SMA SMB
K
A
K
A
Features
AEC-Q101 qualified
Negligible switching losses
High junction temperature capability
Low leakage current
Good trade off between leakage current and forward voltage drop
Avalanche capability specified
ECOPACK®2 compliant component
PPAP capable
VRRM guaranteed from -40°C to +175°C
Description
Schottky rectifiers packaged in SMA or SMB, and designed for high frequency
miniature switched mode power supplies as DC/DC converters for automotive
applications. It is particularly suited for LED lighting applications, ADAS power, and
ECU (Engine Control Unit) in automotive environment.
Product status
STPS1H100-Y
Product summary
Symbol Value
IF(AV) 1 A
VRRM 100 V
T j (range) -40 °C to +175 °C
VF(max.) 0.62 V
Automotive high voltage power Schottky rectifier
STPS1H100-Y
Datasheet
DS6946 - Rev 2 - April 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage, Tj = -40 °C to +175 °C 100 V
IF(RMS) Forward rms current 10 A
IF(AV) Average forward current, δ = 0.5
SMA TL = 150 °C
1 A
SMB TL = 155 °C
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 50 A
PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 108 W
Tstg Storage temperature range -65 to +175 °C
TjMaximum operating junction temperature(1) +175 °C
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal parameters
Symbol Parameter Max. value Unit
Rth(j-l) Junction to lead
SMA 30
°C/W
SMB 25
Table 3. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1) Reverse leakage current
Tj = 25 °C
VR = VRRM
- 4 µA
Tj = 125 °C - 0.2 0.5 mA
VF(2) Forward voltage drop
Tj = 25 °C
IF = 1 A
- 0.77
V
Tj = 125 °C - 0.58 0.62
Tj = 25 °C
IF = 2 A
- 0.86
Tj = 125 °C - 0.65 0.70
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.54 x IF(AV) + 0.08 x IF2(RMS)
STPS1H100-Y
Characteristics
DS6946 - Rev 2 page 2/11
1.1 Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
P (W)
F(AV)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
T
=tp/T tp
I (A)
F(AV)
= 1
= 0.1
= 0.05
= 0.5
= 0.2
δ
δ
δδδ
δ
Figure 2. Average forward current versus ambient
temperature (δ = 0.5)
I (A)
F(AV)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 25 5 0 75 100 125 150 175
Rth(j-a)=Rth(j-l)
T
δ=tp/T tp
Rth(j-a)=100°C/W
Rth(j-a)=120°C/W
SMA
SMB
Rth(j-a)=200°C/W
T (°C)
amb
Figure 3. Normalized avalanche power derating versus
junction temperature (Tj = 125 °C)
P (tp)
P (10 µs)
ARM
ARM
0.001
0.01
0.1
1
1 10 100 1000
t (µs)
p
Figure 4. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA)
Z / R
th(j-a) th(j-a)
0.01
0.10
1.00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
SMA
t (s)
p
Figure 5. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMB)
Z / R
th(j-a) th(j-a)
0.01
0.10
1.00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
SMB
t (s)
p
Figure 6. Reverse leakage current versus reverse voltage
applied (typical values)
I (µA)
R
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
0 1 0 20 30 40 50 60 70 80 90 100
Tj=125 °C
Tj=25 °C
V (V)
R
STPS1H100-Y
Characteristics (curves)
DS6946 - Rev 2 page 3/11
Figure 7. Junction capacitance versus reverse voltage
applied (typical values)
C(pF)
10
100
1 1 0 100
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
V (V)
R
Figure 8. Forward voltage drop versus forward current
(maximum values)
I (A)
FM
0.01
0.10
1.00
10.00
100.00
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Tj=25 °C
Tj=125 °C
V (V)
FM
Figure 9. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
SMB
S(Cu)(cm²)
Epoxy printed ci rc uit boa rd FR4, coppe r t hi ckn ess: 35 µm
Figure 10. Thermal resistance junction to ambient versus
copper surface under each lead (SMA)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
SMA
S(Cu)(cm²)
Epoxy printed circuit board FR4, copper thickness: 35 µm
STPS1H100-Y
Characteristics (curves)
DS6946 - Rev 2 page 4/11
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1 SMB package information
Epoxy meets UL94, V0
Lead-free package
Figure 11. SMB package outline
E1
E
D
C
L
A1
A2
b
STPS1H100-Y
Package information
DS6946 - Rev 2 page 5/11
Table 4. SMB package mechanical data
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.0748 0.0965
A2 0.05 0.20 0.0020 0.0079
b 1.95 2.20 0.0768 0.0867
c 0.15 0.40 0.0059 0.0157
D 3.30 3.95 0.1299 0.1556
E 5.10 5.60 0.2008 0.2205
E1 4.05 4.60 0.1594 0.1811
L 0.75 1.50 0.0295 0.0591
Figure 12. SMB recommended footprint
2.60
(0.102)
5.84
(0.230)
1.62
2.18
(0.086)
1.62
)640.0()460.0(
STPS1H100-Y
SMB package information
DS6946 - Rev 2 page 6/11
2.2 SMA package information
Epoxy meets UL94, V0
Lead-free package
Figure 13. SMA package outline
E
CL
E1
D
A1
A2
b
Table 5. SMA package mechanical data
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.097
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
STPS1H100-Y
SMA package information
DS6946 - Rev 2 page 7/11
Figure 14. SMA recommended footprint in mm (inches)
2.63
(0.103)
5.43
(0.214)
1.4
1.64
(0.064)
1.4
)550.0()550.0(
STPS1H100-Y
SMA package information
DS6946 - Rev 2 page 8/11
3Ordering Information
Table 6. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
STPS1H100AY S11Y SMA 0.068 g 5000
Tape and reel
STPS1H100UY G11Y SMB 0.107 2500
STPS1H100-Y
Ordering Information
DS6946 - Rev 2 page 9/11
Revision history
Table 7. Document revision history
Date Version Changes
3-Dec-2010 1 Initial release.
10-Apr-2018 2 Update Figure 3 "Normalized avalanche power derating versus pulse duration" with PARM 10 µs
curve.
STPS1H100-Y
DS6946 - Rev 2 page 10/11
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STPS1H100-Y
DS6946 - Rev 2 page 11/11