CY74FCT257T QUAD 2-INPUT MULTIPLEXER WITH 3-STATE OUTPUTS SCCS019D - MAY 1994 - REVISED NOVEMBER 2001 D D D D D D D D D Q OR SO PACKAGE (TOP VIEW) Function, Pinout, and Drive Compatible With FCT and F Logic Reduced VOH (Typically = 3.3 V) Version of Equivalent FCT Functions Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics Ioff Supports Partial-Power-Down Mode Operation Matched Rise and Fall Times Fully Compatible With TTL Input and Output Logic Levels ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) - 1000-V Charged-Device Model (C101) 64-mA Output Sink Current 32-mA Output Source Current 3-State Outputs S I0a I1a Ya I0b I1b Yb GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC OE I0c I1c Yc I0d I1d Yd description The CY74FCT257T has four identical two-input multiplexers that select four bits of data from two sources under the control of a common data-select (S) input. The I0 inputs are selected when S is low, and the I1 inputs are selected when S is high. Data at the output is noninverted. The CY74FCT257T is a logic implementation of a four-pole, two-position switch, where the position of the switch is determined by the logic levels at S. Outputs are in the high-impedance state when the output-enable (OE) input is high. All but one device must be in the high-impedance state to avoid currents exceeding the maximum ratings if outputs are tied together. OE inputs must ensure that there is no overlap when outputs of 3-state devices are tied together. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. PIN DESCRIPTION NAME DESCRIPTION I Data inputs S Common data-select input OE Y Output-enable input (active low) Data outputs Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 CY74FCT257T QUAD 2-INPUT MULTIPLEXER WITH 3-STATE OUTPUTS SCCS019D - MAY 1994 - REVISED NOVEMBER 2001 ORDERING INFORMATION SPEED (ns) PACKAGE TA QSOP - Q -40C to 85C SOIC - SO QSOP - Q ORDERABLE PART NUMBER Tape and reel 4.3 CY74FCT257CTQCT Tube 4.3 CY74FCT257CTSOC Tape and reel 4.3 CY74FCT257CTSOCT Tape and reel 5 CY74FCT257ATQCT TOP-SIDE MARKING FT257-3 FCT257C FT257-1 QSOP - Q Tape and reel 6 CY74FCT257TQCT FT257 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS I1 X OUTPUT Y OE S H X I0 X L H X L L L H X H H L L L X L L L H X H Z H = High logic level, L = Low logic level, X = Don't care, Z = High-impedance state logic diagram OE S I0a I1a I0b I1b I0c I1c I0d I1d 2 15 1 2 4 Ya 3 5 7 Yb 6 14 12 Yc 13 11 9 10 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 Yd CY74FCT257T QUAD 2-INPUT MULTIPLEXER WITH 3-STATE OUTPUTS SCCS019D - MAY 1994 - REVISED NOVEMBER 2001 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA Package thermal impedance, JA (see Note 1): Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90C/W SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57C/W Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 135C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 2) MIN NOM MAX UNIT 4.75 5 5.25 V VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 V High-level output current -32 mA IOL TA Low-level output current 64 mA 85 C High-level input voltage 2 Operating free-air temperature -40 V NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 CY74FCT257T QUAD 2-INPUT MULTIPLEXER WITH 3-STATE OUTPUTS SCCS019D - MAY 1994 - REVISED NOVEMBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT -0.7 -1.2 V 0.3 0.55 VIK VOH VCC = 4.75, VCC = 4.75, IIN = -18 mA IOH = -32 mA VOL Vhys VCC = 4.75, All inputs IOL = 64 mA II IIH VCC = 5.25 V, VCC = 5.25 V, VIN = 5.25 V VIN = 2.7 V 5 A 1 A IIL IOZH VCC = 5.25 V, VCC = 5.25 V, VIN = 0.5 V VOUT = 2.7 V 1 A 10 A IOZL IOS VCC = 5.25 V, VCC = 5.25 V, VOUT = 0.5 V VOUT = 0 V -10 A -225 mA Ioff ICC VCC = 0 V, VCC = 5.25 V, 2 V 0.2 -60 -120 V V 1 A 0.1 0.2 mA 0.5 2 mA 0.06 0.12 mA/ MHz 0.7 1.4 1 2.4 0.7 1.4|| 1.7 5.4|| Ci 5 10 Co 9 12 ICC ICCD IC# VOUT = 4.5 V VIN 0.2 V, VIN VCC - 0.2 V VCC = 5.25 V, VIN = 3.4 V , f1 = 0, Outputs open VCC = 5.25 V, One input switching at 50% duty cycle, Outputs open, OE = GND, VIN 0.2 V or VIN VCC - 0.2 V VCC = 5.25 V, Outputs open, open OE = GND One input switching at f1 = 10 MHz at 50% duty cycle Four bits switching at f1 = 2.5 MHz at 50% duty cycle VIN 0.2 V or VIN VCC - 0.2 V VIN = 3.4 V or GND VIN 0.2 V or VIN VCC - 0.2 V VIN = 3.4 V or GND mA pF pF Typical values are at VCC = 5 V, TA = 25C. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND This parameter is derived for use in total power-supply calculations. # IC = ICC + ICC x DH x NT + ICCD(f0/2 + f1 x N1) Where: IC = Total supply current ICC = Power-supply current with CMOS input levels ICC = Power-supply current for a TTL high input (VIN = 3.4 V) DH = Duty cycle for TTL inputs high NT = Number of TTL inputs at DH ICCD = Dynamic current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N1 = Number of inputs changing at f1 All currents are in milliamperes and all frequencies are in megahertz. || Values for these conditions are examples of the ICC formula. 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 CY74FCT257T QUAD 2-INPUT MULTIPLEXER WITH 3-STATE OUTPUTS SCCS019D - MAY 1994 - REVISED NOVEMBER 2001 switching characteristics over operating free-air temperature range (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL I Y tPLH tPHL S Y tPZH tPZL OE Y tPHZ tPLZ OE Y POST OFFICE BOX 655303 CY74FCT257T CY74FCT257AT CY74FCT257CT MIN MAX MIN MAX MIN MAX 1.5 6 1.5 5 1.5 4.3 1.5 6 1.5 5 1.5 4.3 1.5 10.5 1.5 7 1.5 5.2 1.5 10.5 1.5 7 1.5 5.2 1.5 8.5 1.5 7 1.5 6 1.5 8.5 1.5 7 1.5 6 1.5 6 1.5 5.5 1.5 5 1.5 6 1.5 5.5 1.5 5 * DALLAS, TEXAS 75265 UNIT ns ns ns ns 5 CY74FCT257T QUAD 2-INPUT MULTIPLEXER WITH 3-STATE OUTPUTS SCCS019D - MAY 1994 - REVISED NOVEMBER 2001 PARAMETER MEASUREMENT INFORMATION 7V From Output Under Test From Output Under Test Test Point CL = 50 pF (see Note A) Open TEST GND CL = 50 pF (see Note A) 500 S1 500 S1 Open 7V Open tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 500 LOAD CIRCUIT FOR 3-STATE OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw tsu 3V 1.5 V Input 1.5 V th 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output tPLZ 3.5 V 1.5 V tPZH VOH 1.5 V VOL 1.5 V 0V Output Waveform 1 (see Note B) tPLH 1.5 V 1.5 V tPZL VOH In-Phase Output 3V Output Control Output Waveform 2 (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 1.5 V VOH - 0.3 V VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. 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Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 24-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CY74FCT257ATD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257ATDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257ATDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257ATDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257ATDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257ATDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257ATQCT ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT257ATQCTE4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT257ATQCTG4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT257CTD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257CTDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257CTDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257CTDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257CTDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257CTDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257CTQCT ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT257CTQCTE4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT257CTQCTG4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT257CTSOC ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257CTSOCE4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257CTSOCG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257CTSOCT ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257CTSOCTE4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257CTSOCTG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT257TQCT ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 24-May-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CY74FCT257TQCTE4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT257TQCTG4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CY74FCT257ATDR SOIC CY74FCT257CTDR CY74FCT257CTSOCT SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.5 10.3 2.1 8.0 16.0 Q1 D 16 2500 330.0 16.4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CY74FCT257ATDR SOIC D 16 2500 333.2 345.9 28.6 CY74FCT257CTDR SOIC D 16 2500 333.2 345.9 28.6 CY74FCT257CTSOCT SOIC DW 16 2000 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP(R) Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee(R) Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2009, Texas Instruments Incorporated