3MTM TextoolTM Open-Top Test and Burn-In Sockets for Ball Grid Array Packages 3Innovation 3MTM TextoolTM Open-Top Sockets for BGA Packages Table of Contents Product Advantages .............................................................................................................1 Contact Durability................................................................................................................1 Contact Reliability ...............................................................................................................2 Micro-Wiping and Solder Ball Deformation .......................................................................3 Package Alignment ..............................................................................................................4 Package Dimension Requirements ......................................................................................5 Socket Mechanism and Operating Instructions ...................................................................6 Ordering Information ...........................................................................................................8 3M Textool Open-Top BGA Sockets 0.65 mm ...................................................................9 3M Textool Open-Top BGA Sockets 0.80 mm ................................................................10 3M Textool Open-Top BGA Sockets 1.0 mm ..................................................................11 3M Textool Open-Top BGA Sockets 1.27 mm ................................................................12 For the most current product and technical information, click on the product names within this PDF, which will take you to the specific 3M Textool Test and Burn-In Sockets product page on the website. 3MTM TextoolTM Open-Top Sockets for BGA Packages First to market in 1992 with BGA sockets, 3M continues to expand our product range and available options. The versatile product design and four product platforms enable quick-turn and low cost proliferation of new sizes. 3M provides reliable performance for test and burn-in applications, with a proven design perfected with years of customer experience. 3M provides sockets for most types of BGA packages, standard or custom, in a variety of pitches, including 0.65 mm, 0.80 mm, 1.00 mm and 1.27 mm. 3M Textool Open-Top Test and Burn-in Sockets provide the following benefits: Dual-Beam Contact Design * Minimizes ball deformation with low actuation force, minimal shear stress and contact points above center plane * Maximizes contact durability due to lower stress per contact beam * Enhances electrical reliability by expanding contact interface zone Micro-Wiping Effect * Optimizes contact interface by removing oxide build-up * Minimizes solder transfer to contact tips Open-Top Socket Design * Accommodates a wide range of package dimensions * Compatible with most automated device loaders * Enables easy manual operation with low actuation force * Can reduce lead time and cost with modular tooling and optimal footprint density Global Support * Local sales and technical service personnel in all major markets worldwide * Design resources and materials expertise in both the United States and Japan * Quick-turn product samples shipped anywhere in the world * Website provides easy access to technical information worldwide 3M Contact Durability 3M's dual-beam contact increases socket durability with its patented dual-beam motion. 3M's Dual-Beam Contact Motion G3M * Since both beams of the 3M contact are moving, each one only has to move G /2. 3M * For a single beam contact to accommodate the same ball (G = G ), one beam must cover the entire gap, thus accelerating the force applied to the beam in motion as the contact travels. 3M Stress 3M Closed Open Single-Beam Contact Motion GA Force 1 Stress A A * The added stress of additional travel in the single beam contact increases the likelihood of fatigue-related failures. * The dual-beam motion of the 3M Textool socket contact prolongs socket mechanical life cycle, which may decrease total cost of ownership. 3MTM TextoolTM Open-Top Sockets for BGA Packages 3M Contact Reliability 3M's micro-wiping contact increases electrical reliability and is intended to decrease total cost of ownership. Competition's Edge-Point Contact Concentrated contact point accumulates solder over time. Contact Mark Piercing Contact * Encourages solder build-up over time, which in turn increases long-term electrical resistance and decreases reliability. * Can reduce socket total life cycle and may increase total cost of ownership. * Expensive cleaning and restoration procedures are sometimes necessary, requiring added cost and board downtime. 3M's Micro-Wiping Contact Multiple Contact Points Contact Mark 3M's Dual-Beam Micro-Wiping Contact * Provides larger contact area and micro-wiping motion to reduce solder build-up over time, thus maintaining long-term electrical resistance, increasing reliability and prolonging the life cycle of the socket. It is difficult to accumulate solder on this larger area. Micro-wiping helps keep contacting surfaces clean. Contact Resistance * Can decrease total cost of ownership. Competition's Edge Point Contact 3M Flat Area Contact # BI Cycles 2 3MTM TextoolTM Open-Top Sockets for BGA Packages Micro-Wiping and Solder Ball Deformation * The dual-beam contact provides balanced forces, reducing the sheer stress on the solder ball. * The contact arms grasp the solder ball above its center. The shape of the contact arm exerts a component of the applied force in a downward direction, enhancing package retention. FR = FL Note: FL = Force Left, FR = Force Right 1.27 mm 1.00 mm, 0.80 mm, 0.65 mm Contact Mark With Micro-Wiping Contact Mark With Micro-Wiping FL FL Contact Contact FR FR Contact Solder Ball Contact 1.27 mm Solder Ball Deformation After 48 Hours at 125C Solder Ball 1.0 mm Solder Ball Deformation After 24 Hours at 125C The 3M Textool Open-Top BGA Socket contact is designed to minimize deformation of the solder ball. This is achieved by means of a low-force, dual-beam design that touches the ball at two opposing points away from the BGA seating plane. The result is a system producing only minor indentations which have no effect on solder ball coplanarity. Micro-Wiping 3 FREE STATE OPEN CLOSED 3MTM TextoolTM Open-Top Sockets for BGA Packages Package Alignment Socket Construction Loading Sequence See Illustration Below 1. The top cover is pushed down until fully depressed. 2. The downward motion of the top cover is translated to lateral motion bringing the package guides to the loading position. Concurrently, the nest combs move to open the contact arms to the open position. Top Cover 3. A BGA package is loaded between the guides to achieve proper alignment of solder balls with socket contacts. 4. Raised features on the nest serve as physical stops that control package entry to the correct depth for proper socket operation. Package Guide Retainer Clip (2) Top Cover Package Guide Package Stop (4) Package Package Stop Nest Comb Nest (2) Lever (2) Contacts Contact Nest Comb Base Alignment Plate 4 3MTM TextoolTM Open-Top Sockets for BGA Packages BGA Packages and Relation to Socket BGA packages are available from multiple sources in a wide variety of designs, materials, body sizes, matrices, pin pattern configurations, pitches and thicknesses. To assure proper mating of package to socket and reliable socket performance, all package parameters must be precisely specified and the corresponding socket feature designed to match the package specification. To properly select or design a socket, the following package dimensions must be specified accurately. D ZD D1 e ob Essential BGA Package Dimensions Dimensions Overall Height A Ball Height A Substrate Thickness A Ball Diameter ob D E D E D E Body Size Total Pitch A A2 Minimum Mold Cap (If Retainer Clip is Used) e 1 2 2 D 3 (If Retainer Clip is Used) E 3 Ball Pitch e M Number of Rows E1 2 1 A1 Maximum Mold Cap E 1 D M E Number of Balls Package Overhang n Z Z D E ZE Pattern Square Edge D E 2 2 Need Pattern Drawing If retainer clip is specified, style of clip depends on package profile. The dimensions D & E and D & E noted at right are required to select the proper clip design. 2 2 3 3 Note: To assure proper match of socket to package, the preferred information is the latest revision of the customer package drawing. The package drawing should contain all of the information in the above table. Send the current package drawing to 3M Customer Service. Tapered Edge D E 2 2 D E D E 3 3 D E 2 2 5 Contact Gap Adjustment 3M Textool Open-Top BGA Sockets are designed to function with common solders under normal production burn-in conditions. In addition, for customers using eutectic solder-balls in long-term testing and/or highstress environments such as "life testing" and "HAST," 3M can customize sockets to control solder ball deformation by making an adjustment of the socket contact gap. This adjustment is called "custom gapping" and is based on actual measurement of BGA samples that are provided by the customer. This disclaimer is intended to cover eutectic and other low melt-point solder applications only. Higher melt-point solders, such as 90/10 and lead-free, do not require custom gapping. Please contact 3M Customer Service with your specific needs and conditions. Custom gapping tailors the socket for an exact solder ball diameter and should only be considered for stable production applications where solder ball dimensions are not expected to vary. 3MTM TextoolTM Open-Top Sockets for BGA Packages Socket Mechanism and Operating Instructions L OO XT /TE 3 OL XTO /TE 3 BGA Package Solder Ball 1 Nes st- s Ne t-2 Ne t-2 Contact Base Plate Stage 1 Stage 2 Free State. Socket, with normally closed contacts, in free state, ready for actuation. Contacts Open. A downward force is applied to the top plate, which translates to a lateral motion of the nest combs, and opens the contacts to receive the solder ball. Note: Depress top cover before inserting package. 6 3MTM TextoolTM Open-Top Sockets for BGA Packages Socket Mechanism and Operating Instructions O XTO /TE 3 OL XTO /TE 3 L ZIF (Zero Insertion Force) 7 Stage 3 Stage 4 A BGA device is placed into the top opening. Alignment features guide the package into proper position so each ball rests between the open contact arms. The vertical actuation force is removed, the contacts close and each ball is gripped above its horizontal center. 3MTM TextoolTM Open-Top Sockets for BGA Packages Ordering Information Retainer Clip Feature 1. Submit your detailed package drawing to 3M Customer Service. 2. Specify optional features desired: * With or without board locating posts * With or without retainer 3. 3M Customer Service will assign complete part number. 3M Textool sockets are designed to function properly without the use of retainer clips. The retainer clip feature is desirable for high vibration/shock applications and with small or non-spherical solder balls or to serve as a visual aid during package loading. The purpose of the retainer clip feature is to retain the DUT in the socket should there be an event or conditions leading to dislodgement of the solder balls from the socket contacts. Retainer clips are customdesigned based on specific package dimensions and should only be considered for stable production applications where package dimensions are not expected to vary. In cases of non-spherical and small solder balls, 3M Technical Service may request package samples for fit analysis. Socket Options Optional Board Locating Post on Socket Base (2) Optional Package Retainer Optional Length of Contact Tail 3 L OO XT /TE Optional Board Locating Post on Alignment Plate (2) Socket Part Numbering System 2XXX-9XXX-XX-X X X 1 Pin Count Product Series Number Product Platforms 0 = Type-0 1 = Type-I 2 = Type-II 3 = Type-III Package Size/ Matrix Variation 8 Material Type 1 = PES/BeCu/Au Solder Tail Length (Available options vary by pitch) Retainer 4 = Without (Standard for 1.0 mm and 1.27 mm) 5 = With (Standard for 0.65 mm and 0.80 mm) Board Locating Post 0 = Without 1 = With (Both Alignment Plate and Base) 2 = With (Alignment Plate Only) 3 = With (Base Only) Product Variation (3M Assigned) 3MTM TextoolTM Open-Top BGA Sockets 0.65 mm In an effort to better serve our customers, 3M continually updates our technical documents. Please visit our website for the most up-to-date technical information. www.3M.com/electronics BGA 0.65 mm Pitch Socket Platforms Type I II III Maximum Body Size (mm) 12x12 17x17 21x21 Maximum Matrix 17x17 25x25 31x31 Maximum Ball Count 289 625 961 Status Available Available Inquire* *Note: At time of publication, Type III was not released for sale. Please contact 3M Customer Service for current availability. BGA 0.65 mm Pitch Socket Available Package Guide Sizes Socket Type I II Note: 9 Series Number 9610 9611 9612 9613 9614 9615 9616 9617 9618 9619 9671 9620 9621 9670 9622 9623 9625 9624 9672 9626 9627 9628 9629 Package Body Size (mm) 8x8 8x8 9x9 9x9 10x10 10x10 11x11 11x11 12x12 12x12 9x9 13x13 13x13 13x13 14x14 14x14 15x15 15x15 15x15 16x16 16x16 17x17 17x17 Matrix Count 10x10 11x11 12x12 13x13 13x13 14x14 15x15 16x16 16x16 17x17 13x13 18x18 19x19 20x20 19x19 20x20 20x20 21x21 22x22 22x22 23x23 24x24 25x25 Maximum Pin Count 100 121 144 169 169 196 225 256 256 289 169 324 361 400 361 400 400 441 484 484 529 576 625 Contact 3M Customer Service Rep or 3M Authorized Distributor for information on sizes not listed on the above chart. Contact patterns can be customized to match the package. 3MTM TextoolTM Open-Top BGA Sockets 0.80 mm In an effort to better serve our customers, 3M continually updates our technical documents. Please visit our website for the most up-to-date technical information. www.3M.com/electronics BGA 0.80 mm Pitch Socket Platforms Type I II III IV Maximum Body Size (mm) 12x12 17x17 21x21 24x24 Maximum Matrix 13x13 19x19 25x25 31x31 Maximum Ball Count 169 361 625 961 Status Available Available Available Inquire* BGA 0.80 mm Pitch Socket Available Package Guide Sizes Socket Type I II III 10 Note: Series Number 9014 9015 9016 9017 9016 9018 9019 9018 9010 9026 9027 9028 9029 9020 9029 9021 9022 9021 9023 9024 9025 9030 9031 9032 9031 9033 9034 9033 9035 9036 9037 9038 Package Body Size (mm) 9x9 9x9 10x10 10x10 10x10 11x11 11x11 11x11 12x12 12x12 13x13 13x13 14x14 14x14 14x14 15x15 15x15 15x15 16x16 16x16 17x17 17x17 18x18 18x18 18x18 19x19 19x19 19x19 20x20 20x20 21x21 21x21 Matrix Count 9x9 10x10 10x10 11x11 12x12 11x11 12x12 13x13 13x13 14x14 14x14 15x15 15x15 16x16 17x17 16x16 17x17 18x18 18x18 19x19 19x19 20x20 20x20 21x21 22x22 21x21 22x22 23x23 23x23 24x24 24x24 25x25 Maximum Pin Count 81 100 100 121 144 121 144 169 169 196 196 225 225 256 289 256 289 324 324 361 361 400 400 441 484 441 484 529 529 576 576 625 Contact 3M Customer Service Rep or 3M Authorized Distributor for information on sizes not listed on the above chart. Contact patterns can be customized to match the package. 3MTM TextoolTM Open-Top BGA Sockets 1.0 mm In an effort to better serve our customers, 3M continually updates our technical documents. Please visit our website for the most up-to-date technical information. www.3M.com/electronics BGA 1.0 mm Pitch Socket Platforms Type 0 I II III Maximum Body Size (mm) 19x19 29x29 40x40 45x45 Maximum Matrix 17x17 27x27 39x39 45x45 Maximum Ball Count 289 729 1521 2025 Status Available Available Available Available BGA 1.0 mm Pitch Socket Available Package Guide Sizes Socket Type 0 Series Number 9342 9348 9340 9300 9301 9302 9303 9304 9305 9306 9307 9308 9344 9343 9309 9352 9355 9356 9357 9358 9310 9311 9312 9313 9314 9315 9316 9317 9318 9319 9360 9320 9321 9322 9323 9324 9325 9326 9327 9328 9329 9331 9332 9333 9334 9335 I II III 11 Note: Package Body Size (mm) 6x6 11x11 12x10 12x12 13x13 13x13 14x14 14x14 15x15 15x15 17x17 17x17 18x12 18x18 19x19 14x10 15x15 17x17 17x17 19x19 19x19 21x21 21x21 23x23 23x23 25x25 25x25 27x27 27x27 29x29 29x29 31x31 31x31 33x33 33x33 35x35 35x35 37.5x37.5 37.5x37.5 40x40 40x40 42.5 42.5 45 45 47.5 Matrix Count 6x6 10x10 10x8 11x11 11x11 12x12 12x12 13x13 13x13 14x14 15x15 16x16 16x10 15x15 17x17 13x9 14x14 15x15 16x16 17x17 18x18 19x19 20x20 21x21 22x22 23x23 24x24 25x25 26x26 27x27 28x28 29x29 30x30 31x31 32x32 33x33 34x34 36x36 37x37 38x38 39x39 41 42 43 44 45 Maximum Pin Count 36 100 80 121 121 144 144 169 169 196 225 256 160 225 289 117 196 225 256 289 324 361 400 441 484 529 576 625 676 729 784 841 900 961 1024 1089 1156 1296 1369 1444 1521 1681 1764 1849 1936 2025 Contact 3M Customer Service Rep or 3M Authorized Distributor for information on sizes not listed on the above chart. Contact patterns can be customized to match the package. 3MTM TextoolTM Open-Top BGA Sockets 1.27 mm In an effort to better serve our customers, 3M continually updates our technical documents. Please visit our website for the most up-to-date technical information. www.3M.com/electronics BGA 1.27 mm Pitch Socket Platforms Type II III Maximum Body Size (mm) 35x35 45x45 Maximum Matrix 27x27 35x35 Maximum Ball Count 729 1225 Status Available Available *Note: At time of publication, Type I was not released for sale. Please contact 3M Customer Service for current availability. BGA 1.27 mm Pitch Socket Available Package Guide Socket Type II III Note: 12 Series Number 9222 9223 9224 9225 9226 9227 9228 9229 9232 9233 9234 9235 9236 9237 9238 9239 Package Body Size (mm) 29 x 29 29 x 29 31 x 31 31 x 31 33 x 33 33 x 33 35 x 35 35 x 35 37.5 x 37.5 37.5 x 37.5 40 x 40 40 x 40 42.5 x 42.5 42.5 x 42.5 45 x 45 45 x 45 Matrix Count 21 x 21 22 x 22 23 x 23 24 x 24 24 x 24 25 x 25 26 x 26 27 x 27 28 x 28 29 x 29 30 x 30 31 x 31 32 x 32 33 x 33 34 x 34 35 x 35 Maximum Pin Count 441 484 529 576 576 625 676 729 784 841 900 961 1024 1089 1156 1225 Contact 3M Customer Service Rep or 3M Authorized Distributor for information on sizes not listed on the above chart. Contact patterns can be customized to match the package. .80 mm .65 mm Type II Type II Type I 1.00 mm 1.27 mm Type I Type II Type 0 Type III Type II Type III 3M and Textool are trademarks of 3M. Important Notice All statements, technical information, and recommendations related to 3M's products are based on information believed to be reliable, but the accuracy or completeness is not guaranteed. Before using this product, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated with such use. Any statements related to the product which are not contained in 3M's current publications, or any contrary statements contained on your purchase order shall have no force or effect unless expressly agreed upon, in writing, by an authorized officer of 3M. Warranty; Limited Remedy; Limited Liability. This product will be free from defects in material and manufacture for a period of one year from the time of purchase. 3M MAKES NO OTHER WARRANTIES INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. If this product is defective within the warranty period stated above, your exclusive remedy shall be, at 3M's option, to replace or repair the 3M product or refund the purchase price of the 3M product. Except where prohibited by law, 3M will not be liable for any indirect, special, incidental or consequential loss or damage arising from this 3M product, regardless of the legal theory asserted. 3 Electronics 6801 River Place Blvd. Austin, TX 78726-9000 www.3M.com/electronics 1-800-225-5373 1-800-932-9373 (fax) (c) 3M 2005