Table of Contents
1 Ratings..................................................................................5
1.1 Thermal handling ratings............................................... 5
1.2 Moisture handling ratings...............................................5
1.3 ESD handling ratings.....................................................5
1.4 Voltage and current operating ratings............................5
2 General................................................................................. 6
2.1 AC electrical characteristics...........................................6
2.2 Nonswitching electrical specifications............................6
2.2.1 Voltage and current operating requirements..... 7
2.2.2 LVD and POR operating requirements..............7
2.2.3 Voltage and current operating behaviors...........8
2.2.4 Power mode transition operating behaviors...... 9
2.2.5 Power consumption operating behaviors.......... 10
2.2.6 EMC radiated emissions operating behaviors... 15
2.2.7 Designing with radiated emissions in mind........16
2.2.8 Capacitance attributes.......................................16
2.3 Switching specifications.................................................16
2.3.1 Device clock specifications................................16
2.3.2 General switching specifications....................... 17
2.4 Thermal specifications...................................................17
2.4.1 Thermal operating requirements....................... 17
2.4.2 Thermal attributes..............................................17
3 Peripheral operating requirements and behaviors................ 18
3.1 Core modules................................................................ 18
3.1.1 SWD electricals ................................................ 18
3.2 System modules............................................................ 20
3.3 Clock modules............................................................... 20
3.3.1 MCG specifications............................................20
3.3.2 Oscillator electrical specifications......................21
3.4 Memories and memory interfaces................................. 22
3.4.1 Flash electrical specifications............................ 22
3.5 Security and integrity modules.......................................24
3.6 Analog............................................................................24
3.6.1 ADC electrical specifications............................. 24
3.6.2 CMP and 6-bit DAC electrical specifications..... 27
3.7 Timers............................................................................29
3.8 Communication interfaces............................................. 29
3.8.1 SPI switching specifications.............................. 29
3.8.2 Inter-Integrated Circuit Interface (I2C) timing.... 33
3.8.3 UART.................................................................35
4 Dimensions........................................................................... 35
4.1 Obtaining package dimensions......................................35
5 Pinout....................................................................................35
5.1 KL02 signal multiplexing and pin assignments..............35
5.2 KL02 pinouts..................................................................37
6 Ordering parts....................................................................... 39
6.1 Determining valid orderable parts..................................39
7 Part identification...................................................................39
7.1 Description.....................................................................39
7.2 Format........................................................................... 40
7.3 Fields............................................................................. 40
7.4 Example.........................................................................40
8 Small package marking.........................................................41
9 Terminology and guidelines.................................................. 41
9.1 Definition: Operating requirement..................................41
9.2 Definition: Operating behavior....................................... 42
9.3 Definition: Attribute........................................................ 42
9.4 Definition: Rating........................................................... 42
9.5 Result of exceeding a rating.......................................... 43
9.6 Relationship between ratings and operating
requirements..................................................................43
9.7 Guidelines for ratings and operating requirements........44
9.8 Definition: Typical value.................................................44
9.9 Typical value conditions.................................................45
10 Revision history.....................................................................45
4Kinetis KL02 32 KB Flash, Rev4 08/2014.
Freescale Semiconductor, Inc.