Bosch Sensortec
BMG160
3-axis gyroscope sensor
General description
The BMG160 is an ultra-small, digital 3-axis angular
rate sensor with a measurement range up to 2000°/s
and a digital resolution of 16 bit for consumer
electronics applications.
The BMG160 allows low-noise measurement of
angular rates in 3 perpendicular axes and is
designed for use in mobile phones, handhelds,
computer peripherals, man-machine interfaces,
virtual reality features, remote and game controllers.
BMG160 target applications
fGaming
fNavigation systems
fMotion and activity measurement
fOptical image stabilization
Key features
With its small footprint of only 3 mm x 3 mm the
BMG160 is unique in the class of low-noise consumer
electronics gyroscopes. The zero-rate offset and offset
stability over temperature of the BMG160 are outstan-
ding.
f3-axis integrated, digital gyroscope
f16 bit digital resolution
f5 programmable angular rate measurement
ranges
fIntegrated interrupt engine and FIFO buffer
fLow power consumption <5 mA
fShort start-up time of 30 ms
fI2C and SPI interface (4-wire and 3-wire)
fLow-pass lters (programmable)
fFast and slow offset controller
fUltra small size: 3 mm x 3 mm x 0.95 mm
outline dimensions
fMSL level 1 category 12-pin LGA package
fRoHS compliant, halogen-free
BMG160 Technical data
Digital resolution
Measurement ranges
(programmable)
Sensitivity
(calibrated)
Zero-rate offset (typ.)
Zero-rate offset over
temperature
Noise density (typ.)
Low-pass lter
bandwidths (progr.)
Date rates
(programmable)
Digital inputs/outputs
Supply voltage (VDD)
I/0 supply voltage
(VDDIO)
Temperature range
(operating)
Current consumption
ffull operation
ffast power-up
FIFO data buffer
LGA package
Shock resistance
16 bit
±125 °/s, ±250 °/s,
±500 °/s, ±1000 °/s,
±2000 °/s
±125°/s: 262.4 LSB/°/s
±250 °/s: 131.2 LSB/°/s
±500 °/s: 65.5 LSB/°/s
±10 00°/s: 32.8 LSB/°/s
±200 0°/s: 16.4 LSB/°/s
±1 °/s
0.015 °/s/K
0.014 °/s/√Hz
230, 116, 64, 47, 32,
23, 12 Hz
2000, 1000,
400, 200, 100 Hz
SPI, I²C,
2x digital interrupts
2.4 … 3.6 V
1.2 … 3.6 V
-40 … +85 °C
5.0 mA
2.5 mA
100 samples depth
(each axis)
3 mm x 3 mm x 0.95 mm
10,000 g x 200 μs
Headquarters
Bosch Sensortec GmbH
Gerhard-Kindler-Strasse 8
72770 Reutlingen · Germany
Telephone +49 7121 3535 900
Fax +49 7121 3535 909
contact@bosch-sensortec.com
www.bosch-sensortec.com
| Bosch Sensortec | BMG160
2
Data & Specifi cation are preliminary and subject to change without notice Doc.-Number: BST-BMG160-FL000-01/ Version_0.2_092012
© Bosch Sensortec GmbH reserves all rights in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third par-
ties. BOSCH and the symbols are registered trademarks of Robert Bosch GmbH, Germany.
completely Pb-free
Featuring a full operation current consumption of only
5 mA the BMG160 is ideally suited for battery powe-
red devices, like mobile phones, remote controllers
and mobile gaming devices. In fast power-up mode
the current consumption can be even further reduced
to only 2.5 mA.
The BMG160 offers many con guration possibilites in
order to give the designer full fl exibility when integra-
ting the sensor into the target application. Depending
on the programmable settings the integrated
interrupt engine of the BMG160 signals the occur-
rence of certain events via the sensors‘ interrupt pins.
The corresponding registers of the BMG160 can easily
be set and read-out via the digital sensor interfaces.
The BMG160 features I2C and SPI (3-wire/4-wire)
digital, serial interfaces. Sensor parameters, like
measurement ranges or low-pass lter settings and
also all interrupt engine settings can be easily pro-
grammed via the digital interfaces.
System compatibility
The BMG160 has been designed for best possible t
into modern mobile consumer electronics devices.
Besides the ultra-small footprint and very low power
consumption, the BMG160 has very wide ranges for
VDD and VDDIO supply voltages.
Last but not least, the BMG160 also includes a FIFO
buffer with 100 samples depth for each axis. An
integrated self-test feature facilitates overall system
reliability.
Pin
no.
Name Type Description
1 NC - Not connected
2 VDD Power
supply
Analog power
supply
3 GNDA Power
supply
Analog ground
4 INT1 Input/output Interrupt 1
5 CSB Input Chip select
6 PS Input Protocol Select
7SCL/SCK Input Serial clock
8 SDO Output Serial data out
9SDI/SDA Input /
output
Serial data
in / out
10 VDDIO Power
supply
Power supply
digital interface
11 GNDIO Power
supply
I/O ground
12 INT2 Input/output Interrupt 2
Pin confi guration (top view)
