STPS1H100-Y Datasheet Automotive high voltage power Schottky rectifier Features A A K K SMB SMA * * * * * * AEC-Q101 qualified Negligible switching losses High junction temperature capability Low leakage current Good trade off between leakage current and forward voltage drop Avalanche capability specified * * * ECOPACK(R)2 compliant component PPAP capable VRRM guaranteed from -40C to +175C Description Schottky rectifiers packaged in SMA or SMB, and designed for high frequency miniature switched mode power supplies as DC/DC converters for automotive applications. It is particularly suited for LED lighting applications, ADAS power, and ECU (Engine Control Unit) in automotive environment. Product status STPS1H100-Y Product summary Symbol Value IF(AV) 1A VRRM 100 V T j (range) -40 C to +175 C VF(max.) 0.62 V DS6946 - Rev 2 - April 2018 For further information contact your local STMicroelectronics sales office. www.st.com STPS1H100-Y Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage, Tj = -40 C to +175 C 100 V IF(RMS) Forward rms current 10 A 1 A SMA TL = 150 C SMB TL = 155 C IF(AV) Average forward current, = 0.5 IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 50 A PARM Repetitive peak avalanche power tp = 10 s, Tj = 125 C 108 W -65 to +175 C +175 C Tstg Storage temperature range Tj Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal parameters Symbol Rth(j-l) Parameter Max. value Junction to lead SMA 30 SMB 25 Unit C/W Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Tj = 25 C VF(2) Forward voltage drop Tj = 125 C Tj = 25 C Tj = 125 C VR = VRRM IF = 1 A IF = 2 A Min. Typ. - 0.2 - Unit 4 A 0.5 mA 0.77 0.58 - Max. 0.62 0.86 0.65 V 0.70 1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses, use the following equation: P = 0.54 x IF(AV) + 0.08 x IF2(RMS) DS6946 - Rev 2 page 2/11 STPS1H100-Y Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature ( = 0.5) IF(AV)(A) 1.2 PF(AV) (W) 0.8 0.7 = 0.1 = 0.05 = 0.2 = 0.5 Rth(j-a)=Rth(j-l) 1.0 Rth(j-a)=120C/W 0.6 SMB Rth(j-a)=100C/W 0.8 = 1 SMA 0.5 Rth(j-a)=200C/W 0.6 0.4 0.3 0.4 T 0.2 T 0.1 IF(AV) (A) 0.2 tp =tp/T =tp/T 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0 Figure 3. Normalized avalanche power derating versus junction temperature (Tj = 125 C) 1 Tamb (C) tp 0.0 25 50 75 100 125 150 175 Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) Zth(j-a)/ Rth(j-a) PARM (t p ) PARM (10 s) 1.00 SMA 0.1 0.10 0.01 Single pulse t p (s) t p(s) 0.01 0.001 1 10 100 1000 Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) 1.E-03 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 6. Reverse leakage current versus reverse voltage applied (typical values) Zth(j-a)/ Rth(j-a) 1.E+03 1.00 1.E-02 IR(A) SMB 1.E+02 Tj=125 C 1.E+01 0.10 1.E+00 1.E-01 Single pulse Tj=25 C 1.E-02 t p (s) VR(V) 0.01 1.E-03 DS6946 - Rev 2 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E-03 0 10 20 30 40 50 60 70 80 90 100 page 3/11 STPS1H100-Y Characteristics (curves) Figure 7. Junction capacitance versus reverse voltage applied (typical values) Figure 8. Forward voltage drop versus forward current (maximum values) C(pF) IFM(A) 100 100.00 F=1 MHz VOSC=30 mVRMS Tj=25 C 10.00 Tj=125 C Tj=25 C 1.00 0.10 VR(V) 10 1 10 100 VFM(V) 0.01 0.0 Figure 9. Thermal resistance junction to ambient versus copper surface under each lead (SMB) 200 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (SMA) Rth(j-a) (C/W) Rth(j-a) (C/W) Epoxy printed ci rcui t board FR4, coppe r t hi ckness: 35 m 200 SMB Epoxy printed circuit board FR4, copper thickness: 35 m SMA 150 150 100 100 50 50 S(Cu)(cm) S(Cu)(cm) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 0.0 DS6946 - Rev 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/11 STPS1H100-Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 2.1 SMB package information * * Epoxy meets UL94, V0 Lead-free package Figure 11. SMB package outline E1 D E A1 C A2 L DS6946 - Rev 2 b page 5/11 STPS1H100-Y SMB package information Table 4. SMB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 1.95 2.20 0.0768 0.0867 c 0.15 0.40 0.0059 0.0157 D 3.30 3.95 0.1299 0.1556 E 5.10 5.60 0.2008 0.2205 E1 4.05 4.60 0.1594 0.1811 L 0.75 1.50 0.0295 0.0591 Figure 12. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS6946 - Rev 2 page 6/11 STPS1H100-Y SMA package information 2.2 SMA package information * * Epoxy meets UL94, V0 Lead-free package Figure 13. SMA package outline E1 D E A1 C L A2 b Table 5. SMA package mechanical data Dimensions Millimeters Ref. DS6946 - Rev 2 Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.097 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 page 7/11 STPS1H100-Y SMA package information Figure 14. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.103) (0.055) 1.64 (0.064) 5.43 (0.214) DS6946 - Rev 2 page 8/11 STPS1H100-Y Ordering Information 3 Ordering Information Table 6. Ordering information DS6946 - Rev 2 Order code Marking Package Weight Base qty. STPS1H100AY S11Y SMA 0.068 g 5000 STPS1H100UY G11Y SMB 0.107 2500 Delivery mode Tape and reel page 9/11 STPS1H100-Y Revision history Table 7. Document revision history DS6946 - Rev 2 Date Version Changes 3-Dec-2010 1 Initial release. 10-Apr-2018 2 Update Figure 3 "Normalized avalanche power derating versus pulse duration" with PARM 10 s curve. page 10/11 STPS1H100-Y IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2018 STMicroelectronics - All rights reserved DS6946 - Rev 2 page 11/11