Description
These diode-transistor optocouplers
use an insulating layer between a
LED and an integrated
photodetector to provide electrical
insulation between input and
output. Separate connections for
the photodiode bias and output-
transistor collector increase the
speed up to a hundred times that of
a conventional phototransistor
coupler by reducing the base-
collector capacitance.
Agilent HCPL-250L/ 050L/253L/053L
LVTTL/LVCMOS Compatible 3.3 V
Optocouplers (1 Mb/s)
Data Sheet
Features
• Low power consumption
• High speed: 1 Mb/s
• LVTTL/LVCMOS compatible
• Available in 8-pin DIP, SO-8
• Open collector output
• Guaranteed performance from
temperature: 0˚C to +70˚C
• Safety approval, UL, CSA, IEC/EN/DIN
EN 60747-5-2
Applications
• High voltage insulation
• Video signal isolation
• Power translator isolation in motor
drives
• Line receivers
• Feedback element in switched mode
power supplies
• High speed logic ground isolation –
LVTTL/LVCMOS
• Replaces pulse transformers
• Replaces slow phototransistor
isolators
• Analog signal ground isolation
Functional Diagram
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent
damage and/or degradation which may be induced by ESD.
These optocouplers are available
in an 8-pin DIP and in an industry
standard SO-8 package. The
following is a cross reference
table listing the 8-pin DIP part
number and the electrically
equivalent SO-8 part number.
The SO-8 does not require
"through holes" in a PCB. This
package occupies approximately
one-third the footprint area of the
7
1
2
3
45
6
8
ANODE
1
CATHODE
1
CATHODE
2
ANODE
2
V
CC
V
O1
V
O2
GND
HCPL–253L/HCPL–053L
7
1
2
3
45
6
8
NC
ANODE
CATHODE
NC
V
CC
V
B
V
O
GND
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
V
O
LOW
HIGH
HCPL–250L/HCPL–050L
2
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-250L #XXXX
060 = IEC/EN/DIN EN 60747-5-2 VIORM
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
Option data sheets available. Contact Agilent sales representative or
authorized distributor for information.
Schematic
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
These optocouplers can be used
in LVTTL/LVCMOS or wide
bandwidth analog applications.
The common mode transient
immunity of 1000 V/µs minimum
to typical at VCM = 10 V
guaranteed for these
optocouplers.
8-Pin DIP SO-8 Package
HCPL-250L HCPL-050L
HCPL-253L HCPL-053L
I
F1
SHIELD
8
7
V
CC
+
2
V
O1
I
CC
V
F1
I
O1
1
–
I
F2
6
5GND
–
4
V
O2
V
F2
I
O2
3
+
I
F
SHIELD
8
6
5GND
V
CC
2
3
V
O
I
CC
V
F
I
O
ANODE
CATHODE
+
–
7V
B
I
B
*
HCPL-250L/HCPL-050L HCPL-253L/HCPL-053L
Remarks: The notation “#” is used for existing products, while (new)
products launched since 15th July 2001 and lead free option will use “-”
3
Package Outline Drawings
8-Pin DIP Package
1.080 ± 0.320
(0.043 ± 0.013) 2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
5° TYP. 0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXXZ
YYWW
DATE CODE
DIMENSIONS IN MILLIMETERS AND (INCHES).
5678
4321
OPTION CODE*
UL
RECOGNITION
UR
TYPE NUMBER
* MARKING CODE LETTER FOR OPTION NUMBERS
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
Small Outline SO-8 Package
XXXV
YWW
8765
4321
5.994 ± 0.203
(0.236 ± 0.008)
3.937 ± 0.127
(0.155 ± 0.005)
0.406 ± 0.076
(0.016 ± 0.003) 1.270
(0.050)BSC
5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005) 1.524
(0.060)
45° X 0.432
(0.017)
0.228 ± 0.025
(0.009 ± 0.001)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0.305
(0.012)MIN.
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
7°
PIN ONE
0 ~ 7°
*
*
7.49 (0.295)
1.9 (0.075)
0.64 (0.025)
LAND PATTERN RECOMMENDATION
4
Solder Reflow Temperature Profile Regulatory Information
The devices contained in this
data sheet have been approved by
the following organizations:
UL
Approval under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approval under CSA Component
Acceptance
Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
Recommended Pb-Free IR Profile
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK
TEMP.
240°CPEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150°C, 90 + 30 SEC.
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
217 °C
RAMP-DOWN
6 °C/SEC. MAX.
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
260 +0/-5 °C
t 25 °C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERA TURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
5
Insulation and Safety Related Specifications
8-Pin DIP
(300 Mil) SO-8
Parameter Symbol Value Value Units Conditions
Minimum External Air L (101) 7.1 4.9 mm Measured from input terminals to output
Gap (External Clearance) terminals, shortest distance through air.
Minimum External Tracking L (102) 7.4 4.8 mm Measured from input terminals to output
(External Creepage) terminals, shortest distance path along body.
Minimum Internal Plastic 0.08 0.08 mm Through insulation distance, conductor to
Gap (Internal Clearance) conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
Tracking Resistance CTI 200 200 Volts DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking
Index)
Isolation Group IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1)
IEC/EN/DIN EN 60747-5-2Insulation Related Characteristics
Description Symbol PDIP Option 060 SO-8 Option 60 Units
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤ 150 V rms I-IV
for rated mains voltage ≤ 300 V rms I-IV I-III
for rated mains voltage ≤ 600 V rms I-III I-II
Climatic Classification 55/85/21 55/85/21
Pollution Degree (DIN VDE 0110/1.89) 2 2
Maximum Working Insulation Voltage VIORM 630 566 Vpeak
Input to Output Test Voltage, Method b*
VIORM x 1.875 = VPR, 100% Production Test VPR 1181 1063 Vpeak
with tm = 1 sec, Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
VIORM x 1.5 = VPR, Type and Sample Test, VPR 945 849 Vpeak
tm = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage* VIOTM 6000 4000 Vpeak
(Transient Overvoltage, tini = 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 16, Thermal Derating curve.)
Case Temperature TS175 150 ˚C
Input Current IS,INPUT 230 150 mA
Output Power PS,OUTPUT 600 600 mW
Insulation Resistance at TS, VIO = 500 V RS≥ 109≥ 109Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
6
Absolute Maximum Ratings
Parameter Symbol Min. Max. Units Note
Storage Temperature TS–55 125 °C
Operating Temperature TA–55 100 °C
–55 85
Average Forward Input Current IF(AVG) 25 mA 1
Peak Forward Input Current IF(PEAK) 2
(50% duty cycle, 1 ms pulse width) 50 mA
(50% duty cycle, 1 ms pulse width) 40
Peak Transient Input Current IF(TRANS) 1A
(≤ 1 µs pulse width, 300 pps)
0.1
Reverse LED Input Voltage (Pin 3-2) VR5V
Input Power Dissipation PIN 45 mW 3
4
Average Output Current (Pin 6) IO(AVG) 8mA
Peak Output Current IO(PEAK) 16 mA
Emitter-Base Reverse Voltage VEBR 5V
Supply Voltage (Pin 8-5) VCC –0.5 7 V
Output Voltage (Pin 6-5) VO–0.5 7 V
Base Current IB5mA
Output Power Dissipation PO100 mW 4
Lead Solder Temperature
(Through Hole Parts Only)
1.6 mm below seating plane, 10 sec. TLS 260 °C
up to seating plane, 10 seconds 260 °C
Reflow Temperature Profile TRP See Package Outline Drawings
section
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Power Supply Voltage VCC 2.7 3.6 V
Forward Input Current IF(ON) 16 20 mA
Forward Input Voltage VF(OFF) 00.8V
Operating Temperature TA085°C
7
Electrical Specifications (DC)
Over Recommended Temperature (TA = 0˚C to +70˚C), VCC = 3.3 V, IF = 16 mA, unless otherwise specified. See Note 13.
Parameter Sym. Device Min. Typ. Max. Units Test Conditions Fig. Note
Current Transfer CTR % TA = 25˚C VO = 0.4 V IF = 16 mA, 2 5, 11
VCC = 3.3 V
15 20 50
Logic Low VOL VI
F = 16 mA,
VCC = 3.3 V
0.05 0.3 TA = 25˚C IO = 3.0 mA
Logic High IOH 0.003 1 µAT
A = 25˚C VO = VCC = 3.3 V IF = 0 mA 3
Output Current
Logic Low ICCL 43.0 100 µAI
F = 16 mA, VO = Open, VCC = 3.3 V 13
Supply Current Dual 300
Logic High ICCH 0.005 0.3 µAT
A = 25˚C IF = 0 mA, VO = Open, 13
Supply Current Dual 10 VCC = 3.3 V
Input Forward VF1.52 1.7 V TA = 25˚C IF = 16 mA 1
Voltage
Input Reverse BVR5VI
R = 10 µA
Breakdown
Voltage
Input CIN 60 pF f = 1 MHz, VF = 0 V
Capacitance
Ratio
Output Voltage
Switching Specifications (AC)
Over Recommended Temperature (TA = 0˚C to +70˚C), VCC = 3.3 V, IF = 16 mA unless otherwise specified.
All typicals at VCC = 3.3 V, TA = 25°C.
Parameter Sym. Device Min. Typ.* Max. Units Test Conditions Fig. Note
Propagation tPHL 0.35 1 µsR
L = 1.9 kΩ5 8, 9
Delay Time to
Logic Low at
Output
Propagation tPLH 0.65 1 µsR
L = 1.9 kΩ5 8, 9
Delay Time to
Logic High at
Output
Common Mode |CM
H
|1kV/µsR
L = 4.1 kΩIF = 0 mA, TA = 25˚C, 6 7, 8, 9
Transient RL = 1.9 kΩVCM = 10 Vp-p
Immunity at CL = 15 pF
Logic High
Level Output
Common Mode |CM
L
|1kV/µsR
L = 4.1 kΩIF = 16 mA, TA = 25˚C, 6 7, 8, 9
Transient RL = 1.9 kΩVCM = 10 Vp-p
Immunity at CL = 15 pF
Logic Low
Level Output
*All typicals at TA = 25˚C
8
Package Characteristics
Over Recommended Temperature (TA = 0˚C to 70˚C) unless otherwise specified.
Parameter Sym. Device Min. Typ.* Max. Units Test Conditions Fig. Note
Input-Output VISO 8-Pin DIP 3750 V rms RH < 50%, 6, 14
Momentary SO-8 t = 1 min.,
Withstand TA = 25˚C
Voltage**
II-O 8-Pin DIP 1 µA 45% RH, t = 5 s, 6, 16
VI-O = 3 kVdc,
TA = 25˚C
Input-Output RI-O 8-Pin DIP 1012 ΩVI-O = 500 Vdc 6
Resistance SO-8
Input-Output CI-O 8-Pin DIP 0.6 pF f = 1 MHz 6
Capacitance SO-8
*All typicals at TA = 25˚C.
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous
voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table (if applicable),
your equipment level safety specification or Agilent Application Note 1074 entitled "Optocoupler Input-Output Endurance Voltage," publication
number 5963-2203E.
Notes:
1. Derate linearly above 70˚C free-air temperature at a rate of 0.8 mA/˚C (8-Pin DIP).
Derate linearly above 85˚C free-air temperature at a rate of 0.5 mA/˚C (SO-8).
2. Derate linearly above 70˚C free-air temperature at a rate of 1.6 mA/˚C (8-Pin DIP).
Derate linearly above 85˚C free-air temperature at a rate of 1.0 mA/˚C (SO-8).
3. Derate linearly above 70˚C free-air temperature at a rate of 0.9 mW/˚C (8-Pin DIP).
Derate linearly above 85˚C free-air temperature at a rate of 1.1 mW/˚C (SO-8).
4. Derate linearly above 70˚C free-air temperature at a rate of 2.0 mW/˚C (8-Pin DIP).
Derate linearly above 85˚C free-air temperature at a rate of 2.3 mW/˚C (SO-8).
5. CURRENT TRANSFER RATIO in percent is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100.
6. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.
7. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt on the leading edge of the common
mode pulse signal, VCM, to assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a
Logic Low level is the maximum tolerable (negative) dVCM/dt on the trailing edge of the common mode pulse signal, VCM, to assure that the
output will remain in a Logic Low state (i.e., VO < 0.8 V).
8. The 1.9 kΩ load represents 1 TTL unit load of 1.6 mA and the 5.6 mA kΩ pull-up resistor.
9. The 4.1 kΩ load represents 1 LSTTL unit load of 0.36 mA and 6.1 kΩ pull-up resistor.
10. The frequency at which the AC output voltage is 3 dB below its mid-frequency value.
11. The JEDEC registration for the 6N136 specifies a minimum CTR of 15%. Agilent guarantees a minimum CTR of 15%.
12. See Option 020 data sheet for more information.
13. Use of a 0.1 µf bypass capacitor connected between pins 5 and 8 is recommended.
14. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 V rms for 1 second (leakage
detection current limit, II-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation
Related Characteristics Table, if applicable.
15. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 second (leakage
detection current limit, II-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation
Related Characteristics Table, if applicable.
16. This rating is equally validated by an equivalent AC proof test.
9
Figure 1. Input current vs. forward voltage. Figure 2. Current transfer ratio vs.
temperature.
Figure 3. Logic high output current vs.
temperature.
VF – FORWARD VOLTAGE – VOLTS
100
10
0.1
0.01
1.1 1.2 1.3 1.4
IF – FORWARD CURRENT – mA
1.61.5
1.0
0.001
1000
IF
VF
+T = 25°C
A
–
8 PIN DIP, SO-8
T
A
– TEMPERATURE – °C
I = 0
V = V = 3.3 V
CCO
F
-50 -25 0 +25 +50 +75 +100
10+4
10-2
10-1
100
10+1
10+2
10+3
I
OH
– LOGIC HIGH OUTPUT CURRENT – nA
-75
8 PIN DIP, SO-8
1.1
1.0
0.9
0.8
0.7
0.6
-60 -20 0 80
NORMALIZED CURRENT TRANSFER RATIO
T
A
– TEMPERATURE – °C
F
CC
A
8 PIN DIP, SO-8
-40 20 40 60 100
O
NORMALIZED
I = 16 mA
V = 0.4 V
V = 3.3 V
T = 25°C
Figure 4. Thermal derating curve, dependence
of safety limiting value with case temperature
per IEC/EN/DIN EN 60747-5-2.
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
0
0
T
S
– CASE TEMPERATURE – °C
20050
400
12525 75 100 150
600
800
200
100
300
500
700 P
S
(mW)
I
S
(mA)
175
Figure 6. Test circuit for transient immunity and typical waveforms.
Figure 5. Switching test circuit.
O
V 3.3 V
OL
V
O
V
0 V 10% 90% 90% 10%
SWITCH AT A: I = 0 mA
F
SWITCH AT B: I = 16 mA
F
CM
V
trtf
7
1
2
3
45
6
8
VO
0.1 µF
L
R
+3.3 V
PULSE GEN.
VCM
+–
V
IF
*
A
B
FF
VO
PULSE
GEN.
Z = 50 Ω
t = 5 ns
O
r
I MONITOR
F
IF
0.1µF
L
R
CL = 1.5 µF
RM
0
tPHL tPLH
O
V
IF
OL
V
50%
+3.3 V
1
2
3
4
8
7
6
5
50%
10% DUTY CYCLE
1/f < 100 µS
10
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For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
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(916) 788-6763
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5989-0300EN
December 20, 2004
5989-2111EN
