Preliminary Specification Number : SP-ZZ1CK-E
W-LAN+Bluetooth Combo Module Data Sheet
Cypress Chipset
for 802.11a/b/g/n/ac + Bluetooth 4.1
Tentative P/N : LBEE5ZZ1CK-TEMP
Preliminary
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Murat a M anufacturi ng Co., Ltd.
Preliminary Specification Number : SP-ZZ1CK-E 1 / 32
The revision history of the product specification
Revised No.
Date
Note
-
2014/03/28
First Issue
B
2015/02/11
p4:Addi ng t olerance
p13~20:c hange output power
C
2016/4/14
P23 :corre c t io n output power set t ing
D
2017/3/3
Changed IC Part Num ber
P3:Adde d Certificat ion inf ormat ion
P5:Adde d Label infor mation
P28:Add ed r eference circuit
P29:Added Packing infor mat ion
E
2017/4/12
Revised BT versi on
P3:1. SCOPE
P27:11.10 DC/RF C har acteristics for Bluetooth
（
LE
）
Preliminary
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Preliminary Specification Number : SP-ZZ1CK-E 2 / 32
TABLE OF CONTE NTS
1. SCOPE ....................................................................................................................................................... 3
2. Part Number ............................................................................................................................................... 3
3. Block Diaglam ............................................................................................................................................ 3
4. Certification Information ............................................................................................................................. 3
4.1. Radio Certi ficati on ..................................................................................................................... 3
5. Dimensions，Marking and Terminal Configuration .................................................................................... 4
6. Rating ......................................................................................................................................................... 8
7. Operating Condition ................................................................................................................................... 8
7.1. Oper at in g condition .................................................................................................................... 8
7.2. Power Up Sequ ence .................................................................................................................. 8
7.2.1 Power On Sequence for WLAN ON and BT O N ................................................................... 8
7.2.2 Power On Sequence for WLAN ON and BT O ff .................................................................... 9
7.2.3 Power On Sequence for WLAN OFF and BT O N .................................................................. 9
7.2.4 Power On Sequence for WLAN OFF and BT O FF ................................................................ 9
8 External LPO Signal Requirement ........................................................................................................... 10
9. Digital I/O Requirements .......................................................................................................................... 10
10 Interface timing ...................................................................................................................................... 11
10.1 WLAN SDIO T iming .................................................................................................................. 11
10.1.1 SDIO T iming( Default Mode) .................................................................................................. 11
10.1.2 SDIO T iming( High S pe ed Mode).......................................................................................... 12
10.1.3 SDIO timing(S DR mode) ...................................................................................................... 12
10.1.4 SDIO T iming( DDR50 mode) ................................................................................................ 15
10.2 Bluet ooth UART Timing ........................................................................................................... 17
11 ELECTORICAL CHARACTERISTICS ..................................................................................................... 18
11.1 DC/RF Char act eristics for IEEE802.11b - 2.4G ...................................................................... 18
11.2 DC/RF Char act eristics for IEEE802.11g - 2.4G ...................................................................... 19
11.3 DC/RF Char act eristics for IEEE802.11n - 2.4GHz .................................................................. 20
11.4 DC/RF Char act eristics for IEEE802.11a - 5GHz ..................................................................... 21
11.5 DC/RF Char act eristics for IEEE802.11n(HT 20MHz) - 5GHz ................................................. 22
11.6 DC/RF Char act eristics for IEEE802.11n(HT 40MHz) - 5GHz ................................................. 23
11.7 DC/RF Character ist ics for IEEE80 2.11ac( VHT 40M Hz ) - 5GHz ............................................. 24
11.8 DC/RF Character ist ics for IEEE80 2.11ac( VHT 80M Hz )-5GHz ............................................... 25
11.9 DC/RF Char act eristics for Bl uetooth ....................................................................................... 26
11.10 DC/RF Characteristics for Bluetooth（LE） ........................................................................ 27
12 REFERENCE CIRCUIT........................................................................................................................ 28
13 Packing Information .............................................................................................................................. 29
NOTICE ........................................................................................................................................................... 31
1. Storage Conditions : .................................................................................................................................... 31
2. Handling Conditions :................................................................................................................................... 31
3. Cleaning : ..................................................................................................................................................... 31
4. Operational Environment Conditions : ......................................................................................................... 31
5. Input Power Capacity : ................................................................................................................................. 31
PRECONDITION TO USE OUR PRODUCTS ................................................................................................ 32
Please be aware that an important notice concerning availability, standard warranty and use in critical
applications of Murata products and disclaimers thereto appears at the end of this specification sheet.
Preliminary
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Preliminary Specification Number : SP-ZZ1CK-E 3 / 32
1. SCOPE
This specification is applie d t o t he IEEE802.11a/b/g/n/ac W-LAN + Bluetooth 4.1 combo module.
- Module size : 33.0 x 18.0 mm typ., t = 7.55 mm max.
- IC/Firmware : Cypress CYW4339
- WLAN Host I/F : SDIO3.0
-Bluetooth Host I/F : UART
- Referen ce Clock : 37.4MHz Crystal Oscillator embed ded
- ROM : I nt er nal O TP
- Weight : 2.47g
- RoHS : This module is compliant w it h t he RoHS directiv e.
2. Part Number
Sample Part Number
LBEE5ZZ1CK-TEMP
3. Block Diaglam
4. Certification Information
4.1. Radio Certification
USA/Canada
FCC ID : VPYLB1CK982
IC : 772C-LB1CK982
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5. Dimensions
，
Marking and Terminal Configuration
Dimensions
Shield Case
Internal
Antenna
3.1±0.2
18±0.2
33±0.2
923.7±0.2
φ2.7
±0.1
2.74.3±0.2
1
1516
30
9±0.2
Unit:mm
Indication
< connector＞
P/N: DF17(4.0)-30DP-0.5V (mounted on M urata module)
P/N: DF17(4.0)-30DS-0.5V (need t o place on Customer board)
Maker: HIROSE Electric
Modul e side connector
[HIROSE]
DF17(4.0)-30DP-0.5V
Customer side con nector
[HIROSE]
DF17(4.0)-30DS-0.5V
Module
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Marking
<Top side>
Marking
Meaning
(A)
Part Number
(B)
FCC ID
(C)
IC ID
(D)
Trace Number
(A)
(B)
(C)
ABC
(D)
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Terminal Config uratio ns
No. Terminal Name Type
Connect ion to IC
Terminal
Description
1 VBAT PI
SR_VDDBATP5V
LDO_VDDBAT5V
Power V BAT
2 VBAT PI
SR_VDDBATP5V
LDO_VDDBAT5V
Power V BAT
3
GND
-
-
-
4 VIO PI
PMU_VDDIO
VDDIO
VDDIO_SD
I/O supply for PMU, WLAN, SDIO
5
GND
-
-
-
6 WLAN_REG_ON I WL_REG_ON
Used by PMU to power up or power down
the internal CYW4339 regulators used by
the WLAN sec tion. Also , when
deasserted, this pin holds the WLAN
section in reset. This pin has an internal
200k ohm pull-down resistor that is
enabled by default. It can be disabled
through programming.
7 BT_REG_ON I BT_REG_ON
Used by PMU to power up, or power
down the interna l CYW4339 regulators
used by BT section. Also when
deasserted, this pin holds the BT/FM
section in reset. This pin has an internal
200kohm pull-down resistor that is
enabled by default. It can be disabled by
programming.
8 WLAN_HOST_WAKE I/O GPIO_0
This pin can programmed by S/W to be a
GPIO, or WLAN_HOST_WAKE output
indicating that hos t w ak e-up should be
performed.
9
GND
-
-
-
10 BT_UART_RTS_N O BT_UART_RTS_N
UART request-to-send. Active-low
request to send signal for HCI UART I/F
11 BT_UART_TXD O BT_UART_TXD
UART signal output. Serial data output
for the HCI UART I/F
12 BT_UART_RXD I BT_UART_RXD
UART signal input. Ser ial data input for
the HCI UART I/F
13 BT_UART_CTS_N I BT_UART_CTS_N
UART clear_ to_send.
Active low. Clear to send s ig nal for HCI
UART I/F
14
GND
-
-
-
15
SLEEP_CLK
I
LPO_IN
External S le ep c l ock input(32. 768kHz)
16
GND
-
-
-
17 BT_DEV_WAKE I/O BT_DEV_WAKE
DEV_ W AKE of general purpose I/O
signal
18 BT_HOST_WAKE I/O BT_HOST_WAKE
HOST_WAKE of general purpose I/O
signal
19
GND
-
-
20
SDIO_D2
I/O
SDIO_DATA2
SDIO Data Line 2
21
GND
-
-
-
22
SDIO_D3
I/O
SDIO_DATA3
SDIO Data Line 3
23
GND
-
-
-
24
SDIO_CMD
I/O
SDIO_CMD
SDIO Command Line
25
GND
-
-
-
26
SDIO_CLK
I
SDIO_CLK
SDIO Clock Input
No. Terminal Name Type
Connect ion to IC
Terminal
Description
Preliminary
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27
GND
-
-
-
28
SDIO_D0
I/O
SDIO_DATA0
SDIO Data Line 0
29
GND
-
-
-
30
SDIO_D1
I/O
SDIO_DATA1
SDIO Data Line 1
(1)
(30)
(16)
(15)
Terminal Configuration look ed from a board imp lementation side of the customer
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6. Rating
Parameter
min.
max.
Unit
S tor age Temper ature
-40
85
deg.C
Supply Voltage
VBAT
0
+5
V
VIO
0
+3.9
V
* Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is
not implied under these conditions. Exposure to absolute ratings for extended periods of time may
adversely affect reliability. No damage assuming only one parameter is set at limit at a time with
all other p arameters are set within op erating condit ion.
7. Operating Condition
7.1. Operating condition
Parameter
min.
typ.
max.
unit
Operating Temperature*1
-20
25
80
deg.C
Supply Voltage
VBAT
3.2
3.6
4.4
V
VIO
1.71
1.8
1.89
V
* Surface temperature of shield case
7.2. Po wer Up Se quenc e
-VBAT should not rise 10 % -90%faster tha n 40 microsecond.
-VBAT should be up before or at the same time as VIO. VIO should NOT be present fast or be held
high before VBAT is high.
7.2.1 Power On Sequenc e for WLAN ON and BT ON
32.768kH z Sleep Clock
VBAT
VDDIO
WL_REG_ON
BT_REG_ON
90% of VH
~2 Sleep cycle
VIO
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7.2.2 Power On Sequenc e for WLAN ON and BT OFF
32.768kH z Sleep Clock
VBAT
VDDIO
WL_REG_ON
BT_REG_ON
90% of VH
~2 Sleep cycle
7.2.3 Power O n Sequence for W LAN OFF and BT O N
32.768kH z Sleep Clock
VBAT
VDDIO
WL_REG_ON
BT_REG_ON
90% of VH
~2 Sleep cycle
7.2.4 Power On Sequenc e for WLAN OFF and BT OFF
32.768kH z Sleep Clock
VBAT
VDDIO
WL_REG_ON
BT_REG_ON
VIO
VIO
VIO
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8 External LPO Signa l Requirement
Parameter
External LPO Clock
Unit
Nominal input frequency
32.768
kHz
Frequency ac curacy
+/-200
ppm
Duty cycle
30-70
%
Input signal amplitude
200 - 1800
mVp-p
Signal type
Square-w ave or sine-wave
-
Input impe dance*a
> 100k
< 5
ohm
pF
Clock jitter ( during initial start-up)
<10,000
ppm
a)When power is applied or switch off.
9. Digital I/O Requirements
Digital I/O Pins
Sym
min.
typ.
max.
unit
SDIO Interface I/O Pins@1.8V
Input high voltage
VIH
1.27
-
-
V
Input low v olt age
VIL
-
-
0.58
V
Output hig h voltage@2mA
VOH
1.40
-
-
V
Output low voltage@2mA
VOL
-
-
0.45
V
Other Digital I/O Pins@1.8V
Input high voltage
VIH
0.65 x VIO
-
-
V
Input low v olt age
VIL
-
-
0.35 x VIO
V
Output hig h voltage@2mA
VOH
VIO-0.45
-
-
V
Output low voltage@2mA
VOL
-
-
0.45
V
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10 Interface timing
10.1 WLAN SDIO Timing
10.1.1 SDIO Timing(Default Mode)
SDIO Bus T iming(a) p ar ameters (def ault Mode)
Parameter
Symbol
Min
Typ
Max
Unit
SDIO CLK (All value s are referred t o m inimum VIH and maximum VIL(b)
Frequency-Data Tran sfer Mode
fPP
0
-
25
MHz
Frequency-Identi fication Mode
fOD
0
-
400
kHz
Clock Low Time
tWL
10
-
-
ns
Clock High Time
tWH
10
-
-
ns
Clock Rise Time
tTLH
-
-
10
ns
Clock low Time
tTHL
-
-
10
ns
Input s: CMD, DAT (re ferenced to CLK)
Input Setup Time
tISU
5
-
-
ns
Input Hold Time
tIH
5
-
-
ns
Outputs: CMD, D AT (r eferenced to CLK)
Output Delay time-Data Transfer Mode
tODLY
0
-
14
ns
Output Delay time-Identifi cation Mode
tODLY
0
-
50
ns
(a). Timing is based on CL < 40pF load on CMD and Data.
(b). Min (Vih) = 0.7*VIO and max (Vil) = 0.2*VIO.
CLK
Output
Input
f
PP
t
WH
t
ISU
t
IH
t
ODLY
(min)
t
WL
t
THL
t
TLH
t
ODLY
(max)
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10.1.2 SDIO T im ing( Hi gh S p ee d Mode)
CLK
Input
Output
fPP
tWH
tISU
tIH
tOH
tWL
tTHL
tTLH
tODLY
50% VDD
SDIO Bus T iming(a) parameters (High-Speed Mode)
Parameter
Symbol
Min
Typ
Max
Unit
SDIO CLK (All value s are referred t o m inimum VIH and maximum VIL(b)
Frequency-Data Tran sfer Mode
fPP
0
-
50
MHz
Frequency-Identi fication Mode
fOD
0
-
400
kHz
Clock Low Time
tWL
7
-
-
ns
Clock High Time
tWH
7
-
-
ns
Clock Rise Time
tTLH
-
-
3
ns
Clock low Time
tTHL
-
-
3
ns
Input s: CMD, DAT (re ferenced to CLK)
Input Setup Time
tISU
6
-
-
ns
Input Hold Time
tIH
2
-
-
ns
Outputs: CMD, DAT (refer enced to CLK)
Output Delay time-Data Transfer Mode
tODLY
-
-
14
ns
Output Hold time
tOH
2.5
-
-
ns
Total System Capacitance (each line)
CL
-
-
40
pF
(a). Timing is based on CL < 40pF load on CMD and Data.
(b). Min (Vih) = 0.7*VIO and max (Vil) = 0.2*VIO.
10.1.3 SDIO timing(SDR mode)
Clock T iming
SDIO Bus Clock Timing Parameters(S D R Modes)
Parameter
Symbol
Min
Max
Unit
Comments
-
tclk
40
-
ns
SDR12 mode
20
-
ns
SDR25 mode
10
-
ns
SDR50 mode
4.8
-
ns
SDR104 mode
-
tcr, tcf
-
0.2xtclk
ns
tcr, tcf<2.00ns(max)@100MHz,
Ccard=10pF
tcr, tcf<0.96ns(max)@208MHz,
Ccard=10pF
Clock duty
cycle
-
30
70
%
ns
SDIO_
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Device Input T imin g
SDIO Bus Input T iming Parameters(S DR Modes)
Symbol
Min
Max
Unit
CommentsUnit
SDR104 Mod e
tis
1.4
-
ns
Ccard=10pF, VCT=0.975V
tih
0.8
-
ns
Ccard=5pF, VCT=0.97 5v
SDR50 Mode
tis
3.0
-
ns
Ccard=10pF, VCT=0.9 75V
tih
0.8
-
ns
Ccard=5pF, VCT=0.975V
Device Output T i ming
SDR Modes up to 100MH z
SDIO Bus Output Timing Parameters(SDR Modes up t o 100MHz)
Symbol
Min
Max
Unit
CommentsUnit
todly
-
7.5
ns
tclk>10ns Cl=30pF usi ng driver tyoe B for SDR50
todly
-
14.0
ns
tclk>20ns Cl=40pF usi ng f or SD R 12, SDR25
toh
1.5
-
ns
Hold time at the t odly(min) Cl=15pF
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SDR Modes 100MHz t o 208MHz
SDIO Bus Output Timing Parameters(SDR Mod es 100MHz up to 208MHz)
Symbol
Min
Max
Unit
Comments
top
0
2
UI
Card output phase
⊿
top
-350
+1550
ps
Delay v ar iat ion d ue t o temp change after t uni ng
todw
0.60
-
UI
todw=2.88ns@208MHz
⊿top=+ 1550 ps for ju nction temper ature of ⊿top= 90 degrees durin g operation
⊿top=-350 ps for junction tem per at ure of ⊿top=-20 degrees during oper ation
⊿top=+ 2600 ps for ju nction temper ature of ⊿top=-20 to +125 degrees during operation
⊿top Cons id er ation for Variable Data Window (SDR 104 mode)
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10.1.4 SDIO Timing(DDR50 mode)
SDIO Bus Clock Timing Parameters(DDR50 Mode)
parameter
Symbol
Min
Max
Unit
Comments
-
tclk
20
-
ns
DDR50 mode
-
tcr, tcf
-
0.2xtclk
ns
tcr, tcf<4.00ns(max)@50MHz,
Ccard=10pF
Clock duty cycle
-
45
55
%
-
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Data Timing, DDR50 Mode
SDIO Bus Timing Para meters(DD R5 0 M ode)
parameter
Symbol
Min
Max
unit
Comments
Input C MD
Input setup t i me
tisu
6
-
ns
Ccard<10 pF(1 Card)
Input hold t i me
tih
0.8
-
ns
Ccard<10 pF(1 Card)
Output C MD
Output del ay time
todly
-
13.7
ns
Ccard<30 pF(1 Card)
Output hol d t ime
toh
1.5
-
ns
Ccard<15 pF(1 Card)
Input DAT
Input set up t i me
tisu2x
3
-
ns
Ccard<10 pF(1 Card)
Input hold t i me
tih2x
0.8
-
ns
Ccard<10 pF(1 Card)
Output DAT
Output del ay time
todly2x
-
7.0
ns
Ccard<25 pF(1 Card)
Output hol d t ime
todly2x
1.5
-
ns
Ccard<15 pF(1 Card)
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10.2 Bl uetooth UART Timing
BT_UART_CTS_N
BT_UART_TXD
BT_UART_RXD
BT_UART_RTS_N
Midpoint of STOP bit
3
1
Midpoint of STOP bit
2
Reference
Description
Min
Typ
Max
Unit
1
Delay time, UART_CTS low to UART_TXD valid
-
-
1.5
Bit periods
2
Setup time, UART_CTS high before m i dpoint of stop bit
-
-
0.5
Bit periods
3
Delay time, midpoint of stop bit to UART_RTS high
-
-
0.5
Bit periods
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11 ELECTORICAL CHARACTERIS TICS
11.1 D C/RF Characteri st ics for IEE E802.11b - 2.4G
Normal Condition : 25deg.C, VBAT=3.6V.
11Mbps m ode unless other wise specified.
Items
Contents
Specification
IEEE802.11b-2.4GHz
Mode
DSSS / CCK
Channel frequency
2412 to 2472 MHz
Data rat e
1, 2, 5.5, 11Mbp s
Power setting (Tx power, in dBm)
17
Current Consumption
Min.
Typ.
Max.
unit
(a) Tx mode (99% Tx mode)
-
-
350
mA
(b) Rx mode
-
-
100
mA
Transmitter
Min.
Typ.
Max.
Unit
Power Lev els
15
17
19
dBm
Spectrum Mask
(a) 1st side lobes
-
-
-30
dBr
(b) 2nd side lobes
-
-
-50
dBr
Power-on/off ramp
-
-
2.0
Usec
RF Carrier Suppre ssion
15
-
dB
Modulation Accuracy
-
-
35
%
Spurious Emissions (BW=100kHz)
(a) 10MHz
≦
f<2387MHz
-
-
-36
dBm
(b) 2387MHz
≦
f<2400MHz
-
-
-30
dBm
(c) 2483.5MHz<f
≦
2496.5MHz
-
-
-47
dBm
(d) 2496.5MHz<f
≦
8GHz
-
-
-47
dBm
Receiver
Min.
Typ.
Max.
Unit
Minimum Input Level (FER< 8%)
-
-
-76
dBm
Maximum Input Level ( FE R < 8%)
-10
-
-
dBm
Adjacent Channel Reject ion (FER< 8%)
35
-
-
dB
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11.2 D C/RF Characteri st ics for IEE E802.11g - 2.4G
Normal Condition : 25deg.C, VBAT = 3. 6V.
54Mbp s mode unles s ot herwise specified.
Items
Contents
Specification
IEEE802.11g-2.4GHz
Mode
OFDM
Channel frequency
2412 to 24 72 MHz
Data rat e
6, 9, 12, 18, 24, 36, 48, 54Mbps
Power setting (Tx power, in dBm)
14
Current Consumption
Min.
Typ.
Max.
Unit
(a) Tx mode (99% Tx mode)
-
-
300
mA
(b) Rx mode
-
-
100
mA
Transmitter
Min.
Typ.
Max.
Unit
Power Levels
12
14
16
dBm
Spectrum Mask
(a) at fc +/- 11MHz
-
-
-20
dBr
(b) at fc +/- 20MHz
-
-
-28
dBr
(c) at fc > +/-30MHz
-
-
-40
dBr
Constellat ion Error
-
-
-25
dB
Spurious Emissions (BW=100kHz)
(a) 10MHz
≦
f<2387MHz
-
-
-36
dBm
(b) 2387MHz
≦
f<2400MHz
-
-
-30
dBm
(c) 2483.5MHz<f
≦
2496.5MHz
-
-
-47
dBm
(d) 2496.5MHz<f
≦
8GHz
-
-
-47
dBm
Receiver
Min.
Typ.
Max.
Unit
Minimum Input Level (P ER < 10%)
-
-
-65
dBm
Maximum Input Level ( PE R < 10%)
-20
-
-
dBm
Adjacent Ch annel Reject ion (FER< 10%)
-1
-
-
dB
Preliminary
< Specification m ay be changed by Murat a without notice >
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Preliminary Specification Number : SP-ZZ1CK-E 20 / 32
11.3 D C/RF Characteri st ics for IEE E802.11n - 2.4GHz
Normal Condition : 25deg.C, VBAT = 3. 6V.
65Mbp s ( M CS7) mode un l es s ot her w ise specified.
Items
Contents
Specification
IEEE802.11n-2.4GHz
Mode
OFDM
Channel frequency
2412 to 2472 MHz
Data rat e
6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
Power setting (Tx power, in dBm)
13
Current Consumption
Min.
Typ.
Max.
Unit
(a) Tx mode (99% Tx mode)
-
-
300
mA
(b) Rx mode
-
-
100
mA
Transmitter
Min.
Typ.
Max.
Unit
Power Levels
11
13
15
dBm
Spectrum Mask
(a) at fc +/- 11MHz
-
-
-20
dBr
(b) at fc +/- 20MHz
-
-
-28
dBr
(c) at fc > +/-30MHz
-
-
-45
dBr
Constellat ion Error
-
-
-27
dB
Spurious Emissions (BW=100kHz)
(a) 10MHz
≦
f<2387MHz
-
-
-36
dBm
(b) 2387MHz
≦
f<2400MHz
-
-
-30
dBm
(c) 2483.5MHz<f
≦
2496.5MHz
-
-
-47
dBm
(d) 2496.5MHz<f
≦
8GHz
-
-
-47
dBm
Receiver
Min.
Typ.
Max.
Unit
Minimum Input Level (P ER < 10%)
-
-
-64
dBm
Adjacent Ch annel Reject ion (FER< 10%)
-1
-
-
dB
Preliminary
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Preliminary Specification Number : SP-ZZ1CK-E 21 / 32
11.4 D C/RF Characteri st ics for IEE E802.11a - 5GHz
Nor mal Co n dition : 25deg.C, VB AT =3.6V.
54Mbp s mode unles s ot herwise specified.
Items
Contents
Specification
IEEE802.11a-5GHz
Mode
OFDM
Channel frequency
5180 - 5825MHz
Data rat e
6, 9, 12, 18, 24, 36, 48, 54Mbps
Power setting (Tx power, in dBm)
12
Current Consumption
min.
Typ.
Max.
Unit
(a) Tx mode (99% Tx mode)
-
-
350
mA
(b) Rx mode
-
-
110
mA
Transmitter
min.
Typ.
Max.
Unit
Power Levels
10
12
14
dBm
Spectrum Mask
(a) at fc +/- 11MHz
-
-
-20
dBr
(b) at fc +/- 20MHz
-
-
-28
dBr
(c) at fc > +/-30MHz
-
-
-40
dBr
Constellat ion Error
-
-
-25
dB
Spurious Emissions (BW=100kHz)
(a) 10MHz
≦
f<2387MHz
-
-
-36
dBm
(b) 2387MHz
≦
f<2400MHz
-
-
-30
dBm
(c) 2483.5MHz< f
≦
2496.5MHz
-
-
-47
dBm
(d) 2496.5MHz<f
≦
8GHz
-
-
-47
dBm
Receiver
min.
Typ.
Max.
Unit
Minimum Input Level (P ER < 10%)
-
-
-65
dBm
Adjacent Ch annel Reject ion (FER< 10%)
-1
-
-
dB
Preliminary
< Specification m ay be changed by Murat a without notice >
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Preliminary Specification Number : SP-ZZ1CK-E 22 / 32
11.5 D C/RF Characteri st ics for IEE E802.11n(HT 20MHz) - 5GHz
Normal Condition : 25deg.C, VBAT = 3. 6V.
65Mbps (MCS7 – HT 20MHz) mode unles s ot her wise specifie d.
Items
Contents
Specification
IEEE802.11n-5GHz
Mode
OFDM
Channel frequency
5180 - 5825MHz
Data rat e
6.5, 13, 19. 5, 26, 39, 52, 58.5, 65Mbps
Power setting (Tx power, in dBm)
12
Current Consumption
min.
Typ.
Max.
Unit
(a) Tx mode (99% Tx mode)
-
-
350
mA
(b) Rx mode
-
-
110
mA
Transmitter
min.
Typ.
Max.
Unit
Power Levels
10
12
14
dBm
Spectrum Mask
(a) at fc +/- 11MHz
-
-
-20
dBr
(b) at fc +/- 20MHz
-
-
-28
dBr
(c) at fc > +/-30MHz
-
-
-40
dBr
Constellat ion Error
(measured at enhanced mode)
-
-
-27
dB
Spurious Emissions (BW=100kHz)
(a) 10MHz
≦
f<2387MHz
-
-
-36
dBm
(b) 2387MHz
≦
f<2400MHz
-
-
-30
dBm
(c) 2483.5MHz< f
≦
2496.5MHz
-
-
-47
dBm
(d) 2496.5MHz<f
≦
8GHz
-
-
-47
dBm
Receiver
min.
Typ.
Max.
Unit
Minimum Input Level (P ER < 10%)
-
-
-64
dBm
Adjacent Ch annel Reject ion (FER< 10%)
-1
-
-
dB
Preliminary
< Specification m ay be changed by Murat a without notice >
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Preliminary Specification Number : SP-ZZ1CK-E 23 / 32
11.6 D C/RF Characteri st ics for IEE E802.11n(HT 40MHz) - 5GHz
Normal Condition : 25deg.C, VBAT = 3. 6V.
135Mbps (MCS7 – HT 40MHz) mode unles s ot her wise spec ified.
Items
Contents
Specification
IEEE802.11n-5GHz
Mode
OFDM
Channel frequency
5190 - 5795MHz
Data rat e
13.5, 27, 40.5, 54, 81, 108, 121.5, 135Mbps
Power setting (Tx power, in dBm)
11.5
Current Consumption
min.
Typ.
Max.
Unit
(a) Tx mode (99% Tx mode)
-
-
350
mA
(b) Rx mode
-
-
110
mA
Transmitter
min.
Typ.
Max.
Unit
Power Levels
9.5
11.5
13.5
dBm
Spectrum Mask
(a) at fc +/- 11MHz
-
-
-20
dBr
(b) at fc +/- 20MHz
-
-
-28
dBr
(c) at fc > +/-30MHz
-
-
-40
dBr
Constellat ion Error
(measured at enhanced mode)
-
-
-27
dB
Spurious Emissions (BW=100kHz)
(a) 10MHz
≦
f<2387MHz
-
-
-36
dBm
(b) 2387MHz
≦
f<2400MHz
-
-
-30
dBm
(c) 2483.5MHz< f
≦
2496.5MHz
-
-
-47
dBm
(d) 2496.5MHz<f
≦
8GHz
-
-
-47
dBm
Receiver
min.
Typ.
Max.
Unit
Minimum Input Level (PE R < 10%)
-
-
-61
dBm
Adjacent Ch annel Reject ion (FER< 10%)
-1
-
-
dB
Preliminary
< Specification m ay be changed by Murat a without notice >
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Preliminary Specification Number : SP-ZZ1CK-E 24 / 32
11.7 D C/RF Characteri st ics for IEE E802.11ac(VHT 40MHz) - 5GHz
Normal Condition : 25deg.C, VBAT = 3. 6V.
180Mbps (MCS9 – VHT 40MHz) m ode unless otherwise specif ied.
Items
Contents
Specification
IEEE802.11ac-5GHz
Mode
OFDM
Channel frequency
5190 - 5795MHz
Data rat e
13.5,27,40.5,54,81,108,121.5,135,160,180Mbps
Power setting (Tx power, in dBm)
11.5
Current Consumption
min.
Typ.
Max.
Unit
(a) Tx mode (99% Tx mode)
-
-
350
mA
(b) Rx mode
-
-
130
mA
Transmitter
min.
Typ.
Max.
Unit
Power Levels
9.5
11.5
13.5
dBm
Spectrum Mask
(a) at fc +/- 21MHz
-
-
-20
dBr
(b) at fc +/- 40MHz
-
-
-28
dBr
(c) at fc > +/-60MHz
-
-
-40
dBr
Constellat ion Error
(measured at enhanced mode)
-
-
-32
dB
Spurious Emissions (BW=100kHz)
(a) 10MHz
≦
f<2387MHz
-
-
-36
dBm
(b) 2387MHz
≦
f<2400MHz
-
-
-30
dBm
(c) 2483.5MHz< f
≦
2496.5MHz
-
-
-47
dBm
(d) 2496.5MHz<f
≦
8GHz
-
-
-47
dBm
Receiver
min.
Typ.
Max.
Unit
Minimum Input Level (PE R < 10%)
-
-
-54
dBm
Adjacent Ch annel Reject ion (FER< 10%)
-1
-
-
dB
Preliminary
< Specification m ay be changed by Murat a without notice >
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Preliminary Specification Number : SP-ZZ1CK-E 25 / 32
11.8 D C/RF Characteri st ics for IEE E802.11ac(VHT 80MHz)-5GHz
Normal Condition : 25deg.C, VBAT = 3. 6V.
390Mbps (MCS9 – VHT 80MHz) mode unless otherw ise specified.
Items
Contents
Specification
IEEE802.11ac-5GHz
Mode
OFDM
Channel frequency
5210 - 5775MHz
Data rat e
29.3,58.5,87.8,117,175.5,234,263.3,292.5,351,390Mbps
Power setting (Tx power, in dBm)
11
Current Consumption
min.
Typ.
Max.
Unit
(a) Tx mode (99% Tx mode)
-
-
350
mA
(b) Rx mode
-
-
160
mA
Transmitter
min.
Typ.
Max.
Unit
Power Levels
9
11
13
dBm
Spectrum Mask
(a) at fc +/- 41MHz
-
-
-20
dBr
(b) at fc +/- 80MHz
-
-
-28
dBr
(c) at fc > +/-120MHz
-
-
-40
dBr
Constellation Error
(measured at enhanced mode)
-
-
-32
dB
Spurious Emissions (BW=100kHz)
(a) 10MHz
≦
f<2387MHz
-
-
-36
dBm
(b) 2387MHz
≦
f<2400MHz
-
-
-30
dBm
(c) 2483.5MHz< f
≦
2496.5MHz
-
-
-47
dBm
(d) 2496.5MHz<f
≦
8GHz
-
-
-47
dBm
Receiver
min.
Typ.
Max.
Unit
Minimum Input Level (P ER < 10%)
-
-
-51
dBm
Adjacent Ch annel Reject ion (FER< 10%)
-1
-
-
dB
Preliminary
< Specification m ay be changed by Murat a without notice >
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Preliminary Specification Number : SP-ZZ1CK-E 26 / 32
11.9 D C/RF Characteri st ics for Blu et ooth
Normal co nditions : 25 de g.C, VBAT = 3.6V
Items
Contents
Bluetooth specificat io n (power class)
Version 2.1+ EDR (Class1)
Channel frequency ( spacing)
2402 to 2480 MHz (1MHz)
Current Consumption
Min.
Typ.
Max.
Unit
(a) DH5 Packet 50% Rx/Tx slot duty cycle
-
-
90
mA
(b) 2DH5 Packet 50% Rx/Tx slot duty cycle
-
-
80
mA
(c) 3DH5 Packet 50% Rx/Tx slot duty cycle
-
-
80
mA
Transmitter
Min.
Typ.
Max.
Unit
Output Powe r *1
7
11
15
dBm
Frequency r ange
2400
-
2483.5
MHz
20dB bandw idth
-
1
MHz
Adjacent Channel Power *2
(a) [M-N] =2
-
-
-20
dBm
(b) [M-N] ≥3
-
-
-40
dBm
Modulati on characteristics
(a) Modulation Δf1avg
140
-
175
kHz
(b) Modulation Δf2max
115
-
kHz
(c) Modulation Δf2avg / Δf1avg
0.8
-
-
Carrier Frequency Drift
(a) 1slot
-25
-
+25
kHz
(b) 3slot / 5slot
-40
-
+40
kHz
(c) Maximum drift rate
-20
-
+20
kHz/50us
EDR Relative Pow er
-4
-
+1
dB
EDR Carrier Freq uency Stability and M odulation Accuracy
(a) ωi
-75
-
+75
kHz
(b) ωi+ωo
-75
-
+75
kHz
(c) ωo
-10
-
+10
kHz
(d) RMS DEVM (DQPSK)
-
-
20
%
(e) Pea k DEVM ( DQP S K)
-
-
35
%
(f) 99% DEVM (DQPS K)
-
-
30
%
(g) RMS DEVM (8 DPSK)
-
-
13
%
(h) Pea k DEVM (8 D PSK)
-
-
25
%
(i) 99% DEVM (8DPSK)
-
-
20
%
Spurious Emissions (BW=100kHz)
(a) 10MHz
≦
f<2387MHz
-
-
-36
dBm
(b) 2387MHz
≦
f<2400MHz
-
-
-30
dBm
(c) 2483.5MHz< f
≦
2496.5MHz
-
-
-47
dBm
(d) 2496.5MHz<f
≦
8GHz
-
-
-47
dBm
Receiver
Min.
Typ.
Max.
Unit
Sensitivity (BER<0.1%)
-
-
-80
dBm
C/I Performance (BE R<0.1%) *3
(a) co-channel
-
-
11
dB
(b) 1MHz
-
-
0
dB
(c) 2MHz
-
-
-30
dB
(d) 3MHz
-
-
-40
dB
(e) image (+4MHz)
-
-
-9
dB
(f) image +/- 1MHz
-
-
-20
dB
Maximum Input Level (BER<0.1%)
-20
-
-
dBm
EDR Sen sit iv it y (BE R<0.007%)
(a) 8DPSK
-
-
-77
dBm
*1: Up to three spurious responses within Bluetooth limits are allowed.
*2: Up to five spurious responses within Bluetooth limits are allowed.
Preliminary
< Specification m ay be changed by Murat a without notice >
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Preliminary Specification Number : SP-ZZ1CK-E 27 / 32
11.10 D C/RF Characteri st ics for Blu et ooth
（
LE
）
Normal co nditions : 25 de g.C, VBAT = 3.6V
Items
Contents
Bluetooth specificat io n (power class)
Version 4.1(LE)
Channel frequency ( spacing)
2402 to 2480 MHz (2MHz)
Number o f R F Ch annel
40
Item / Condition
Min.
Typ.
Max.
Unit
Center Frequency
2402
-
2480
MHz
Channel Spaci ng
-
2
-
MHz
Number o f R F channel
-
40
-
-
Output pow er *1
-
-
10
dBm
Modulati on Charact erist ic s
1) Δf1avg
225
-
275
kHz
2) Δf2max (at 99.9%)
185
-
-
kHz
3) Δf2avg / Δf1avg
0.8
-
-
-
Carrier fre quency offset and drift
1) Frequency offset
-
-
150
kHz
2) Frequency drift
-
-
50
kHz
3) Drift rate
-
-
20
kHz
Receiver sensitivity ( PE R < 30.8%)
-
-
-70
dBm
Maximum input signal level (PER < 30. 8% )
-10
-
-
dBm
PER Repor t I ntegrity (-30dBm input)
50
-
65.4
%
Preliminary
< Specification m ay be changed by Murat a without notice >
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Preliminary Specification Number : SP-ZZ1CK-E 28 / 32
12 REFERENCE CIRCUIT
1
2
3
4
5
A B C D E F
1
2
3
4
5
A B C D E F
VBAT 1
VBAT 2
GND 3
VIO 4
GND 5
WLAN_REG_ON 6
BT_REG_ON 7
WLAN_HOST_WAKE 8
GND 9
BT_UART_RTS_N 10
BT_UART_TXD 11
BT_UART_RXD 12
BT_UART_CTS_N 13
GND 14
SLEEP_CLK 15
GND
16
BT_DEV_WAKE
17
BT_HOST_WAKE
18
GND
19
SDIO_D2
20
GND
21
SDIO_D3
22
GND
23
SDIO_CMD
24
GND
25
SDIO_CLK
26
GND
27
SDIO_D0
28
GND
29
SDIO_D1
30
TYPE1CK
GNDGND
SLEEP_CLK_IN(32.768kHz)
BT_UART_TXD
BT_UART_RXD
BT_UART_RTS_N
BT_UART_CTS_N
WLAN_HOST_WAKE
BT_REG_ON
WLAN_REG_ON
BT_DEV_WAKE
BT_HOST_WAKE
VIO
4.7uF
VBAT
1uF
GND GND
SDIO_D2
SDIO_D3
SDIO_CMD
SDIO_CLK
SDIO_D0
SDIO_D1
VIO
100kohm
10kohm~
Preliminary
< Specification m ay be changed by Murat a without notice >
Murat a M anufacturing Co., Ltd.
Preliminary Specification Number : SP-ZZ1CK-E 29 / 32
13 Packing Information
The products shall be packed in the below t r ay.
Number of the products in t he car ton is 210pcs.
There is the 42pcs per tr ay and 5pile number of the tray which stored the prod uct.
Finally, a dum my t r ay is put on the top most par t of tray s.
Packing in a inn er box
Shippin g box
Tray
(
5 sheets)
Tray(Upper lid)
Inner box
cushioning
module
Preliminary
< Specification m ay be changed by Murat a without notice >
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Preliminary Specification Number : SP-ZZ1CK-E 30 / 32
- Please keep any packaging below 40 deg.C until using it up, because a tray is potentially
deformed w it h st orage ov er t he temperature.
- Please don’t stac k the shipping box over 1.5m height to avoid any physical problem.
- Four inner boxes is general number in a shipping box, but it may be dummy for some of inner
boxes.
- One inner box has 210pcs as standard q’ty.
- MOQ is 840pcs, which are constructed two inner boxes.
Shipping Box
Inner Box
Preliminary
< Specification m ay be changed by Murat a without notice >
Murat a M anufacturi ng Co., Ltd.
Preliminary Specification Number : SP-ZZ1CK-E 31 / 32
NOTICE
1. Storage Conditions :
Please use t hi s pr oduct wit hin 6month af t er r eceipt.
- The product shal l be st ored without o pening the p acking under t he ambient temperat ure from 5
to 35deg. C an d humidity from 2 0 t o 70%RH.
(Packing m at er ials, in particular, may be defor med a t the temperature over 40deg.C. )
- The product le f t more than 6mo nt hs after reception, it needs t o be confirmed the solderbilit y
before used.
- The product shal l be st ored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mec hanical shoc k inc luding, but not li m ited t o, s t icking the packing materials by
sharp object and dropping the product, s hall not be applied in or der not to damage the packin g
materials.
2. Handling Conditi ons :
Be careful i n handling or tr ansporting products because exces sive stress or m ec hanical shoc k m ay
break products.
Handle with c ar e if products may have cracks or dama ges on their ter minals, the characteristics o f
products may change. Do not touc h products w it h bear hand s t hat may des t r oy by static electrical
charge.
3. Cleaning :
Since this Product is Mois ture Sensitive, any cleaning is not permitt ed.
4. Operational Environment Conditions :
Products are designed to work for el ect r onic produc ts under nor m al e nvironmental conditions
(ambient temperatur e, humidity and pr essure). Therefore, pr oduc ts have no problems to be used
under the similar cond itions to the above-menti oned. However, if products ar e used under t he
followin g circumstances, it may damage products an d leakage of electricity and abnormal
temperatur e may occur.
- In an atmos phere containing corrosive gas ( Cl 2, NH3, SOx, NOx etc.).
- In an atmos phere containing co mb ust ible and volatile gases.
- Dusty place.
- Direct su nl ig ht place.
- Water splashing place.
- Humid place where wat er condenses.
- Freezing place.
If there are possibilities for products to be used under the prec eding clause, consult with M ur ata
before actual use.
As it might be a cause of degradat ion or destruc t ion t o apply static el ectricity to products, do
not apply static electr icity or excessiv e voltag e w hile assembli ng and measuri ng.
5. Input Power Capacity :
Products shall be us ed in the input power capac ity as specified in t hi s s pecificat ion s.
Inform Murata beforehand, in case that the components are used bey ond such input pow er capac ity
range.
Preliminary
< Specification m ay be changed by Murat a without notice >
Murat a M anufacturi ng Co., Ltd.
Preliminary Specification Number : SP-ZZ1CK-E 32 / 32
PRECONDITION TO USE OUR PRODUCTS
PLEA SE READ THI S NOTICE BEFORE USING OUR PRODUCTS.
Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the
specifications of our product when our product is mounted to your product.
All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that
our product is used for the purpose, under the condition and in the environment specified in this specification. You are
requested not to use our product deviating from the condition and the environment specified in this specification.
Please note that the only warranty that we provide regarding the products is its conformance to the specifications
provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such
products, which are caused under the conditions other than those specified in this specification.
WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED,
INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY
ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECT UA L PROPERTY RIGHTS.
The product shall not be used in any application listed below which requires especially high reliability for the prevention
of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that,
if you use our products in such applications, we will not be responsible for any failure to meet such requirements.
Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS,
DAMAGES, COS TS, AND EXPENSES THAT MAY BE INCURRED, INCLUDI NG W ITHOUT LI MITATION, ATTORNEY
FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.
- Aircraft equ ipment. - Aerospace equipment - Undersea equipment.
- Power plant contr ol equ ipm e nt - Medical equ ipment .
- Transportation equipment (vehicles, trains, ships, elevator, etc.).
- Traffic signa l equip ment . - Disaster prevention / crime prevention equipment.
-Burning / explosion control equipment
- Application of similar complexity and/ or reliability requirements to the applications listed in the above.
We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our
product. Our product cannot be used for the product which is prohibited from being manufactured, use d, and sold by
the regulations and laws in the world.
We do not warrant or represent that any license, either express or implied, is granted under any our patent right,
copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in
which our products or services are used. Information provided by us regarding third-party products or services does not
constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such
information may require a license from a third party under the patents or other intellectual property of the third party, or
a license from us under our patents or other intellectual property.
Please do not use our products, our technical information and other data provided by us for the purpose of developing
of mass-destruction weapons and the purpose of military use.
Moreover, you must comply with " foreign exchange and foreign trade law", the "U.S. export administration regulations",
etc.
Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of
materials and/or components from our suppliers.
By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your
company and that you understand and accept the validity of the contents herein. When you are not able to return the
signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or
approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer
acknowledges that engineering samples may deviate from specifications and may contain defects due to their
development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability
for damages caused by
- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in
the produ ct to be sold by you,
-deviation or lapse in function of engineering sample,
-improper use of engineering samples.
We discla im any liabi lity for co nseq uent ial and incidental damages.
If you can’t agree the above contents, you should inquire our sales.
Preliminary
< Specification m ay be changed by Murat a without notice >
Murat a M anufacturi ng Co., Ltd.