w WAN-0129
Decoupling and Layout Methodology
for Wolfson DACs, ADCs and CODECs
WOLFSON MICROELECTRONICS plc
www.wolfsonmicro.com
January 2003, Rev 1.0
Copyright 2003 Wolfson Microelectronics plc
INTRODUCTION
This application note looks at the general decoupling and layout practice required for Wolfson
converters to achieve maximum performance in a typical high-speed mixed-signal circuit.
APPLICATION
Wolfson DACs, ADCs and CODECs have both digital and analogue interfaces. It is important that
noise is minimised to get the maximum converter performance. In our datasheets there are a
number of supply pins on each chip. They are labelled according to their internal connection, not
necessarily how they should be connected externally. The datasheets show typical supply
connections and decoupling arrangements and this report goes into further details.
GROUNDING
First consider the grounding of the IC. Ideally the circuit board will have a single continuous ground
plane, with all ground pins connected to it. The components will be located so that high-speed digital
devices are kept away from analogue devices, so that noise currents do not stray where they are not
wanted.
In some cases a cut between analogue and digital planes is required, because the component
positions cannot be optimised. In this case the analogue and digital grounds must be connected
under the converter with a wide copper track. Just using a zero-ohm link may not provide a good
enough connection in some circumstances. Ensure any tracks going from the board’s analogue
section to the digital section (e.g. data lines and clocks) are tracked over the ground connection, not
the cut, to minimise loop area for the return currents. Wolfson converters are designed with a pin-out
which ensures tracks need only go over the appropriate ground plane. If you have other high-speed
currents (including ESD currents) flowing between analogue and digital grounds, make sure this is
not the only connection between them, or you will make the converter performance worse.
DIGITAL SUPPLY
Digital supply pins can be connected to the main digital supply rail if the noise levels are not too high.
If there is no nearby digital supply, or it is too noisy, then one can be made from the analogue supply
using an LC filter like below: this will make sure the noise does not go back to the analogue supply.
10
µ
H
0.1
µ
F
AVdd DVdd
Figure 1 Converter Digital Supply from Analogue Supply
We name the digital pins like this: DVDD, DCVDD. Be sure to place a 0.1µF multi-layer ceramic
capacitor close to each of these pins (within 3mm) to decouple it properly to DGND. If there is no
large-value capacitor within 50mm, then also add one 10µF low-ESR capacitor per rail. This can be
multi-layer ceramic, low-ESR tantalum or low-ESR organic semiconductor electrolytic type. Check
the datasheet shows the part has less than 200m ESR for best performance.
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ANALOGUE SUPPLY
Analogue supply pins must be connected to a low-noise analogue supply rail, which ideally comes
from a low-noise linear regulator. We name these pins like this: AVDD, HPVDD, SPKVDD. Be sure
to place a 0.1µF multi-layer ceramic capacitor close to each of these pins (within 3mm) to decouple it
properly to AGND. If there is no large-value capacitor within 50mm, then also add one 10µF low-
ESR capacitor per rail. This can be multi-layer ceramic, low-ESR tantalum or low-ESR organic
semiconductor electrolytic type. Check the datasheet shows the part has less than 200m ESR for
best performance.
On some of our devices there are internal supplies or references which require external decoupling.
We names these pins like: VMID, VREF, VREFOUT, CAP2. The pins connect just to a capacitor,
not to an external supply. Be sure to place a 0.1µF multi-layer ceramic capacitor close to each of
these pins (within 3mm) to decouple it properly to AGND. Also add one 10µF low-ESR capacitor per
pin. This can be multi-layer ceramic, low-ESR tantalum or low-ESR organic semiconductor
electrolytic type. Check the datasheet shows the part has less than 200m ESR for best
performance.
SUPPLY LAYOUT
Ideally the supply connections will be made with planes on a multi-layer circuit board. If these planes
are on adjacent layers, the parasitic capacitance of these layers will further improve high-frequency
decoupling. Where this is not possible, use tracks much wider than the current rating requires.
SOLUTION
Figure 2 Decoupling Example
CONCLUSION
With careful consideration of layout and provision of low-noise supplies, the performance specified in
our datasheets should be achieved.
APPLICATION SUPPORT
If you require more information or require technical support please contact Wolfson Microelectronics
Applications group through the following channels:
Email: apps@wolfsonmicro.com
Telephone: +44 (0)131 272 7070
Fax: +44 (0)131 272 7001
Mail: Applications at the address on last page.
or contact your local Wolfson representative.
Additional information may be made available from time to time on our web site at
http://www.wolfsonmicro.com
DVDD
DGND
AGND
AVDD
7
6
Notes: 1. AGND and DGND should be connected as close to the IC as possible.
2. C
2
, C
3
, C
4
and C
8
should be 0.1µF multi-layer ceramics, positioned as close to the IC as possible.
3. Capacitor types for C1, C5, C9 should be carefully chosen. 10µF capacitors with low ESR are
recommended for optimum performance.
VREFP
VREFN
C
3 C
4 C
5
C
2
DVDD
C
1
AVDD
DGND
AGND
10
14
9
13
+
+
VMI
C
9
C
8
AGND
12
+
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IMPORTANT NOTICE
Wolfson Microelectronics plc (WM) reserve the right to make changes to their products or to discontinue any product or service
without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that
information being relied on is current. All products are sold subject to the WM terms and conditions of sale supplied at the time of
order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
WM warrants performance of its products to the specifications applicable at the time of sale in accordance with WM’s standard
warranty. Testing and other quality control techniques are utilised to the extent WM deems necessary to support this warranty.
Specific testing of all parameters of each device is not necessarily performed, except those mandated by government
requirements.
In order to minimise risks associated with customer applications, adequate design and operating safeguards must be used by the
customer to minimise inherent or procedural hazards. Wolfson products are not authorised for use as critical components in life
support devices or systems without the express written approval of an officer of the company. Life support devices or systems are
devices or systems that are intended for surgical implant into the body, or support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use provided, can be reasonably expected to result in a significant injury to the
user. A critical component is any component of a life support device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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ADDRESS:
Wolfson Microelectronics plc
Westfield House
26 Westfield Road
Edinburgh
EH11 2QW
United Kingdom
Tel :: +44 (0)131 272 7000
Fax :: +44 (0)131 272 7001
Email :: apps@wolfsonmicro.com