To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
5. When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
Electronics products or the technology described in this document for any purpose relating to military applications or use by
the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and
technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
7. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior
written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
expressly specified in a Renesas Electronics data sheets or data books, etc.
“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS
Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with
applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
T
he information in this document is subject to change without notice. Before using this document, pleas
e
c
onfirm that this is the latest version.
N
ot all products and/or types are available in every country. Please check with an NEC Electronic
s
s
ales representative for availability and additional information.
MOS INTEGRATED CIRCUIT
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
18M-BIT QDRTMII SRAM
4-WORD BURST OPERATION
Document No. M19870EJ1V0DS00 (1st edition)
Date Published July 2009
Printed in Japan
DATA SHEET
2009
Description
The
μ
PD44165084A-A is a 2,097,152-word by 8-bit, the
μ
PD44165094A-A is a 2,097,152-word by 9-bit, the
μ
PD44165184A-A is a 1,048,576-word by 18-bit and the
μ
PD44165364A-A is a 524,288-word by 36-bit synchronous quad
data rate static RAM fabricated with advanced CMOS technology using full CMOS six-transistor memory cell.
The
μ
PD44165084A-A,
μ
PD44165094A-A,
μ
PD44165184A-A and
μ
PD44165364A-A integrate unique synchronous
peripheral circuitry and a burst counter. All input registers controlled by an input clock pair (K and K#) are latched on
the positive edge of K and K#.
These products are suitable for application which require synchronous operation, high speed, low voltage, high density
and wide bit configuration.
These products are packaged in 165-pin PLASTIC BGA.
Features
1.8 ± 0.1 V power supply
165-pin PLASTIC BGA (13 x 15)
HSTL interface
PLL circuitry for wide output data valid window and future frequency scaling
Separate independent read and write data ports with concurrent transactions
100% bus utilization DDR READ and WRITE operation
Four-tick burst for reduced address frequency
Two input clocks (K and K#) for precise DDR timing at clock rising edges only
Two output clocks (C and C#) for precise flight time
and clock skew matching-clock and data delivered together to receiving device
Internally self-timed write control
Clock-stop capability. Normal operation is restored in 1,024 cycles after clock is resumed.
User programmable impedance output
Fast clock cycle time : 3.3 ns (300 MHz) , 3.7 ns (270 MHz) , 4.0 ns (250 MHz) , 5.0 ns (200 MHz)
Simple control logic for easy depth expansion
JTAG boundary scan
Operating ambient temperature : Commercial TA = 0 to +70°C (-E33, -E40, -E50)
Industrial TA = –40 to +85°C (-E37Y, -E40Y, -E50Y)
2 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Ordering Information
(1) Operating Ambient Temperature TA = 0 to +70°C
Part number Cycle Clock Organization Package Operating
Time Frequency (word x bit) Ambient
ns MHz Temperature
μ
PD44165084AF5-E33-EQ2-A
3.3 300 2M x 8-bit 165-pin PLASTIC Commercial
μ
PD44165084AF5-E40-EQ2-A 4.0 250 BGA (13 x 15) (TA = 0 to +70°C)
μ
PD44165084AF5-E50-EQ2-A 5.0 200
μ
PD44165094AF5-E33-EQ2-A
3.3 300 2M x 9-bit Lead-free
μ
PD44165094AF5-E40-EQ2-A 4.0 250
μ
PD44165094AF5-E50-EQ2-A 5.0 200
μ
PD44165184AF5-E33-EQ2-A
3.3 300 1M x 18-bit
μ
PD44165184AF5-E40-EQ2-A 4.0 250
μ
PD44165184AF5-E50-EQ2-A 5.0 200
μ
PD44165364AF5-E33-EQ2-A
3.3 300 512K x 36-bit
μ
PD44165364AF5-E40-EQ2-A 4.0 250
μ
PD44165364AF5-E50-EQ2-A 5.0 200
Remarks 1. QDR Consortium standard package size is 13 x 15 and 15 x 17.
The footprint is commonly used.
2. Products with -A at the end of the part number are lead-free products.
3 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
(2) Operating Ambient Temperature TA = –40 to +85°C
Part number Cycle Clock Organization Package Operating
Time Frequency (word x bit) Ambient
ns MHz Temperature
μ
PD44165084AF5-E37Y-EQ2-A 3.7 270 2M x 8-bit 165-pin PLASTIC Industrial
μ
PD44165084AF5-E40Y-EQ2-A 4.0 250 BGA (13 x 15) (TA = –40 to +85°C)
μ
PD44165084AF5-E50Y-EQ2-A 5.0 200
μ
PD44165094AF5-E37Y-EQ2-A 3.7 270 2M x 9-bit Lead-free
μ
PD44165094AF5-E40Y-EQ2-A 4.0 250
μ
PD44165094AF5-E50Y-EQ2-A 5.0 200
μ
PD44165184AF5-E37Y-EQ2-A 3.7 270 1M x 18-bit
μ
PD44165184AF5-E40Y-EQ2-A 4.0 250
μ
PD44165184AF5-E50Y-EQ2-A 5.0 200
Remarks 1. QDR Consortium standard package size is 13 x 15 and 15 x 17.
The footprint is commonly used.
2. Products with -A at the end of the part number are lead-free products.
4 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Pin Configurations
165-pin PLASTIC BGA (13 x 15)
(Top View)
[
μ
PD44165084A-A]
2M x 8-bit
1 2 3 4 5 6 7 8 9 10 11
A CQ# VSS A W# NW1# K# NC R# A VSS CQ
B NC NC NC A NC K NW0# A NC NC Q3
C NC NC NC VSS A NC A VSS NC NC D3
D NC D4 NC VSS VSS VSS VSS VSS NC NC NC
E NC NC Q4 VDDQ VSS VSS VSS VDDQ NC D2 Q2
F NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC
G NC D5 Q5 VDDQ VDD VSS VDD VDDQ NC NC NC
H DLL# VREF VDDQ VDDQ VDD VSS VDD VDDQVDDQVREF ZQ
J NC NC NC VDDQ VDD VSS VDD VDDQ NC Q1 D1
K NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC
L NC Q6 D6 VDDQ VSS VSS VSS VDDQ NC NC Q0
M NC NC NC VSS VSS VSS VSS VSS NC NC D0
N NC D7 NC VSS A A A VSS NC NC NC
P NC NC Q7 A A C A A NC NC NC
R TDO TCK A A A C# A A A TMS TDI
A : Address inputs DLL# : DLL/PLL disable
D0 to D7 : Data inputs TMS : IEEE 1149.1 Test input
Q0 to Q7 : Data outputs TDI : IEEE 1149.1 Test input
R# : Read input TCK : IEEE 1149.1 Clock input
W# : Write input TDO : IEEE 1149.1 Test output
NW0#, NW1# : Nibble Write data select VREF : HSTL input reference input
K, K# : Input clock VDD : Power Supply
C, C# : Output clock VDDQ : Power Supply
CQ, CQ# : Echo clock VSS : Ground
ZQ : Output impedance matching NC : No connection
Remarks 1. ×××# indicates active LOW signal.
2. Refer to Package Drawing for the index mark.
3. 2A, 7A and 10A are expansion addresses: 10A for 36Mb, 2A for 72Mb and 7A for 144Mb.
2A and 10A of this product can also be used as NC.
5 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
165-pin PLASTIC BGA (13 x 15)
(Top View)
[
μ
PD44165094A-A]
2M x 9-bit
1 2 3 4 5 6 7 8 9 10 11
A CQ# VSS A W# NC K# NC R# A VSS CQ
B NC NC NC A NC K BW0# A NC NC Q4
C NC NC NC VSS A NC A VSS NC NC D4
D NC D5 NC VSS VSS VSS VSS VSS NC NC NC
E NC NC Q5 VDDQ VSS VSS VSS VDDQ NC D3 Q3
F NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC
G NC D6 Q6 VDDQ VDD VSS VDD VDDQ NC NC NC
H DLL# VREF VDDQ VDDQ VDD VSS VDD VDDQVDDQVREF ZQ
J NC NC NC VDDQ VDD VSS VDD VDDQ NC Q2 D2
K NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC
L NC Q7 D7 VDDQ VSS VSS VSS VDDQ NC NC Q1
M NC NC NC VSS VSS VSS VSS VSS NC NC D1
N NC D8 NC VSS A A A VSS NC NC NC
P NC NC Q8 A A C A A NC D0 Q0
R TDO TCK A A A C# A A A TMS TDI
A : Address inputs DLL# : DLL/PLL disable
D0 to D8 : Data inputs TMS : IEEE 1149.1 Test input
Q0 to Q8 : Data outputs TDI : IEEE 1149.1 Test input
R# : Read input TCK : IEEE 1149.1 Clock input
W# : Write input TDO : IEEE 1149.1 Test output
BW0# : Byte Write data select VREF : HSTL input reference input
K, K# : Input clock VDD : Power Supply
C, C# : Output clock VDDQ : Power Supply
CQ, CQ# : Echo clock VSS : Ground
ZQ : Output impedance matching NC : No connection
Remarks 1. ×××# indicates active LOW signal.
2. Refer to Package Drawing for the index mark.
3. 2A, 7A and 10A are expansion addresses: 10A for 36Mb, 2A for 72Mb and 7A for 144Mb.
2A and 10A of this product can also be used as NC.
6 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
165-pin PLASTIC BGA (13 x 15)
(Top View)
[
μ
PD44165184A-A]
1M x 18-bit
1 2 3 4 5 6 7 8 9 10 11
A CQ# VSS NC W# BW1# K# NC R# A VSS CQ
B NC Q9 D9 A NC K BW0# A NC NC Q8
C NC NC D10 VSS A NC A VSS NC Q7 D8
D NC D11 Q10 VSS VSS VSS VSS VSS NC NC D7
E NC NC Q11 VDDQ VSS VSS VSS VDDQ NC D6 Q6
F NC Q12 D12 VDDQ VDD VSS VDD VDDQ NC NC Q5
G NC D13 Q13 VDDQ VDD VSS VDD VDDQ NC NC D5
H DLL# VREF VDDQ VDDQ VDD VSS VDD VDDQVDDQVREF ZQ
J NC NC D14 VDDQ VDD VSS VDD VDDQ NC Q4 D4
K NC NC Q14 VDDQ VDD VSS VDD VDDQ NC D3 Q3
L NC Q15 D15 VDDQ VSS VSS VSS VDDQ NC NC Q2
M NC NC D16 VSS VSS VSS VSS VSS NC Q1 D2
N NC D17 Q16 VSS A A A VSS NC NC D1
P NC NC Q17 A A C A A NC D0 Q0
R TDO TCK A A A C# A A A TMS TDI
A : Address inputs DLL# : DLL/PLL disable
D0 to D17 : Data inputs TMS : IEEE 1149.1 Test input
Q0 to Q17 : Data outputs TDI : IEEE 1149.1 Test input
R# : Read input TCK : IEEE 1149.1 Clock input
W# : Write input TDO : IEEE 1149.1 Test output
BW0#, BW1# : Byte Write data select VREF : HSTL input reference input
K, K# : Input clock VDD : Power Supply
C, C# : Output clock VDDQ : Power Supply
CQ, CQ# : Echo clock VSS : Ground
ZQ : Output impedance matching NC : No connection
Remarks 1. ×××# indicates active LOW signal.
2. Refer to Package Drawing for the index mark.
3. 2A, 3A and 10A are expansion addresses: 3A for 36Mb, 10A for 72Mb and 2A for 144Mb.
2A and 10A of this product can also be used as NC.
7 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
165-pin PLASTIC BGA (13 x 15)
(Top View)
[
μ
PD44165364A-A]
512K x 36-bit
1 2 3 4 5 6 7 8 9 10 11
A CQ# VSS NC W# BW2# K# BW1# R# NC VSS CQ
B Q27 Q18 D18 A BW3# K BW0# A D17 Q17 Q8
C D27 Q28 D19 VSS A NC A VSS D16 Q7 D8
D D28 D20 Q19 VSS VSS VSS VSS VSS Q16 D15 D7
E Q29 D29 Q20 VDDQ VSS VSS VSS VDDQ Q15 D6 Q6
F Q30 Q21 D21 VDDQ VDD VSS VDD VDDQ D14 Q14 Q5
G D30 D22 Q22 VDDQ VDD VSS VDD VDDQ Q13 D13 D5
H DLL# VREF VDDQ VDDQ VDD VSS VDD VDDQVDDQVREF ZQ
J D31 Q31 D23 VDDQ VDD VSS VDD VDDQ D12 Q4 D4
K Q32 D32 Q23 VDDQ VDD VSS VDD VDDQ Q12 D3 Q3
L Q33 Q24 D24 VDDQ VSS VSS VSS VDDQ D11 Q11 Q2
M D33 Q34 D25 VSS VSS VSS VSS VSS D10 Q1 D2
N D34 D26 Q25 VSS A A A VSS Q10 D9 D1
P Q35 D35 Q26 A A C A A Q9 D0 Q0
R TDO TCK A A A C# A A A TMS TDI
A : Address inputs DLL# : DLL/PLL disable
D0 to D35 : Data inputs TMS : IEEE 1149.1 Test input
Q0 to Q35 : Data outputs TDI : IEEE 1149.1 Test input
R# : Read input TCK : IEEE 1149.1 Clock input
W# : Write input TDO : IEEE 1149.1 Test output
BW0# to BW3# : Byte Write data select VREF : HSTL input reference input
K, K# : Input clock VDD : Power Supply
C, C# : Output clock VDDQ : Power Supply
CQ, CQ# : Echo clock VSS : Ground
ZQ : Output impedance matching NC : No connection
Remarks 1. ×××# indicates active LOW signal.
2. Refer to Package Drawing for the index mark.
3. 3A, 9A and 10A are expansion addresses: 9A for 36Mb, 3A for 72Mb and 10A for 144Mb.
2A and 10A of this product can also be used as NC.
8 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Pin Identification (1/2)
Symbol Description
A Synchronous Address Inputs: These inputs are registered and must meet the setup and hold times around the
rising edge of K. All transactions operate on a burst of four words (two clock periods of bus activity). These
inputs are ignored when device is deselected, i.e., NOP (R# = W# = HIGH).
D0 to Dxx Synchronous Data Inputs: Input data must meet setup and hold times around the rising edges of K and K#
during WRITE operations. See Pin Configurations for ball site location of individual signals.
x8 device uses D0 to D7.
x9 device uses D0 to D8.
x18 device uses D0 to D17.
x36 device uses D0 to D35.
Q0 to Qxx Synchronous Data Outputs: Output data is synchronized to the respective C and C# or to K and K# rising edges
if C and C# are tied HIGH. Data is output in synchronization with C and C# (or K and K#), depending on the R#
command. See Pin Configurations for ball site location of individual signals.
x8 device uses Q0 to Q7.
x9 device uses Q0 to Q8.
x18 device uses Q0 to Q17.
x36 device uses Q0 to Q35.
R# Synchronous Read: When LOW this input causes the address inputs to be registered and a READ cycle to be
initiated. This input must meet setup and hold times around the rising edge of K. If a READ command (R# =
LOW) is input, an input of R# on the subsequent rising edge of K is ignored.
W# Synchronous Write: When LOW this input causes the address inputs to be registered and a WRITE cycle to be
initiated. This input must meet setup and hold times around the rising edge of K. If a WRITE command (W# =
LOW) is input, an input of W# on the subsequent rising edge of K is ignored.
BWx#
NWx#
Synchronous Byte Writes (Nibble Writes on x8): When LOW these inputs cause their respective byte or nibble
to be registered and written during WRITE cycles. These signals must meet setup and hold times around the
rising edges of K and K# for each of the two rising edges comprising the WRITE cycle. See Pin
Configurations for signal to data relationships.
x8 device uses NW0#, NW1#.
x9 device uses BW0#.
x18 device uses BW0#, BW1#.
x36 device uses BW0# to BW3#.
See Byte Write Operation for relation between BWx#, NWx# and Dxx.
K, K# Input Clock: This input clock pair registers address and control inputs on the rising edge of K, and registers data
on the rising edge of K and the rising edge of K#. K# is ideally 180 degrees out of phase with K. All
synchronous inputs must meet setup and hold times around the clock rising edges.
C, C# Output Clock: This clock pair provides a user controlled means of tuning device output data. The rising edge of
C# is used as the output timing reference for first and third output data. The rising edge of C is used as the
output reference for second and fourth output data. Ideally, C# is 180 degrees out of phase with C. When use of
K and K# as the reference instead of C and C#, then fixed C and C# to HIGH. Operation cannot be guaranteed
unless C and C# are fixed to HIGH (i.e. toggle of C and C#).
9 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
(2/2)
Symbol Description
CQ, CQ# Synchronous Echo Clock Outputs. The rising edges of these outputs are tightly matched to the synchronous
data outputs and can be used as a data valid indication. These signals run freely and do not stop when Q
tristates. If C and C# are stopped (if K and K# are stopped in the single clock mode), CQ and CQ# will also
stop.
ZQ Output Impedance Matching Input: This input is used to tune the device outputs to the system data bus
impedance. Q, CQ and CQ# output impedance are set to 0.2 x RQ, where RQ is a resistor from this bump to
ground. The output impedance can be minimized by directly connect ZQ to VDDQ. This pin cannot be connected
directly to GND or left unconnected. The output impedance is adjusted every 1,024 cycles upon power-up to
account for drifts in supply voltage and temperature. After replacement for a resistor, the new output impedance
is reset by implementing power-on sequence.
DLL# DLL/PLL Disable: When debugging the system or board, the operation can be performed at a clock frequency
slower than TKHKH (MAX.) without the DLL/PLL circuit being used, if DLL# = LOW. The AC/DC characteristics
cannot be guaranteed. For normal operation, DLL# must be HIGH and it can be connected to VDDQ through a
10 kΩ or less resistor.
TMS
TDI
IEEE 1149.1 Test Inputs: 1.8 V I/O level. These balls may be left Not Connected if the JTAG function is not
used in the circuit.
TCK IEEE 1149.1 Clock Input: 1.8 V I/O level. This pin must be tied to VSS if the JTAG function is not used in the
circuit.
TDO IEEE 1149.1 Test Output: 1.8 V I/O level.
VREF HSTL Input Reference Voltage: Nominally VDDQ/2. Provides a reference voltage for the input buffers.
VDD Power Supply: 1.8 V nominal. See Recommended DC Operating Conditions and DC Characteristics for
range.
VDDQ Power Supply: Isolated Output Buffer Supply. Nominally 1.5 V. 1.8 V is also permissible. See Recommended DC
Operating Conditions and DC Characteristics for range.
VSS Power Supply: Ground
NC No Connect: These signals are not connected internally.
10 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Block Diagram
[
μ
PD44165084A-A]
DATA
REGISTRY
& LOGIC
OUTPUT
REGISTER
W#
NW0#
NW1#
R#
K
K# K
K
R#
W#
K
ADDRESS 19
19
D0 to D7 8
OUTPUT
SELECT
OUTPUT
BUFFER
8
16
16
16
32
16
MUX
MUX
ADDRESS
REGISTRY
& LOGIC
219x 32
MEMORY
ARRAY
WRITE
DRIVER
SENSE
AMPS
WRITE
REGISTER
Q0 to Q7
C, C#
OR
K, K#
CQ,
CQ#
2
[
μ
PD44165094A-A]
DATA
REGISTRY
& LOGIC
OUTPUT
REGISTER
W#
BW0#
R#
K
K# K
K
R#
W#
K
ADDRESS 19
19
D0 to D8 9
OUTPUT
SELECT
OUTPUT
BUFFER
9
18
18
18
36
18
MUX
MUX
ADDRESS
REGISTRY
& LOGIC
219x 36
MEMORY
ARRAY
WRITE
DRIVER
SENSE
AMPS
WRITE
REGISTER
Q0 to Q8
C, C#
OR
K, K#
CQ,
CQ#
2
11 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
[
μ
PD44165184A-A]
DATA
REGISTRY
& LOGIC
OUTPUT
REGISTER
W#
BW0#
BW1#
R#
K
K# K
K
R#
W#
K
A
DDRESS 18
18
D0 to D17 18
OUTPUT
SELECT
OUTPUT
BUFFER
18
36
36 36
72
36
MUX
MUX
ADDRESS
REGISTRY
& LOGIC
2
18
x 72
MEMORY
ARRAY
WRITE
DRIVER
SENSE
AMPS
WRITE
REGISTER
Q0 to Q1
7
C, C#
OR
K, K#
CQ,
CQ#
2
[
μ
PD44165364A-A]
DATA
REGISTRY
& LOGIC
OUTPUT
REGISTER
W#
BW0#
BW1#
R#
K
K# K
K
R#
W#
K
ADDRESS 17
17
D0 to D35 36
OUTPUT
SELECT
OUTPUT
BUFFER
36
72
72 72
144
72
MUX
MUX
ADDRESS
REGISTRY
& LOGIC
217x 144
MEMORY
ARRAY
WRITE
DRIVER
SENSE
AMPS
WRITE
REGISTER
Q0 to Q35
C, C#
OR
K, K#
CQ,
CQ#
2
BW2#
BW3#
12 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Power-on Sequence
The following timing charts show the recommended power-on sequence, i.e., when starting the clock after VDD/VDDQ
stable and when starting the clock before VDD/VDDQ stable.
1. Clock starts after VDD/VDDQ stable
The clock is supplied from a controller.
(a)
V
DD
/V
DD
Q
V
DD
/V
DD
Q Stable (< ±0.1 V DC per 50 ns)
DLL#
Clock Start Normal Operation
Start
Clock
Fix HIGH (or tied to V
DD
Q)
20 ns (MIN.)
1,024 cycles or more
Stable Clock
Note
Note Input a stable clock from the start.
(b)
VDD/VDDQ
DLL# Switched to HIGH after Clock is stable.
Unstable Clock
(level, frequency)
VDD/VDDQ Stable (< ±0.1 V DC per 50 ns)
Clock
Clock Start
Normal Operation
Start
1,024 cycles or more
Stable Clock
(c)
V
DD
/V
DD
Q
DLL#
30 ns. (MIN.)
Clock Stop
V
DD
/V
DD
Q Stable (< ±0.1 V DC per 50 ns)
Fix HIGH (or tied to V
DD
Q)
Unstable Clock
(level, frequency)
Clock
Clock Start
Normal Operation
Start
1,024 cycles or more
Stable Clock
13 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
2. Clock starts before VDD/VDDQ stable
The clock is supplied from a clock generator.
(a)
V
DD
/V
DD
Q
DLL#
30 ns. (MIN.)
Clock Stop
V
DD
/V
DD
Q Stable (< ±0.1 V DC per 50 ns)
Fix HIGH (or tied to V
DD
Q)
Unstable Clock
(level, frequency)
Clock
Clock Start
Normal Operation Start1,024 cycles or more
Stable Clock
(b)
V
DD
/V
DD
Q
DLL#
Clock keep running
Switched to HIGH after Clock is stable.
HIGH or LOW
30 ns (MIN.)
DLL# LOW
V
DD
/V
DD
Q Stable (< ±0.1 V DC per 50 ns)
Normal
Operation
Start
1,024 cycles or more
Stable Clock
Unstable Clock
(level, frequency)
Clock
Clock Start
14 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Truth Table
Operation CLK R# W# D or Q
WRITE cycle L H H L Data in
Load address, input write data on two Input data DA(A+0) DA(A+1) DA(A+2) DA(A+3)
consecutive K and K# rising edge Input clock K(t+1) K#(t+1) K(t+2) K#(t+2)
READ cycle L H L X Data out
Load address, read data on two Output data QA(A+0) QA(A+1) QA(A+2) QA(A+3)
consecutive C and C# rising edge Output clock C#(t+1) C(t+2) C#(t+2) C(t+3)
NOP (No operation) L H H H D = X, Q = High-Z
Clock stop Stopped X X Previous state
Remarks 1. H : HIGH, L : LOW, × : don’t care, : rising edge.
2. Data inputs are registered at K and K# rising edges. Data outputs are delivered at C and C# rising edges
except if C and C# are HIGH then data outputs are delivered at K and K# rising edges.
3. R# and W# must meet setup/hold times around the rising edge (LOW to HIGH) of K and are registered at
the rising edge of K.
4. This device contains circuitry that ensure the outputs to be in high impedance during power-up.
5. Refer to state diagram and timing diagrams for clarification.
6. It is recommended that K = K# = C = C# when clock is stopped. This is not essential but permits most
rapid restart by overcoming transmission line charging symmetrically.
7. If R# was LOW to initiate the previous cycle, this signal becomes a don't care for this WRITE operation
however it is strongly recommended that this signal is brought HIGH as shown in the truth table.
8. W# during write cycle and R# during read cycle were HIGH on previous K clock rising edge. Initiating
consecutive READ or WRITE operations on consecutive K clock rising edges is not permitted. The
device will ignore the second request.
15 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Byte Write Operation
[
μ
PD44165084A-A]
Operation K K# NW0# NW1#
Write D0 to D7 L H 0 0
L H 0 0
Write D0 to D3 L H 0 1
L H 0 1
Write D4 to D7 L H 1 0
L H 1 0
Write nothing L H 1 1
L H 1 1
Remarks 1. H : HIGH, L : LOW, : rising edge.
2. Assumes a WRITE cycle was initiated. NW0# and NW1# can be altered for any portion of the BURST
WRITE operation provided that the setup and hold requirements are satisfied.
[
μ
PD44165094A-A]
Operation K K# BW0#
Write D0 to D8 L H 0
L H 0
Write nothing L H 1
L H 1
Remarks 1. H : HIGH, L : LOW, : rising edge.
2. Assumes a WRITE cycle was initiated. BW0# can be altered for any portion of the BURST WRITE
operation provided that the setup and hold requirements are satisfied.
[
μ
PD44165184A-A]
Operation K K# BW0# BW1#
Write D0 to D17 L H 0 0
L H 0 0
Write D0 to D8 L H 0 1
L H 0 1
Write D9 to D17 L H 1 0
L H 1 0
Write nothing L H 1 1
L H 1 1
Remarks 1. H : HIGH, L : LOW, : rising edge.
2. Assumes a WRITE cycle was initiated. BW0# and BW1# can be altered for any portion of the BURST
WRITE operation provided that the setup and hold requirements are satisfied.
16 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
[
μ
PD44165364A-A]
Operation K K# BW0# BW1# BW2# BW3#
Write D0 to D35 L H 0 0 0 0
L H 0 0 0 0
Write D0 to D8 L H 0 1 1 1
L H 0 1 1 1
Write D9 to D17 L H 1 0 1 1
L H 1 0 1 1
Write D18 to D26 L H 1 1 0 1
L H 1 1 0 1
Write D27 to D35 L H 1 1 1 0
L H 1 1 1 0
Write nothing L H 1 1 1 1
L H 1 1 1 1
Remarks 1. H : HIGH, L : LOW, : rising edge.
2. Assumes a WRITE cycle was initiated. BW0# to BW3# can be altered for any portion of the BURST
WRITE operation provided that the setup and hold requirements are satisfied.
17 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Bus Cycle State Diagram
READ DOUBLE;
R_Count = R_Count+2
WRITE DOUBLE;
W_Count = W_Count+2
Power UP
Always
R# = HIGH
Supply voltage
provided
LOAD NEW
READ ADDRESS;
R_Count = 0;
R_Init = 1
READ PORT NOP
R_Init = 0
R# = LOW & R_Count = 4
W# = HIGH
WRITE PORT NOP
LOAD NEW
WRITE ADDRESS;
W_Count = 0
Always W# = LOW & W_Count = 4
W# = LOW
R_Init = 0 R# = LOW
Supply voltage
provided
INCREMENT READ
ADDRESS BY TWO
R_Init = 0
INCREMENT WRITE
ADDRESS BY TWO
W_Count = 2 R_Count = 2 AlwaysAlways
W# = HIGH
& W_Count = 4
R# = HIGH
& R_Count = 4
Remarks 1. The address is concatenated with two additional internal LSBs to facilitate burst operation.
The address order is always fixed as: xxx...xxx+0, xxx...xxx+1, xxx...xxx+2, xxx...xxx+3.
Bus cycle is terminated at the end of this sequence (burst count = 4).
2. Read and write state machines can be active simultaneously.
Read and write cannot be simultaneously initiated. Read takes precedence.
3. State machine control timing is controlled by K.
18 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Electrical Specifications
Absolute Maximum Ratings
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Supply voltage VDD –0.5 +2.5 V
Output supply voltage VDDQ –0.5 VDD V
Input voltage VIN –0.5 VDD + 0.5 (2.5 V MAX.) V
Input / Output voltage VI/O –0.5 VDDQ + 0.5 (2.5 V MAX.) V
Operating ambient temperature TA Commercial 0 +70 °C
Industrial –40 +85
Storage temperature Tstg –55 +125 °C
Caution Exposing the device to stress above those listed in Absolute Maximum Ratings could cause
permanent damage. The device is not meant to be operated under conditions outside the limits
described in the operational section of this specification. Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
Recommended DC Operating Conditions
Parameter Symbol Conditions MIN. TYP. MAX. Unit Note
Supply voltage VDD 1.7 1.9 V
Output supply voltage VDDQ 1.4 VDD V 1
Input HIGH voltage VIH (DC) VREF + 0.1 VDDQ + 0.3 V 1, 2
Input LOW voltage VIL (DC) –0.3 VREF – 0.1 V 1, 2
Clock input voltage VIN –0.3 VDDQ + 0.3 V 1, 2
Reference voltage VREF 0.68 0.95 V
Notes 1. During normal operation, VDDQ must not exceed VDD.
2. Power-up: VIH VDDQ + 0.3 V and VDD 1.7 V and VDDQ 1.4 V for t 200 ms
Recommended AC Operating Conditions
Parameter Symbol Conditions MIN. TYP. MAX. Unit Note
Input HIGH voltage VIH (AC) VREF + 0.2 V 1
Input LOW voltage VIL (AC) VREF – 0.2 V 1
Note 1. Overshoot: VIH (AC) VDD + 0.7 V (2.5 V MAX.) for t TKHKH/2
Undershoot: VIL (AC) – 0.5 V for t TKHKH/2
Control input signals may not have pulse widths less than TKHKL (MIN.) or operate at cycle rates less than
TKHKH (MIN.).
19 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
DC Characteristics (VDD = 1.8 ± 0.1 V)
Parameter Symbol Test condition MIN. TYP. MAX. Unit Note
x8, x9 x18 x36
Input leakage current ILI –2 +2
μ
A
I/O leakage current ILO –2 +2
μ
A
Operating supply IDD Note1 Commercial -E33 520 610 790 mA
current (TA = 0 to +70°C) -E40 460 530 680
(Read cycle/ -E50 410 460 580
Write cycle) Industrial -E37Y 500 580
(TA = –40 to +85°C) -E40Y 480 550
-E50Y 430 480
Standby supply ISB1 Note1 Commercial -E33 300 300 300 mA
current (TA = 0 to +70°C) -E40 280 280 280
(NOP) -E50 260 260 260
Industrial -E37Y 310 310
(TA = –40 to +85°C) -E40Y 300 300
-E50Y 280 280
Output HIGH voltage VOH(Low) |IOH| 0.1 mA VDDQ – 0.2 VDDQ V 4, 5
VOH Note2 VDDQ/2–0.12 – VDDQ/2+0.12 4, 5
Output LOW voltage VOL(Low) IOL 0.1 mA VSS 0.2 V 4, 5
VOL Note3 VDDQ/2–0.12 – VDDQ/2+0.12 4, 5
Notes 1. VIN VIL or VIN VIH, II/O = 0 mA, Cycle = MAX.
2. Outputs are impedance-controlled. | IOH | = (VDDQ/2)/(RQ/5) ±15% for values of 175 Ω RQ 350 Ω.
3. Outputs are impedance-controlled. IOL = (VDDQ/2)/(RQ/5) ±15% for values of 175 Ω RQ 350 Ω.
4. AC load current is higher than the shown DC values.
5. HSTL outputs meet JEDEC HSTL Class I standards.
Capacitance (TA = 25°C, f = 1 MHz)
Parameter Symbol Test conditions MIN. TYP. MAX. Unit
Input capacitance (Address, Control) CIN VIN = 0 V 4 5 pF
Input / Output capacitance CI/O VI/O = 0 V 6 7 pF
(D, Q, CQ, CQ#)
Clock Input capacitance Cclk Vclk = 0 V 5 6 pF
Remark These parameters are periodically sampled and not 100% tested.
Thermal Resistance
Parameter Symbol Test conditions MIN. TYP. MAX. Unit
Thermal resistance
θ
j-a 25.1 °C/W
(junction – ambient)
Thermal resistance
θ
j-c 2.8 °C/W
(junction – case)
Remark These parameters are simulated under the condition of air flow velocity = 1 m/s.
20 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
AC Characteristics (VDD = 1.8 ± 0.1 V)
AC Test Conditions (VDD = 1.8 ± 0.1 V, VDDQ = 1.4 V to VDD)
Input waveform (Rise / Fall time 0.3 ns)
0.75 V 0.75 V
Test Points
1.25 V
0.25 V
Output waveform
V
DD
Q / 2 V
DD
Q / 2
Test Points
Output load condition
Figure 1. External load at test
V
DD
Q / 2
0.75 V 50 Ω
Z
O
= 50 Ω
250 Ω
SRAM
V
REF
ZQ
21 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Read and Write Cycle
Parameter Symbol
-E33 -E37Y
-E40, -E40Y -E50, -E50Y Unit Note
(300 MHz) (270 MHz) (250 MHz) (200 MHz)
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
Clock
Average Clock cycle time (K, K#, C, C#) TKHKH 3.3 8.4 3.7 8.4 4.0 8.4 5.0 8.4 ns 1
Clock phase jitter (K, K#, C, C#) TKC var – 0.2 0.2 – 0.2 – 0.2
ns 2
Clock HIGH time (K, K#, C, C#) TKHKL 1.32 1.5 1.6 – 2.0 – ns
Clock LOW time (K, K#, C, C#) TKLKH 1.32 1.5 1.6 – 2.0 – ns
Clock HIGH to Clock# HIGH
(KK#, CC#)
TKHK#H 1.49 – 1.7 1.8 – 2.2 – ns
Clock# HIGH to Clock HIGH
(K#K, C#C)
TK#HKH 1.49 – 1.7 1.8 – 2.2 – ns
Clock to data clock 270 to 300 MHz TKHCH 0 1.45 – – – – – –
ns
(KC, K#C#) 250 to 270 MHz 0 1.65 0 1.65 – – – –
200 to 250 MHz 0 1.8 0 1.8 0 1.8 –
167 to 200 MHz 0 2.3 0 2.3 0 2.3 0 2.3
133 to 167 MHz 0 2.8 0 2.8 0 2.8 0 2.8
< 133 MHz 0 3.55 0 3.55 0 3.55 0 3.55
DLL/PLL lock time (K, C) TKC lock 1,024 1,024 1,024 – 1,024 – Cycle 3
K static to DLL/PLL reset TKC reset 30 – 30 30 – 30 – ns 4
Output Times
C, C# HIGH to output valid TCHQV – 0.45 0.45 – 0.45 – 0.45
ns
C, C# HIGH to output hold TCHQX – 0.45 0.45 0.45 – 0.45 ns
C, C# HIGH to echo clock valid TCHCQV – 0.45 0.45 – 0.45 – 0.45
ns
C, C# HIGH to echo clock hold TCHCQX – 0.45 0.45 – 0.45 0.45 ns
CQ, CQ# HIGH to output valid TCQHQV – 0.27 0.3 – 0.3 – 0.35
ns 5
CQ, CQ# HIGH to output hold TCQHQX – 0.27 – 0.3 – 0.3 – 0.35 ns 5
C HIGH to output High-Z TCHQZ – 0.45 0.45 – 0.45 – 0.45
ns
C HIGH to output Low-Z TCHQX1 0.45 0.45 – 0.45 0.45 ns
Setup Times
Address valid to K rising edge TAVKH 0.4 – 0.5 0.5 – 0.6 – ns 6
Control inputs (R#, W#) valid to K rising
edge
TIVKH 0.4 – 0.5 0.5 – 0.6 – ns 6
Data inputs and write data select TDVKH 0.3 –
0.35 0.35 – 0.4 – ns 6
inputs (BWx#, NWx#) valid to K, K#
rising edge
Hold Times
K rising edge to address hold TKHAX 0.4 – 0.5 0.5 – 0.6 – ns 6
K rising edge to control inputs (R#, W#)
hold
TKHIX 0.4 – 0.5 0.5 – 0.6 – ns 6
K, K# rising edge to data inputs and TKHDX 0.3 –
0.35 0.35 – 0.4 – ns 6
write data select inputs (BWx#, NWx#)
hold
22 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Notes 1. When debugging the system or board, these products can operate at a clock frequency slower than TKHKH
(MAX.) without the DLL/PLL circuit being used, if DLL# = LOW. Read latency (RL) is changed to 1.5 clock in
this operation. The AC/DC characteristics cannot be guaranteed, however.
2. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge. TKC var
(MAX.) indicates a peak-to-peak value.
3. V
DD slew rate must be less than 0.1 V DC per 50 ns for DLL/PLL lock retention.
DLL/PLL lock time begins once VDD and input clock are stable.
It is recommended that the device is kept NOP (R# = W# = HIGH) during these cycles.
4. K input is monitored for this operation. See below for the timing.
K
K
TKC reset
or
TKC reset
5. Echo clock is very tightly controlled to data valid / data hold. By design, there is a ± 0.1 ns variation from
echo clock to data. The data sheet parameters reflect tester guardbands and test setup variations.
6. This is a synchronous device. All addresses, data and control lines must meet the specified setup
and hold times for all latching clock edges.
Remarks 1. This parameter is sampled.
2. Test conditions as specified with the output loading as shown in AC Test Conditions
unless otherwise noted.
3. Control input signals may not be operated with pulse widths less than TKHKL (MIN.).
4. If C, C# are tied HIGH, K, K# become the references for C, C# timing parameters.
5. VDDQ is 1.5 V DC.
23 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Read and Write Timing
K
Address
Data in
K#
24613 5 7
TKHK#H TK#HKH
C
C#
TKHCH
NOP READ READ
TKHKL TKLKH
Q00 Q02
Data out
Q01 Q03
R#
W#
TKHKL TKLKH
TCHQX1 TCHQX TCHQZ
D10 D12D11 D13
TDVKH TKHDX
TDVKH TKHDX
TKHKH
TIVKH TKHIX
TAVKH TKHAX
CQ
CQ#
TCHQV
TCHCQX
TCHCQV
TCHCQX
TCHCQV
WRITE NOP
Qx3
TCHQX
TCHQV
WRITE
TIVKH TKHIX
A0 A1 A2 A3
D30 D32D31 D33
Q20 Q22Q21 Q23
Qx2
TKHK#H TK#HKH
TKHCH
TKHKH
TCQHQV
TCQHQX
Remarks 1. Q00 refers to output from address A0+0.
Q01 refers to output from the next internal burst address following A0,i.e.,A0+1.
2. Outputs are disabled (high impedance) 3.5 clocks after the last READ (R# = LOW) is input in the
sequences of [READ]-[NOP]-[NOP], [READ]-[WRITE]-[NOP] and [READ]-[NOP]-[WRITE].
3. In this example, if address A2 = A1, data Q20 = D10, Q21 = D11, Q22 = D12 and Q23 = D13.
Write data is forwarded immediately as read results.
24 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Application Example
SRAM
Controller
Data In
Data Out
Address
R#
W#
BW#
SRAM#1 CQ/CQ#
SRAM#4 CQ/CQ#
Source CLK/CLK#
Return CLK/CLK#
ZQ
Q
CQ#
CQ
SRAM#4
D
A R# W# BWx# C/C# K/K#
R
RVt
Vt
RVt
RVt
RVt
RVt
R =
250 ΩR =
250 Ω
ZQ
Q
CQ#
CQ
SRAM#1
D
A R# W# BWx# C/C# K/K#
R = 50 Ω Vt = Vref
. . .
. . .
Remark AC specifications are defined at the condition of SRAM outputs, CQ, CQ# and Q with termination.
25 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
JTAG Specification
These products support a limited set of JTAG functions as in IEEE standard 1149.1.
Test Access Port (TAP) Pins
Pin name Pin assignments Description
TCK 2R Test Clock Input. All input are captured on the rising edge of TCK and all outputs
propagate from the falling edge of TCK.
TMS 10R Test Mode Select. This is the command input for the TAP controller state machine.
TDI 11R Test Data Input. This is the input side of the serial registers placed between TDI and
TDO. The register placed between TDI and TDO is determined by the state of the TAP
controller state machine and the instruction that is currently loaded in the TAP instruction.
TDO 1R Test Data Output. This is the output side of the serial registers placed between TDI and
TDO. Output changes in response to the falling edge of TCK.
Remark The device does not have TRST (TAP reset). The Test-Logic Reset state is entered while TMS is held HIGH
for five rising edges of TCK. The TAP controller state is also reset on the SRAM POWER-UP.
JTAG DC Characteristics (VDD = 1.8 ± 0.1 V, unless otherwise noted)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
JTAG Input leakage current ILI 0 V VIN VDD –5.0 +5.0
μ
A
JTAG I/O leakage current ILO 0 V VIN VDDQ , –5.0 +5.0
μ
A
Outputs disabled
JTAG input HIGH voltage VIH 1.3 VDD+0.3 V
JTAG input LOW voltage VIL –0.3 +0.5 V
JTAG output HIGH voltage VOH1 | IOHC | = 100
μ
A 1.6 V
VOH2 | IOHT | = 2 mA 1.4 V
JTAG output LOW voltage VOL1 IOLC = 100
μ
A – 0.2 V
VOL2 IOLT = 2 mA 0.4 V
26 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
JTAG AC Test Conditions
Input waveform (Rise / Fall time 1 ns)
0.9 V 0.9 V
Test Points
1.8 V
0 V
Output waveform
0.9 V 0.9 V
Test Points
Output load
Figure 2. External load at test
TDO Z
O
= 50 Ω
V
TT
= 0.9 V
20 pF
50 Ω
27 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
JTAG AC Characteristics
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Clock
Clock cycle time tTHTH 50 ns
Clock frequency fTF 20 MHz
Clock HIGH time tTHTL 20 ns
Clock LOW time tTLTH 20 ns
Output time
TCK LOW to TDO unknown tTLOX 0 – – ns
TCK LOW to TDO valid tTLOV 10 ns
Setup time
TMS setup time tMVTH 5 – – ns
TDI valid to TCK HIGH tDVTH 5 – – ns
Capture setup time tCS 5 – – ns
Hold time
TMS hold time tTHMX 5 – – ns
TCK HIGH to TDI invalid tTHDX 5 – – ns
Capture hold time tCH 5 – – ns
JTAG Timing Diagram
t
THTH
t
TLOV
t
TLTH
t
THTL
t
MVTH
t
THDX
t
DVTH
t
THMX
TCK
TMS
TDI
TDO
t
TLOX
28 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Scan Register Definition (1)
Register name Description
Instruction register The instruction register holds the instructions that are executed by the TAP controller when it is
moved into the run-test/idle or the various data register state. The register can be loaded when it is
placed between the TDI and TDO pins. The instruction register is automatically preloaded with the
IDCODE instruction at power-up whenever the controller is placed in test-logic-reset state.
Bypass register The bypass register is a single bit register that can be placed between TDI and TDO. It allows serial
test data to be passed through the RAMs TAP to another device in the scan chain with as little delay
as possible.
ID register The ID Register is a 32 bit register that is loaded with a device and vendor specific 32 bit code when
the controller is put in capture-DR state with the IDCODE command loaded in the instruction register.
The register is then placed between the TDI and TDO pins when the controller is moved into shift-DR
state.
Boundary register The boundary register, under the control of the TAP controller, is loaded with the contents of the
RAMs I/O ring when the controller is in capture-DR state and then is placed between the TDI and
TDO pins when the controller is moved to shift-DR state. Several TAP instructions can be used to
activate the boundary register.
The Scan Exit Order tables describe which device bump connects to each boundary register
location. The first column defines the bit’s position in the boundary register. The second column is
the name of the input or I/O at the bump and the third column is the bump number.
Scan Register Definition (2)
Register name Bit size Unit
Instruction register 3 bit
Bypass register 1 bit
ID register 32 bit
Boundary register 107 bit
ID Register Definition
Part number Organization ID [31:28] vendor revision no. ID [27:12] part no. ID [11:1] vendor ID no. ID [0] fix bit
μ
PD44165084A-A 2M x 8 XXXX 0000 0000 0000 1111 00000010000 1
μ
PD44165094A-A 2M x 9 XXXX 0000 0000 0101 0010 00000010000 1
μ
PD44165184A-A 1M x 18 XXXX 0000 0000 0001 0000 00000010000 1
μ
PD44165364A-A 512K x 36 XXXX 0000 0000 0001 0001 00000010000 1
29 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
SCAN Exit Order
Bit Signal name Bump Bit Signal name Bump Bit Signal name Bump
no. x8 x9 x18 x36 ID no. x8 x9 x18 x36 ID no. x8 x9 x18 x36 ID
1 C# 6R 37 NC NC NC D15 10D 73 NC NC NC Q28 2C
2 C 6P 38 NC NC NC Q15 9E 74 Q4 Q5 Q11 Q20 3E
3 A 6N 39 NC NC Q7 Q7 10C 75 D4 D5 D11 D20 2D
4 A 7P 40 NC NC D7 D7 11D 76 NC NC NC D29 2E
5 A 7N 41 NC NC NC D16 9C 77 NC NC NC Q29 1E
6 A 7R 42 NC NC NC Q16 9D 78 NC NC Q12 Q21 2F
7 A 8R 43 Q3 Q4 Q8 Q8 11B 79 NC NC D12 D21 3F
8 A 8P 44 D3 D4 D8 D8 11C 80 NC NC NC D30 1G
9 A 9R 45 NC NC NC D17 9B 81 NC NC NC Q30 1F
10 NC Q0 Q0 Q0 11P 46 NC NC NC Q17 10B 82 Q5 Q6 Q13 Q22 3G
11 NC D0 D0 D0 10P 47 CQ 11A 83 D5 D6 D13 D22 2G
12 NC NC NC D9 10N 48 Internal 84 NC NC NC D31 1J
13 NC NC NC Q9 9P 49 A A A NC 9A 85 NC NC NC Q31 2J
14 NC NC Q1 Q1 10M 50 A 8B 86 NC NC Q14 Q23 3K
15 NC NC D1 D1 11N 51 A 7C 87 NC NC D14 D23 3J
16 NC NC NC D10 9M 52 NC 6C 88 NC NC NC D32 2K
17 NC NC NC Q10 9N 53 R# 8A 89 NC NC NC Q32 1K
18 Q0 Q1 Q2 Q2 11L 54 NC NC NC BW1# 7A 90 Q6 Q7 Q15 Q24 2L
19 D0 D1 D2 D2 11M 55 NW0# BW0# BW0# BW0# 7B 91 D6 D7 D15 D24 3L
20 NC NC NC D11 9L 56 K 6B 92 NC NC NC D33 1M
21 NC NC NC Q11 10L 57 K# 6A 93 NC NC NC Q33 1L
22 NC NC Q3 Q3 11K 58 NC NC NC BW3# 5B 94 NC NC Q16 Q25 3N
23 NC NC D3 D3 10K 59 NW1# NC BW1# BW2# 5A 95 NC NC D16 D25 3M
24 NC NC NC D12 9J 60 W# 4A 96 NC NC NC D34 1N
25 NC NC NC Q12 9K 61 A 5C 97 NC NC NC Q34 2M
26 Q1 Q2 Q4 Q4 10J 62 A 4B 98 Q7 Q8 Q17 Q26 3P
27 D1 D2 D4 D4 11J 63 A A NC NC 3A 99 D7 D8 D17 D26 2N
28 ZQ 11H 64 DLL# 1H 100 NC NC NC D35 2P
29 NC NC NC D13 10G 65 CQ# 1A 101 NC NC NC Q35 1P
30 NC NC NC Q13 9G 66 NC NC Q9 Q18 2B 102 A 3R
31 NC NC Q5 Q5 11F 67 NC NC D9 D18 3B 103 A 4R
32 NC NC D5 D5 11G 68 NC NC NC D27 1C 104 A 4P
33 NC NC NC D14 9F 69 NC NC NC Q27 1B 105 A 5P
34 NC NC NC Q14 10F 70 NC NC Q10 Q19 3D 106 A 5N
35 Q2 Q3 Q6 Q6 11E 71 NC NC D10 D19 3C 107 A 5R
36 D2 D3 D6 D6 10E 72 NC NC NC D28 1D
30 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
JTAG Instructions
Instructions Description
EXTEST The EXTEST instruction allows circuitry external to the component package to be tested. Boundary-
scan register cells at output pins are used to apply test vectors, while those at input pins capture test
results. Typically, the first test vector to be applied using the EXTEST instruction will be shifted into the
boundary scan register using the PRELOAD instruction. Thus, during the update-IR state of EXTEST,
the output drive is turned on and the PRELOAD data is driven onto the output pins.
IDCODE The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in
capture-DR mode and places the ID register between the TDI and TDO pins in shift-DR mode. The
IDCODE instruction is the default instruction loaded in at power up and any time the controller is
placed in the test-logic-reset state.
BYPASS When the BYPASS instruction is loaded in the instruction register, the bypass register is placed
between TDI and TDO. This occurs when the TAP controller is moved to the shift-DR state. This
allows the board level scan path to be shortened to facilitate testing of other devices in the scan path.
SAMPLE / PRELOAD SAMPLE / PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE /
PRELOAD instruction is loaded in the instruction register, moving the TAP controller into the capture-
DR state loads the data in the RAMs input and Q pins into the boundary scan register. Because the
RAM clock(s) are independent from the TAP clock (TCK) it is possible for the TAP to attempt to
capture the I/O ring contents while the input buffers are in transition (i.e., in a metastable state).
Although allowing the TAP to sample metastable input will not harm the device, repeatable results
cannot be expected. RAM input signals must be stabilized for long enough to meet the TAPs input
data capture setup plus hold time (tCS plus tCH). The RAMs clock inputs need not be paused for any
other TAP operation except capturing the I/O ring contents into the boundary scan register. Moving
the controller to shift-DR state then places the boundary scan register between the TDI and TDO pins.
SAMPLE-Z If the SAMPLE-Z instruction is loaded in the instruction register, all RAM Q pins are forced to an
inactive drive state (high impedance) and the boundary register is connected between TDI and TDO
when the TAP controller is moved to the shift-DR state.
JTAG Instruction Coding
IR2 IR1 IR0 Instruction Note
0 0 0 EXTEST
0 0 1 IDCODE
0 1 0 SAMPLE-Z 1
0 1 1 RESERVED 2
1 0 0 SAMPLE / PRELOAD
1 0 1 RESERVED 2
1 1 0 RESERVED 2
1 1 1 BYPASS
Notes 1. TRISTATE all Q pins and CAPTURE the pad values into a SERIAL SCAN LATCH.
2. Do not use this instruction code because the vendor uses it to evaluate this product.
31 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Output Pin States of CQ, CQ# and Q
Instructions Control-Register Status Output Pin Status
CQ, CQ# Q
EXTEST 0 Update High-Z
1 Update Update
IDCODE 0 SRAM SRAM
1 SRAM SRAM
SAMPLE-Z 0 High-Z High-Z
1 High-Z High-Z
SAMPLE 0 SRAM SRAM
1 SRAM SRAM
BYPASS 0 SRAM SRAM
1 SRAM SRAM
Remark The output pin statuses during each instruction vary according
to the Control-Register status (value of Boundary Scan
Register, bit no. 48).
There are three statuses:
Update : Contents of the “Update Register” are output to
the output pin (QDR Pad).
SRAM : Contents of the SRAM internal output “SRAM
Output” are output to the output pin (QDR Pad).
High-Z : The output pin (QDR Pad) becomes high
impedance by controlling of the “High-Z JTAG ctrl”.
The Control-Register status is set during Update-DR at the
EXTEST or SAMPLE instruction.
SRAM
CAPTURE
Register
Boundary Scan
Register
Update
Register
QDR
Pad
SRAM
Output
Driver
High-Z
JTAG ctrl
High-Z
Update
SRAM
Output
32 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Boundary Scan Register Status of Output Pins CQ, CQ# and Q
Instructions SRAM Status Boundary Scan Register Status Note
CQ, CQ# Q
EXTEST READ (Low-Z) Pad Pad
NOP (High-Z) Pad Pad
IDCODE READ (Low-Z) No definition
NOP (High-Z)
SAMPLE-Z READ (Low-Z) Pad Pad
NOP (High-Z) Pad Pad
SAMPLE READ (Low-Z) Internal Internal
NOP (High-Z) Internal Pad
BYPASS READ (Low-Z) No definition
NOP (High-Z)
Remark The Boundary Scan Register statuses during execution each
instruction vary according to the instruction code and SRAM
operation mode.
There are two statuses:
Pad : Contents of the output pin (QDR Pad) are captured
in the “CAPTURE Register” in the Boundary Scan
Register.
Internal : Contents of the SRAM internal output “SRAM
Output” are captured in the “CAPTURE Register”
in the Boundary Scan Register.
Pad
Internal
SRAM
Output
Driver
Update
Register
QDR
Pad
High-Z
JTAG ctrl
CAPTURE
Register
SRAM
Output
Boundary Scan
Register
33 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
TAP Controller State Diagram
Test-Logic-Reset
Run-Test / Idle Select-DR-Scan
Capture-DR Capture-IR
Shift-DR
Exit1-DR
Pause-DR
Exit2-DR
Update-DR Update-IR
Exit2-IR
Pause-IR
Exit1-IR
Shift-IR
Select-IR-Scan
0
0
0
1
0
1
1
0
0
1
0
1
1
0
0
0
0
10 10
11 1
0
1
1
0
1
0
11
Disabling the Test Access Port
It is possible to use this device without utilizing the TAP. To disable the TAP Controller without interfering with normal
operation of the device, TCK must be tied to VSS to preclude mid level inputs. TDI and TMS may be left open but fix
them to VDD via a resistor of about 1 kΩ when the TAP controller is not used. TDO should be left unconnected also
when the TAP controller is not used.
34 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Test Logic Operation (Instruction Scan)
TCK
Controller
state
TDI
TMS
TDO
Test-Logic-Reset
Run-Test/Idle
Select-DR-Scan
Select-IR-Scan
Capture-IR
Shift-IR
Exit1-IR
Pause-IR
Exit2-IR
Shift-IR
Exit1-IR
Update-IR
Run-Test/Idle
IDCODE
Instruction
Register state New Instruction
Output Inactive
35 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Test Logic (Data Scan)
Controller
state
TDI
TMS
TDO
Run-Test/Idle
Select-DR-Scan
Capture-DR
Shift-DR
Exit1-DR
Pause-DR
Exit2-DR
Shift-DR
Exit1-DR
Update-DR
Test-Logic-Reset
Instruction
Instruction
Register state IDCODE
Run-Test/Idle
Select-DR-Scan
Select-IR-Scan
Output Inactive
TCK
36 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Package Drawing
165-PIN PLASTIC BGA (13x15)
ITEM DIMENSIONS
D
E
w
e
A
A1
A2
13.00±0.10
15.00±0.10
0.15
0.40±0.05
1.00
1.40±0.11
1.00
0.50±0.05
(UNIT:mm)
0.08
0.10
0.20
1.50
0.50
P165F5-100-EQ2
x
y
y1
ZD
ZE
b
A
11
10
9
8
7
6
5
4
3
2
1
INDEX MARK
ZE
ZD B
SwB
E
SwA
D
S
y
S
A
A2
A1
e
y1 S
SxbA
B
M
φφ
RPNMLKJHGFEDCBA
37 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
Recommended Soldering Condition
Please consult with our sales offices for soldering conditions of these products.
Types of Surface Mount Devices
μ
PD44165084AF5-EQ2-A : 165-pin PLASTIC BGA (13 x 15)
μ
PD44165094AF5-EQ2-A : 165-pin PLASTIC BGA (13 x 15)
μ
PD44165184AF5-EQ2-A : 165-pin PLASTIC BGA (13 x 15)
μ
PD44165364AF5-EQ2-A : 165-pin PLASTIC BGA (13 x 15)
Quality Grade
A quality grade of the products is “Standard”.
Anti-radioactive design is not implemented in the products.
Semiconductor devices have the possibility of unexpected defects by affection of cosmic ray that reach to the
ground and so forth.
38 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
[ MEMO ]
39 Data Sheet M19870EJ1V0DS
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
1
2
3
4
VOLTAGE APPLICATION WAVEFORM AT INPUT PIN
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the
CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may
malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed,
and also in the transition period when the input level passes through the area between VIL (MAX) and
VIH (MIN).
HANDLING OF UNUSED INPUT PINS
Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is
possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS
devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND
via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must
be judged separately for each device and according to related specifications governing the device.
PRECAUTION AGAINST ESD
A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as
much as possible, and quickly dissipate it when it has occurred. Environmental control must be
adequate. When it is dr y, a humidifier should be used. It is recommended to avoid using insulators that
easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static
container, static shielding bag or conductive material. All test and measurement tools including work
benches and floors should be grounded. The operator should be grounded using a wrist strap.
Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for
PW boards with mounted semiconductor devices.
STATUS BEFORE INITIALIZATION
Power-on does not necessarily define the initial status of a MOS device. Immediately after the power
source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does
not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the
reset signal is received. A reset operation must be executed immediately after power-on for devices
with reset functions.
POWER ON/OFF SEQUENCE
In the case of a device that uses different power supplies for the internal operation and external
interface, as a rule, switch on the external power supply after switching on the internal power supply.
When switching the power supply off, as a rule, switch off the external power supply and then the
internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal
elements due to the passage of an abnormal current.
The correct power on/off sequence must be judged separately for each device and according to related
specifications governing the device.
INPUT OF SIGNAL DURING POWER OFF STATE
Do not input signals or an I/O pull-up power supply while the device is not powered. The current
injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and
the abnormal current that passes in the device at this time may cause degradation of internal elements.
Input of signals during the power off state must be judged separately for each device and according to
related specifications governing the device.
NOTES FOR CMOS DEVICES
5
6
μ
PD44165084A-A, 44165094A-A, 44165184A-A, 44165364A-A
QDR RAMs and Quad Data Rate RAMs comprise a new series of products developed by Cypress Semiconductor,
Renesas, IDT, NEC Electronics, and Samsung.
The information in this document is current as of July, 2009. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets,
etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or
types are available in every country. Please check with an NEC Electronics sales representative for
availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While NEC Electronics endeavors to enhance the quality and safety of NEC Electronics products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC
Electronics products are not taken measures to prevent radioactive rays in the product design. When customers
use NEC Electronics products with their products, customers shall, on their own responsibility, incorporate
sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in
order to avoid risks of the damages to property (including public or social property) or injury (including death) to
persons, as the result of defects of NEC Electronics products.
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a
customer-designated "quality assurance program" for a specific application. The recommended applications
of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the
quality grade of each NEC Electronics product before using it in a particular application.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
M8E0904E
(1)
(2)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
"Standard":
"Special":
"Specific":