LMK00105SQE - Texas Instruments High-Performance Analog

LMK00105

Ultra-low Jitter LVCMOS Fanout Buffer/Level Translator with Universal

Input

1.0 General Description

The LMK00105 is a high performance, low noise LVCMOS

fanout buffer which can distribute 5 ultra-low jitter clocks from

a differential, single ended, or crystal input. The LMK00105

supports synchronous output enable for glitch free operation.

The ultra low-skew, low-jitter, and high PSRR make this buffer

ideally suited for various networking, telecom, server and

storage area networking, RRU LO reference distribution,

medical and test equipment applications.

The core voltage can be set to 2.5 or 3.3 V, while the output

voltage can be set to 1.5, 1.8, 2.5 or 3.3 V. The LMK00105

can be easily configured through pin programming.

2.0 Target Applications

●LO Reference Distribution for RRU Applications

●SONET, Ethernet, Fibre Channel Line Cards

●Optical Transport Networks

●GPON OLT/ONU

●Server and Storage Area Networking

●Medical Imaging

●Portable Test and Measurement

●High-end A/V

3.0 Features

●5 LVCMOS Outputs, DC to 200 MHz

●Universal Input

—LVPECL

—LVDS

—HCSL

—SSTL

—LVCMOS / LVTTL

●Crystal Oscillator Interface

—Crystal Input Frequency: 10 to 40 MHz

●Output Skew: 6 ps

●Additive Phase Jitter

—30 fs at 156.25 MHz (12 kHz to 20 MHz)

●Low Propagation Delay

●Operates with 3.3 or 2.5 V Core Supply Voltage

●Adjustable Output Power Supply

—1.5 V, 1.8 V, 2.5 V, and 3.3 V For Each Bank

●24 pin QFN package (4.0 x 4.0 x 0.8 mm)

4.0 Functional Block Diagram

30180701

TRI-STATE® is a registered trademark of National Semiconductor Corporation.

PRODUCTION DATA information is current as of

publication date. Products conform to specifications per

the terms of the Texas Instruments standard warranty.

Production processing does not necessarily include

testing of all parameters.

5.0 Connection Diagram

24-Pin QFN Package

Top down view through device.

30180702

6.0 Pin Descriptions

Pin # Pin Name Type Description

DAP DAP - The DAP should be grounded

2, 6 Vddo Power Power Supply for Bank A (CLKout0 and CLKout 1) CLKout pins.

3 CLKout0 Output LVCMOS Output

1,4,7,11,12,

16,19 GND GND Ground

5 CLKout1 Output LVCMOS Output

8,23 Vdd Power Supply for operating core and input buffer

9 OSCin Input Input for Crystal

10 OSCout Output Output for Crystal

13 CLKout2 Output LVCMOS Output

14,18 Vddo Power Power Supply for Bank B (CLKout2 to CLKout 4) CLKout pins

15 CLKout3 Output LVCMOS Output

17 CLKout4 Output LVCMOS Output

20 CLKin* Input Optional complimentary input pin

21 CLKin Input Input Pin

22 SEL Input Input Clock Selection. This pin has an internal pull-down resistor.

(Note 1)

24 OE Input Output Enable. This pin has an internal pull-down resistor. (Note 1)

Note 1: CMOS control input with internal pull-down resistor.

LMK00105

7.0 Absolute Maximum Ratings (Note 2, Note 3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for

availability and specifications.

Parameter Symbol Ratings Units

Core Supply Voltage Vdd -0.3 to 3.6 V

Output Supply Voltage Vddo -0.3 to 3.6 V

Input Voltage VIN -0.3 to Vdd + 0.3 V

Storage Temperature Range TSTG -65 to 150 °C

Lead Temperature (solder 4 s) TL+260 °C

Junction Temperature TJ+125 °C

8.0 Recommended Operating Conditions

Parameter Symbol Min Typ Max Units

Ambient Temperature TA-40 25 85 °C

Core Supply Voltage Vdd 2.375 3.3 3.45 V

Output Supply Voltage (Note 4) Vddo 1.425 3.3 Vdd V

Note 2: "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability

and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in

the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the

device should not be operated beyond such conditions.

Note 3: This device is a high performance integrated circuit with ESD handling precautions. Handling of this device should only be done at ESD protected work

stations. The device is rated to a HBM-ESD of > 2.5 kV, a MM-ESD of > 250 V, and a CDM-ESD of > 1 kV.

Note 4: Vddo should be less than or equal to Vdd, (Vddo ≤ Vdd)

9.0 Package Thermal Resistance

24-Lead QFN

Package Symbols Ratings Units

Thermal resistance from junction to

ambient

on 4-layer Jedec board (Note 5)

θJA 54 ° C/W

Thermal resistance from junction to case

(Note 6)θJC (DAP) 20 ° C/W

Note 5: Specification assumes 5 thermal vias connect to die attach pad to the embedded copper plane on the 4-layer Jedec board. These vias play a key role in

improving the thermal performance of the QFN. For best thermal dissipation it is recommended that the maximum number of vias be used on the board layout.

Note 6: Case is defined as the DAP (die attach pad).

LMK00105

10.0 Electrical Characteristics

(2.375 V ≤ Vdd ≤ 3.45 V, 1.425 ≤ Vddo ≤ Vdd, -40 °C ≤ TA ≤ 85 °C, Differential inputs. Typical values represent most likely

parametric norms at Vdd = Vddo = 3.3 V, TA = 25 °C, at the Recommended Operation Conditions at the time of product charac-

terization and are not guaranteed). Test conditions are: Ftest = 100 MHz, Load = 5 pF in parallel with 50 Ω unless otherwise stated.

Symbol Parameter Test Conditions Min Typ Max Units

Total Device Characteristics

Vdd Core Supply Voltage 2.375 2.5 or

3.3 3.465 V

Vddo Output Supply Voltage 1.425

1.5,1.8,

2.5, or

3.3

Vdd V

IVdd Core Current

No CLKin 16 25

Vddo = 3.3 V, Ftest = 100 MHz 24

Vddo = 2.5 V, Ftest = 100 MHz 20

IVddo[n] Current for Each Output

Vddo = 2.5 V,

OE = High, Ftest = 100 MHz, CL = 10pF 5

mAVddo= 3.3 V,

OE = High, Ftest = 100 MHz, CL = 10pF 7

OE = Low 0.1

IVdd + IVddo

Total Device Current with Loads on

all outputs

OE = High @ 100 MHz 59 mA

OE = Low 16

Power Supply Ripple Rejection (PSRR)

PSRR Ripple Induced

Phase Spur Level

100 kHz, 100 mVpp

Ripple Injected on

Vdd, Vddo = 2.5 V

-44 dBc

Outputs (Note 7)

Skew Output Skew Measured between outputs,

referenced to CLKout0 6 25 ps

tPD

Propagation Delay

CLKin to CLKout

(Note 9)

CL = 5 pF, RL = 50 Ω

Vdd = 3.3 V; Vddo = 3.3 V 1 ns

CL = 5 pF, RL = 50 Ω

Vdd = 2.5 V; Vddo = 1.5 V 1.4 ns

tPD, PP Part-to-part Skew (Note 8, Note 9)

CL = 5 pF, RL = 50 Ω

Vdd = 3.3 V; Vddo = 3.3 V 750 ps

CL = 5 pF, RL = 50 Ω

Vdd = 2.5 V; Vddo = 1.5 V 1.1 ns

fCLKout

Output Frequency

(Note 10) DC 200 MHz

tRise Rise/Fall Time

Vdd = 3.3 V, Vddo = 1.8 V, CL = 10 pF 500

Vdd = 2.5 V, Vddo = 2.5 V, CL = 10 pF 300

Vdd = 3.3 V, Vddo = 3.3 V, CL = 10 pF 200

VCLKoutLow Output Low Voltage 0.1

VCLKoutHigh Output High Voltage Vddo-

0.1

RCLKout Output Resistance 50 ohm

tjRMS Additive Jitter

fCLKout = 156.25 MHz,

CMOS input slew rate ≥ 2 V/ns

CL = 5 pF, BW = 12 kHz to 20 MHz,

Differential Input Mode Only

30 fs

LMK00105

Symbol Parameter Test Conditions Min Typ Max Units

Digital Inputs (OE, SEL0, SEL1)

VLow Input Low Voltage Vdd = 2.5 V 0.4

VHigh Input High Voltage Vdd = 2.5 V 1.3

Vdd = 3.3 V 1.6

IIH High Level Input Current 50 uA

IIL Low Level Input Current -5 5

CLKin/CLKin* Input Clock Specifications, (Note 12, Note 13)

IIH High Level Input Current VCLKin = Vdd 20 uA

IIL

Low Level Input Current

(Note 11)VCLKin = 0 V -20 uA

VIH Input High Voltage Vdd V

VIL Input Low Voltage GND

VCM

Differential Input

Common Mode Input Voltage

(Note 15)

VID = 150 mV 0.5 Vdd-

1.2

VID = 350 mV 0.5 Vdd-

1.1

VID = 800 mV 0.5 Vdd-

0.9

VID Differential Input Voltage Swing CLKin driven differentially 0.15 1.5 V

OSCin/OSCout Pins

fOSCin Input Frequency (Note 10) Single-Ended Input, OSCout floating DC 200 MHz

fXTAL Crystal Frequency Input Range

Fundamental Mode Crystal

ESR < 200 Ω ( fXtal ≤ 30 MHz )

ESR < 120 Ω ( fXtal > 30 MHz )

(Note 14, Note 10)

10 40 MHz

COSCin Shunt Capacitance 1 pF

VIH Input High Voltage Single-Ended Input, OSCout floating 2.5 V

Note 7: AC Parameters for CMOS are dependent upon output capacitive loading

Note 8: Part-to-part skew is calculated as the difference between the fastest and slowest tPD across multiple devices.

Note 9: Guaranteed by design.

Note 10: Guaranteed by characterization.

Note 11: VIL should not go below -0.3 volts.

Note 12: See Section 12.1 Differential Voltage Measurement Terminology for definition of VOD and VID.

Note 13: Refer to application note AN-912 Common Data Transmission Parameters and their Definitions for more information.

Note 14: The ESR requirements stated are what is necessary in order to ensure that the Oscillator circuitry has no start up issues. However, lower ESR values

for the crystal might be necessary in order to stay below the maximum power dissipation requirements for that crystal.

Note 15: When using differential signals with VCM outside of the acceptable range for the specified VID, the clock must be AC coupled.

LMK00105

11.0 Typical Performance Characteristics

Unless otherwise specified: Vdd = Vddo = 3.3 V, TA = 20 °C, CL = 5 pF, CLKin driven differentially, input slew rate ≥ 2 V/ns.

RMS Jitter vs. CLKin Slew Rate @ 100 MHz

0.5 1.0 1.5 2.0 2.5 3.0

100

150

200

250

300

350

400

450

500

RMS JITTER (fs)

DIFFERENTIAL INPUT SLEW RATE (V/ns)

Fclk-100 MHz

Int. BW=1-20 MHz

-40 C

25 C

85 C

CLKin Source

30180741

Noise Floor vs. CLKin Slew Rate @ 100 MHz

0.5 1.0 1.5 2.0 2.5 3.0

-170

-165

-160

-155

-150

-145

-140

NOISE FLOOR (dBc/Hz)

DIFFERENTIAL INPUT SLEW RATE (V/ns)

Fclk=100 MHz

Foffset=20 MHz

-40 C

25 C

85 C

CLKin Source

30180774

LVCMOS Phase Noise @ 100 MHz

30180742

Note 16: Test conditions: LVCMOS Input, slew rate ≥ 2 V/ns, CL = 5 pF in parallel

with 50 Ω, BW = 1 MHz to 20 MHz

LVCMOS Output Swing vs. Frequency

0 200 400 600 800 1000

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

OUTPUT SWING (V)

FREQUENCY (MHz)

Rterm=50 Ω

Vddo=1.5 V

Vddo=1.8 V

Vddo=2.5 V

Vddo=3.3 V

30180775

Iddo per Output vs Frequency

0 50 100 150 200 250

CURRENT (mA)

FREQUENCY (MHz)

Cload = 10 pF

Vddo = 1.5 V

Vddo = 1.8 V

Vddo = 2.5 V

Vddo = 3.3 V

30180776

LMK00105

12.0 Measurement Definitions

12.1 Differential Voltage Measurement Terminology

The differential voltage of a differential signal can be described by two different definitions causing confusion when reading

datasheets or communicating with other engineers. This section will address the measurement and description of a differential

signal so that the reader will be able to understand and discern between the two different definitions when used.

The first definition used to describe a differential signal is the absolute value of the voltage potential between the inverting and non-

inverting signal. The symbol for this first measurement is typically VID or VOD depending on if an input or output voltage is being

described.

The second definition used to describe a differential signal is to measure the potential of the non-inverting signal with respect to

the inverting signal. The symbol for this second measurement is VSS and is a calculated parameter. Nowhere in the IC does this

signal exist with respect to ground, it only exists in reference to its differential pair. VSS can be measured directly by oscilloscopes

with floating references, otherwise this value can be calculated as twice the value of VOD as described in the first section

Figure 1 illustrates the two different definitions side-by-side for inputs and Figure 2 illustrates the two different definitions side-by-

side for outputs. The VID and VOD definitions show VA and VB DC levels that the non-inverting and inverting signals toggle between

with respect to ground. VSS input and output definitions show that if the inverting signal is considered the voltage potential reference,

the non-inverting signal voltage potential is now increasing and decreasing above and below the non-inverting reference. Thus the

peak-to-peak voltage of the differential signal can be measured.

VID and VOD are often defined in volts (V) and VSS is often defined as volts peak-to-peak (VPP).

30180712

FIGURE 1. Two Different Definitions for Differential Input Signals

30180713

FIGURE 2. Two Different Definitions for Differential Output Signals

LMK00105

13.0 Functional Description

The LMK00105 is a 5 output LVCMOS clock fanout buffer with low additive jitter that can operate up to 200 MHz. It features a 2:1

input multiplexer with a crystal oscillator input, single supply or dual supply (lower power) operation, and pin-programmable device

configuration. The device is offered in a 24-pin QFN package.

13.1 Vdd and Vddo Power Supplies (Note 17, Note 18)

Separate core and output supplies allow the output buffers to operate at the same supply as the Vdd core supply (3.3 V or 2.5 V)

or from a lower supply voltage (3.3 V, 2.5 V, 1.8 V, or 1.5 V). Compared to single-supply operation, dual supply operation enables

lower power consumption and output-level compatibility.

Bank A (CLKout0 and CLKout1) and Bank B (CLKout2 to CLKout4) may also be operated at different Vddo voltages, provided neither

Vddo voltage exceeds Vdd.

Note 17: Care should be taken to ensure the Vddo voltage does not exceed the Vdd voltage to prevent turning-on the internal ESD protection circuitry.

Note 18: DO NOT DISCONNECT OR GROUND ANY OF THE Vddo PINS as the Vddo pins are internally connected within an output bank.

13.2 CLOCK INPUT

The LMK00105 has one differential input, CLKin/CLKin* and OSCin, that can be driven in different manners that are described in

the following sections.

13.2.1 SELECTION OF CLOCK INPUT

Clock input selection is controlled using the SEL pin as shown in Table 1. Refer to Section 14.1 Driving the Clock Inputs for clock

input requirements. When CLKin is selected, the crystal circuit is powered down. When OSCin is selected, the crystal oscillator will

start-up and its clock will be distributed to all outputs.

TABLE 1. Input Selection

SEL Input

0 CLKin, CLKin*

1OSCin

(Crystal Mode)

13.2.1.1 CLKin/CLKin* Pins

The LMK00105 has a differential input (CKLin/CLKin*) which can be driven single-ended or differentially. It can accept AC or DC

coupled 3.3V/2.5V LVPECL, LVDS, or other differential and single ended signals that meet the input requirements in Section 10.0

Electrical Characteristics and (Note 15). Refer to Section 14.1 Driving the Clock Inputs for more details on driving the LMK00105

inputs.

In the event that a Crystal mode is not selected and the CLKin pins do not have an AC signal applied to them, Table 2 will be the

state of the outputs.

TABLE 2. CLKin Input vs. Output States

CLKin Output State

Open Logic Low

Logic Low Logic Low

Logic High Logic High

13.2.1.2 OSCin/OSCout Pins

The LMK00105 has a crystal oscillator which will be powered up when OSCin is selected. Alternatively, OSCin may be driven by

a single ended clock, up to 200 MHz, instead of a crystal. Refer to Section 14.2 Crystal Interface for more information.

If Crystal mode is selected and the pins do not have an AC signal applied to them, Table 3 will be the state of the outputs. If Crystal

mode is selected an open state is not allowed on OSCin, as the outputs may oscillate due to the crystal oscillator circuitry.

TABLE 3. OSCin Input vs. Output States

OSCin Output State

Open Not Allowed

Logic Low Logic High

Logic High Logic Low

LMK00105

13.3 CLOCK OUTPUTS

The LMK00105 has 5 LVCMOS outputs.

13.3.1 Output Enable Pin

When the output enable pin is held High, the outputs are enabled. When it is held Low, the outputs are held in a Low state as shown

in Table 4.

TABLE 4. Output Enable Pin States

OE Outputs

Low Disabled (Hi-Z)

High Enabled

The OE pin is synchronized to the input clock to ensure that there are no runt pulses. When OE is changed from Low to High, the

outputs will initially have an impedance of about 400 Ω to ground until the second falling edge of the input clock and starting with

the second falling edge of the input clock, the outputs will buffer the input. If the OE pin is taken from Low to High when there is no

input clock present, the outputs will either go high or low and stay a that state; they will not oscillate. When the OE pin is taken from

High to Low the outputs will be Low after the second falling edge of the clock input and then will go to a Disabled (Hi-Z) state starting

after the next rising edge.

13.3.2 Using Less than Five Outputs

Although the LMK00105 has 5 outputs, not all applications will require all of these. In this case, the unused outputs should be left

floating with a minimum copper length (Note 19) to minimize capacitance. In this way, this output will consume minimal output

current because it has no load.

Note 19: For best soldering practices, the minimum trace length should extend to include the pin solder mask. This way during reflow, the solder has the same

copper area as connected pins. This allows for good, uniform fillet solder joints helping to keep the IC level during reflow.

LMK00105

14.0 Application Information

14.1 Driving the Clock Inputs

The LMK00105 has a differential input (CLKin/CLKin*) that can accept AC or DC coupled 3.3V/2.5V LVPECL, LVDS, and other

differential and single ended signals that meet the input requirements specified in Section 10.0 Electrical Characteristics. The device

can accept a wide range of signals due to its wide input common mode voltage range (VCM) and input voltage swing (VID)/dynamic

range. AC coupling may also be employed to shift the input signal to within the VCM range.

To achieve the best possible phase noise and jitter performance, it is recommended that the input to have a high slew rate of 2 V/

ns (differential) or higher. Driving the input with a lower slew rate will degrade the noise floor and jitter. For this reason, a differential

input signal is recommended over single-ended because it typically provides higher slew rate and common-mode noise rejection.

While it is recommended to drive CLKin with a differential signal input, it is possible to drive them with a single ended clock. The

single-ended input slew rate should be as high as possible to minimize performance degradation. The CLKin input has an internal

bias voltage of about 1.4 V. The input can be AC coupled as shown in Figure 3 which is the preferred configuration, or Figure 4,

or Figure 5 depending upon the application. In these cases, the output impedance of the CMOS driver plus RS should be matched

as closely as possible to the 50 Ω termination resistor for best performance.

30180738

FIGURE 3. Preferred Configuration: Single-Ended LVCMOS Input, AC Coupling

30180743

FIGURE 4. Single-Ended LVCMOS Input, AC Coupling

Near End Termination

30180744

FIGURE 5. Single-Ended LVCMOS Input, AC Coupling,

Far End Temination

A single ended clock may also be DC coupled to CLKin as shown in Figure 6. If the DC coupled input swing has a common mode

level near the devices internal bias of 1.4 V, then only a 0.1 µF bypass cap is required on CLKin*. Otherwise, if the input swing is

not optimally centered near the internal bias voltage, then CLKin* should be externally biased to the midpoint voltage of the input

swing. This can be achieved using external biasing resistors, RB1 and RB2, or another low-noise voltage reference. The external

bias voltage should be within the specified input common voltage (VCM) range. This will ensure the input swing crosses the

threshold voltage at a point where the input slew rate is the highest.

LMK00105

30180739

FIGURE 6. Single-Ended LVCMOS Input, DC Coupling with Common Mode Biasing

If the crystal oscillator circuit is not used, it is possible to drive the OSCin input with an single-ended external clock as shown in

Figure 7. Configurations similar to Figure 4 or Figure 5 could also be used as long as the OSCout pin is left floating. In these cases,

the output impedance of the CMOS driver plus RS should be matched as closely as possible to the 50 Ω termination resistor for

best performance. The input clock should be AC coupled to the OSCin pin, which has an internally generated input bias voltage,

and the OSCout pin should be left floating. While OSCin provides an alternative input to multiplex an external clock, it is recom-

mended to use either differential input (CLKin) since it offers higher operating frequency, better common mode, improved power

supply noise rejection, and greater performance over supply voltage and temperature variations.

30180703

FIGURE 7. Driving OSCin with a Single-Ended

14.2 Crystal Interface

The LMK00105 has an integrated crystal oscillator circuit that supports a fundamental mode, AT-cut crystal. The crystal interface

is shown in Figure 8.

30180704

FIGURE 8. Crystal Interface

The load capacitance (CL) is specific to the crystal, but usually on the order of 18 to 20 pF. While CL is specified for the crystal, the

OSCin input capacitance (CIN = 1 pF typical) of the device and PCB stray capacitance (CSTRAY ~ 1 to 3 pF) can affect the discrete

load capacitor values, C1 and C2. For the parallel resonant circuit, the discrete capacitor values can be calculated as follows:

CL = (C1 * C2) / (C1 + C2) + CIN + CSTRAY (1)

Typically, C1 = C2 for optimum symmetry, so Equation 1 can be rewritten in terms of C1only:

CL = C12 / (2 * C1) + CIN + CSTRAY (2)

Finally, solve for C1:

C1 = (CL - CIN - CSTRAY) * 2 (3)

Section 10.0 Electrical Characteristics provides crystal interface specifications with conditions that ensure start-up of the crystal,

but it does not specify crystal power dissipation. The designer will need to ensure the crystal power dissipation does not exceed

LMK00105

the maximum drive level specified by the crystal manufacturer. Overdriving the crystal can cause premature aging, frequency shift,

and eventual failure. Drive level should be held at a sufficient level necessary to start-up and maintain steady-state operation.

The power dissipated in the crystal, PXTAL, can be computed by:

PXTAL = IRMS2 * RESR * (1 + C0 / CL)2(4)

Where:

•IRMS is the RMS current through the crystal.

•RESR is the maximum equivalent series resistance specified for the crystal.

•CL is the load capacitance specified for the crystal.

•C0 is the mininimum shunt capacitance specified for the crystal.

IRMS can be measured using a current probe (e.g. Tektronix CT-6 or equivalent) placed on the leg of the crystal connected to

OSCout with the oscillation circuit active.

As shown in Figure 8, an external resistor, RLIM, can be used to limit the crystal drive level if necessary. If the power dissipated in

the selected crystal is higher than the drive level specified for the crystal with RLIM shorted, then a larger resistor value is mandatory

to avoid overdriving the crystal. However, if the power dissipated in the crystal is less than the drive level with RLIM shorted, then

a zero value for RLIM can be used. As a starting point, a suggested value for RLIM is 1.5 kΩ.

14.3 Power Supply Ripple Rejection

In practical system applications, power supply noise (ripple) can be generated from switching power supplies, digital ASICs or

FPGAs, etc. While power supply bypassing will help filter out some of this noise, it is important to understand the effect of power

supply ripple on the device performance. When a single-tone sinusoidal signal is applied to the power supply of a clock distribution

device, such as LMK00105, it can produce narrow-band phase modulation as well as amplitude modulation on the clock output

(carrier). In the singleside band phase noise spectrum, the ripple-induced phase modulation appears as a phase spur level relative

to the carrier (measured in dBc).

For the LMK00105, power supply ripple rejection (PSRR), was measured as the single-sideband phase spur level (in dBc) modu-

lated onto the clock output when a ripple signal was injected onto the Vddo supply. The PSRR test setup is shown in Figure 9.

30180740

FIGURE 9. PSRR Test Setup

A signal generator was used to inject a sinusoidal signal onto the Vddo supply of the DUT board, and the peak-to-peak ripple

amplitude was measured at the Vddo pins of the device. A limiting amplifier was used to remove amplitude modulation on the

differential output clock and convert it to a single-ended signal for the phase noise analyzer. The phase spur level measurements

were taken for clock frequencies of 100 MHz under the following power supply ripple conditions:

•Ripple amplitude: 100 mVpp on Vddo = 2.5 V

•Ripple frequency: 100 kHz

Assuming no amplitude modulation effects and small index modulation, the peak-to-peak deterministic jitter (DJ) can be calculated

using the measured single-sideband phase spur level (PSRR) as follows:

DJ (ps pk-pk) = [(2 * 10(PSRR/20)) / (π * fclk)] * 1012 (5)

14.4 Power Supply Bypassing

The Vdd and Vddo power supplies should have a high frequency bypass capacitor, such as 100 pF, placed very close to each supply

pin. Placing the bypass capacitors on the same layer as the LMK00105 improves input sensitivity and performance. All bypass and

decoupling capacitors should have short connections to the supply and ground plane through a short trace or via to minimize series

inductance.

14.5 Thermal Management

For reliability and performance reasons the die temperature should be limited to a maximum of 125 °C. That is, as an estimate, TA

(ambient temperature) plus device power consumption times θJA should not exceed 125 °C.

LMK00105

The package of the device has an exposed pad that provides the primary heat removal path as well as excellent electrical grounding

to a printed circuit board. To maximize the removal of heat from the package a thermal land pattern including multiple vias to a

ground plane must be incorporated on the PCB within the footprint of the package. The exposed pad must be soldered down to

ensure adequate heat conduction out of the package.

A recommended land and via pattern is shown in Figure 10. More information on soldering QFN (formerly referred to as LLP)

packages and gerber footprints can be obtained: http://www.national.com/en/packaging/index.html.

A recommended footprint including recommended solder mask and solder paste layers can be found at: http://www.national.com/

en/packagingl/gerber.html for the SQA24A package.

To minimize junction temperature it is recommended that a simple heat sink be built into the PCB (if the ground plane layer is not

exposed). This is done by including a copper area of about 2 square inches on the opposite side of the PCB from the device. This

copper area may be plated or solder coated to prevent corrosion but should not have conformal coating (if possible), which could

provide thermal insulation. The vias shown in Figure 10 should connect these top and bottom copper layers and to the ground

layer. These vias act as “heat pipes” to carry the thermal energy away from the device side of the board to where it can be more

effectively dissipated.

30180773

FIGURE 10. Recommended Land and Via Pattern

LMK00105

15.0 Physical Dimensions inches (millimeters) unless otherwise noted

Leadless Leadframe Package (Bottom View)

24 Pin QFN Package

16.0 Ordering Information

Order Number Package Marking Packaging

LMK00105SQX

K00105

4500 Unit Tape and Reel

LMK00105SQ 1000 Unit Tape and Reel

LMK00105SQE 250 Unit Tape and Reel

LMK00105

Notes

LMK00105

Notes

Incorporated

PACKAGE OPTION ADDENDUM

www.ti.com 24-Jan-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

LMK00105SQ/NOPB ACTIVE WQFN RTW 24 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 K00105

LMK00105SQE/NOPB ACTIVE WQFN RTW 24 250 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 K00105

LMK00105SQX/NOPB ACTIVE WQFN RTW 24 4500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 K00105

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) Only one of markings shown within the brackets will appear on the physical device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

MECHANICAL DATA

RTW0024A

www.ti.com

SQA24A (Rev B)

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