This is information on a product in full production.
November 2015 DocID028619 Rev 1 1/11
11
BALF-CC25-02D3
50 ohm, conjugate match to CC2541
transformer balun
Datasheet
−
production data
Features
•2.45 GHz balun with integrated matching
network
•Matching optimized for following CC2541
•Low insertion loss
•Low amplitude imbalance
•Low phase imbalance
•Coated Flip-Chip on glass
•Small footprint: < 0.88 mm²
Benefits
•Very low profile
•High RF performance
•PCB space saving versus discrete solution
•BOM count reduction
•Efficient manufacturability
Description
STMicroelectronics BAL-CC25-02D3 is an ultra
miniature balun which integrates a matching
network in a monolithic glass substrate. This has
been customized for the CC2541 RF
transceivers.
It’s a design using STMicroelectronics IPD
(integrated passive device) technology on non-
conductive glass substrate to optimize RF
performance.
Figure 1. Pin configuration (top view)
Figure 2. Application schematic (top view)
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Characteristics BALF-CC25-02D3
2/11 DocID0286 19 Rev 1
1 Characteristics
Table 1.
A
bsolute maximum rating (limiting values)
Symbol Parameter Value Unit
P
IN
Input power RF
IN
20 dBm
V
ESD
ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 Ω, air discharge) 2000
VESD ratings machine model (MM: C = 200 pF, R = 25 Ω, L = 500 nH) 500
ESD ratings charged device model (CDM, JESD22-C101D) 500
T
OP
Operating temperature -40 to + 105 °C
Table 2. Electrical characteristics - RF performance (T
amb
= 25 °C)
Symbol Parameter Value Unit
Min. Typ. Max.
Z
OUT
Nominal differential output imped anc e Conjuga te mat ch to CC2541 Ω
Z
IN
Nominal input impedance 50
F Frequency range (bandwidth) 2379 2507
I
L
Insertion loss in bandwidth 1.6 1.8 dB
R
L_SE
Single ende d return los s in ban dw idth 9 10 dB
R
L_DIFF
Differential ended return loss in bandwidth 9 17 dB
Φ
imb
Phase imbalance 7 °
A
imb
Amplitude imbalance 0.6 dB
DocID028619 Rev 1 3/11
BALF-CC25-02D3 Characteristics
Figure 3. Balun transmission (T
amb
= 25 °C)
Figure 4. Insertion loss (T
amb
= 25 °C)
Figure 5. Return loss on SE port (T
amb
= 25 °C)
G%
IUHT*+]
G%
IUHT*+]
G%
IUHT*+]
Characteristics BALF-CC25-02D3
4/11 DocID0286 19 Rev 1
Figure 6. Return loss on DIFF port (T
amb
= 25 °C)
Figure 7. Amplitude imbalance (T
amb
= 25 °C)
Figure 8. Phase imbalance (T
amb
= 25 °C)
G%
IUHT*+]
G%
IUHT*+]
GHJ
IUHT*+]
DocID028619 Rev 1 5/11
BALF-CC25-02D3 Package information
2 Package information
•Epoxy meets UL94, V0
•Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
2.1 Flip-Chip package information
Figure 9. Flip-Chip package outline
Table 3. Flip-Chip package mechanical data
Parameter Description Min. Typ. Max. Unit
A Bump height + subs tra te thic kness 0.570 0.630 0.690 mm
A1 Bump height 0.155 0.205 0.255 mm
A2 Substrate thic k nes s 0.400 mm
b Bum p dia me ter 0. 215 0.255 0.295 mm
D Y dimension of the die 0.890 0.940 0.990 mm
D1 Y pitch 0.500 mm
E X dimension of the die 0.890 0.940 0.990 mm
E1 X pitch 0.500 mm
SE 0.250 mm
fD Distance from bump to edge of die on Y
axis 0.220 mm
fE Distance from bump to edge of die on X
axis 0.220 mm
ccc 0.05 mm
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Package information BALF-CC25-02D3
6/11 DocID0286 19 Rev 1
Figure 10. Footprint
Figure 11. Bump coordinates (top view)
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DocID028619 Rev 1 7/11
BALF-CC25-02D3 Package information
Figure 12. Footprint - 3 mils stencil -non solder
mask defined Figure 13. Footprint - 3 mils stencil - solder
mask defined
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Figure 14. Footprint - 5 mils stencil -non solder
mask defined Figure 15. Footprint - 5 mils stencil - solder
mask defined
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Package information BALF-CC25-02D3
8/11 DocID0286 19 Rev 1
Figure 16. PCB layout recommendation
Figure 17. Marking
Note: More information is available in the STMicroelectronics Application note:
AN2348 Flip-Chip: “Package description and recommendations for use”
x
y
x
w
z
w
Dot, ST logo
ECOPACK grade
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
DocID028619 Rev 1 9/11
BALF-CC25-02D3 Package information
Figure 18. Flip Chip tape and reel specifications
Note: More information is available in the application note:
AN2348: “Flip Chip: package description and recommendations for use”
Dot identifying Pin A1 location
User direction of unreeling
All dimensions are typical values in mm
4.0 ± 0.1
2.0 ± 0.05
2.0 ± 0.05
8.0 ± 0.3
1.75 ± 0.1
3.5 ± 0.05
Ø 1.55 ± 0.10
0.73 ± 0.05
1.0 ± 0.05
0.20 ± 0.015
1.0 ± 0.05
ST ST ST
x x z
y w w
x x z
y w w
x x z
y w w
ST STST ST
x x z
y w w
x x z
y w w
x x z
y w w
x x z
y w w
Ordering informa tion BALF-CC25-02D3
10/11 DocID028619 Rev 1
3 Ordering information
4 Revision history
Table 4. Ordering in formation
Order code Markin g Packa ge Weight Base qty Delivery mode
BAL-CC25-02D3 TE Flip Chip 1.07 mg 5000 Tape and reel (7”)
Table 5. Document revision history
Date Revision Changes
17-Nov-2015 1 Initial release
DocID028619 Rev 1 11/11
BALF-CC25-02D3
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