AD7984BCPZ - Analog Devices

18-Bit, 1.33 MSPS PulSAR 10.5 mW

ADC in MSOP/QFN

AD7984

Rev. 0

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

rights of third parties that may result from its use. Specifications subject to change without notice. No

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Tel: 781.329.4700 www.analog.com

FEATURES

18-bit resolution with no missing codes

Throughput: 1.33 MSPS

Low power dissipation: 10.5 mW at 1.33 MSPS

INL: ±2.25 LSB maximum

Dynamic range: 99.7 dB typical

True differential analog input range: ±VREF

0 V to VREF with VREF between 2.9 V to 5.0 V

Allows use of any input range

Easy to drive with the ADA4941

No pipeline delay

Single-supply 2.5 V operation with 1.8 V/2.5 V/3 V/5 V logic

interface

Serial interface SPI-/QSPI™-/MICROWIRE™-/DSP-compatible

Ability to daisy-chain multiple ADCs and busy indicator

10-lead MSOP (MSOP-8 size) and 10-lead 3 mm × 3 mm QFN

(LFCSP), SOT-23 size

APPLICATIONS

Battery-powered equipment

Data acquisition systems

Medical instruments

Seismic data acquisition systems

APPLICATION DIAGRAM

AD7984

REF

GND

VDD

IN+

IN–

VIO

SDI

SCK

SDO

CNV

1.8V TO 5V

ADA4941

3- OR 4-WIRE

INTERFACE

(SPI, CS

DAISY CHAIN)

2.9V TO 5

2.5

10V, ±5V, ..

06973-001

Figure 1.

GENERAL DESCRIPTION

The AD7984 is an 18-bit, successive approximation, analog-to-

digital converter (ADC) that operates from a single power

supply, VDD. It contains a low power, high speed, 18-bit

sampling ADC and a versatile serial interface port. On the CNV

rising edge, the AD7984 samples the voltage difference between

the IN+ and IN− pins. The voltages on these pins usually swing

in opposite phases between 0 V and VREF. The reference voltage,

REF, is applied externally and can be set independent of the

supply voltage, VDD.

The SPI-compatible serial interface also features the ability,

using the SDI input, to daisy-chain several ADCs on a single

3-wire bus and provides an optional busy indicator. It is compatible

with 1.8 V, 2.5 V, 3 V, and 5 V logic, using the separate VIO supply.

The AD7984 is available in a 10-lead MSOP or a 10-lead QFN

(LFCSP) with operation specified from −40°C to +85°C.

Table 1. MSOP, QFN (LFCSP) 14-/16-/18-Bit PulSAR® ADC

Type 100 kSPS 250 kSPS 400 kSPS to 500 kSPS ≥1000 kSPS ADC Driver

14-Bit AD7940 AD79421AD79461

16-Bit AD7680 AD76851AD76861AD79801ADA4941-x

AD7683 AD76871AD76881AD79831ADA4841-x

AD7684 AD7694 AD76931

18-Bit AD76911AD76901AD79821ADA4941-x

AD79841ADA4841-x

1 Pin-for-pin compatible.

AD7984

Rev. 0 | Page 2 of 24

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications....................................................................................... 1

Application Diagram........................................................................ 1

General Description......................................................................... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Timing Specifications .................................................................. 5

Absolute Maximum Ratings............................................................ 6

ESD Caution.................................................................................. 6

Pin Configurations and Function Descriptions........................... 7

Typical Performance Characteristics ............................................. 8

Terminology .................................................................................... 11

Theory of Operation ...................................................................... 12

Circuit Information.................................................................... 12

Converter Operation.................................................................. 12

Typical Connection Diagram ................................................... 13

Analog Inputs.............................................................................. 14

Driver Amplifier Choice ........................................................... 14

Single-to-Differential Driver .................................................... 15

Voltage Reference Input ............................................................ 15

Power Supply............................................................................... 15

Digital Interface.......................................................................... 16

CS Mode, 3-Wire Without Busy Indicator ............................. 17

CS Mode, 3-Wire with Busy Indicator .................................... 18

CS Mode, 4-Wire Without Busy Indicator ............................. 19

CS Mode, 4-Wire with Busy Indicator .................................... 20

Chain Mode Without Busy Indicator ...................................... 21

Chain Mode with Busy Indicator............................................. 22

Application Hints ........................................................................... 23

Layout .......................................................................................... 23

Evaluating the AD7984 Performance...................................... 23

Outline Dimensions....................................................................... 24

Ordering Guide .......................................................................... 24

REVISION HISTORY

11/07—Revision 0: Initial Version

AD7984

Rev. 0 | Page 3 of 24

SPECIFICATIONS

VDD = 2.5 V, VIO = 2.3 V to 5.5 V, REF = 5 V, TA = −40°C to +85°C, unless otherwise noted.

Table 2.

Parameter Conditions Min Typ Max Unit

RESOLUTION 18 Bits

ANALOG INPUT

Voltage Range IN+ − IN− −VREF +VREF V

Absolute Input Voltage IN+, IN− −0.1 VREF + 0.1 V

Common-Mode Input Range IN+, IN− VREF × 0.475 VREF × 0.5 VREF × 0.525 V

Analog Input CMRR fIN = 450 kHz 67 dB1

Leakage Current at 25°C Acquisition phase 200 nA

Input Impedance See the Analog Inputs section

ACCURACY

No Missing Codes 18 Bits

Differential Linearity Error −1 +1.5 LSB2

Integral Linearity Error −2.25 +2.25 LSB2

Transition Noise 0.95 LSB2

Gain Error, TMIN to TMAX3 −0.075 ±0.022 +0.075 % of FS

Gain Error Temperature Drift −0.6 ppm/°C

Zero Error, TMIN to TMAX3 −700 ±100 +700 μV

Zero Temperature Drift 0.3 ppm/°C

Power Supply Sensitivity VDD = 2.5 V ± 5% 90 dB1

THROUGHPUT

Conversion Rate 0 1.33 MSPS

Transient Response Full-scale step 290 ns

AC ACCURACY

Dynamic Range VREF = 5 V 99.7 dB1

Signal-to-Noise, SNR fIN = 1 kHz, VREF = 5 V, TA = 25°C 96.5 98.5 dB1

Spurious-Free Dynamic Range, SFDR fIN = 10 kHz 112.5 dB1

Total Harmonic Distortion4, THD fIN = 10 kHz −110.5 dB1

Signal-to-(Noise + Distortion), SINAD fIN = 10 kHz, VREF = 5 V, TA = 25°C 98 dB1

1 All specifications expressed in decibels are referred to a full-scale input FSR and tested with an input signal at 0.5 dB below full scale, unless otherwise specified.

2 LSB means least significant bit. With the ±5 V input range, one LSB is 38.15 μV.

3 See Terminology section. These specifications include full temperature range variation but not the error contribution from the external reference.

4 Tested fully in production at fIN = 1 kHz.

AD7984

Rev. 0 | Page 4 of 24

VDD = 2.5 V, VIO = 2.3 V to 5.5 V, REF = 5 V, TA = −40°C to +85°C, unless otherwise noted.

Table 3.

Parameter Conditions Min Typ Max Unit

REFERENCE

Voltage Range 2.9 5.1 V

Load Current 1.33 MSPS 520 μA

SAMPLING DYNAMICS

−3 dB Input Bandwidth 10 MHz

Aperture Delay 2 ns

DIGITAL INPUTS

Logic Levels

VIL VIO > 3 V –0.3 +0.3 × VIO V

VIH VIO > 3 V 0.7 × VIO VIO + 0.3 V

VIL VIO ≤ 3 V –0.3 +0.1 × VIO V

VIH VIO ≤ 3 V 0.9 × VIO VIO + 0.3 V

IIL −1 +1 μA

IIH −1 +1 μA

DIGITAL OUTPUTS

Data Format Serial 18 bits, twos complement

Pipeline Delay Conversion results available immediately

after completed conversion

VOL ISINK = +500 μA 0.4 V

VOH ISOURCE = −500 μA VIO − 0.3 V

POWER SUPPLIES

VDD 2.375 2.5 2.625 V

VIO Specified performance 2.3 5.5 V

VIO Range 1.8 5.5 V

Standby Current1, 2VDD and VIO = 2.5 V 1.1 mA

Power Dissipation 1.33 MSPS throughput 10.5 14 mW

Energy per Conversion 7.9 nJ/sample

TEMPERATURE RANGE3

Specified Performance TMIN to TMAX −40 +85 °C

1 With all digital inputs forced to VIO or GND as required.

2 During acquisition phase.

3 Contact an Analog Devices, Inc., sales representative for the extended temperature range.

AD7984

Rev. 0 | Page 5 of 24

TIMING SPECIFICATIONS

TA = −40°C to +85°C, VDD = 2.37 V to 2.63 V, VIO = 2.3 V to 5.5 V, unless otherwise noted.1

Table 4.

Parameter Symbol Min Typ Max Unit

Conversion Time: CNV Rising Edge to Data Available tCONV 300 500 ns

Acquisition Time tACQ 250 ns

Time Between Conversions tCYC 750 ns

CNV Pulse Width (CS Mode) tCNVH 10 ns

SCK Period (CS Mode) tSCK

VIO Above 4.5 V 10.5 ns

VIO Above 3 V 12 ns

VIO Above 2.7 V 13 ns

VIO Above 2.3 V 15 ns

SCK Period (Chain Mode) tSCK

VIO Above 4.5 V 11.5 ns

VIO Above 3 V 13 ns

VIO Above 2.7 V 14 ns

VIO Above 2.3 V 16 ns

SCK Low Time tSCKL 4.5 ns

SCK High Time tSCKH 4.5 ns

SCK Falling Edge to Data Remains Valid tHSDO 3 ns

SCK Falling Edge to Data Valid Delay tDSDO

VIO Above 4.5 V 9.5 ns

VIO Above 3 V 11 ns

VIO Above 2.7 V 12 ns

VIO Above 2.3 V 14 ns

CNV or SDI Low to SDO D15 MSB Valid (CS Mode) tEN

VIO Above 3 V 10 ns

VIO Above 2.3 V 15 ns

CNV or SDI High or Last SCK Falling Edge to SDO High Impedance (CS Mode) tDIS 20 ns

SDI Valid Setup Time from CNV Rising Edge tSSDICNV 5 ns

SDI Valid Hold Time from CNV Rising Edge (CS Mode) tHSDICNV 2 ns

SDI Valid Hold Time from CNV Rising Edge (Chain Mode) tHSDICNV 0 ns

SCK Valid Setup Time from CNV Rising Edge (Chain Mode) tSSCKCNV 5 ns

SCK Valid Hold Time from CNV Rising Edge (Chain Mode) tHSCKCNV 5 ns

SDI Valid Setup Time from SCK Falling Edge (Chain Mode) tSSDISCK 2 ns

SDI Valid Hold Time from SCK Falling Edge (Chain Mode) tHSDISCK 3 ns

SDI High to SDO High (Chain Mode with Busy Indicator) tDSDOSDI 15 ns

1 See Figure 2 and Figure 3 for load conditions.

500µA I

1.4V

TO SDO

20pF

6973-002

Figure 2. Load Circuit for Digital Interface Timing

X% VIO1

Y% VIO1

VIH2

VIL2

VIH2

DELAY

1FOR VIO ≤ 3.0V, X = 90, AND Y = 10; FOR VIO > 3.0V, X = 70, AND Y = 30.

2MINIMUM VIH AND MAXIMUM VIL USED. SEE DIGITAL INPUTS

SPECIFICATIONS IN TABLE 3.

6973-003

Figure 3. Voltage Levels for Timing

AD7984

Rev. 0 | Page 6 of 24

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter Rating

Analog Inputs

IN+, IN− to GND1−0.3 V to VREF + 0.3 V

or ±130 mA

Supply Voltage

REF, VIO to GND −0.3 V to +6.0 V

VDD to GND −0.3 V to +3.0 V

VDD to VIO +3 V to −6 V

Digital Inputs to GND −0.3 V to VIO + 0.3 V

Digital Outputs to GND −0.3 V to VIO + 0.3 V

Storage Temperature Range −65°C to +150°C

Junction Temperature 150°C

θJA Thermal Impedance

10-Lead MSOP 200°C/W

10-Lead QFN (LFCSP) 48.7°C/W

θJC Thermal Impedance

10-Lead MSOP 44°C/W

10-Lead QFN (LFCSP) 2.96°C/W

Lead Temperatures

Vapor Phase (60 sec) 215°C

Infrared (15 sec) 220°C

1 See the Analog Inputs section for an explanation of IN+ and IN−.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

AD7984

Rev. 0 | Page 7 of 24

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

REF

VDD

IN+

IN–

GND

VIO

SDI

SCK

SDO

CNV

AD7984

TOP VIEW

(Not to Scale)

06973-004

Figure 4. 10-Lead MSOP Pin Configuration

1REF

2VDD

3IN+

4IN–

5GND

10 VIO

9SDI

8SCK

7SDO

6CNV

AD7984

TOP VIEW

(Not to Scale)

06973-005

Figure 5. 10-Lead QFN (LFCSP) Pin Configuration

Table 6. Pin Function Descriptions

Pin No. Mnemonic Type1Description

1 REF AI

Reference Input Voltage. The REF range is 2.9 V to 5.1 V. This pin is referred to the GND pin and

should be decoupled closely to the GND pin with a 10 μF capacitor.

2 VDD P Power Supply.

3 IN+ AI Differential Positive Analog Input.

4 IN− AI Differential Negative Analog Input.

5 GND P Power Supply Ground.

6 CNV DI

Convert Input. This input has multiple functions. On its rising edge, it initiates the conversions

and selects the interface mode of the part: chain mode or CS mode. In CS mode, the SDO pin is

enabled when CNV is low. In chain mode, the data should be read when CNV is high.

7 SDO DO Serial Data Output. The conversion result is output on this pin. It is synchronized to SCK.

8 SCK DI Serial Data Clock Input. When the part is selected, the conversion result is shifted out by this clock.

9 SDI DI

Serial Data Input. This input provides multiple features. It selects the interface mode of the ADC as

follows:

Chain mode is selected if SDI is low during the CNV rising edge. In this mode, SDI is used as a

data input to daisy-chain the conversion results of two or more ADCs onto a single SDO line. The

digital data level on SDI is output on SDO with a delay of 18 SCK cycles.

CS mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV can

enable the serial output signals when low. If SDI or CNV is low when the conversion is complete,

the busy indicator feature is enabled.

10 VIO P

Input/Output Interface Digital Power. Nominally at the same supply as the host interface

(1.8 V, 2.5 V, 3 V, or 5 V).

1 AI = analog input, DI = digital input, DO = digital output, and P = power.

AD7984

Rev. 0 | Page 8 of 24

TYPICAL PERFORMANCE CHARACTERISTICS

VDD = 2.5 V, REF = 5.0 V, VIO = 3.3 V.

2.0

–2.0

0 262144

06973-032

CODE

INL (LSB)

1.5

1.0

0.5

–0.5

–1.0

–1.5

65536 131072 196608

POSITIVE INL: +1.07LSB

NEGATIVE INL: –0.73LSB

Figure 6. Integral Nonlinearity vs. Code

60k

06973-041

CODE IN HEX

COUNTS

50k

40k

30k

20k

10k

1D 1E

007 600

326

20 21 22 23 24 25

326

26 27 28

5992

32350

55354

31003

5708

Figure 7. Histogram of a DC Input at the Code Center

–180

06973-033

FREQUENCY (kHz)

AMPLITUDE (dB of Full Scale)

–20

–40

–60

–80

–100

–120

–140

–160

100 200 300 400 500 600

= 1.33MSPS

= 10kHz

SNR = 98.2dB

THD = –110.6dB

SFDR = 112.5dB

SINAD = 98.0dB

Figure 8. FFT Plot

2.0

–2.0

0 262144

06973-038

CODE

DNL (LSB)

1.5

1.0

0.5

–0.5

–1.0

–1.5

65536 131072 196608

POSITIVE DNL: +0.63LSB

NEGATIVE DNL: –0.34LSB

Figure 9. Differential Nonlinearity vs. Code

60k

06973-042

CODE IN HEX

COUNTS

50k

40k

30k

20k

10k

1E 1F

002

21 22 23 24 25 26 27

28 29

1801 1378

16593 14653

48273 48266

Figure 10. Histogram of a DC Input at the Code Transition

100

–10 0

06973-039

INPUT LEVEL (dB of Full Scale)

SNR (dB)

–9 –8 –7 –6 –5 –4 –3 –2 –1

Figure 11. SNR vs. Input Level

AD7984

Rev. 0 | Page 9 of 24

100

2.5 5.5

REFERENCE VOLTAGE (V)

SNR, SINAD (dB)

ENOB (Bits)

3.0 3.5 4.0 4.5 5.0

06973-043

ENOB

SNR

SINAD

Figure 12. SNR, SINAD, and ENOB vs. Reference Voltage

100

–55 105

06973-044

TEMPERATURE (°C)

SNR (dB)

–35 –15 5 25 45 65 85

Figure 13. SNR vs. Temperature

100

1000

06973-034

FREQUENCY (kHz)

SINAD (dB)

1 10 100

Figure 14. SINAD vs. Frequency

–

100

–120

2.5 5.5

REFERENCE VOLTAGE (V)

THD (dB)

–105

–110

–115

3.0 3.5 4.0 4.5 5.0

06973-045

Figure 15. THD vs. Reference Voltage

–

100

–120

–55 125

06973-046

TEMPERATURE (°C)

THD (dB)

–105

–110

–115

–35 –15 5 25 45 65 85 105

Figure 16. THD vs. Temperature

–

–115

1000

06973-040

FREQUENCY (kHz)

THD (dB)

1 10 100

–85

–90

–95

–100

–105

–110

Figure 17. THD vs. Frequency

AD7984

Rev. 0 | Page 10 of 24

2.5

2.375 2.625

06973-035

VDD VOLTAGE (V)

OPERATING CURRENTS (mA)

2.0

1.5

1.0

0.5

2.425 2.475 2.525 2.575

IVDD

IREF

IVIO

Figure 18. Operating Currents vs. Supply

1.5

0.5

–55 125

06973-036

TEMPERATURE (°C)

STANDBY CURRENTS (mA)

1.4

1.3

1.2

1.1

1.0

0.9

0.8

0.7

0.6

–35 –15 5 25 45 65 85 105

IVDD + IVIO

Figure 19. Standby Currents vs. Temperature

2.5

–55 125

06973-037

TEMPERATURE (°C)

OPERATING CURRENTS (mA)

–35 –15 5 25 45 65 85 105

2.0

1.5

1.0

0.5

IVDD

IREF

IVIO

Figure 20. Operating Currents vs. Temperature

AD7984

Rev. 0 | Page 11 of 24

TERMINOLOGY

Integral Nonlinearity Error (INL)

INL refers to the deviation of each individual code from a line

drawn from negative full scale through positive full scale. The

point used as negative full scale occurs ½ LSB before the first

code transition. Positive full scale is defined as a level 1½ LSB

beyond the last code transition. The deviation is measured from

the middle of each code to the true straight line (see Figure 22).

Differential Nonlinearity Error (DNL)

In an ideal ADC, code transitions are 1 LSB apart. DNL is the

maximum deviation from this ideal value. It is often specified in

terms of resolution for which no missing codes are guaranteed.

Zero Error

Zero error is the difference between the ideal midscale voltage,

that is, 0 V, from the actual voltage producing the midscale

output code, that is, 0 LSB.

Gain Error

The first transition (from 100 ... 00 to 100 ... 01) should occur at

a level ½ LSB above nominal negative full scale (−4.999981 V

for the ±5 V range). The last transition (from 011 … 10 to

011 … 11) should occur for an analog voltage 1½ LSB below

the nominal full scale (+4.999943 V for the ±5 V range). The

gain error is the deviation of the difference between the actual

level of the last transition and the actual level of the first

transition from the difference between the ideal levels.

Spurious-Free Dynamic Range (SFDR)

SFDR is the difference, in decibels (dB), between the rms

amplitude of the input signal and the peak spurious signal.

Effective Number of Bits (ENOB)

ENOB is a measurement of the resolution with a sine wave

input. It is related to SINAD as follows:

ENOB = (SINADdB − 1.76)/6.02

and is expressed in bits.

Noise-Free Code Resolution

Noise-free code resolution is the number of bits beyond which it is

impossible to distinctly resolve individual codes. It is calculated as

Noise-Free Code Resolution = log2(2N/Peak-to-Peak Noise)

and is expressed in bits.

Effective Resolution

Effective resolution is calculated as

Effective Resolution = log2(2N/RMS Input Noise)

and is expressed in bits.

Total Harmonic Distortion (THD)

THD is the ratio of the rms sum of the first five harmonic

components to the rms value of a full-scale input signal and is

expressed in decibels.

Dynamic Range

Dynamic range is the ratio of the rms value of the full scale to

the total rms noise measured with the inputs shorted together.

The value for dynamic range is expressed in decibels. It is

measured with a signal at −60 dBF so that it includes all noise

sources and DNL artifacts.

Signal-to-Noise Ratio (SNR)

SNR is the ratio of the rms value of the actual input signal to

the rms sum of all other spectral components below the Nyquist

frequency, excluding harmonics and dc. The value for SNR is

expressed in decibels.

Signal-to-(Noise + Distortion) Ratio (SINAD)

SINAD is the ratio of the rms value of the actual input signal to

the rms sum of all other spectral components that are less than

the Nyquist frequency, including harmonics but excluding dc.

The value of SINAD is expressed in decibels.

Aperture Delay

Aperture delay is the measurement of the acquisition

performance and is the time between the rising edge of the

CNV input and when the input signal is held for a conversion.

Transient Response

Transient response is the time required for the ADC to accurately

acquire its input after a full-scale step function is applied.

AD7984

Rev. 0 | Page 12 of 24

THEORY OF OPERATION

COMP CONTROL

LOGIC

SWITCHES CONTROL

BUSY

OUTPUT CODE

CNV

CC2C65,536C 4C131,072C

LSB SW+

MSB

LSB SW–

MSB

CC2C65,536C 4C131,072C

IN+

REF

IN–

6973-011

Figure 21. ADC Simplified Schematic

CIRCUIT INFORMATION

The AD7984 is a fast, low power, single-supply, precise, 18-bit

ADC using a successive approximation architecture and is

capable of converting 1,330,000 samples per second (1.33 MSPS).

The AD7984 provides the user with an on-chip track-and-hold

and does not exhibit any pipeline delay or latency, making it

ideal for multiple multiplexed channel applications.

The AD7984 can be interfaced to any 1.8 V to 5 V digital logic

family. It is available in a 10-lead MSOP or a tiny 10-lead QFN

(LFCSP) that allows space savings and flexible configurations.

It is pin-for-pin-compatible with the 18-bit AD7982.

CONVERTER OPERATION

The AD7984 is a successive approximation ADC based on a

charge redistribution DAC. Figure 21 shows the simplified

schematic of the ADC. The capacitive DAC consists of two

identical arrays of 18 binary-weighted capacitors, which are

connected to the two comparator inputs.

During the acquisition phase, terminals of the array tied to the

input of the comparator are connected to GND via SW+ and

SW−. All independent switches are connected to the analog

inputs. Therefore, the capacitor arrays are used as sampling

capacitors and acquire the analog signal on the IN+ and IN−

inputs. When the acquisition phase is complete and the CNV

input goes high, a conversion phase is initiated. When the

conversion phase begins, SW+ and SW− are opened first. The

two capacitor arrays are then disconnected from the inputs and

connected to the GND input. Therefore, the differential voltage

between the inputs IN+ and IN− captured at the end of the

acquisition phase is applied to the comparator inputs, causing

the comparator to become unbalanced. By switching each

element of the capacitor array between GND and REF, the

comparator input varies by binary-weighted voltage steps

(VREF/2, VREF/4 ... VREF/262,144). The control logic toggles these

switches, starting with the MSB, to bring the comparator back

into a balanced condition. After the completion of this process,

the part returns to the acquisition phase, and the control logic

generates the ADC output code and a busy signal indicator.

Because the AD7984 has an on-board conversion clock, the

serial clock, SCK, is not required for the conversion process.

AD7984

Rev. 0 | Page 13 of 24

Transfer Functions

The ideal transfer characteristic for the AD7984 is shown in

Figure 22 and Table 7.

100 ... 000

100 ... 001

100 ... 010

011 ... 101

011 ... 110

011 ... 111

ADC CODE (TWOS COMPLEMENT)

ANALOG INPUT

+FSR – 1.5 LSB

+FSR – 1 LSB

–FSR + 1 LSB

–FSR

–FSR + 0.5 LSB

6973-012

Figure 22. ADC Ideal Transfer Function

Table 7. Output Codes and Ideal Input Voltages

Description

Analog Input

VREF = 5 V

Digital Output

Code (Hex)

FSR − 1 LSB +4.999962 V 0x1FFFF1

Midscale + 1 LSB +38.15 μV 0x00001

Midscale 0 V 0x00000

Midscale − 1 LSB −38.15 μV 0x3FFFF

−FSR + 1 LSB −4.999962 V 0x20001

−FSR −5 V 0x200002

1 This is also the code for an overranged analog input (VIN+ − VIN− above VREF − VGND).

2 This is also the code for an underranged analog input (VIN+ − VIN− below VGND).

TYPICAL CONNECTION DIAGRAM

Figure 23 shows an example of the recommended connection

diagram for the AD7984 when multiple supplies are available.

2.7nF

15Ω

V–

0 TO VREF

V+

2.7nF

15Ω

V–

REF TO 0

V+

10µF

REF

REF VDD VIO

GND

IN+

IN–

SDI

SCK

SDO

CNV

AD7984

100nF

3-WIRE INTERFACE

2.5V

1.8V TO 5V

V+

ADA4841

2, 3

NOTES

SEE VOLTAGE REFERENCE INPUT SECTION FOR REFERENCE SELECTION.

REF

IS USUALLY A 10µF CERAMIC CAPACITOR (X5R).

SEE RECOMMENDED LAYOUT IN FIGURE 40 AND FIGURE 41.

SEE DRIVER AMPLIFIER CHOICE SECTION.

OPTIONAL FILTER. SEE ANALOG INPUTS SECTION.

06973-013

Figure 23. Typical Application Diagram with Multiple Supplies

AD7984

Rev. 0 | Page 14 of 24

ANALOG INPUTS

Figure 24 shows an equivalent circuit of the input structure of

the AD7984.

The two diodes, D1 and D2, provide ESD protection for the

analog inputs, IN+ and IN−. Care must be taken to ensure that

the analog input signal does not exceed the reference input

voltage (REF) by more than 0.3 V. If the analog input signal

exceeds this level, the diodes become forward-biased and start

conducting current. These diodes can handle a forward-biased

current of 130 mA maximum. However, if the supplies of the

input buffer (for example, the supplies of the ADA4841 in

Figure 23) are different from those of REF, the analog input

signal may eventually exceed the supply rails by more than

0.3 V. In such a case (for example, an input buffer with a short-

circuit), the current limitation can be used to protect the part.

REF

IN+ OR IN–

GND

06973-014

Figure 24. Equivalent Analog Input Circuit

The analog input structure allows the sampling of the true

differential signal between IN+ and IN−. By using these

differential inputs, signals common to both inputs are rejected.

1 10 100 1000 10000

FREQUENCY (kHz)

CMRR (dB)

6973-015

Figure 25. Analog Input CMRR vs. Frequency

During the acquisition phase, the impedance of the analog

inputs (IN+ or IN−) can be modeled as a parallel combination

of capacitor, CPIN, and the network formed by the series connection

of RIN and CIN. CPIN is primarily the pin capacitance. RIN is typically

400 Ω and is a lumped component composed of serial resistors

and the on resistance of the switches. CIN is typically 30 pF and

is mainly the ADC sampling capacitor.

During the sampling phase, where the switches are closed, the

input impedance is limited to CPIN. RIN and CIN make a 1-pole,

low-pass filter that reduces undesirable aliasing effects and

limits noise.

When the source impedance of the driving circuit is low, the

AD7984 can be driven directly. Large source impedances

significantly affect the ac performance, especially THD. The

dc performances are less sensitive to the input impedance. The

maximum source impedance depends on the amount of THD

that can be tolerated. The THD degrades as a function of the

source impedance and the maximum input frequency.

DRIVER AMPLIFIER CHOICE

Although the AD7984 is easy to drive, the driver amplifier must

meet the following requirements:

• The noise generated by the driver amplifier must be kept as

low as possible to preserve the SNR and transition noise

performance of the AD7984. The noise from the driver is

filtered by the AD7984 analog input circuit’s 1-pole, low-

pass filter made by RIN and CIN or by the external filter, if

one is used. Because the typical noise of the AD7984 is

36.24 μV rms, the SNR degradation due to the amplifier is

⎟

⎠

⎞

⎜

⎝

⎛

−22 )(

.2463

36.24

log20

3dB

LOSS

Nef

SNR

where:

f–3dB is the input bandwidth, in megahertz, of the AD7984

(10 MHz) or the cutoff frequency of the input filter, if

one is used.

N is the noise gain of the amplifier (for example, 1 in buffer

configuration).

eN is the equivalent input noise voltage of the op amp, in

nV/√Hz.

• For ac applications, the driver should have a THD perfor-

mance commensurate with the AD7984.

• For multichannel multiplexed applications, the driver

amplifier and the AD7984 analog input circuit must settle

for a full-scale step onto the capacitor array at an 18-bit level

(0.0004%, 4 ppm). In the data sheet of the amplifier,

settling at 0.1% to 0.01% is more commonly specified. This

may differ significantly from the settling time at an 18-bit

level and should be verified prior to driver selection.

Table 8. Recommended Driver Amplifiers

Amplifier Typical Application

ADA4941-x Very low noise, low power single-to-differential

ADA4841-x Very low noise, small, and low power

AD8021 Very low noise and high frequency

AD8022 Low noise and high frequency

OP184 Low power, low noise, and low frequency

AD8655 5 V single supply, low noise

AD8605, AD8615 5 V single supply, low power

AD7984

Rev. 0 | Page 15 of 24

SINGLE-TO-DIFFERENTIAL DRIVER

For applications using a single-ended analog signal, either

bipolar or unipolar, the ADA4941-x single-ended-to-

differential driver allows for a differential input into the part. The

schematic is shown in Figure 26.

R1 and R2 set the attenuation ratio between the input range and

the ADC range (VREF). R1, R2, and CF are chosen depending on

the desired input resistance, signal bandwidth, antialiasing, and

noise contribution. For example, for the ±10 V range with a 4 kΩ

impedance, R2 = 1 kΩ and R1 = 4 kΩ.

R3 and R4 set the common mode on the IN− input, and R5 and R6

set the common mode on the IN+ input of the ADC. The common

mode should be close to VREF/2. For example, for the ±10 V range

with a single supply, R3 = 8.45 kΩ, R4 = 11.8 kΩ, R5 = 10.5 kΩ,

and R6 = 9.76 kΩ.

15Ω

10µF

100nF

+2.5V

+5V REF

+5.2V

–0.2V

±10V,

±5V, ..

REF VDD

GND

IN+

IN–

AD7984

2.7nF

ADA4941

OUTP

OUTN

REF

100nF

06973-016

Figure 26. Single-Ended-to-Differential Driver Circuit

VOLTAGE REFERENCE INPUT

The AD7984 voltage reference input, REF, has a dynamic input

impedance and should therefore be driven by a low impedance

source with efficient decoupling between the REF and GND

pins, as explained in the Layout section.

When REF is driven by a very low impedance source (for

example, a reference buffer using the AD8031 or the AD8605),

a 10 μF (X5R, 0805 size) ceramic chip capacitor is appropriate

for optimum performance.

If an unbuffered reference voltage is used, the decoupling value

depends on the reference used. For instance, a 22 μF (X5R,

1206 size) ceramic chip capacitor is appropriate for optimum

performance using a low temperature drift ADR43x reference.

If desired, a reference-decoupling capacitor with values as small

as 2.2 μF can be used with a minimal impact on performance,

especially DNL.

Regardless, there is no need for an additional lower value

ceramic decoupling capacitor (for example, 100 nF) between the

REF and GND pins.

POWER SUPPLY

The AD7984 uses two power supply pins: a core supply (VDD) and

a digital input/output interface supply (VIO). VIO allows direct

interface with any logic between 1.8 V and 5.5 V. To reduce the

number of supplies needed, VIO and VDD can be tied together.

The AD7984 is independent of power supply sequencing between

VIO and VDD. Additionally, it is very insensitive to power supply

variations over a wide frequency range, as shown in Figure 27.

PSRR (dB)

1 10 100 1000

FREQUENCY (kHz)

6973-017

Figure 27. PSRR vs. Frequency

To ensure optimum performance, VDD should be roughly half

of REF, the voltage reference input. For example, if REF is 5.0 V,

VDD should be set to 2.5 V (±5%).

AD7984

Rev. 0 | Page 16 of 24

DIGITAL INTERFACE

Although the AD7984 has a reduced number of pins, it offers

flexibility in its serial interface modes.

When in CS mode, the AD7984 is compatible with SPI, QSPI,

digital hosts, and DSPs. In this mode, the AD7984 can use

either a 3-wire or 4-wire interface. A 3-wire interface using the

CNV, SCK, and SDO signals minimizes wiring connections

useful, for instance, in isolated applications. A 4-wire interface

using the SDI, CNV, SCK, and SDO signals allows CNV, which

initiates the conversions, to be independent of the readback

timing (SDI). This is useful in low jitter sampling or

simultaneous sampling applications.

When in chain mode, the AD7984 provides a daisy-chain feature

using the SDI input for cascading multiple ADCs on a single

data line similar to a shift register.

The mode in which the part operates depends on the SDI level

when the CNV rising edge occurs. The CS mode is selected if

SDI is high, and the chain mode is selected if SDI is low. The

SDI hold time is such that when SDI and CNV are connected,

the chain mode is always selected.

In either mode, the AD7984 offers the option of forcing a start

bit in front of the data bits. This start bit can be used as a busy

signal indicator to interrupt the digital host and trigger the data

reading. Otherwise, without a busy indicator, the user must timeout

the maximum conversion time prior to readback.

The busy indicator feature is enabled

• In CS mode if CNV or SDI is low when the ADC

conversion ends (see Figure 31 and Figure 35).

• In chain mode if SCK is high during the CNV rising edge

(see Figure 39).

AD7984

Rev. 0 | Page 17 of 24

CS MODE, 3-WIRE WITHOUT BUSY INDICATOR

This mode is usually used when a single AD7984 is connected

to an SPI-compatible digital host. The connection diagram is

shown in Figure 28, and the corresponding timing is given in

Figure 29.

With SDI tied to VIO, a rising edge on CNV initiates a

conversion, selects the CS mode, and forces SDO to high

impedance. When a conversion is initiated, it continues until

completion irrespective of the state of CNV. This can be useful,

for example, to bring CNV low to select other SPI devices, such

as analog multiplexers; however, CNV must be returned high

before the minimum conversion time elapses and then held

high for the maximum possible conversion time to avoid the

generation of the busy signal indicator. When the conversion is

complete, the AD7984 enters the acquisition phase and goes

into standby mode. When CNV goes low, the MSB is output

onto SDO. The remaining data bits are clocked by subsequent

SCK falling edges. The data is valid on both SCK edges. Although

the rising edge can be used to capture the data, a digital host

using the SCK falling edge allows a faster reading rate, provided

it has an acceptable hold time. After the 18th SCK falling edge or

when CNV goes high (whichever occurs first), SDO returns to

high impedance.

AD7984

SDI SDO

CNV

SCK

CONVERT

DATA IN

CLK

DIGITAL HOST

VIO

06973-018

Figure 28. CS Mode, 3-Wire Without Busy Indicator Connection Diagram (SDI High)

SDO D17 D16 D15 D1 D0

DIS

SCK 1 2 3 16 17 18

SCK

SCKL

SCKH

HSDO

DSDO

CNV

CONVERSIONACQUISITION

CONV

CYC

ACQUISITION

SDI = 1

CNVH

ACQ

06973-019

Figure 29. CS Mode, 3-Wire Without Busy Indicator Serial Interface Timing (SDI High)

AD7984

Rev. 0 | Page 18 of 24

CS MODE, 3-WIRE WITH BUSY INDICATOR

This mode is usually used when a single AD7984 is connected

to an SPI-compatible digital host having an interrupt input.

The connection diagram is shown in Figure 30, and the

corresponding timing is given in Figure 31.

With SDI tied to VIO, a rising edge on CNV initiates a

conversion, selects the CS mode, and forces SDO to high

impedance. SDO is maintained in high impedance until the

completion of the conversion irrespective of the state of CNV.

Prior to the minimum conversion time, CNV can be used to

select other SPI devices, such as analog multiplexers, but CNV

must be returned low before the minimum conversion time

elapses and then held low for the maximum possible conversion

time to guarantee the generation of the busy signal indicator.

When the conversion is complete, SDO goes from high

impedance to low impedance. With a pull-up on the SDO line,

this transition can be used as an interrupt signal to initiate the

data reading controlled by the digital host. The AD7984 then

enters the acquisition phase and goes into standby mode. The

data bits are then clocked out, MSB first, by subsequent SCK

falling edges. The data is valid on both SCK edges. Although the

rising edge can be used to capture the data, a digital host using

the SCK falling edge allows a faster reading rate, provided it has

an acceptable hold time. After the optional 19th SCK falling edge

or when CNV goes high (whichever occurs first), SDO returns

to high impedance.

If multiple AD7984s are selected at the same time, the SDO

output pin handles this contention without damage or induced

latch-up. Meanwhile, it is recommended to keep this contention

as short as possible to limit extra power dissipation.

AD7984

SDI SDO

CNV

SCK

CONVERT

DATA IN

CLK

DIGITAL HOST

VIO

IRQ

VIO

47kΩ

06973-020

Figure 30. CS Mode, 3-Wire with Busy Indicator Connection Diagram (SDI High)

SDO D17 D16 D1 D0

DIS

SCK 123 171819

SCK

SCKL

SCKH

HSDO

DSDO

CNV

CONVERSIONACQUISITION

CONV

CYC

ACQUISITION

SDI = 1

CNVH

ACQ

06973-021

Figure 31. CS Mode, 3-Wire with Busy Indicator Serial Interface Timing (SDI High)

AD7984

Rev. 0 | Page 19 of 24

CS MODE, 4-WIRE WITHOUT BUSY INDICATOR

This mode is usually used when multiple AD7984s are connected

to an SPI-compatible digital host.

A connection diagram example using two AD7984s is shown in

Figure 32, and the corresponding timing is given in Figure 33.

With SDI high, a rising edge on CNV initiates a conversion,

selects the CS mode, and forces SDO to high impedance. In this

mode, CNV must be held high during the conversion phase and

the subsequent data readback (if SDI and CNV are low, SDO is

driven low). Prior to the minimum conversion time, SDI can be

used to select other SPI devices, such as analog multiplexers,

but SDI must be returned high before the minimum conversion

time elapses and then held high for the maximum possible

conversion time to avoid the generation of the busy signal

indicator. When the conversion is complete, the AD7984

enters the acquisition phase and goes into standby mode. Each

ADC result can be read by bringing its SDI input low, which

consequently outputs the MSB onto SDO. The remaining data

bits are then clocked by subsequent SCK falling edges. The data

is valid on both SCK edges. Although the rising edge can be

used to capture the data, a digital host using the SCK falling

edge allows a faster reading rate, provided it has an acceptable

hold time. After the 18th SCK falling edge or when SDI goes

high (whichever occurs first), SDO returns to high impedance

and another AD7984 can be read.

AD7984

SDI SDO

CNV

SCK

CONVERT

DATA IN

CLK

DIGITAL HOST

CS1

CS2

AD7984

SDI SDO

CNV

SCK

06973-022

Figure 32. CS Mode, 4-Wire Without Busy Indicator Connection Diagram

SDO D17 D16 D15 D1 D0

DIS

SCK 123 343536

HSDO

DSDO

CONVERSIONACQUISITION

CONV

CYC

ACQ

ACQUISITION

SDI(CS1)

CNV

SSDICNV

HSDICNV

16 17

SCK

SCKL

SCKH

D0 D17 D16

19 2018

SDI(CS2)

6973-023

Figure 33. CS Mode, 4-Wire Without Busy Indicator Serial Interface Timing

AD7984

Rev. 0 | Page 20 of 24

CS MODE, 4-WIRE WITH BUSY INDICATOR

This mode is usually used when a single AD7984 is connected

to an SPI-compatible digital host with an interrupt input and

when it is desired to keep CNV, which is used to sample the

analog input, independent of the signal used to select the data

reading. This independence is particularly important in

applications where low jitter on CNV is desired.

The connection diagram is shown in Figure 34, and the

corresponding timing is given in Figure 35.

With SDI high, a rising edge on CNV initiates a conversion,

selects the CS mode, and forces SDO to high impedance. In this

mode, CNV must be held high during the conversion phase and

the subsequent data readback. (If SDI and CNV are low, SDO is

driven low.) Prior to the minimum conversion time, SDI can be

used to select other SPI devices, such as analog multiplexers,

but SDI must be returned low before the minimum conversion

time elapses and then held low for the maximum possible

conversion time to guarantee the generation of the busy signal

indicator. When the conversion is complete, SDO goes from

high impedance to low impedance. With a pull-up on the SDO

line, this transition can be used as an interrupt signal to initiate

the data readback controlled by the digital host. The AD7984

then enters the acquisition phase and goes into standby mode.

The data bits are then clocked out, MSB first, by subsequent

SCK falling edges. The data is valid on both SCK edges. Although

the rising edge can be used to capture the data, a digital host

using the SCK falling edge allows a faster reading rate, provided

it has an acceptable hold time. After the optional 19th SCK

falling edge or SDI going high (whichever occurs first), SDO

returns to high impedance.

AD7984

SDI SDO

CNV

SCK

CONVERT

DATA IN

CLK

DIGITAL HOST

IRQ

VIO

47kΩ

CS1

06973-024

Figure 34. CS Mode, 4-Wire with Busy Indicator Connection Diagram

SDO D17 D16 D1 D0

DIS

SCK 1 2 3 171819

SCK

SCKL

SCKH

HSDO

DSDO

CONVERSIONACQUISITION

CONV

CYC

ACQ

ACQUISITION

SDI

CNV

SSDICNV

HSDICNV

06973-025

Figure 35. CS Mode, 4-Wire with Busy Indicator Serial Interface Timing

AD7984

Rev. 0 | Page 21 of 24

CHAIN MODE WITHOUT BUSY INDICATOR

This mode can be used to daisy-chain multiple AD7984s on

a 3-wire serial interface. This feature is useful for reducing

component count and wiring connections, for example, in

isolated multiconverter applications or for systems with a

limited interfacing capacity. Data readback is analogous to

clocking a shift register.

A connection diagram example using two AD7984s is shown in

Figure 36, and the corresponding timing is given in Figure 37.

When SDI and CNV are low, SDO is driven low. With SCK low,

a rising edge on CNV initiates a conversion, selects the chain

mode, and disables the busy indicator. In this mode, CNV is

held high during the conversion phase and the subsequent data

readback. When the conversion is complete, the MSB is output

onto SDO and the AD7984 enters the acquisition phase and

goes into standby mode. The remaining data bits stored in the

internal shift register are clocked by subsequent SCK falling

edges. For each ADC, SDI feeds the input of the internal shift

the chain outputs its data MSB first, and 18 × N clocks are

required to read back the N ADCs. The data is valid on both

SCK edges. Although the rising edge can be used to capture the

data, a digital host using the SCK falling edge will allow a faster

reading rate and consequently more AD7984s in the chain,

provided the digital host has an acceptable hold time. The

maximum conversion rate may be reduced due to the total

readback time.

CONVERT

DATA IN

CLK

DIGITAL HOST

AD7984

SDI SDO

CNV

SCK

AD7984

SDI SDO

CNV

SCK

06973-026

Figure 36. Chain Mode Without Busy Indicator Connection Diagram

SDO

= SDI

17 D

16 D

SCK 1 2 3 343536

SSDISCK

HSDISCK

CONVERSIONACQUISITION

CONV

CYC

ACQ

ACQUISITION

CNV

16 17

SCK

SCKL

SCKH

19 2018

SDI

= 0

SDO

17 D

16 D

15 D

17 D

HSDO

DSDO

SSCKCNV

HSCKCNV

06973-027

Figure 37. Chain Mode Without Busy Indicator Serial Interface Timing

AD7984

Rev. 0 | Page 22 of 24

CHAIN MODE WITH BUSY INDICATOR

This mode can also be used to daisy-chain multiple AD7984s

on a 3-wire serial interface while providing a busy indicator.

This feature is useful for reducing component count and wiring

connections, for example, in isolated multiconverter applications or

for systems with a limited interfacing capacity. Data readback is

analogous to clocking a shift register.

A connection diagram example using three AD7984s is shown

in Figure 38, and the corresponding timing is given in Figure 39.

When SDI and CNV are low, SDO is driven low. With SCK

high, a rising edge on CNV initiates a conversion, selects the

chain mode, and enables the busy indicator feature. In this

mode, CNV is held high during the conversion phase and the

subsequent data readback. When all ADCs in the chain have

completed their conversions, the SDO pin of the ADC closest to

the digital host (see the AD7984 ADC labeled C in Figure 38) is

driven high. This transition on SDO can be used as a busy indicator

to trigger the data readback controlled by the digital host. The

AD7984 then enters the acquisition phase and goes into standby

mode. The data bits stored in the internal shift register are clocked

out, MSB first, by subsequent SCK falling edges. For each ADC,

SDI feeds the input of the internal shift register and is clocked

by the SCK falling edge. Each ADC in the chain outputs its data

MSB first, and 18 × N + 1 clocks are required to read back the N

ADCs. Although the rising edge can be used to capture the data, a

digital host using the SCK falling edge allows a faster reading

rate and, consequently, more AD7984s in the chain, provided

the digital host has an acceptable hold time.

CONVERT

DATA IN

CLK

DIGITAL HOST

AD7984

SDI SDO

CNV

SCK

AD7984

SDI SDO

CNV

SCK IRQ

AD7984

SDI SDO

CNV

SCK

06973-028

Figure 38. Chain Mode with Busy Indicator Connection Diagram

SDO

= SDI

17 D

16 D

SCK 123 39 53 54

CONVERSION

ACQUISITION

CONV

CYC

ACQ

ACQUISITION

CNV = SDI

417

SCK

SCKH

SCKL

19 3818

SDO

= SDI

17 D

16 D

15 D

17 D

SSDISCK

HSDISCK

HSDO

DSDO

SDO

17 D

16 D

15 D

21 35 3620 37

17D

17 D

DSDOSDI

SSCKCNV

HSCKCNV

DSDOSDI

06973-029

Figure 39. Chain Mode with Busy Indicator Serial Interface Timing

AD7984

Rev. 0 | Page 23 of 24

APPLICATION HINTS

LAYOUT

The printed circuit board (PCB) that houses the AD7984

should be designed so that the analog and digital sections are

separated and confined to certain areas of the board. The

pinout of the AD7984, with its analog signals on the left side

and its digital signals on the right side, eases this task.

Avoid running digital lines under the device because these

couple noise onto the die, unless a ground plane under the

AD7984 is used as a shield. Fast switching signals, such as CNV

or clocks, should not run near analog signal paths. Crossover of

digital and analog signals should be avoided.

At least one ground plane should be used. It can be common or

split between the digital and analog sections. In the latter case,

the planes should be joined underneath the AD7984.

The AD7984 voltage reference input REF has a dynamic input

impedance and should be decoupled with minimal parasitic

inductances. This is done by placing the reference decoupling

ceramic capacitor close to, ideally right up against, the REF and

GND pins and connecting them with wide, low impedance traces.

Finally, the power supplies VDD and VIO of the AD7984

should be decoupled with ceramic capacitors, typically 100 nF,

placed close to the AD7984 and connected using short, wide

traces to provide low impedance paths and to reduce the effect

of glitches on the power supply lines.

An example of layout following these rules is shown in

Figure 40 and Figure 41.

EVALUATING THE AD7984 PERFORMANCE

Other recommended layouts for the AD7984 are outlined

in the documentation of the evaluation board for the AD7984

(EVAL-AD7984CBZ). The evaluation board package includes

a fully assembled and tested evaluation board, documentation,

and software for controlling the board from a PC via the

EVAL-CONTROL BRD3Z.

AD7984

06973-030

Figure 40. Example Layout of the AD7984 (Top Layer)

06973-031

Figure 41. Example Layout of the AD7984 (Bottom Layer)

AD7984

Rev. 0 | Page 24 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-187-BA

0.23

0.08

0.80

0.60

0.40

8°

0°

0.15

0.05

0.33

0.17

0.95

0.85

0.75

SEATING

PLANE

1.10 MAX

10 6

0.50 BSC

PIN 1

COPLANARITY

0.10

3.10

3.00

2.90

3.10

3.00

2.90

5.15

4.90

4.65

Figure 42. 10-Lead Mini Small Outline Package [MSOP]

(RM-10)

Dimensions shown in millimeters

101207-B

TOP VIEW

0.30

0.23

0.18

*EXPOSED

PAD

(BOTTOM VIEW)

PIN 1 INDEX

AREA

3.00

BSC SQ

SEATING

PLANE

0.80

0.75

0.70

0.20 REF

0.05 MAX

0.02 NOM

0.80 MAX

0.55 NOM

1.74

1.64

1.49

2.48

2.38

2.23

0.50

0.40

0.30

0.50 BSC

PIN1

INDICATOR

(R0.19)

*PADDLE CONNECTED TO GND.

THIS CONNECTION IS NOT

REQUIRED TO MEET THE

ELECTRICAL PERFORMANCES.

Figure 43. 10-Lead Lead Frame Chip Scale Package [QFN (LFCSP_WD)]

3 mm × 3 mm Body, Very Very Thin, Dual Lead (CP-10-9)

Dimensions shown in millimeters

ORDERING GUIDE

Model Temperature Range Package Description Package Option Ordering Quantity Branding

AD7984BRMZ1−40°C to +85°C 10-Lead MSOP RM-10 Tube, 50 C60

AD7984BRMZ-RL71−40°C to +85°C 10-Lead MSOP RM-10 Reel, 1,000 C60

AD7984BCPZ1−40°C to +85°C 10-Lead QFN (LFCSP_WD) CP-10-9 Tube, 75 C60

AD7984BCPZ-RL71−40°C to +85°C 10-Lead QFN (LFCSP_WD) CP-10-9 Reel, 1,000 C60

AD7984BCPZ-RL1−40°C to +85°C 10-Lead QFN (LFCSP_WD) CP-10-9 Reel, 5,000 C60

EVAL-AD7984CBZ1, 2 Evaluation Board

EVAL-CONTROL BRD3Z1, 3 Evaluation Board

1 Z = RoHS compliant part.

2 This board can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BRD3Z for evaluation/demonstration purposes.

3 This board allows a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designator.

registered trademarks are the property of their respective owners.

D06973-0-11/07(0)