MC68HC05B4 MC68HC705B5 MC68HC05B5 MC68HC05B6 MC68HC05B8 MC68HC05B16 MC68HC705B16 MC68HC705B16N MC68HC05B32 MC68HC705B32 Technical Data M68HC05 Microcontrollers MC68HC05B6/D Rev. 4.1 08/2005 freescale.com INTRODUCTION 1 MODES OF OPERATION AND PIN DESCRIPTIONS 2 MEMORY AND REGISTERS 3 INPUT/OUTPUT PORTS 4 PROGRAMMABLE TIMER 5 SERIAL COMMUNICATIONS INTERFACE 6 PULSE LENGTH D/A CONVERTERS 7 ANALOG TO DIGITAL CONVERTER 8 RESETS AND INTERRUPTS 9 CPU CORE AND INSTRUCTION SET 10 ELECTRICAL SPECIFICATIONS 11 MECHANICAL DATA 12 ORDERING INFORMATION 13 APPENDICES 14 HIGH SPEED OPERATION 15 TPG 2 1 INTRODUCTION 2 MODES OF OPERATION AND PIN DESCRIPTIONS 3 MEMORY AND REGISTERS 4 INPUT/OUTPUT PORTS 5 PROGRAMMABLE TIMER 6 SERIAL COMMUNICATIONS INTERFACE 7 PULSE LENGTH D/A CONVERTERS 8 ANALOG TO DIGITAL CONVERTER 9 RESETS AND INTERRUPTS 10 CPU CORE AND INSTRUCTION SET 11 ELECTRICAL SPECIFICATIONS 12 MECHANICAL DATA 13 ORDERING INFORMATION 14 APPENDICES 15 HIGH SPEED OPERATION TPG 3 CUSTOMER FEEDBACK QUESTIONNAIRE (MC68HC05B6/D rev. 4) Motorola wishes to continue to improve the quality of its documentation. 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Too little detail SECTION 1 INTRODUCTION SECTION 2 MODES OF OPERATION AND PIN DESCRIPTIONS SECTION 3 MEMORY AND REGISTERS SECTION 4 INPUT/OUTPUT PORTS SECTION 5 PROGRAMMABLE TIMER SECTION 6 SERIAL COMMUNICATIONS INTERFACE SECTION 7 PULSE LENGTH D/A CONVERTERS SECTION 8 ANALOG TO DIGITAL CONVERTER SECTION 9 RESETS AND INTERRUPTS SECTION 10 CPU CORE AND INSTRUCTION SET SECTION 11 ELECTRICAL SPECIFICATIONS SECTION 12 MECHANICAL DATA SECTION 13 ORDERING INFORMATION SECTION 14 APPENDICES SECTION 15 HIGH SPEED OPERATION Too much detail Comments: 6. Have you found any errors? If so, please comment: 7. From your point of view, is anything missing from the document? If so, please say what: TPG 4 8. How could we improve this document? 9. How would you rate Motorola's documentation? Excellent - In general - Against other semiconductor suppliers Poor 10. Which semiconductor manufacturer provides the best technical documentation? 11. 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Name: Phone No: Position: FAX No: Department: Company: Address: Thank you for helping us improve our documentation, Graham Forbes, Technical Publications Manager, Motorola Ltd., Scotland. TPG - Finally, tuck this edge into opposite flap - 5 MC68HC05B6 High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit All Trade Marks recognized. This document contains information on new products. Specifications and information herein are subject to change without notice. All products are sold on Freescale's Terms & Conditions of Supply. In ordering a product covered by this document the Customer agrees to be bound by those Terms & Conditions and nothing contained in this document constitutes or forms part of a contract (with the exception of the contents of this Notice). A copy of Freescale's Terms & Conditions of Supply is available on request. Freescale reserves the right to make changes without further notice to any products herein. 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Freescale products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale was negligent regarding the design or manufacture of the part. Freescale, Inc. is an Equal Opportunity/Affirmative Action Employer. The Customer should ensure that it has the most up to date version of the document by contacting its local Freescale office. This document supersedes any earlier documentation relating to the products referred to herein. The information contained in this document is current at the date of publication. It may subsequently be updated, revised or withdrawn. Freescale LTD., 2005 TPG 6 Conventions Where abbreviations are used in the text, an explanation can be found in the glossary, at the back of this manual. Register and bit mnemonics are defined in the paragraphs describing them. An overbar is used to designate an active-low signal, eg: RESET. Unless otherwise stated, shaded cells in a register diagram indicate that the bit is either unused or reserved; `u' is used to indicate an undefined state (on reset). Unless otherwise stated, pins labelled "NU" should be tied to VSS in an electrically noisy environment. Pins labelled "NC" can be left floating, since they are not bonded to any part of the device. TPG 6 TABLE OF CONTENTS Paragraph Number TITLE Page Number 1 INTRODUCTION 1.1 1.2 Features.............................................................................................................1-2 Mask options for the MC68HC05B6 ..................................................................1-3 2 MODES OF OPERATION AND PIN DESCRIPTIONS 2.1 Modes of operation ............................................................................................2-1 2.1.1 Single chip mode .........................................................................................2-1 2.2 Serial RAM loader .............................................................................................2-2 2.3 `Jump to any address'........................................................................................2-4 2.4 Low power modes..............................................................................................2-6 2.4.1 STOP ...........................................................................................................2-6 2.4.2 WAIT ............................................................................................................2-8 2.4.2.1 Power consumption during WAIT mode .................................................2-8 2.4.3 SLOW mode.................................................................................................2-9 2.4.3.1 Miscellaneous register...........................................................................2-9 2.5 Pin descriptions ..............................................................................................2-10 2.5.1 VDD and VSS ............................................................................................2-10 2.5.2 IRQ ............................................................................................................2-10 2.5.3 RESET .......................................................................................................2-10 2.5.4 TCAP1 .......................................................................................................2-10 2.5.5 TCAP2 .......................................................................................................2-11 2.5.6 TCMP1.......................................................................................................2-11 2.5.7 TCMP2.......................................................................................................2-11 2.5.8 OSC1, OSC2 .............................................................................................2-11 2.5.8.1 Crystal ..................................................................................................2-11 2.5.8.2 Ceramic resonator................................................................................2-11 2.5.8.3 External clock .......................................................................................2-12 2.5.9 RDI (Receive data in).................................................................................2-13 2.5.10 TDO (Transmit data out) ............................................................................2-13 2.5.11 SCLK..........................................................................................................2-13 2.5.12 PLMA .........................................................................................................2-13 MC68HC05B6 Rev. 4.1 TABLE OF CONTENTS Freescale i Paragraph Number 2.5.13 2.5.14 2.5.15 2.5.16 2.5.17 2.5.18 TABLE OF CONTENTS Page Number PLMB ......................................................................................................... 2-13 VPP1.......................................................................................................... 2-13 VRH ........................................................................................................... 2-13 VRL............................................................................................................ 2-13 PA0 - PA7/PB0 - PB7/PC0 - PC7 ............................................................ 2-13 PD0/AN0-PD7/AN7................................................................................... 2-13 3 MEMORY AND REGISTERS 3.1 3.2 3.3 3.4 3.5 3.5.1 3.5.2 3.5.3 3.5.4 3.5.5 3.6 3.7 3.8 Registers ........................................................................................................... 3-1 RAM .................................................................................................................. 3-1 ROM .................................................................................................................. 3-1 Self-check ROM ................................................................................................ 3-2 EEPROM ........................................................................................................... 3-3 EEPROM control register ............................................................................ 3-3 EEPROM read operation ............................................................................. 3-5 EEPROM erase operation ........................................................................... 3-5 EEPROM programming operation ............................................................... 3-6 Options register (OPTR) .............................................................................. 3-6 EEPROM during STOP mode ........................................................................... 3-7 EEPROM during WAIT mode ............................................................................ 3-7 Miscellaneous register...................................................................................... 3-9 4 INPUT/OUTPUT PORTS 4.1 Input/output programming ................................................................................. 4-1 4.2 Ports A and B .................................................................................................... 4-2 4.3 Port C ................................................................................................................ 4-3 4.4 Port D ................................................................................................................ 4-3 4.5 Port registers ..................................................................................................... 4-4 4.5.1 Port data registers A and B (PORTA and PORTB) ...................................... 4-4 4.5.2 Port data register C (PORTC)...................................................................... 4-4 4.5.3 Port data register D (PORTD)...................................................................... 4-5 4.5.3.1 A/D status/control register...................................................................... 4-5 4.5.4 Data direction registers (DDRA, DDRB and DDRC).................................... 4-5 4.6 Other port considerations .................................................................................. 4-6 Freescale ii TABLE OF CONTENTS MC68HC05B6 Rev. 4.1 Paragraph Number TABLE OF CONTENTS Page Number 5 PROGRAMMABLE TIMER 5.1 5.1.1 5.2 5.2.1 5.2.2 5.3 5.3.1 5.3.2 5.4 5.4.1 5.4.2 5.4.3 5.5 5.5.1 5.6 5.7 5.8 Counter ..............................................................................................................5-1 Counter register and alternate counter register ...........................................5-3 Timer control and status ....................................................................................5-4 Timer control register (TCR) ........................................................................5-4 Timer status register (TSR)..........................................................................5-6 Input capture......................................................................................................5-7 Input capture register 1 (ICR1) ....................................................................5-7 Input capture register 2 (ICR2) ....................................................................5-8 Output compare .................................................................................................5-9 Output compare register 1 (OCR1)..............................................................5-9 Output compare register 2 (OCR2)............................................................5-10 Software force compare .............................................................................5-11 Pulse Length Modulation (PLM) ......................................................................5-11 Pulse length modulation registers A and B (PLMA/PLMB) ........................5-11 Timer during STOP mode................................................................................5-12 Timer during WAIT mode.................................................................................5-12 Timer state diagrams .......................................................................................5-12 6 SERIAL COMMUNICATIONS INTERFACE 6.1 6.2 6.3 6.4 6.5 6.6 6.6.1 6.6.2 6.7 6.8 6.9 6.10 6.11 6.11.1 6.11.2 6.11.3 6.11.4 6.11.5 6.12 6.13 6.14 SCI two-wire system features ............................................................................6-1 SCI receiver features .........................................................................................6-3 SCI transmitter features.....................................................................................6-3 Functional description........................................................................................6-3 Data format ........................................................................................................6-5 Receiver wake-up operation ..............................................................................6-5 Idle line wake-up ..........................................................................................6-6 Address mark wake-up ................................................................................6-6 Receive data in (RDI) ........................................................................................6-6 Start bit detection...............................................................................................6-6 Transmit data out (TDO) ....................................................................................6-8 SCI synchronous transmission ..........................................................................6-9 SCI registers ....................................................................................................6-10 Serial communications data register (SCDR) ............................................6-10 Serial communications control register 1 (SCCR1) ...................................6-10 Serial communications control register 2 (SCCR2) ...................................6-14 Serial communications status register (SCSR)..........................................6-16 Baud rate register (BAUD) .........................................................................6-18 Baud rate selection ..........................................................................................6-19 SCI during STOP mode ...................................................................................6-21 SCI during WAIT mode....................................................................................6-21 MC68HC05B6 Rev. 4.1 TABLE OF CONTENTS Freescale iii Paragraph Number TABLE OF CONTENTS Page Number 7 PULSE LENGTH D/A CONVERTERS 7.1 7.2 7.3 7.4 Miscellaneous register....................................................................................... 7-3 PLM clock selection........................................................................................... 7-4 PLM during STOP mode ................................................................................... 7-4 PLM during WAIT mode .................................................................................... 7-4 8 ANALOG TO DIGITAL CONVERTER 8.1 8.2 8.2.1 8.2.2 8.2.3 8.3 8.4 8.5 A/D converter operation..................................................................................... 8-1 A/D registers...................................................................................................... 8-3 Port D data register (PORTD)...................................................................... 8-3 A/D result data register (ADDATA) ............................................................... 8-3 A/D status/control register (ADSTAT)........................................................... 8-4 A/D converter during STOP mode..................................................................... 8-6 A/D converter during WAIT mode...................................................................... 8-6 Port D analog input............................................................................................ 8-6 9 RESETS AND INTERRUPTS 9.1 Resets ............................................................................................................... 9-1 9.1.1 Power-on reset............................................................................................. 9-2 9.1.2 Miscellaneous register ................................................................................ 9-2 9.1.3 RESET pin ................................................................................................... 9-3 9.1.4 Computer operating properly (COP) watchdog reset .................................. 9-3 9.1.4.1 COP watchdog during STOP mode ....................................................... 9-4 9.1.4.2 COP watchdog during WAIT mode ........................................................ 9-4 9.1.5 Functions affected by reset.......................................................................... 9-5 9.2 Interrupts ........................................................................................................... 9-6 9.2.1 Interrupt priorities......................................................................................... 9-6 9.2.2 Nonmaskable software interrupt (SWI) ........................................................ 9-6 9.2.3 Maskable hardware interrupts ..................................................................... 9-7 9.2.3.1 External interrupt (IRQ).......................................................................... 9-7 9.2.3.2 Miscellaneous register .......................................................................... 9-9 9.2.3.3 Timer interrupts .................................................................................... 9-10 9.2.3.4 Serial communications interface (SCI) interrupts................................. 9-10 9.2.4 Hardware controlled interrupt sequence.................................................... 9-11 Freescale iv TABLE OF CONTENTS MC68HC05B6 Rev. 4.1 Paragraph Number TABLE OF CONTENTS Page Number 10 CPU CORE AND INSTRUCTION SET 10.1 Registers .........................................................................................................10-1 10.1.1 Accumulator (A) .........................................................................................10-2 10.1.2 Index register (X)........................................................................................10-2 10.1.3 Program counter (PC) ................................................................................10-2 10.1.4 Stack pointer (SP) ......................................................................................10-2 10.1.5 Condition code register (CCR)...................................................................10-2 10.2 Instruction set ..................................................................................................10-3 10.2.1 Register/memory Instructions ....................................................................10-4 10.2.2 Branch instructions ....................................................................................10-4 10.2.3 Bit manipulation instructions ......................................................................10-4 10.2.4 Read/modify/write instructions ...................................................................10-4 10.2.5 Control instructions ....................................................................................10-4 10.2.6 Tables.........................................................................................................10-4 10.3 Addressing modes .........................................................................................10-11 10.3.1 Inherent....................................................................................................10-11 10.3.2 Immediate ................................................................................................10-11 10.3.3 Direct........................................................................................................10-11 10.3.4 Extended..................................................................................................10-12 10.3.5 Indexed, no offset.....................................................................................10-12 10.3.6 Indexed, 8-bit offset..................................................................................10-12 10.3.7 Indexed, 16-bit offset................................................................................10-12 10.3.8 Relative ....................................................................................................10-13 10.3.9 Bit set/clear ..............................................................................................10-13 10.3.10 Bit test and branch ...................................................................................10-13 11 ELECTRICAL SPECIFICATIONS 11.1 11.2 11.2.1 11.2.2 11.3 11.4 Absolute maximum ratings ..............................................................................11-1 DC electrical characteristics ............................................................................11-2 IDD trends for 5V operation ........................................................................11-3 IDD trends for 3.3V operation .....................................................................11-6 A/D converter characteristics...........................................................................11-8 Control timing ................................................................................................11-10 12 MECHANICAL DATA 12.1 MC68HC05B family pin configurations ............................................................12-1 12.1.1 52-pin plastic leaded chip carrier (PLCC) ..................................................12-1 12.1.2 64-pin quad flat pack (QFP) .......................................................................12-2 MC68HC05B6 Rev. 4.1 TABLE OF CONTENTS Freescale v Paragraph Number TABLE OF CONTENTS Page Number 12.1.3 56-pin shrink dual in line package (SDIP).................................................. 12-3 12.2 MC68HC05B6 mechanical dimensions ........................................................... 12-4 12.2.1 52-pin plastic leaded chip carrier (PLCC) .................................................. 12-4 12.2.2 64-pin quad flat pack (QFP)....................................................................... 12-5 12.2.3 56-pin shrink dual in line package (SDIP).................................................. 12-6 13 ORDERING INFORMATION 13.1 13.2 13.3 EPROMS ......................................................................................................... 13-2 Verification media ............................................................................................ 13-2 ROM verification units (RVU)........................................................................... 13-2 A MC68HC05B4 A.1 A.2 Features ........................................................................................................... A-1 Self-check mode............................................................................................... A-5 B MC68HC05B8 B.1 Features ........................................................................................................... B-1 C MC68HC705B5 C.1 C.2 C.2.1 C.3 C.3.1 C.4 C.5 C.5.1 C.5.2 C.5.3 C.5.4 C.5.5 C.6 C.7 Freescale vi Features ........................................................................................................... C-1 EPROM ............................................................................................................ C-5 EPROM programming operation................................................................. C-5 EPROM registers.............................................................................................. C-6 EPROM control register .............................................................................. C-6 Options register (OPTR)................................................................................... C-7 Bootstrap mode ................................................................................................ C-8 Erased EPROM verification ...................................................................... C-11 EPROM parallel bootstrap load ................................................................ C-11 EPROM (RAM) serial bootstrap load and execute ................................... C-13 RAM parallel bootstrap load and execute ................................................. C-14 Bootstrap loader timing diagrams ............................................................. C-17 DC electrical characteristics ........................................................................... C-19 Control timing ................................................................................................. C-19 TABLE OF CONTENTS MC68HC05B6 Rev. 4.1 Paragraph Number TABLE OF CONTENTS Page Number D MC68HC05B16 D.1 D.2 D.3 Features............................................................................................................ D-1 Self-check routines ........................................................................................... D-2 External clock ................................................................................................... D-4 E MC68HC705B16 E.1 Features............................................................................................................ E-2 E.2 External clock ................................................................................................... E-5 E.3 EPROM............................................................................................................. E-5 E.3.1 EPROM read operation............................................................................... E-5 E.3.2 EPROM program operation......................................................................... E-5 E.3.3 EPROM/EEPROM/ECLK control register ................................................... E-6 E.3.4 Mask option register.................................................................................... E-8 E.3.5 EEPROM options register (OPTR) ............................................................. E-9 E.4 Bootstrap mode .............................................................................................. E-10 E.4.1 Erased EPROM verification ...................................................................... E-13 E.4.2 EPROM/EEPROM parallel bootstrap........................................................ E-13 E.4.3 EEPROM/EPROM/RAM serial bootstrap.................................................. E-16 E.4.4 RAM parallel bootstrap ............................................................................. E-19 E.4.4.1 Jump to start of RAM ($0050) ............................................................. E-20 E.5 Absolute maximum ratings ............................................................................. E-21 E.6 DC electrical characteristics ........................................................................... E-22 E.7 A/D converter characteristics.......................................................................... E-24 E.8 Control timing ................................................................................................. E-26 E.9 EPROM electrical characteristics ................................................................... E-28 F MC68HC705B16N F.1 F.2 F.3 F.4 F.4.1 F.4.2 F.4.3 F.4.4 F.4.5 F.5 F.5.1 Features............................................................................................................ F-2 External clock ................................................................................................... F-5 RESET pin........................................................................................................ F-5 EPROM............................................................................................................. F-5 EPROM read operation............................................................................... F-5 EPROM program operation......................................................................... F-6 EPROM/EEPROM/ECLK control register ................................................... F-6 Mask option register.................................................................................... F-8 EEPROM options register (OPTR) ............................................................. F-9 Bootstrap mode .............................................................................................. F-10 Erased EPROM verification ...................................................................... F-13 MC68HC05B6 Rev. 4.1 TABLE OF CONTENTS Freescale vii Paragraph Number TABLE OF CONTENTS Page Number F.5.2 EPROM/EEPROM parallel bootstrap.........................................................F-13 F.5.3 Serial RAM loader......................................................................................F-16 F.5.3.1 Jump to start of RAM ($0051) ..............................................................F-16 F.6 Absolute maximum ratings ..............................................................................F-19 F.7 DC electrical characteristics ............................................................................F-20 F.8 A/D converter characteristics ..........................................................................F-22 F.9 Control timing ..................................................................................................F-24 F.10 EPROM electrical characteristics ....................................................................F-26 G MC68HC05B32 G.1 G.2 Features ........................................................................................................... G-1 External clock ................................................................................................... G-2 H MC68HC705B32 H.1 Features ........................................................................................................... H-3 H.2 External clock ................................................................................................... H-7 H.3 RESET pin........................................................................................................ H-7 H.4 EPROM ............................................................................................................ H-7 H.4.1 EPROM read operation............................................................................... H-8 H.4.2 EPROM program operation ........................................................................ H-8 H.4.3 EPROM/EEPROM control register ............................................................. H-8 H.4.4 Mask option register ................................................................................. H-11 H.4.5 Options register (OPTR) ........................................................................... H-12 H.5 Bootstrap mode .............................................................................................. H-13 H.5.1 Erased EPROM verification ...................................................................... H-16 H.5.2 EPROM/EEPROM parallel bootstrap........................................................ H-16 H.5.3 Serial RAM loader..................................................................................... H-19 H.5.3.1 Jump to start of RAM ($0051) ............................................................. H-19 H.6 Absolute maximum ratings ............................................................................. H-22 H.7 DC electrical characteristics ........................................................................... H-23 H.8 A/D converter characteristics ......................................................................... H-25 H.9 Control timing ................................................................................................. H-27 H.10 EPROM electrical characteristics ................................................................... H-29 I HIGH SPEED OPERATION I.1 I.2 I.3 Freescale viii DC electrical characteristics ............................................................................... I-2 A/D converter characteristics ............................................................................. I-3 Control timing for 5V operation...........................................................................I-4 TABLE OF CONTENTS MC68HC05B6 Rev. 4.1 LIST OF FIGURES Figure Number 1-1 2-1 2-2 2-3 2-4 2-5 3-1 4-1 4-2 4-3 5-1 5-2 5-3 5-4 5-5 6-1 6-2 6-3 6-4 6-5 6-6 6-7 6-8 6-9 6-10 7-1 7-2 7-3 8-1 8-2 9-1 9-2 9-3 TITLE Page Number MC68HC05B6 block diagram ............................................................................. 1-3 MC68HC05B6 `load program in RAM and execute' schematic diagram ............ 2-3 MC68HC05B6 `jump to any address' schematic diagram .................................. 2-5 STOP and WAIT flowcharts................................................................................ 2-7 Slow mode divider block diagram ....................................................................... 2-9 Oscillator connections ...................................................................................... 2-12 Memory map of the MC68HC05B6 .................................................................... 3-2 Standard I/O port structure................................................................................. 4-2 ECLK timing diagram.......................................................................................... 4-3 Port logic levels................................................................................................... 4-6 16-bit programmable timer block diagram .......................................................... 5-2 Timer state timing diagram for reset ................................................................. 5-13 Timer state timing diagram for input capture .................................................... 5-13 Timer state timing diagram for output compare ................................................ 5-14 Timer state timing diagram for timer overflow................................................... 5-14 Serial communications interface block diagram ................................................. 6-2 SCI rate generator division ................................................................................. 6-4 Data format......................................................................................................... 6-5 SCI examples of start bit sampling technique .................................................... 6-7 SCI sampling technique used on all bits............................................................. 6-7 Artificial start following a framing error ............................................................... 6-8 SCI start bit following a break............................................................................. 6-8 SCI example of synchronous and asynchronous transmission .......................... 6-9 SCI data clock timing diagram (M=0) ............................................................... 6-12 SCI data clock timing diagram (M=1) ............................................................... 6-13 PLM system block diagram................................................................................. 7-1 PLM output waveform examples ........................................................................ 7-2 PLM clock selection............................................................................................ 7-4 A/D converter block diagram .............................................................................. 8-2 Electrical model of an A/D input pin ................................................................... 8-6 Reset timing diagram.......................................................................................... 9-1 Watchdog system block diagram ........................................................................ 9-3 Interrupt flow chart.............................................................................................. 9-8 MC68HC05B6 Rev. 4.1 LIST OF FIGURES Freescale ix Figure Number 10-1 10-2 11-1 11-2 11-3 11-4 11-5 11-6 11-7 11-8 11-9 11-10 11-11 11-12 11-13 12-1 12-2 12-3 12-4 12-5 12-6 A-1 A-2 A-3 B-1 B-2 C-1 C-2 C-3 C-4 C-5 C-6 C-7 C-8 C-9 C-10 D-1 D-2 D-3 E-1 E-2 E-3 Freescale x TITLE Page Number Programming model ......................................................................................... 10-1 Stacking order .................................................................................................. 10-1 Run IDD vs internal operating frequency (4.5V, 5.5V) ...................................... 11-3 Run IDD (SM = 1) vs internal operating frequency (4.5V, 5.5V) ....................... 11-3 Wait IDD vs internal operating frequency (4.5V, 5.5V)...................................... 11-3 Wait IDD (SM = 1) vs internal operating frequency (4.5V, 5.5V)....................... 11-4 Increase in IDD vs frequency for A/D, SCI systems active, VDD = 5.5V........... 11-4 IDD vs mode vs internal operating frequency, VDD = 5.5V ............................... 11-4 Run IDD vs internal operating frequency (3 V, 3.6V)......................................... 11-6 Run IDD (SM = 1) vs internal operating frequency (3V,3.6V) ........................... 11-6 Wait IDD vs internal operating frequency (3V, 3.6V)......................................... 11-6 Wait IDD (SM = 1) vs internal operating frequency (3V, 3.6V).......................... 11-7 Increase in IDD vs frequency for A/D, SCI systems active, VDD = 3.6V............ 11-7 IDD vs mode vs internal operating frequency, VDD = 3.6V ............................... 11-7 Timer relationship........................................................................................... 11-12 52-pin PLCC pinout for the MC68HC05B6....................................................... 12-1 64-pin QFP pinout for the MC68HC05B6......................................................... 12-2 56-pin SDIP pinout for the MC68HC05B6........................................................ 12-3 52-pin PLCC mechanical dimensions .............................................................. 12-4 64-pin QFP mechanical dimensions................................................................. 12-5 56-pin SDIP mechanical dimensions................................................................ 12-6 MC68HC05B4 block diagram .............................................................................A-2 Memory map of the MC68HC05B4 ....................................................................A-3 MC68HC05B4 self-check schematic diagram ....................................................A-7 MC68HC05B8 block diagram .............................................................................B-2 Memory map of the MC68HC05B8 ....................................................................B-3 MC68HC705B5 block diagram ...........................................................................C-2 Memory map of the MC68HC705B5 ..................................................................C-3 Modes of operation flow chart (1 of 2)................................................................C-9 Modes of operation flow chart (2 of 2)..............................................................C-10 Timing diagram with handshake.......................................................................C-11 EPROM(RAM) parallel bootstrap schematic diagram ......................................C-12 EPROM (RAM) serial bootstrap schematic diagram ........................................C-15 RAM parallel bootstrap schematic diagram......................................................C-16 EPROM parallel bootstrap loader timing diagram ............................................C-17 RAM parallel loader timing diagram ................................................................C-18 MC68HC05B16 block diagram ...........................................................................D-3 Oscillator connections ........................................................................................D-4 Memory map of the MC68HC05B16 ..................................................................D-5 MC68HC705B16 block diagram .........................................................................E-2 Memory map of the MC68HC705B16 ................................................................E-3 Modes of operation flow chart (1 of 2)..............................................................E-11 LIST OF FIGURES MC68HC05B6 Rev. 4.1 Figure Number E-4 E-5 E-6 E-7 E-8 E-9 E-10 E-11 F-1 F-2 F-3 F-4 F-5 F-6 F-7 F-8 F-9 F-10 G-1 G-2 H-1 H-2 H-3 H-4 H-5 H-6 H-7 H-8 H-9 H-10 I-1 TITLE Page Number Modes of operation flow chart (2 of 2) ..............................................................E-12 Timing diagram with handshake .......................................................................E-14 Parallel EPROM loader timing diagram ............................................................E-14 EPROM Parallel bootstrap schematic diagram.................................................E-15 RAM/EPROM/EEPROM serial bootstrap schematic diagram ..........................E-17 Parallel RAM loader timing diagram .................................................................E-19 RAM parallel bootstrap schematic diagram ......................................................E-20 Timer relationship .............................................................................................E-28 MC68HC705B16N block diagram.......................................................................F-2 Memory map of the MC68HC705B16N..............................................................F-3 Modes of operation flow chart (1 of 2) ..............................................................F-11 Modes of operation flow chart (2 of 2) ..............................................................F-12 Timing diagram with handshake .......................................................................F-14 Parallel EPROM loader timing diagram ............................................................F-14 EPROM parallel bootstrap schematic diagram.................................................F-15 RAM load and execute schematic diagram ......................................................F-17 Parallel RAM loader timing diagram .................................................................F-18 Timer relationship .............................................................................................F-26 MC68HC05B32 block diagram .......................................................................... G-2 Memory map of the MC68HC05B32 ................................................................. G-3 MC68HC705B32 block diagram ........................................................................ H-4 Memory map of the MC68HC705B32 ............................................................... H-5 Modes of operation flow chart (1 of 2) ............................................................. H-14 Modes of operation flow chart (2 of 2) ............................................................. H-15 Timing diagram with handshake ...................................................................... H-17 Parallel EPROM loader timing diagram ........................................................... H-17 EPROM parallel bootstrap schematic diagram................................................ H-18 RAM load and execute schematic diagram ..................................................... H-20 Parallel RAM loader timing diagram ................................................................ H-21 Timer relationship ............................................................................................ H-29 Timer relationship ................................................................................................ I-5 MC68HC05B6 Rev. 4.1 LIST OF FIGURES Freescale xi THIS PAGE LEFT BLANK INTENTIONALLY Freescale xii LIST OF FIGURES MC68HC05B6 Rev. 4.1 LIST OF TABLES Table Number 1-1 2-1 3-1 3-2 3-3 4-1 6-1 6-2 6-3 6-4 6-5 6-6 8-1 8-2 9-1 9-2 9-3 10-1 10-2 10-3 10-4 10-5 10-6 10-7 10-8 10-9 11-1 11-2 11-3 11-4 11-5 11-6 11-7 TITLE Page Number Data sheet appendices....................................................................................... 1-1 Mode of operation selection ............................................................................... 2-1 EEPROM control bits description ....................................................................... 3-4 Register outline................................................................................................... 3-8 IRQ sensitivity..................................................................................................... 3-9 I/O pin states ...................................................................................................... 4-2 Method of receiver wake-up ............................................................................. 6-11 SCI clock on SCLK pin ..................................................................................... 6-13 First prescaler stage ......................................................................................... 6-18 Second prescaler stage (transmitter) ............................................................... 6-18 Second prescaler stage (receiver).................................................................... 6-19 SCI baud rate selection .................................................................................... 6-20 A/D clock selection ............................................................................................. 8-4 A/D channel assignment..................................................................................... 8-5 Effect of RESET, POR, STOP and WAIT............................................................ 9-5 Interrupt priorities ............................................................................................... 9-7 IRQ sensitivity..................................................................................................... 9-9 MUL instruction ................................................................................................ 10-5 Register/memory instructions........................................................................... 10-5 Branch instructions ........................................................................................... 10-6 Bit manipulation instructions............................................................................. 10-6 Read/modify/write instructions ......................................................................... 10-7 Control instructions........................................................................................... 10-7 Instruction set (1 of 2)....................................................................................... 10-8 Instruction set (2 of 2)....................................................................................... 10-9 M68HC05 opcode map................................................................................... 10-10 Absolute maximum ratings ............................................................................... 11-1 DC electrical characteristics for 5V operation................................................... 11-2 DC electrical characteristics for 3.3V operation................................................ 11-5 A/D characteristics for 5V operation ................................................................. 11-8 A/D characteristics for 3.3V operation .............................................................. 11-9 Control timing for 5V operation ....................................................................... 11-10 Control timing for 3.3V operation .................................................................... 11-11 MC68HC05B6 Rev. 4.1 LIST OF TABLES Freescale xiii Table Number 13-1 13-2 A-1 A-2 A-3 B-1 C-1 C-2 C-3 C-4 C-5 D-1 D-2 E-1 E-2 E-3 E-4 E-5 E-6 E-7 E-8 E-9 E-10 E-11 E-12 E-13 E-14 E-15 F-1 F-2 F-3 F-4 F-5 F-6 F-7 F-8 F-9 F-10 F-11 F-12 F-13 F-14 Freescale xiv TITLE Page Number MC order numbers ........................................................................................... 13-1 EPROMs for pattern generation ....................................................................... 13-2 Mode of operation selection ...............................................................................A-1 Register outline ..................................................................................................A-4 MC68HC05B4 self-check results .......................................................................A-6 Register outline ..................................................................................................B-4 Register outline ..................................................................................................C-4 Mode of operation selection ...............................................................................C-8 Bootstrap vector targets in RAM ......................................................................C-14 Additional DC electrical characteristics for MC68HC705B5.............................C-19 Additional control timing for MC68HC705B5 ....................................................C-19 Mode of operation selection ...............................................................................D-2 Register outline ..................................................................................................D-6 Register outline ..................................................................................................E-4 EPROM control bits description .........................................................................E-6 EEPROM control bits description .......................................................................E-7 Mode of operation selection .............................................................................E-10 Bootstrap vector targets in RAM ......................................................................E-18 Absolute maximum ratings ...............................................................................E-21 DC electrical characteristics for 5V operation ..................................................E-22 DC electrical characteristics for 3.3V operation ...............................................E-23 A/D characteristics for 5V operation.................................................................E-24 A/D characteristics for 3.3V operation..............................................................E-25 Control timing for 5V operation.........................................................................E-26 Control timing for 3.3V operation......................................................................E-27 DC electrical characteristics for 5V operation ..................................................E-28 Control timing for 5V operation.........................................................................E-28 Control timing for 3.3V operation......................................................................E-28 Register outline .................................................................................................. F-4 EPROM control bits description ......................................................................... F-7 EEPROM control bits description ....................................................................... F-8 Mode of operation selection ............................................................................. F-10 Bootstrap vector targets in RAM ...................................................................... F-16 Absolute maximum ratings ............................................................................... F-19 DC electrical characteristics for 5V operation .................................................. F-20 DC electrical characteristics for 3.3V operation ............................................... F-21 A/D characteristics for 5V operation................................................................. F-22 A/D characteristics for 3.3V operation.............................................................. F-23 Control timing for 5V operation......................................................................... F-24 Control timing for 3.3V operation...................................................................... F-25 DC electrical characteristics for 5V operation .................................................. F-26 Control timing for 5V operation......................................................................... F-26 LIST OF TABLES MC68HC05B6 Rev. 4.1 Table Number F-15 G-1 H-1 H-2 H-3 H-4 H-5 H-6 H-7 H-8 H-9 H-10 H-11 H-12 H-13 H-14 H-15 I-1 I-2 I-3 TITLE Page Number Control timing for 3.3V operation ......................................................................F-26 Register outline.................................................................................................. G-4 Register outline.................................................................................................. H-6 EPROM control bits description......................................................................... H-9 EEPROM control bits description .................................................................... H-10 Mode of operation selection ............................................................................ H-13 Bootstrap vector targets in RAM...................................................................... H-19 Absolute Maximum ratings .............................................................................. H-22 DC electrical characteristics for 5V operation.................................................. H-23 DC electrical characteristics for 3.3V operation............................................... H-24 A/D characteristics for 5V operation ................................................................ H-25 A/D characteristics for 3.3V operation ............................................................. H-26 Control timing for 5V operation ........................................................................ H-27 Control timing for operation at 3.3V ................................................................. H-28 DC electrical characteristics for 5V operation.................................................. H-29 Control timing for 5V operation ........................................................................ H-29 Control timing for 3.3V operation ..................................................................... H-29 Ordering information............................................................................................ I-1 DC electrical characteristics for 5V operation...................................................... I-2 A/D characteristics for 5V operation .................................................................... I-3 MC68HC05B6 Rev. 4.1 LIST OF TABLES Freescale xv THIS PAGE LEFT BLANK INTENTIONALLY Freescale xvi LIST OF TABLES MC68HC05B6 Rev. 4.1 1 1 INTRODUCTION The MC68HC05B6 microcomputer (MCU) is a member of Freescale's MC68HC05 family of low-cost single chip microcomputers. This 8-bit MCU contains an on-chip oscillator, CPU, RAM, ROM, EEPROM, A/D converter, pulse length modulated outputs, I/O, serial communications interface, programmable timer system and watchdog. The fully static design allows operation at frequencies down to dc to further reduce the already low power consumption to a few micro-amps. This data sheet is structured such that devices similar to the MC68HC05B6 are described in a set of appendices (see Table 1-1). Table 1-1 Data sheet appendices Device Differences from MC68HC05B6 A MC68HC05B8 B 7.25K bytes ROM MC68HC705B5 C 6K bytes EPROM; self-check replaced by bootstrap firmware; no EEPROM MC68HC05B16 D 16K bytes ROM; increased RAM and self-check ROM MC68HC705B16 E 16K bytes EPROM; increased RAM; self-check replaced by bootstrap firmware; modified power-on reset routine MC68HC705B16N F 16K bytes EPROM; increased RAM; self-check replaced by bootstrap firmware; modified power-on reset routine MC68HC05B32 G 32K bytes ROM; no page zero ROM; increased RAM H 32K bytes EPROM; no page zero ROM; increased RAM; self-check mode replaced by bootstrap firmware MC68HC705B32 MC68HC05B6 Rev. 4.1 Appendix MC68HC05B4 4K bytes ROM; no EEPROM INTRODUCTION Freescale 1-1 1 1.1 Features Hardware features * Fully static design featuring the industry standard M68HC05 family CPU core * On chip crystal oscillator with divide by 2 or a software selectable divide by 32 option (SLOW mode) * 2.1 MHz internal operating frequency at 5V; 1.0 MHz at 3V * High speed version available * 176 bytes of RAM * 5936 bytes of user ROM plus 14 bytes of user vectors * 256 bytes of byte erasable EEPROM with internal charge pump and security bit * Write/erase protect bit for 224 of the 256 bytes EEPROM * Self test/bootstrap mode * Power saving STOP, WAIT and SLOW modes * Three 8-bit parallel I/O ports and one 8-bit input-only port * Software option available to output the internal E-clock to port pin PC2 * 16-bit timer with 2 input captures and 2 output compares * Computer operating properly (COP) watchdog timer * Serial communications interface system (SCI) with independent transmitter/receiver baud rate selection; receiver wake-up function for use in multi-receiver systems * 8 channel A/D converter * 2 pulse length modulation systems which can be used as D/A converters * One interrupt request input plus 4 on-board hardware interrupt sources * Available in 52-pin plastic leaded chip carrier (PLCC), 64-pin quad flat pack (QFP) and 56-pin shrink dual in line (SDIP) packages * Complete development system support available using the MMDS05 development station with the M68HC05B32EM emulation module * Extended operating temperature range of -40 to +125 C Freescale 1-2 INTRODUCTION MC68HC05B6 Rev. 4.1 1 1.2 Mask options for the MC68HC05B6 The MC68HC05B6 has three mask options that are programmed during manufacture and must be specified on the order form. * Power-on-reset delay (tPORL) = 16 or 4064 cycles * Automatic watchdog enable/disable following a power-on or external reset * Watchdog enable/disable during WAIT mode RESET IRQ PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2/ECLK PC3 PC4 PC5 PC6 PC7 COP watchdog OSC2 OSC1 Oscillator / 2 / / 32 M68HC05 CPU VDD VSS 432 bytes self check ROM 176 bytes RAM 16-bit programmable timer Port D PD0/AN0 PD1/AN1 PD2/AN2 PD3/AN3 PD4/AN4 PD5/AN5 PD6/AN6 PD7/AN7 VRH VRL 5950 bytes User ROM (including 14 bytes User vectors) Port A Charge pump VPP1 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 Port B 256 bytes EEPROM Port C Warning: It is recommended that an external clock is always used if tPORL is set to 16 cycles. This will prevent any problems arising with oscillator stability when the device is put into STOP mode. 8-bit A/D converter TCMP1 TCMP2 TCAP1 TCAP2 SCI RDI SCLK TDO PLM PLMA D/A PLMB D/A Figure 1-1 MC68HC05B6 block diagram MC68HC05B6 Rev. 4.1 INTRODUCTION Freescale 1-3 1 THIS PAGE LEFT BLANK INTENTIONALLY Freescale 1-4 INTRODUCTION MC68HC05B6 Rev. 4.1 2 2 MODES OF OPERATION AND PIN DESCRIPTIONS 2.1 Modes of operation The MC68HC05B6 MCU has two modes of operation, namely single chip and self check modes. Table 2-1 shows the conditions required to enter each mode on the rising edge of RESET. Table 2-1 Mode of operation selection 2.1.1 IRQ pin TCAP1 pin PD3 PD4 VSS to VDD VSS to VDD X X Single chip Mode 2VDD VDD 1 0 Serial RAM loader 2VDD VDD 1 1 Jump to any address Single chip mode This is the normal operating mode of the MC68HC05B6. In this mode the device functions as a self-contained microcomputer (MCU) with all on-board peripherals, including the three 8-bit I/O ports and the 8-bit input-only port, available to the user. All address and data activity occurs within the MCU. MC68HC05B6 Rev. 4.1 MODES OF OPERATION AND PIN DESCRIPTIONS Freescale 2-1 2.2 2 Serial RAM loader The `load program in RAM and execute' mode is entered if the following conditions are satisfied when the reset pin is released to VDD. The format used is identical to the format used for the MC68HC805C4. The SEC bit in the options register must be inactive, i.e. set to `1'. - IRQ at 2xVDD - TCAP1 at VDD - PD3 at VDD for at least 30 machine cycles after reset - PD4 at VSS for at least 30 machine cycles after reset In the `load program in RAM and execute' routine, user programs are loaded into MCU RAM via the SCI port and then executed. Data is loaded sequentially, starting at RAM location $0050, until the last byte is loaded. Program control is then transferred to the RAM program starting at location $0051. The first byte loaded is the count of the total number of bytes in the program plus the count byte. The program starts at the second byte in RAM. During the firmware initialization stage, the SCI is configured for the NRZ data format (idle line, start bit, eight data bits and stop bit). The baud rate is 9600 with a 4 MHz crystal. A program to convert ASCII S-records to the format required by the RAM loader is available from Freescale. If immediate execution is not desired after loading the RAM program, it is possible to hold off execution. This is accomplished by setting the byte count to a value that is greater than the overall length of the loaded data. When the last byte is loaded, the firmware will halt operation expecting additional data to arrive. At this point, the reset switch is placed in the reset position which will reset the MCU, but keep the RAM program intact. All routines can now be entered from this state, including the one which will execute the program in RAM (see Section 2.3). To load a program in the EEPROM, the `load program in RAM and execute' function is also used. In this instance the process involves two distinct steps. Firstly, the RAM is loaded with a program which will control the loading of the EEPROM, and when the RAM contents are executed, the MCU is instructed to load the EEPROM. The erased state of the EEPROM is $FF. Figure 2-1 shows the schematic diagram of the circuit required for the serial RAM loader. Freescale 2-2 MODES OF OPERATION AND PIN DESCRIPTIONS MC68HC05B6 Rev. 4.1 P1 10 nF 10 k GND +5V 2xVDD 10 RESET VDD OSC1 18 47 F RESET OSC2 16 17 10 M 0.01 F 6 15 22 pF NC RS232 50 52 10 k IRQ RDI PD3 TDO PD4 Connect as required for the application 32 33 34 35 36 37 38 39 42 43 44 45 46 47 48 49 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 TCAP1 MC68HC05B6 (52-pin package) 24 25 26 27 28 29 30 31 22 pF NC 9600 Bd RS232 level translator suggested: MC145406 or MAX232 4 MHz VRH VRL VPP1 PLMA PLMB SCLK TCMP2 TCAP2 TCMP1 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0 PD7 PD6 PD5 PD2 PD1 PD0 19 11 9 22 8 7 40 20 21 51 1 Connect as required for the application 23 2 3 4 5 12 13 14 VSS 41 Figure 2-1 MC68HC05B6 `load program in RAM and execute' schematic diagram MC68HC05B6 Rev. 4.1 MODES OF OPERATION AND PIN DESCRIPTIONS Freescale 2-3 2 2.3 2 `Jump to any address' The `jump to any address' mode is entered when the reset pin is released to VDD, if the following conditions are satisfied: - IRQ at 2xVDD - TCAP1 at VDD - PD3 at VDD for at least 30 machine cycles after reset - PD4 at VDD for at least 30 machine cycles after reset This function allows execution of programs previously loaded in RAM or EEPROM using the methods outlined in Section 2.2. To execute the `jump to any address' function, data input at port A has to be $CC and data input at port B and port C should represent the MSB and LSB respectively, of the address to jump to for execution of the user program. A schematic diagram of the circuit required is shown in Figure 2-2. Freescale 2-4 MODES OF OPERATION AND PIN DESCRIPTIONS MC68HC05B6 Rev. 4.1 P1 10 nF 10 k GND +5V 2xVDD 10 RESET VDD OSC1 18 47 F RESET OSC2 16 17 10 M 0.01 F 6 15 22 pF NC 10 k IRQ PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 PD4 TCAP1 MC68HC05B6 (52-pin package) 32 33 34 35 36 37 38 39 PD3 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 VRH VRL VPP1 PLMA PLMB SCLK RDI TDO TCMP2 8 x 10 k LSB Select required address MSB 8 x 10 k 42 43 44 45 46 47 48 49 22 pF NC 8 x 10 k optional (see note) 24 25 26 27 28 29 30 31 4 MHz TCAP2 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0 TCMP1 VSS PD7 PD6 PD5 PD2 PD1 PD0 19 11 9 22 8 7 40 20 21 51 50 52 Connect as required for the application 1 23 2 3 4 5 12 13 14 41 Note: These eight resistors are optional; direct connection is possible if pins PA0-PA7, PB0-PB7 and PC0-PC7 are kept in input mode during application. Figure 2-2 MC68HC05B6 `jump to any address' schematic diagram MC68HC05B6 Rev. 4.1 MODES OF OPERATION AND PIN DESCRIPTIONS Freescale 2-5 2 2.4 2 Low power modes The STOP and WAIT instructions have different effects on the programmable timer, the serial communications interface, the watchdog system, the EEPROM and the A/D converter. These different effects are described in the following sections. 2.4.1 STOP The STOP instruction places the MCU in its lowest power consumption mode. In STOP mode, the internal oscillator is turned off, halting all internal processing including timer, serial communications interface and the A/D converter (see flowchart in Figure 2-3). The only way for the MCU to wake-up from the STOP mode is by receipt of an external interrupt or by the detection of a reset (logic low on RESET pin or a power-on reset). During STOP mode, the I-bit in the CCR is cleared to enable external interrupts (see Section 10.1.5). The SM bit is cleared to allow nominal speed operation for the 4064 cycles count while exiting STOP mode (see Section 2.4.3). All other registers and memory remain unaltered and all input/output lines remain unchanged. This continues until an external interrupt (IRQ) or reset is sensed, at which time the internal oscillator is turned on. The external interrupt or reset causes the program counter to vector to the corresponding locations ($1FFA, B and $1FFE, F respectively). When leaving STOP mode, a tPORL internal cycles delay is provided to give the oscillator time to stabilise before releasing CPU operation. This delay is selectable via a mask option to be either 16 or 4064 cycles. The CPU will resume operation by servicing the interrupt that wakes it up, or by fetching the reset vector, if reset wakes it up. Warning: If tPORL is selected to be 16 cycles, it is recommended that an external clock signal is used to avoid problems with oscillator stability while the device is in STOP mode. Note: The stacking corresponding to an eventual interrupt to go out of STOP mode will only be executed when going out of STOP mode. The following list summarizes the effect of STOP mode on the individual modules of the MC68HC05B6. - The watchdog timer is reset; refer to Section 9.1.4.1 - The EEPROM acts as read-only memory (ROM); refer to Section 3.6 - All SCI activity stopped; refer to Section 6.13 - The timer stops counting; refer to Section 5.6 - The PLM outputs remain at current level; refer to Section 7.3 - The A/D converter is disabled; refer to Section 8.3 - The I-bit in the CCR is cleared Freescale 2-6 MODES OF OPERATION AND PIN DESCRIPTIONS MC68HC05B6 Rev. 4.1 STOP YES 2 Watchdog active? NO Stop oscillator and all clocks. Clear I bit. NO Reset? IRQ external interrupt? NO WAIT YES Oscillator active. Timer, SCI, A/D, EEPROM clocks active. Processor clocks stopped Clear I-bit Reset? YES NO IRQ external interrupt? YES YES YES NO Timer interrupt? NO Turn on oscillator. Wait for time delay to stabilise YES SCI interrupt? NO Restart processor clock Generate watchdog reset (1) Fetch reset vector or (2) Service interrupt: a. stack b. set I-bit c. vector to interrupt routine (1) Fetch reset vector or (2) Service interrupt: a. stack b. set I-bit c. vector to interrupt routine Figure 2-3 STOP and WAIT flowcharts MC68HC05B6 Rev. 4.1 MODES OF OPERATION AND PIN DESCRIPTIONS Freescale 2-7 2.4.2 2 WAIT The WAIT instruction places the MCU in a low power consumption mode, but WAIT mode consumes more power than STOP mode. All CPU action is suspended and the watchdog is disabled, but the timer, A/D and SCI systems remain active and operate as normal (see flowchart in Figure 2-3). All other memory and registers remain unaltered and all parallel input/output lines remain unchanged. The programming or erase mechanism of the EEPROM is also unaffected, as well as the charge pump high voltage generator. During WAIT mode the I-bit in the CCR is cleared to enable all interrupts. The INTE bit in the miscellaneous register (Section 2.5) is not affected by WAIT mode. When any interrupt or reset is sensed, the program counter vectors to the locations containing the start address of the interrupt or reset service routine. Any IRQ, timer (overflow, input capture or output compare) or SCI interrupt (in addition to a logic low on the RESET pin) causes the processor to exit WAIT mode. If a non-reset exit from WAIT mode is performed (i.e. timer overflow interrupt exit), the state of the remaining systems will be unchanged. If a reset exit from WAIT mode is performed the entire system reverts to the disabled reset state. Note: The stacking corresponding to an eventual interrupt to leave WAIT mode will only be executed when leaving WAIT mode. The following list summarizes the effect of WAIT mode on the modules of the MC68HC05B6. - The watchdog timer functions according to the mask option selected; refer to Section 9.1.4.2 - The EEPROM is not affected; refer to Section 3.7 - The SCI is not affected; refer to Section 6.14 - The timer is not affected; refer to Section 5.7 - The PLM is not affected; refer to Section 7.4 - The A/D converter is not affected; refer to Section 8.4 - The I-bit in the CCR is cleared 2.4.2.1 Power consumption during WAIT mode Power consumption during WAIT mode depends on how many systems are active. The power consumption will be highest when all the systems (A/D, timer, EEPROM and SCI) are active, and lowest when the EEPROM erase and programming mechanism, SCI and A/D are disabled. The timer cannot be disabled in WAIT mode. It is important that before entering WAIT mode, the programmer sets the relevant control bits for the individual modules to reflect the desired functionality during WAIT mode. Power consumption may be further reduced by the use of SLOW mode. Freescale 2-8 MODES OF OPERATION AND PIN DESCRIPTIONS MC68HC05B6 Rev. 4.1 2.4.3 SLOW mode The SLOW mode function is controlled by the SM bit in the miscellaneous register at location $000C. It allows the user to insert, under software control, an extra divide-by-16 between the oscillator and the internal clock driver (see Figure 2-4). This feature permits a slow down of all the internal operations and thus reduces power consumption. The SLOW mode function should not be enabled while using the A/D converter or while erasing/programming the EEPROM unless the internal A/D RC oscillator is turned on. OSC2 OSC1 pin pin fOSC Oscillator fOSC/2 /2 / 16 fOSC/32 SM-bit (bit 1, $000C) Control logic Main internal clock Figure 2-4 Slow mode divider block diagram 2.4.3.1 Miscellaneous register Miscellaneous Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 $000C POR INTP INTN INTE SFA SFB SM State on reset bit 0 WDOG ?001 000? SM -- Slow mode 1 (set) - 0 (clear) - The system runs at a bus speed 16 times lower than normal (fOSC/32). SLOW mode affects all sections of the device, including SCI, A/D and timer. The system runs at normal bus speed (fOSC/2). The SM bit is cleared by external or power-on reset. The SM bit is automatically cleared when entering STOP mode. Note: The bits shown shaded in the above representation are explained individually in the relevant sections of this manual. The complete register plus an explanation of each bit can be found in Section 3.8. MC68HC05B6 Rev. 4.1 MODES OF OPERATION AND PIN DESCRIPTIONS Freescale 2-9 2 2.5 Pin descriptions 2.5.1 VDD and VSS 2 Power is supplied to the microcontroller using these two pins. VDD is the positive supply and VSS is ground. It is in the nature of CMOS designs that very fast signal transitions occur on the MCU pins. These short rise and fall times place very high short-duration current demands on the power supply. To prevent noise problems, special care must be taken to provide good power supply by-passing at the MCU. By-pass capacitors should have good high-frequency characteristics and be as close to the MCU as possible. Bypassing requirements vary, depending on how heavily the MCU pins are loaded. 2.5.2 IRQ This is an input-only pin for external interrupt sources. Interrupt triggering is selected using the INTP and INTN bits in the miscellaneous register, to be one of four options detailed in Table 9-3. In addition, the external interrupt facility (IRQ) can be disabled using the INTE bit in the miscellaneous register (see Section 3.8). It is only possible to change the interrupt option bits in the miscellaneous register while the I-bit is set. Selecting a different interrupt option will automatically clear any pending interrupts. Further details of the external interrupt procedure can be found in Section 9.2.3.1. The IRQ pin contains an internal Schmitt trigger as part of its input to improve noise immunity. 2.5.3 RESET This active low I/O pin is used to reset the MCU. Applying a logic zero to this pin forces the device to a known start-up state. An external RC-circuit can be connected to this pin to generate a power-on-reset (POR) if required. In this case, the time constant must be great enough to allow the oscillator circuit to stabilize. This input has an internal Schmitt trigger to improve noise immunity. When a reset condition occurs internally, i.e. from the COP watchdog, the RESET pin provides an active-low open drain output signal that may be used to reset external hardware. 2.5.4 TCAP1 The TCAP1 input controls the input capture 1 function of the on-chip programmable timer system. Freescale 2-10 MODES OF OPERATION AND PIN DESCRIPTIONS MC68HC05B6 Rev. 4.1 2.5.5 TCAP2 The TCAP2 input controls the input capture 2 function of the on-chip programmable timer system. 2.5.6 TCMP1 The TCMP1 pin is the output of the output compare 1 function of the timer system. 2.5.7 TCMP2 The TCMP2 pin is the output of the output compare 2 function of the timer system. 2.5.8 OSC1, OSC2 These pins provide control input for an on-chip oscillator circuit. A crystal, ceramic resonator or external clock signal connected to these pins supplies the oscillator clock. The oscillator frequency (fOSC) is divided by two to give the internal bus frequency (fOP). There is also a software option which introduces an additional divide by 16 into the oscillator clock, giving an internal bus frequency of fOSC/32. 2.5.8.1 Crystal The circuit shown in Figure 2-5(a) is recommended when using either a crystal or a ceramic resonator. Figure 2-5(d) lists the recommended capacitance and feedback resistance values. The internal oscillator is designed to interface with an AT-cut parallel-resonant quartz crystal resonator in the frequency range specified for fOSC (see Section 11.4). Use of an external CMOS oscillator is recommended when crystals outside the specified ranges are to be used. The crystal and associated components should be mounted as close as possible to the input pins to minimise output distortion and start-up stabilisation time. The manufacturer of the particular crystal being considered should be consulted for specific information. 2.5.8.2 Ceramic resonator A ceramic resonator may be used instead of a crystal in cost sensitive applications. The circuit shown in Figure 2-5(a) is recommended when using either a crystal or a ceramic resonator. Figure 2-5(d) lists the recommended capacitance and feedback resistance values. The manufacturer of the particular ceramic resonator being considered should be consulted for specific information. MC68HC05B6 Rev. 4.1 MODES OF OPERATION AND PIN DESCRIPTIONS Freescale 2-11 2 2.5.8.3 2 External clock An external clock should be applied to the OSC1 input, with the OSC2 pin left unconnected, as shown in Figure 2-5(c). The tOXOV or tILCH specifications (see Section 11.4) do not apply when using an external clock input. The equivalent specification of the external clock source should be used in lieu of tOXOV or tILCH. L C1 RS OSC1 OSC2 MCU OSC1 C0 OSC2 RP (b) Crystal equivalent circuit COSC2 COSC1 MCU OSC1 OSC2 External clock NC (a) Crystal/ceramic resonator oscillator connections (c) External clock source connections Crystal RS(max) C0 Ceramic resonator 2MHz 4MHz Unit 400 75 RS(typ) 2 - 4MHz 10 Unit 5 7 pF C0 40 pF 8 12 F C1 4.3 pF COSC1 15 - 40 15 - 30 pF COSC1 30 pF COSC2 15 - 30 15 - 25 pF COSC2 30 pF C1 RP 10 10 M RP 1 - 10 M Q 30 000 40 000 -- Q 1250 -- (d) Typical crystal and ceramic resonator parameters Figure 2-5 Oscillator connections Freescale 2-12 MODES OF OPERATION AND PIN DESCRIPTIONS MC68HC05B6 Rev. 4.1 2.5.9 RDI (Receive data in) 2 The RDI pin is the input pin of the SCI receiver. 2.5.10 TDO (Transmit data out) The TDO pin is the output pin of the SCI transmitter. 2.5.11 SCLK The SCLK pin is the clock output pin of the SCI transmitter. 2.5.12 PLMA The PLMA pin is the output of pulse length modulation converter A. 2.5.13 PLMB The PLMB pin is the output of pulse length modulation converter B. 2.5.14 VPP1 The VPP1 pin is the output of the charge pump for the EEPROM1 array. 2.5.15 VRH The VRH pin is the positive reference voltage for the A/D converter. 2.5.16 VRL The VRL pin is the negative reference voltage for the A/D converter. 2.5.17 PA0 - PA7/PB0 - PB7/PC0 - PC7 These 24 I/O lines comprise ports A, B and C. The state of any pin is software programmable, and all the pins are configured as inputs during power-on or reset. Under software control the PC2 pin can output the internal E-clock (see Section 4.2). 2.5.18 PD0/AN0-PD7/AN7 This 8-bit input only port (D) shares its pins with the A/D converter. When enabled, the A/D converter uses pins PD0/AN0 - PD7/AN7 as its analog inputs. On reset, the A/D converter is disabled which forces the port D pins to be input only port pins (see Section 8.5). MC68HC05B6 Rev. 4.1 MODES OF OPERATION AND PIN DESCRIPTIONS Freescale 2-13 2 THIS PAGE LEFT BLANK INTENTIONALLY Freescale 2-14 MODES OF OPERATION AND PIN DESCRIPTIONS MC68HC05B6 Rev. 4.1 3 3 MEMORY AND REGISTERS The MC68HC05B6 MCU is capable of addressing 8192 bytes of memory and registers with its program counter. The memory map includes 5950 bytes of User ROM (including User vectors), 432 bytes of self check ROM, 176 bytes of RAM and 256 bytes of EEPROM. 3.1 Registers All the I/O, control and status registers of the MC68HC05B6 are contained within the first 32-byte block of the memory map, as shown in Figure 3-1. The miscellaneous register is shown in Section 3.8 as this register contains bits which are relevant to several modules. 3.2 RAM The user RAM comprises 176 bytes of memory, from $0050 to $00FF. This is shared with a 64 byte stack area. The stack begins at $00FF and may extend down to $00C0. Note: 3.3 Using the stack area for data storage or temporary work locations requires care to prevent the data from being overwritten due to stacking from an interrupt or subroutine call. ROM The User ROM consists of 5950 bytes of ROM mapped as follows: * 48 bytes of page zero ROM from $0020 to $004F * 5888 bytes of User ROM from $0800 to $1EFF * 14 bytes of User vectors from $1FF2 to $1FFF MC68HC05B6 Rev. 4.1 MEMORY AND REGISTERS Freescale 3-1 3.4 Self-check ROM There are two areas of self-check ROM (ROMI and ROMII) located from $0200 to $02BF (192 bytes) and $1F00 to $1FEF (240 bytes) respectively. 3 MC68HC05B6 Registers $0000 I/O (32 bytes) $0020 Page 0 User ROM (48 bytes) $0050 $00C0 $0100 $0101 $0120 RAM (176 bytes) Stack OPTR (1 byte) Non protected (31 bytes) EEPROM (256 bytes) Protected (224 bytes) $0200 Self-check ROM I (192 bytes) $02C0 $0800 $1F00 User ROM (5888 bytes) Self-check ROM II (240 bytes) $1FF0 SCI $1FF2-3 Timer overflow $1FF4-5 $1FF6-7 Timer output compare 1& 2 $1FF8-9 Timer input capture 1 & 2 External IRQ $1FFA-B $1FFC-D SWI $1FFE-F Reset/power-on reset Port A data register $0000 Port B data register $0001 Port C data register $0002 Port D input data register $0003 Port A data direction register $0004 Port B data direction register $0005 Port C data direction register $0006 EEPROM/ECLK control register $0007 A/D data register $0008 A/D status/control register $0009 Pulse length modulation A $000A Pulse length modulation B $000B Miscellaneous register $000C SCI baud rate register $000D SCI control register 1 $000E SCI control register 2 $000F SCI status register $0010 SCI data register $0011 Timer control register $0012 Timer status register $0013 Capture high register 1 $0014 Capture low register 1 $0015 Compare high register 1 $0016 Compare low register 1 $0017 Counter high register $0018 Counter low register $0019 Alternate counter high register $001A Alternate counter low register $001B Capture high register 2 $001C Capture low register 2 $001D Compare high register 2 $001E Compare low register 2 $001F Options register $0100 User vectors (14 bytes) Reserved Figure 3-1 Memory map of the MC68HC05B6 Freescale 3-2 MEMORY AND REGISTERS MC68HC05B6 Rev. 4.1 3.5 EEPROM The user EEPROM consists of 256 bytes of memory located from address $0100 to $01FF. 255 bytes are general purpose and 1 byte is used by the option register. The non-volatile EEPROM is byte erasable. An internal charge pump provides the EEPROM voltage (VPP1), which removes the need to supply a high voltage for erase and programming functions. The charge pump is a capacitor/diode ladder network which will give a very high impedance output of around 20-30 M. The voltage of the charge pump is visible at the VPP1 pin. During normal operation of the device, where programming/erasing of the EEPROM array will occur, VPP1 should never be connected to either VDD or VSS as this could prevent the charge pump reaching the necessary programming voltage. Where it is considered dangerous to leave VPP1 unconnected for reasons of excessive noise in a system, it may be tied to VDD; this will protect the EEPROM data but will also increase power consumption, and therefore it is recommended that the protect bit function is used for regular protection of EEPROM data (see Section 3.5.5). In order to achieve a higher degree of security for stored data, there is no capability for bulk or row erase operations. The EEPROM control register ($0007) provides control of the EEPROM programming and erase operations. Warning: The VPP1 pin should never be connected to VSS, as this could cause permanent damage to the device. 3.5.1 EEPROM control register EEPROM/ECLK control Address bit 7 bit 6 bit 5 bit 4 $0007 0 0 0 0 bit 3 bit 2 bit 1 bit 0 State on reset ECLK E1ERA E1LAT E1PGM 0000 0000 ECLK See Section 4.3 for a description of this bit. E1ERA -- EEPROM erase/programming bit Providing the E1LAT and E1PGM bits are at logic one, this bit indicates whether the access to the EEPROM is for erasing or programming purposes. 1 (set) - 0 (clear) - An erase operation will take place. A programming operation will take place. Once the program/erase EEPROM address has been selected, E1ERA cannot be changed. MC68HC05B6 Rev. 4.1 MEMORY AND REGISTERS Freescale 3-3 3 E1LAT -- EEPROM programming latch enable bit 1 (set) 3 - 0 (clear) - Address and data can be latched into the EEPROM for further program or erase operations, providing the E1PGM bit is cleared. Data can be read from the EEPROM. The E1ERA bit and the E1PGM bit are reset to zero when E1LAT is `0'. STOP, power-on and external reset clear the E1LAT bit. Note: After the tERA1 erase time or tPROG1 programming time, the E1LAT bit has to be reset to zero in order to clear the E1ERA bit and the E1PGM bit. E1PGM -- EEPROM charge pump enable/disable 1 (set) - Internal charge pump generator switched on. 0 (clear) - Internal charge pump generator switched off. When the charge pump generator is on, the resulting high voltage is applied to the EEPROM array. This bit cannot be set before the data is selected, and once this bit has been set it can only be cleared by clearing the E1LAT bit. A summary of the effects of setting/clearing bits 0, 1 and 2 of the control register are give in Table 3-1. Table 3-1 EEPROM control bits description E1ERA Note: Freescale 3-4 E1LAT E1PGM Description 0 0 0 Read condition 0 1 0 Ready to load address/data for program/erase 0 1 1 Byte programming in progress 1 1 0 Ready for byte erase (load address) 1 1 1 Byte erase in progress All combinations are not shown in the above table, since the E1PGM and E1ERA bits are cleared when the E1LAT bit is at zero, and will result in a read condition. MEMORY AND REGISTERS MC68HC05B6 Rev. 4.1 3.5.2 EEPROM read operation To be able to read from EEPROM, the E1LAT bit has to be at logic zero, as shown in Table 3-1. While this bit is at logic zero, the E1PGM bit and the E1ERA bit are permanently reset to zero and the 256 bytes of EEPROM may be read as if it were a normal ROM area. The internal charge pump generator is automatically switched off since the E1PGM bit is reset. If a read operation is executed while the E1LAT bit is set (erase or programming sequence), data resulting from the operation will be $FF. Note: When not performing any programming or erase operation, it is recommended that EEPROM should remain in the read mode (E1LAT = 0) 3.5.3 EEPROM erase operation To erase the contents of a byte of the EEPROM, the following steps should be taken: 1 Set the E1LAT bit. 1) Set the E1ERA bit (1& 2 may be done simultaneously with the same instruction). 2) Write address/data to the EEPROM address to be erased. 3) Set the E1PGM bit. 4) Wait for a time tERA1. 5) Reset the E1LAT bit (to logic zero). While an erase operation is being performed, any access of the EEPROM array will not be successful. The erased state of the EEPROM is $FF and the programmed state is $00. Note: Data written to the address to be erased is not used, therefore its value is not significant. If a second word is to be erased, it is important that the E1LAT bit be reset before restarting the erasing sequence otherwise any write to a new address will have no effect. This condition provides a higher degree of security for the stored data. User programs must be running from the RAM or ROM as the EEPROM will have its address and data buses latched. MC68HC05B6 Rev. 4.1 MEMORY AND REGISTERS Freescale 3-5 3 3.5.4 EEPROM programming operation To program a byte of EEPROM, the following steps should be taken: 3 1 Set the E1LAT bit. 2 Write address/data to the EEPROM address to be programmed. 3 Set the E1PGM bit. 4 Wait for time tPROG1. 5 Reset the E1LAT bit (to logic zero). While a programming operation is being performed, any access of the EEPROM array will not be successful. Warning: To program a byte correctly, it has to have been previously erased. It is advised that this is done only for 01 transitions, as this saves excessive overwriting of EEPROM. If a second word is to be programmed, it is important that the E1LAT bit be reset before restarting the programming sequence otherwise any write to a new address will have no effect. This condition provides a higher degree of security for the stored data. User programs must be running from the RAM or ROM as the EEPROM will have its address and data buses latched. Note: 224 bytes of EEPROM (address $0120 to $01FF) can be program and erase protected under the control of bit 1 of the OPTR register detailed in Section 3.5.5. 3.5.5 Options register (OPTR) This register (OPTR), located at $0100, contains the secure and protect functions for the EEPROM and allows the user to select options in a non-volatile manner. The contents of the OPTR register are loaded into data latches with each power-on or external reset. Address Options (OPTR)(1) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 $0100 State on reset bit 1 bit 0 EE1P SEC Not affected (1) This register is implemented in EEPROM; therefore reset has no effect on the individual bits. Freescale 3-6 MEMORY AND REGISTERS MC68HC05B6 Rev. 4.1 EE1P - EEPROM protect bit In order to achieve a higher degree of protection, the EEPROM is effectively split into two parts, both working from the VPP1 charge pump. Part 1 of the EEPROM array (32 bytes from $0100 to $011F) cannot be protected; part 2 (224 bytes from $0120 to $01FF) is protected by the EE1P bit of the options register. 1 (set) - 0 (clear) - Part 2 of the EEPROM array is not protected; all 256 bytes of EEPROM can be accessed for any read, erase or programming operations Part 2 of the EEPROM array is protected; any attempt to erase or program a location will be unsuccessful When this bit is set to 1 (erased), the protection will remain until the next power-on or external reset. EE1P can only be written to `0' when the ELAT bit in the EEPROM control register is set. SEC - Security bit This high security bit allows the user to secure the EEPROM data from external accesses. When the SEC bit is at `0', the EEPROM contents are secured by preventing any entry to test mode. The only way to erase the SEC bit to `1' externally is to enter self-check mode, at which time the entire EEPROM contents will be erased. When the SEC bit is changed, its new value will have no effect until the next external or power-on reset. 3.6 EEPROM during STOP mode When entering STOP mode, the EEPROM is automatically set to the read mode and the VPP1 high voltage charge pump generator is automatically disabled. 3.7 EEPROM during WAIT mode The EEPROM is not affected by WAIT mode. Any program/erase operation will continue as in normal operating mode. The charge pump is not affected by WAIT mode, therefore it is possible to wait the tERA1 erase time or tPROG1 programming time in WAIT mode. Under normal operating conditions, the charge pump generator is driven by the internal CPU clocks. When the operating frequency is low, e.g. during WAIT mode, the clocking should be done by the internal A/D RC oscillator. The RC oscillator is enabled by setting the ADRC bit of the A/D status/control register at $0009. MC68HC05B6 Rev. 4.1 MEMORY AND REGISTERS Freescale 3-7 3 Table 3-2 Register outline Register name 3 Address bit 7 Port A data (PORTA) $0000 Port B data (PORTB) $0001 Port C data (PORTC) $0002 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Undefined Undefined PC2/ ECLK Port D data (PORTD) $0003 Port A data direction (DDRA) $0004 0000 0000 0000 0000 Port B data direction (DDRB) $0005 Port C data direction (DDRC) $0006 EEPROM/ECLK control $0007 A/D data (ADDATA) $0008 A/D status/control (ADSTAT) $0009 Pulse length modulation A (PLMA) $000A Pulse length modulation B (PLMB) $000B Miscellaneous PD7 PD6 PD5 PD4 PD3 PD2 Undefined PD1 PD0 Undefined 0000 0000 0 0 0 0 ECLK E1ERA E1LAT E1PGM 0000 0000 0 CH3 0000 0000 COCO ADRC ADON CH2 CH1 CH0 0000 0000 0000 0000 0000 0000 $000C POR(1) INTP INTN INTE SCT1 SCT0 SFA SFB SM WDOG(2) ?001 000? SCT0 SCR2 SCR1 SCR0 00uu uuuu SCI baud rate (BAUD) $000D SPC1 SPC0 SCI control 1 (SCCR1) $000E R8 T8 SCI control 2 (SCCR2) $000F TIE TCIE RIE ILIE TE RE RWU SCI status (SCSR) $0010 TDRE TC RDRF IDLE OR NF FE SCI data (SCDR) $0011 Timer control (TCR) $0012 ICIE OCIE TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0 ICF1 OCF1 TOF M WAKE CPOL CPHA LBCL Undefined SBK 0000 0000 1100 000u 0000 0000 ICF2 Undefined Timer status (TSR) $0013 Input capture high 1 $0014 OCF2 Input capture low 1 $0015 Undefined Output compare high 1 $0016 Undefined Output compare low 1 $0017 Undefined Timer counter high $0018 1111 1111 1111 1100 Undefined Timer counter low $0019 Alternate counter high $001A 1111 1111 Alternate counter low $001B 1111 1100 Input capture high 2 $001C Undefined Input capture low 2 $001D Undefined Output compare high 2 $001E Undefined Output compare low 2 $001F Options (OPTR)(3) $0100 Undefined EE1P SEC Not affected (1) The POR bit is set each time there is a power-on reset. (2) The state of the WDOG bit after reset is dependent on the mask option selected; 1=watchdog enabled, 0=watchdog disabled. (3) This register is implemented in EEPROM; therefore reset has no effect on the individual bits. Freescale 3-8 MEMORY AND REGISTERS MC68HC05B6 Rev. 4.1 3.8 Miscellaneous register Address Miscellaneous bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 $000C POR(1) INTP INTN INTE SFA SFB SM bit 0 State on reset WDOG(2) ?001 000? (1) The POR bit is set each time there is a power-on reset. (2) The state of the WDOG bit after reset is dependent on the mask option selected; 1=watchdog enabled, 0=watchdog disabled. POR -- Power-on reset bit (see Section 9.1) This bit is set each time the device is powered on. Therefore, the state of the POR bit allows the user to make a software distinction between a power-on and an external reset. This bit cannot be set by software and is cleared by writing it to zero. 1 (set) - 0 (clear) - A power-on reset has occurred. No power-on reset has occurred. INTP, INTN -- External interrupt sensitivity options (see Section 9.2) These two bits allow the user to select which edge the IRQ pin will be sensitive to (see Table 3-3). Both bits can be written to only while the I-bit is set, and are cleared by power-on or external reset, thus the device is initialised with negative edge and low level sensitivity. Table 3-3 IRQ sensitivity INTP INTN 0 0 Negative edge and low level sensitive IRQ sensitivity 0 1 Negative edge only 1 0 Positive edge only 1 1 Positive and negative edge sensitive INTE -- External interrupt enable (see Section 9.2) 1 (set) - External interrupt function (IRQ) enabled. 0 (clear) - External interrupt function (IRQ) disabled. The INTE bit can be written to only while the I-bit is set, and is set by power-on or external reset, thus enabling the external interrupt function. MC68HC05B6 Rev. 4.1 MEMORY AND REGISTERS Freescale 3-9 3 SFA -- Slow or fast mode selection for PLMA (see Section 7.1) This bit allows the user to select the slow or fast mode of the PLMA pulse length modulation output. 1 (set) 3 - 0 (clear) - Slow mode PLMA (4096 x timer clock period). Fast mode PLMA (256 x timer clock period). SFB -- Slow or fast mode selection for PLMB (see Section 7.1) This bit allows the user to select the slow or fast mode of the PLMB pulse length modulation output. 1 (set) - 0 (clear) - Note: Slow mode PLMB (4096 x timer clock period). Fast mode PLMB (256 x timer clock period). The highest speed of the PLM system corresponds to the frequency of the TOF bit being set, multiplied by 256. The lowest speed of the PLM system corresponds to the frequency of the TOF bit being set, multiplied by 16. Warning: Because the SFA bit and SFB bit are not double buffered, it is mandatory to set the SFA bit and SFB bit to the desired values before writing to the PLM registers; not doing so could temporarily give incorrect values at the PLM outputs. SM -- Slow mode (see Section 2.4.3) 1 (set) - 0 (clear) - The system runs at a bus speed 16 times lower than normal (fOSC/32). SLOW mode affects all sections of the device, including SCI, A/D and timer. The system runs at normal bus speed (fOSC/2). The SM bit is cleared by external or power-on reset. The SM bit is automatically cleared when entering STOP mode. WDOG -- Watchdog enable/disable (see Section 9.1.4) The WDOG bit can be used to enable the watchdog timer previously disabled by a mask option. Following a watchdog reset the state of the WDOG bit is as defined by the mask option specified. Once the watchdog is enabled, the WDOG bit acts as a reset mechanism for the watchdog counter. Writing a'1' to this bit clears the counter to its initial value and prevents a watchdog timeout. 1 (set) - 0 (clear) - Freescale 3-10 Watchdog counter cleared and enabled. The watchdog cannot be disabled by software; writing a zero to this bit has no effect. MEMORY AND REGISTERS MC68HC05B6 Rev. 4.1 4 INPUT/OUTPUT PORTS 4 In single-chip mode, the MC68HC05B6 has a total of 24 I/O lines, arranged as three 8-bit ports (A, B and C), and eight input-only lines, arranged as one 8-bit port (D). Each I/O line is individually programmable as either input or output, under the software control of the data direction registers. The 8-bit input-only port (D) shares its pins with the A/D converter, when the A/D converter is enabled. To avoid glitches on the output pins, data should be written to the I/O port data register before writing ones to the corresponding data direction register bits to set the pins to output mode. 4.1 Input/output programming The bidirectional port lines may be programmed as inputs or outputs under software control. The direction of each pin is determined by the state of the corresponding bit in the port data direction register (DDR). Each port has an associated DDR. Any I/O port pin is configured as an output if its corresponding DDR bit is set to a logic one. A pin is configured as an input if its corresponding DDR bit is cleared to a logic zero. At power-on or reset, all DDRs are cleared, thus configuring all port pins as inputs. The data direction registers can be written to or read by the MCU. During the programmed output state, a read of the data register actually reads the value of the output data latch and not the I/O pin. The operation of the standard port hardware is shown schematically in Figure 4-1. MC68HC05B6 Rev. 4.1 INPUT/OUTPUT PORTS Freescale 4-1 M68HC05 internal connections 4 Data direction register bit DDRn Latched data register bit DATA Output buffer I/O Pin O/P data buffer Input buffer DDRn DATA I/O Pin Output 1 0 0 1 1 1 Input 0 0 tristate 0 1 tristate Figure 4-1 Standard I/O port structure Table 4-1 shows the effect of reading from or writing to an I/O pin in various circumstances. Note that the read/write signal shown is internal and not available to the user. Table 4-1 I/O pin states R/W 0 0 1 1 4.2 DDRn 0 1 0 1 Action of MCU write to/read of data bit The I/O pin is in input mode. Data is written into the output data latch. Data is written into the output data latch, and output to the I/O pin. The state of the I/O pin is read. The I/O pin is in output mode. The output data latch is read. Ports A and B These ports are standard M68HC05 bidirectional I/O ports, each comprising a data register and a data direction register. Reset does not affect the state of the data register, but clears the data direction register, thereby returning all port pins to input mode. Writing a `1' to any DDR bit sets the corresponding port pin to output mode. Freescale 4-2 INPUT/OUTPUT PORTS MC68HC05B6 Rev. 4.1 4.3 Port C In addition to the standard port functions described for port A and B, port C pin 2 can be configured, using the ECLK bit of the EEPROM/ECLK control register, to output the CPU clock. If this is selected the corresponding DDR bit is automatically set and bit 2 of port C will always read the output data latch. The other port C pins are not affected by this feature. EEPROM/ECLK control Address bit 7 bit 6 bit 5 bit 4 $0007 0 0 0 0 bit 3 bit 2 bit 1 bit 0 State on reset ECLK E1ERA E1LAT E1PGM 0000 0000 ECLK -- External clock output bit 1 (set) - 0 (clear) - ECLK CPU clock is output on PC2. ECLK CPU clock is not output on PC2; port C acts as a normal I/O port. The ECLK bit is cleared by power-on or external reset. It is not affected by the execution of a STOP or WAIT instruction. The timing diagram of the clock output is shown in Figure 4-2. Internal clock (PHI2) External clock (ECLK/PC2) Output port (if write to output port) Figure 4-2 ECLK timing diagram 4.4 Port D This 8-bit input-only port shares its pins with the A/D converter subsystem. When the A/D converter is enabled, pins PD0-PD7 read the eight analog inputs to the A/D converter. Port D can be read at any time, however, if it is read during an A/D conversion sequence noise, may be injected on the analog inputs, resulting in reduced accuracy of the A/D. Furthermore, performing MC68HC05B6 Rev. 4.1 INPUT/OUTPUT PORTS Freescale 4-3 4 a digital read of port D with levels other than VDD or VSS on the port D pins will result in greater power dissipation during the read cycle. As port D is an input-only port there is no DDR associated with it. Also, at power up or external reset, the A/D converter is disabled, thus the port is configured as a standard input-only port. Note: It is recommended that all unused input ports and I/O ports be tied to an appropriate logic level (i.e. either VDD or VSS). 4 4.5 Port registers The following sections explain in detail the individual bits in the data and control registers associated with the ports. 4.5.1 Port data registers A and B (PORTA and PORTB) Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Port A data (PORTA) $0000 Undefined Port B data (PORTB) $0001 Undefined Each bit can be configured as input or output via the corresponding data direction bit in the port data direction register (DDRx). The state of the port data registers following reset is not defined. 4.5.2 Port data register C (PORTC) Address Port C data (PORTC) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 PC2/ ECLK $0002 bit 1 bit 0 State on reset Undefined Each bit can be configured as input or output via the corresponding data direction bit in the port data direction register (DDRx). In addition, bit 2 of port C is used to output the CPU clock if the ECLK bit in the EEPROM CTL/ECLK register is set (see Section 4.3). The state of the port data registers following reset is not defined. Freescale 4-4 INPUT/OUTPUT PORTS MC68HC05B6 Rev. 4.1 4.5.3 Port data register D (PORTD) Port D data (PORTD) Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset $0003 PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 Undefined All the port D bits are input-only and are shared with the A/D converter. The function of each bit is determined by the ADON bit in the A/D status/control register. 4 The state of the port data registers following reset is not defined. 4.5.3.1 A/D status/control register Address A/D status/control $0009 bit 7 bit 6 bit 5 COCO ADRC ADON bit 4 bit 3 bit 2 bit 1 bit 0 State on reset 0 CH3 CH2 CH1 CH0 0000 0000 ADON -- A/D converter on 1 (set) - 0 (clear) - A/D converter is switched on; all port D pins act as analog inputs for the A/D converter. A/D converter is switched off; all port D pins act as input only pins. Reset clears the ADON bit, thus configuring port D as an input only port. 4.5.4 Data direction registers (DDRA, DDRB and DDRC) Address Port A data direction (DDRA) bit 7 bit 6 bit 5 bit 4 bit 3 $0004 bit 2 bit 1 bit 0 State on reset 0000 0000 Port B data direction (DDRB) $0005 0000 0000 Port C data direction (DDRC) $0006 0000 0000 Writing a `1' to any bit configures the corresponding port pin as an output; conversely, writing any bit to `0' configures the corresponding port pin as an input. Reset clears these registers, thus configuring all ports as inputs. MC68HC05B6 Rev. 4.1 INPUT/OUTPUT PORTS Freescale 4-5 4.6 Other port considerations All output ports can emulate `open-drain' outputs. This is achieved by writing a zero to the relevant output port latch. By toggling the corresponding data direction bit, the port pin will either be an output zero or tri-state (an input). This is shown diagrammatically in Figure 4-3. 4 When using a port pin as an `open-drain' output, certain precautions must be taken in the user software. If a read-modify-write instruction is used on a port where the `open-drain' is assigned and the pin at this time is programmed as an input, it will read it as a `one'. The read-modify-write instruction will then write this `one' into the output data latch on the next cycle. This would cause the `open-drain' pin not to output a `zero' when desired. Note: `Open-drain' outputs should not be pulled above VDD. Read buffer output (a) A Y Data direction register bit DDRn DDRn A 1 0 Y 1 1 0 0 0 1 1 0 low 1 1 -- 0 0 high 0 1 high Normal operation - tri state tri state tri state 0 1 (b) `Open-drain' VDD VDD Px0 `Open-drain' output (c) DDRx, bit 0 = 0 Portx, bit 0 = 0 DDRx, bit 0 = 0 Portx, bit 0 = 0 Figure 4-3 Port logic levels Freescale 4-6 INPUT/OUTPUT PORTS MC68HC05B6 Rev. 4.1 5 PROGRAMMABLE TIMER The programmable timer on the MC68HC05B6 consists of a 16-bit read-only free-running counter, with a fixed divide-by-four prescaler, plus the input capture/output compare circuitry. The timer can be used for many purposes including measuring pulse length of two input signals and generating two output signals. Pulse lengths for both input and output signals can vary from several microseconds to many seconds. In addition, it works in conjunction with the pulse length modulation (PLM) system, which can also be referred to as the pulse width modulation system, to execute two 8-bit D/A PLM (pulse length modulation) conversions, with a choice of two repetition rates. The timer is also capable of generating periodic interrupts or indicating passage of an arbitrary multiple of four CPU cycles. A block diagram is shown in Figure 5-1, and timing diagrams are shown in Figure 5-2, Figure 5-3, Figure 5-4 and Figure 5-5. The timer has a 16-bit architecture, hence each specific functional segment is represented by two 8-bit registers (except the PLMA and PLMB which use one 8-bit register for each). These registers contain the high and low byte of that functional segment. Accessing the low byte of a specific timer function allows full control of that function; however, an access of the high byte inhibits that specific timer function until the low byte is also accessed. The 16-bit programmable timer is monitored and controlled by a group of sixteen registers, full details of which are contained in this section. Note: 5.1 A problem may arise if an interrupt occurs in the time between the high and low bytes being accessed. To prevent this, the I-bit in the condition code register (CCR) should be set while manipulating both the high and low byte register of a specific timer function, ensuring that an interrupt does not occur. Counter The key element in the programmable timer is a 16-bit, free-running counter or counter register, preceded by a prescaler that divides the internal processor clock by four. The prescaler gives the timer a resolution of 2s if the internal bus clock is 2 MHz. The counter is incremented during the low portion of the internal bus clock. Software can read the counter at any time without affecting its value. MC68HC05B6 Rev. 4.1 PROGRAMMABLE TIMER Freescale 5-1 5 Internal bus 8 Internal processor clock High byte Output compare register 1 5 Low byte High byte Output compare register 2 $0016 $0017 8-bit buffer Low byte High byte $001E $001F /4 16-bit $0018 free-running $0019 counter Counter alternate register COP watchdog counter input To PLM High byte Low byte Low byte High byte Input capture $0014 register 1 $0015 Low byte Input capture $001C register 2 $001D $001A $001B Internal timer bus Output compare circuit 1 Edge detect circuit 2 Edge detect circuit 1 Overflow detect circuit Output compare circuit 2 TCAP2 pin TCAP1 pin D + C D 7 6 5 4 3 ICF1 OCF1 TOF ICF2 OCF2 + Timer status register $0013 ICIE OCIE TOIE FOLV2 FOLV1 OLVL2 IEDG1 OLVL1 C Q TCMP2 pin Latch Q TCMP1 pin Latch Timer control register $0012 Interrupt circuit Input capture interrupt $1FF8,9 Output compare interrupt $1FF6,7 Overflow interrupt $1FF4,5 Figure 5-1 16-bit programmable timer block diagram Freescale 5-2 PROGRAMMABLE TIMER MC68HC05B6 Rev. 4.1 5.1.1 Counter register and alternate counter register Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Timer counter high $0018 1111 1111 Timer counter low $0019 1111 1100 Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Alternate counter high $001A 1111 1111 Alternate counter low $001B 1111 1100 The double-byte, free-running counter can be read from either of two locations, $18-$19 (counter register) or $1A-$1B (alternate counter register). A read from only the less significant byte (LSB) of the free-running counter ($19 or $1B) receives the count value at the time of the read. If a read of the free-running counter or alternate counter register first addresses the more significant byte (MSB) ($18 or $1A), the LSB is transferred to a buffer. This buffer value remains fixed after the first MSB read, even if the user reads the MSB several times. This buffer is accessed when reading the free-running counter or alternate counter register LSB and thus completes a read sequence of the total counter value. In reading either the free-running counter or alternate counter register, if the MSB is read, the LSB must also be read to complete the sequence. If the timer overflow flag (TOF) is set when the counter register LSB is read then a read of the timer status register (TSR) will clear the flag. The alternate counter register differs from the counter register only in that a read of the LSB does not clear TOF. Therefore, where it is critical to avoid the possibility of missing timer overflow interrupts due to clearing of TOF, the alternate counter register should be used. The free-running counter is set to $FFFC during power-on and external reset and is always a read-only register. During a power-on reset, the counter begins running after the oscillator start-up delay. Because the free-running counter is 16 bits preceded by a fixed divide-by-4 prescaler, the value in the free-running counter repeats every 262,144 internal bus clock cycles. TOF is set when the counter overflows (from $FFFF to $0000); this will cause an interrupt if TOIE is set. In some particular timing control applications it may be desirable to reset the 16-bit free running counter under software control. When the low byte of the counter ($19 or $1B) is written to, the counter is configured to its reset value ($FFFC). The divide-by-4 prescaler is also reset and the counter resumes normal counting operation. All of the flags and enable bits remain unaltered by this operation. If access has previously been made to the high byte of the free-running counter ($18 or $1A), then the reset counter operation terminates the access sequence. Warning: This operation may affect the function of the watchdog system (see Section 9.1.4). The PLM results will also be affected while resetting the counter. MC68HC05B6 Rev. 4.1 PROGRAMMABLE TIMER Freescale 5-3 5 5.2 Timer control and status The various functions of the timer are monitored and controlled using the timer control and status registers described below. 5.2.1 Timer control register (TCR) The timer control register ($0012) is used to enable the input captures (ICIE), output compares (OCIE), and timer overflow (TOIE) functions as well as forcing output compares (FOLV1 and FOLV2), selecting input edge sensitivity (IEDG1) and levels of output polarity (OLV1 and OLV2). 5 Timer control (TCR) bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Address bit 7 bit 6 bit 5 $0012 ICIE OCIE TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0 ICIE -- Input captures interrupt enable If this bit is set, a timer interrupt is enabled whenever the ICF1 or ICF2 status flag (in the timer status register) is set. 1 (set) - Interrupt enabled. 0 (clear) - Interrupt disabled. OCIE -- Output compares interrupt enable If this bit is set, a timer interrupt is enabled whenever the OCF1 or OCF2 status flag (in the timer status register) is set. 1 (set) - Interrupt enabled. 0 (clear) - Interrupt disabled. TOIE -- Timer overflow interrupt enable If this bit is set, a timer interrupt is enabled whenever the TOF status flag (in the timer status register) is set. 1 (set) - Interrupt enabled. 0 (clear) - Interrupt disabled. Freescale 5-4 PROGRAMMABLE TIMER MC68HC05B6 Rev. 4.1 FOLV2 -- Force output compare 2 This bit always reads as zero, hence writing a zero to this bit has no effect. Writing a one at this position will force the OLV2 bit to the corresponding output level latch, thus appearing at the TCMP2 pin. Note that this bit does not affect the OCF2 bit of the status register (see Section 5.4.3). 1 (set) - 0 (clear) - OLV2 bit forced to output level latch. No effect. FOLV1 -- Force output compare 1 This bit always reads as zero, hence writing a zero to this bit has no effect. Writing a one at this position will force the OLV1 bit to the corresponding output level latch, thus appearing at the TCMP1 pin. Note that this bit does not affect the OCF1 bit of the status register (see Section 5.4.3). 1 (set) - 0 (clear) - OLV1 bit forced to output level latch. No effect. OLV2 -- Output level 2 When OLV2 is set a high output level will be clocked into the output level register by the next successful output compare, and will appear on the TCMP2 pin. When clear, it will be a low level which will appear on the TCMP2 pin. 1 (set) - 0 (clear) - A high output level will appear on the TCMP2 pin. A low output level will appear on the TCMP2 pin. IEDG1 -- Input edge 1 When IEDG1 is set, a positive-going edge on the TCAP1 pin will trigger a transfer of the free-running counter value to the input capture register 1. When clear, a negative-going edge triggers the transfer. 1 (set) - 0 (clear) - Note: TCAP1 is positive-going edge sensitive. TCAP1 is negative-going edge sensitive. There is no need for an equivalent bit for the input capture register 2 as TCAP2 is negative-going edge sensitive only. OLV1 -- Output level 1 When OLV1 is set a high output level will be clocked into the output level register by the next successful output compare, and will appear on the TCMP1 pin. When clear, it will be a low level which will appear on the TCMP1 pin. 1 (set) - 0 (clear) - MC68HC05B6 Rev. 4.1 A high output level will appear on the TCMP1 pin. A low output level will appear on the TCMP1 pin. PROGRAMMABLE TIMER Freescale 5-5 5 5.2.2 Timer status register (TSR) The timer status register ($13) is a read only register and contains the status bits corresponding to the four timer interrupt conditions - ICF1,OCF1, TOF, ICF2 and OCF2. Accessing the timer status register satisfies the first condition required to clear the status bits. The remaining step is to access the register corresponding to the status bit. Address bit 7 bit 6 bit 5 bit 4 bit 3 $0013 ICF1 OCF1 TOF ICF2 OCF2 Timer status (TSR) 5 bit 2 bit 1 bit 0 State on reset Undefined ICF1 -- Input capture flag 1 This bit is set when the selected polarity of edge is detected by the input capture edge detector 1 at TCAP1; an input capture interrupt will be generated, if ICIE is set. ICF1 is cleared by reading the TSR and then the input capture low register 1 ($15). 1 (set) - 0 (clear) - A valid input capture has occurred. No input capture has occurred. OCF1 -- Output compare flag 1 This bit is set when the output compare 1 register contents match those of the free-running counter; an output compare interrupt will be generated if OCIE is set. OCF1 is cleared by reading the TSR and then reading or writing the output compare 1 low register ($17). 1 (set) - 0 (clear) - A valid output compare has occurred. No output compare has occurred. TOF -- Timer overflow status flag This bit is set when the free-running counter overflows from $FFFF to $0000; a timer overflow interrupt will occur if TOIE is set. TOF is cleared by reading the TSR and the counter low register ($19). 1 (set) - 0 (clear) - Timer overflow has occurred. No timer overflow has occurred. When using the timer overflow function and reading the free-running counter at random times to measure an elapsed time, a problem may occur whereby the timer overflow flag is unintentionally cleared if: 1 The timer status register is read or written when TOF is set, and 1) The LSB of the free-running counter is read, but not for the purpose of servicing the flag. Reading the alternate counter register instead of the counter register will avoid this potential problem. Freescale 5-6 PROGRAMMABLE TIMER MC68HC05B6 Rev. 4.1 ICF2 -- Input capture flag 2 This bit is set when a negative edge is detected by the input capture edge detector 2 at TCAP2; an input capture interrupt will be generated if ICIE is set. ICF2 is cleared by reading the TSR and then the input capture low register 2 ($1D). 1 (set) - A valid (negative) input capture has occurred. 0 (clear) - No input capture has occurred. OCF2 -- Output compare flag 2 This bit is set when the output compare 2 register contents match those of the free-running counter; an output compare interrupt will be generated if OCIE is set. OCF2 is cleared by reading the TSR and then reading or writing the output compare 2 low register ($1F). 1 (set) - A valid output compare has occurred. 0 (clear) - 5.3 No output compare has occurred. Input capture `Input capture' is a technique whereby an external signal is used to trigger a read of the free running counter. In this way it is possible to relate the timing of an external signal to the internal counter value, and hence to elapsed time. There are two input capture registers: input capture register 1 (ICR1) and input capture register 2 (ICR2). The same input capture interrupt enable bit (ICIE) is used for the two input captures. 5.3.1 Input capture register 1 (ICR1) Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Input capture high 1 $0014 Undefined Input capture low 1 $0015 Undefined The two 8-bit registers that make up the 16-bit input capture register 1 are read-only, and are used to latch the value of the free-running counter after the input capture edge detector circuit 1 senses a valid transition at TCAP1. The level transition that triggers the counter transfer is defined by the input edge bit (IEDG1). When an input capture 1 occurs, the corresponding flag ICF1 in TSR is set. An interrupt can also accompany an input capture 1 provided the ICIE bit in TCR is set. The 8 most significant bits are stored in the input capture high 1 register at $14, the 8 least significant bits in the input capture low 1 register at $15. MC68HC05B6 Rev. 4.1 PROGRAMMABLE TIMER Freescale 5-7 5 5 The result obtained from an input capture will be one greater than the value of the free-running counter on the rising edge of the internal bus clock preceding the external transition. This delay is required for internal synchronization. Resolution is one count of the free-running counter, which is four internal bus clock cycles. The free-running counter contents are transferred to the input capture register 1 on each valid signal transition whether the input capture 1 flag (ICF1) is set or clear. The input capture register 1 always contains the free-running counter value that corresponds to the most recent input capture 1. After a read of the input capture 1 register MSB ($14), the counter transfer is inhibited until the LSB ($15) is also read. This characteristic causes the time used in the input capture software routine and its interaction with the main program to determine the minimum pulse period. A read of the input capture 1 register LSB ($15) does not inhibit the free-running counter transfer since the two actions occur on opposite edges of the internal bus clock. Reset does not affect the contents of the input capture 1 register, except when exiting STOP mode (see Section 5.6). 5.3.2 Input capture register 2 (ICR2) Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Input capture high 2 $001C Undefined Input capture low 2 $001D Undefined The two 8-bit registers that make up the 16-bit input capture register 2 are read-only, and are used to latch the value of the free-running counter after the input capture edge detector circuit 2 senses a negative transition at pin TCAP2. When an input capture 2 occurs, the corresponding flag ICF2 in TSR is set. An interrupt can also accompany an input capture 2 provided the ICIE bit in TCR is set.The 8 most significant bits are stored in the input capture 2 high register at $1C, the 8 least significant bits in the input capture 2 low register at $1D. The result obtained from an input capture will be one greater than the value of the free-running counter on the rising edge of the internal bus clock preceding the external transition. This delay is required for internal synchronization. Resolution is one count of the free-running counter, which is four internal bus clock cycles. The free-running counter contents are transferred to the input capture register 2 on each negative signal transition whether the input capture 2 flag (IC2F) is set or clear. The input capture register 2 always contains the free-running counter value that corresponds to the most recent input capture 2. After a read of the input capture register 2 MSB ($1C), the counter transfer is inhibited until the LSB ($1D) is also read. This characteristic causes the time used in the input capture software routine and its interaction with the main program to determine the minimum pulse period. A read of the input capture register 2 LSB ($1C) does not inhibit the free-running counter transfer since the two actions occur on opposite edges of the internal bus clock. Reset does not affect the contents of the input capture 2 register, except when exiting STOP mode (see Section 5.6). Freescale 5-8 PROGRAMMABLE TIMER MC68HC05B6 Rev. 4.1 5.4 Output compare `Output compare' is a technique which may be used, for example, to generate an output waveform, or to signal when a specific time period has elapsed, by presetting the output compare register to the appropriate value. There are two output compare registers: output compare register 1 (OCR1) and output compare register 2 (OCR2), both of which are read or write registers. Note: The same output compare interrupt enable bit (OCIE) is used for the two output compares. 5.4.1 5 Output compare register 1 (OCR1) Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Output compare high 1 $0016 Undefined Output compare low 1 $0017 Undefined The 16-bit output compare register 1 is made up of two 8-bit registers at locations $16 (MSB) and $17 (LSB). The contents of the output compare register 1 are compared with the contents of the free-running counter continually and, if a match is found, the corresponding output compare flag (OCF1) in the timer status register is set and the output level (OLVL1) is transferred to pin TCMP1. The output compare register 1 values and the output level bit should be changed after each successful comparison to establish a new elapsed timeout. An interrupt can also accompany a successful output compare provided the corresponding interrupt enable bit (OCIE) is set. (The free-running counter is updated every four internal bus clock cycles.) After a processor write cycle to the output compare register 1 containing the MSB ($16), the output compare function is inhibited until the LSB ($17) is also written. The user must write both bytes (locations) if the MSB is written first. A write made only to the LSB ($17) will not inhibit the compare 1 function. The processor can write to either byte of the output compare register 1 without affecting the other byte. The output level (OLVL1) bit is clocked to the output level register and hence to the TCMP1 pin whether the output compare flag 1 (OCF1) is set or clear. The minimum time required to update the output compare register 1 is a function of the program rather than the internal hardware. Because the output compare flag 1 and the output compare register 1 are not defined at power on, and not affected by reset, care must be taken when initializing output compare functions with software. The following procedure is recommended: - Write to output compare high 1 to inhibit further compares; - Read the timer status register to clear OCF1 (if set); - Write to output compare low 1 to enable the output compare 1 function. MC68HC05B6 Rev. 4.1 PROGRAMMABLE TIMER Freescale 5-9 The purpose of this procedure is to prevent the OCF1 bit from being set between the time it is read and the write to the corresponding output compare register. All bits of the output compare register are readable and writable and are not altered by the timer hardware or reset. If the compare function is not needed, the two bytes of the output compare register can be used as storage locations. 5.4.2 Output compare register 2 (OCR2) Address 5 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Output compare high 2 $001E Undefined Output compare low 2 $001F Undefined The 16-bit output compare register 2 is made up of two 8-bit registers at locations $1E (MSB) and $1F (LSB). The contents of the output compare register 2 are compared with the contents of the free-running counter continually and, if a match is found, the corresponding output compare flag (OCF2) in the timer status register is set and the output level (OLVL2) is transferred to pin TCMP2. The output compare register 2 values and the output level bit should be changed after each successful comparison to establish a new elapsed timeout. An interrupt can also accompany a successful output compare provided the corresponding interrupt enable bit (OCIE) is set. (The free-running counter is updated every four internal bus clock cycles.) After a processor write cycle to the output compare register 2 containing the MSB ($1E), the output compare function is inhibited until the LSB ($1F) is also written. The user must write both bytes (locations) if the MSB is written first. A write made only to the LSB ($1F) will not inhibit the compare 2 function. The processor can write to either byte of the output compare register 2 without affecting the other byte. The output level (OLVL2) bit is clocked to the output level register and hence to the TCMP2 pin whether the output compare flag 2 (OCF2) is set or clear. The minimum time required to update the output compare register 2 is a function of the program rather than the internal hardware. Because the output compare flag 2 and the output compare register 2 are not defined at power on, and not affected by reset, care must be taken when initializing output compare functions with software. The following procedure is recommended: - Write to output compare high 2 to inhibit further compares; - Read the timer status register to clear OCF2 (if set); - Write to output compare low 2 to enable the output compare 2 function. Freescale 5-10 PROGRAMMABLE TIMER MC68HC05B6 Rev. 4.1 The purpose of this procedure is to prevent the OCF1 bit from being set between the time it is read and the write to the corresponding output compare register. All bits of the output compare register are readable and writable and are not altered by the timer hardware or reset. If the compare function is not needed, the two bytes of the output compare register can be used as storage locations. 5.4.3 Software force compare A software force compare is required in many applications. To achieve this, bit 3 (FOLV1 for OCR1) and bit 4 (FOLV2 for OCR2) in the timer control register are used. These bits always read as `zero', but a write to `one' causes the respective OLVL1 or OLVL2 values to be copied to the respective output level (TCMP1 and TCMP2 pins). Internal logic is arranged such that in a single instruction, one can change OLVL1 and/or OLVL2, at the same time causing a forced output compare with the new values of OLVL1 and OLVL2. In conjunction with normal compare, this function allows a wide range of applications including fixed frequency generation. Note: 5.5 A software force compare will affect the corresponding output pin TCMP1 and/or TCMP2, but will not affect the compare flag, thus it will not generate an interrupt. Pulse Length Modulation (PLM) The programmable timer works in conjunction with the PLM system to execute two 8-bit D/A PLM conversions, with a choice of two repetition rates (see Section 7). 5.5.1 Pulse length modulation registers A and B (PLMA/PLMB) Address Pulse length modulation A (PLMA) MC68HC05B6 Rev. 4.1 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 $000A Address Pulse length modulation B (PLMB) bit 7 State on reset 0000 0000 bit 7 bit 6 bit 5 bit 4 $000B PROGRAMMABLE TIMER bit 3 bit 2 bit 1 bit 0 State on reset 0000 0000 Freescale 5-11 5 5.6 Timer during STOP mode When the MCU enters STOP mode, the timer counter stops counting and remains at that particular count value until STOP mode is exited by an interrupt. If STOP mode is exited by power-on or external reset, the counter is forced to $FFFC but if it is exited by external interrupt (IRQ) then the counter resumes from its stopped value. Another feature of the programmable timer is that if at least one valid input capture edge occurs at one of the TCAP pins while in STOP mode, the corresponding input capture detect circuitry is armed. This action does not wake the MCU or set any timer flags, but when the MCU does wake-up there will be an active input capture flag (and data) from that first valid edge which occurred during STOP mode. 5 If STOP mode is exited by an external reset then no such input capture flag or data action takes place even if there was a valid input capture edge (at one of the TCAP pins) during STOP mode. 5.7 Timer during WAIT mode The timer system is not affected by WAIT mode and continues normal operation. Any valid timer interrupt will wake-up the system. 5.8 Timer state diagrams The relationships between the internal clock signals, the counter contents and the status of the flag bits are shown in the following figures. It should be noted that the signals labelled `internal' (processor clock, timer clocks and reset) are not available to the user. Freescale 5-12 PROGRAMMABLE TIMER MC68HC05B6 Rev. 4.1 Internal processor clock Internal reset Internal timer clocks T00 T01 T10 T11 16-bit counter $FFFC $FFFD $FFFE $FFFF 5 External reset or end of POR Note: The counter and timer control registers are the only ones affected by power-on or external reset. Figure 5-2 Timer state timing diagram for reset Internal processor clock Internal timer clocks T00 T01 T10 T11 16-bit counter $F124 $F125 $F126 } } } } Input edge $F123 Internal capture latch Input capture register $???? $F124 Input capture flag Note: If the input edge occurs in the shaded area from one timer state T10 to the next timer state T10, then the input capture flag will be set during the next T11 state. Figure 5-3 Timer state timing diagram for input capture MC68HC05B6 Rev. 4.1 PROGRAMMABLE TIMER Freescale 5-13 Internal processor clock Internal timer clocks T00 T01 T10 T11 16-bit counter $F456 $F457 $F458 $F459 (Note 1) Output compare register 5 CPU writes $F457 (Note 1) Compare register latch (Note 2) Output compare flag and TCMP1,2 Note: $F457 1 The CPU write to the compare registers may take place at any time, but a compare only occurs at timer state T01. Thus a four cycle difference may exist between the write to the compare register and the actual compare. 1) The output compare flag is set at the timer state T11 that follows the comparison match ($F457 in this example). Figure 5-4 Timer state timing diagram for output compare Internal processor clock Internal timer clocks T00 T01 T10 T11 16-bit counter $FFFF $0000 $0001 $0002 Timer overflow flag Note: The timer overflow flag is set at timer state T11 (transition of counter from $FFFF to $0000). It is cleared by a read of the timer status register during the internal processor clock high time, followed by a read of the counter low register. Figure 5-5 Timer state timing diagram for timer overflow Freescale 5-14 PROGRAMMABLE TIMER MC68HC05B6 Rev. 4.1 6 SERIAL COMMUNICATIONS INTERFACE A full-duplex asynchronous serial communications interface (SCI) is provided with a standard non-return-to-zero (NRZ) format and a variety of baud rates. The SCI transmitter and receiver are functionally independent and have their own baud rate generator; however they share a common baud rate prescaler and data format. The serial data format is standard mark/space (NRZ) and provides one start bit, eight or nine data bits, and one stop bit. 6 The SCLK pin is the output of the transmitter clock. It outputs the transmitter data clock for synchronous transmission (no clocks on start bit and stop bit, and a software option to send clock on last data bit). This allows control of peripherals containing shift registers (e.g. LCD drivers). Phase and polarity of these clocks are software programmable. Any SCI bidirectional communication requires a two-wire system: receive data in (RDI) and transmit data out (TDO). `Baud' and `bit rate' are used synonymously in the following description. 6.1 SCI two-wire system features * Standard NRZ (mark/space) format * Advanced error detection method with noise detection for noise duration of up to 1/16th bit time * Full-duplex operation (simultaneous transmit and receive) * 32 software selectable baud rates * Different baud rates for transmit and receive; for each transmit baud rate, 8 possible receive baud rates * Software selectable word length (eight or nine bits) * Separate transmitter and receiver enable bits * Capable of being interrupt driven * Transmitter clocks available without altering the regular transmitter or receiver functions * Four separate enable bits for interrupt control 71 MC68HC05B6 Rev. 4.1 SERIAL COMMUNICATIONS INTERFACE Freescale 6-1 Internal bus SCI interrupt + $0011 (See note) Transmit data register $0011 (See note) & & & & Transmit data shift register TDO pin + 6 7 TRDE TE 6 TC 5 RDRF 7 6 5 4 3 2 1 0 Receive data shift register RDI pin SCSR $0010 4 IDLE 3 OR 2 NF 1 FE Wake up unit 7 SBK Flag control Transmitter control Receiver control Transmitter clock SCLK pin $000F SCCR2 TIE TCIE RIE ILIE TE RE SBK RWU Receive data register Receiver clock Clock extraction phase and polarity control 7 R8 Note: 6 T8 5 4 M 3 WAKE 2 CPOL 1 CPHA 0 LBCL SCCR1 $000E The serial communications data register (SCI SCDR) is controlled by the internal R/W signal. It is the transmit data register when written to and the receive data register when read. Figure 6-1 Serial communications interface block diagram 71 Freescale 6-2 SERIAL COMMUNICATIONS INTERFACE MC68HC05B6 Rev. 4.1 6.2 SCI receiver features * Receiver wake-up function (idle line or address bit) * Idle line detection * Framing error detection * Noise detection * Overrun detection * Receiver data register full flag 6.3 SCI transmitter features * Transmit data register empty flag * Transmit complete flag * Send break 6.4 6 Functional description A block diagram of the SCI is shown in Figure 6-1. Option bits in serial control register1 (SCCR1) select the `wake-up' method (WAKE bit) and data word length (M-bit) of the SCI. SCCR2 provides control bits that individually enable the transmitter and receiver, enable system interrupts and provide the wake-up enable bit (RWU) and the send break code bit (SBK). Control bits in the baud rate register (BAUD) allow the user to select one of 32 different baud rates for the transmitter and receiver (see Section 6.11.5). Data transmission is initiated by writing to the serial communications data register (SCDR). Provided the transmitter is enabled, data stored in the SCDR is transferred to the transmit data shift register. This transfer of data sets the transmit data register empty flag (TDRE) in the SCI status register (SCSR) and generates an interrupt (if transmitter interrupts are enabled). The transfer of data to the transmit data shift register is synchronized with the bit rate clock (see Figure 6-2). All data is transmitted least significant bit first. Upon completion of data transmission, the transmission complete flag (TC) in the SCSR is set (provided no pending data, preamble or break is to be sent) and an interrupt is generated (if the transmit complete interrupt is enabled). If the transmitter is disabled, and the data, preamble or break (in the transmit data shift register) has been sent, the TC bit will also be set. This will also generate an interrupt if the transmission complete interrupt enable bit (TCIE) is set. If the transmitter is disabled during a transmission, the character being transmitted will be completed before the transmitter gives up control of the TDO pin. 71 MC68HC05B6 Rev. 4.1 SERIAL COMMUNICATIONS INTERFACE Freescale 6-3 When SCDR is read, it contains the last data byte received, provided that the receiver is enabled. The receive data register full flag bit (RDRF) in the SCSR is set to indicate that a data byte has been transferred from the input serial shift register to the SCDR; this will cause an interrupt if the receiver interrupt is enabled. The data transfer from the input serial shift register to the SCDR is synchronized by the receiver bit rate clock. The OR (overrun), NF (noise), or FE (framing) error flags in the SCSR may be set if data reception errors occurred. An idle line interrupt is generated if the idle line interrupt is enabled and the IDLE bit (which detects idle line transmission) in SCSR is set. This allows a receiver that is not in the wake-up mode to detect the end of a message or the preamble of a new message, or to resynchronize with the transmitter. A valid character must be received before the idle line condition or the IDLE bit will not be set and idle line interrupt will not be generated. 6 The SCP0 and SCP1 bits function as a prescaler for SCR0-SCR2 to generate the receiver baud rate and for SCT0-SCT2 to generate the transmitter baud rate. Together, these eight bits provide multiple transmitter/receiver rate combinations for a given crystal frequency (see Figure 6-2). This register should only be written to while both the transmitter and receiver are disabled (TE=0, RE=0). Internal processor clock SCP0 - SCP1 prescaler rate control (/ NP) SCR0 - SCR2 receiver rate control (/ NR) SCT0 - SCT2 transmitter rate control (/ NT) /16 Transmitter clock Note: SCP1 SPC0 SCT2 SCT1 SCT0 SCR2 SCR1 SCR0 7 6 5 4 3 2 1 0 Baud rate register $000D Receiver clock There is a fixed rate divide-by-16 before the transmitter to compensate for the inherent divide-by-16 of the receiver (sampling). This means that by loading the same value for both the transmitter and receiver baud rate selector, the same baud rates can be obtained. Figure 6-2 SCI rate generator division 71 Freescale 6-4 SERIAL COMMUNICATIONS INTERFACE MC68HC05B6 Rev. 4.1 6.5 Data format Receive data or transmit data is the serial data that is transferred to the internal data bus from the receive data input pin (RDI) or from the internal bus to the transmit data output pin (TDO). The non-return-to-zero (NRZ) data format shown in Figure 6-3 is used and must meet the following criteria: - The idle line is brought to a logic one state prior to transmission/reception of a character. - A start bit (logic zero) is used to indicate the start of a frame. - The data is transmitted and received least significant bit first. - A stop bit (logic one) is used to indicate the end of a frame. A frame consists of a start bit, a character of eight or nine data bits, and a stop bit. - A break is defined as the transmission or reception of a low (logic zero) for at least one complete frame time (10 zeros for 8-bit format, 11 zeros for 9-bit). 6 Control bit M selects 8 or 9 bit data Idle line 0 1 2 3 4 5 6 7 0 8 Start Stop Start Figure 6-3 Data format 6.6 Receiver wake-up operation The receiver logic hardware also supports a receiver wake-up function which is intended for systems having more than one receiver. With this function a transmitting device directs messages to an individual receiver or group of receivers by passing addressing information as the initial byte(s) of each message. The wake-up function allows receivers not addressed to remain in a dormant state for the remainder of the unwanted message. This eliminates any further software overhead to service the remaining characters of the unwanted message and thus improves system performance. The receiver is placed in wake-up mode by setting the receiver wake-up bit (RWU) in the SCCR2 register. While RWU is set, all of the receiver related status flags (RDRF, IDLE, OR, NF, and FE) are inhibited (cannot become set). Note that the idle line detect function is inhibited while the RWU bit is set. Although RWU may be cleared by a software write to SCCR2, it would be unusual to do so. Normally RWU is set by software and is cleared automatically in hardware by one of the two methods described below. 71 MC68HC05B6 Rev. 4.1 SERIAL COMMUNICATIONS INTERFACE Freescale 6-5 6.6.1 Idle line wake-up In idle line wake-up mode, a dormant receiver wakes up as soon as the RDI line becomes idle. Idle is defined as a continuous logic high level on the RDI line for ten (or eleven) full bit times. Systems using this type of wake-up must provide at least one character time of idle between messages to wake up sleeping receivers, but must not allow any idle time between characters within a message. 6.6.2 6 Address mark wake-up In address mark wake-up, the most significant bit (MSB) in a character is used to indicate whether it is an address (1) or data (0) character. Sleeping receivers will wake up whenever an address character is received. Systems using this method for wake-up would set the MSB of the first character of each message and leave it clear for all other characters in the message. Idle periods may be present within messages and no idle time is required between messages for this wake-up method. 6.7 Receive data in (RDI) Receive data is the serial data that is applied through the input line and the SCI to the internal bus. The receiver circuitry clocks the input at a rate equal to 16 times the baud rate. This time is referred to as the RT rate in Figure 6-4 and as the receiver clock in Figure 6-2. The receiver clock generator is controlled by the baud rate register, as shown in Figure 6-1 and Figure 6-2; however, the SCI is synchronized by the start bit, independent of the transmitter. Once a valid start bit is detected, the start bit, each data bit and the stop bit are sampled three times at RT intervals 8 RT, 9 RT and 10 RT (1 RT is the position where the bit is expected to start), as shown in Figure 6-5. The value of the bit is determined by voting logic which takes the value of the majority of the samples. A noise flag is set when all three samples on a valid start bit or data bit or the stop bit do not agree. 6.8 Start bit detection When the input (idle) line is detected low, it is tested for three more sample times (referred to as the start edge verification samples in Figure 6-4). If at least two of these three verification samples detect a logic zero, a valid start bit has been detected, otherwise the line is assumed to be idle. A noise flag is set if one of the three verification samples detect a logic one, thus a valid start bit could be assumed with a set noise flag present. 71 Freescale 6-6 SERIAL COMMUNICATIONS INTERFACE MC68HC05B6 Rev. 4.1 16X internal sampling clock RT clock edges for all three examples 1RT 2RT 3RT 4RT 5RT 6RT 7RT 8RT Idle Start RDI 1 1 1 1 1 1 1 1 1 1 1 Start qualifiers 0 0 Start 0 0 Start edge verification samples Noise RDI 1 1 1 1 1 1 1 1 1 1 1 0 0 1 0 0 0 0 Start Noise RDI 1 1 1 1 1 0 1 1 1 1 1 0 6 Figure 6-4 SCI examples of start bit sampling technique Previous bit Present bit Next bit < < < RDI Samples 16RT 1RT 8RT 9RT 10RT 16RT 1RT Figure 6-5 SCI sampling technique used on all bits If there has been a framing error without detection of a break (10 zeros for 8 bit format or 11 zeros for 9 bit format), the circuit continues to operate as if there actually was a stop bit, and the start edge will be placed artificially. The last bit received in the data shift register is inverted to a logic one, and the three logic one start qualifiers (shown in Figure 6-4) are forced into the sample shift register during the interval when detection of a start bit is anticipated (see Figure 6-6); therefore, the start bit will be accepted no sooner than it is anticipated. 71 MC68HC05B6 Rev. 4.1 SERIAL COMMUNICATIONS INTERFACE Freescale 6-7 If the receiver detects that a break (RDRF = 1, FE = 1, receiver data register = $0000) produced the framing error, the start bit will not be artificially induced and the receiver must actually detect a logic one before the start bit can be recognised (see Figure 6-7). Data Expected stop Artificial edge Data Start bit RDI Data samples a) Case 1: receive line low during artificial edge Data 6 Expected stop Start edge Data Start bit RDI Data samples b) Case 2: receive line high during expected start edge Figure 6-6 Artificial start following a framing error Expected stop Detected as valid start edge Break Start bit RDI Data samples Start qualifiers Start edge verification samples Figure 6-7 SCI start bit following a break 6.9 Transmit data out (TDO) Transmit data is the serial data from the internal data bus that is applied through the SCI to the output line. Data format is as discussed in Section 6.5 and shown in Figure 6-3. The transmitter generates a bit time by using a derivative of the RT clock, thus producing a transmission rate equal to 1/16th that of the receiver sample clock (assuming the same baud rate is selected for both the receiver and transmitter). 71 Freescale 6-8 SERIAL COMMUNICATIONS INTERFACE MC68HC05B6 Rev. 4.1 6.10 SCI synchronous transmission The SCI transmitter allows the user to control a one way synchronous serial transmission. The SCLK pin is the clock output of the SCI transmitter. No clocks are sent to that pin during start bit and stop bit. Depending on the state of the LBCL bit (bit 0 of SCCR1), clocks will or will not be activated during the last valid data bit (address mark). The CPOL bit (bit 2 of SCCR1) allows the user to select the clock polarity, and the CPHA bit (bit 1 of SCCR1) allows the user to select the phase of the external clock (see Figure 6-8, Figure 6-9 and Figure 6-10). During idle, preamble and send break, the external SCLK clock is not activated. These options allow the user to serially control peripherals which consist of shift registers, without losing any functions of the SCI transmitter which can still talk to other SCI receivers. These options do not affect the SCI receiver which is independent of the transmitter. The SCLK pin works in conjunction with the TDO pin. When the SCI transmitter is disabled (TE = 0), the SCLK and TDO pins go to the high impedance state. Note: 6 The LBCL, CPOL and CPHA bits have to be selected before enabling the transmitter to ensure that the clocks function correctly. These bits should not be changed while the transmitter is enabled. RDI Data out TDO Data in Asynchronous (e.g. Modem) SCLK MC68HC05B6 Data in Clock Output port Enable Synchronous (e.g. shift register, display driver, etc.) Figure 6-8 SCI example of synchronous and asynchronous transmission 71 MC68HC05B6 Rev. 4.1 SERIAL COMMUNICATIONS INTERFACE Freescale 6-9 6.11 SCI registers The SCI system is configured and controlled by five registers: SCDR, SCCR1, SCCR2, SCSR, and BAUD. 6.11.1 Serial communications data register (SCDR) Address SCI data (SCDR) 6 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 $0011 State on reset 0000 0000 The SCDR is controlled by the internal R/W signal and performs two functions in the SCI. It acts as the receive data register (RDR) when it is read and as the transmit data register (TDR) when it is written. Figure 6-1 shows this register as two separate registers, RDR and TDR. The RDR provides the interface from the receive shift register to the internal data bus and the TDR provides the parallel interface from the internal data bus to the transmit shift register. The receive data register is a read-only register containing the last byte of data received from the shift register for the internal data bus. The RDR full bit (RDRF) in the serial communications status register is set to indicate that a byte has been transferred from the input serial shift register to the SCDR. The transfer is synchronized with the receiver bit rate clock (from the receiver control) as shown in Figure 6-1. All data is received with the least significant bit first. The transmit data register (TDR) is a write-only register containing the next byte of data to be applied to the transmit shift register from the internal data bus. As long as the transmitter is enabled, data stored in the SCDR is transferred to the transmit shift register (after the current byte in the shift register has been transmitted). The transfer is synchronized with the transmitter bit rate clock (from the transmitter control) as shown in Figure 6-1. All data is received with the least significant bit first. 6.11.2 Serial communications control register 1 (SCCR1) SCI control 1 (SCCR1) Address bit 7 bit 6 $000E R8 T8 bit 5 bit 4 M bit 3 bit 2 bit 1 WAKE CPOL CPHA bit 0 State on reset LBCL Undefined The SCI control register 1 (SCCR1) contains control bits related to the nine data bit character format, the receiver wake-up feature and the options to output the transmitter clocks for synchronous transmissions. 71 Freescale 6-10 SERIAL COMMUNICATIONS INTERFACE MC68HC05B6 Rev. 4.1 R8 -- Receive data bit 8 This read-only bit is the ninth serial data bit received when the SCI system is configured for nine data bit operation (M = 1). The most significant bit (bit 8) of the received character is transferred into this bit at the same time as the remaining eight bits (bits 0-7) are transferred from the serial receive shifter to the SCI receive data register. T8 -- Transmit data bit 8 This read/write bit is the ninth data bit to be transmitted when the SCI system is configured for nine data bit operation (M = 1). When the eight low order bits (bits 0-7) of a transmit character are transferred from the SCI data register to the serial transmit shift register, this bit (bit 8) is transferred to the ninth bit position of the shifter. M -- Mode (select character format) The read/write M-bit controls the character length for both the transmitter and receiver at the same time. The 9th data bit is most commonly used as an extra stop bit or it can also be used as a parity bit (see Table 6-1). 1 (set) - Start bit, 9 data bits, 1 stop bit. 0 (clear) - Start bit, 8 data bits, 1 stop bit. 6 Table 6-1 Method of receiver wake-up WAKE M Method of receiver wake-up 0 x Detection of an idle line allows the next data type received to cause the receive data register to fill and produce an RDRF flag. 1 0 Detection of a received one in the eighth data bit allows an RDRF flag and associated error flags. 1 1 Detection of a received one in the ninth data bit allows an RDRF flag and associated error flags. x = Don't care WAKE -- Wake-up mode select This bit allows the user to select the method for receiver wake-up. The WAKE bit can be read or written to any time. See Table 6-1. 1 (set) - Wake-up on address mark; if RWU is set, SCI will wake-up if the 8th (if M=0) or 9th (if M=1) bit received on the Rx line is set. 0 (clear) - Wake-up on idle line; if RWU is set, SCI will wake-up after 11 (if M=0) or 12 (if M=1) consecutive `1's on the Rx line. 71 MC68HC05B6 Rev. 4.1 SERIAL COMMUNICATIONS INTERFACE Freescale 6-11 CPOL - Clock polarity This bit allows the user to select the polarity of the clocks to be sent to the SCLK pin. It works in conjunction with the CPHA bit to produce the desired clock-data relation (see Figure 6-9 and Figure 6-10). 1 (set) - 0 (clear) - Steady high value at SCLK pin outside transmission window. Steady low value at SCLK pin outside transmission window. This bit should not be manipulated while the transmitter is enabled. CPHA - Clock phase This bit allows the user to select the phase of the clocks to be sent to the SCLK pin. This bit works in conjunction with the CPOL bit to produce the desired clock-data relation (see Figure 6-9 and Figure 6-10). 6 1 (set) - 0 (clear) - SCLK clock line activated at beginning of data bit. SCLK clock line activated in middle of data bit. This bit should not be manipulated while the transmitter is enabled. Idle or preceding transmission M = 0 (8 data bits) Start Stop clock (CPOL = 0, CPHA = 0) * clock (CPOL = 0, CPHA = 1) * clock (CPOL = 1, CPHA = 0) * clock (CPOL = 1, CPHA = 1) data Idle or next transmission * 0 Start LSB 1 2 3 4 5 7 6 MSB Stop * LBCL bit controls last data clock Figure 6-9 SCI data clock timing diagram (M=0) 71 Freescale 6-12 SERIAL COMMUNICATIONS INTERFACE MC68HC05B6 Rev. 4.1 Idle or preceding transmission Idle or next Stop transmission M = 1 (9 data bits) Start clock (CPOL = 0, CPHA = 0) * clock (CPOL = 0, CPHA = 1) * clock (CPOL = 1, CPHA = 0) * clock (CPOL = 1, CPHA = 1) * data 0 1 2 3 4 5 7 6 8 MSB Stop Start LSB 6 * LBCL bit controls last data clock Figure 6-10 SCI data clock timing diagram (M=1) LBCL - Last bit clock This bit allows the user to select whether the clock associated with the last data bit transmitted (MSB) has to be output to the SCLK pin. The clock of the last data bit is output to the SCLK pin if the LBCL bit is a logic one, and is not output if it is a logic zero. The last bit is the 8th or 9th data bit transmitted depending on the 8 or 9 bit format selected by M-bit (seeTable 6-2). This bit should not be manipulated while the transmitter is enabled. Table 6-2 SCI clock on SCLK pin Data format M-bit LBCL bit Number of clocks on SCLK pin 8 bit 0 0 7 8 bit 0 1 8 9 bit 1 0 8 9 bit 1 1 9 71 MC68HC05B6 Rev. 4.1 SERIAL COMMUNICATIONS INTERFACE Freescale 6-13 6.11.3 Serial communications control register 2 (SCCR2) The SCI control register 2 (SCCR2) provides the control bits that enable/disable individual SCI functions. SCI control (SCCR2) Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset $000F TIE TCIE RIE ILIE TE RE RWU SBK 0000 0000 TIE -- Transmit interrupt enable 1 (set) 6 - TDRE interrupts enabled. 0 (clear) - TDRE interrupts disabled. TCIE -- Transmit complete interrupt enable 1 (set) - TC interrupts enabled. 0 (clear) - TC interrupts disabled. RIE -- Receiver interrupt enable 1 (set) - RDRF and OR interrupts enabled. 0 (clear) - RDRF and OR interrupts disabled. ILIE -- Idle line interrupt enable 1 (set) - IDLE interrupts enabled. 0 (clear) - IDLE interrupts disabled. TE -- Transmitter enable When the transmit enable bit is set, the transmit shift register output is applied to the TDO line and the corresponding clocks are applied to the SCLK pin. Depending on the state of control bit M (SCCR1), a preamble of 10 (M = 0) or 11 (M = 1) consecutive ones is transmitted when software sets the TE bit from a cleared state. If a transmission is in progress and a zero is written to TE, the transmitter will wait until after the present byte has been transmitted before placing the TDO and the SCLK pin in the idle, high impedance state. If the TE bit has been written to a zero and then set to a one before the current byte is transmitted, the transmitter will wait for that byte to be transmitted and will then initiate transmission of a new preamble. After this latest transmission, and provided the TDRE bit is set (no new data to transmit), the line remains idle (driven high while TE = 1); otherwise, normal transmission occurs. This function allows the user to neatly terminate a transmission sequence. 71 Freescale 6-14 SERIAL COMMUNICATIONS INTERFACE MC68HC05B6 Rev. 4.1 After loading the last byte in the serial communications data register and receiving the TDRE flag, the user should clear TE. Transmission of the last byte will then be completed and the line will go idle. 1 (set) - Transmitter enabled. 0 (clear) - Transmitter disabled. RE -- Receiver enable 1 (set) - Receiver enabled. 0 (clear) - Receiver disabled. When RE is clear (receiver disabled) all the status bits associated with the receiver (RDRF, IDLE, OR, NF and FE) are inhibited. RWU -- Receiver wake-up When the receiver wake-up bit is set by the user software, it puts the receiver to sleep and enables the wake-up function. The type of wake-up mode for the receiver is determined by the WAKE bit discussed above (in the SCCR1). When the RWU bit is set, no status flags will be set. Flags which were set previously will not be cleared when RWU is set. 6 If the WAKE bit is cleared, RWU is cleared by the SCI logic after receiving 10 (M = 0) or 11 (M =1) consecutive ones. Under these conditions, RWU cannot be set if the line is idle. If the WAKE bit is set, RWU is cleared after receiving an address bit. The RDRF flag will then be set and the address byte stored in the receiver data register. SBK -- Send break If the send break bit is toggled set and cleared, the transmitter sends 10 (M = 0) or 11 (M = 1) zeros and then reverts to idle sending data. If SBK remains set, the transmitter will continually send whole blocks of zeros (sets of 10 or 11) until cleared. At the completion of the break code, the transmitter sends at least one high bit to guarantee recognition of a valid start bit. 71 MC68HC05B6 Rev. 4.1 SERIAL COMMUNICATIONS INTERFACE Freescale 6-15 6.11.4 Serial communications status register (SCSR) SCI status (SCSR) Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 $0010 TDRE TC RDRF IDLE OR NF FE bit 0 State on reset 1100 000u The serial communications status register (SCSR) provides inputs to the interrupt logic circuits for generation of the SCI system interrupt. In addition, a noise flag bit and a framing error bit are also contained in the SCSR. TDRE -- Transmit data register empty flag This bit is set when the contents of the transmit data register are transferred to the serial shift register. New data will not be transmitted unless the SCSR register is read before writing to the transmit data register to clear the TDRE flag. 6 If the TDRE bit is clear, this indicates that the transfer has not yet occurred and a write to the serial communications data register will overwrite the previous value. The TDRE bit is cleared by accessing the serial communications status register (with TDRE set) followed by writing to the serial communications data register. TC -- Transmit complete flag This bit is set to indicate that the SCI transmitter has no meaningful information to transmit (no data in shifter, no preamble, no break). When TC is set the serial line will go idle (continuous MARK). The TC bit is cleared by accessing the serial communications status register (with TC set) followed by writing to the serial communications data register. It does not inhibit the transmitter function in any way. RDRF -- Receive data register full flag This bit is set when the contents of the receiver serial shift register are transferred to the receiver data register. If multiple errors are detected in any one received word, the NF and RDRF bits will be affected as appropriate during the same clock cycle. The RDRF bit is cleared when the serial communications status register is accessed (with RDRF set) followed by a read of the serial communications data register. IDLE -- Idle line detected flag This bit is set when a receiver idle line is detected (the receipt of a minimum of ten/eleven consecutive "1"s). This bit will not be set by the idle line condition when the RWU bit is set. This allows a receiver that is not in the wake-up mode to detect the end of a message, detect the preamble of a new message or resynchronize with the transmitter. The IDLE bit is cleared by accessing the serial communications status register (with IDLE set) followed by a read of the serial communications data register. Once cleared, IDLE will not be set again until after RDRF has been set, (i.e. until after the line has been active and becomes idle again). 71 Freescale 6-16 SERIAL COMMUNICATIONS INTERFACE MC68HC05B6 Rev. 4.1 OR -- Overrun error flag This bit is set when a new byte is ready to be transferred from the receiver shift register to the receiver data register and the receive data register is already full (RDRF bit is set). Data transfer is inhibited until the RDRF bit is cleared. Data in the serial communications data register is valid in this case, but additional data received during an overrun condition (including the byte causing the overrun) will be lost. The OR bit is cleared when the serial communications status register is accessed (with OR set) followed by a read of the serial communications data register. NF -- Noise error flag This bit is set if there is noise on a `valid' start bit, any of the data bits or on the stop bit. The NF bit is not set by noise on the idle line nor by invalid start bits. If there is noise, the NF bit is not set until the RDRF flag is set. Each data bit is sampled three times as described in Section 6.7. The NF bit represents the status of the byte in the serial communications data register. For the byte being received (shifted in) there will be also a `working' noise flag, the value of which will be transferred to the NF bit when the serial data is loaded into the serial communications data register. The NF bit does not generate an interrupt because the RDRF bit gets set with NF and can be used to generate the interrupt. 6 The NF bit is cleared when the serial communications status register is accessed (with NF set) followed by a read of the serial communications data register. FE -- Framing error flag This bit is set when the word boundaries in the bit stream are not synchronized with the receiver bit counter (generated by the reception of a logic zero bit where a stop bit was expected). The FE bit reflects the status of the byte in the receive data register and the transfer from the receive shifter to the receive data register is inhibited by an overrun. The FE bit is set during the same cycle as the RDRF bit but does not get set in the case of an overrun (OR). The framing error flag inhibits further transfer of data into the receive data register until it is cleared. The FE bit is cleared when the serial communications status register is accessed (with FE set) followed by a read of the serial communications data register. 71 MC68HC05B6 Rev. 4.1 SERIAL COMMUNICATIONS INTERFACE Freescale 6-17 6.11.5 Baud rate register (BAUD) The baud rate register provides the means to select two different or equivalent baud rates for the transmitter and receiver. SCI baud rate (BAUD) Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 $000D SCP1 SCP0 SCT2 SCT1 SCT0 SCR2 SCR1 bit 0 State on reset SCR0 00uu uuuu SCP1, SCP0 -- Serial prescaler select bits These read/write bits determine the prescale factor, NP, by which the internal processor clock is divided before it is applied to the transmitter and receiver rate control dividers, NT and NR. This common prescaled output is used as the input to a divider that is controlled by the SCR0-SCR2 bits for the SCI receiver, and by the SCT0-SCT2 bits for the transmitter. 6 Table 6-3 First prescaler stage SCP1 SCP0 Prescaler division ratio (NP) 0 0 1 0 1 3 1 0 4 1 1 13 SCT2, SCT1,SCT0 -- SCI rate select bits (transmitter) These three read/write bits select the baud rates for the transmitter. The prescaler output is divided by the factors shown in Table 6-4. Table 6-4 Second prescaler stage (transmitter) SCT2 SCT1 SCT0 Transmitter division ratio (NT) 0 0 0 1 0 0 1 2 0 1 0 4 0 1 1 8 1 0 0 16 1 0 1 32 1 1 0 64 1 1 1 128 71 Freescale 6-18 SERIAL COMMUNICATIONS INTERFACE MC68HC05B6 Rev. 4.1 SCR2, SCR1, SCR0 -- SCI rate select bits (receiver) These three read/write bits select the baud rates for the receiver. The prescaler output described above is divided by the factors shown in Table 6-5. Table 6-5 Second prescaler stage (receiver) SCR2 SCR1 SCR0 Receiver division ratio (NR) 0 0 0 1 0 0 1 2 0 1 0 4 0 1 1 8 1 0 0 16 1 0 1 32 1 1 0 64 1 1 1 128 6 The following equations are used to calculate the receiver and transmitter baud rates: f op baudTx = ----------------------------------16 * NP * NT f op baudRx = ----------------------------------16 * NP * NR where: NP = prescaler divide ratio NT = transmitter baud rate divide ratio NR = receiver baud rate divide ratio baudTx = transmitter baud rate baudRx = receiver baud rate fOSC = oscillator frequency 6.12 Baud rate selection The flexibility of the baud rate generator allows many different baud rates to be selected. A particular baud rate may be generated in several ways by manipulating the various prescaler and division ratio bits. Table 6-6 shows the baud rates that can be achieved, for five typical crystal frequencies. These are effectively the highest baud rates which can be achieved using a given crystal. 71 MC68HC05B6 Rev. 4.1 SERIAL COMMUNICATIONS INTERFACE Freescale 6-19 Table 6-6 SCI baud rate selection Crystal frequency - fOSC (MHz) 6 SCP1 SCP0 NP NT/NR 4.194304 0 0 0 0 4.00 2.4576 2.00 1.8432 0 1 1 131072 125000 76800 62500 0 0 0 57600 0 1 1 2 65536 62500 38400 31250 0 0 28800 0 1 0 1 4 32768 31250 19200 15625 0 14400 0 0 1 1 1 8 16384 15625 9600 7813 7200 0 0 1 0 0 1 16 8192 7813 4800 3906 3600 0 0 1 0 1 1 32 4096 3906 2400 1953 1800 0 0 1 1 0 1 64 2048 1953 1200 977 900 0 0 1 1 1 1 128 1024 977 600 488 450 0 1 0 0 0 3 1 43691 41667 25600 20833 19200 0 1 0 0 1 3 2 21845 20833 12800 10417 9600 0 1 0 1 0 3 4 10923 10417 6400 5208 4800 0 1 0 1 1 3 8 5461 5208 3200 2604 2400 0 1 1 0 0 3 16 2731 2604 1600 1302 1200 0 1 1 0 1 3 32 1365 1302 800 651 600 0 1 1 1 0 3 64 683 651 400 326 300 0 1 1 1 1 3 128 341 326 200 163 150 1 0 0 0 0 4 1 32768 31250 19200 15625 14400 1 0 0 0 1 4 2 16384 15625 9600 7813 7200 1 0 0 1 0 4 4 8192 7813 4800 3906 3600 1 0 0 1 1 4 8 4096 3906 2400 1953 1800 1 0 1 0 0 4 16 2048 1953 1200 977 900 1 0 1 0 1 4 32 1024 977 600 488 450 1 0 1 1 0 4 64 512 488 300 244 225 1 0 1 1 1 4 128 256 244 150 122 113 1 1 0 0 0 13 1 10082 9615 5908 4808 4431 1 1 0 0 1 13 2 5041 4808 2954 2404 2215 1 1 0 1 0 13 4 2521 2404 1477 1202 1108 1 1 0 1 1 13 8 1260 1202 738 601 554 1 1 1 0 0 13 16 630 601 369 300 277 1 1 1 0 1 13 32 315 300 185 150 138 1 1 1 1 0 13 64 158 150 92 75 69 1 1 1 1 1 13 128 79 75 46 38 35 Note: SCT/R2 SCT/R1 SCT/R0 The examples shown above do not apply when the part is operating in slow mode (see Section 2.4.3). 71 Freescale 6-20 SERIAL COMMUNICATIONS INTERFACE MC68HC05B6 Rev. 4.1 6.13 SCI during STOP mode When the MCU enters STOP mode, the baud rate generator driving the receiver and transmitter is shut down. This stops all SCI activity. Both the receiver and the transmitter are unable to operate. If the STOP instruction is executed during a transmitter transfer, that transfer is halted. When STOP mode is exited as a result of an external interrupt, that particular transmission resumes. If the receiver is receiving data when the STOP instruction is executed, received data sampling is stopped (baud generator stops) and the rest of the data is lost. Warning: For the above reasons, all SCI transactions should be in the idle state when the STOP instruction is executed. 6.14 6 SCI during WAIT mode The SCI system is not affected by WAIT mode and continues normal operation. Any valid SCI interrupt will wake-up the system. If required, the SCI system can be disabled prior to entering WAIT mode by writing a zero to the transmitter and receiver enable bits in the serial communication control register 2 at $000F. This action will result in a reduction of power consumption during WAIT mode. 71 MC68HC05B6 Rev. 4.1 SERIAL COMMUNICATIONS INTERFACE Freescale 6-21 6 THIS PAGE LEFT BLANK INTENTIONALLY 71 Freescale 6-22 SERIAL COMMUNICATIONS INTERFACE MC68HC05B6 Rev. 4.1 7 PULSE LENGTH D/A CONVERTERS The pulse length D/A converter (PLM) system works in conjunction with the timer to execute two 8-bit D/A conversions, with a choice of two repetition rates. (See Figure 7-1.) Data bus 8 PLMA D/A pin 8 PLMA register PLMB register `A' register buffer `B' register buffer `A' comparator `B' comparator 7 R Latch S R Latch S Zero detector Zero detector 8 SFA bit `A' multiplexer 16 PLMB D/A pin 8 `B' multiplexer 16 SFB bit Timer bus From timer Figure 7-1 PLM system block diagram MC68HC05B6 Rev. 4.1 PULSE LENGTH D/A CONVERTERS Freescale 7-1 The D/A converter has two data registers associated with it, PLMA and PLMB. Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Pulse length modulation A (PLMA) $000A 0000 0000 Pulse length modulation B (PLMB) $000B 0000 0000 This is a dual 8-bit resolution D/A converter associated with two output pins (PLMA and PLMB). The outputs are pulse length modulated signals whose duty cycle ratio may be modified. These signals can be used directly as PLMs, or the filtered average may be used as general purpose analog outputs. 7 The longest repetition period is 4096 times the programmable timer clock period (CPU clock multiplied by four), and the shortest repetition period is 256 times the programmable timer clock period (the repetition rate frequencies for a 4 MHz crystal are 122 Hz and 1953 Hz respectively). Registers PLMA ($0A) and PLMB ($0B) are associated with the pulse length values of the two counters. A value of $00 loaded into these registers results in a continuously low output on the corresponding D/A output pin. A value of $80 results in a 50% duty cycle output, and so on, to the maximum value $FF corresponding to an output which is at `1' for 255/256 of the cycle. When the MCU makes a write to register PLMA or PLMB the new value will only be picked up by the D/A converters at the end of a complete cycle of conversion. This results in a monotonic change of the DC component at the output without overshoots or vicious starts (a vicious start is an output which gives totally erroneous PLM during the period immediately following an update of the PLM D/A registers). This feature is achieved by double buffering of the PLM D/A registers. Examples of PWM output waveforms are shown in Figure 7-2. 256 T $00 255 T $01 T 128 T 128 T $80 255 T $FF T T = 4 CPU clocks in fast mode and 64 CPU clocks in slow mode Figure 7-2 PLM output waveform examples Freescale 7-2 PULSE LENGTH D/A CONVERTERS MC68HC05B6 Rev. 4.1 Note: Since the PLM system uses the timer counter, PLM results will be affected while resetting the timer counter. Both D/A registers are reset to $00 during power-on or external reset. WAIT mode does not affect the output waveform of the D/A converters. 7.1 Miscellaneous register Miscellaneous Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 $000C POR INTP INTN INTE SFA SFB SM State on reset bit 0 WDOG ?001 000? SFA -- Slow or fast mode selection for PLMA This bit allows the user to select the slow or fast mode of the PLMA pulse length modulation output. 1 (set) - 0 (clear) - Slow mode PLMA (4096 x timer clock period). Fast mode PLMA (256 x timer clock period). 7 SFB -- Slow or fast mode selection for PLMB This bit allows the user to select the slow or fast mode of the PLMB pulse length modulation output. 1 (set) - 0 (clear) - Slow mode PLMB (4096 x timer clock period). Fast mode PLMB (256 x timer clock period). The highest speed of the PLM system corresponds to the frequency of the TOF bit being set, multiplied by 256. The lowest speed of the PLM system corresponds to the frequency of the TOF bit being set, multiplied by 16. Because the SFA bit and SFB bit are not double buffered, it is mandatory to set them to the desired values before writing to the PLM registers; not doing so could temporarily give incorrect values at the PLM outputs. SM -- Slow mode 1 (set) - 0 (clear) - MC68HC05B6 Rev. 4.1 The system runs at a bus speed 16 times lower than normal (fOSC/32). SLOW mode affects all sections of the device, including SCI, A/D and timer. The system runs at normal bus speed (fOSC/2). PULSE LENGTH D/A CONVERTERS Freescale 7-3 The SM bit is cleared by external or power-on reset. The SM bit is automatically cleared when entering STOP mode. Note: 7.2 The bits that are shown shaded in the above representation are explained individually in the relevant sections of this manual. The complete register plus an explanation of each bit can be found in Section 3.8 PLM clock selection The slow/fast mode of the PLM D/A converters is selected by bits 1, 2, and 3 of the miscellaneous register at address $000C (SFA bit for PLMA and SFB bit for PLMB). The slow/fast mode has no effect on the D/A converters' 8-bit resolution (see Figure 7-3). fOSC 7 /2 /32 SM bit = 0 Bus frequency (fOP) /4 Timer clock SM bit = 1 x4096 x256 SF bit = 1 PLM clock SF bit = 0 Figure 7-3 PLM clock selection 7.3 PLM during STOP mode On entering STOP mode, the PLM outputs remain at their particular level. When STOP mode is exited by an interrupt, the PLM systems resume regular operation. If STOP mode is exited by power-on or external reset the registers values are forced to $00. 7.4 PLM during WAIT mode The PLM system is not affected by WAIT mode and continues normal operation. Freescale 7-4 PULSE LENGTH D/A CONVERTERS MC68HC05B6 Rev. 4.1 8 ANALOG TO DIGITAL CONVERTER The analog to digital converter system consists of a single 8-bit successive approximation converter and a sixteen channel multiplexer. Eight of the channels are connected to the PD0/AN0 - PD7/AN7 pins of the MC68HC05B6 and the other eight channels are dedicated to internal reference points for test functions. The channel input pins do not have any internal output driver circuitry connected to them because such circuitry would load the analog input signals due to output buffer leakage current. There is one 8-bit result data register (address $08) and one 8-bit status/control register (address $09). The A/D converter is ratiometric and two dedicated pins, VRH and VRL, are used to supply the reference voltage levels for all analog inputs. These pins are used in preference to the system power supply lines because any voltage drops in the bonding wires of the heavily loaded supply pins could degrade the accuracy of the A/D conversion. An input voltage equal to or greater than VRH converts to $FF (full scale) with no overflow indication and an input voltage equal to VRL converts to $00. The A/D converter can operate from either the bus clock or an internal RC type oscillator. The internal RC type oscillator is activated by the ADRC bit in the A/D status/control register (ADSTAT) and can be used to give a sufficiently high clock rate to the A/D converter when the bus speed is too low to provide accurate results. When the A/D converter is not being used it can be disconnected, by clearing the ADON bit in the ADSTAT register, in order to save power (see Section 8.2.3). For further information on A/D converter operation please refer to the M68HC11 Reference Manual -- M68HC11RM/AD. 8.1 A/D converter operation The A/D converter consists of an analog multiplexer, an 8-bit digital to analog converter capacitor array, a comparator and a successive approximation register (SAR) (see Figure 8-1). There are eleven options that can be selected by the multiplexer; AN0-AN7, VRH, (VRH+VRL)/2 or VRL. Selection is done via the CHx bits in the ADSTAT register (see Section 8.2.3). AN0-AN7 are the only input points for A/D conversion operations; the others are reference points that can be used for test purposes. MC68HC05B6 Rev. 4.1 ANALOG TO DIGITAL CONVERTER Freescale 8-1 8 The A/D reference input (AN0-AN7) is applied to a precision internal D/A converter. Control logic drives this D/A converter and the analog output is successively compared with the analog input sampled at the beginning of the conversion. The conversion is monotonic with no missing codes. AN0 VRH VRL 8-bit capacitive DAC with sample and hold AN1 AN3 AN4 AN5 AN6 AN7 Analog MUX (Channel assignment) AN2 Successive approximation register (SAR) and control Result A/D status/control register (ADSTAT)$09 CH0 CH1 CH2 CH3 0 ADON ADRC COCO VRH (VRH+VRL)/2 VRL 8 A/D result register (ADDATA) $08 Figure 8-1 A/D converter block diagram The result of each successive comparison is stored in the SAR and, when the conversion is complete, the contents of the SAR are transferred to the read-only result data register ($08), and the conversion complete flag, COCO, is set in the A/D status/control register ($09). Warning: Any write to the A/D status/control register will abort the current conversion, reset the conversion complete flag and start a new conversion on the selected channel. At power-on or external reset, both the ADRC and ADON bits are cleared; thus the A/D is disabled. Freescale 8-2 ANALOG TO DIGITAL CONVERTER MC68HC05B6 Rev. 4.1 8.2 A/D registers 8.2.1 Port D data register (PORTD) Port D data (PORTD) Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset $0003 PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 Undefined Port D is an input-only port which routes the eight analog inputs to the A/D converter. When the A/D converter is disabled, the pins are configured as standard input-only port pins, which can be read via the port D data register. Note: 8.2.2 When the A/D function is enabled, pins PD0-PD7 will act as analog inputs. Using a pin or pins as A/D inputs does not affect the ability to read port D as static inputs; however, reading port D during an A/D conversion sequence may inject noise on the analog inputs and result in reduced accuracy of the A/D result. Performing a digital read of port D with levels other than VDD or VSS on the pins will result in greater power dissipation during the read cycle, and may give unpredictable results on the corresponding port D pins. 8 A/D result data register (ADDATA) Address A/D data (ADDATA) bit 7 bit 6 bit 5 bit 4 bit 3 $0008 bit 2 bit 1 bit 0 State on reset 0000 0000 ADDATA is a read-only register which is used to store the results of A/D conversions. Each result is loaded into the register from the SAR and the conversion complete flag, COCO, in the ADSTAT register is set. MC68HC05B6 Rev. 4.1 ANALOG TO DIGITAL CONVERTER Freescale 8-3 8.2.3 A/D status/control register (ADSTAT) Address A/D status/control (ADSTAT) $0009 bit 7 bit 6 bit 5 COCO ADRC ADON bit 4 bit 3 bit 2 bit 1 bit 0 State on reset 0 CH3 CH2 CH1 CH0 0000 0000 COCO -- Conversion complete flag 1 (set) - COCO is set each time a conversion is complete, allowing the new result to be read from the A/D result data register ($08). The converter then starts a new conversion. 0 (clear) - COCO is cleared by reading the result data register or writing to the status/control register. Reset clears the COCO flag. ADRC -- A/D RC oscillator control The ADRC bit allows the user to control the A/D RC oscillator, which is used to provide a sufficiently high clock rate to the A/D to ensure accuracy when the chip is running at low speeds. 1 (set) 8 - When the ADRC bit is set, the A/D RC oscillator is turned on and, if ADON is set, the A/D runs from the RC oscillator clock. See Table 8-1. 0 (clear) - When the ADRC bit is cleared, the A/D RC oscillator is turned-off and, if ADON is set, the A/D runs from the CPU clock. When the A/D RC oscillator is turned on, it takes a time tADRC to stabilize (see Table 11-6 and Table 11-7). During this time A/D conversion results may be inaccurate. Note: If the MCU bus clock falls below 1MHz, the A/D RC oscillator should be switched on. Power-on or external reset clears the ADRC bit. Table 8-1 A/D clock selection Freescale 8-4 RC A/D oscillator converter Comments ADRC ADON 0 0 OFF OFF A/D switched off. 0 1 OFF ON A/D using CPU clock. 1 0 ON OFF Allows the RC oscillator to stabilize. 1 1 ON ON A/D using RC oscillator clock. ANALOG TO DIGITAL CONVERTER MC68HC05B6 Rev. 4.1 ADON -- A/D converter on The ADON bit allows the user to enable/disable the A/D converter. 1 (set) - A/D converter is switched on. 0 (clear) - A/D converter is switched off. When the A/D converter is switched on, it takes a time tADON for the current sources to stabilize (see Table 11-6 and Table 11-7). Using the A/D converter before this time has elapsed may result in the incorrect operation of the A/D, even after tADON has elapsed. In this case ADON would have to be cleared and set again. Power-on or external reset will clear the ADON bit, thus disabling the A/D converter. CH3-CH0 -- A/D channels 3, 2, 1 and 0 The CH3-CH0 bits allow the user to determine which channel of the A/D converter multiplexer is selected. See Table 8-2 for channel selection. Reset clears the CH0-CH3 bits. Table 8-2 A/D channel assignment MC68HC05B6 Rev. 4.1 CH3 CH2 CH1 CH0 Channel selected 0 0 0 0 AN0 0 0 0 1 AN1 0 0 1 0 AN2 0 0 1 1 AN3 0 1 0 0 AN4 0 1 0 1 AN5 0 1 1 0 AN6 0 1 1 1 AN7 1 0 0 0 VRH pin (high) 1 0 0 1 (VRH + VRL) / 2 1 0 1 0 VRL pin (low) 1 0 1 1 VRL pin (low) 1 1 0 0 VRL pin (low) 1 1 0 1 VRL pin (low) 1 1 1 0 VRL pin (low) 1 1 1 1 VRL pin (low) ANALOG TO DIGITAL CONVERTER 8 Freescale 8-5 8.3 A/D converter during STOP mode When the MCU enters STOP mode with the A/D converter turned on, the A/D clocks are stopped and the A/D converter is disabled for the duration of STOP mode, including the 4064 cycles start-up time. If the A/D RC oscillator is in operation it will also be disabled. 8.4 A/D converter during WAIT mode The A/D converter is not affected by WAIT mode and continues normal operation. In order to reduce power consumption the A/D converter can be disconnected, under software control using the ADON bit and the ADRC bit in the A/D status/control register at $0009, before entering WAIT mode. 8.5 8 Port D analog input The external analog voltage value to be processed by the A/D converter is sampled on an internal capacitor through a resistive path, provided by input-selection switches and a sampling aperture time switch, as shown in Figure 8-2. Sampling time is limited to 12 bus clock cycles. After sampling, the analog value is stored on the capacitor and held until the end of conversion. During this hold time, the analog input is disconnected from the internal A/D system and the external voltage source sees a high impedance input. The equivalent analog input during sampling is an RC low-pass filter with a minimum resistance of 50 k and a capacitance of at least 10pF. It should be noted that these are typical values measured at room temperature. Input protection device Analog input pin < 2pF 50k + 20V - 0.7V 1 A junction leakage 10pF DAC capacitance VRL Note: The analog switch is closed during the 12 cycle sample time only. Figure 8-2 Electrical model of an A/D input pin Freescale 8-6 ANALOG TO DIGITAL CONVERTER MC68HC05B6 Rev. 4.1 9 RESETS AND INTERRUPTS 9.1 Resets The MC68HC05B6 can be reset in three ways: by the initial power-on reset function, by an active low input to the RESET pin or by a computer operating properly (COP) watchdog reset. Any of these resets will cause the program to go to its starting address, specified by the contents of memory locations $1FFE and $1FFF, and cause the interrupt mask bit in the condition code register to be set. tVDDR VDD VDD threshold (1-2V typical) tOXOV 9 OSC1 Internal processor clock RESET Internal address bus Internal data bus tPORL tCYC tRL (or tDOGL) (Internal power-on reset) 1FFE 1FFE 1FFE 1FFE 1FFF New PC 1FFE 1FFE 1FFE 1FFE Reset sequence New PCH (External hardware reset) 1FFF New PC New PCL Op code Reset sequence New PCL Op code Program execution begins New PCH Program execution begins Figure 9-1 Reset timing diagram MC68HC05B6 Rev. 4.1 RESETS AND INTERRUPTS Freescale 9-1 9.1.1 Power-on reset A power-on reset occurs when a positive transition is detected on VDD. The power-on reset function is strictly for power turn-on conditions and should not be used to detect drops in the power supply voltage. The power-on circuitry provides a stabilization delay (tPORL) from when the oscillator becomes active. If the external RESET pin is low at the end of this delay then the processor remains in the reset state until RESET goes high. The user must ensure that the voltage on VDD has risen to a point where the MCU can operate properly by the time tPORL has elapsed. If there is doubt, the external RESET pin should remain low until the voltage on VDD has reached the specified minimum operating voltage. This may be accomplished by connecting an external RC circuit to this pin to generate a power-on reset (POR). In this case, the time constant must be great enough to allow the oscillator circuit to stabilize. During power-on reset, the RESET pin is driven low during a tPORL delay start-up sequence. tPORL is defined by a user specified mask option to be either 16 cycles or 4064 cycles (see Section 1.2). A software distinction between a power-on reset and an external reset can be made using the POR bit in the miscellaneous register (see Section 9.1.2). 9.1.2 Miscellaneous register Address Miscellaneous 9 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 $000C POR(1) INTP INTN INTE SFA SFB SM bit 0 State on reset WDOG(2) ?001 000? (1) The POR bit is set each time there is a power-on reset. (2) The state of the WDOG bit after reset is dependent on the mask option selected; 1=watchdog enabled, 0=watchdog disabled. POR -- Power-on reset bit This bit is set each time the device is powered on. Therefore, the state of the POR bit allows the user to make a software distinction between a power-on and an external reset. This bit cannot be set by software and is cleared by writing it to zero. 1 (set) - 0 (clear) - Note: Freescale 9-2 A power-on reset has occurred. No power-on reset has occurred. The bits shown shaded in the above representation are explained individually in the relevant sections of this manual. The complete register plus an explanation of each bit can be found in Section 3.8. RESETS AND INTERRUPTS MC68HC05B6 Rev. 4.1 9.1.3 RESET pin When the oscillator is running in a stable condition, the MCU is reset when a logic zero is applied to the RESET input for a minimum period of 1.5 machine cycles (tCYC). An internal Schmitt Trigger is used to improve noise immunity on this pin. When the RESET pin goes high, the MCU will resume operation on the following cycle. When a reset condition occurs internally, i.e. from POR or the COP watchdog, the RESET pin provides an active-low open drain output signal which may be used to reset external hardware. Current limitation to protect the pull-down device is provided in case an RC type external reset circuit is used. 9.1.4 Computer operating properly (COP) watchdog reset The watchdog counter system consists of a divide-by-8 counter, preceded by a fixed divide-by-4 and a fixed divide-by-256 prescaler, plus control logic as shown in Figure 9-2. The divide-by-8 counter can be reset by software. Main CPU clock R / 8 watchdog counter WDOG bit Reset pin 9 Reset Enable / 256 (Bit 7 of free running counter) Latch + fOSC/2 /4 fOSC/32 prescaler Power-on S Control logic Schmitt trigger Input protection Figure 9-2 Watchdog system block diagram Warning: The input to the watchdog system is derived from the carry output of bit 7 of the free running timer counter. Therefore, a reset of the timer may affect the period of the watchdog timeout. The watchdog system can be automatically enabled, following power-on or external reset, via a mask option (see Section 1.2), or it can be enabled by software by writing a `1' to the WDOG bit in the miscellaneous register at $000C (see Section 9.1.2). Once enabled, the watchdog system MC68HC05B6 Rev. 4.1 RESETS AND INTERRUPTS Freescale 9-3 cannot be disabled by software (writing a `zero' to the WDOG bit has no effect at any time). In addition, the WDOG bit acts as a reset mechanism for the watchdog counter. Writing a `1' to this bit clears the counter to its initial value and prevents a watchdog timeout. WDOG -- Watchdog enable/disable The WDOG bit can be used to enable the watchdog timer previously disabled by a mask option. Following a watchdog reset the state of the WDOG bit is as defined by the mask option specified. 1 (set) - 0 (clear) - Watchdog enabled and counter cleared. The watchdog cannot be disabled by software; writing a zero to this bit has no effect. The divide-by-8 watchdog counter will generate a main reset of the chip when it reaches its final state; seven clocks are necessary to bring the watchdog counter from its clear state to its final state. This reset appears after time tDOG since the last clear or since the enable of the watchdog counter system. The watchdog counter, therefore, has to be cleared periodically, by software, with a period less than tDOG. The reset generated by the watchdog system is apparent at the RESET pin (see Figure 9-2). The RESET pin level is re-entered in the control logic, and when it has been maintained at level `zero' for a minimum of tDOGL, the RESET pin is released. 9.1.4.1 9 COP watchdog during STOP mode The STOP instruction is inhibited when the watchdog system is enabled. If a STOP instruction is executed while the watchdog system is enabled, then a watchdog reset will occur as if there were a watchdog timeout. In the case of a watchdog reset due to a STOP instruction, the oscillator will not be affected, thus there will be no tPORL cycles start-up delay. On start-up, the watchdog will be configured according to the user specified mask option. 9.1.4.2 COP watchdog during WAIT mode The state of the watchdog during WAIT mode is selected via a mask option (see Section 1.2) to be one of the options below: Watchdog enabled -- the watchdog counter will continue to operate during WAIT mode and a reset will occur after time tDOG. Watchdog disabled -- on entering WAIT mode, the watchdog counter system is reset and disabled. On exiting WAIT mode the counter resumes normal operation. Freescale 9-4 RESETS AND INTERRUPTS MC68HC05B6 Rev. 4.1 9.1.5 Functions affected by reset When processing stops within the MCU for any reason, i.e. power-on reset, external reset or the execution of a STOP or WAIT instruction, various internal functions of the MCU are affected. Table 9-1 shows the resulting action of any type of system reset, but not necessarily in the order in which they occur. Table 9-1 Effect of RESET, POR, STOP and WAIT RESET POR WAIT Timer prescaler set to zero Function/effect x x - STOP - Timer counter set to $FFFC x x - - All timer enable bits cleared (disable) x x - - Data direction registers cleared (inputs) x x - - Stack pointer set to $00FF x x - - Force internal address bus to restart x x - - Vector $1FFE, $1FFF x x - - - Interrupt mask bit (I-bit CCR) set to 1 x x - Interrupt mask bit (I-bit CCR) cleared - - x x Set interrupt enable bit (INTE) x x - - Set POR bit in miscellaneous register - x - - Reset STOP latch x x - - Reset IRQ latch x x - - Reset WAIT latch x x - - SCI disabled x x - - SCI status bits cleared (except TDRE and TC) x x - - SCI interrupt enable bits cleared x x - - SCI status bits TDRE and TC set x x - - Oscillator disabled for 4064 cycles - x - x Timer clock cleared - x - x SCI clock cleared - x - x A/D disabled x x - x SM bit in the miscellaneous register cleared x x - x Watchdog counter reset x x x x WDOG bit in the miscellaneous register reset x x - x EEPROM control bits (see Section 3.5.1) x x - x 9 x = Described action takes place - = Described action does not take place MC68HC05B6 Rev. 4.1 RESETS AND INTERRUPTS Freescale 9-5 9.2 Interrupts The MCU can be interrupted by four different sources: three maskable hardware interrupts and one non maskable software interrupt: * External signal on the IRQ pin * Serial communications interface (SCI) * Programmable timer * Software interrupt instruction (SWI) Interrupts cause the processor to save the register contents on the stack and to set the interrupt mask (I-bit) to prevent additional interrupts. The RTI instruction (ReTurn from Interrupt) causes the register contents to be recovered from the stack and normal processing to resume. While executing the RTI instruction, the value of the I-bit is replaced by the corresponding I-bit stored on the stack. Unlike reset, hardware interrupts do not cause the current instruction execution to be halted, but are considered pending until the current instruction is complete. The current instruction is the one already fetched and being operated on. When the current instruction is complete, the processor checks all pending hardware interrupts. If interrupts are not masked (I-bit clear) and the corresponding interrupt enable bit is set, the processor proceeds with interrupt processing; otherwise, the next instruction is fetched and executed. Note: 9 9.2.1 Power-on and external reset clear all interrupt enable bits, but set the INTE bit in the miscellaneous register, thus preventing interrupts during the reset sequence. Interrupt priorities Each potential interrupt source is assigned a priority level, which means that if more than one interrupt is pending at the same time, the processor will service the one with the highest priority first. For example, if both an external interrupt and a timer interrupt are pending after an instruction execution, the external interrupt is serviced first. Table 9-2 shows the relative priority of all the possible interrupt sources. Figure 9-3 shows the interrupt processing flow. 9.2.2 Nonmaskable software interrupt (SWI) The software interrupt (SWI) is an executable instruction and a nonmaskable interrupt: it is executed regardless of the state of the I-bit in the CCR. If the I-bit is zero (interrupts enabled), SWI is executed after interrupts that were pending when the SWI was fetched, but before interrupts Freescale 9-6 RESETS AND INTERRUPTS MC68HC05B6 Rev. 4.1 Table 9-2 Interrupt priorities Register Flags Vector address Priority Reset Source -- -- $1FFE, $1FFF highest Software interrupt (SWI) -- -- $1FFC, $1FFD $1FFA, $1FFB -- -- Timer input captures TSR ICF1, ICF2 $1FF8, $1FF9 Timer output compares TSR OCF1, OCF2 $1FF6, $1FF7 Timer overflow TSR TOF $1FF4, $1FF5 SCSR TDRE, TC, OR, RDRF, IDLE $1FF2, $1FF3 External interrupt (IRQ) Serial communications interface (SCI) lowest generated after the SWI was fetched. The SWI interrupt service routine address is specified by the contents of memory locations $1FFC and $1FFD. 9.2.3 Maskable hardware interrupts If the interrupt mask bit in the CCR is set, all maskable interrupts (internal and external) are masked. Clearing the I-bit allows interrupt processing to occur. Note: 9.2.3.1 The internal interrupt latch is cleared in the first part of the interrupt service routine; therefore, one external interrupt pulse could be latched and serviced as soon as the I-bit is cleared. 9 External interrupt (IRQ) If the interrupt mask in the condition code register has been cleared and the interrupt enable bit (INTE) is set and the signal on the external interrupt pin (IRQ) satisfies the condition selected by the option control bits (INTP and INTN), then the external interrupt is recognized. INTE, INTP and INTN are all bits contained in the miscellaneous register at $000C. When the interrupt is recognized, the current state of the CPU is pushed onto the stack and the I-bit is set. This masks further interrupts until the present one is serviced. The external interrupt service routine address is specified by the content of memory locations $1FFA and $1FFB. MC68HC05B6 Rev. 4.1 RESETS AND INTERRUPTS Freescale 9-7 Reset Is I-bit set? IRQ external interrupt? Clear IRQ request latch Stack PC, X, A, CC Timer internal interrupt? Set I-bit SCI internal interrupt? 9 Fetch next instruction Execute instruction Load PC from: IRQ: $1FFA-$1FFB Timer IC: $1FF8-$1FF9 Timer OC: $1FF6-$1FF7 Timer OVF:$1FF4-$1FF5 SCI: $1FF2-$1FF3 Complete interrupt routine and execute RTI Figure 9-3 Interrupt flow chart Freescale 9-8 RESETS AND INTERRUPTS MC68HC05B6 Rev. 4.1 9.2.3.2 Miscellaneous register Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 $000C POR INTP INTN INTE SFA SFB SM Miscellaneous Note: bit 0 State on reset WDOG ?001 000? The bits shown shaded in the above representation are explained individually in the relevant sections of this manual. The complete register plus an explanation of each bit can be found in Section 3.8. INTP, INTN -- External interrupt sensitivity options These two bits allow the user to select which edge the IRQ pin is sensitive to as shown in Table 9-3. Both bits can be written to only while the I-bit is set, and are cleared by power-on or external reset. Therefore the device is initialised with negative edge and low level sensitivity. Table 9-3 IRQ sensitivity INTP INTN 0 0 Negative edge and low level sensitive IRQ sensitivity 0 1 Negative edge only 1 0 Positive edge only 1 1 Positive and negative edge sensitive 9 INTE -- External interrupt enable 1 (set) - External interrupt function (IRQ) enabled. 0 (clear) - External interrupt function (IRQ) disabled. The INTE bit can be written to only while the I-bit is set, and is set by power-on or external reset, thus enabling the external interrupt function. Table 9-3 describes the various triggering options available for the IRQ pin, however it is important to re-emphasize here that in order to avoid any conflict and spurious interrupt, it is only possible to change the external interrupt options while the I-bit is set. Any attempt to change the external interrupt option while the I-bit is clear will be unsuccessful. If an external interrupt is pending, it will automatically be cleared when selecting a different interrupt option. Note: If the external interrupt function is disabled by the INTE bit and an external interrupt is sensed by the edge detector circuitry, then the interrupt request is latched and the interrupt stays pending until the INTE bit is set. The internal latch of the external interrupt is cleared in the first part of the service routine (except for the low level MC68HC05B6 Rev. 4.1 RESETS AND INTERRUPTS Freescale 9-9 interrupt which is not latched); therefore, only one external interrupt pulse can be latched during tILIL and serviced as soon as the I-bit is cleared. 9.2.3.3 Timer interrupts There are five different timer interrupt flags (ICF1, ICF2, OCF1, OCF2 and TOF) that will cause a timer interrupt whenever they are set and enabled. These five interrupt flags are found in the five most significant bits of the timer status register (TSR) at location $0013. ICF1 and ICF2 will vector to the service routine defined by $1FF8-$1FF9, OCF1 and OCF2 will vector to the service routine defined by $1FF6-$1FF7 and TOF will vector to the service routine defined by $1FF4-$1FF5 as shown in Figure 5.1. There are three corresponding enable bits; ICIE for ICF1 and ICF2, OCIE for OCF1 and OCF2, and TOIE for TOF. These enable bits are located in the timer control register (TCR) at address $0012. See Section 5.2.1 and Section 5.2.2 for further information. 9.2.3.4 Serial communications interface (SCI) interrupts There are five different interrupt flags (TDRE, TC, OR, RDRF and IDLE) that cause SCI interrupts whenever they are set and enabled. These five interrupt flags are found in the five most significant bits of the SCI status register (SCSR) at location $0010. There are four corresponding enable bits: TIE for TDRE, TCIE for TC, RIE for OR and RDRF, and ILIE for IDLE. These enable bits are located in the serial communications control register 2 (SCCR2) at address $000F. See Section 6.11.3 and Section 6.11.4. 9 The SCI interrupt causes the program counter to vector to the address pointed to by memory locations $1FF2 and $1FF3 which contain the starting address of the interrupt service routine. Software in the SCI interrupt service routine must determine the priority and cause of the interrupt by examining the interrupt flags and the status bits located in the serial communications status register SCSR (address $0010). The general sequence for clearing an interrupt is a software sequence of accessing the serial communications status register while the flag is set followed by a read or write of an associated register. Refer to Section 6 for a description of the SCI system and its interrupts. Freescale 9-10 RESETS AND INTERRUPTS MC68HC05B6 Rev. 4.1 9.2.4 Hardware controlled interrupt sequence The following three functions: reset, STOP and WAIT, are not in the strictest sense interrupts. However, they are acted upon in a similar manner. Flowcharts for STOP and WAIT are shown in Figure 2.4. RESET: A reset condition causes the program to vector to its starting address, which is contained in memory locations $1FFE (MSB) and $1FFF (LSB). The I-bit in the condition code register is also set, to disable interrupts. STOP: The STOP instruction causes the oscillator to be turned off and the processor to `sleep' until an external interrupt (IRQ) or occurs or the device is reset. WAIT: The WAIT instruction causes all processor clocks to stop, but leaves the timer clocks running. This `rest' state of the processor can be cleared by reset, an external interrupt (IRQ), a timer interrupt or an SCI interrupt. There are no special WAIT vectors for these individual interrupts. 9 MC68HC05B6 Rev. 4.1 RESETS AND INTERRUPTS Freescale 9-11 THIS PAGE LEFT BLANK INTENTIONALLY 9 Freescale 9-12 RESETS AND INTERRUPTS MC68HC05B6 Rev. 4.1 10 CPU CORE AND INSTRUCTION SET This section provides a description of the CPU core registers, the instruction set and the addressing modes of the MC68HC05B6. 10.1 Registers The MCU contains five registers, as shown in the programming model of Figure 10-1. The interrupt stacking order is shown in Figure 10-2. 7 0 7 0 7 0 Accumulator Index register 15 Program counter 15 7 0 0 0 0 0 0 0 0 0 1 1 7 0 1 1 1 H I N Z C Stack pointer Condition code register 10 Carry / borrow Zero Negative Interrupt mask Half carry Figure 10-1 Programming model Unstack Condition code register Accumulator Index register Program counter high Program counter low Stack 0 Interrupt Increasing memory address Return 7 Decreasing memory address Figure 10-2 Stacking order 115 MC68HC05B6 Rev. 4.1 CPU CORE AND INSTRUCTION SET Freescale 10-1 10.1.1 Accumulator (A) The accumulator is a general purpose 8-bit register used to hold operands and results of arithmetic calculations or data manipulations. 10.1.2 Index register (X) The index register is an 8-bit register, which can contain the indexed addressing value used to create an effective address. The index register may also be used as a temporary storage area. 10.1.3 Program counter (PC) The program counter is a 16-bit register, which contains the address of the next byte to be fetched. 10.1.4 Stack pointer (SP) The stack pointer is a 16-bit register, which contains the address of the next free location on the stack. During an MCU reset or the reset stack pointer (RSP) instruction, the stack pointer is set to location $00FF. The stack pointer is then decremented as data is pushed onto the stack and incremented as data is pulled from the stack. 10 When accessing memory, the ten most significant bits are permanently set to 0000000011. These ten bits are appended to the six least significant register bits to produce an address within the range of $00C0 to $00FF. Subroutines and interrupts may use up to 64 (decimal) locations. If 64 locations are exceeded, the stack pointer wraps around and overwrites the previously stored information. A subroutine call occupies two locations on the stack; an interrupt uses five locations. 10.1.5 Condition code register (CCR) The CCR is a 5-bit register in which four bits are used to indicate the results of the instruction just executed, and the fifth bit indicates whether interrupts are masked. These bits can be individually tested by a program, and specific actions can be taken as a result of their state. Each bit is explained in the following paragraphs. 115 Freescale 10-2 CPU CORE AND INSTRUCTION SET MC68HC05B6 Rev. 4.1 Half carry (H) This bit is set during ADD and ADC operations to indicate that a carry occurred between bits 3 and 4. Interrupt (I) When this bit is set all maskable interrupts are masked. If an interrupt occurs while this bit is set, the interrupt is latched and remains pending until the interrupt bit is cleared. Negative (N) When set, this bit indicates that the result of the last arithmetic, logical, or data manipulation was negative. Zero (Z) When set, this bit indicates that the result of the last arithmetic, logical, or data manipulation was zero. Carry/borrow (C) When set, this bit indicates that a carry or borrow out of the arithmetic logical unit (ALU) occurred during the last arithmetic operation. This bit is also affected during bit test and branch instructions and during shifts and rotates. 10.2 Instruction set The MCU has a set of 62 basic instructions. They can be grouped into five different types as follows: - Register/memory - Read/modify/write - Branch - Bit manipulation - Control 10 The following paragraphs briefly explain each type. All the instructions within a given type are presented in individual tables. This MCU uses all the instructions available in the M146805 CMOS family plus one more: the unsigned multiply (MUL) instruction. This instruction allows unsigned multiplication of the contents of the accumulator (A) and the index register (X). The high-order product is then stored in the index register and the low-order product is stored in the accumulator. A detailed definition of the MUL instruction is shown in Table 10-1. 115 MC68HC05B6 Rev. 4.1 CPU CORE AND INSTRUCTION SET Freescale 10-3 10.2.1 Register/memory Instructions Most of these instructions use two operands. The first operand is either the accumulator or the index register. The second operand is obtained from memory using one of the addressing modes. The jump unconditional (JMP) and jump to subroutine (JSR) instructions have no register operand. Refer to Table 10-2 for a complete list of register/memory instructions. 10.2.2 Branch instructions These instructions cause the program to branch if a particular condition is met; otherwise, no operation is performed. Branch instructions are two-byte instructions. Refer to Table 10-3. 10.2.3 Bit manipulation instructions The MCU can set or clear any writable bit that resides in the first 256 bytes of the memory space (page 0). All port data and data direction registers, timer and serial interface registers, control/status registers and a portion of the on-chip RAM reside in page 0. An additional feature allows the software to test and branch on the state of any bit within these locations. The bit set, bit clear, bit test and branch functions are all implemented with single instructions. For the test and branch instructions, the value of the bit tested is also placed in the carry bit of the condition code register. Refer to Table 10-4. 10.2.4 10 Read/modify/write instructions These instructions read a memory location or a register, modify or test its contents, and write the modified value back to memory or to the register. The test for negative or zero (TST) instruction is an exception to this sequence of reading, modifying and writing, since it does not modify the value. Refer to Table 10-5 for a complete list of read/modify/write instructions. 10.2.5 Control instructions These instructions are register reference instructions and are used to control processor operation during program execution. Refer to Table 10-6 for a complete list of control instructions. 10.2.6 Tables Tables for all the instruction types listed above follow. In addition there is a complete alphabetical listing of all the instructions (see Table 10-7 and Table 10-8), and an opcode map for the instruction set of the M68HC05 MCU family (see Table 10-9). 115 Freescale 10-4 CPU CORE AND INSTRUCTION SET MC68HC05B6 Rev. 4.1 Table 10-1 MUL instruction X:A X*A Operation Multiplies the eight bits in the index register by the eight Description bits in the accumulator and places the 16-bit result in the concatenated accumulator and index register. H : Cleared I : Not affected N : Not affected Z : Not affected C : Cleared Condition codes Source MUL Form Addressing mode Cycles Bytes Opcode Inherent 11 1 $42 Table 10-2 Register/memory instructions Addressing modes Indexed (no offset) # Bytes # Cycles Opcode # Bytes # Cycles Opcode # Bytes # Cycles Opcode # Bytes # Cycles Opcode # Bytes # Cycles Indexed (16-bit offset) Opcode Indexed (8-bit offset) # Cycles Extended # Bytes Direct Opcode Mnemonic Immediate Load A from memory LDA A6 2 2 B6 2 3 C6 3 4 F6 1 3 E6 2 4 D6 3 5 Load X from memory LDX AE 2 2 BE 2 3 CE 3 4 FE 1 3 EE 2 4 DE 3 5 Store A in memory STA B7 2 4 C7 3 5 F7 1 4 E7 2 5 D7 3 6 Store X in memory STX BF 2 4 CF 3 5 FF 1 4 EF 2 5 DF 3 6 Add memory to A ADD AB 2 2 BB 2 3 CB 3 4 FB 1 3 EB 2 4 DB 3 5 Add memory and carry to A ADC A9 2 2 B9 2 3 C9 3 4 F9 1 3 E9 2 4 D9 3 5 Subtract memory SUB A0 2 2 B0 2 3 C0 3 4 F0 1 3 E0 2 4 D0 3 5 Subtract memory from A with borrow SBC A2 2 2 B2 2 3 C2 3 4 F2 1 3 E2 2 4 D2 3 5 5 Function AND memory with A AND A4 2 2 B4 2 3 C4 3 4 F4 1 3 E4 2 4 D4 3 OR memory with A ORA AA 2 2 BA 2 3 CA 3 4 FA 1 3 EA 2 4 DA 3 5 Exclusive OR memory with A EOR A8 2 2 B8 2 3 C8 3 4 F8 1 3 E8 2 4 D8 3 5 Arithmetic compare A with memory CMP A1 2 2 B1 2 3 C1 3 4 F1 1 3 E1 2 4 D1 3 5 Arithmetic compare X with memory CPX A3 2 2 B3 2 3 C3 3 4 F3 1 3 E3 2 4 D3 3 5 Bit test memory with A (logical compare) BIT A5 2 2 B5 2 3 C5 3 4 F5 1 3 E5 2 4 D5 3 5 Jump unconditional JMP BC 2 2 CC 3 3 FC 1 2 EC 2 3 DC 3 4 Jump to subroutine JSR BD 2 5 CD 3 6 FD 1 5 ED 2 6 DD 3 7 10 115 MC68HC05B6 Rev. 4.1 CPU CORE AND INSTRUCTION SET Freescale 10-5 Table 10-3 Branch instructions Relative addressing mode Function Mnemonic Opcode # Bytes # Cycles Branch always BRA 20 2 3 Branch never BRN 21 2 3 Branch if higher BHI 22 2 3 Branch if lower or same BLS 23 2 3 Branch if carry clear BCC 24 2 3 (Branch if higher or same) (BHS) 24 2 3 Branch if carry set BCS 25 2 3 (Branch if lower) (BLO) 25 2 3 Branch if not equal BNE 26 2 3 Branch if equal BEQ 27 2 3 Branch if half carry clear BHCC 28 2 3 Branch if half carry set BHCS 29 2 3 Branch if plus BPL 2A 2 3 Branch if minus BMI 2B 2 3 Branch if interrupt mask bit is clear BMC 2C 2 3 Branch if interrupt mask bit is set BMS 2D 2 3 Branch if interrupt line is low BIL 2E 2 3 Branch if interrupt line is high BIH 2F 2 3 Branch to subroutine BSR AD 2 6 Table 10-4 Bit manipulation instructions Addressing Modes 10 Bit set/clear Bit test and branch Function Mnemonic Opcode # Bytes # Cycles Opcode # Bytes # Cycles Branch if bit n is set BRSET n (n=0-7) 2*n 3 5 Branch if bit n is clear BRCLR n (n=0-7) 01+2*n 3 5 Set bit n BSET n (n=0-7) 10+2*n 2 5 Clear bit n BCLR n (n=0-7) 11+2*n 2 5 115 Freescale 10-6 CPU CORE AND INSTRUCTION SET MC68HC05B6 Rev. 4.1 Table 10-5 Read/modify/write instructions Addressing modes Inherent (X) Indexed (8-bit offset) Indexed (no offset) Opcode # Bytes # Cycles Opcode # Bytes # Cycles Opcode # Bytes # Cycles Opcode # Bytes # Cycles Opcode # Bytes # Cycles Direct Mnemonic Inherent (A) Increment INC 4C 1 3 5C 1 3 3C 2 5 7C 1 5 6C 2 6 Decrement DEC 4A 1 3 5A 1 3 3A 2 5 7A 1 5 6A 2 6 Clear CLR 4F 1 3 5F 1 3 3F 2 5 7F 1 5 6F 2 6 Complement COM 43 1 3 53 1 3 33 2 5 73 1 5 63 2 6 Negate (two's complement) NEG 40 1 3 50 1 3 30 2 5 70 1 5 60 2 6 Rotate left through carry ROL 49 1 3 59 1 3 39 2 5 79 1 5 69 2 6 Rotate right through carry ROR 46 1 3 56 1 3 36 2 5 76 1 5 66 2 6 Logical shift left LSL 48 1 3 58 1 3 38 2 5 78 1 5 68 2 6 Logical shift right LSR 44 1 3 54 1 3 34 2 5 74 1 5 64 2 6 Arithmetic shift right ASR 47 1 3 57 1 3 37 2 5 77 1 5 67 2 6 Test for negative or zero TST 4D 1 3 5D 1 3 3D 2 4 7D 1 4 6D 2 5 Multiply MUL 42 1 11 Function Table 10-6 Control instructions Inherent addressing mode Function Mnemonic Opcode # Bytes # Cycles Transfer A to X TAX 97 1 2 Transfer X to A TXA 9F 1 2 Set carry bit SEC 99 1 2 Clear carry bit CLC 98 1 2 Set interrupt mask bit SEI 9B 1 2 Clear interrupt mask bit CLI 9A 1 2 Software interrupt SWI 83 1 10 Return from subroutine RTS 81 1 6 Return from interrupt RTI 80 1 9 Reset stack pointer RSP 9C 1 2 No-operation NOP 9D 1 2 Stop STOP 8E 1 2 Wait WAIT 8F 1 2 10 115 MC68HC05B6 Rev. 4.1 CPU CORE AND INSTRUCTION SET Freescale 10-7 Table 10-7 Instruction set (1 of 2) Addressing modes Mnemonic 10 INH IMM DIR EXT REL IX IX1 Condition codes IX2 BSC BTB H I N Z C ADC * ADD * AND * * * ASL * * ASR * * BCC * * * * * BCLR * * * * * BCS * * * * * BEQ * * * * * BHCC * * * * * BHCS * * * * * BHI * * * * * BHS * * * * * BIH * * * * * BIL * * * * * BIT * * * BLO * * * * * BLS * * * * * BMC * * * * * BMI * * * * * BMS * * * * * BNE * * * * * BPL * * * * * BRA * * * * * BRN * * * * * BRCLR * * * * BRSET * * * * BSET * * * * * BSR * * * * * CLC * * * * 0 * CLI * 0 * * CLR * * 0 1 * CMP * * Address mode abbreviations BSC Bit set/clear IMM Immediate BTB Bit test & branch IX Indexed (no offset) DIR Direct IX1 EXT Extended IX2 INH Inherent REL Condition code symbols Tested and set if true, cleared otherwise Interrupt mask * Not affected Negate (sign bit) ? Load CCR from stack Z Zero 0 Cleared C Carry/borrow 1 Set H Half carry (from bit 3) Indexed, 1 byte offset I Indexed, 2 byte offset N Relative Not implemented 115 Freescale 10-8 CPU CORE AND INSTRUCTION SET MC68HC05B6 Rev. 4.1 Table 10-8 Instruction set (2 of 2) Addressing modes Mnemonic INH IMM DIR EXT REL IX IX1 Condition codes IX2 BSC BTB H I N Z COM * * C 1 CPX * * DEC * * * EOR * * * INC * * * JMP * * * * * JSR * * * * * LDA * * * LDX * * * LSL * * LSR * * 0 MUL 0 * * * 0 NEG * * NOP * * * * * ORA * * * ROL * * ROR * * RSP * * * * * RTI ? ? ? ? ? RTS * * * * * SBC * * SEC * * * * 1 SEI * 1 * * * STA * * * STOP * 0 * * * STX * * * SUB * * SWI * 1 * * * TAX * * * * * TST * * * TXA * * * * * WAIT * 0 * * * Address mode abbreviations BSC Bit set/clear IMM Immediate BTB Bit test & branch IX Indexed (no offset) DIR Direct IX1 EXT Extended IX2 INH Inherent REL 10 Condition code symbols Tested and set if true, cleared otherwise Interrupt mask * Not affected Negate (sign bit) ? Load CCR from stack Z Zero 0 Cleared C Carry/borrow 1 Set H Half carry (from bit 3) Indexed, 1 byte offset I Indexed, 2 byte offset N Relative Not implemented 115 MC68HC05B6 Rev. 4.1 CPU CORE AND INSTRUCTION SET Freescale 10-9 Freescale 10-10 CPU CORE AND INSTRUCTION SET 0 0000 1 0001 2 0010 3 0011 4 0100 5 0101 6 0110 7 0111 8 1000 9 1001 A 1010 B 1011 C 1100 D 1101 E 1110 F 1111 BTB 2 5 BTB 2 5 BTB 2 5 3 3 3 BTB 2 5 BTB 2 5 BTB 2 5 BTB 2 5 BTB 2 5 BTB 2 5 BTB 2 5 BTB 2 5 BTB 2 5 BTB 2 5 BTB 2 3 3 3 3 3 3 3 3 3 3 3 BRCLR7 BRSET7 BRCLR6 BRSET6 BRCLR5 BRSET5 BRCLR4 BRSET4 BRCLR3 BRSET3 BRCLR2 BTB 2 5 3 BRSET2 BRCLR1 BRSET1 BRCLR0 BTB 2 5 BRSET0 3 5 BSC 2 BCLR7 BSC 2 5 BSET7 BSC 2 5 BCLR6 BSC 2 5 BSET6 BSC 2 5 BCLR5 BSC 2 5 BSET5 BSC 2 5 BCLR4 BSC 2 5 BSET4 BSC 2 5 BCLR3 BSC 2 5 BSET3 BSC 2 5 BCLR2 BSC 2 5 BSET2 BSC 2 5 BCLR1 BSC 2 5 BSET1 BSC 2 5 BCLR0 BSC 2 5 BSET0 5 REL 2 3 REL 2 3 REL 3 REL 2 3 REL 2 3 REL 3 REL 3 REL 2 3 BIH BIL BMS BMC BMI BPL REL 2 REL 3 REL 2 3 REL 2 3 REL 3 REL 2 3 REL 2 3 BHCS REL 2 3 BHCC BEQ BNE BCS BCC BLS BHI BRN BRA 3 BSC BTB DIR EXT INH IMM Bit set/clear Bit test and branch Direct Extended Inherent Immediate IX IX1 IX2 REL A X Abbreviations for address modes and registers Low High Branch REL 2 0010 CLR TST INC DEC ROL LSL ASR ROR LSR COM NEG DIR 3 0011 INH 1 3 INH 1 3 CLRA TSTA INCA INH 1 3 INH 1 INH 1 3 3 INH 1 DECA INH 1 3 ROLA LSLA ASRA INH 1 3 3 INH 1 INH 1 3 RORA LSRA 11 INH 3 COMA MUL INH 1 NEGA 3 INH 2 3 INH 2 3 INH 2 3 INH 2 3 CLRX TSTX INCX INH 2 3 INH 2 INH 2 3 3 INH 2 DECX ROLX 3 INH 2 ASRX LSLX 3 INH 2 3 RORX LSRX COMX INH 2 NEGX 3 CLR TST INC DEC ROL LSL ASR ROR LSR COM NEG Read/modify/write INH IX1 5 6 0101 0110 Indexed (no offset) Indexed, 1 byte (8-bit) offset Indexed, 2 byte (16-bit) offset Relative Accumulator Index register DIR 1 5 DIR 1 DIR 1 4 5 DIR 1 DIR 1 5 DIR 1 5 DIR 1 5 DIR 1 5 5 DIR 1 DIR 1 5 5 1 DIR 1 5 INH 4 0100 10 Bit manipulation BTB BSC 0 1 0000 0001 IX1 1 6 IX1 1 IX1 1 5 6 IX1 1 IX1 1 6 IX1 1 6 IX1 1 6 IX1 1 6 6 IX1 1 IX1 1 6 6 IX1 1 6 CLR TST INC DEC ROL LSL ASR ROR LSR COM NEG IX 7 0111 1 WAIT 1 1 1 1 1 1 1 INH 1 INH 2 2 INH 10 INH INH 6 STOP SWI RTS RTI 9 Not implemented IX 1 5 IX IX 4 5 IX IX 5 IX 5 IX 5 IX 5 5 IX IX 1 5 5 1 IX 1 5 TXA NOP RSP SEI CLI SEC CLC TAX Control INH INH 8 9 1000 1001 2 INH 2 INH 2 INH 2 INH 2 2 INH 2 2 INH 2 2 INH 2 2 INH 2 2 2 2 2 2 2 2 2 LDX BSR ADD ORA ADC EOR LDA BIT AND CPX SBC CMP SUB IMM A 1010 2 STX LDX JSR JMP ADD ORA ADC EOR STA LDA BIT AND CPX SBC CMP SUB 3 Bytes 1 STX LDX JSR JMP ADD ORA ADC EOR STA LDA BIT AND CPX SBC CMP SUB SUB F 1111 EXT 3 EXT 3 5 EXT 3 4 EXT 3 6 EXT 3 3 EXT 3 4 EXT 3 4 EXT 3 4 EXT 3 4 EXT 3 5 EXT 3 4 EXT 3 4 EXT 3 4 EXT 3 4 EXT 3 4 EXT 3 4 4 IX 3 0 0000 IX2 2 IX2 2 6 IX2 2 5 IX2 2 7 IX2 2 4 IX2 2 5 IX2 2 5 IX2 2 5 IX2 2 5 IX2 2 6 IX2 2 5 IX2 2 5 IX2 2 5 IX2 2 5 IX2 2 5 IX2 2 5 5 STX LDX JSR JMP ADD ORA ADC EOR STA LDA BIT AND CPX SBC CMP SUB IX1 E 1110 Address mode STX LDX JSR JMP ADD ORA ADC EOR STA LDA BIT AND CPX SBC CMP SUB Register/memory EXT IX2 C D 1100 1101 Cycles DIR 3 DIR 3 4 DIR 3 3 DIR 3 5 DIR 3 2 DIR 3 3 DIR 3 3 DIR 3 3 DIR 3 3 DIR 3 4 DIR 3 3 DIR 3 3 DIR 3 3 DIR 3 3 DIR 3 3 DIR 3 3 Mnemonic Legend 2 IMM 2 REL 2 2 6 2 IMM 2 IMM 2 2 IMM 2 2 IMM 2 2 2 IMM 2 IMM 2 2 IMM 2 2 IMM 2 2 IMM 2 2 IMM 2 2 IMM 2 2 2 DIR B 1011 STX LDX JSR JMP ADD ORA ADC EOR STA LDA BIT AND CPX SBC CMP SUB IX IX 4 IX 3 IX 5 IX 2 IX 3 IX 3 IX 3 IX 3 IX 4 IX 3 IX 3 IX 3 IX 3 IX 3 IX 3 3 0 0000 1 0001 2 0010 3 0011 4 0100 5 0101 6 0110 7 0111 8 1000 9 1001 A 1010 B 1011 C 1100 D 1101 E 1110 F 1111 Low High Opcode in binary Opcode in hexadecimal IX1 1 IX1 1 5 IX1 1 4 IX1 1 6 IX1 1 3 IX1 1 4 IX1 1 4 IX1 1 4 IX1 1 4 IX1 1 5 IX1 1 4 IX1 1 4 IX1 1 4 IX1 1 4 IX1 1 4 IX1 1 4 4 IX F 1111 Table 10-9 M68HC05 opcode map MC68HC05B6 Rev. 4.1 115 10.3 Addressing modes Ten different addressing modes provide programmers with the flexibility to optimize their code for all situations. The various indexed addressing modes make it possible to locate data tables, code conversion tables and scaling tables anywhere in the memory space. Short indexed accesses are single byte instructions; the longest instructions (three bytes) enable access to tables throughout memory. Short absolute (direct) and long absolute (extended) addressing are also included. One or two byte direct addressing instructions access all data bytes in most applications. Extended addressing permits jump instructions to reach all memory locations. The term `effective address' (EA) is used in describing the various addressing modes. The effective address is defined as the address from which the argument for an instruction is fetched or stored. The ten addressing modes of the processor are described below. Parentheses are used to indicate `contents of' the location or register referred to. For example, (PC) indicates the contents of the location pointed to by the PC (program counter). An arrow indicates `is replaced by' and a colon indicates concatenation of two bytes. For additional details and graphical illustrations, refer to the M6805 HMOS/M146805 CMOS Family Microcomputer/ Microprocessor User's Manual or to the M68HC05 Applications Guide. 10.3.1 Inherent In the inherent addressing mode, all the information necessary to execute the instruction is contained in the opcode. Operations specifying only the index register or accumulator, as well as the control instruction, with no other arguments are included in this mode. These instructions are one byte long. 10.3.2 Immediate In the immediate addressing mode, the operand is contained in the byte immediately following the opcode. The immediate addressing mode is used to access constants that do not change during program execution (e.g. a constant used to initialize a loop counter). 10 EA = PC+1; PC PC+2 10.3.3 Direct In the direct addressing mode, the effective address of the argument is contained in a single byte following the opcode byte. Direct addressing allows the user to directly address the lowest 256 bytes in memory with a single two-byte instruction. EA = (PC+1); PC PC+2 Address bus high 0; Address bus low (PC+1) 115 MC68HC05B6 Rev. 4.1 CPU CORE AND INSTRUCTION SET Freescale 10-11 10.3.4 Extended In the extended addressing mode, the effective address of the argument is contained in the two bytes following the opcode byte. Instructions with extended addressing mode are capable of referencing arguments anywhere in memory with a single three-byte instruction. When using the Freescale assembler, the user need not specify whether an instruction uses direct or extended addressing. The assembler automatically selects the short form of the instruction. EA = (PC+1):(PC+2); PC PC+3 Address bus high (PC+1); Address bus low (PC+2) 10.3.5 Indexed, no offset In the indexed, no offset addressing mode, the effective address of the argument is contained in the 8-bit index register. This addressing mode can access the first 256 memory locations. These instructions are only one byte long. This mode is often used to move a pointer through a table or to hold the address of a frequently referenced RAM or I/O location. EA = X; PC PC+1 Address bus high 0; Address bus low X 10.3.6 Indexed, 8-bit offset In the indexed, 8-bit offset addressing mode, the effective address is the sum of the contents of the unsigned 8-bit index register and the unsigned byte following the opcode. Therefore the operand can be located anywhere within the lowest 511 memory locations. This addressing mode is useful for selecting the mth element in an n element table. 10 EA = X+(PC+1); PC PC+2 Address bus high K; Address bus low X+(PC+1) where K = the carry from the addition of X and (PC+1) 10.3.7 Indexed, 16-bit offset In the indexed, 16-bit offset addressing mode, the effective address is the sum of the contents of the unsigned 8-bit index register and the two unsigned bytes following the opcode. This address mode can be used in a manner similar to indexed, 8-bit offset except that this three-byte instruction allows tables to be anywhere in memory. As with direct and extended addressing, the Freescale assembler determines the shortest form of indexed addressing. EA = X+[(PC+1):(PC+2)]; PC PC+3 Address bus high (PC+1)+K; Address bus low X+(PC+2) where K = the carry from the addition of X and (PC+2) 115 Freescale 10-12 CPU CORE AND INSTRUCTION SET MC68HC05B6 Rev. 4.1 10.3.8 Relative The relative addressing mode is only used in branch instructions. In relative addressing, the contents of the 8-bit signed byte (the offset) following the opcode are added to the PC if, and only if, the branch conditions are true. Otherwise, control proceeds to the next instruction. The span of relative addressing is from -126 to +129 from the opcode address. The programmer need not calculate the offset when using the Freescale assembler, since it calculates the proper offset and checks to see that it is within the span of the branch. EA = PC+2+(PC+1); PC EA if branch taken; otherwise EA = PC PC+2 10.3.9 Bit set/clear In the bit set/clear addressing mode, the bit to be set or cleared is part of the opcode. The byte following the opcode specifies the address of the byte in which the specified bit is to be set or cleared. Any read/write bit in the first 256 locations of memory, including I/O, can be selectively set or cleared with a single two-byte instruction. EA = (PC+1); PC PC+2 Address bus high 0; Address bus low (PC+1) 10.3.10 Bit test and branch The bit test and branch addressing mode is a combination of direct addressing and relative addressing. The bit to be tested and its condition (set or clear) is included in the opcode. The address of the byte to be tested is in the single byte immediately following the opcode byte (EA1). The signed relative 8-bit offset in the third byte (EA2) is added to the PC if the specified bit is set or cleared in the specified memory location. This single three-byte instruction allows the program to branch based on the condition of any readable bit in the first 256 locations of memory. The span of branch is from -125 to +130 from the opcode address. The state of the tested bit is also transferred to the carry bit of the condition code register. 10 EA1 = (PC+1); PC PC+2 Address bus high 0; Address bus low (PC+1) EA2 = PC+3+(PC+2); PC EA2 if branch taken; otherwise PC PC+3 115 MC68HC05B6 Rev. 4.1 CPU CORE AND INSTRUCTION SET Freescale 10-13 THIS PAGE LEFT BLANK INTENTIONALLY 10 115 Freescale 10-14 CPU CORE AND INSTRUCTION SET MC68HC05B6 Rev. 4.1 11 ELECTRICAL SPECIFICATIONS This section contains the electrical specifications and associated timing information for the MC68HC05B6. 11.1 Absolute maximum ratings Table 11-1 Absolute maximum ratings Symbol Value Supply voltage(1) Rating VDD - 0.5 to +7.0 V Input voltage (Except VPP1) VIN VSS - 0.5 to VDD + 0.5 V Input voltage - Self-check mode (IRQ pin only) VIN VSS - 0.5 to 2VDD + 0.5 V TA TL to TH 0 to +70 -40 to +85 -40 to +125 C TSTG - 65 to +150 C ID IS 25 45 mA mA Operating temperature range - Standard (MC68HC05B6) - Extended (MC68HC05B6C) - Automotive (MC68HC05B6M) Storage temperature range Current drain per pin (excluding VDD and VSS)(2) - Source - Sink Unit 11 (1) All voltages are with respect to VSS. (2) Maximum current drain per pin is for one pin at a time, limited by an external resistor. Note: This device contains circuitry designed to protect against damage due to high electrostatic voltages or electric fields. However, it is recommended that normal precautions be taken to avoid the application of any voltages higher than those given in the maximum ratings table to this high impedance circuit. For maximum reliability all unused inputs should be tied to either VSS or VDD. MC68HC05B6 Rev. 4.1 ELECTRICAL SPECIFICATIONS Freescale 11-1 129 130 131 132 133 11.2 DC electrical characteristics Table 11-2 DC electrical characteristics for 5V operation 11 (VDD = 5 Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Characteristic(1) Output voltage ILOAD = - 10 A ILOAD = +10 A Output high voltage (ILOAD = 0.8mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2 Output high voltage (ILOAD = 1.6mA) TDO, SCLK, PLMA, PLMB Output low voltage (ILOAD = 1.6mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2, TDO, SCLK, PLMA, PLMB Output low voltage (ILOAD = 1.6mA) RESET Input high voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, IRQ, RESET, TCAP1, TCAP2, RDI Input low voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, IRQ, RESET,TCAP1, TCAP2, RDI Supply current(3) RUN (SM = 0) (See Figure 11-1) RUN (SM = 1) (See Figure 11-2) WAIT (SM = 0) (See Figure 11-3) WAIT (SM = 1) (See Figure 11-4) STOP 0 to 70 (standard) - 40 to 85 (extended) - 40 to 105 (extended) - 40 to 125 (automotive) High-Z leakage current PA0-7, PB0-7, PC0-7, TDO, RESET, SCLK Input current (0 to 70) IRQ, OSC1, TCAP1, TCAP2, RDI, PD0/AN0-PD7/AN7 (channel not selected) Input current (- 40 to 125) IRQ, OSC1, TCAP1, TCAP2, RDI, Capacitance Ports (as input or output), RESET, TDO, SCLK IRQ, TCAP1, TCAP2, OSC1, RDI PD0/AN0-PD7/AN7 (A/D off) PD0/AN0-PD7/AN7 (A/D on) Symbol Min Typ(2) Max Unit VOH VOL VDD - 0.1 -- -- -- -- 0.1 V VOH VDD - 0.8 VDD - 0.4 -- VOH VDD - 0.8 VDD - 0.4 -- VOL -- 0.1 0.4 0.4 1 VOL V V VIH 0.7VDD -- VDD V VIL VSS -- 0.2VDD V -- -- -- -- 3.5 0.5 1 0.35 6 1.5 2 1 mA mA mA mA -- -- -- -- 2 -- -- -- 10 20 60 60 A A A A IIL -- 0.2 1 A IIN -- 0.2 0.2 1 1 mA IIN -- -- 5 A COUT CIN CIN CIN -- -- -- -- -- -- 12 22 12 8 -- -- pF pF pF pF IDD (1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching currents inherent in CMOS designs (see Section 2). (2) Typical values are at mid point of voltage range and at 25C only. (3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 4.2MHz); all inputs 0.2 V from rail; no DC loads; maximum load on outputs 50pF (20pF on OSC2). STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD - 0.2 V: STOP IDD measured with OSC1 = VDD. WAIT IDD is affected linearly by the OSC2 capacitance. Freescale 11-2 ELECTRICAL SPECIFICATIONS MC68HC05B6 Rev. 4.1 134 135 136 137 138 11.2.1 IDD trends for 5V operation For the examples below, typical values are at the mid-point of the voltage range and at a temperature of 25C only. 8 7 6 5 4 3 2 1 0 IDD (mA) 5.5V 4.5V 0 0.5 1 1.5 2 2.5 3 Internal operating frequency (MHz) 3.5 4 Figure 11-1 Run IDD vs internal operating frequency (4.5V, 5.5V) 1.2 1 0.8 IDD (mA) 0.6 0.4 5.5V 4.5V 0.2 0 0 0.5 1 1.5 2 2.5 3 Internal operating frequency (MHz) 3.5 4 Figure 11-2 Run IDD (SM = 1) vs internal operating frequency (4.5V, 5.5V) 11 2.5 2 IDD (mA) 1.5 1 5.5V 4.5V 0.5 0 0 0.5 1 1.5 2 2.5 3 Internal operating frequency (MHz) 3.5 4 Figure 11-3 Wait IDD vs internal operating frequency (4.5V, 5.5V) MC68HC05B6 Rev. 4.1 ELECTRICAL SPECIFICATIONS Freescale 11-3 139 140 0.9 0.8 0.7 0.6 0.5 IDD (mA) 0.4 0.3 0.2 0.1 0 5.5V 4.5V 0 0.5 1 1.5 2 2.5 3 Internal operating frequency (MHz) 3.5 4 Figure 11-4 Wait IDD (SM = 1) vs internal operating frequency (4.5V, 5.5V) 1.6 1.4 1.2 1 0.8 IDD (mA) 0.6 0.4 0.2 0 A/D + SCI A/D SCI 0 0.5 1 1.5 2 Internal operating frequency (MHz) 2.5 3 Figure 11-5 Increase in IDD vs frequency for A/D, SCI systems active, VDD = 5.5V 11 IDD (mA) 8 7 6 5 4 3 2 1 0 Run IDD Wait IDD Run IDD (SM = 1) Wait IDD (SM = 1) 0 0.5 1 1.5 2 2.5 3 Internal operating frequency (MHz) 3.5 4 Figure 11-6 IDD vs mode vs internal operating frequency, VDD = 5.5V Freescale 11-4 ELECTRICAL SPECIFICATIONS MC68HC05B6 Rev. 4.1 Table 11-3 DC electrical characteristics for 3.3V operation (VDD = 3.3Vdc 10%, VSS = 0Vdc, TA = TL to TH) Characteristic(1) Symbol Output voltage ILOAD = - 10 A VOH ILOAD = +10 A VOL Output high voltage (ILOAD = 0.2mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2 VOH Output high voltage (ILOAD = 0.4mA) TDO, SCLK, PLMA, PLMB VOH Output low voltage (ILOAD = 0.4mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2, VOL TDO, SCLK, PLMA, PLMB Output low voltage (ILOAD = 0.4mA) VOL RESET Input high voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, VIH IRQ, RESET, TCAP1, TCAP2, RDI Input low voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, IRQ, VIL RESET, TCAP1, TCAP2, RDI Supply current(3) RUN (SM = 0) (See Figure 11-1) RUN (SM = 1) (See Figure 11-2) WAIT (SM = 0) (See Figure 11-3) WAIT (SM = 1) (See Figure 11-4) IDD STOP 0 to 70 (standard) - 40 to 85 (extended) - 40 to 105 (extended) - 40 to 125 (automotive) High-Z leakage current PA0-7, PB0-7, PC0-7, TDO, RESET, SCLK IIL Input current (0 to 70) IRQ, OSC1, TCAP1, TCAP2, RDI, IIN PD0/AN0-PD7/AN7 (channel not selected) Input current (- 40 to 125) IRQ, OSC1, TCAP1, TCAP2, RDI, IIN Capacitance Ports (as input or output), RESET, TDO, COUT SCLK CIN IRQ, TCAP1, TCAP2, OSC1, RDI CIN PD0/AN0-PD7/AN7 (A/D off) CIN PD0/AN0-PD7/AN7 (A/D on) Min Typ(2) Max Unit VDD - 0.1 -- -- -- -- 0.1 V VDD - 0.3 VDD - 0.1 -- VDD - 0.3 VDD - 0.1 -- -- 0.1 0.3 0.2 0.6 0.7VDD -- VDD V VSS -- 0.2VDD V -- -- -- -- 1.2 0.2 0.4 0.15 3 1 1.5 0.5 mA mA mA mA -- -- -- -- 1 -- -- -- 10 10 40 40 A A A A -- 0.2 1 A -- 0.2 0.2 1 1 A -- -- 5 A -- -- -- -- -- -- 12 22 12 8 -- -- pF pF pF pF V V 11 (1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching currents inherent in CMOS designs (see Section 2). (2) Typical values are at mid point of voltage range and at 25C only. (3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 2.0MHz); all inputs 0.2 V from rail; no DC loads; maximum load on outputs 50pF (20pF on OSC2). STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD - 0.2 V: STOP IDD measured with OSC1 = VDD. WAIT IDD is affected linearly by the OSC2 capacitance. MC68HC05B6 Rev. 4.1 ELECTRICAL SPECIFICATIONS Freescale 11-5 11.2.2 IDD trends for 3.3V operation For the examples below, typical values are at the mid-point of the voltage range and at a temperature of 25C only. 2.5 2 IDD (mA) 1.5 1 3.6V 3.0V 0.5 0 0 0.5 1 1.5 2 Internal operating frequency (MHz) 2.5 Figure 11-7 Run IDD vs internal operating frequency (3 V, 3.6V) 0.6 0.5 0.4 IDD (mA) 0.3 0.2 3.6V 3.0V 0.1 0 0 0.5 1 1.5 2 Internal operating frequency (MHz) 2.5 Figure 11-8 Run IDD (SM = 1) vs internal operating frequency (3V,3.6V) 11 1.2 1 0.8 IDD (mA) 0.6 0.4 3.6V 3.0V 0.2 0 0 0.5 1 1.5 2 Internal operating frequency (MHz) 2.5 Figure 11-9 Wait IDD vs internal operating frequency (3V, 3.6V) Freescale 11-6 ELECTRICAL SPECIFICATIONS MC68HC05B6 Rev. 4.1 0.5 0.4 IDD (mA) 0.3 0.2 3.6V 3.0V 0.1 0 0 0.5 1 1.5 2 Internal operating frequency (MHz) 2.5 Figure 11-10 Wait IDD (SM = 1) vs internal operating frequency (3V, 3.6V) 0.7 0.6 0.5 IDD (mA) 0.4 0.3 0.2 0.1 0 A/D + SCI A/D SCI 0 0.5 1 1.5 2 Internal operating frequency (MHz) 2.5 Figure 11-11 Increase in IDD vs frequency for A/D, SCI systems active, VDD = 3.6V 2.5 2 IDD (mA) Run IDD 1.5 Run IDD (SM=1) 1 Wait IDD (SM=1) 0.5 0 11 Wait IDD 0 0.5 1 1.5 Internal operating frequency (MHz) 2 2.5 Figure 11-12 IDD vs mode vs internal operating frequency, VDD = 3.6V MC68HC05B6 Rev. 4.1 ELECTRICAL SPECIFICATIONS Freescale 11-7 11.3 A/D converter characteristics Table 11-4 A/D characteristics for 5V operation (VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Min Max Unit Resolution Characteristic Number of bits resolved by the A/D Parameter 8 -- Bit Non-linearity Max deviation from the best straight line through the A/D transfer characteristics (VRH = VDD and VRL = 0V) -- 0.5 LSB Quantization error Uncertainty due to converter resolution -- 0.5 LSB Absolute accuracy Difference between the actual input voltage and the full-scale equivalent of the binary code output code for all errors -- 1 LSB Conversion range Analog input voltage range VRL VRH V VRH Maximum analog reference voltage VRL VDD + 0.1 V Minimum analog reference voltage VSS - 0.1 VRH V VR(1) Minimum difference between VRH and VRL 3 -- V Conversion time Total time to perform a single analog to digital conversion a. External clock (OSC1, OSC2) b. Internal RC oscillator -- -- 32 32 tCYC s VRL Monotonicity Conversion result never decreases with an increase in input voltage and has no missing codes Zero input reading Conversion result when VIN = VRL 00 -- Hex Full scale reading Conversion result when VIN = VRH -- FF Hex Sample acquisition time Analog input acquisition sampling a. External clock (OSC1, OSC2) b. Internal RC oscillator(2) -- -- 12 12 tCYC s Sample/hold capacitance Input capacitance on PD0/AN0-PD7/AN7 -- 12 pF Input leakage(3) -- 1 A Input leakage on A/D pins PD0/AN0-PD7/AN7, VRL, VRH GUARANTEED (1) Performance verified down to 2.5V VR, but accuracy is tested and guaranteed at VR = 5V10%. 11 (2) Source impedances greater than 10k will adversely affect internal charging time during input sampling. (3) The external system error caused by input leakage current is approximately equal to the product of R source and input current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2). Freescale 11-8 ELECTRICAL SPECIFICATIONS MC68HC05B6 Rev. 4.1 Table 11-5 A/D characteristics for 3.3V operation (VDD = 3.3 Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Min Max Unit Resolution Characteristic Number of bits resolved by the A/D Parameter 8 -- Bit Non-linearity Max deviation from the best straight line through the A/D transfer characteristics (VRH = VDD and VRL = 0V) -- 1 LSB Quantization error Uncertainty due to converter resolution -- 1 LSB Absolute accuracy Difference between the actual input voltage and the full-scale equivalent of the binary code output code for all errors -- 2 LSB Conversion range Analog input voltage range VRL VRH V VRH Maximum analog reference voltage VRL VDD + 0.1 V VRL Minimum analog reference voltage VSS - 0.1 VRH V VR Minimum difference between VRH and VRL 3 -- V Conversion time Total time to perform a single analog to digital conversion Internal RC oscillator -- 32 s Monotonicity Conversion result never decreases with an increase in input voltage and has no missing codes GUARANTEED Zero input reading Conversion result when VIN = VRL 00 -- Hex Full scale reading Conversion result when VIN = VRH -- FF Hex Sample acquisition time Analog input acquisition sampling Internal RC oscillator(1) -- 12 s Sample/hold capacitance Input capacitance on PD0/AN0-PD7/AN7 -- 12 pF Input leakage(2) -- 1 A Input leakage on A/D pins PD0/AN0-PD7/AN7, VRL, VRH (1) Source impedances greater than 10k will adversely affect internal charging time during input sampling. (2) The external system error caused by input leakage current is approximately equal to the product of R source and input current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2). 11 MC68HC05B6 Rev. 4.1 ELECTRICAL SPECIFICATIONS Freescale 11-9 11.4 Control timing Table 11-6 Control timing for 5V operation (VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Characteristic Symbol Frequency of operation Crystal option fOSC External clock option fOSC Internal operating frequency (fOSC/2) Using crystal fOP Using external clock fOP Cycle time (see Figure 9-1) tCYC Crystal oscillator start-up time (see Figure 9-1) tOXOV Stop recovery start-up time (crystal oscillator) tILCH RC oscillator stabilization time tADRC A/D converter stabilization time tADON External RESET input pulse width tRL Power-on RESET output pulse width 4064 cycle tPORL 16 cycle tPORL Watchdog RESET output pulse width tDOGL Watchdog time-out tDOG EEPROM byte erase time 0 to 70 (standard) - 40 to 85 (extended) - 40 to 125 (automotive) EEPROM byte program time(1) 0 to 70 (standard) - 40 to 85 (extended) - 40 to 125 (automotive) Timer (see Figure 11-13) Resolution(2) Input capture pulse width Input capture pulse period Interrupt pulse width (edge-triggered) Interrupt pulse period OSC1 pulse width(5) Write/Erase endurance(6)(7) Data retention(6)(7) 11 Min Max Unit -- dc 4.2 4.2 MHz MHz dc dc 476 -- 1.5 2.1 2.1 -- 100 100 5 500 -- MHz MHz ns ms ms s s tCYC 4064 16 1.5 6144 -- -- -- 7168 tCYC tCYC tERA tERA tERA 10 10 10 -- -- -- ms ms ms tPROG tPROG tPROG 10 10 20 -- -- -- ms ms ms -- -- -- -- -- -- tCYC ns tCYC ns tCYC ns cycles years tRESL tTH, tTL tTLTL tILIH tILIL tOH, tOL -- -- 4 125 --(3) 125 --(4) 90 10000 10 tCYC tCYC (1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when programming the EEPROM. (2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting factor in determining the timer resolution. (3) The minimum period tTLTL should not be less than the number of cycle times it takes to execute the capture interrupt service routine plus 24 tCYC. (4) The minimum period tILIL should not be less than the number of cycle times it takes to execute the interrupt service routine plus 21 tCYC. (5) tOH and tOL should not total less than 238ns. (6) At a temperature of 85C (7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information. Freescale 11-10 ELECTRICAL SPECIFICATIONS MC68HC05B6 Rev. 4.1 Table 11-7 Control timing for 3.3V operation (VDD = 3.3Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Symbol Min Max Unit Frequency of operation Crystal option External clock option Characteristic fOSC fOSC -- dc 2.0 2.0 MHz MHz Internal operating frequency (fOSC/2) Using crystal Using external clock fOP fOP -- dc 1.0 1.0 MHz MHz Cycle time (see Figure 9-1) tCYC 1000 -- ns Crystal oscillator start-up time (see Figure 9-1) tOXOV -- 100 ms Stop recovery start-up time (crystal oscillator) tILCH 100 ms RC oscillator stabilization time tADRC 5 s A/D converter stabilization time tADON 500 s External RESET input pulse width tRL 1.5 -- tCYC Power-on RESET output pulse width 4064 cycle 16 cycle tPORL tPORL 4064 16 -- -- tCYC tCYC Watchdog RESET output pulse width tDOGL 1.5 -- tCYC Watchdog time-out tDOG 6144 7168 tCYC EEPROM byte erase time 0 to 70 (standard) - 40 to 85 (extended) - 40 to 125 (automotive) 30 30 30 -- -- -- ms ms ms EEPROM byte program time(1) 0 to 70 (standard) - 40 to 85 (extended) - 40 to 125 (automotive) tERA tERA tERA tPROG tPROG tPROG 30 30 30 -- -- -- ms ms ms Timer (see Figure 11-13) Resolution(2) Input capture pulse width Input capture pulse period tRESL tTH, tTL tTLTL 4 250 --(3) -- -- -- tCYC ns tCYC Interrupt pulse width (edge-triggered) tILIH 250 -- ns Interrupt pulse period tILIL --(4) -- tCYC tOH, tOL 200 -- OSC1 pulse width(5) Write/Erase endurance(6)(7) Data retention (6)(7) 11 ns -- 10000 cycles -- 10 years (1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when programming the EEPROM. (2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting factor in determining the timer resolution. (3) The minimum period tTLTL should not be less than the number of cycle times it takes to execute the capture interrupt service routine plus 24 tCYC. (4) The minimum period tILIL should not be less than the number of cycle times it takes to execute the interrupt service routine plus 21 tCYC. (5) tOH and tOL should not total less than 500ns. (6) At a temperature of 85C (7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information. MC68HC05B6 Rev. 4.1 ELECTRICAL SPECIFICATIONS Freescale 11-11 tTLTL tTH tTL External signal (TCAP1, TCAP2) Figure 11-13 Timer relationship 11 Freescale 11-12 ELECTRICAL SPECIFICATIONS MC68HC05B6 Rev. 4.1 12 MECHANICAL DATA MC68HC05B family pin configurations 12.1.1 52-pin plastic leaded chip carrier (PLCC) 47 48 49 50 51 52 2 3 4 5 39 16 38 17 37 18 36 19 35 20 34 PC3 PC4 PC5 PC6 PC7 VSS VPP1/NU PB0 PB1 PB2 PB3 PB4 PB5 PLMB TCAP1 TCAP2 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 PB7 PB6 33 15 32 40 31 41 14 30 13 29 42 28 12 27 43 26 44 11 25 10 24 45 23 46 9 22 8 21 VRH PD4/AN4 VDD PD3/AN3 PD2/AN2 PD1/AN1 PD0/AN0 NC/VPP6 OSC1 OSC2 RESET IRQ PLMA 6 7 VRL NC/NU PD5/AN5 PD6/AN6 PD7/AN7 TCMP1 TCMP2 TDO SCLK RDI PC0 PC1 PC2/ECLK 12.1 Pin 6 Pin 15 MC68HC05B4 Device NC NC Pin 40 NU MC68HC05B6 NC NC VPP1 MC68HC05B8 NC NC VPP1 MC68HC05B16 NC NC VPP1 MC68HC05B32 NC NC VPP1 MC68HC705B5 NC VPP6 NU MC68HC705B16 NU VPP6 VPP1 MC68HC705B16N NU VPP6 VPP1 MC68HC705B32 NU VPP6 VPP1 NC = Not connected NU = Non-user pin (Should be tied to VSS in an electrically noisy environment) 12 Figure 12-1 52-pin PLCC pinout for the MC68HC05B6 TPG MC68HC05B6 Rev. 4.1 MECHANICAL DATA Freescale 12-1 141 64-pin quad flat pack (QFP) 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 PC2/ECLK PC3 PC4 PC5 PC6 PC7 VSS VPP1/NC NC NC/NU PB0 PB1 PB2 PB3 PB4 PB5 12.1.2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 PB6 PB7 NC NC PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 NC TCAP2 TCAP1 PLMB D/A VRL VRH PD4/AN4 VDD PD3/AN3 PD2/AN2 PD1/AN1 PD0/AN0 NC NC NC/VPP6 OSC1 OSC2 RESET IRQ PLMA D/A 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 PC1 PC0 NC NC NC NC NC RDI SCLK TDO TCMP2 TCMP1 PD7/AN7 PD6/AN6 PD5/AN5 NC Pin 27 Pin 55 Pin 57 MC68HC05B4 Device NC NC NC MC68HC05B6 MC68HC05B8 MC68HC05B16 MC68HC05B32 NC NC VPP1 MC68HC705B5 12 Not available in this package MC68HC705B16 VPP6 NU MC68HC705B16N VPP6 NU VPP1 VPP1 MC68HC705B32 VPP6 NC VPP1 NC = Not connected NU = Non-user pin (Should be tied to VSS in an electrically noisy environment) Figure 12-2 64-pin QFP pinout for the MC68HC05B6 TPG Freescale 12-2 MECHANICAL DATA MC68HC05B6 Rev. 4.1 142 12.1.3 56-pin shrink dual in line package (SDIP) TCMP1 PD7 PD6 PD5 NC NC/NU NC VRL VRH PD4 VDD PD3 PD2 PD1 PD0 NC/VPP6 OSC1 OSC2 RESET IRQ PLMA PLMB TCAP1 TCAP2 PA7 PA6 PA5 PA4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Device 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 TCMP2 TDO SCLK RDI PC0 PC1 NC PC2 PC3 PC4 PC5 PC6 PC7 VSS VPP1/NC PB0 PB1 PB2 PB3 PB4 PB5 NC PB6 PB7 PA0 PA1 PA2 PA3 Pin 6 Pin 16 MC68HC05B4 NC NC Pin 42 NC MC68HC05B6 NC NC VPP1 MC68HC05B8 NC NC VPP1 MC68HC05B16 NC NC VPP1 MC68HC05B32 NC NC VPP1 MC68HC705B5 NC VPP6 NC MC68HC705B16 Not available in this package MC68HC705B16N Contact Sales MC68HC705B32 NU VPP6 VPP1 NC = Not connected NU = Non-user pin (Should be tied to VSS in an electrically noisy environment) 12 Figure 12-3 56-pin SDIP pinout for the MC68HC05B6 TPG MC68HC05B6 Rev. 4.1 MECHANICAL DATA Freescale 12-3 143 12.2 MC68HC05B6 mechanical dimensions 12.2.1 52-pin plastic leaded chip carrier (PLCC) 0.18 M T N S -P S -N- -L- B L S -M S Y BRK -M- Case No. 778-02 52 Lead PLCC w/o pedestal G1 W pin 52 Z1 pin 1 -P- X V A R Z U 0.18 M T N S -P S L S -M S 0.18 M T L S -M S N S -P S 0.18 M T L S -M S N S -P S C G G1 0.25 S T L S -M S 12 Dim. Min. Max. A 19.94 20.19 B 19.94 20.19 C 4.20 4.57 E 2.29 2.79 F 0.33 0.48 G 1.27 BSC H 0.66 0.81 J 0.51 -- K 0.64 -- R 19.05 19.20 0.10 J E -T- SEATING PLANE N S -P S Notes 1. Datums -L-, -M-, -N- and -P- are determined where top of lead shoulder exits plastic body at mould parting line. 2. Dimension G1, true position to be measured at datum -T- (seating plane). 3. Dimensions R and U do not include mould protrusion. Allowable mould protrusion is 0.25mm per side. 4. Dimensions and tolerancing per ANSI Y 14.5M, 1982. 5. All dimensions in mm. Dim. Min. Max. U 19.05 19.20 1.21 V 1.07 W 1.07 1.21 X 1.07 1.42 Y -- 0.50 Z 2 10 G1 18.04 18.54 K1 1.02 -- Z1 2 10 Figure 12-4 52-pin PLCC mechanical dimensions TPG Freescale 12-4 MECHANICAL DATA MC68HC05B6 Rev. 4.1 144 12.2.2 64-pin quad flat pack (QFP) L B 33 -A- -B- Case No. 840C 64 lead QFP B Detail "A" 64 0.05 A - B L 17 1 P B 32 0.20 M C A - B S D S 49 V 0.20 M H A - B S D S 48 - A, B, D Detail "A" F N J 16 -D- Base Metal D A 0.20 M C A - B S D S Section B-B 0.05 A - B 0.20 M C A - B S D S S 0.20 M H A - B S D S U T Detail "C" M E R Q C -CSeating Plane Datum -H- Plane G H X Dim. Min. Max. A 13.90 14.10 B 13.90 14.10 C 2.067 2.457 D 0.30 0.45 E 2.00 2.40 F 0.30 -- G 0.80 BSC H 0.067 0.250 J 0.130 0.230 K 0.50 0.66 L K W M 12.00 REF Notes Dim. Min. 1. Datum Plane -H- is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 2. Datums A-B and -D to be determined at Datum Plane -H-. 3. Dimensions S and V to be determined at seating plane -C-. 4. Dimensions A and B do not include mould protrusion. Allowable mould protrusion is 0.25mm per side. Dimensions A and B do include mould mismatch and are determined at Datum Plane -H-. 5. Dimension D does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 total in excess of the D dimension at maximum material condition. Dambar cannot be located on the lower radius or the foot. 6. Dimensions and tolerancing per ANSI Y 14.5M, 1982. 7. All dimensions in mm. M 5 10 N 0.130 0.170 P Max. 0.40 BSC Q 2 8 R 0.13 0.30 S 16.20 16.60 T 0.20 REF U 9 15 V 16.20 16.60 W X 12 0.042 NOM 1.10 1.30 Figure 12-5 64-pin QFP mechanical dimensions TPG MC68HC05B6 Rev. 4.1 MECHANICAL DATA Freescale 12-5 145 12.2.3 56-pin shrink dual in line package (SDIP) L -A56 29 Case No. 859-01 56 lead SDIP H -B- 1 28 M J C -TSeating Plane K G F 0.25 M T B S N E D 0.25 M T A S Dim. Min. Max. A 51.69 52.45 B 13.72 14.22 C 3.94 5.08 D 0.36 0.56 E F G 0.89 BSC 0.81 1.17 Notes Dim. H 1. Due to space limitations, this case shall be represented by a general case outline, rather than one showing all the leads. 2. Dimensions and tolerancing per ANSI Y 14.5 1982. 3. All dimensions in mm. 4. Dimension L to centre of lead when formed parallel. 5. Dimensions A and B do not include mould flash. Allowable mould flash is 0.25 mm. Min. Max. 7.62 BSC J 0.20 0.38 K 2.92 3.43 L 15.24 BSC M 0 15 N 0.51 1.02 1.778 BSC Figure 12-6 56-pin SDIP mechanical dimensions 12 TPG Freescale 12-6 MECHANICAL DATA MC68HC05B6 Rev. 4.1 146 13 ORDERING INFORMATION This section describes the information needed to order the MC68HC05B6 and other family members. To initiate a ROM pattern for the MCU, it is necessary to contact your local field service office, local sales person or Freescale representative. Please note that you will need to supply details such as: mask option selections; temperature range; oscillator frequency; package type; electrical test requirements; and device marking details so that an order can be processed, and a customer specific part number allocated. Refer to Table 13-1 for appropriate part numbers. The part number consists of the device title plus the appropriate suffix. For example, the MC68HC05B6 in 52-pin PLCC package at -40 to +85C would be ordered as: MC68HC05B6CFN. Table 13-1 MC order numbers Device Title MC68HC05B6 MC68HC05B4 MC68HC05B8 MC68HC05B16 MC68HC05B32 MC68HC705B5 MC68HC705B16 MC68HC705B16N MC68HC705B32 MC68HC05B6 Rev. 4.1 Package Type 52-pin PLCC 64-pin QFP 56-pin SDIP 52-pin PLCC 64-pin QFP 56-pin SDIP 52-pin PLCC 64-pin QFP 56-pin SDIP 52-pin PLCC 64-pin QFP 56-pin SDIP 52-pin PLCC 64-pin QFP 56-pin SDIP 52-pin PLCC 56-pin SDIP 52-pin PLCC 64-pin QFP 52-pin PLCC 64-pin QFP 56-pin SDIP 52-pin PLCC 64-pin QFP 56-pin SDIP Suffix 0 to 70C FN FU B FN FU B FN FU B FN FU B FN FU B FN B FN FU FN FU FN FU B Suffix Suffix -40 to +85C -40 to +105C CFN VFN CFU VFU CB VB CFN VFN CFU VFU CB VB CFN VFN CFU VFU CB VB CFN VFN CFU VFU CB VB CFN N/A CFU N/A Contact Sales N/A CFN VFN CB VB CFN VFN CFU VFU CFN VFN CFU VFU Contact Sales CFN N/A CFU N/A CB N/A ORDERING INFORMATION Suffix -40 to +125C MFN MFU MB MFN MFU MB MFN MFU MB MFN MFU MB N/A N/A N/A MFN MB MFN MFU MFN MFU 13 N/A N/A N/A Freescale 13-1 147 148 13.1 EPROMS For the MC68HC05B6, an 8 kbyte EPROM programmed with the customer's software (positive logic for address and data) should be submitted for pattern generation. All unused bytes should be programmed to $00. The size of EPROM which should be used for all other family members is listed in Table 13-2. The EPROM should be clearly labelled, placed in a conductive IC carrier and securely packed. Table 13-2 EPROMs for pattern generation Device MC68HC05B4 13.2 Size of EPROM 8 kbyte MC68HC05B8 8 kbyte MC68HC05B16 16 kbyte MC68HC05B32 32 kbyte Verification media All original pattern media (EPROMs) are filed for contractual purposes and are not returned. A computer listing of the ROM code will be generated and returned with a listing verification form. The listing should be thoroughly checked and the verification form completed, signed and returned to Freescale. The signed verification form constitutes the contractual agreement for creation of the custom mask. If desired, Freescale will program blank EPROMs (supplied by the customer) from the data file used to create the custom mask, to aid in the verification process. 13.3 ROM verification units (RVU) Ten MCUs containing the customer's ROM pattern will be provided for program verification. These units will have been made using the custom mask but are for ROM verification only. For expediency, they are usually unmarked and are tested only at room temperature (25C) and at 5 Volts. These RVUs are included in the mask charge and are not production parts. They are neither backed nor guaranteed by Freescale Quality Assurance. 13 Freescale 13-2 ORDERING INFORMATION MC68HC05B6 Rev. 4.1 A MC68HC05B4 The MC68HC05B4 is a device similar to the MC68HC05B6, but without EEPROM and having a reduced ROM size of 4 kbytes. The entire MC68HC05B6 data sheet applies to the MC68HC05B4, with the exceptions outlined in this appendix. A.1 Features * 4158 bytes User ROM (including 14 bytes User vectors) * No EEPROM * High speed version not available Section 3.5, `EEPROM', therefore, does not apply to the MC68HC05B4, and the register at address $07 only allows the user to select whether or not the ECLK should appear at PC2, using bit 3 of $07. All other bits of this register read as `0'. Table A-1 Mode of operation selection IRQ pin TCAP1 pin PD3 PD4 VSS to VDD VSS to VDD X X Mode 2VDD VDD 0 X Self check 2VDD VDD 1 0 Serial RAM loader 2VDD VDD 1 1 Jump to any address Single chip 14 MC68HC05B6 Rev. 4.1 MC68HC05B4 Freescale A-1 149 150 151 152 153 Port A Port B 4158 bytes User ROM (including 14 bytes User vectors) Oscillator / 2 / /32 M68HC05 CPU PC0 PC1 PC2/ECLK PC3 PC4 PC5 PC6 PC7 432 bytes self check ROM Port D VDD VSS PLMA D/A PLMB D/A PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 COP watchdog OSC2 OSC1 PD0/AN0 PD1/AN1 PD2/AN2 PD3/AN3 PD4/AN4 PD5/AN5 PD6/AN6 PD7/AN7 VRH VRL PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 Port C RESET IRQ 8-bit A/D converter 176 bytes RAM 16-bit programmable timer PLM SCI TCMP1 TCMP2 TCAP1 TCAP2 RDI SCLK TDO Figure A-1 MC68HC05B4 block diagram 14 Freescale A-2 MC68HC05B4 MC68HC05B6 Rev. 4.1 154 155 156 MC68HC05B4 Registers $0000 I/O (32 bytes) $0020 Page 0 User ROM (48 bytes) $0050 $00C0 RAM (176 bytes) Stack $0100 $0200 Self-check ROM I (192 bytes) $02C0 $0F00 $1F00 User ROM (4096 bytes) Self-check ROM II (240 bytes) $1FF0 $1FF2-3 SCI $1FF4-5 Timer overflow $1FF6-7 Timer output compare 1& 2 $1FF8-9 Timer input capture 1 & 2 $1FFA-B External IRQ $1FFC-D SWI $1FFE-F Reset/power-on reset Port A data register $0000 Port B data register $0001 Port C data register $0002 Port D input data register $0003 Port A data direction register $0004 Port B data direction register $0005 Port C data direction register $0006 EEPROM/ECLK control register $0007 A/D data register $0008 A/D status/control register $0009 Pulse length modulation A $000A Pulse length modulation B $000B Miscellaneous register $000C SCI baud rate register $000D SCI control register 1 $000E SCI control register 2 $000F SCI status register $0010 SCI data register $0011 Timer control register $0012 Timer status register $0013 Capture high register 1 $0014 Capture low register 1 $0015 Compare high register 1 $0016 Compare low register 1 $0017 Counter high register $0018 Counter low register $0019 Alternate counter high register $001A Alternate counter low register $001B Capture high register 2 $001C Capture low register 2 $001D Compare high register 2 $001E Compare low register 2 $001F User vectors (14 bytes) Reserved Figure A-2 Memory map of the MC68HC05B4 14 MC68HC05B6 Rev. 4.1 MC68HC05B4 Freescale A-3 Table A-2 Register outline Register name Address bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Port A data (PORTA) $0000 Port B data (PORTB) $0001 Port C data (PORTC) $0002 Port D data (PORTD) $0003 Port A data direction (DDRA) $0004 0000 0000 Port B data direction (DDRB) $0005 0000 0000 Port C data direction (DDRC) $0006 ECLK control $0007 A/D data (ADDATA) $0008 A/D status/control (ADSTAT) $0009 Pulse length modulation A (PLMA) $000A Pulse length modulation B (PLMB) $000B Miscellaneous Undefined Undefined PC2/ ECLK PD7/ AN7 PD6/ AN6 PD5/ AN5 PD4/ AN4 PD3/ AN3 PD2/ AN2 Undefined PD1/ AN1 PD0/ AN0 Undefined 0000 0000 0 0 0 0 ECLK 0 0 0 0000 0000 0 CH3 CH2 CH1 CH0 0000 0000 0000 0000 COCO ADRC ADON 0000 0000 0000 0000 $000C POR(1) INTP INTN INTE SCT1 SCT0 SFA SFB SM WDOG ?001 000? SCT0 SCR2 SCR1 SCR0 00uu uuuu WAKE CPOL CPHA LBCL uuuu uuuu (2) SCI baud rate (BAUD) $000D SPC1 SPC0 SCI control 1 (SCCR1) $000E R8 T8 SCI control 2 (SCCR2) $000F TIE TCIE RIE ILIE TE RE RWU SCI status (SCSR) $0010 TDRE TC RDRF IDLE OR NF FE SCI data (SCDR) $0011 Timer control (TCR) $0012 ICIE OCIE TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0 ICF1 OCF1 TOF M SBK 0000 0000 1100 000u 0000 0000 ICF2 OCF2 uuuu uuuu Timer status (TSR) $0013 Input capture high 1 $0014 Input capture low 1 $0015 Undefined Output compare high 1 $0016 Undefined Output compare low 1 $0017 Undefined Timer counter high $0018 1111 1111 1111 1100 Undefined Timer counter low $0019 Alternate counter high $001A 1111 1111 Alternate counter low $001B 1111 1100 Input capture high 2 $001C Undefined Input capture low 2 $001D Undefined Output compare high 2 $001E Undefined Output compare low 2 $001F Undefined (1) This bit is set each time there is a power-on reset. (2) The state of the WDOG bit after reset is dependent upon the mask option selected; 1=watchdog enabled, 0=watchdog disabled. 14 Freescale A-4 MC68HC05B4 MC68HC05B6 Rev. 4.1 A.2 Self-check mode The self-check function available on the MC68HC05B4 provides an internal capability to determine if the device is functional. Self-check is performed using the circuit shown in Figure A-3. Port C pins PC0-PC3 are monitored for the self-check results (light emitting diodes are shown but other devices could be used), and are interpreted as described in Table A-3. The self-check mode is entered by applying 2 x VDD dc (via a 4.7k resistor) to the IRQ pin and 5V dc input (via a 4.7k resistor) to the TCAP1 pin and then depressing the reset switch to execute a reset. After reset, the following tests are performed automatically and once completed they continually repeat. A good device will exhibit flashing LEDs; a bad device will be indicated by the LEDs holding at one value. Note: Self-check code can be obtained from your local Freescale representative. I/0 -- Functionally exercises ports A, B, C and D RAM -- Counter test for each RAM byte ROM -- Exclusive OR with odd ones parity result Timer -- Tracks counter registers and checks ICF1, ICF2, OCF1, OCF2 and TOF flags SCI -- Transmission test; check for RDRF, TDRE, TC and FE flags A/D -- Check A/D functionality on internal channels: VRL, VRH and (VRL + VRH)/2 PLM -- Checks the PLM basic functionality Interrupts -- Tests external timer and SCI interrupts Watchdog-- Tests the watchdog Caution: This document includes descriptions of the various self-check and bootstrap mechanisms that are currently implemented as firmware in the non-user ROM areas of the MC68HC05B6 and related devices. As these firmware routines are intended primarily to help Freescale's engineers test the devices, they may be changed or removed at any time. For this reason, Freescale recommends the self-check and bootstrap routines are not called from the user software. Customers who do call these routines from the user software do so at their own risk. 14 MC68HC05B6 Rev. 4.1 MC68HC05B4 Freescale A-5 Table A-3 MC68HC05B4 self-check results PC3 PC2 PC1 PC0 1 0 0 1 Bad port Remarks 0 1 1 0 Bad port 1 0 1 0 Bad RAM 1 0 1 1 Bad ROM 1 1 0 0 Bad Timer 1 1 0 1 Bad SCI 1 1 1 0 Bad A/D 0 0 0 1 Bad PLM 0 0 1 0 Bad interrupts 0 0 1 1 Bad watchdog Flashing Good device All others Bad device, bad port etc. `0' indicates LED on; `1' indicates LED off 14 Freescale A-6 MC68HC05B4 MC68HC05B6 Rev. 4.1 P1 47 F 10 nF 15 RESET NC 8 VRH 18 RESET 10 VDD 16 OSC1 17 OSC2 10 M 0.01 F 22 pF IRQ 50 52 20 21 2 51 3 4 5 9 11 12 13 14 24 25 26 27 28 29 30 31 22 pF 19 BC239 VPP1 RDI TDO PLMA PLMB TCMP1 SCLK PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 TCAP2 TCMP2 1 TCAP1 22 32 PB7 33 PB6 34 PB5 35 PB4 36 PB3 37 PB2 38 PB1 39 PB0 PC7 PC6 PC5 PC4 PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 4k7 23 PC3 PC2 PC1 VSS VRL 41 Note: 4 MHz NC MC68HC05B4 (52-pin package) 6 40 GND +5V 2xVDD PC0 4k7 EEPROM tested 4k7 EEPROM not tested 4k7 42 43 44 45 46 47 48 49 680 680 680 680 7 For the MC68HC05B4, switches on PB5 and PB6 have no effect All resistors are 10 k, unless otherwise stated. Figure A-3 MC68HC05B4 self-check schematic diagram 14 MC68HC05B6 Rev. 4.1 MC68HC05B4 Freescale A-7 THIS PAGE LEFT BLANK INTENTIONALLY 14 Freescale A-8 MC68HC05B4 MC68HC05B6 Rev. 4.1 B MC68HC05B8 The MC68HC05B8 is a device similar to the MC68HC05B6, but with an increased ROM size of 7.25 kbytes. The entire MC68HC05B6 data sheet applies to the MC68HC05B8, with the exceptions outlined in this appendix. B.1 Features * 7230 bytes User ROM (including 14 bytes User vectors) * High speed version available 14 TPG MC68HC05B6 Rev. 4.1 MC68HC05B8 Freescale B-1 157 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2/ECLK PC3 PC4 PC5 PC6 PC7 COP watchdog OSC2 OSC1 Oscillator / 2 / /32 M68HC05 CPU VDD VSS 432 bytes self check ROM 176 bytes RAM 16-bit programmable timer Port D PD0/AN0 PD1/AN1 PD2/AN2 PD3/AN3 PD4/AN4 PD5/AN5 PD6/AN6 PD7/AN7 VRH VRL Port A RESET IRQ 7230 bytes User ROM (including 14 bytes User vectors) Port B Charge pump VPP1 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 Port C 256 bytes EEPROM 8-bit A/D converter TCMP1 TCMP2 TCAP1 TCAP2 SCI RDI SCLK TDO PLM PLMA D/A PLMB D/A Figure B-1 MC68HC05B8 block diagram 14 TPG Freescale B-2 MC68HC05B8 MC68HC05B6 Rev. 4.1 158 MC68HC05B8 Registers $0000 I/O (32 bytes) $0020 Page 0 User ROM (48 bytes) $0050 $00C0 $0100 $0101 RAM (176 bytes) Stack OPTR (1 byte) Non protected (31 bytes) $0120 EEPROM (256 bytes) Protected (224 bytes) $0200 Self-check ROM I (192 bytes) $02C0 $0300 $1F00 User ROM (7168 bytes) Self-check ROM II (240 bytes) $1FF0 $1FF2-3 SCI Timer overflow $1FF4-5 $1FF6-7 Timer output compare 1& 2 $1FF8-9 Timer input capture 1 & 2 External IRQ $1FFA-B $1FFC-D SWI $1FFE-F Reset/power-on reset Port A data register $0000 Port B data register $0001 Port C data register $0002 Port D input data register $0003 Port A data direction register $0004 Port B data direction register $0005 Port C data direction register $0006 EEPROM/ECLK control register $0007 A/D data register $0008 A/D status/control register $0009 Pulse length modulation A $000A Pulse length modulation B $000B Miscellaneous register $000C SCI baud rate register $000D SCI control register 1 $000E SCI control register 2 $000F SCI status register $0010 SCI data register $0011 Timer control register $0012 Timer status register $0013 Capture high register 1 $0014 Capture low register 1 $0015 Compare high register 1 $0016 Compare low register 1 $0017 Counter high register $0018 Counter low register $0019 Alternate counter high register $001A Alternate counter low register $001B Capture high register 2 $001C Capture low register 2 $001D Compare high register 2 $001E Compare low register 2 $001F Options register $0100 User vectors (14 bytes) Reserved Figure B-2 Memory map of the MC68HC05B8 14 TPG MC68HC05B6 Rev. 4.1 MC68HC05B8 Freescale B-3 159 Table B-1 Register outline Register name Address bit 7 Port A data (PORTA) $0000 Port B data (PORTB) $0001 Port C data (PORTC) $0002 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Undefined Undefined PC2/ ECLK Port D data (PORTD) $0003 Port A data direction (DDRA) $0004 0000 0000 0000 0000 Port B data direction (DDRB) $0005 Port C data direction (DDRC) $0006 EEPROM/ECLK control $0007 A/D data (ADDATA) $0008 A/D status/control (ADSTAT) $0009 Pulse length modulation A (PLMA) $000A Pulse length modulation B (PLMB) $000B Miscellaneous PD7 PD6 PD5 PD4 PD3 PD2 Undefined PD1 PD0 Undefined 0000 0000 0 0 0 0 ECLK E1ERA E1LAT E1PGM 0000 0000 0 CH3 0000 0000 COCO ADRC ADON CH2 CH1 CH0 0000 0000 0000 0000 0000 0000 $000C POR(1) INTP INTN INTE SCT1 SCT0 SFA SFB SM WDOG(2) ?001 000? SCT0 SCR2 SCR1 SCR0 00uu uuuu SCI baud rate (BAUD) $000D SPC1 SPC0 SCI control 1 (SCCR1) $000E R8 T8 SCI control 2 (SCCR2) $000F TIE TCIE RIE ILIE TE RE RWU SCI status (SCSR) $0010 TDRE TC RDRF IDLE OR NF FE SCI data (SCDR) $0011 Timer control (TCR) $0012 ICIE OCIE TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0 ICF1 OCF1 TOF M WAKE CPOL CPHA LBCL Undefined SBK 0000 0000 1100 000u 0000 0000 ICF2 Undefined Timer status (TSR) $0013 Input capture high 1 $0014 OCF2 Input capture low 1 $0015 Undefined Output compare high 1 $0016 Undefined Output compare low 1 $0017 Undefined Timer counter high $0018 1111 1111 1111 1100 Undefined Timer counter low $0019 Alternate counter high $001A 1111 1111 Alternate counter low $001B 1111 1100 Input capture high 2 $001C Undefined Input capture low 2 $001D Undefined Output compare high 2 $001E Undefined Output compare low 2 $001F Options (OPTR)(3) $0100 Undefined EE1P SEC Not affected (1) This bit is set each time there is a power-on reset. (2) The state of the WDOG bit after reset is dependent upon the mask option selected; 1=watchdog enabled, 0=watchdog disabled. (3) This register is implemented in EEPROM; therefore reset has no effect on the individual bits. 14 TPG Freescale B-4 MC68HC05B8 MC68HC05B6 Rev. 4.1 160 C MC68HC705B5 The MC68HC705B5 is a device similar to the MC68HC05B6, but with the 6 kbytes ROM and 256 bytes EEPROM replaced by a single EPROM array. In addition, the self-check routines available on the MC68HC05B6 are replaced by bootstrap firmware. The MC68HC705B5 is intended to operate as a one time programmable (OTP) version of the MC68HC05B6 without EEPROM or the MC68HC05B4, meaning that the application program can never be erased once it has been loaded into the EPROM. The entire MC68HC05B6 data sheet applies to the MC68HC705B5, with the exceptions outlined in this appendix. C.1 Features * 6206 bytes EPROM (including 14 bytes User vectors) * No EEPROM * Bootstrap firmware * Simultaneous programming of up to 4 bytes * Data protection for program code * Optional pull-down resistors on port B and port C * MC68HC05B6 mask options are programmable using control bits held in the options register * 52-pin PLCC and 56-pin SDIP packages * High speed version not available 14 MC68HC05B6 Rev. 4.1 MC68HC705B5 Freescale C-1 161 162 163 164 165 PC0 PC1 PC2/ECLK PC3 PC4 PC5 PC6 PC7 Oscillator / 2 / /32 176 bytes RAM M68HC05 CPU VDD VSS 16-bit programmable timer Port D PD0/AN0 PD1/AN1 PD2/AN2 PD3/AN3 PD4/AN4 PD5/AN5 PD6/AN6 PD7/AN7 VRH VRL PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 496 bytes bootstrap ROM COP watchdog OSC2 OSC1 Port A RESET IRQ Port B 6206 bytes EPROM (including 14 bytes User vectors) VPP6 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 Port C 256 bytes EPROM1 8-bit A/D converter TCMP1 TCMP2 TCAP1 TCAP2 SCI RDI SCLK TDO PLM PLMA D/A PLMB D/A Figure C-1 MC68HC705B5 block diagram 14 Freescale C-2 MC68HC705B5 MC68HC05B6 Rev. 4.1 166 167 168 169 170 MC68HC705B5 Registers $0000 I/O (32 bytes) $0020 Page 0 User EPROM (48 bytes) $0002 Port D input data register $0003 $0005 Port C data direction register $0006 EPROM/ECLK control register $0007 A/D data register $0008 A/D status/control register $0009 Pulse length modulation A $000A Pulse length modulation B $000B Miscellaneous register $000C SCI baud rate register $000D SCI control register 1 $000E SCI control register 2 $000F SCI status register $0010 SCI data register $0011 Timer control register $0012 Timer status register $0013 Capture high register 1 $0014 User EPROM (5888 bytes) Capture low register 1 $0015 Compare high register 1 $0016 Compare low register 1 $0017 Options register Counter high register $0018 Counter low register $0019 Alternate counter high register $001A Alternate counter low register $001B Capture high register 2 $001C Capture low register 2 $001D Compare high register 2 $001E Compare low register 2 $001F Options register $1EFE $0100 User EPROM1 (256 bytes) Bootstrap ROMI (256 bytes) $0300 $0800 $1F00 $0001 $0004 Stack $1EFE Port B data register Port C data register Port A data direction register RAM (176 bytes) $0200 $0000 Port B data direction register $0050 $00C0 Port A data register Bootstrap ROMII (240 bytes) $1FF0 $1FF2-3 SCI Timer overflow $1FF2-3 $1FF2-3 Timer output compare 1& 2 $1FF2-3 Timer input capture 1 & 2 External IRQ $1FF2-3 $1FF2-3 SWI $1FF2-3 Reset/power-on reset User vectors (14 bytes) Reserved Figure C-2 Memory map of the MC68HC705B5 14 MC68HC05B6 Rev. 4.1 MC68HC705B5 Freescale C-3 171 172 173 174 175 Table C-1 Register outline Register name Address bit 7 Port A data (PORTA) $0000 Port B data (PORTB) $0001 Port C data (PORTC) $0002 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Undefined Undefined PC2/ ECLK Port D data (PORTD) $0003 Port A data direction (DDRA) $0004 0000 0000 0000 0000 Port B data direction (DDRB) $0005 Port C data direction (DDRC) $0006 EPROM/ECLK control $0007 A/D data (ADDATA) $0008 A/D status/control (ADSTAT) $0009 Pulse length modulation A (PLMA) $000A Pulse length modulation B (PLMB) $000B Miscellaneous PD7 PD6 PD5 PD4 PD3 PD2 Undefined PD1 PD0 Undefined 0000 0000 EPPT(1) ELAT EPGM ECLK u?00 0uuu 0000 0000 COCO ADRC ADON 0 CH3 CH2 CH1 CH0 0000 0000 0000 0000 0000 0000 $000C POR(2) INTP INTN INTE SCT1 SCT0 SFA SFB SM WDOG(3) ?001 000? SCT0 SCR2 SCR1 SCR0 00uu uuuu SCI baud rate (BAUD) $000D SPC1 SPC0 SCI control 1 (SCCR1) $000E R8 T8 SCI control 2 (SCCR2) $000F TIE TCIE RIE ILIE TE RE RWU SCI status (SCSR) $0010 TDRE TC RDRF IDLE OR NF FE SCI data (SCDR) $0011 Timer control (TCR) $0012 ICIE OCIE TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0 ICF1 OCF1 TOF Timer status (TSR) $0013 Input capture high 1 $0014 M WAKE CPOL CPHA LBCL uuuu SBK 0000 0000 1100 000u 0000 0000 ICF2 uuuu OCF2 Undefined Input capture low 1 $0015 Undefined Output compare high 1 $0016 Undefined Output compare low 1 $0017 Undefined Timer counter high $0018 1111 1111 1111 1100 Timer counter low $0019 Alternate counter high $001A 1111 1111 Alternate counter low $001B 1111 1100 Input capture high 2 $001C Undefined Input capture low 2 $001D Undefined Output compare high 2 $001E Undefined Output compare low 2 $001F Options (OPTR)(4) $1EFE Undefined EPP 0 RTIM RWAT WWAT PBPD PCPD Not affected (1) This bit reflects the state of the EPP bit in the options register ($1EFE) at reset. (2) This bit is set each time the device is powered-on. (3) The state of the WDOG bit after reset depends on the mask option selected; `1' = watchdog enabled and `0' = watchdog disabled. (4) Because this register is implemented in EPROM, reset has no effect on the state of the individual bits. 14 Freescale C-4 MC68HC705B5 MC68HC05B6 Rev. 4.1 176 177 178 C.2 EPROM The MC68HC705B5 has a total of 6206 bytes of EPROM, 256 bytes being reserved for the EPROM1 array (see Figure C-2). The EPP bit (EPROM protect) is not operative on the EPROM1 array, making it possible to program it after the main EPROM has been programmed and protected. The reset and interrupt vectors are located at $1FF2-$1FFF and the EPROM control register described in Section C.3.1 is located at address $0007. The EPROM array is supplied by the VPP6 pin in both read and programming modes. Typically the user's software will be loaded in a programming board where VPP6 is controlled by one of the bootstrap loader routines (bootloader mode). It will then be placed in an application where no programming occurs (user mode). In this case the VPP6 pin should be hardwired to VDD. An erased EPROM byte reads as $00. Warning: A minimum VDD voltage must be applied to the VPP6 pin at all times, including power-on, as a lower voltage could damage the device. Unless otherwise stated, EPROM programming is guaranteed at ambient (25C) temperature only C.2.1 EPROM programming operation The User program can be used to program some EPROM locations, provided the proper procedure is followed. In particular, the programming sequence must be running in RAM, as the EPROM will not be available for code execution while the ELAT bit is set. The VPP6 switching must occur externally, after the EPGM bit is set, for example, under the control of a signal generated on a pin by the programming routine. Note: Unless the part has a window for reprogramming, only the cumulative programming of bits to logic 1 is possible if multiple programming is made on the same byte. To allow simultaneous programming of up to 4 bytes, they must be in the same group of addresses which share the same most significant address bits; only the two LSBs can change. 14 MC68HC05B6 Rev. 4.1 MC68HC705B5 Freescale C-5 C.3 EPROM registers C.3.1 EPROM control register Address EPROM/ECLK control $0007 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 State on reset bit 0 EPPT(1) ELAT EPGM ECLK u?00 0uuu (1) This bit is a copy of the EPP bit in the options register at $1EFE and therefore its state on reset will be the same as that for the EPP bit. Bit 7 -- Factory use only This bit is strictly for factory use only and will always read zero. EPPT -- EPROM protect test bit This bit is a copy of the EPROM protect bit (EPP) located in the option register. When ELAT is set, the EPPT bit can be tested by the software to check if the EPROM array is protected or not, since the EPROM content is not available when ELAT is set. POR or external reset modifies this bit to reflect the state of the EPP bit in the options register. ELAT -- EPROM programming latch enable bit 1 (set) - 0 (clear) - When set, this bit allows latching of the address and up to 4 data bytes for further programming, provided EPGM is zero. When cleared, program and interrupt routines can be executed and data can be read in the EPROM or firmware ROM. STOP, power-on and external reset clear this bit. EPGM -- EPROM programming bit This bit is the EPROM program enable bit. It can be set to `1' to enable programming only after ELAT is set and at least one byte is written to the EPROM. It is not possible to clear EPGM by software, but clearing ELAT will always clear EPGM. ECLK -- External clock option bit See Section 4.3. 14 Freescale C-6 MC68HC705B5 MC68HC05B6 Rev. 4.1 C.4 Options register (OPTR) Address Options (OPTR)(1) bit 7 $1EFE bit 6 bit 5 EPP 0 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset RTIM RWAT WWAT PBPD PCPD Not affected (1) This register is implemented in EPROM, therefore reset has no effect on the state of the individual bits. Note: This register can only be written to while the device is in bootloader mode. Bit 7 -- Factory use only Warning: This bit is strictly for factory use only and will always read zero to avoid accidental damage to the device. Any attempt to write to this bit could result in physical damage. EPP -- EPROM protect This bit protects the contents of the main EPROM against accidental modification; it has no effect on reading or executing code in the EPROM. 1 (set) - 0 (clear) - EPROM contents are protected. EPROM contents are not protected. RTIM -- Reset time This bit can modify tPORL, i.e. the time that the RESET pin is kept low following a power-on reset. This feature is handled in the ROM part via a mask option. 1 (set) - 0 (clear) - tPORL = 16 cycles. tPORL = 4064 cycles. RWAT -- Watchdog after reset This bit can modify the status of the watchdog counter after reset. 1 (set) - 0 (clear) - The watchdog will be active immediately following power-on or external reset (except in bootstrap mode). The watchdog system will be disabled after power-on or external reset. WWAT -- Watchdog during WAIT mode This bit can modify the status of the watchdog counter during WAIT mode. MC68HC05B6 Rev. 4.1 MC68HC705B5 14 Freescale C-7 1 (set) - 0 (clear) - The watchdog will be active during WAIT mode. The watchdog system will be disabled during WAIT mode. PBPD - Port B pull-down resistors 1 (set) - 0 (clear) - Pull-down resistors are connected to all 8 pins of port B; the pull-down, RPD, is active only while the pin is an input. No pull-down resistors are connected. PCPD -- Port C pull-down resistors 1 (set) - 0 (clear) - Pull-down resistors are connected to all 8 pins of port C; the pull-down, RPD, is active only while the pin is an input. No pull-down resistors are connected. The combination of bit 0 and bit 1 allows the option of pull-down resistors on 0, 8 or 16 inputs. This feature is not available on the MC68HC05B6. C.5 Bootstrap mode The 432 bytes of self-check firmware on the MC68HC05B6 are replaced with 496 bytes of bootstrap firmware. The bootstrap firmware located from $0200 to $02FF and $1F00 to $1FEF can be used to program the EPROM, to check if the EPROM is erased and to load and execute data in RAM. When the MC68HC705B5 is placed in the bootstrap mode, the bootstrap reset vector is fetched and the bootstrap firmware starts to execute. Table C-2 shows the conditions required to enter each level of bootstrap mode on the rising edge of RESET. The hold time on the IRQ and TCAP1 pins after the external RESET pin is brought high is two clock cycles. Table C-2 Mode of operation selection IRQ pin TCAP1 pin PD2 PD3 PD4 VSS to VDD VSS to VDD x x x Mode + 9 Volts VDD 0 1 0 Erased EPROM verification + 9 Volts VDD x 0 0 EPROM parallel bootstrap load + 9 Volts VDD x 1 1 EPROM (RAM) serial bootstrap load and execute + 9 Volts VDD x 0 1 RAM parallel bootstrap load and execute Single chip x = Don't care 14 Freescale C-8 MC68HC705B5 MC68HC05B6 Rev. 4.1 The bootstrap program first copies part of itself into RAM, as the program cannot be executed in ROM during verification/programming of the EPROM. It then sets the TCMP1 output to a logic high level. Reset IRQ at 9V? N User mode Y TCAP1 set? N Non-user mode Y Bootstrap mode A Y PD4 set? N PD3 set? Y Y N Parallel EPROM bootstrap Program EPROM; parallel load; green LED flashes Programming OK? EPROM erased? N PD2 set? N Y Non-user mode Red LED on EPROM not erased Green LED on Y N Red LED on Green LED on Bad EPROM programming EPROM verified Figure C-3 Modes of operation flow chart (1 of 2) 14 MC68HC05B6 Rev. 4.1 MC68HC705B5 Freescale C-9 A Bootstrap RAM N PD3 set? Y N PD4 set? Serial EPROM (RAM) bootstrap Red LED off Y N Load next RAM byte Transmit last four programmed locations RAM full? Receive address Y Execute RAM program at $0050 Receive four data Green LED on Y Bad EPROM programming Negative address? Red LED on N Execute RAM program at $0083 N Program EPROM data at address; green LED flashes Y Programming OK? Figure C-4 Modes of operation flow chart (2 of 2) 14 Freescale C-10 MC68HC705B5 MC68HC05B6 Rev. 4.1 C.5.1 Erased EPROM verification The flowchart in Figure C-3 and Figure C-4 shows that the on-chip bootstrap routines can be used to check if the EPROM is erased (all $00s). If a non $00 byte is detected, the red LED stays on and the routine will stay in a loop. Only when the whole EPROM content is verified as erased will the green LED be turned on. C.5.2 EPROM parallel bootstrap load When this mode is selected, the EPROM is loaded in increasing address order with non EPROM segments being skipped by the loader. Simultaneous programming is performed by reading four bytes of data before actual programming is performed, thus dividing the loading time of the internal EPROM by four. When PD2=0, the programming time is set to 5 milliseconds and the program/verify routine takes approximately 15 seconds. Parallel data is entered through Port A, while the 13-bit address is output on port B and PC0 to PC4. If the data comes from an external EPROM, the handshake can be disabled by connecting together PC5 and PC6. If the data is supplied via a parallel interface, handshaking will be provided by PC5 and PC6 according to the timing diagram of Figure C-5. During programming, the green LED flashes at about 3 Hz. Upon completion of the programming operation, the EPROM content is checked against the external data source. If programming is verified the green LED stays on, while an error causes the red LED to be turned on. Figure C-6 shows a circuit that can be used to program the EPROM (or to load and execute data in the RAM). Note: The entire EPROM can be loaded from the external source; if it is desired to leave a segment undisturbed, the data for this segment should be all zeros. Address HDSK out (PC5) DATA HDSK in (PC6) F29 Data read 14 Data read Figure C-5 Timing diagram with handshake MC68HC05B6 Rev. 4.1 MC68HC705B5 Freescale C-11 RESET RUN 1N914 P1 1 2 3 + 100F GND +5V VPP 1k 100k 1.0F + 1N914 TCAP1 VRH VDD IRQ 47F OSC1 + 10M red LED 470 0.01F 470 RESET OSC2 NC TCMP1 TCMP2 PLMA PLMB RDI VRL TCAP2 PD7 PD6 PD5 PD3 PD2 PD1 PD0 green LED red LED -- programming failed green LED -- programming OK 4.0 MHz 22pF 22pF MC68HC705B5 +5V RAM 26 27 28 VPP NC PGM VCC 20 A0 A1 A2 A3 A4 A5 A6 A7 CE 27C64 25 24 21 23 2 A8 A9 A10 A11 A12 GND 14 Note: D0 D1 D2 D3 D4 D5 D6 D7 OE 1N5819 1 EPROM 10 9 8 7 6 5 4 3 11 12 13 15 16 17 18 19 TDO SCLK PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 10 k 1 k BC309C PD4 VPP6 12 k 4k7 PC7 BC239C 1nF + 4k7 +5V PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 100 k HDSK out PC5 PC6 VSS PC4 PC3 PC2 PC1 PC0 Short circuit if handshake not used A12 A11 A10 A9 A8 HDSK in 22 This circuit is recommended for programming only at 25C and not for use in the end application, or at temperatures other than 25C. If used in the end application, VPP6 should be tied to VDD to avoid damaging the device. 14 Figure C-6 EPROM(RAM) parallel bootstrap schematic diagram Freescale C-12 MC68HC705B5 MC68HC05B6 Rev. 4.1 C.5.3 EPROM (RAM) serial bootstrap load and execute The serial routine communicates through the SCI with an external host, typically a PC, by means of an RS232 link at 9600 baud, 8-bit, no parity and full duplex. Data format is not ASCII, but 8-bit binary, so a complementary program must be run by the host to supply the required format. Such a program is available for the IBM PC from Freescale. The EPROM bootstrap routines are used to customise the OTP EPROM. To increase the speed of programming, four bytes are programmed in parallel while the data is simultaneously transmitted and received in full duplex. This implies that while 4 bytes are being programmed, the next 4 bytes are received and the preceding 4 bytes are echoed. The format accepted by the serial loader is as follows: [address n high] [address n low] [data(n)] [data (n+1)] [data (n+2)] [data (n+3)] Address n must have the two LSBs at zero so that n, n+1, n+2 and n+3 have identical MSBs. These blocks of four bytes do not need to be contiguous, as a new address is transmitted for each new group. The protocol is as follows: 1 The MC68HC705B5 sends the last two bytes programmed to the host as a prompt; this allows verification by the host of proper programming. 1) In response to the first byte prompt, the host sends the first address byte. 2) After receiving the first address byte, the MC68HC705B5 sends the next byte programmed. 3) The exchange of data continues until the MC68HC705B5 has sent the four data bytes and the host has sent the 2 address data bytes and 4 data bytes. 4) If the data is non zero, it is programmed at the address provided, while the next address and bytes are received and the previous data is echoed. 5) Loop to 1. After reset, the MC68HC705B5 serial bootstrap routine will first echo two blocks of four bytes at $0000, as no data is programmed yet. If the data sent in is $00, no programming in the EPROM takes place, and the contents of the accessed location are returned as a prompt. The entire EPROM memory can be read in this fashion (serial dump). The red LED will be on if the data read from the EPROM is not $00. Serial RAM loading and execute can be accomplished in this mode. A RAM byte will be written if the address sent by the host in the serial protocol points to the RAM. In the RAM bootloader mode, all interrupt vectors are mapped to pseudo-vectors in RAM (see Table C-3). This allows programmers to use their own service-routine addresses. Each pseudo-vector is allowed three bytes of space rather than the two bytes for normal vectors, because an explicit jump (JMP) opcode is needed to cause the desired jump to the user's service-routine address. MC68HC05B6 Rev. 4.1 MC68HC705B5 Freescale C-13 14 Table C-3 Bootstrap vector targets in RAM Vector targets in RAM SCI interrupt $00E4 Timer overflow $00E7 Timer output compare $00EA Timer input capture $00ED IRQ $00F0 SWI $00F3 A 10-byte stack is also reserved at the top of the RAM allowing, for example, one interrupt and two sub-routine levels. Program execution is triggered by sending a negative (bit 7 set) high address; execution starts at address XADR ($0083). The RAM addresses between $0050 and $0082 are used by the loader and are therefore not available to the user during serial loading/executing. Refer to Figure C-7 shows a suitable circuit. Figure C-9 shows address and data bus timing. C.5.4 RAM parallel bootstrap load and execute The RAM bootstrap program will start loading the RAM with external data (e.g. from a 2564 or 2764 EPROM). Before loading a new byte, the state of the PD4/AN4 pin is checked; if this pin goes to level `0', or if the RAM is full, then control is given to the loaded program at address $0050. If the data is supplied by a parallel interface, handshaking will be provided by PC5 and PC6 according to Figure C-10. If the data comes from an external EPROM, the handshake can be disabled by connecting together PC5 and PC6. Figure C-8 shows a circuit that can be used to load the RAM with short test programs. Up to 8 programs can be loaded in turn from the EPROM. Selection is accomplished by means of the switches connected to the EPROM higher address lines (A8 through A10). If the user program sets PC0 to level `1', the external EPROM will be disabled, rendering both port A outputs and port B inputs available. The EPROM parallel bootstrap loader circuit (Figure C-6) can also be used, provided VPP is tied to VDD. The high order address lines will be at zero. The LEDs will stay off. 14 Freescale C-14 MC68HC705B5 MC68HC05B6 Rev. 4.1 P1 RESET 100k RUN 10nF 1k 1N914 1.0F + 1N914 22 8 1 2 3 GND +5V VPP + 47F 10 TCAP1 VRH VDD 19 IRQ 18 RESET 47F OSC1 + 10M OSC2 Red LED 470 0.01F 20 470 21 PLMA 4.0 MHz 22pF 22pF PLMB Green LED PD3 Erase check MC68HC705B5 Green -- EPROM erased Red -- EPROM not erased Serial boot PD4 Green -- programming OK Red -- programming error 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 9600 BD 8-bit no parity RS232 Connector 22F + 8 5 7 3 2 1 2 x 3K +5V 16 2 22F + 6 MAX 232 13 14 1 3 4 5 12 11 + 22F + 22F 14 13 12 5 4 3 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 VPP6 12 k 4k7 PC7 PD0 PD1 PD2 PD5 PD6 PD7 50 RDI 52 TDO VSS 41 BC239C 1nF + 4k7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 15 Note: 10 k 1 k BC309C Serial boot 1N5819 Erase check PC6 PC5 PC4 PC3 PC2 PC1 PC0 43 44 45 46 47 48 49 23 TCAP2 2 TCMP1 1 TCMP2 51 SCLK 40 NC VRL 7 A minimum VDD voltage must be applied to the VPP6 pin at all times, including power-on, as a lower voltage could damage the device. Unless otherwise stated, EPROM programming is guaranteed at ambient (25C) temperature only Figure C-7 EPROM (RAM) serial bootstrap schematic diagram MC68HC05B6 Rev. 4.1 MC68HC705B5 Freescale C-15 14 P1 RESET RUN 100F 1N914 + 1 GND +5V 2 1k 100k 1.0F + 1N914 TCAP1 VDD IRQ OSC1 RESET OSC2 10M 4.0 MHz 0.01F 22pF 22pF PD4 VPP6 MC68HC705B5 +5V 1 26 27 +5V 16 x 100k 28 VPP NC PGM VCC 20 CE 23 A11 2 A12 U1 2764 +5V 3 x 4.7k 25 24 21 A8 A9 A0 A1 A2 A3 A4 A5 A6 A7 D0 D1 D2 D3 D4 D5 D6 D7 10 9 8 7 6 5 4 3 11 12 13 15 16 17 18 19 A10 GND 14 OE PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB6 PB7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 +5V 18 x 100 k NC TCAP2 TCMP2 TCMP1 PLMB PLMA SCLK TDO RDI VRH VRL PD7 PD6 PD5 PD3 PD2 PD1 PD0 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0 VSS 22 14 Figure C-8 RAM parallel bootstrap schematic diagram Freescale C-16 MC68HC705B5 MC68HC05B6 Rev. 4.1 C.5.5 Bootstrap loader timing diagrams tCOOE tCOOE tCOOE tCDDE Address tADE tDHE tADE tDHE tADE tDHE tADE tDHE Data tADE max (address to data delay) 5 machine cycles tDHA min (data hold time) 14 machine cycles tCOOE (load cycle time) 117 machine cycles < tCOOE < 150 machine cycles tCDDE (programming cycle time) tCOOE + tPROG (5ms nominal) 1 machine cycle = 1/(2f0(Xtal)) Figure C-9 EPROM parallel bootstrap loader timing diagram 14 MC68HC05B6 Rev. 4.1 MC68HC705B5 Freescale C-17 tCR Address PC5 out tHO tADR tDHR Data tHI max PC6 in PD4 tEXR max tADR max (address to data delay; PC6=PC5) 16 machine cycles tDHR min (data hold time) 4 machine cycles tCR (load cycle time; PC6=PC5) 49 machine cycles tHO (PC5 handshake out delay) 5 machine cycles tHI max (PC6 handshake in, data hold time) 10 machine cycles tEXR max (max delay for transition to be recognised during this cycle; PC6=PC5 30 machine cycles 1 machine cycle = 1/(2f0(Xtal)) Figure C-10 RAM parallel loader timing diagram 14 Freescale C-18 MC68HC705B5 MC68HC05B6 Rev. 4.1 C.6 Note: DC electrical characteristics The complete table of DC electrical characteristics can be found in Section 11.2. The values contained in the following table should be used in conjunction with those quoted in that section. Table C-4 Additional DC electrical characteristics for MC68HC705B5 (VDD = 5 Vdc 10%, VSS = 0 Vdc, TA = 25C) Characteristic Symbol Input current Port B and port C pull-down (VIN =VIH) IRPD EPROM absolute maximum voltage EPROM programming voltage EPROM programming current EPROM read voltage C.7 Note: Min Typ Max Unit A 80 VPP6 max VDD -- 18 V VPP6 15.0 15.5 16 V IPP6 -- -- 18 mA VPP6R VDD VDD VDD V Control timing The complete table of control timing can be found in Section 11.4. The values contained in the following table should be used in conjunction with those quoted in that section. Table C-5 Additional control timing for MC68HC705B5 (VDD = 5 Vdc 10%, VSS = 0 Vdc, TA = 25 C) Characteristic EPROM programming time Symbol Min Typ Max Unit tPROG 5 -- 20 ms 14 MC68HC05B6 Rev. 4.1 MC68HC705B5 Freescale C-19 THIS PAGE LEFT BLANK INTENTIONALLY 14 Freescale C-20 MC68HC705B5 MC68HC05B6 Rev. 4.1 D MC68HC05B16 Maskset errata This errata section outlines the differences between previously available masksets (D20J, F62J and G28F) and all other masksets. Unless otherwise stated, the main body of Appendix D refers to all these other masksets with any differences being noted in this errata section. * Certain MC68HC05B16 masksets contain the same oscillator circuitry as the MC68HC05B6 (see Section 2.5.8.3). These are denoted by D20J, F62J and G28F. The MC68HC05B16 is a device similar to the MC68HC05B6, but with increased RAM, ROM and self-check ROM sizes. The entire MC68HC05B6 data sheet, including the electrical characteristics, applies to the MC68HC05B16, with the exceptions outlined in this appendix. D.1 Features * 15 kbytes User ROM * 352 bytes of RAM * 496 bytes self-check ROM * 52-pin PLCC, 56-pin SDIP and 64-pin QFP packages * High speed version available 14 MC68HC05B6 Rev. 4.1 MC68HC05B16 Freescale D-1 179 180 181 182 183 Table D-1 Mode of operation selection D.2 IRQ pin TCAP1 pin PD3 PD4 VSS to VDD VSS to VDD X X Mode 2VDD VDD 0 X Self check 2VDD VDD 1 0 Serial RAM loader 2VDD VDD 1 1 Jump to any address Single chip Self-check routines The self-check routines for the MC68HC05B16 are identical to those of the MC68HC05B4 with the following exception. The count byte on the MC68HC05B16 can be any value up to 256 ($00). The first 176 bytes are loaded into RAM I and the remainder is loaded into RAM II starting at $0250. 14 184 Freescale D-2 MC68HC05B16 MC68HC05B6 Rev. 4.1 Port A Port B Charge pump VPP1 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 Port C 256 bytes EEPROM PC0 PC1 PC2/ECLK PC3 PC4 PC5 PC6 PC7 496 bytes self-check ROM 15120 bytes ROM RESET IRQ COP watchdog OSC2 OSC1 Oscillator / 2 / /32 M68HC05 CPU VDD VSS 16-bit timer Port D PD0/AN0 PD1/AN1 PD2/AN2 PD3/AN3 PD4/AN4 PD5/AN5 PD6/AN6 PD7/AN7 VRH VRL 352 bytes static RAM 8-bit A/D converter TCMP1 TCMP2 TCAP1 TCAP2 SCI RDI SCLK TDO PLM PLMA D/A PLMB D/A Figure D-1 MC68HC05B16 block diagram 14 MC68HC05B6 Rev. 4.1 MC68HC05B16 Freescale D-3 D.3 External clock When using an external clock the OSC1 and OSC2 pins should be driven in antiphase, as shown in Figure D-2. The tOXOV or tILCH specifications (see Section 11.4) do not apply when using an external clock input. The equivalent specification of the external clock source should be used in lieu of tOXOV or tILCH. L C1 RS OSC1 OSC2 MCU C0 OSC1 OSC2 (b) Crystal equivalent circuit COSC2 COSC1 MCU (a) Crystal/ceramic resonator oscillator connections OSC1 OSC2 External clock NC (c) External clock source connections Crystal RS(max) C0 Ceramic resonator 2MHz 4MHz Unit 400 75 RS(typ) 2 - 4MHz 10 Unit 5 7 pF C0 40 pF 8 12 F C1 4.3 pF COSC1 15 - 40 15 - 30 pF COSC1 30 pF COSC2 15 - 30 15 - 25 pF COSC2 30 pF C1 RP 10 10 M RP 1 - 10 M Q 30 000 40 000 -- Q 1250 -- (d) Typical crystal and ceramic resonator parameters Figure D-2 Oscillator connections 14 Freescale D-4 MC68HC05B16 MC68HC05B6 Rev. 4.1 MC68HC05B16 Registers $0000 I/O (32 bytes) $0020 Page 0 User ROM (48 bytes) Port A data register $0000 Port B data register $0001 Port C data register $0002 Port D input data register $0003 Port A data direction register $0004 Port B data direction register $0005 Port C data direction register $0006 EEPROM/ECLK control register $0007 A/D data register $0008 A/D status/control register $0009 Pulse length modulation A $000A Pulse length modulation B $000B Miscellaneous register $000C SCI baud rate register $000D SCI control register 1 $000E SCI control register 2 $000F SCI status register $0010 $0011 $0200 SCI data register Timer control register $0012 $0250 Timer status register $0013 RAM11 (176 bytes) Capture high register 1 $0014 Capture low register 1 $0015 User ROM (15104 bytes) Compare high register 1 $0016 Compare low register 1 $0017 $3DFE Counter high register $0018 Counter low register $0019 $3E00 Alternate counter high register $001A Alternate counter low register $001B Capture high register 2 $001C Capture low register 2 $001D Compare high register 2 $001E Compare low register 2 $001F Options register $0100 $0050 $00C0 $0100 $0101 RAM1 (176 bytes) Stack Options register Unprotected (31 bytes) $0120 EEPROM (256 bytes) Protected (224 bytes) $0300 Self-check ROM (496 bytes) $3FF0 $3FF2-3 SCI Timer overflow $3FF4-5 $3FF6-7 Timer output compare 1& 2 $3FF8-9 Timer input capture 1 & 2 External IRQ $3FFA-B $3FFC-D SWI $3FFE-F Reset/power-on reset User vectors (14 bytes) Reserved Figure D-3 Memory map of the MC68HC05B16 14 MC68HC05B6 Rev. 4.1 MC68HC05B16 Freescale D-5 Table D-2 Register outline Register name Address bit 7 Port A data (PORTA) $0000 Port B data (PORTB) $0001 Port C data (PORTC) $0002 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Undefined Undefined PC2/ ECLK Port D data (PORTD) $0003 Port A data direction (DDRA) $0004 0000 0000 0000 0000 Port B data direction (DDRB) $0005 Port C data direction (DDRC) $0006 EEPROM/ECLK control $0007 A/D data (ADDATA) $0008 A/D status/control (ADSTAT) $0009 Pulse length modulation A (PLMA) $000A Pulse length modulation B (PLMB) $000B Miscellaneous PD7 PD6 PD5 PD4 PD3 PD2 Undefined PD1 PD0 Undefined 0000 0000 0 0 0 0 ECLK E1ERA E1LAT E1PGM 0000 0000 0 CH3 0000 0000 COCO ADRC ADON CH2 CH1 CH0 0000 0000 0000 0000 0000 0000 $000C POR(1) INTP INTN INTE SCT1 SCT0 SFA SFB SM WDOG(2) ?001 000? SCT0 SCR2 SCR1 SCR0 00uu uuuu SCI baud rate (BAUD) $000D SPC1 SPC0 SCI control 1 (SCCR1) $000E R8 T8 SCI control 2 (SCCR2) $000F TIE TCIE RIE ILIE TE RE RWU SCI status (SCSR) $0010 TDRE TC RDRF IDLE OR NF FE SCI data (SCDR) $0011 Timer control (TCR) $0012 ICIE OCIE TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0 ICF1 OCF1 TOF M WAKE CPOL CPHA LBCL Undefined SBK 0000 0000 1100 000u 0000 0000 ICF2 Undefined Timer status (TSR) $0013 Input capture high 1 $0014 OCF2 Input capture low 1 $0015 Undefined Output compare high 1 $0016 Undefined Output compare low 1 $0017 Undefined Timer counter high $0018 1111 1111 1111 1100 Undefined Timer counter low $0019 Alternate counter high $001A 1111 1111 Alternate counter low $001B 1111 1100 Input capture high 2 $001C Undefined Input capture low 2 $001D Undefined Output compare high 2 $001E Undefined Output compare low 2 $001F Options (OPTR)(3) $0100 Undefined EE1P SEC Not affected (1) This bit is set each time there is a power-on reset. (2) The state of the WDOG bit after reset is dependent upon the mask option selected; 1=watchdog enabled, 0=watchdog disabled. (3) This register is implemented in EEPROM; therefore reset has no effect on the individual bits. 14 Freescale D-6 MC68HC05B16 MC68HC05B6 Rev. 4.1 E MC68HC705B16 To ensure correct operation of the MC68HC705B16 after power-on, the device must be reset a second time after power-on. This can be done in software using the MC68HC705B16 watchdog. The following software sub-routine should be used: RESET2 BSET 0, $0C STOP Start watchdog STOP causes immediate watchdog system reset The interrupt vector at $3FF0 and $3FF1 must be initialised with the RESET2 address value. The MC68HC705B16 is a device similar to the MC68HC05B6, but with increased RAM and 15 kbytes of EPROM instead of 6 kbytes of ROM. In addition, the self-check routines available in the MC68HC05B6 are replaced by bootstrap firmware. The MC68HC705B16 is an OTPROM (one-time programmable ROM) version of the MC68HC05B16, meaning that once the application program has been loaded in the EPROM it can never be erased. The entire MC68HC05B6 data sheet applies to the MC68HC705B16, with the exceptions outlined in this appendix. 14 MC68HC05B6 Rev. 4.1 MC68HC705B16 Freescale E-1 185 186 187 188 189 E.1 Features 352 bytes of RAM * 576 bytes bootstrap ROM * Simultaneous programming of up to 8 bytes of EPROM * Optional pull-down resistors available on all port B and port C pins * 52-pin PLCC and 64-pin QFP packages * High speed version not available 256 bytes EEPROM VPP1 Charge pump VPP6 15168 bytes EPROM RESET IRQ PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2/ECLK PC3 PC4 PC5 PC6 PC7 576 bytes bootstrap ROM COP watchdog OSC2 OSC1 Oscillator / 2 / / 32 352 bytes static RAM M68HC05 CPU VDD VSS 16-bit timer Port D PD0/AN0 PD1/AN1 PD2/AN2 PD3/AN3 PD4/AN4 PD5/AN5 PD6/AN6 PD7/AN7 VRH VRL Port A * Port B 15 kbytes EPROM Port C * 8-bit A/D converter TCMP1 TCMP2 TCAP1 TCAP2 SCI RDI SCLK TDO PLM PLMA D/A PLMB D/A Figure E-1 MC68HC705B16 block diagram 14 Note: Freescale E-2 The electrical characteristics of the MC68HC05B6 as provided in Section 11 do not apply to the MC68HC705B16. Data specific to the MC68HC705B16 can be found in this appendix. MC68HC705B16 MC68HC05B6 Rev. 4.1 190 191 192 193 194 MC68HC705B16 Registers $0000 I/O (32 bytes) $0020 Page 0 User EPROM (48 bytes) $0100 $0101 $0006 E/EEPROM/ECLK control register $0007 A/D data register $0008 A/D status/control register $0009 Pulse length modulation A $000A Pulse length modulation B $000B Miscellaneous register $000C SCI baud rate register $000D SCI control register 1 $000E SCI control register 2 $000F SCI status register $0010 SCI data register $0011 Timer control register $0012 Timer status register $0013 RAM11 (176 bytes) Capture high register 1 $0014 Capture low register 1 $0015 User EPROM (15104 bytes) Compare high register 1 $0016 Compare low register 1 $0017 Counter high register $0018 Counter low register $0019 Alternate counter high register $001A Alternate counter low register $001B Capture high register 2 $001C Capture low register 2 $001D Compare high register 2 $001E Compare low register 2 $001F Options register $0100 Mask option register $3DFE EEPROM (256 bytes) Protected (224 bytes) $3DFE $3DFF $3E00 $0003 $0005 Unprotected (31 bytes) Bootstrap ROM1 (80 bytes) $0300 $0002 Port D input data register Port C data direction register Options register $0250 $0001 $0004 Stack $0200 Port B data register Port C data register Port A data direction register RAM1 (176 bytes) $0120 $0000 Port B data direction register $0050 $00C0 Port A data register Mask option register Bootstrap ROM11 (496 bytes) $3FF0-1 $3FF2-3 SCI Timer overflow $3FF4-5 $3FF6-7 Timer output compare 1& 2 $3FF8-9 Timer input capture 1 & 2 External IRQ $3FFA-B $3FFC-D SWI $3FFE-F Reset/power-on reset User vectors (14 bytes) Reserved Figure E-2 Memory map of the MC68HC705B16 14 MC68HC05B6 Rev. 4.1 MC68HC705B16 Freescale E-3 195 196 197 198 199 Table E-1 Register outline Register name Address bit 7 Port A data (PORTA) $0000 Port B data (PORTB) $0001 Port C data (PORTC) $0002 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Undefined Undefined PC2/ ECLK PD7 PD6 PD5 PD4 PD3 PD2 Undefined Port D data (PORTD) $0003 Port A data direction (DDRA) $0004 PD1 PD0 0000 0000 Undefined 0000 0000 Port B data direction (DDRB) $0005 Port C data direction (DDRC) $0006 0000 0000 EPROM/EEPROM/ECLK control $0007 E6LAT E6PGM ECLK E1ERA E1LAT E1PGM 0000 0000 A/D data (ADDATA) $0008 A/D status/control (ADSTAT) $0009 Pulse length modulation A (PLMA) $000A Pulse length modulation B (PLMB) $000B Miscellaneous 0000 0000 COCO ADRC ADON 0 CH3 CH2 CH1 CH0 0000 0000 0000 0000 0000 0000 $000C POR(1) INTP INTN INTE SCT1 SCT0 SFA SFB SM WDOG(2) ?001 000? SCT0 SCR2 SCR1 SCR0 00uu uuuu SCI baud rate (BAUD) $000D SPC1 SPC0 SCI control 1 (SCCR1) $000E R8 T8 SCI control 2 (SCCR2) $000F TIE TCIE RIE ILIE TE RE RWU SCI status (SCSR) $0010 TDRE TC RDRF IDLE OR NF FE SCI data (SCDR) $0011 Timer control (TCR) $0012 ICIE OCIE TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0 ICF1 OCF1 TOF M WAKE CPOL CPHA LBCL Undefined SBK 0000 0000 1100 000u 0000 0000 ICF2 Undefined Timer status (TSR) $0013 Input capture high 1 $0014 OCF2 Input capture low 1 $0015 Undefined Output compare high 1 $0016 Undefined Output compare low 1 $0017 Undefined Timer counter high $0018 1111 1111 1111 1100 Undefined Timer counter low $0019 Alternate counter high $001A 1111 1111 Alternate counter low $001B 1111 1100 Input capture high 2 $001C Undefined Input capture low 2 $001D Undefined Output compare high 2 $001E Undefined Output compare low 2 $001F Options (OPTR)(3) $0100 Mask option register (MOR)(4) $3DFE Undefined EE1P SEC Not affected RTIM RWAT WWAT PBPD PCPD Not affected (1) This bit is set each time there is a power-on reset. (2) The state of the WDOG bit after reset is dependent upon the mask option selected; 1=watchdog enabled, 0=watchdog disabled. (3) This register is implemented in EEPROM; therefore reset has no effect on the individual bits. 14 (4) This register is implemented in EPROM; therefore reset has no effect on the individual bits. Freescale E-4 MC68HC705B16 MC68HC05B6 Rev. 4.1 200 201 202 203 204 E.2 External clock When using an external clock the OSC1 and OSC2 pins should be driven in antiphase (see Figure D-2). The tOXOV or tILCH specifications (see Section E.8) do not apply when using an external clock input. The equivalent specification of the external clock source should be used in lieu of tOXOV or tILCH. E.3 EPROM The MC68HC705B16 memory map is given in Figure E-2. The device has a total of 15168 bytes of EPROM (including 14 bytes for User vectors) and 256 bytes of EEPROM. The EPROM array is supplied by the VPP6 pin in both read and program modes. Typically the user's software would be loaded into a programming board where VPP6 is controlled by one of the bootstrap loader routines. It would then be placed in an application where no programming occurs. In this case the VPP6 pin should be hardwired to VDD. Warning: A minimum VDD voltage must be applied to the VPP6 pin at all times, including power-on. Failure to do so could result in permanent damage to the device. Unless otherwise stated, EPROM programming is guaranteed at ambient (25C) temperature only. E.3.1 EPROM read operation The execution of a program in the EPROM address range or a load from the EPROM are both read operations. The E6LAT bit in the EPROM/EEPROM control register should be cleared to `0' which automatically resets the E6PGM bit. In this way the EPROM is read like a normal ROM. Reading the EPROM with the E6LAT bit set will give data that does not correspond to the actual memory content. As interrupt vectors are in EPROM, they will not be loaded when E6LAT is set. Similarly, the bootstrap ROM routines cannot be executed when E6LAT is set. In read mode, the VPP6 pin must be at the VDD level. When entering the STOP mode, the EPROM is automatically set to the read mode. Note: E.3.2 An erased byte reads as $00. EPROM program operation Typically the EPROM will be programmed by the bootstrap routines resident in the on-chip ROM. However, the user program can be used to program some EPROM locations if the proper procedure is followed. In particular, the programming sequence must be running in RAM, as the MC68HC05B6 Rev. 4.1 MC68HC705B16 Freescale E-5 14 205 206 207 208 209 EPROM will not be available for code execution while the E6LAT bit is set. The VPP6 switching must occur externally after the E6PGM bit is set, for example under control of a signal generated on a pin by the programming routine. Note: When the part becomes a PROM, only the cumulative programming of bits to logic `1' is possible if multiple programming is made on the same byte. To allow simultaneous programming of up to eight bytes, these bytes must be in the same group of addresses which share the same most significant address bits; only the three least significant bits can change. E.3.3 EPROM/EEPROM/ECLK control register Address EPROM/EEPROM/ECLK control bit 7 $0007 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset E6LAT E6PGM ECLK E1ERA E1LAT E1PGM 0000 0000 E6LAT -- EPROM programming latch enable bit 1 (set) - Address and up to eight data bytes can be latched into the EPROM for further programming providing the E6PGM bit is cleared. 0 (clear) - Data can be read from the EPROM or firmware ROM; the E6PGM bit is reset to zero when E6LAT is `0'. STOP, power-on and external reset clear the E6LAT bit. Note: After the tERA1 erase time or tPROG1 programming time, the E6LAT bit has to be reset to zero in order to clear the E6PGM bit. E6PGM -- EPROM program enable bit This bit is the EPROM program enable bit. It can be set to `1' to enable programming only after E6LAT is set and at least one byte is written to the EPROM. It is not possible to clear this bit using software but clearing E6LAT will always clear E6PGM. Table E-2 EPROM control bits description E6LAT E6PGM 14 Note: Freescale E-6 Description 0 0 Read/execute in EPROM 1 0 Ready to write address/data to EPROM 1 1 programming in progress The E6PGM bit can never be set while the E6LAT bit is at zero. MC68HC705B16 MC68HC05B6 Rev. 4.1 210 211 212 ECLK See Section 4.3. E1ERA -- EEPROM erase/programming bit Providing the E1LAT and E1PGM bits are at logic one, this bit indicates whether the access to the EEPROM is for erasing or programming purposes. 1 (set) - 0 (clear) - An erase operation will take place. A programming operation will take place. Once the program/erase EEPROM address has been selected, E1ERA cannot be changed. E1LAT -- EEPROM programming latch enable bit 1 (set) - 0 (clear) - Address and data can be latched into the EEPROM for further program or erase operations, providing the E1PGM bit is cleared. Data can be read from the EEPROM. The E1ERA bit and the E1PGM bit are reset to zero when E1LAT is `0'. STOP, power-on and external reset clear the E1LAT bit. Note: After the tERA1 erase time or tPROG1 programming time, the E1LAT bit has to be reset to zero in order to clear the E1ERA bit and the E1PGM bit. E1PGM -- EEPROM charge pump enable/disable 1 (set) - Internal charge pump generator switched on. 0 (clear) - Internal charge pump generator switched off. When the charge pump generator is on, the resulting high voltage is applied to the EEPROM array. This bit cannot be set before the data is selected, and once this bit has been set it can only be cleared by clearing the E1LAT bit. A summary of the effects of setting/clearing bits 0, 1 and 2 of the control register are given in Table E-3. Table E-3 EEPROM control bits description E1ERA Note: E1LAT E1PGM Description 0 0 0 Read condition 0 1 0 Ready to load address/data for program/erase 0 1 1 Byte programming in progress 1 1 0 Ready for byte erase (load address) 1 1 1 Byte erase in progress 14 The E1PGM and E1ERA bits are cleared when the E1LAT bit is at zero. MC68HC05B6 Rev. 4.1 MC68HC705B16 Freescale E-7 E.3.4 Mask option register Address Mask option register (MOR)(1) bit 7 $3DFE bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset RTIM RWAT WWAT PBPD PCPD Not affected (1) This register is implemented in EPROM; therefore reset has no effect on the individual bits. RTIM -- Reset time This bit can modify the time tPORL, where the RESET pin is kept low after a power-on reset. 1 (set) - 0 (clear) - tPORL = 16 cycles. tPORL = 4064 cycles. RWAT -- Watchdog after reset This bit can modify the status of the watchdog counter after reset. Usually, the watchdog system is disabled after power-on or external reset but when this bit is set, it will be active immediately after the following resets (except in bootstrap mode). WWAT -- Watchdog during WAIT mode This bit can modify the status of the watchdog counter in WAIT mode. Normally, the watchdog system is disabled in WAIT mode but when this bit is set, the watchdog will be active in WAIT mode. PBPD -- Port B pull-down This bit, when programmed, connects a resistive pull-down on each pin of port B. This pull-down, RPD, is active on a given pin only while it is an input. PCPD -- Port C pull-down This bit, when programmed, connects a resistive pull-down on each pin of port C. This pull-down, RPD, is active on a given pin only while it is an input. 14 Freescale E-8 MC68HC705B16 MC68HC05B6 Rev. 4.1 E.3.5 EEPROM options register (OPTR) Address Options (OPTR)(1) bit 7 bit 6 bit 5 bit 4 $0100 bit 3 bit 2 State on reset bit 1 bit 0 EE1P SEC Not affected (1) This register is implemented in EEPROM; therefore reset has no effect on the individual bits. EE1P - EEPROM protect bit In order to achieve a higher degree of protection, the EEPROM is effectively split into two parts, both working from the VPP1 charge pump. Part 1 of the EEPROM array (32 bytes from $0100 to $011F) cannot be protected; part 2 (224 bytes from $0120 to $01FF) is protected by the EE1P bit in the options register. 1 (set) - 0 (clear) - Part 2 of the EEPROM array is not protected; all 256 bytes of EEPROM can be accessed for any read, erase or programming operations. Part 2 of the EEPROM array is protected; any attempt to erase or program a location will be unsuccessful. When this bit is set to 1 (erased), the protection will remain until the next power-on or external reset. EE1P can only be written to `0' when the E1LAT bit in the EEPROM control register is set. Note: The EEPROM1 protect function is disabled while in bootstrap mode. SEC -- Secure bit This bit allows the EPROM and EEPROM1 to be secured from external access. When this bit is in the erased state (set), the EPROM and EEPROM1 content is not secured and the device may be used in non user mode. When the SEC bit is programmed to `zero', the EPROM and EEPROM1 content is secured by prohibiting entry to the non user mode. To deactivate the secure bit, the EPROM has to be erased by exposure to a high density ultraviolet light, and the device has to be entered into the EPROM erase verification mode with PD1 set. When the SEC bit is changed, its new value will have no effect until the next power-on or external reset. 1 (set) - 0 (clear) - EEPROM/EPROM not protected. EEPROM/EPROM protected. 14 MC68HC05B6 Rev. 4.1 MC68HC705B16 Freescale E-9 E.4 Bootstrap mode The 432 bytes of self-check firmware on the MC68HC05B6 are replaced by 576 bytes of bootstrap firmware. A detailed description of the modes of operation within bootstrap mode is given below. The bootstrap program in mask ROM address locations $0200 to $024F and $3E00 to $3FEF can be used to program the EPROM and the EEPROM, to check if the EPROM is erased or to load and execute data in RAM. After reset, while going to the bootstrap mode, the vector located at address $3FEE and $3FEF (RESET) is fetched to start execution of the bootstrap program. To place the part in bootstrap mode, the IRQ pin should be at + 9V with the TCAP1 pin `high' during transition of the RESET pin from low to high. The hold time on the IRQ and TCAP1 pins is two clock cycles after the external RESET pin is brought high. When the MC68HC705B16 is placed in the bootstrap mode, the bootstrap reset vector is fetched and the bootstrap firmware starts to execute. Table E-4 shows the conditions required to enter each level of bootstrap mode on the rising edge of RESET. Table E-4 Mode of operation selection IRQ pin TCAP1 pin PD1 PD2 PD3 PD4 Mode VSS to VDD VSS to VDD x x x x Single chip + 9 Volts VDD 0 0 x 0 Erased EPROM verification (EEV) + 9 Volts VDD 1 0 0 0 Erased EPROM verification; erase EEPROM; EPROM/EEPROM parallel program/verify + 9 Volts VDD 1 0 1 0 Erased EPROM verification; erase EEPROM; EPROM/EEPROM/ RAM serial bootstrap load and execute + 9 Volts VDD x x 0 1 RAM parallel bootstrap load and execute (if SEC bit = 1) + 9 Volts VDD x x 1 1 Serial EPROM/EEPROM/RAM bootloader (if SEC = 1) x = Don't care The bootstrap program first copies part of itself in RAM (except `RAM parallel load'), as the program cannot be executed in ROM during verification/programming of the EPROM. It then sets the TCMP1 output to a logic high level. 14 Freescale E-10 MC68HC705B16 MC68HC05B6 Rev. 4.1 Reset IRQ at 9V? N User mode Y Y TCAP1 set? N SEC bit active? N Non-user mode Y Bootstrap mode Erased EPROM verification A Y PD4 set? N PD2 set? N Y Non-user mode EPROM erased? Y N N Red LED on EPROM not erased B Y Green LED on PD1 set? Y PD3 set? N Bulk erase EEPROM1 Parallel E/EEPROM bootstrap Program EPROM; parallel load; green LED flashes Red LED on N Programming OK? Y EEPROM1 erased? Y N Red LED on Bad EPROM programming Green LED on Red LED off EPROM verified 14 Figure E-3 Modes of operation flow chart (1 of 2) MC68HC05B6 Rev. 4.1 MC68HC705B16 Freescale E-11 Red LED flashes Y SEC bit set? A N N PD3 set? Parallel bootstrap RAM Serial E/EEPROM (RAM) bootstrap Y N PD4 set? B Y N Load next RAM byte Transmit last four programmed locations RAM1 full? Receive address Y Execute RAM program at $0050 Receive four data Y Negative address? N Green LED on Program E/EEPROM data at address; green LED flashes Execute RAM program at $008B Figure E-4 Modes of operation flow chart (2 of 2) 14 Freescale E-12 MC68HC705B16 MC68HC05B6 Rev. 4.1 E.4.1 Erased EPROM verification If a non $00 byte is detected, the red LED is turned on and the routine stops (see Figure E-3 and Figure E-4). Only when the entire EPROM content is verified as erased does the green LED switch on. PD1 is then checked. If PD1=0, the bootstrap program stops here and no programming occurs until such time as a high level is sensed on PD1. If PD1=1, the bootstrap program proceeds to erase the EEPROM1 for a nominal 100 ms (4.0 MHz crystal). It is then checked for complete erasure; if a non $FF byte is detected, the red LED is turned on, and erase is performed a second time, and so on until total erasure is verified. At this point, both EPROM and EEPROM1 are completely erased and the security bit is cleared. The programming operation can then be performed. A schematic diagram of the circuit required for erased EPROM verification is shown in Figure E-7. E.4.2 EPROM/EEPROM parallel bootstrap Before the parallel bootstrap routines begin, the erased EPROM verification program is executed as described in Section E.4.1. When PD2=0, the programming time is set to 5 milliseconds with the bootstrap program and verify for the EPROM taking approximately 15 seconds. The EPROM is loaded in increasing address order with non EPROM segments being skipped by the loader. Simultaneous programming is performed by reading eight bytes of data before actual programming is performed, thus the loading time of the internal EPROM is divided by eight. Parallel data is entered through Port A, while the 14-bit address is output on port B, PC0 to PC4 and TCMP2. If the data comes from an external EPROM, the handshake can be disabled by connecting together PC5 and PC6. If the data is supplied by a parallel interface, handshaking will be provided by PC5 and PC6 according to the timing diagram of Figure E-5 (see also Figure E-6). During programming, the green LED will flash at about 3 Hz. Upon completion of the programming operation, the contents of the EPROM and EEPROM1 are checked against the external data source. If programming is verified the green LED stays on, while an error will cause the red LED to be turned on. Figure E-7 is a schematic diagram of a circuit that can be used to program the EPROM or to load and execute data in the RAM. Note: The entire EPROM and EEPROM1 can be loaded from the external source; if it is desired to leave a segment undisturbed, the data for this segment should be all zeros for EPROM data and all $FFs for EEPROM1 data. 14 MC68HC05B6 Rev. 4.1 MC68HC705B16 Freescale E-13 Address HDSK out (PC5) Data HDSK in (PC6) F29 Data read Data read Figure E-5 Timing diagram with handshake tCOOE tCOOE tCOOE tCDDE Address tADE tDHE tADE tDHE tADE tDHE tADE tDHE Data tADE max (address to data delay) 5 machine cycles tDHA min (data hold time) 14 machine cycles tCOOE (load cycle time) 117 machine cycles < tCOOE < 150 machine cycles tCDDE (programming cycle time) tCOOE + tPROG (5ms nominal for EPROM; 10ms for EEPROM1)) 1 machine cycle = 1/(2f0(Xtal)) Figure E-6 Parallel EPROM loader timing diagram 14 Freescale E-14 MC68HC705B16 MC68HC05B6 Rev. 4.1 P1 RESET RUN 1N914 + 100F 1k 1N914 1.0F + red LED 470 0.01F 470 TCAP1 VRH VDD IRQ OSC1 RESET OSC2 NC TCMP1 VPP1 PLMA PLMB RDI VRL TCAP2 PD7 PD6 PD5 PD3 PD2 PD1 PD0 Boot green LED red LED -- programming failed green LED -- programming OK Erase check green LED -- EPROM erased red LED -- EPROM not erased 47F 22pF Erase check & boot EPROM erase check RAM 27 EPROM 28 A13 A0 A1 A2 A3 A4 20 CE A5 A6 27C128 A7 25 24 21 23 2 D0 D1 D2 D3 D4 D5 D6 D7 A8 A9 A10 A11 A12 GND 14 Note: 1N5819 PD4 SCLK TDO VPP PGM VCC OE 26 10 9 8 7 6 5 4 3 11 12 13 15 16 17 18 19 10k TCMP2 + 4.0 MHz 22pF MC68HC705B16 MCU +5V 1 GND +5V VPP 1 k BC309C 100k 1 2 3 VPP6 12 k PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 4k7 PC7 BC239C 1nF + 4k7 +5V 100 k PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 HDSK out PC5 PC6 VSS PC4 PC3 PC2 PC1 PC0 Short circuit if handshake not used A12 A11 A10 A9 A8 HDSK in 22 This circuit is recommended for programming only at 25C and not for use in the end application, or at temperatures other than 25C. If used in the end application, VPP6 should be tied to VDD to avoid damaging the device. 14 Figure E-7 EPROM Parallel bootstrap schematic diagram MC68HC05B6 Rev. 4.1 MC68HC705B16 Freescale E-15 E.4.3 EEPROM/EPROM/RAM serial bootstrap For erased EPROM verification, PD4 must be at `0'. In this case, erased EPROM verification executes as described in Section E.4.1 before control is given to the serial routine. If PD4 is at `1', the program initially checks the state of the security bit. If the security bit is active (`0'), the program will not enter serial bootstrap and the red LED will flash. Otherwise the serial bootstrap program will be executed according to Figure E-3 and Figure E-4. The serial routine communicates through the SCI with an external host, typically a PC, by means of an RS232 link at 9600 baud, 8-bit, no parity and full duplex. Refer to Figure E-8 for a schematic diagram of a suitable circuit. Note: Data format is not ASCII, but 8-bit binary, so a complementary program must be run by the host to supply the required format. Such a program is available for the IBM PC from Freescale. The EPROM bootstrap routines are used to customise the OTP EPROM. To increase the speed of programming the 15 kbytes, four bytes are programmed while the data is simultaneously transmitted back and forward in full duplex. This implies that while 4 bytes are being programmed the next 4 bytes are received and the preceding 4 bytes are echoed. The format accepted by the serial loader is as follows: 1) EPROM locations [address n high] [address n low] [data(n)] [data (n+1)] [data (n+2)] [data (n+3)] Address n must have the two least significant bits at zero so that n, n+1, n+2 and n+3 have identical most significant bits. These blocks of four bytes do not need to be contiguous, as a new address is transmitted for each new group. 2) EEPROM1 locations [address n high] [address n low] [data(n)] [dummy data 1] [dummy data 2] [dummy data 3] The same four byte protocol of data exchange is used, but only the first data value is programmed at address n. The three following dummy data values must be sent to be in agreement with the protocol, but are not significant. The protocol is as follows: 1) The MC68HC705B16 sends the last two bytes programmed to the host as a prompt; this also allows the host to verify that programming has been carried out correctly. 2) In response to the first byte prompt, the host sends the first address byte. 14 3) After receiving the first address byte, the MC68HC705B16 sends the next byte programmed. Freescale E-16 MC68HC705B16 MC68HC05B6 Rev. 4.1 P1 RESET 100k RUN 10nF 1k 1N914 1.0F + 1N914 22 8 1 2 3 GND +5V VPP + 47F 10 TCAP1 VRH VDD 19 IRQ 18 RESET OSC1 20 OSC2 47F + Red LED 470 0.01F 470 21 Green LED PLMA 4.0 MHz 22pF 22pF PLMB U2 MC68HC705B16 MCU (socket) PD3 Erase check Green LED -- EPROM erased Red LED -- EPROM not erased Serial boot Serial boot Flashing green LED -- programming Green LED -- programming ended 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 Erase check and serial boot EPROM erase check 9600 BD 8-bit no parity 22F + RS232 connector 8 5 7 3 2 1 2 x 3K +5V 16 2 22F + 6 MAX 232 13 14 1 3 4 5 12 11 + 22F + 22F 14 13 12 5 4 3 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 VPP6 12 k 4k7 PC7 PD0 PD1 PD2 PD5 PD6 PD7 50 RDI 52 TDO VSS 41 BC239C 1nF + 4k7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 15 Note: 10k 1 k BC309C Erase check & serial boot 1N5819 PD4 PC6 PC5 PC4 PC3 PC2 PC1 PC0 43 44 45 46 47 48 49 VPP1 23 TCAP2 2 TCMP1 1 TCMP2 51 SCLK 40 NC VRL 7 A minimum VDD voltage must be applied to the VPP6 pin at all times, including power-on, as a lower voltage could damage the device. Unless otherwise stated, EPROM programming is guaranteed at ambient (25C) temperature only 14 Figure E-8 RAM/EPROM/EEPROM serial bootstrap schematic diagram MC68HC05B6 Rev. 4.1 MC68HC705B16 Freescale E-17 4) The exchange of data continues until the MC68HC705B16 has sent the four data bytes and the host has sent the 2 address data bytes and 4 data bytes. 5) If the data is different from $00 for EPROM or $FF for EEPROM, it is programmed at the address provided, while the next address and bytes are received and the previous data is echoed. 6) Loop to 1. After reset, the MC68HC705B16 serial bootstrap routine will first echo two blocks of four bytes at $00, as no data is programmed yet. If the data received is $00 for EPROM locations or $FF for EEPROM locations, no programming in the EPROM and EEPROM1 takes place, and the contents of the accessed location are returned as a prompt. The entire EPROM/EEPROM memory can be read in this fashion (serial dump). Warning: When using this function with a programmed device, the device must be placed into RAM/EPROM/EEPROM serial bootstrap mode without EPROM erase check (PD4 = 1). Serial RAM loading and execute can be accomplished in this mode. A RAM byte will be written if the address sent by the host in the serial protocol points to the RAM. RAM bytes $008B-$00E3 and $0250-$02ED are available for user test programs. A 10-byte stack resides at the top of RAMI, allowing, for example, one interrupt and two sub-routine levels. The RAM addresses between $0050 and $008A are used by the loader and are therefore not available to the user during serial loading/executing. If the SEC bit is at `1', program execution is triggered by sending a negative (bit 7 set) high address; execution starts at address XADR ($008B). In the RAM bootloader mode, all interrupt vectors are mapped to pseudo-vectors in RAM (see Table E-5). This allows programmers to use their own service-routine addresses. Each pseudo-vector is allowed three bytes of space rather than the two bytes for normal vectors, because an explicit jump (JMP) opcode is needed to cause the desired jump to the user's service routine address. Table E-5 Bootstrap vector targets in RAM Vector targets in RAM SCI interrupt 14 Freescale E-18 $02EE Timer overflow $02F1 Timer output compare $02F4 Timer input capture $02F7 IRQ $02FA SWI $02FD MC68HC705B16 MC68HC05B6 Rev. 4.1 E.4.4 RAM parallel bootstrap The program first checks the state of the security bit. If the SEC bit is active, i.e. `0', the program will not enter the RAM bootstrap mode and the red LED will flash. Otherwise the RAM bootstrap program will start loading the RAM with external data (e.g. from a 2564 or 2764 EPROM). Before loading a new byte the state of the PD4/AN4 pin is checked. If this pin goes to level `0', or if the RAM is full, then control is given to the loaded program at address $0050. See Figure E-3 and Figure E-4. If the data is supplied by a parallel interface, handshaking will be provided by PC5 and PC6 according to Figure E-9. If the data comes from an external EPROM, the handshake can be disabled by connecting together PC5 and PC6. Figure E-10 provides a schematic diagram of a circuit that can be used to load the RAM with short test programs. Up to 8 programs can be loaded in turn from the EPROM. Selection is accomplished by means of the switches connected to the EPROM higher address lines (A8 through A10). If the user program sets PC0 to level `1', this will disable the external EPROM, thus rendering both port A output and port B input available. The EPROM parallel bootstrap loader schematic can also be used (Figure E-7), provided VPP is at VDD level. The high order address lines will be at zero. The LEDs will stay off. tCR Address PC5 out tHO tADR tDHR Data tHI max PC6 in PD4 tEXR max tADR max (address to data delay; PC6=PC5) 16 machine cycles tDHR min (data hold time) 4 machine cycles tCR (load cycle time; PC6=PC5) 49 machine cycles tHO (PC5 handshake out delay) 5 machine cycles tHI max (PC6 handshake in, data hold time) 10 machine cycles tEXR max (max delay for transition to be recognised during this cycle; PC6=PC5 30 machine cycles 1 machine cycle = 1/(2f0(Xtal)) 14 Figure E-9 Parallel RAM loader timing diagram MC68HC05B6 Rev. 4.1 MC68HC705B16 Freescale E-19 E.4.4.1 Jump to start of RAM ($0050) PD4 must be high during the first 49 program cycles and pulled low before the 68th cycle for immediate jump execution at address $0050. P1 RESET 100k RUN 100F 1N914 + 1 GND +5V 2 1k 1N914 1.0F + TCAP1 VDD IRQ OSC1 RESET OSC2 0.01F 4.0 MHz 22pF 22pF PD4 VPP6 U2 MC68HC705B16 MCU (socket) +5V 1 26 27 16 x 100k 28 VPP NC PGM VCC 20 CE 23 A11 2 A12 U1 2764 +5V 3 x 4.7k 25 24 21 A8 A9 A0 A1 A2 A3 A4 A5 A6 A7 D0 D1 D2 D3 D4 D5 D6 D7 10 9 8 7 6 5 4 3 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB6 PB7 11 12 13 15 16 17 18 19 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 A10 GND 14 OE +5V 18 x 100 k VPP1 NC TCAP2 TCMP2 TCMP1 PLMB PLMA SCLK TDO RDI VRH VRL PD7 PD6 PD5 PD3 PD2 PD1 PD0 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0 VSS 22 Figure E-10 RAM parallel bootstrap schematic diagram 14 Freescale E-20 MC68HC705B16 MC68HC05B6 Rev. 4.1 E.5 Absolute maximum ratings Table E-6 Absolute maximum ratings Symbol Value Supply voltage(1) Rating VDD - 0.5 to +7.0 V Input voltage (Except VPP1 and VPP6) VIN VSS - 0.5 to VDD + 0.5 V Input voltage - Self-check mode (IRQ pin only) VIN VSS - 0.5 to 2VDD + 0.5 V TA TL to TH 0 to +70 -40 to +85 -40 to +105 -40 to +125 C TSTG - 65 to +150 C ID IS 25 45 mA mA Operating temperature range - Standard (MC68HC705B16) - Extended (MC68HC705B16C) - Industrial (MC68HC705B16V) - Automotive (MC68HC705B16M) Storage temperature range Current drain per pin (excluding VDD and VSS)(2) - Source - Sink Unit (1) All voltages are with respect to VSS. (2) Maximum current drain per pin is for one pin at a time, limited by an external resistor. Note: This device contains circuitry designed to protect against damage due to high electrostatic voltages or electric fields. However, it is recommended that normal precautions be taken to avoid the application of any voltages higher than those given in the maximum ratings table to this high impedance circuit. For maximum reliability all unused inputs should be tied to either VSS or VDD. 14 MC68HC05B6 Rev. 4.1 MC68HC705B16 Freescale E-21 E.6 DC electrical characteristics Table E-7 DC electrical characteristics for 5V operation (VDD = 5 Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Symbol Characteristic(1) Output voltage ILOAD = - 10 A VOH ILOAD = +10 A VOL Output high voltage (ILOAD = 0.8mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2 VOH Output high voltage (ILOAD = 1.6mA) VOH TDO, SCLK, PLMA, PLMB Output low voltage (ILOAD = 1.6mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2, VOL TDO, SCLK, PLMA, PLMB Output low voltage (ILOAD = 1.6mA) VOL RESET Input high voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, VIH IRQ, RESET, TCAP1, TCAP2, RDI Input low voltage VIL PA0-7, PB0-7, PC0-7, PD0-7, OSC1, IRQ, RESET, TCAP1, TCAP2, RDI Supply current(3) RUN (SM = 0) (See Figure 11-1) IDD IDD RUN (SM = 1) (See Figure 11-2) IDD WAIT (SM = 0) (See Figure 11-3) IDD WAIT (SM = 1) (See Figure 11-4) STOP IDD 0 to 70 (standard) IDD - 40 to 85 (extended) IDD - 40 to 105 (industrial) IDD - 40 to 125 (automotive) High-Z leakage current IIL PA0-7, PB0-7, PC0-7, TDO, RESET, SCLK Input current Port B and port C pull-down (VIN =VIH) IRPD Input current (0 to 70) IIN IRQ, OSC1, TCAP1, TCAP2, RDI, PD0/AN0-PD7/AN7 (channel not selected) Input current (- 40 to 125) IIN IRQ, OSC1, TCAP1, TCAP2, RDI, PD0/AN0-PD7/AN7 (channel not selected) Capacitance Ports (as input or output), RESET, TDO, SCLK COUT CIN IRQ, TCAP1, TCAP2, OSC1, RDI CIN PD0/AN0-PD7/AN7 (A/D off) CIN PD0/AN0-PD7/AN7 (A/D on) 14 Min Typ(2) Max Unit VDD - 0.1 -- -- -- -- 0.1 V VDD - 0.8 VDD - 0.4 -- VDD - 0.8 VDD - 0.4 -- -- 0.1 0.4 0.4 1 0.7VDD -- VDD V VSS -- 0.2VDD V -- -- -- -- 5.0 1.0 1.5 0.9 6 1.5 2 1 mA mA mA mA -- -- -- -- 2 -- -- -- 10 20 60 60 A A A A -- 0.2 1 A V V A 80 -- 0.2 1 A -- -- 5 A -- -- -- -- -- -- 12 22 12 8 -- -- pF pF pF pF (1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching currents inherent in CMOS designs (see Section 2). (2) Typical values are at mid point of voltage range and at 25C only. (3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 4.2MHz); all inputs 0.2 V from rail; no DC loads; maximum load on outputs 50pF (20pF on OSC2). STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD - 0.2 V: STOP IDD measured with OSC1 = VDD. WAIT IDD is affected linearly by the OSC2 capacitance. Freescale E-22 MC68HC705B16 MC68HC05B6 Rev. 4.1 Table E-8 DC electrical characteristics for 3.3V operation (VDD = 3.3Vdc 10%, VSS = 0Vdc, TA = TL to TH) Characteristic(1) Symbol Output voltage ILOAD = - 10 A VOH ILOAD = +10 A VOL Output high voltage (ILOAD = 0.8mA) VOH PA0-7, PB0-7, PC0-7, TCMP1, TCMP2 Output high voltage (ILOAD = 1.6mA) TDO, SCLK, PLMA, PLMB VOH Output low voltage (ILOAD = 1.6mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2, VOL TDO, SCLK, PLMA, PLMB Output low voltage (ILOAD = 1.6mA) VOL RESET Input high voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, VIH IRQ, RESET, TCAP1, TCAP2, RDI Input low voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, IRQ, VIL RESET, TCAP1, TCAP2, RDI Supply current(3) IDD RUN (SM = 0) (See Figure 11-1) RUN (SM = 1) (See Figure 11-2) IDD WAIT (SM = 0) (See Figure 11-3) IDD WAIT (SM = 1) (See Figure 11-4) IDD STOP 0 to 70 (standard) IDD - 40 to 85 (extended) IDD - 40 to 105 (industrial) IDD - 40 to 125 (automotive) IDD High-Z leakage current PA0-7, PB0-7, PC0-7, TDO, RESET, SCLK IIL Input current Port B and port C pull-down (VIN =VIH) IRPD Input current (0 to 70) IRQ, OSC1, TCAP1, TCAP2, RDI, IIN PD0/AN0-PD7/AN7 (channel not selected) Input current (- 40 to 125) IIN IRQ, OSC1, TCAP1, TCAP2, RDI, PD0/AN0-PD7/AN7 (channel not selected) Capacitance Ports (as input or output), RESET, TDO, COUT SCLK CIN IRQ, TCAP1, TCAP2, OSC1, RDI CIN PD0/AN0-PD7/AN7 (A/D off) CIN PD0/AN0-PD7/AN7 (A/D on) Min Typ(2) Max Unit VDD - 0.1 -- -- -- -- 0.1 V VDD - 0.3 VDD - 0.1 -- VDD - 0.3 VDD - 0.1 -- -- 0.1 0.4 0.2 0.6 0.7VDD -- VDD V VSS -- 0.2VDD V -- -- -- -- 2.0 0.8 1.0 0.4 3 1 1.5 0.5 mA mA mA mA -- -- -- -- 1 -- -- -- 10 10 40 40 A A A A -- 0.2 1 V V A A 80 -- 0.2 1 A -- -- 5 A -- -- -- -- -- -- 12 22 12 8 -- -- pF pF pF pF (1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching currents inherent in CMOS designs (see Section 2). (2) Typical values are at mid point of voltage range and at 25C only. 14 MC68HC05B6 Rev. 4.1 MC68HC705B16 Freescale E-23 (3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 2.0MHz); all inputs 0.2 V from rail; no DC loads; maximum load on outputs 50pF (20pF on OSC2). STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD - 0.2 V: STOP IDD measured with OSC1 = VDD. WAIT IDD is affected linearly by the OSC2 capacitance. 14 Freescale E-24 MC68HC705B16 MC68HC05B6 Rev. 4.1 E.7 A/D converter characteristics Table E-9 A/D characteristics for 5V operation (VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Min Max Unit Resolution Characteristic Number of bits resolved by the A/D Parameter 8 -- Bit Non-linearity Max deviation from the best straight line through the A/D transfer characteristics (VRH = VDD and VRL = 0V) -- 0.5 LSB Quantization error Uncertainty due to converter resolution -- 0.5 LSB Absolute accuracy Difference between the actual input voltage and the full-scale equivalent of the binary code output code for all errors -- 1 LSB Conversion range Analog input voltage range VRL VRH V VRH Maximum analog reference voltage VRL VDD + 0.1 V Minimum analog reference voltage VSS - 0.1 VRH V VR(1) Minimum difference between VRH and VRL 3 -- V Conversion time Total time to perform a single analog to digital conversion a. External clock (OSC1, OSC2) b. Internal RC oscillator -- -- 32 32 tCYC s VRL Monotonicity Conversion result never decreases with an increase in input voltage and has no missing codes GUARANTEED Zero input reading Conversion result when VIN = VRL 00 -- Hex Full scale reading Conversion result when VIN = VRH -- FF Hex Sample acquisition time Analog input acquisition sampling a. External clock (OSC1, OSC2) b. Internal RC oscillator(2) -- -- 12 12 tCYC s Sample/hold capacitance Input capacitance on PD0/AN0-PD7/AN7 -- 12 pF Input leakage(3) -- 1 A Input leakage on A/D pins PD0/AN0-PD7/AN7, VRL, VRH (1) Performance verified down to 2.5V VR, but accuracy is tested and guaranteed at VR = 5V10%. (2) Source impedances greater than 10k will adversely affect internal charging time during input sampling. (3) The external system error caused by input leakage current is approximately equal to the product of R source and input current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2). 14 MC68HC05B6 Rev. 4.1 MC68HC705B16 Freescale E-25 Table E-10 A/D characteristics for 3.3V operation (VDD = 3.3 Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Min Max Unit Resolution Characteristic Number of bits resolved by the A/D Parameter 8 -- Bit Non-linearity Max deviation from the best straight line through the A/D transfer characteristics (VRH = VDD and VRL = 0V) -- 1 LSB Quantization error Uncertainty due to converter resolution -- 1 LSB Absolute accuracy Difference between the actual input voltage and the full-scale equivalent of the binary code output code for all errors -- 2 LSB Conversion range Analog input voltage range VRL VRH V VRH Maximum analog reference voltage VRL VDD + 0.1 V VRL Minimum analog reference voltage VSS - 0.1 VRH V VR Minimum difference between VRH and VRL 3 -- V Conversion time Total time to perform a single analog to digital conversion Internal RC oscillator -- 32 s Monotonicity Conversion result never decreases with an increase in input voltage and has no missing codes Zero input reading Conversion result when VIN = VRL 00 -- Hex Full scale reading Conversion result when VIN = VRH -- FF Hex Sample acquisition time Analog input acquisition sampling Internal RC oscillator(1) -- 12 s Sample/hold capacitance Input capacitance on PD0/AN0-PD7/AN7 -- 12 pF Input leakage(2) -- 1 A Input leakage on A/D pins PD0/AN0-PD7/AN7, VRL, VRH GUARANTEED (1) Source impedances greater than 10k will adversely affect internal charging time during input sampling. (2) The external system error caused by input leakage current is approximately equal to the product of R source and input current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2). 14 Freescale E-26 MC68HC705B16 MC68HC05B6 Rev. 4.1 E.8 Control timing Table E-11 Control timing for 5V operation (VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Characteristic Symbol Frequency of operation Crystal option fOSC External clock option fOSC Internal operating frequency (fOSC/2) Using crystal fOP Using external clock fOP Cycle time (see Figure 9-1) tCYC Crystal oscillator start-up time (see Figure 9-1) tOXOV Stop recovery start-up time (crystal oscillator) tILCH RC oscillator stabilization time tADRC A/D converter stabilization time tADON External RESET input pulse width tRL Power-on RESET output pulse width 4064 cycle tPORL 16 cycle tPORL Watchdog RESET output pulse width tDOGL Watchdog time-out tDOG EEPROM byte erase time tERA 0 to 70 (standard) - 40 to 85 (extended) tERA - 40 to 105 (industrial) tERA - 40 to 125 (automotive) tERA EEPROM byte program time(1) tPROG 0 to 70 (standard) - 40 to 85 (extended) tPROG - 40 to 105 (industrial) tPROG - 40 to 125 (automotive) tPROG Timer (see Figure E-11) Resolution(2) tRESL Input capture pulse width tTH, tTL Input capture pulse period tTLTL Interrupt pulse width (edge-triggered) tILIH Interrupt pulse period tILIL OSC1 pulse width(5) tOH, tOL Write/Erase endurance(6)(7) -- -- Data retention(6)(7) Min Max Unit -- dc 4.2 4.2 MHz MHz dc dc 480 -- 1.5 2.1 2.1 -- 100 100 5 500 -- MHz MHz ns ms ms s s tCYC 4064 16 1.5 6144 -- -- -- 7168 tCYC tCYC 10 10 10 10 -- -- -- -- ms ms ms ms 10 10 15 20 -- -- -- -- ms ms ms ms -- -- -- -- -- -- tCYC ns tCYC ns tCYC ns cycles years 4 125 --(3) 125 --(4) 90 10000 10 tCYC tCYC (1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when programming the EEPROM. (2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting factor in determining the timer resolution. (3) The minimum period tTLTL should not be less than the number of cycle times it takes to execute the capture interrupt service routine plus 24 tCYC. (4) The minimum period tILIL should not be less than the number of cycle times it takes to execute the interrupt service routine plus 21 tCYC. (5) tOH and tOL should not total less than 238ns. (6) At a temperature of 85C (7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information. MC68HC05B6 Rev. 4.1 MC68HC705B16 14 Freescale E-27 Table E-12 Control timing for 3.3V operation (VDD = 3.3Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Symbol Min Max Unit Frequency of operation Crystal option External clock option Characteristic fOSC fOSC -- dc 2.0 2.0 MHz MHz Internal operating frequency (fOSC/2) Using crystal Using external clock fOP fOP -- dc 1.0 1.0 MHz MHz Cycle time (see Figure 9-1) tCYC 1000 -- ns Crystal oscillator start-up time (see Figure 9-1) tOXOV -- 100 ms ms Stop recovery start-up time (crystal oscillator) tILCH 100 RC oscillator stabilization time tADRC 5 s A/D converter stabilization time tADON 500 s External RESET input pulse width tRL 1.5 -- tCYC Power-on RESET output pulse width 4064 cycle 16 cycle tPORL tPORL 4064 16 -- -- tCYC tCYC Watchdog RESET output pulse width tDOGL 1.5 -- tCYC Watchdog time-out tDOG 6144 7168 tCYC EEPROM byte erase time 0 to 70 (standard) - 40 to 85 (extended) - 40 to 105 (industrial) - 40 to 125 (automotive) 30 30 30 30 -- -- -- -- ms ms ms ms EEPROM byte program time(1) 0 to 70 (standard) - 40 to 85 (extended) - 40 to 105 (industrial) - 40 to 125 (automotive) tERA tERA tERA tERA tPROG tPROG tPROG tPROG 30 30 30 30 -- -- -- -- ms ms ms ms Timer (see Figure E-11) Resolution(2) Input capture pulse width Input capture pulse period tRESL tTH, tTL tTLTL 4 250 --(3) -- -- -- tCYC ns tCYC Interrupt pulse width (edge-triggered) tILIH 250 -- ns Interrupt pulse period tILIL --(4) -- tCYC tOH, tOL 200 -- OSC1 pulse width(5) Write/Erase endurance(6)(7) Data retention(6)(7) ns -- 10000 cycles -- 10 years (1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when programming the EEPROM. (2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting factor in determining the timer resolution. (3) The minimum period tTLTL should not be less than the number of cycle times it takes to execute the capture interrupt service routine plus 24 tCYC. (4) The minimum period tILIL should not be less than the number of cycle times it takes to execute the interrupt service routine plus 21 tCYC. (5) tOH and tOL should not total less than 500ns. (6) At a temperature of 85C (7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information. 14 Freescale E-28 MC68HC705B16 MC68HC05B6 Rev. 4.1 tTLTL tTH tTL External signal (TCAP1, TCAP2) Figure E-11 Timer relationship E.9 EPROM electrical characteristics Table E-13 DC electrical characteristics for 5V operation (VDD = 5 Vdc 10%, VSS = 0 Vdc, TA = 25C) Characteristic(1) EPROM Absolute maximum voltage Programming voltage Programming current Read voltage Symbol Min Typ(2) Max Unit VPP6 max VPP6 IPP6 VPP6R VDD 15 -- VDD -- 15.5 50 VDD 18 16 64 VDD V V mA V (1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching currents inherent in CMOS designs (see Section 2). (2) Typical values are at mid point of voltage range and at 25C only. Table E-14 Control timing for 5V operation (VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = 25C) Characteristic EPROM programming time Symbol Min Max Unit tPROG 5 20 ms Table E-15 Control timing for 3.3V operation (VDD = 3.3 Vdc 10%, VSS = 0 Vdc, TA = 25C) Characteristic EPROM programming time Symbol Min Max Unit tPROG 5 20 ms 14 MC68HC05B6 Rev. 4.1 MC68HC705B16 Freescale E-29 14 Freescale E-30 MC68HC705B16 MC68HC05B6 Rev. 4.1 F MC68HC705B16N The MC68HC705B16N is a new device identical to the MC68HC705B16 in its memory map and functionality, except for the following: * Bootloader * Reset pulse width * Reset twice issue * Electrical characteristics On the MC68HC705B16 there was a requirement to reset the device a second time after power-on. On the MC68HC705B16N this reset twice action is now not required. The interrupt service routine for the vector at address $3FF0-$3FF1 is no longer required, as the vector will never be fetched. However, the interrupt service routine and vector contents required for the MC68HC705B16 (see Section E, page E-1) can also be kept on the MC68HC705B16N with no detrimental effect, although they will never be used. The MC68HC705B16N is a device similar to the MC68HC05B6, but with increased RAM and 15 kbytes of EPROM instead of 6 kbytes of ROM. In addition, the self-check routines available in the MC68HC05B6 are replaced by bootstrap firmware. The MC68HC705B16N is an OTPROM (one-time programmable ROM) version of the MC68HC05B16, meaning that once the application program has been loaded in the EPROM it can never be erased. The entire MC68HC05B6 data sheet applies to the MC68HC705B16N, with the exceptions outlined in this appendix. 14 MC68HC05B6 Rev. 4.1 MC68HC705B16N Freescale F-1 213 214 215 216 217 F.1 Features 352 bytes of RAM * 576 bytes bootstrap ROM * Simultaneous programming of up to 8 bytes of EPROM * Optional pull-down resistors available on all port B and port C pins * 52-pin PLCC and 64-pin QFP packages 256 bytes EEPROM VPP1 Charge pump VPP6 15168 bytes EPROM RESET IRQ PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2/ECLK PC3 PC4 PC5 PC6 PC7 576 bytes bootstrap ROM COP watchdog OSC2 OSC1 Oscillator 352 bytes static RAM / 2 / / 32 M68HC05 CPU VDD VSS 16-bit timer Port D PD0/AN0 PD1/AN1 PD2/AN2 PD3/AN3 PD4/AN4 PD5/AN5 PD6/AN6 PD7/AN7 VRH VRL Port A * Port B 15 kbytes EPROM Port C * 8-bit A/D converter TCMP1 TCMP2 TCAP1 TCAP2 SCI RDI SCLK TDO PLM PLMA D/A PLMB D/A Figure F-1 MC68HC705B16N block diagram Note: 14 Freescale F-2 The electrical characteristics of the MC68HC05B6 as provided in Section 11 do not apply to the MC68HC705B16N. Data specific to the MC68HC705B16N can be found in this appendix. MC68HC705B16N MC68HC05B6 Rev. 4.1 218 219 220 221 222 MC68HC705B16 Registers $0000 I/O (32 bytes) $0020 Page 0 User EPROM (48 bytes) $0100 $0101 $0006 E/EEPROM/ECLK control register $0007 A/D data register $0008 A/D status/control register $0009 Pulse length modulation A $000A Pulse length modulation B $000B Miscellaneous register $000C SCI baud rate register $000D SCI control register 1 $000E SCI control register 2 $000F SCI status register $0010 SCI data register $0011 Timer control register $0012 Timer status register $0013 RAM11 (176 bytes) Capture high register 1 $0014 Capture low register 1 $0015 User EPROM (15104 bytes) Compare high register 1 $0016 Compare low register 1 $0017 Counter high register $0018 Counter low register $0019 Alternate counter high register $001A Alternate counter low register $001B Capture high register 2 $001C Capture low register 2 $001D Compare high register 2 $001E Compare low register 2 $001F Options register $0100 Mask option register $3DFE EEPROM (256 bytes) Protected (224 bytes) $3DFE $3DFF $3E00 $0003 $0005 Unprotected (31 bytes) Bootstrap ROM1 (80 bytes) $0300 $0002 Port D input data register Port C data direction register Options register $0250 $0001 $0004 Stack $0200 Port B data register Port C data register Port A data direction register RAM1 (176 bytes) $0120 $0000 Port B data direction register $0050 $00C0 Port A data register Mask option register Bootstrap ROM11 (496 bytes) $3FF0-1 $3FF2-3 SCI Timer overflow $3FF4-5 $3FF6-7 Timer output compare 1& 2 $3FF8-9 Timer input capture 1 & 2 External IRQ $3FFA-B $3FFC-D SWI $3FFE-F Reset/power-on reset User vectors (14 bytes) Reserved Figure F-2 Memory map of the MC68HC705B16N 14 MC68HC05B6 Rev. 4.1 MC68HC705B16N Freescale F-3 223 224 225 226 227 Table F-1 Register outline Register name Address bit 7 Port A data (PORTA) $0000 Port B data (PORTB) $0001 Port C data (PORTC) $0002 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Undefined Undefined PC2/ ECLK PD7 PD6 PD5 PD4 PD3 PD2 Undefined Port D data (PORTD) $0003 Port A data direction (DDRA) $0004 PD1 PD0 0000 0000 Undefined 0000 0000 Port B data direction (DDRB) $0005 Port C data direction (DDRC) $0006 0000 0000 EPROM/EEPROM/ECLK control $0007 E6LAT E6PGM ECLK E1ERA E1LAT E1PGM 0000 0000 A/D data (ADDATA) $0008 A/D status/control (ADSTAT) $0009 Pulse length modulation A (PLMA) $000A Pulse length modulation B (PLMB) $000B Miscellaneous 0000 0000 COCO ADRC ADON 0 CH3 CH2 CH1 CH0 0000 0000 0000 0000 0000 0000 $000C POR(1) INTP INTN INTE SCT1 SCT0 SFA SFB SM WDOG(2) ?001 000? SCT0 SCR2 SCR1 SCR0 00uu uuuu SCI baud rate (BAUD) $000D SPC1 SPC0 SCI control 1 (SCCR1) $000E R8 T8 SCI control 2 (SCCR2) $000F TIE TCIE RIE ILIE TE RE RWU SCI status (SCSR) $0010 TDRE TC RDRF IDLE OR NF FE SCI data (SCDR) $0011 Timer control (TCR) $0012 ICIE OCIE TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0 ICF1 OCF1 TOF M WAKE CPOL CPHA LBCL Undefined SBK 0000 0000 1100 000u 0000 0000 ICF2 Undefined Timer status (TSR) $0013 Input capture high 1 $0014 OCF2 Input capture low 1 $0015 Undefined Output compare high 1 $0016 Undefined Output compare low 1 $0017 Undefined Timer counter high $0018 1111 1111 1111 1100 Undefined Timer counter low $0019 Alternate counter high $001A 1111 1111 Alternate counter low $001B 1111 1100 Input capture high 2 $001C Undefined Input capture low 2 $001D Undefined Output compare high 2 $001E Undefined Output compare low 2 $001F Options (OPTR)(3) $0100 Mask option register (MOR)(4) $3DFE Undefined EE1P SEC Not affected RTIM RWAT WWAT PBPD PCPD Not affected (1) This bit is set each time there is a power-on reset. (2) The state of the WDOG bit after reset is dependent upon the mask option selected; 1=watchdog enabled, 0=watchdog disabled. (3) This register is implemented in EEPROM; therefore reset has no effect on the individual bits. 14 (4) This register is implemented in EPROM; therefore reset has no effect on the individual bits. Freescale F-4 MC68HC705B16N MC68HC05B6 Rev. 4.1 228 229 230 231 232 F.2 External clock When using an external clock the OSC1 and OSC2 pins should be driven in antiphase (see Figure D-2). The tOXOV or tILCH specifications (see Section F.9) do not apply when using an external clock input. The equivalent specification of the external clock source should be used in lieu of tOXOV or tILCH. F.3 RESET pin When the oscillator is running in a stable condition, the MCU is reset when a logic zero is applied to the RESET input for a minimum period of 3.0 machine cycles (tCYC). For more information see Section 9.1.3. F.4 EPROM The MC68HC705B16N memory map is given in Figure F-2. The device has a total of 15168 bytes of EPROM (including 14 bytes for User vectors) and 256 bytes of EEPROM. The EPROM array is supplied by the VPP6 pin in both read and program modes. Typically the user's software would be loaded into a programming board where VPP6 is controlled by one of the bootstrap loader routines. It would then be placed in an application where no programming occurs. In this case the VPP6 pin should be hardwired to VDD. Warning: A minimum VDD voltage must be applied to the VPP6 pin at all times, including power-on. Failure to do so could result in permanent damage to the device. Unless otherwise stated, EPROM programming is guaranteed at ambient (25C) temperature only. F.4.1 EPROM read operation The execution of a program in the EPROM address range or a load from the EPROM are both read operations. The E6LAT bit in the EPROM/EEPROM control register should be cleared to `0' which automatically resets the E6PGM bit. In this way the EPROM is read like a normal ROM. Reading the EPROM with the E6LAT bit set will give data that does not correspond to the actual memory content. As interrupt vectors are in EPROM, they will not be loaded when E6LAT is set. Similarly, the bootstrap ROM routines cannot be executed when E6LAT is set. In read mode, the VPP6 pin must be at the VDD level. When entering the STOP mode, the EPROM is automatically set to the read mode. Note: 14 An erased byte reads as $00. MC68HC05B6 Rev. 4.1 MC68HC705B16N Freescale F-5 233 234 235 236 237 F.4.2 EPROM program operation Typically the EPROM will be programmed by the bootstrap routines resident in the on-chip ROM. However, the user program can be used to program some EPROM locations if the proper procedure is followed. In particular, the programming sequence must be running in RAM, as the EPROM will not be available for code execution while the E6LAT bit is set. The VPP6 switching must occur externally after the E6PGM bit is set, for example under control of a signal generated on a pin by the programming routine. Note: When the part becomes a PROM, only the cumulative programming of bits to logic `1' is possible if multiple programming is made on the same byte. To allow simultaneous programming of up to eight bytes, these bytes must be in the same group of addresses which share the same most significant address bits; only the three least significant bits can change. F.4.3 EPROM/EEPROM/ECLK control register Address EPROM/EEPROM/ECLK control bit 7 $0007 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset E6LAT E6PGM ECLK E1ERA E1LAT E1PGM 0000 0000 E6LAT -- EPROM programming latch enable bit 1 (set) - Address and up to eight data bytes can be latched into the EPROM for further programming providing the E6PGM bit is cleared. 0 (clear) - Data can be read from the EPROM or firmware ROM; the E6PGM bit is reset to zero when E6LAT is `0'. STOP, power-on and external reset clear the E6LAT bit. Note: After the tERA1 erase time or tPROG1 programming time, the E6LAT bit has to be reset to zero in order to clear the E6PGM bit. E6PGM -- EPROM program enable bit This bit is the EPROM program enable bit. It can be set to `1' to enable programming only after E6LAT is set and at least one byte is written to the EPROM. It is not possible to clear this bit using software but clearing E6LAT will always clear E6PGM. 14 Note: The E6PGM bit can never be set while the E6LAT bit is at zero. 238 Freescale F-6 MC68HC705B16N MC68HC05B6 Rev. 4.1 Table F-2 EPROM control bits description E6LAT E6PGM Description 0 0 Read/execute in EPROM 1 0 Ready to write address/data to EPROM 1 1 programming in progress ECLK See Section 4.3. E1ERA -- EEPROM erase/programming bit Providing the E1LAT and E1PGM bits are at logic one, this bit indicates whether the access to the EEPROM is for erasing or programming purposes. 1 (set) - 0 (clear) - An erase operation will take place. A programming operation will take place. Once the program/erase EEPROM address has been selected, E1ERA cannot be changed. E1LAT -- EEPROM programming latch enable bit 1 (set) - 0 (clear) - Address and data can be latched into the EEPROM for further program or erase operations, providing the E1PGM bit is cleared. Data can be read from the EEPROM. The E1ERA bit and the E1PGM bit are reset to zero when E1LAT is `0'. STOP, power-on and external reset clear the E1LAT bit. Note: After the tERA1 erase time or tPROG1 programming time, the E1LAT bit has to be reset to zero in order to clear the E1ERA bit and the E1PGM bit. E1PGM -- EEPROM charge pump enable/disable 1 (set) - Internal charge pump generator switched on. 0 (clear) - Internal charge pump generator switched off. When the charge pump generator is on, the resulting high voltage is applied to the EEPROM array. This bit cannot be set before the data is selected, and once this bit has been set it can only be cleared by clearing the E1LAT bit. A summary of the effects of setting/clearing bits 0, 1 and 2 of the control register are given in Table F-3. Note: The E1PGM and E1ERA bits are cleared when the E1LAT bit is at zero. 14 MC68HC05B6 Rev. 4.1 MC68HC705B16N Freescale F-7 Table F-3 EEPROM control bits description E1ERA F.4.4 E1LAT E1PGM Description 0 0 0 Read condition 0 1 0 Ready to load address/data for program/erase 0 1 1 Byte programming in progress 1 1 0 Ready for byte erase (load address) 1 1 1 Byte erase in progress Mask option register Address Mask option register (MOR)(1) bit 7 $3DFE bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset RTIM RWAT WWAT PBPD PCPD Not affected (1) This register is implemented in EPROM; therefore reset has no effect on the individual bits. RTIM -- Reset time This bit can modify the time tPORL, where the RESET pin is kept low after a power-on reset. 1 (set) - 0 (clear) - tPORL = 16 cycles. tPORL = 4064 cycles. RWAT -- Watchdog after reset This bit can modify the status of the watchdog counter after reset. Usually, the watchdog system is disabled after power-on or external reset but when this bit is set, it will be active immediately after the following resets (except in bootstrap mode). WWAT -- Watchdog during WAIT mode This bit can modify the status of the watchdog counter in WAIT mode. Normally, the watchdog system is disabled in WAIT mode but when this bit is set, the watchdog will be active in WAIT mode. PBPD -- Port B pull-down This bit, when programmed, connects a resistive pull-down on each pin of port B. This pull-down, RPD, is active on a given pin only while it is an input. 14 Freescale F-8 MC68HC705B16N MC68HC05B6 Rev. 4.1 PCPD -- Port C pull-down This bit, when programmed, connects a resistive pull-down on each pin of port C. This pull-down, RPD, is active on a given pin only while it is an input. F.4.5 EEPROM options register (OPTR) Address Options (OPTR)(1) bit 7 bit 6 bit 5 bit 4 $0100 bit 3 bit 2 State on reset bit 1 bit 0 EE1P SEC Not affected (1) This register is implemented in EEPROM; therefore reset has no effect on the individual bits. EE1P - EEPROM protect bit In order to achieve a higher degree of protection, the EEPROM is effectively split into two parts, both working from the VPP1 charge pump. Part 1 of the EEPROM array (32 bytes from $0100 to $011F) cannot be protected; part 2 (224 bytes from $0120 to $01FF) is protected by the EE1P bit in the options register. 1 (set) - 0 (clear) - Part 2 of the EEPROM array is not protected; all 256 bytes of EEPROM can be accessed for any read, erase or programming operations. Part 2 of the EEPROM array is protected; any attempt to erase or program a location will be unsuccessful. When this bit is set to 1 (erased), the protection will remain until the next power-on or external reset. EE1P can only be written to `0' when the E1LAT bit in the EEPROM control register is set. Note: The EEPROM1 protect function is disabled while in bootstrap mode. SEC -- Secure bit This bit allows the EPROM and EEPROM1 to be secured from external access. When this bit is in the erased state (set), the EPROM and EEPROM1 content is not secured and the device may be used in non user mode. When the SEC bit is programmed to `zero', the EPROM and EEPROM1 content is secured by prohibiting entry to the non user mode. To deactivate the secure bit, the EPROM has to be erased by exposure to a high density ultraviolet light, and the device has to be entered into the EPROM erase verification mode with PD1 set. When the SEC bit is changed, its new value will have no effect until the next power-on or external reset. 1 (set) - 0 (clear) - MC68HC05B6 Rev. 4.1 EEPROM/EPROM not protected. EEPROM/EPROM protected. MC68HC705B16N 14 Freescale F-9 F.5 Bootstrap mode Oscillator divide-by-two is forced in bootstrap mode. The 432 bytes of self-check firmware on the MC68HC05B6 are replaced by 576 bytes of bootstrap firmware. A detailed description of the modes of operation within bootstrap mode is given below. The bootstrap program in mask ROM address locations $0200 to $024F and $3E00 to $3FEF can be used to program the EPROM and the EEPROM, to check if the EPROM is erased or to load and execute data in RAM. After reset, while going to the bootstrap mode, the vector located at address $3FEE and $3FEF (RESET) is fetched to start execution of the bootstrap program. To place the part in bootstrap mode, the IRQ pin should be at 2xVDD with the TCAP1 pin `high' during transition of the RESET pin from low to high. The hold time on the IRQ and TCAP1 pins is two clock cycles after the external RESET pin is brought high. When the MC68HC705B16N is placed in the bootstrap mode, the bootstrap reset vector will be fetched and the bootstrap firmware will start to execute. Table F-4 shows the conditions required to enter each level of bootstrap mode on the rising edge of RESET. Table F-4 Mode of operation selection IRQ pin TCAP1 pin PD1 PD2 PD3 PD4 Mode VSS to VDD VSS to VDD x x x x Single chip 2xVDD VDD 0 0 0 0 Erased EPROM verification 2xVDD VDD 0 0 1 0 EPROM verification; 2xVDD VDD 1 0 0 0 EPROM verification; erase EEPROM; EPROM/EEPROM parallel program/verify 2xVDD VDD 1 0 1 0 Erased EPROM verification; erase EEPROM; EPROM parallel program/verify (no E2) 2xVDD VDD 1 0 0 1 Jump to start of RAM ($0051); SEC bit = NON ACTIVE 1 Serial RAM load/execute - similar to MC68HC05B6 but can fill RAM I and II 2xVDD VDD x 0 1 x = Don't care The bootstrap program will first copy part of itself in RAM (except `RAM parallel load'), as the program cannot be executed in ROM during verification/programming of the EPROM. It will then set the TCMP1 output to a logic high level, unlike the MC68HC05B6 which keeps TCMP1 low. This can be used to distinguish between the two circuits and, in particular, for selection of the VPP level and current capability. 14 Freescale F-10 MC68HC705B16N MC68HC05B6 Rev. 4.1 Reset IRQ at 2xVDD? N Y TCAP1=VDD? User mode Y N SEC bit active? N Non-user mode Y PD4 set? Y N Non-user mode Y PD2 set? SEC bit active? N PD2 set? Y Erased EPROM verification PD3 set? Y Non-user mode Y Serial RAM load/execute N N Red LED on Y N Y PD1 set? Red LED on N N PD3 set? Y Jump to RAM ($0051) SEC bit active? N N EPROM verify Verify EPROM EPROM erased? Red LED on Erased EPROM verification Y Red LED on N EPROM verified? Y Green LED on Green LED on Y PD1 set? N Y D 14 Figure F-3 Modes of operation flow chart (1 of 2) MC68HC05B6 Rev. 4.1 MC68HC705B16N Freescale F-11 D EEPROM byte erase and verify N EEPROM erased? Y Parallel program and verify N PD3 set? Y Go to $300 (EPROM only) Go to $100 (EPROM and EEPROM) Parallel program Data verified? N Y 14 Red LED on Green LED on Figure F-4 Modes of operation flow chart (2 of 2) Freescale F-12 MC68HC705B16N MC68HC05B6 Rev. 4.1 F.5.1 Erased EPROM verification If a non $00 byte is detected, the red LED will be turned on and the routine will stop (see Figure F-3 and Figure F-4). Only when the whole EPROM content is verified as erased will the green LED be turned on. PD1 is then checked. If PD1=0, the bootstrap program stops here and no programming occurs until such time as a high level is sensed on PD1. If PD1 = 1, the bootstrap program proceeds to erase the EEPROM1 for a nominal 2.5 seconds (4.0 MHz crystal). It is then checked for complete erasure; if any EEPROM byte is not erased, the program will stop before erasing the SEC byte. When both EPROM and EEPROM1 are completely erased and the security bit is cleared the programming operation can be performed. A schematic diagram of the circuit required for erased EPROM verification is shown in Figure F-8. F.5.2 EPROM/EEPROM parallel bootstrap Within this mode there are various subsections which can be utilised by correctly configuring the port pins shown in Table F-4. The erased EPROM verification program will be executed first as described in Section F.5.1. The EPROM programming time is set to 10 milliseconds with the bootstrap program and verify for the EPROM taking approximately 15 seconds. The EPROM will be loaded in increasing address order with non EPROM segments being skipped by the loader. Simultaneous programming is performed by reading eight bytes of data before actual programming is performed, thus dividing the loading time of the internal EPROM by 8. If any block of 8 EPROM bytes or 1 EEPROM byte of data is in the erased state, no programming takes place, thus speeding up the execution time. Parallel data is entered through Port A, while the 15-bit address is output on port B, PC0 to PC4 and TCMP1 and TCMP2. If the data comes from an external EPROM, the handshake can be disabled by connecting together PC5 and PC6. If the data is supplied by a parallel interface, handshake will be provided by PC5 and PC6 according to the timing diagram of Figure F-6 (see also Figure F-7). During programming, the green LED will flash at about 3 Hz. Upon completion of the programming operation, the EPROM and EEPROM1 content will be checked against the external data source. If programming is verified the green LED will stay on, while an error will cause the red LED to be turned on. Figure F-7 is a schematic diagram of a circuit which can be used to program the EPROM or to load and execute data in the RAM. Note: The entire EPROM and EEPROM1 can be loaded from the external source; if it is desired to leave a segment undisturbed, the data for this segment should be all $00s for EPROM data and all $FFs for EEPROM1 data. 14 MC68HC05B6 Rev. 4.1 MC68HC705B16N Freescale F-13 Address HDSK out (PC5) Data HDSK in (PC6) F29 Data read Data read Figure F-5 Timing diagram with handshake tCOOE tCOOE tCOOE tCDDE Address tADE tDHE tADE tDHE tADE tDHE tADE tDHE Data tADE max (address to data delay) 5 machine cycles tDHA min (data hold time) 14 machine cycles tCOOE (load cycle time) 117 machine cycles < tCOOE < 150 machine cycles tCDDE (programming cycle time) tCOOE + tPROG (10 ms nominal for EPROM; 10ms for EEPROM1)) 1 machine cycle = 1/(2f0(Xtal)) Figure F-6 Parallel EPROM loader timing diagram 14 Freescale F-14 MC68HC705B16N MC68HC05B6 Rev. 4.1 P1 RESET RUN 1N914 + 100F 1.0F + 1N914 red LED 470 0.01F 470 TCAP1 VRH VDD IRQ OSC1 RESET OSC2 NC TCMP1 VPP1 PLMA PLMB RDI VRL TCAP2 PD7 PD6 PD5 PD3 PD2 PD1 PD0 Boot green LED red LED -- programming failed green LED -- programming OK Erase check green LED -- EPROM erased red LED -- EPROM not erased 47F 4.0 MHz EPROM verify 22pF Erase check & boot (EPROM only) 22pF Erase verify & boot D0 D1 D2 D3 D4 D5 D6 D7 GND 14 Note: OE Erase check & boot (EPROM & EEPROM) EPROM check 10 9 8 7 6 5 4 3 11 12 13 15 16 17 18 19 1N5819 EPROM SCLK TDO TCMP2 10k 1 k BC309C PD4 1 27 28 VPP PGM VCC A14 26 A13 A0 A1 A2 A3 A4 20 CE A5 A6 27C256 A7 + MC68HC705B16N MCU +5V A8 A9 A10 A11 A12 GND +5V VPP 1k 100k 25 24 21 23 2 1 2 3 VPP6 12 k PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 4k7 PC7 BC239C 1nF + 4k7 +5V 100 k PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 HDSK out PC5 PC6 VSS PC4 PC3 PC2 PC1 PC0 Short circuit if handshake not used A12 A11 A10 A9 A8 HDSK in 22 This circuit is recommended for programming only at 25C and not for use in the end application, or at temperatures other than 25C. If used in the end application, VPP6 should be tied to VDD to avoid damaging the device. 14 Figure F-7 EPROM parallel bootstrap schematic diagram MC68HC05B6 Rev. 4.1 MC68HC705B16N Freescale F-15 F.5.3 Serial RAM loader This mode is similar to the RAM load/execute program for the MC68HC05B6 described in Section 2.2, with the additional features listed below. Table F-4 shows the entry conditions required for this mode. If the first byte is less than $B0, the bootloader behaves exactly as the MC68HC05B6, i.e. count byte followed by data stored in $0050 to $00FF. If the count byte is larger than RAM I (176 bytes) then the code continues to fill RAM II. In this case the count byte is ignored and the program execution begins at $0051 once the total RAM area is filled or if no data is received for 5 milliseconds. The user must take care when using branches or jumps as his code will be relocated in RAM I and II. If the user intends to use the stack in his program, he should send NOP's to fill the desired stack area. In the RAM bootloader mode, all interrupt vectors are mapped to pseudo-vectors in RAM (see Table F-5). This allows programmers to use their own service-routine addresses. Each pseudo-vector is allowed three bytes of space rather than the two bytes for normal vectors, because an explicit jump (JMP) opcode is needed to cause the desired jump to the users service-routine address. Table F-5 Bootstrap vector targets in RAM Vector targets in RAM SCI interrupt F.5.3.1 $0063 Timer overflow $0060 Timer output compare $005D Timer input capture $005A IRQ $0057 SWI $0054 Jump to start of RAM ($0051) The Jump to start of RAM program will be executed when the device is brought out of reset with PD1 and PD4 at `1' and PD2 and PD3 at `0'. 14 Freescale F-16 MC68HC705B16N MC68HC05B6 Rev. 4.1 P1 RESET 100k RUN 10nF 1k 1N914 1.0F + 1N914 22 8 1 2 3 GND +5V VPP + 47F 10 TCAP1 VRH VDD 19 IRQ 18 RESET OSC1 20 OSC2 47F + Red LED 470 0.01F 470 21 PLMA 4.0 MHz 22pF 22pF PLMB Green LED RAM load & execute PD3 Jump to $51 Erase check MC68HC705B16N MCU (socket) Green LED -- EPROM erased Red LED -- EPROM not erased Serial boot PD4 1 k 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 Serial RAM load & execute 9600 BD 8-bit no parity 22F + RS232 Connector 8 5 7 3 2 1 2 x 3K +5V 16 2 22F + 6 MAX 232 13 14 1 3 4 5 12 11 + 22F + 22F 14 13 12 5 4 3 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 VPP6 12 k 4k7 PC7 PD0 PD1 PD2 PD5 PD6 PD7 50 RDI 52 TDO VSS 41 BC239C 1nF + 4k7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 15 Note: 10k BC309C Flashing green LED -- programming Green LED -- programming ended 1N5819 Serial boot PC6 PC5 PC4 PC3 PC2 PC1 PC0 43 44 45 46 47 48 49 VPP1 23 TCAP2 2 TCMP1 1 TCMP2 51 SCLK 40 NC VRL 7 A minimum VDD voltage must be applied to the VPP6 pin at all times, including power-on, as a lower voltage could damage the device. Unless otherwise stated, EPROM programming is guaranteed at ambient (25C) temperature only 14 Figure F-8 RAM load and execute schematic diagram MC68HC05B6 Rev. 4.1 MC68HC705B16N Freescale F-17 tCR Address PC5 out tHO tADR tDHR Data tHI max PC6 in PD4 tEXR max tADR max (address to data delay; PC6=PC5) 16 machine cycles tDHR min (data hold time) 4 machine cycles tCR (load cycle time; PC6=PC5) 49 machine cycles tHO (PC5 handshake out delay) 5 machine cycles tHI max (PC6 handshake in, data hold time) 10 machine cycles tEXR max (max delay for transition to be recognised during this cycle; PC6=PC5 30 machine cycles 1 machine cycle = 1/(2f0(Xtal)) Figure F-9 Parallel RAM loader timing diagram 14 Freescale F-18 MC68HC705B16N MC68HC05B6 Rev. 4.1 F.6 Absolute maximum ratings Table F-6 Absolute maximum ratings Symbol Value Supply voltage(1) Rating VDD - 0.5 to +7.0 V Input voltage (Except VPP1 and VPP6) VIN VSS - 0.5 to VDD + 0.5 V Input voltage - Self-check mode (IRQ pin only) VIN VSS - 0.5 to 2VDD + 0.5 V TA TL to TH 0 to +70 -40 to +85 -40 to +105 -40 to +125 C TSTG - 65 to +150 C ID IS 25 45 mA mA Operating temperature range - Standard (MC68HC705B16N) - Extended (MC68HC705B16NC) - Industrial (MC68HC705B16NV) - Automotive (MC68HC705B16NM) Storage temperature range Current drain per pin (excluding VDD and VSS)(2) - Source - Sink Unit (1) All voltages are with respect to VSS. (2) Maximum current drain per pin is for one pin at a time, limited by an external resistor. Note: This device contains circuitry designed to protect against damage due to high electrostatic voltages or electric fields. However, it is recommended that normal precautions be taken to avoid the application of any voltages higher than those given in the maximum ratings table to this high impedance circuit. For maximum reliability all unused inputs should be tied to either VSS or VDD. 14 MC68HC05B6 Rev. 4.1 MC68HC705B16N Freescale F-19 F.7 DC electrical characteristics Table F-7 DC electrical characteristics for 5V operation (VDD = 5 Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Symbol Characteristic(1) Output voltage ILOAD = - 10 A VOH ILOAD = +10 A VOL Output high voltage (ILOAD = 0.8mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2 VOH Output high voltage (ILOAD = 1.6mA) VOH TDO, SCLK, PLMA, PLMB Output low voltage (ILOAD = 1.6mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2, VOL TDO, SCLK, PLMA, PLMB Output low voltage (ILOAD = 1.6mA) VOL RESET Input high voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, VIH IRQ, RESET, TCAP1, TCAP2, RDI Input low voltage VIL PA0-7, PB0-7, PC0-7, PD0-7, OSC1, IRQ, RESET, TCAP1, TCAP2, RDI Supply current(3) RUN (SM = 0) (See Figure 11-1) IDD IDD RUN (SM = 1) (See Figure 11.2) IDD WAIT (SM = 0) (See Figure 11-3) IDD WAIT (SM = 1) (See Figure 11-4) STOP IDD 0 to 70 (standard) IDD - 40 to 85 (extended) IDD - 40 to 105 (industrial) IDD - 40 to 125 (automotive) High-Z leakage current IIL PA0-7, PB0-7, PC0-7, TDO, RESET, SCLK Input current Port B and port C pull-down (VIN =VIH) IRPD Input current (0 to 70) IIN IRQ, OSC1, TCAP1, TCAP2, RDI, PD0/AN0-PD7/AN7 (channel not selected) Input current (- 40 to 125) IIN IRQ, OSC1, TCAP1, TCAP2, RDI, PD0/AN0-PD7/AN7 (channel not selected) Capacitance Ports (as input or output), RESET, TDO, SCLK COUT CIN IRQ, TCAP1, TCAP2, OSC1, RDI CIN PD0/AN0-PD7/AN7 (A/D off) CIN PD0/AN0-PD7/AN7 (A/D on) 14 Min Typ(2) Max Unit VDD - 0.1 -- -- -- -- 0.1 V VDD - 0.8 VDD - 0.4 -- VDD - 0.8 VDD - 0.4 -- -- 0.1 0.4 0.4 1 0.7VDD -- VDD V VSS -- 0.2VDD V -- -- -- -- 5.0 1.0 1.5 0.9 6 1.5 2 1 mA mA mA mA -- -- -- -- 2 -- -- -- 10 20 60 100 A A A A -- 0.2 1 A V V A 80 -- 0.2 1 A -- -- 5 A -- -- -- -- -- -- 12 22 12 8 -- -- pF pF pF pF (1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching currents inherent in CMOS designs (see Section 2). (2) Typical values are at mid point of voltage range and at 25C only. (3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 4.2MHz); all inputs 0.2 V from rail; no DC loads; maximum load on outputs 50pF (20pF on OSC2). STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD - 0.2 V: STOP IDD measured with OSC1 = VDD. WAIT IDD is affected linearly by the OSC2 capacitance. Freescale F-20 MC68HC705B16N MC68HC05B6 Rev. 4.1 Table F-8 DC electrical characteristics for 3.3V operation (VDD = 3.3Vdc 10%, VSS = 0Vdc, TA = TL to TH) Characteristic(1) Symbol Output voltage ILOAD = - 10 A VOH ILOAD = +10 A VOL Output high voltage (ILOAD = 0.8mA) VOH PA0-7, PB0-7, PC0-7, TCMP1, TCMP2 Output high voltage (ILOAD = 1.6mA) TDO, SCLK, PLMA, PLMB VOH Output low voltage (ILOAD = 1.6mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2, VOL TDO, SCLK, PLMA, PLMB Output low voltage (ILOAD = 1.6mA) VOL RESET Input high voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, VIH IRQ, RESET, TCAP1, TCAP2, RDI Input low voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, IRQ, VIL RESET, TCAP1, TCAP2, RDI Supply current(3) IDD RUN (SM = 0) (See Figure 11-1) RUN (SM = 1) (See Figure 11-2) IDD WAIT (SM = 0) (See Figure 11-3) IDD WAIT (SM = 1) (See Figure 11-4) IDD STOP 0 to 70 (standard) IDD - 40 to 85 (extended) IDD - 40 to 105 (industrial) IDD - 40 to 125 (automotive) IDD High-Z leakage current PA0-7, PB0-7, PC0-7, TDO, RESET, SCLK IIL Input current Port B and port C pull-down (VIN =VIH) IRPD Input current (0 to 70) IRQ, OSC1, TCAP1, TCAP2, RDI, IIN PD0/AN0-PD7/AN7 (channel not selected) Input current (- 40 to 125) IIN IRQ, OSC1, TCAP1, TCAP2, RDI, PD0/AN0-PD7/AN7 (channel not selected) Capacitance Ports (as input or output), RESET, TDO, COUT SCLK CIN IRQ, TCAP1, TCAP2, OSC1, RDI CIN PD0/AN0-PD7/AN7 (A/D off) CIN PD0/AN0-PD7/AN7 (A/D on) Min Typ(2) Max Unit VDD - 0.1 -- -- -- -- 0.1 V VDD - 0.3 VDD - 0.1 -- VDD - 0.3 VDD - 0.1 -- -- 0.1 0.4 0.2 0.6 0.7VDD -- VDD V VSS -- 0.2VDD V -- -- -- -- 2.0 0.8 1.0 0.4 3 1 1.5 0.5 mA mA mA mA -- -- -- -- 1 -- -- -- 10 10 40 60 A A A A -- 0.2 1 V V A A 80 -- 0.2 1 A -- -- 5 A -- -- -- -- -- -- 12 22 12 8 -- -- pF pF pF pF (1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching currents inherent in CMOS designs (see Section 2). (2) Typical values are at mid point of voltage range and at 25C only. 14 MC68HC05B6 Rev. 4.1 MC68HC705B16N Freescale F-21 (3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 2.0MHz); all inputs 0.2 V from rail; no DC loads; maximum load on outputs 50pF (20pF on OSC2). STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD - 0.2 V: STOP IDD measured with OSC1 = VDD. WAIT IDD is affected linearly by the OSC2 capacitance. 14 Freescale F-22 MC68HC705B16N MC68HC05B6 Rev. 4.1 F.8 A/D converter characteristics Table F-9 A/D characteristics for 5V operation (VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Min Max Unit Resolution Characteristic Number of bits resolved by the A/D Parameter 8 -- Bit Non-linearity Max deviation from the best straight line through the A/D transfer characteristics (VRH = VDD and VRL = 0V) -- 0.5 LSB Quantization error Uncertainty due to converter resolution -- 0.5 LSB Absolute accuracy Difference between the actual input voltage and the full-scale equivalent of the binary code output code for all errors -- 1 LSB Conversion range Analog input voltage range VRL VRH V VRH Maximum analog reference voltage VRL VDD + 0.1 V Minimum analog reference voltage VSS - 0.1 VRH V VR(1) Minimum difference between VRH and VRL 3 -- V Conversion time Total time to perform a single analog to digital conversion a. External clock (OSC1, OSC2) b. Internal RC oscillator -- -- 32 32 tCYC s VRL Monotonicity Conversion result never decreases with an increase in input voltage and has no missing codes GUARANTEED Zero input reading Conversion result when VIN = VRL 00 -- Hex Full scale reading Conversion result when VIN = VRH -- FF Hex Sample acquisition time Analog input acquisition sampling a. External clock (OSC1, OSC2) b. Internal RC oscillator(2) -- -- 12 12 tCYC s Sample/hold capacitance Input capacitance on PD0/AN0-PD7/AN7 -- 12 pF Input leakage(3) -- 1 A Input leakage on A/D pins PD0/AN0-PD7/AN7, VRL, VRH (1) Performance verified down to 2.5V VR, but accuracy is tested and guaranteed at VR = 5V10%. (2) Source impedances greater than 10k will adversely affect internal charging time during input sampling. (3) The external system error caused by input leakage current is approximately equal to the product of R source and input current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2). 14 MC68HC05B6 Rev. 4.1 MC68HC705B16N Freescale F-23 Table F-10 A/D characteristics for 3.3V operation (VDD = 3.3 Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Min Max Unit Resolution Characteristic Number of bits resolved by the A/D Parameter 8 -- Bit Non-linearity Max deviation from the best straight line through the A/D transfer characteristics (VRH = VDD and VRL = 0V) -- 1 LSB Quantization error Uncertainty due to converter resolution -- 1 LSB Absolute accuracy Difference between the actual input voltage and the full-scale equivalent of the binary code output code for all errors -- 2 LSB Conversion range Analog input voltage range VRL VRH V VRH Maximum analog reference voltage VRL VDD + 0.1 V VRL Minimum analog reference voltage VSS - 0.1 VRH V VR Minimum difference between VRH and VRL 3 -- V Conversion time Total time to perform a single analog to digital conversion Internal RC oscillator -- 32 s Monotonicity Conversion result never decreases with an increase in input voltage and has no missing codes Zero input reading Conversion result when VIN = VRL 00 -- Hex Full scale reading Conversion result when VIN = VRH -- FF Hex Sample acquisition time Analog input acquisition sampling Internal RC oscillator(1) -- 12 s Sample/hold capacitance Input capacitance on PD0/AN0-PD7/AN7 -- 12 pF Input leakage(2) -- 1 A Input leakage on A/D pins PD0/AN0-PD7/AN7, VRL, VRH GUARANTEED (1) Source impedances greater than 10k will adversely affect internal charging time during input sampling. (2) The external system error caused by input leakage current is approximately equal to the product of R source and input current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2). 14 Freescale F-24 MC68HC705B16N MC68HC05B6 Rev. 4.1 F.9 Control timing Table F-11 Control timing for 5V operation (VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Characteristic Symbol Frequency of operation Crystal option fOSC External clock option fOSC Internal operating frequency (fOSC/2) Using crystal fOP Using external clock fOP Cycle time (see Figure 9-1) tCYC Crystal oscillator start-up time (see Figure 9-1) tOXOV Stop recovery start-up time (crystal oscillator) tILCH RC oscillator stabilization time tADRC A/D converter stabilization time tADON External RESET input pulse width tRL Power-on RESET output pulse width 4064 cycle tPORL 16 cycle tPORL Watchdog RESET output pulse width tDOGL Watchdog time-out tDOG EEPROM byte erase time tERA 0 to 70 (standard) - 40 to 85 (extended) tERA - 40 to 105 (industrial) tERA - 40 to 125 (automotive) tERA EEPROM byte program time(1) tPROG 0 to 70 (standard) - 40 to 85 (extended) tPROG - 40 to 105 (industrial) tPROG - 40 to 125 (automotive) tPROG Timer (see Figure F-10) Resolution(2) tRESL Input capture pulse width tTH, tTL Input capture pulse period tTLTL Interrupt pulse width (edge-triggered) tILIH Interrupt pulse period tILIL OSC1 pulse width(5) tOH, tOL Write/Erase endurance(6) -- -- Data retention(6)(7) Min Max Unit -- dc 4.2 4.2 MHz MHz dc dc 480 -- 3.0 2.1 2.1 -- 100 100 5 500 -- MHz MHz ns ms ms s s tCYC 4064 16 1.5 6144 -- -- -- 7168 tCYC tCYC 10 10 10 10 -- -- -- -- ms ms ms ms 10 10 15 20 -- -- -- -- ms ms ms ms -- -- -- -- -- -- tCYC ns tCYC ns tCYC ns cycles years 4 125 --(3) 125 --(4) 90 10000 10 tCYC tCYC (1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when programming the EEPROM. (2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting factor in determining the timer resolution. (3) The minimum period tTLTL should not be less than the number of cycle times it takes to execute the capture interrupt service routine plus 24 tCYC. (4) The minimum period tILIL should not be less than the number of cycle times it takes to execute the interrupt service routine plus 21 tCYC. (5) tOH and tOL should not total less than 238ns. (6) At a temperature of 85C (7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information. MC68HC05B6 Rev. 4.1 MC68HC705B16N 14 Freescale F-25 Table F-12 Control timing for 3.3V operation (VDD = 3.3Vdc 10%, VSS = 0 Vdc, TA = TL to TH) Symbol Min Max Unit Frequency of operation Crystal option External clock option Characteristic fOSC fOSC -- dc 2.0 2.0 MHz MHz Internal operating frequency (fOSC/2) Using crystal Using external clock fOP fOP -- dc 1.0 1.0 MHz MHz Cycle time (see Figure 9-1) tCYC 1000 -- ns Crystal oscillator start-up time (see Figure 9-1) tOXOV -- 100 ms ms Stop recovery start-up time (crystal oscillator) tILCH 100 RC oscillator stabilization time tADRC 5 s A/D converter stabilization time tADON 500 s External RESET input pulse width tRL 3.0 -- tCYC Power-on RESET output pulse width 4064 cycle 16 cycle tPORL tPORL 4064 16 -- -- tCYC tCYC Watchdog RESET output pulse width tDOGL 1.5 -- tCYC Watchdog time-out tDOG 6144 7168 tCYC EEPROM byte erase time 0 to 70 (standard) - 40 to 85 (extended) - 40 to 105 (industrial) - 40 to 125 (automotive) 30 30 30 30 -- -- -- -- ms ms ms ms EEPROM byte program time(1) 0 to 70 (standard) - 40 to 85 (extended) - 40 to 105 (industrial) - 40 to 125 (automotive) tERA tERA tERA tERA tPROG tPROG tPROG tPROG 30 30 30 30 -- -- -- -- ms ms ms ms Timer (see Figure F-10) Resolution(2) Input capture pulse width Input capture pulse period tRESL tTH, tTL tTLTL 4 250 --(3) -- -- -- tCYC ns tCYC Interrupt pulse width (edge-triggered) tILIH 250 -- ns Interrupt pulse period tILIL --(4) -- tCYC tOH, tOL 200 OSC1 pulse width(5) Write/Erase endurance(6)(7) Data retention(6)(7) -- ns -- 10000 cycles -- 10 years (1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when programming the EEPROM. (2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting factor in determining the timer resolution. (3) The minimum period tTLTL should not be less than the number of cycle times it takes to execute the capture interrupt service routine plus 24 tCYC. (4) The minimum period tILIL should not be less than the number of cycle times it takes to execute the interrupt service routine plus 21 tCYC. (5) tOH and tOL should not total less than 500ns. (6) At a temperature of 85C (7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information. 14 Freescale F-26 MC68HC705B16N MC68HC05B6 Rev. 4.1 tTLTL tTH tTL External signal (TCAP1, TCAP2) Figure F-10 Timer relationship F.10 EPROM electrical characteristics Table F-13 DC electrical characteristics for 5V operation (VDD = 5 Vdc 10%, VSS = 0 Vdc, TA = 25C) Characteristic(1) EPROM Absolute maximum voltage Programming voltage Programming current Read voltage Symbol Min Typ(2) Max Unit VPP6 max VPP6 IPP6 VPP6R VDD 15 -- VDD -- 15.5 50 VDD 18 16 64 VDD V V mA V (1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching currents inherent in CMOS designs (see Section 2). (2) Typical values are at mid point of voltage range and at 25C only. Table F-14 Control timing for 5V operation (VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = 25C) Characteristic EPROM programming time Symbol Min Max Unit tPROG 5 20 ms Table F-15 Control timing for 3.3V operation (VDD = 3.3 Vdc 10%, VSS = 0 Vdc, TA = 25C) Characteristic EPROM programming time Symbol Min Max Unit tPROG 5 20 ms 14 MC68HC05B6 Rev. 4.1 MC68HC705B16N Freescale F-27 14 Freescale F-28 MC68HC705B16N MC68HC05B6 Rev. 4.1 G MC68HC05B32 The MC68HC05B32 is a device similar to the MC68HC05B6, but with increased RAM and ROM sizes. The entire MC68HC05B6 data sheet applies to the MC68HC05B32, with the exceptions outlined in this appendix. G.1 Features * 31248 bytes User ROM * No page zero ROM * 528 bytes of RAM * 52-pin PLCC and 64-pin QFP packages for -40 to +85C operating temperature range (extended) * 56-pin SDIP package for 0 to 70C operating temperature range * High speed version not available Note: G.2 Preliminary electrical specifications for the MC68HC05B32 should be taken as being similar to those for the MC68HC705B32. When silicon is fully available, the part will be re-characterised and new data made available. External clock When using an external clock the OSC1 and OSC2 pins should be driven in antiphase (see Figure D-2). The tOXOV or tILCH specifications (see Section H.9) do not apply when using an external clock input. The equivalent specification of the external clock source should be used in lieu of tOXOV or tILCH. 14 MC68HC05B6 Rev. 4.1 MC68HC05B32 Freescale G-1 239 240 241 242 VPP6 32 kbytes ROM RESET IRQ PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2/ECLK PC3 PC4 PC5 PC6 PC7 638 bytes self-check ROM COP watchdog OSC2 OSC1 Oscillator / 2 / /32 528 bytes static RAM M68HC05 CPU VDD VSS 16-bit timer Port D PD0/AN0 PD1/AN1 PD2/AN2 PD3/AN3 PD4/AN4 PD5/AN5 PD6/AN6 PD7/AN7 VRH VRL Port A Charge pump Port B VPP1 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 Port C 256 bytes EEPROM 8-bit A/D converter TCMP1 TCMP2 TCAP1 TCAP2 SCI RDI SCLK TDO PLM PLMA D/A PLMB D/A Figure G-1 MC68HC05B32 block diagram 14 Freescale G-2 MC68HC05B32 MC68HC05B6 Rev. 4.1 MC68HC05B32 Registers $0000 I/O (32 bytes) $0020 $0100 $0101 $0006 EEPROM/ECLK control register $0007 A/D data register $0008 A/D status/control register $0009 Pulse length modulation A $000A Pulse length modulation B $000B Miscellaneous register $000C SCI baud rate register $000D SCI control register 1 $000E SCI control register 2 $000F SCI status register $0010 SCI data register $0011 Bootloader ROMI (80 bytes) Timer control register $0012 Timer status register $0013 RAMII (352 bytes) Capture high register 1 $0014 Capture low register 1 $0015 Bootloader ROMII (80 bytes) Compare high register 1 $0016 Compare low register 1 $0017 Counter high register $0018 Counter low register $0019 Alternate counter high register $001A Alternate counter low register $001B Capture high register 2 $001C Capture low register 2 $001D Compare high register 2 $001E Compare low register 2 $001F Options register $0100 EEPROM (256 bytes) Protected (224 bytes) $0400 $7E00 User ROM (31232 bytes) Bootloader ROMIII (478 bytes) $7FDE $7FE0 $0003 $0005 Unprotected (31 bytes) $03B0 $0002 Port D input data register Port C data direction register Options register $0250 $0001 $0004 Stack $0200 Port B data register Port C data register Port A data direction register RAMI (176 bytes) $0120 $0000 Port B data direction register $0050 $00C0 Port A data register Bootloader ROM vectors (16 bytes) $7FF0 $7FF2-3 SCI Timer overflow $7FF4-5 $7FF6-7 Timer output compare 1& 2 $7FF8-9 Timer input capture 1 & 2 External IRQ $7FFA-B $7FFC-D SWI $7FFE-F Reset/power-on reset User vectors (14 bytes) Reserved Figure G-2 Memory map of the MC68HC05B32 14 MC68HC05B6 Rev. 4.1 MC68HC05B32 Freescale G-3 Table G-1 Register outline Register name Address bit 7 Port A data (PORTA) $0000 Port B data (PORTB) $0001 Port C data (PORTC) $0002 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset Undefined Undefined PC2/ ECLK Port D data (PORTD) $0003 Port A data direction (DDRA) $0004 0000 0000 0000 0000 Port B data direction (DDRB) $0005 Port C data direction (DDRC) $0006 EEPROM/ECLK control $0007 A/D data (ADDATA) $0008 A/D status/control (ADSTAT) $0009 Pulse length modulation A (PLMA) $000A Pulse length modulation B (PLMB) $000B Miscellaneous PD7 PD6 PD5 PD4 PD3 PD2 Undefined PD1 PD0 Undefined 0000 0000 0 0 0 0 ECLK E1ERA E1LAT E1PGM 0000 0000 0 CH3 0000 0000 COCO ADRC ADON CH2 CH1 CH0 0000 0000 0000 0000 0000 0000 $000C POR(1) INTP INTN INTE SCT1 SCT0 SFA SFB SM WDOG(2) ?001 000? SCT0 SCR2 SCR1 SCR0 00uu uuuu SCI baud rate (BAUD) $000D SPC1 SPC0 SCI control 1 (SCCR1) $000E R8 T8 SCI control 2 (SCCR2) $000F TIE TCIE RIE ILIE TE RE RWU SCI status (SCSR) $0010 TDRE TC RDRF IDLE OR NF FE SCI data (SCDR) $0011 Timer control (TCR) $0012 ICIE OCIE TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0 ICF1 OCF1 TOF M WAKE CPOL CPHA LBCL Undefined SBK 0000 0000 1100 000u 0000 0000 ICF2 Undefined Timer status (TSR) $0013 Input capture high 1 $0014 OCF2 Input capture low 1 $0015 Undefined Output compare high 1 $0016 Undefined Output compare low 1 $0017 Undefined Timer counter high $0018 1111 1111 1111 1100 Undefined Timer counter low $0019 Alternate counter high $001A 1111 1111 Alternate counter low $001B 1111 1100 Input capture high 2 $001C Undefined Input capture low 2 $001D Undefined Output compare high 2 $001E Undefined Output compare low 2 $001F Options (OPTR)(3) $0100 Mask option register (MOR)(4) $7FDE Undefined EE1P SEC Not affected RTIM RWAT WWAT PBPD PCPD Not affected (1) This bit is set each time there is a power-on reset. (2) The state of the WDOG bit after reset is dependent upon the mask option selected; 1 = watchdog enabled, 0 = watchdog disabled. (3) This register is implemented in EEPROM; therefore reset has no effect on the individual bits. (4) This register is implemented in ROM; therefore reset has no effect on the individual bits. 14 Freescale G-4 MC68HC05B32 MC68HC05B6 Rev. 4.1 y r H ina m i l e MC68HC705B32 Maskset errata r P This errata section outlines the differences between two previously available masksets (D59J and D40J) and all other masksets. Unless otherwise stated, the main body of Appendix G refers to all these other masksets with any differences being noted in this errata section. y r a in * For the D59J and D40J masksets, the MCU only requires that a logic zero is applied to the RESET input for 1.5 tCYC. * For D59J, 16 cycle POR delay option (tPORL) is not available * For the D59J maskset, oscillator divide ratio DIV10 is forced in Bootstrap mode. On all other revisions DIV2 is forced. For the D59J: P m i l re The STOP Idd is greater than the expected value of 120A at 5 volts Vdd at a temperature of 20C with the CAN module enabled and in SLEEP mode. Typically the STOP Idd is in the region of 2.0 milliamps at 20C. The fault lies with the design of the EPROM array. When the STOP instruction is executed, the next opcode in memory is present on the data bus. A fault in the EPROM write data latch circuitry causes a latch to be driven to logic 0 on both sides when the data bus for that bit is logic 1. This results in increasing STOP Idd of 450A per data bus bit set to a logic 1. If all data bus bits are set to logic 1 (i.e. next opcode is $FF, STX 0,X) the STOP Idd shall be in the region of 3.6mA. y r a in The minimum STOP Idd is achieved by ensuring the opcode immediately following the STOP instruction is data $00. This corresponds to BRSET 0,ADDRESS,LABEL. If the label points to the next sequential instruction in memory then this has the effect of a 5 cycle NOP but note that the carry bit in the condition code register may be altered by the BRSET instruction. P MC68HC05B6 Rev. 4.1 m i l re MC68HC705B32 14 Freescale H-1 243 244 245 246 247 y r a in Example STOP m i l e r P BRSET 0,$00,NEXT NEXT any CPU instruction The address compared may be any address in the page zero memory and the only restriction is that it should not be a register with flags cleared by reading the register. The example shows the address compared to be port A data register and this should not cause any problems in any applications. High STOP Idd will be variable dependant upon the opcode following the STOP instruction. The more bits set in the following opcode, the higher the STOP Idd. The work around described above may be used on any 68HC05B32 or corrected version of the 68HC705B32 without problem. It simply adds a 5 cycle delay to the recovery from STOP and 3 bytes of additional code per STOP instruction but may alter the state of the carry bit in the CCR. Also for the D59J: m i l e r P y r a in The EEPROM programming circuit only fully supports 16-byte simultaneous programming mode and does not support single byte programming correctly. The fault lies with the design of the EPROM array. A fault in the EPROM write data latch circuitry causes a latch to be driven to logic 0 on both sides when the data bus for that bit is logic 1. When the ELAT signal is removed, there is a race condition with the EPBS signal which results in the data bus value being copied to all the EPROM latches. Since 16-byte simultaneous programming functions correctly, it is a relatively simple matter to emulate single byte programming by first initialising all 16 data latches to $00 and then writing the data to be written to the appropriate address. y r a in This problem does not affect user application software in normally circumstances since it only applies to programming the EPROM array. The serial programming software should always simulate 16-byte programming. The Freescale software for programming the 705B32 from an IBM compatible PC functions in 16 byte programming mode. This program therefore correctly programs the EPROM. m i l e r P In normal circumstances this errata does not affect the user application software. This only affects software that programs the EPROM array. The parallel programming bootloader software within the 705B32 ROM performs 16-byte programming and so functions correctly. 14 Freescale H-2 MC68HC705B32 MC68HC05B6 Rev. 4.1 248 249 250 251 252 The MC68HC705B32 is an EPROM version of the MC68HC05B32, with the ROM replaced by a similar amount of EPROM. The entire MC68HC05B6 data sheet applies to the MC68HC705B32, with the exceptions outlined in this appendix. H.1 Features m i l re y r a in * 31246 bytes user EPROM * No page zero EPROM at $20-$4F * 528 bytes of RAM * 638 bytes bootstrap ROM instead of 432 bytes of self-check ROM * Simultaneous programming of EPROM with up to 16 bytes of different data * -40 to +85C operating temperature range (extended) * 52-pin PLCC, 56-pin SDIP and 64-pin QFP packages * High speed version not available Note: P y r a in The electrical characteristics from the MC68HC05B6 data sheet should not be used for the MC68HC705B32. Data specific to this device can be found in Section H.7 and Section H.9. P P MC68HC05B6 Rev. 4.1 m i l re m i l re y r a in MC68HC705B32 14 Freescale H-3 253 254 255 256 257 VPP6 32 kbytes EPROM RESET IRQ OSC2 OSC1 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2/ECLK PC3 PC4 PC5 PC6 PC7 y r a in 638 bytes bootstrap ROM m i l e r P COP watchdog Oscillator / 2 / /32 528 bytes static RAM M68HC05 CPU VDD VSS y r a in 16-bit timer Port D PD0/AN0 PD1/AN1 PD2/AN2 PD3/AN3 PD4/AN4 PD5/AN5 PD6/AN6 PD7/AN7 VRH VRL Port A Charge pump Port B VPP1 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 Port C 256 bytes EEPROM 8-bit A/D converter m i l e r P TCMP1 TCMP2 TCAP1 TCAP2 SCI RDI SCLK TDO PLM PLMA D/A PLMB D/A Figure H-1 MC68HC705B32 block diagram m i l e r P 14 Freescale H-4 y r a in MC68HC705B32 MC68HC05B6 Rev. 4.1 258 259 260 261 262 MC68HC705B32 Registers $0000 I/O (32 bytes) $0020 $0050 $00C0 $0100 $0101 RAM1 (176 bytes) Stack r P m i l e Unprotected (31 bytes) EEPROM (256 bytes) Protected (224 bytes) $0200 Bootstrap ROMI (80 bytes) $0250 RAM11 (352 bytes) $03B0 Bootstrap ROMII (80 bytes) $0400 $7FDE $7FDF $7FE0 $7FF0-1 r P User EPROM (31232 bytes) Bootstrap ROMIII (478 bytes) Mask option register m i l e P User vectors (14 bytes) m i l re Port B data register $0001 Port C data register $0002 Port D input data register $0003 Port A data direction register $0004 Port B data direction register $0005 Port C data direction register $0006 A/D status/control register $0009 Pulse length modulation A $000A Pulse length modulation B $000B Miscellaneous register $000C SCI baud rate register $000D SCI control register 1 $000E SCI control register 2 $000F SCI status register $0010 SCI data register $0011 Timer control register $0012 Timer status register $0013 Capture high register 1 $0014 Capture low register 1 $0015 Compare high register 1 $0016 Compare low register 1 $0017 Counter high register $0018 Counter low register $0019 Alternate counter high register $001A Alternate counter low register $001B Capture high register 2 $001C Capture low register 2 $001D Compare high register 2 $001E Compare low register 2 $001F y r a in Bootstrap ROM vectors (16 bytes) $7FF2-3 SCI Timer overflow $7FF4-5 $7FF6-7 Timer output compare 1& 2 $7FF8-9 Timer input capture 1 & 2 External IRQ $7FFA-B $7FFC-D SWI $7FFE-F Reset/power-on reset $0000 E/EEPROM/ECLK control register $0007 $0008 A/D data register Options register $0120 $7E00 y r a in Port A data register y r a in Options register $0100 Mask option register $7FDE Reserved 14 Figure H-2 Memory map of the MC68HC705B32 MC68HC05B6 Rev. 4.1 MC68HC705B32 Freescale H-5 263 264 265 266 267 Table H-1 Register outline Register name Address bit 7 Port A data (PORTA) $0000 Port B data (PORTB) $0001 Port C data (PORTC) $0002 Port D data (PORTD) bit 5 $0004 Port B data direction (DDRB) $0005 Port C data direction (DDRC) $0006 EPROM/EEPROM/ECLK control $0007 PD7 PD6 0 bit 4 bit 3 bit 2 y r a in bit 1 PD5 PD4 PD3 PD2 $0009 Pulse length modulation A (PLMA) $000A Pulse length modulation B (PLMB) $000B Miscellaneous Undefined Undefined PD1 0000 0000 E6LAT E6PGM ECLK E1ERA E1LAT E1PGM u000 0000 0000 0000 COCO ADRC ADON 0 CH3 CH2 CH1 INTN INTE SCT1 SCT0 SFA SFB SM WDOG(2) ?001 000? SCT0 SCR2 SCR1 SCR0 00uu uuuu y r a in SPC1 SPC0 R8 T8 SCI control 2 (SCCR2) $000F TIE TCIE RIE ILIE TE RE RWU SCI status (SCSR) $0010 TDRE TC RDRF IDLE OR NF FE SCI data (SCDR) $0011 Output compare low 1 Timer counter high Timer counter low 0000 0000 0000 0000 $000C POR(1) INTP $000E Output compare high 1 CH0 0000 0000 $000D Input capture low 1 Undefined 0000 0000 SCI baud rate (BAUD) Timer status (TSR) PD0 0000 0000 SCI control 1 (SCCR1) Input capture high 1 State on reset Undefined $0008 A/D status/control (ADSTAT) Timer control (TCR) bit 0 PC2/ ECLK m i l e r P $0003 Port A data direction (DDRA) A/D data (ADDATA) bit 6 M m i l e r P WAKE CPOL CPHA LBCL Undefined SBK 0000 0000 1100 000u 0000 0000 $0012 ICIE OCIE TOIE FOLV2 FOLV1 OLV2 IEDG1 OLVL1 0000 00u0 $0013 ICF1 OCF1 TOF ICF2 OCF2 $0014 Undefined Undefined $0015 Undefined $0016 Undefined $0017 Undefined $0018 1111 1111 $0019 1111 1100 Alternate counter high $001A 1111 1111 Alternate counter low $001B 1111 1100 Input capture high 2 $001C Input capture low 2 $001D Output compare high 2 $001E Output compare low 2 $001F Options (OPTR)(3) $0100 m i l e r P Mask option register (MOR)(4) $7FDE (1) This bit is set each time there is a power-on reset. y r a in EE1P Undefined Undefined Undefined Undefined SEC Not affected RTIM RWAT WWAT PBPD PCPD Not affected (2) The state of the WDOG bit after reset is dependent upon the mask option selected; 1=watchdog enabled, 0=watchdog disabled. (3) This register is implemented in EEPROM; therefore reset has no effect on the individual bits. 14 (4) This register is implemented in EPROM; therefore reset has no effect on the individual bits. Freescale H-6 MC68HC705B32 MC68HC05B6 Rev. 4.1 268 269 270 H.2 External clock y r a in When using an external clock the OSC1 and OSC2 pins should be driven in antiphase (see Figure D-2). The tOXOV or tILCH specifications (see Section H.9) do not apply when using an external clock input. The equivalent specification of the external clock source should be used in lieu of tOXOV or tILCH. H.3 RESET pin P m i l re When the oscillator is running in a stable condition, the MCU is reset when a logic zero is applied to the RESET input for a minimum period of 3.0 machine cycles (tCYC). This differs from the 05B6, 05B4, 705B5, 05B8, 05B16, 705B16 and the 05B32, which require 1.5 tCYC. For more information see Section 9.1.3. H.4 EPROM y r a in The MC68HC705B32 memory map is given in Figure H-2. The device has a total of 31246 bytes of EPROM. 14 bytes are used for the reset and interrupt vectors from address $7FF2 to $7FFF. The main EPROM block of 31232 bytes is located from $0400 to $7DFF. One byte of EPROM is used as an options register and is located at address $7FDE. m i l re The EPROM array is supplied by the VPP6 pin in both read and program modes. Typically the user's software will be loaded into a programming board where VPP6 is controlled by one of the bootstrap loader routines. It will then be placed in an application where no programming occurs. In this case the VPP6 pin should be hardwired to VDD. P Warning: A minimum VDD voltage must be applied to the VPP6 pin at all times, including power-on. Failure to do so could result in permanent damage to the device. Unless otherwise stated, EPROM programming is guaranteed at ambient (25C) temperature only. P MC68HC05B6 Rev. 4.1 m i l re y r a in MC68HC705B32 14 Freescale H-7 H.4.1 EPROM read operation y r a in The execution of a program in the EPROM address range or a load from the EPROM are both read operations. The E6LAT bit in the EPROM/EEPROM control register should be cleared to `0' which automatically resets the E6PGM bit. In this way the EPROM is read like a normal ROM. Reading the EPROM with the E6LAT bit set will give data that does not correspond to the actual memory content. As interrupt vectors are in EPROM, they will not be loaded when E6LAT is set. Similarly, the bootstrap ROM routines cannot be executed when E6LAT is set. In read mode, the VPP6 pin must be at the VDD level. When entering the STOP mode, the EPROM is automatically set to the read mode. Note: H.4.2 m i l e r P An erased byte reads as $00. EPROM program operation y r a in Typically, the EPROM will be programmed by the bootstrap routines resident in the on-chip ROM. However, the user program can be used to program some EPROM locations if the proper procedure is followed. In particular, the programming sequence must be running in RAM, as the EPROM will not be available for code execution while the E6LAT bit is set. The VPP6 switching must occur externally after EPGM is set, for example under control of a signal generated on a pin by the programming routine. Note: m i l e r P Unless the part has a window for reprogramming, only the cumulative programming of bits to logic `1' is possible if multiple programming is made on the same byte. To allow simultaneous programming of up to sixteen bytes, these bytes must be in the same group of addresses which share the same most significant address bits; only the four LSBs can change. H.4.3 EPROM/EEPROM control register Address EPROM/EEPROM/ECLK control $0007 bit 7 bit 6 0 Freescale H-8 bit 4 bit 3 bit 2 bit 1 bit 0 State on reset E6LAT E6PGM ECLK E1ERA E1LAT E1PGM u000 0000 m i l e r P 14 y r a in bit 5 MC68HC705B32 MC68HC05B6 Rev. 4.1 E6LAT -- EPROM programming latch enable bit 1 (set) - Address and up to sixteen data bytes can be latched into the EPROM for further programming providing the E6PGM bit is cleared. When programming the EPROM, all other 15 addresses must be latched with the erased state ($00) or corruption may occur. 0 (clear) - Data can be read from the EPROM or firmware ROM; the E6PGM bit is reset to zero when E6LAT is `0'. m i l re y r a in STOP, power-on and external reset clear the E6LAT bit. Note: P After the tERA1 erase time or tPROG1 programming time, the E6LAT bit has to be reset to zero in order to clear the E6PGM bit. E6PGM -- EPROM program enable bit This bit is the EPROM program enable bit. It can be set to `1' to enable programming only after E6LAT is set and at least one byte is written to the EPROM. It is not possible to clear this bit using software but clearing E6LAT will always clear E6PGM. y r a in Table H-2 EPROM control bits description m i l e E6LAT E6PGM Note: 0 0 1 0 1 1 r P Description Read/execute in EPROM Ready to write address/data to EPROM programming in progress All combinations are not shown in the above table, since the E6PGM bit is cleared when the E6LAT bit is at zero, and will result in a read condition. ECLK See Section 4.3. E1ERA -- EEPROM erase/programming bit m i l re y r a in Providing the E1LAT and E1PGM bits are at logic one, this bit indicates whether the access to the EEPROM is for erasing or programming purposes. 1 (set) - 0 (clear) - An erase operation will take place. P A programming operation will take place. Once the program/erase EEPROM address has been selected, E1ERA cannot be changed. MC68HC05B6 Rev. 4.1 MC68HC705B32 Freescale H-9 14 E1LAT -- EEPROM programming latch enable bit 1 (set) - 0 (clear) - Address and data can be latched into the EEPROM for further program or erase operations, providing the E1PGM bit is cleared. y r a in Data can be read from the EEPROM. The E1ERA bit and the E1PGM bit are reset to zero when E1LAT is `0'. STOP, power-on and external reset clear the E1LAT bit. Note: m i l e r P After the tERA1 erase time or tPROG1 programming time, the E1LAT bit has to be reset to zero in order to clear the E1ERA bit and the E1PGM bit. E1PGM -- EEPROM charge pump enable/disable 1 (set) - Internal charge pump generator switched on. 0 (clear) - Internal charge pump generator switched off. When the charge pump generator is on, the resulting high voltage is applied to the EEPROM array. This bit cannot be set before the data is selected, and once this bit has been set it can only be cleared by clearing the E1LAT bit. y r a in A summary of the effects of setting/clearing bits 0, 1 and 2 of the control register are given in Table H-3. m i l e r P Table H-3 EEPROM control bits description E1ERA 0 0 0 1 1 Note: E1LAT E1PGM 0 Read condition 1 0 Ready to load address/data for program/erase 1 1 Byte programming in progress 1 0 Ready for byte erase (load address) 1 1 Byte erase in progress The E1PGM and E1ERA bits are cleared when the E1LAT bit is at zero. m i l e r P 14 Freescale H-10 Description 0 y r a in MC68HC705B32 MC68HC05B6 Rev. 4.1 H.4.4 Mask option register Address Mask option register (MOR)(1) bit 7 bit 6 y r a in bit 5 $7FDE bit 4 bit 3 bit 2 bit 1 bit 0 State on reset RTIM RWAT WWAT PBPD PCPD Not affected (1) Because this register is implemented in EPROM, reset has no effect on the individual bits. RTIM m i l re This bit can modify the time tPORL, where the RESET pin is kept low after a power-on reset. 1 (set) - 0 (clear) - P tPORL = 16 cycles. tPORL = 4064 cycles. RWAT This bit can modify the status of the watchdog counter after reset. Usually, the watchdog system is disabled after power-on or external reset but when this bit is set, it will be active immediately after the following resets (except in bootstrap mode). WWAT y r a in This bit can modify the status of the watchdog counter in WAIT mode. Normally, the watchdog system is disabled in WAIT mode but when this bit is set, the watchdog will be active in WAIT mode. PBPD P m i l re This bit, when programmed, connects a resistive pull-down on all 8 pins of port B. This pull-down, RPD, is active on a given pin only while it is an input. PCPD This bit, when programmed, connects a resistive pull-down on all 8 pins of port C. This pull-down, RPD, is active on a given pin only while it is an input. P MC68HC05B6 Rev. 4.1 m i l re y r a in MC68HC705B32 14 Freescale H-11 H.4.5 Options register (OPTR) Address Options (OPTR)(1) bit 7 bit 6 y r a in bit 5 $0100 bit 4 bit 3 bit 2 State on reset bit 1 bit 0 EE1P SEC Not affected (1) Because this register is implemented in EEPROM, reset has no effect on the individual bits. m i l e r P EE1P - EEPROM protect bit In order to achieve a higher degree of protection, the EEPROM is effectively split into two parts, both working from the VPP1 charge pump. Part 1 of the EEPROM array (32 bytes from $0100 to $011F) cannot be protected; part 2 (224 bytes from $0120 to $01FF) is protected by the EE1P bit of the options register. 1 (set) - 0 (clear) - Part 2 of the EEPROM array is not protected; all 256 bytes of EEPROM can be accessed for any read, erase or programming operations. y r a in Part 2 of the EEPROM array is protected; any attempt to erase or program a location will be unsuccessful. When this bit is set to 1 (erased), the protection will remain until the next power-on or external reset. EE1P can only be written to `0' when the E1LAT bit in the EEPROM control register is set. Note: m i l e r P The EEPROM1 protect function is disabled while in bootstrap mode. SEC -- Secure bit This bit allows the EPROM and EEPROM1 to be secured from external access. When this bit is in the erased state (set), the EPROM and EEPROM1 content is not secured and the device may be used in non user mode. When the SEC bit is programmed to `zero', the EPROM and EEPROM1 content is secured by prohibiting entry to the non user mode. To deactivate the secure bit, the EPROM has to be erased by exposure to a high density ultraviolet light, and the device has to be entered into the EPROM erase verification mode with PD1 set. When the SEC bit is changed, its new value will have no effect until the next power-on or external reset. 1 (set) - 0 (clear) - 14 Freescale H-12 y r a in EEPROM/EPROM not protected. EEPROM/EPROM protected. m i l e r P MC68HC705B32 MC68HC05B6 Rev. 4.1 H.5 Bootstrap mode Oscillator divide-by-two is forced in bootstrap mode. y r a in The 432 bytes of self-check firmware on the MC68HC05B6 are replaced by 654 bytes of bootstrap firmware. A detailed description of the modes of operation within bootstrap mode is given below. The bootstrap program in mask ROM address locations $0200 to $024F, $03B0 to $3FFF, $7E00 to $7FDD and $7FE0 to $7FEF can be used to program the EPROM and the EEPROM, to check if the EPROM is erased or to load and execute data in RAM. m i l re After reset, while going to the bootstrap mode, the vector located at address $7FEE and $7FEF (RESET) is fetched to start execution of the bootstrap program. To place the part in bootstrap mode, the IRQ pin should be at 2xVDD with the TCAP1 pin `high' during transition of the RESET pin from low to high. The hold time on the IRQ and TCAP1 pins is two clock cycles after the external RESET pin is brought high. P When the MC68HC705B32 is placed in the bootstrap mode, the bootstrap reset vector will be fetched and the bootstrap firmware will start to execute. Table H-4 shows the conditions required to enter each level of bootstrap mode on the rising edge of RESET. y r a in Table H-4 Mode of operation selection IRQ pin m i l re TCAP1 pin PD1 PD2 PD3 PD4 Mode VSS to VDD VSS to VDD x x x x Single chip 2xVDD VDD 0 0 0 x Erased EPROM verification 2xVDD VDD 2xVDD VDD 2xVDD VDD 1 0 0 0 EPROM verification; erase EEPROM; EPROM/EEPROM parallel program/verify 0 1 0 0 Erased EPROM verification; no EEPROM erase if SEC is zero (parallel mode) 1 1 0 0 Erased EPROM verification; erase EEPROM; EPROM parallel program/verify (no E2) P 2xVDD VDD x 1 1 0 Jump to start of RAM ($0051); SEC bit = ACTIVE 2xVDD VDD 0 1 0 1 EPROM and EEPROM verification; SEC bit = ACTIVE (parallel mode) 2xVDD VDD x x 1 1 Serial RAM load/execute - similar to MC68HC05B6 but can fill RAM I, II and III x = Don't care m i l re y r a in The bootstrap program will first copy part of itself in RAM (except `RAM parallel load'), as the program cannot be executed in ROM during verification/programming of the EPROM. It will then set the TCMP1 output to a logic high level, unlike the MC68HC05B6 which keeps TCMP1 low. This can be used to distinguish between the two circuits and, in particular, for selection of the VPP level and current capability. P MC68HC05B6 Rev. 4.1 MC68HC705B32 14 Freescale H-13 y r a in Reset IRQ at 2xVDD? N User mode m i l e r P Y Y TCAP1=VDD? N N SEC bit active? Non-user mode Y Parallel E/EEPROM bootstrap Bootstrap mode PD3 set? Y SEC bit active? N N N PD2 set? N N m i l e r P PD2 set? Y Red LED on N N Y Red LED on y r a in PD4 set? Y PD1 set? Erased EPROM verification Y Y Serial RAM load/execute Non-user mode Jump to RAM ($0051) EPROM erased? Y Green LED on SEC bit active? PD1 set? N N B m i l e r P Red LED off Red LED on y r a in PD4 set? Erase EEPROM1 Y Y A N C 14 Figure H-3 Modes of operation flow chart (1 of 2) Freescale H-14 MC68HC705B32 MC68HC05B6 Rev. 4.1 C Y PD2 set? m i l re Base address = $400 (EPROM only) P A B PD2 set? N y r a in N Base address = $400 (EPROM only) Y Base address = $400 (EPROM only) y r a in N Base address = $100 (EPROM and EEPROM) P m i l re Data verified? N Red LED on Y Green LED on y r a in Figure H-4 Modes of operation flow chart (2 of 2) P MC68HC05B6 Rev. 4.1 m i l re MC68HC705B32 14 Freescale H-15 H.5.1 Erased EPROM verification y r a in If a non $00 byte is detected, the red LED will be turned on and the routine will stop (see Figure H-3 and Figure H-4). Only when the whole EPROM content is verified as erased will the green LED be turned on. PD1 is then checked. If PD1=0, the bootstrap program stops here and no programming occurs until such time as a high level is sensed on PD1. If PD1 = 1, the bootstrap program proceeds to erase the EEPROM1 for a nominal 2.5 seconds (4.0 MHz crystal). It is then checked for complete erasure; if any EEPROM byte is not erased, the program will stop before erasing the SEC byte. When both EPROM and EEPROM1 are completely erased and the security bit is cleared the programming operation can be performed. A schematic diagram of the circuit required for erased EPROM verification is shown in Figure H-7. H.5.2 m i l e r P EPROM/EEPROM parallel bootstrap Within this mode there are various subsections which can be utilised by correctly configuring the port pins shown in Table H-4. y r a in The erased EPROM verification program will be executed first as described in Section H.5.1. When PD2=0, the programming time is set to 5 milliseconds with the bootstrap program and verify for the EPROM taking approximately 15 seconds. The EPROM will be loaded in increasing address order with non EPROM segments being skipped by the loader. Simultaneous programming is performed by reading sixteen bytes of data before actual programming is performed, thus dividing the loading time of the internal EPROM by 16. If any block of 16 EPROM bytes or 1 EEPROM byte of data is in the erased state, no programming takes place, thus speeding up the execution time. m i l e r P Parallel data is entered through Port A, while the 15-bit address is output on port B, PC0 to PC4 and TCMP1 and TCMP2. If the data comes from an external EPROM, the handshake can be disabled by connecting together PC5 and PC6. If the data is supplied by a parallel interface, handshake will be provided by PC5 and PC6 according to the timing diagram of Figure H-5 (see also Figure H-6). y r a in During programming, the green LED will flash at about 3 Hz. Upon completion of the programming operation, the EPROM and EEPROM1 content will be checked against the external data source. If programming is verified the green LED will stay on, while an error will cause the red LED to be turned on. Figure H-7 is a schematic diagram of a circuit which can be used to program the EPROM or to load and execute data in the RAM. Note: 14 Freescale H-16 m i l e r P The entire EPROM and EEPROM1 can be loaded from the external source; if it is desired to leave a segment undisturbed, the data for this segment should be all $00s for EPROM data and all $FFs for EEPROM1 data. MC68HC705B32 MC68HC05B6 Rev. 4.1 Address HDSK out (PC5) Data HDSK in (PC6) F29 P m i l re y r a in Data read Data read Figure H-5 Timing diagram with handshake tCOOE tCOOE Address tADE tDHE Data P tADE tADE m i l re tDHE y r a in tCOOE tADE max (address to data delay) 5 machine cycles tDHA min (data hold time) 14 machine cycles tDHE tADE tCDDE tDHE tCOOE (load cycle time) 117 machine cycles < tCOOE < 150 machine cycles tCDDE (programming cycle time) tCOOE + tPROG (5ms nominal for EPROM; 10ms for EEPROM1)) 1 machine cycle = 1/(2f0(Xtal)) y r a in Figure H-6 Parallel EPROM loader timing diagram P MC68HC05B6 Rev. 4.1 m i l re MC68HC705B32 14 Freescale H-17 y r a in m i l e r P RESET RUN 1N914 + 100F 1.0F + red LED 470 0.01F 470 TCAP1 VRH VDD IRQ OSC1 RESET OSC2 NC TCMP1 VPP1 PLMA PLMB RDI VRL TCAP2 PD7 PD6 PD5 PD3 PD2 PD1 PD0 Boot green LED red LED -- programming failed green LED -- programming OK Erase check green LED -- EPROM erased red LED -- EPROM not erased 47F 22pF Verify EPROM Erase check & boot y r a in RAM m i l e r P A0 A1 A2 A3 A4 20 CE A5 A6 27C256 A7 D0 D1 D2 D3 D4 D5 D6 D7 GND 14 Note: 14 10 9 8 7 6 5 4 3 11 12 13 15 16 17 18 19 1N5819 EPROM SCLK TDO TCMP2 PC7 BC239C 1nF + 4k7 +5V 100 k HDSK out PC5 PC6 Short circuit if handshake not used A12 A11 A10 A9 A8 y r a in VSS m i l e r P 10k VPP6 4k7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 22 1 k 12 k PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 OE Program EPROM EPROM erase check PD4 1 27 28 VPP PGM VCC A14 26 A13 + 4.0 MHz 22pF MC68HC705B32 MCU +5V A8 A9 A10 A11 A12 GND +5V VPP 1k 1N914 25 24 21 23 2 1 2 3 BC309C 100k P1 PC4 PC3 PC2 PC1 PC0 HDSK in This circuit is recommended for programming only at 25C and not for use in the end application, or at temperatures other than 25C. If used in the end application, VPP6 should be tied to VDD to avoid damaging the device. Figure H-7 EPROM parallel bootstrap schematic diagram Freescale H-18 MC68HC705B32 MC68HC05B6 Rev. 4.1 H.5.3 Serial RAM loader y r a in This mode is similar to the RAM load/execute program for the MC68HC05B6 described in Section 2.2, with the additional features listed below. Table H-4 shows the entry conditions required for this mode. If the first byte is less than $B0, the bootloader behaves exactly as the MC68HC05B6, i.e. count byte followed by data stored in $0050 to $00FF. If the count byte is larger than RAM I (176 bytes) then the code continues to fill RAM II then RAM III. In this case the count byte is ignored and the program execution begins at $0051 once the total RAM area is filled or if no data is received for 5 milliseconds. P m i l re The user must take care when using branches or jumps as his code will be relocated in RAM I, II and III. If the user intends to use the stack in his program, he should send NOP's to fill the desired stack area. In the RAM bootloader mode, all interrupt vectors are mapped to pseudo-vectors in RAM (see Table H-5). This allows programmers to use their own service-routine addresses. Each pseudo-vector is allowed three bytes of space rather than the two bytes for normal vectors, because an explicit jump (JMP) opcode is needed to cause the desired jump to the users service-routine address. y r a in Table H-5 Bootstrap vector targets in RAM m i l re Vector targets in RAM P H.5.3.1 SCI interrupt $0063 Timer overflow $0060 Timer output compare $005D Timer input capture $005A IRQ $0057 SWI $0054 y r a in Jump to start of RAM ($0051) The Jump to start of RAM program will be executed when bring the device out of reset with PD2 and PD3 at `1' and PD4 at `0'. P MC68HC05B6 Rev. 4.1 m i l re MC68HC705B32 14 Freescale H-19 RESET 100k y r a in RUN 10nF 1k 1N914 1.0F + 1N914 22 8 19 IRQ m i l e r P 470 470 1 2 3 GND +5V VPP + 47F 10 TCAP1 VRH VDD 18 RESET OSC1 20 OSC2 Red LED 0.01F P1 21 PLMA 47F + 4.0 MHz 22pF 22pF PLMB Green LED Erase check PD3 MC68HC705B32 MCU (socket) Green LED -- EPROM erased Red LED -- EPROM not erased Serial boot Flashing green LED -- programming Green LED -- programming ended 39 38 37 36 35 34 33 32 m i l e r P 31 30 29 28 27 26 25 24 Erase check and serial boot EPROM erase check 9600 BD 8-bit no parity RS232 Connector PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 22F + 8 5 7 3 2 1 2 x 3K +5V 16 2 22F + 6 MAX 232 13 14 1 3 4 5 12 11 + 22F + 22F 14 13 12 5 4 3 PD0 PD1 PD2 PD5 PD6 PD7 50 RDI 52 TDO VSS 41 14 VPP6 m i l e r P 12 k 4k7 PC7 BC239C 1nF + 4k7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 15 Note: 10k 1 k BC309C Serial boot Erase check & serial boot 1N5819 y r a in PD4 PC6 PC5 PC4 PC3 PC2 PC1 PC0 43 44 45 46 47 48 49 y r a in VPP1 23 TCAP2 2 TCMP1 1 TCMP2 51 SCLK 40 NC VRL 7 A minimum VDD voltage must be applied to the VPP6 pin at all times, including power-on, as a lower voltage could damage the device. Unless otherwise stated, EPROM programming is guaranteed at ambient (25C) temperature only Figure H-8 RAM load and execute schematic diagram Freescale H-20 MC68HC705B32 MC68HC05B6 Rev. 4.1 tCR Address PC5 out tHO m i l e tADR Data PC6 in r P PD4 tDHR y r a in tHI max tEXR max tADR max (address to data delay; PC6=PC5) tDHR min (data hold time) y r a in 16 machine cycles 4 machine cycles tCR (load cycle time; PC6=PC5) m i l re tHO (PC5 handshake out delay) tHI max (PC6 handshake in, data hold time) 49 machine cycles 5 machine cycles 10 machine cycles tEXR max (max delay for transition to be recognised during this cycle; PC6=PC5 P 30 machine cycles 1 machine cycle = 1/(2f0(Xtal)) Figure H-9 Parallel RAM loader timing diagram P MC68HC05B6 Rev. 4.1 m i l re y r a in MC68HC705B32 14 Freescale H-21 H.6 Absolute maximum ratings y r a in Table H-6 Absolute Maximum ratings Symbol Value Unit Supply voltage(1) Rating VDD - 0.5 to +7.0 V Input voltage (Except VPP1 and VPP6) VIN VSS - 0.5 to VDD + 0.5 V Input voltage - Self-check mode (IRQ pin only) VIN VSS - 0.5 to 2VDD + 0.5 V TA TL to TH 0 to +70 -40 to +85 C TSTG - 65 to +150 C ID IS 25 45 mA mA m i l e r P Operating temperature range - Standard (MC68HC705B32) - Extended (MC68HC705B32C) Storage temperature range Current drain per pin (excluding VDD and VSS)(2) - Source - Sink (1) All voltages are with respect to VSS. y r a in (2) Maximum current drain per pin is for one pin at a time, limited by an external resistor. Note: This device contains circuitry designed to protect against damage due to high electrostatic voltages or electric fields. However, it is recommended that normal precautions be taken to avoid the application of any voltages higher than those given in the maximum ratings table to this high impedance circuit. For maximum reliability all unused inputs should be tied to either VSS or VDD. m i l e r P m i l e r P 14 Freescale H-22 y r a in MC68HC705B32 MC68HC05B6 Rev. 4.1 H.7 DC electrical characteristics y r a in Table H-7 DC electrical characteristics for 5V operation (VDD = 5 Vdc 10%, VSS = 0 Vdc, -40 to +85C) Characteristic(1) Output voltage ILOAD = - 10 A ILOAD = +10 A Output high voltage (ILOAD = 0.8mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2 Output high voltage (ILOAD = 1.6mA) TDO, SCLK, PLMA, PLMB Output high voltage (ILOAD = -300A) OSC2 Output low voltage (ILOAD = 1.6mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2, TDO, SCLK, PLMA, PLMB Output low voltage (ILOAD = 1.6mA) RESET Output low voltage (ILOAD = -100A) OSC2 Input high voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, IRQ, RESET, TCAP1, TCAP2, RDI Input low voltage PA0-7, PB0-7, PC0-7, PD0-7,OSC1, IRQ, RESET, TCAP1, TCAP2, RDI Supply current(3) (For Guidance Only) RUN (SM = 0) (See Figure 11-1) RUN (SM = 1) (See Figure 11-2) WAIT (SM = 0) (See Figure 11-3) WAIT (SM = 1) (See Figure 11-4) STOP 0 to 70 (standard) - 40 to 85 (extended) High-Z leakage current PA0-7, PB0-7, PC0-7, TDO, RESET, SCLK Input current Port B and port C pull-down (VIN =VIH) Input current (0 to 70) IRQ, OSC1, TCAP1, TCAP2, RDI, PD0/AN0-PD7/AN7 (channel not selected) Input current (- 40 to 85) IRQ, OSC1, TCAP1, TCAP2, RDI, PD0/AN0-PD7/AN7 (channel not selected) Capacitance Ports (as input or output), RESET, TDO, SCLK IRQ, TCAP1, TCAP2, OSC1, RDI PD0/AN0-PD7/AN7 (A/D off) PD0/AN0-PD7/AN7 (A/D on) r P r P P Min Typ(2) Max Unit VDD - 0.1 -- -- -- -- 0.1 V VDD - 0.8 VDD - 0.4 -- VOH VDD - 0.8 VDD - 0.4 -- VOH VDD - 0.8 VDD - 0.3 -- VOL -- 0.1 0.4 VOL -- 0.4 1 VOL -- TBD -- 0.7VDD -- VDD V VSS -- 0.2VDD V -- -- -- -- 6 1.5 2 1 TBD TBD TBD TBD mA mA mA mA IDD IDD -- -- 10 10 TBD TBD A A IIL -- 0.2 1 A Symbol VOH VOL m i l e VOH VIH VIL m i l e IDD IDD IDD IDD y r a in IRPD IIN IIN m i l re COUT COUT CIN CIN V A 80 y r a in V -- 0.2 1 A -- -- 5 A -- -- -- -- -- -- 12 22 12 8 -- -- pF pF pF pF (1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching currents inherent in CMOS designs (see Section 2). (2) Typical values are at mid point of voltage range and at 25C only. MC68HC05B6 Rev. 4.1 MC68HC705B32 Freescale H-23 14 (3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 2.0 MHz); all inputs 0.2 V from rail; no DC loads; maximum load on outputs 50pF (20pF on OSC2). STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD - 0.2 V: STOP IDD measured with OSC1 = VDD. WAIT IDD is affected linearly by the OSC2 capacitance. y r a in m i l e r P m i l e r P m i l e r P 14 Freescale H-24 y r a in y r a in MC68HC705B32 MC68HC05B6 Rev. 4.1 Table H-8 DC electrical characteristics for 3.3V operation (VDD = 3.3Vdc 10%, VSS = 0Vdc, TA = -40 to +85C) Symbol Characteristic(1) Output voltage ILOAD = - 10 A VOH ILOAD = +10 A VOL Output high voltage (ILOAD = 0.8mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2 VOH Output high voltage (ILOAD = 1.6mA) TDO, SCLK, PLMA, PLMB VOH Output low voltage (ILOAD = 1.6mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2, VOL TDO, SCLK, PLMA, PLMB Output low voltage (ILOAD = 1.6mA) VOL RESET Input high voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, VIH IRQ, RESET, TCAP1, TCAP2, RDI Input low voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, IRQ, VIL RESET, TCAP1, TCAP2, RDI Supply current(3) (For Guidance Only) RUN (SM = 0) (See Figure 11-1) IDD RUN (SM = 1) (See Figure 11-2) IDD WAIT (SM = 0) (See Figure 11-3) IDD WAIT (SM = 1) (See Figure 11-4) IDD STOP 0 to 70 (standard) IDD - 40 to 85 (extended) IDD High-Z leakage current PA0-7, PB0-7, PC0-7, TDO, RESET, SCLK IIL Input current (0 to 70) IRQ, OSC1, TCAP1, TCAP2, RDI, IIN PD0/AN0-PD7/AN7 (channel not selected) Input current (- 40 to 125) IRQ, OSC1, TCAP1, TCAP2, RDI, IIN PD0/AN0-PD7/AN7 (channel not selected) Capacitance Ports (as input or output), RESET, TDO, COUT SCLK COUT IRQ, TCAP1, TCAP2, OSC1, RDI CIN PD0/AN0-PD7/AN7 (A/D off) CIN PD0/AN0-PD7/AN7 (A/D on) r P r P m i l e m i l e m i l re y r a in Min Typ(2) Max Unit VDD - 0.1 -- -- -- -- 0.1 V VDD - 0.3 VDD - 0.1 -- VDD - 0.3 VDD - 0.1 -- -- 0.1 0.3 0.2 0.6 -- VDD 0.7VDD y r a in V V V VSS -- 0.2VDD V -- -- -- -- 3 1 1.5 0.5 TBD TBD TBD TBD mA mA mA mA -- -- 10 10 TBD TBD A A -- 0.2 1 A -- 0.2 1 A -- -- 5 A 12 8 -- -- pF pF pF pF y r a in -- -- -- -- -- -- 12 22 (1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching currents inherent in CMOS designs (see Section 2). (2) Typical values are at mid point of voltage range and at 25C only. (3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 2.0 MHz); all inputs 0.2 V from rail; no DC loads; maximum load on outputs 50pF (20pF on OSC2). STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD - 0.2 V: STOP IDD measured with OSC1 = VDD. WAIT IDD is affected linearly by the OSC2 capacitance. P MC68HC05B6 Rev. 4.1 MC68HC705B32 Freescale H-25 14 H.8 A/D converter characteristics y r a in Table H-9 A/D characteristics for 5V operation (VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = -40 to +85C) Characteristic Parameter Min Max Unit 8 -- Bit Max deviation from the best straight line through the A/D transfer characteristics (VRH = VDD and VRL = 0V) -- 0.5 LSB Quantization error Uncertainty due to converter resolution -- 0.5 LSB Absolute accuracy Difference between the actual input voltage and the full-scale equivalent of the binary code output code for all errors -- 1 LSB m i l e r P Resolution Number of bits resolved by the A/D Non-linearity Conversion range Analog input voltage range VRL VRH V VRH Maximum analog reference voltage VRL VDD + 0.1 V y r a in VRL Minimum analog reference voltage VSS - 0.1 VRH V VR Minimum difference between VRH and VRL 3 -- V Conversion time Total time to perform a single analog to digital conversion a. External clock (OSC1, OSC2) b. Internal RC oscillator -- -- 32 32 tCYC s Monotonicity Conversion result never decreases with an increase in input voltage and has no missing codes Zero input reading Conversion result when VIN = VRL 00 -- Hex Full scale reading Conversion result when VIN = VRH -- FF Hex Sample acquisition time Analog input acquisition sampling a. External clock (OSC1, OSC2) b. Internal RC oscillator(1) -- -- 12 12 tCYC s Sample/hold capacitance Input capacitance on PD0/AN0-PD7/AN7 -- 12 pF Input leakage(2) -- 1 A m i l e r P Input leakage on A/D pins PD0/AN0-PD7/AN7, VRL, VRH GUARANTEED (1) Source impedances greater than 10k will adversely affect internal charging time during input sampling. (2) The external system error caused by input leakage current is approximately equal to the product of R source and input current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2). m i l e r P 14 Freescale H-26 y r a in MC68HC705B32 MC68HC05B6 Rev. 4.1 Table H-10 A/D characteristics for 3.3V operation (VDD = 3.3 Vdc 10%, VSS = 0 Vdc, TA = -40 to +85C) Characteristic Parameter y r a in Min Max Unit 8 -- Bit Max deviation from the best straight line through the A/D transfer characteristics (VRH = VDD and VRL = 0V) -- 1 LSB Quantization error Uncertainty due to converter resolution -- 1 LSB Absolute accuracy Difference between the actual input voltage and the full-scale equivalent of the binary code output code for all errors -- 2 LSB Resolution Number of bits resolved by the A/D Non-linearity r P m i l e Conversion range Analog input voltage range VRL VRH V VRH Maximum analog reference voltage VRL VDD + 0.1 V VRL Minimum analog reference voltage VSS - 0.1 VRH V VR Minimum difference between VRH and VRL 3 -- V Conversion time Total time to perform a single analog to digital conversion Internal RC oscillator -- 32 s Monotonicity Conversion result never decreases with an increase in input voltage and has no missing codes Zero input reading Conversion result when VIN = VRL Full scale reading Conversion result when VIN = VRH Sample acquisition time Analog input acquisition sampling Internal RC oscillator(1) m i l e Sample/hold capacitance Input capacitance on PD0/AN0-PD7/AN7 Input leakage(2) y r a in Input leakage on A/D pins PD0/AN0-PD7/AN7, VRL, VRH r P GUARANTEED 00 -- Hex -- FF Hex -- 12 s -- 12 pF -- 1 A (1) Source impedances greater than 10k will adversely affect internal charging time during input sampling. (2) The external system error caused by input leakage current is approximately equal to the product of R source and input current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2). P MC68HC05B6 Rev. 4.1 m i l re y r a in MC68HC705B32 14 Freescale H-27 H.9 Control timing y r a in Table H-11 Control timing for 5V operation (VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = -40 to +85C) Characteristic Symbol Min Max Unit Frequency of operation Crystal option External clock option fOSC fOSC -- dc 4.2 4.2 MHz MHz Internal operating frequency (fOSC/2) Using crystal Using external clock fOP fOP -- dc 2.1 2.1 MHz MHz Cycle time (see Figure 9-1) tCYC 476 -- ns Crystal oscillator start-up time (see Figure 9-1) tOXOV -- 100 ms ms m i l e r P Stop recovery start-up time (crystal oscillator) tILCH 100 RC oscillator stabilization time tADRC 5 s A/D converter stabilization time tADON 500 s tRL 3.0 -- tCYC Power-on RESET output pulse width 4064 cycle 16 cycle tPORL tPORL 4064 16 -- -- tCYC tCYC Watchdog RESET output pulse width tDOGL 1.5 -- tCYC Watchdog time-out tDOG 6144 7168 tCYC EEPROM byte erase time 0 to 70 (standard) - 40 to 85 (extended) 10 10 -- -- ms ms EEPROM byte program time(1) 0 to 70 (standard) - 40 to 85 (extended) tERA tERA tPROG tPROG 10 10 -- -- ms ms Timer (see Figure H-10) Resolution(2) Input capture pulse width Input capture pulse period tRESL tTH, tTL tTLTL 4 125 --(3) -- -- -- tCYC ns tCYC External RESET input pulse width m i l e r P y r a in Interrupt pulse width (edge-triggered) tILIH 125 -- Interrupt pulse period tILIL --(4) -- tOH, tOL 90 -- OSC1 pulse width(5) Write/Erase endurance(6)(7) Data retention(6)(7) y r a in ns tCYC ns -- 10000 cycles -- 10 years (1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when programming the EEPROM. (2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting factor in determining the timer resolution. (3) The minimum period tTLTL should not be less than the number of cycle times it takes to execute the capture interrupt service routine plus 24 tCYC. (4) The minimum period tILIL should not be less than the number of cycle times it takes to execute the interrupt service routine plus 21 tCYC. (5) tOH and tOL should not total less than 238ns. (6) At a temperature of 85C (7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information. m i l e r P 14 Freescale H-28 MC68HC705B32 MC68HC05B6 Rev. 4.1 Table H-12 Control timing for operation at 3.3V y r a in (VDD = 3.3Vdc 10%, VSS = 0 Vdc, TA = -40 to +85C) Characteristic Frequency of operation Crystal option External clock option r P Min Max Unit fOSC fOSC -- dc 2.0 2.0 MHz MHz fOP fOP -- dc 1.0 1.0 MHz MHz tCYC 1000 -- ns tOXOV -- 100 ms m i l e Internal operating frequency (fOSC/2) Using crystal Using external clock Cycle time (see Figure 9-1) Symbol Crystal oscillator start-up time (see Figure 9-1) Stop recovery start-up time (crystal oscillator) tILCH 100 ms RC oscillator stabilization time tADRC 5 s A/D converter stabilization time tADON 500 s External RESET input pulse width tRL 3.0 -- tCYC Power-on RESET output pulse width 4064 cycle 16 cycle tPORL tPORL 4064 16 -- -- tCYC tCYC Watchdog RESET output pulse width tDOGL 1.5 -- tCYC Watchdog time-out tDOG 6144 7168 tCYC EEPROM byte erase time 0 to 70 (standard) - 40 to 85 (extended) tERA tERA 30 30 -- -- ms ms tPROG tPROG 30 30 -- -- ms ms tRESL tTH, tTL tTLTL 4 250 --(3) -- -- -- tCYC ns tCYC m i l re EEPROM byte program time(1) 0 to 70 (standard) - 40 to 85 (extended) P Timer (see Figure H-10) Resolution(2) Input capture pulse width Input capture pulse period y r a in Interrupt pulse width (edge-triggered) tILIH 250 -- ns Interrupt pulse period tILIL --(4) -- tCYC tOH, tOL 100 -- OSC1 pulse width(5) Write/Erase endurance(6)(7) Data retention(6)(7) y r a in ns -- 10000 cycles -- 10 years (1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when programming the EEPROM. (2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting factor in determining the timer resolution. m i l re (3) The minimum period tTLTL should not be less than the number of cycle times it takes to execute the capture interrupt service routine plus 24 tCYC. (4) The minimum period tILIL should not be less than the number of cycle times it takes to execute the interrupt service routine plus 21 tCYC. P (5) tOH and tOL should not total less than 500ns. 14 (6) At a temperature of 85C (7) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information. MC68HC05B6 Rev. 4.1 MC68HC705B32 Freescale H-29 tTLTL tTH tTL y r a in External signal (TCAP1, TCAP2) m i l e r P Figure H-10 Timer relationship H.10 EPROM electrical characteristics Table H-13 DC electrical characteristics for 5V operation (VDD = 5 Vdc 10%, VSS = 0 Vdc, TA = 25C) Characteristic(1) EPROM Absolute maximum voltage Programming voltage Programming current Read voltage Symbol VPP6 max VPP6 IPP6 VPP6R Typ(2) Min Max y r a in VDD 15 -- VDD -- 15.5 50 VDD 18 16 64 VDD Unit V V mA V (1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching inherent in CMOSBLANK designs (see Section 2). THIScurrents PAGE LEFT INTENTIONALLY m i l e r P (2) Typical values are at mid point of voltage range and at 25C only. Table H-14 Control timing for 5V operation (VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = 25C) Characteristic EPROM programming time Symbol Min Max Unit tPROG 5 20 ms Table H-15 Control timing for 3.3V operation (VDD = 3.3 Vdc 10%, VSS = 0 Vdc, TA = 25C) Characteristic EPROM programming time Min Max Unit tPROG 5 20 ms m i l e r P 14 Freescale H-30 y r a in Symbol MC68HC705B32 MC68HC05B6 Rev. 4.1 I HIGH SPEED OPERATION This section contains the electrical specifications and associated timing information for high speed versions of the MC68HC05B6, MC68HC05B8 and MC68HC05B16 (fOSC max = 8 MHz). The ordering information for these devices is contained in Table I-1. Table I-1 Ordering information Device title MC68HC05B6 MC68HC05B8 MC68HC05B16 Note: Package Suffix 0 to 70C Suffix -40 to +85C 52-pin PLCC FN CFN 64-pin QFP FU CFU 56-pin SDIP B CB 52-pin PLCC FN CFN CFU 64-pin QFP FU 56-pin SDIP B CB 52-pin PLCC FN CFN 64-pin QFP FU CFU 56-pin SDIP B CB The high speed version has the same device title as the standard version. High speed operation is selected via a check-box on the order form and will be confirmed on the listing verification form. MC68HC05B6 Rev. 4.1 HIGH SPEED OPERATION Freescale I-1 15 271 272 273 274 275 I.1 DC electrical characteristics Table I-2 DC electrical characteristics for 5V operation (VDD = 5 Vdc 10%, VSS = 0 Vdc, TA = -40 to +85C) Characteristic(1) Output voltage ILOAD = - 10 A ILOAD = +10 A Output high voltage (ILOAD = 0.8mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2 Output high voltage (ILOAD = 1.6mA) TDO, SCLK, PLMA, PLMB Output low voltage (ILOAD = 1.6mA) PA0-7, PB0-7, PC0-7, TCMP1, TCMP2, TDO, SCLK, PLMA, PLMB Output low voltage (ILOAD = 1.6mA) RESET Input high voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, IRQ, RESET, TCAP1, TCAP2, RDI Input low voltage PA0-7, PB0-7, PC0-7, PD0-7, OSC1, IRQ, RESET, TCAP1, TCAP2, RDI Supply current(3) RUN (SM = 0) (See Figure 11-1) RUN (SM = 1) (See Figure 11-2) WAIT (SM = 0) (See Figure 11-3) WAIT (SM = 1) (See Figure 11-4) STOP 0 to 70 (standard) - 40 to 85 (extended) High-Z leakage current PA0-7, PB0-7, PC0-7, TDO, RESET, SCLK Input current (0 to 70) IRQ, OSC1, TCAP1, TCAP2, RDI, PD0/AN0-PD7/AN7 (channel not selected) Capacitance Ports (as input or output), RESET, TDO, SCLK IRQ, TCAP1, TCAP2, OSC1, RDI PD0/AN0-PD7/AN7 (A/D off) PD0/AN0-PD7/AN7 (A/D on) Symbol Min Typ(2) Max Unit VOH VOL VDD - 0.1 -- -- -- -- 0.1 V VOH VDD - 0.8 -- VOH VDD - 0.8 -- -- -- VOL -- -- -- 0.4 VOL -- -- -- VIH 0.7VDD -- VDD V VIL VSS -- 0.2VDD V IDD -- -- -- -- -- -- -- -- 12 3 4 2 mA mA mA mA -- -- -- -- 10 20 A A IIL -- -- 1 A IIN -- -- -- 5 1 A COUT CIN CIN CIN -- -- -- -- -- -- 12 22 12 8 -- -- pF pF pF pF V -- V 1 (1) All IDD measurements taken with suitable decoupling capacitors across the power supply to suppress the transient switching currents inherent in CMOS designs (see Section 2). (2) Typical values are at mid point of voltage range and at 25C only. (3) RUN and WAIT IDD: measured using an external square-wave clock source (fOSC = 8.0MHz); all inputs 0.2 V from rail; no DC loads; maximum load on outputs 50pF (20pF on OSC2). STOP /WAIT IDD: all ports configured as inputs; VIL = 0.2 V and VIH = VDD - 0.2 V: STOP IDD measured with OSC1 = VDD. WAIT IDD is affected linearly by the OSC2 capacitance. 15 276 Freescale I-2 HIGH SPEED OPERATION MC68HC05B6 Rev. 4.1 I.2 A/D converter characteristics Table I-3 A/D characteristics for 5V operation (VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = -40 to +85C) Min Max Unit Resolution Characteristic Number of bits resolved by the A/D Parameter 8 -- Bit Non-linearity Max deviation from the best straight line through the A/D transfer characteristics (VRH = VDD and VRL = 0V) -- 0.5 LSB Quantization error Uncertainty due to converter resolution -- 0.5 LSB -- 1 LSB Difference between the actual input voltage and Absolute accuracy the full-scale equivalent of the binary code output code for all errors Conversion range Analog input voltage range VRL VRH V VRH Maximum analog reference voltage VRL VDD + 0.1 V Minimum analog reference voltage VSS - 0.1 VRH V VR(1) Minimum difference between VRH and VRL 3 -- V Conversion time Total time to perform a single analog to digital conversion a. External clock (OSC1, OSC2) b. Internal RC oscillator -- -- 32 32 tCYC s Monotonicity Conversion result never decreases with an increase in input voltage and has no missing codes VRL GUARANTEED Zero input reading Conversion result when VIN = VRL 00 -- Hex Conversion result when VIN = VRH -- FF Hex Analog input acquisition sampling Sample acquisition a. External clock (OSC1, OSC2) time b. Internal RC oscillator(2) -- -- 12 12 tCYC s Full scale reading Sample/hold capacitance Input capacitance on PD0/AN0-PD7/AN7 -- 12 pF Input leakage(3) Input leakage on A/D pins PD0/AN0-PD7/AN7 VRL, VRH -- -- 1 1 A A (1) Performance verified down to 2.5V VR, but accuracy is tested and guaranteed at VR = 5V10%. (2) Source impedances greater than 10k will adversely affect internal charging time during input sampling. (3) The external system error caused by input leakage current is approximately equal to the product of R source and input current. Input current to A/D channel will be dependent on external source impedance (see Figure 8-2). MC68HC05B6 Rev. 4.1 HIGH SPEED OPERATION Freescale I-3 15 I.3 Control timing for 5V operation (VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = -40 to +85C) Symbol Min Max Unit Frequency of operation Crystal option External clock option Characteristic fOSC fOSC -- dc 8.0 8.0 MHz MHz Internal operating frequency (fOSC/2) Crystal External clock fOP fOP -- dc 4.0 4.0 MHz MHz Cycle time (see Figure 9-1) tCYC 250 -- ns Crystal oscillator start-up time (see Figure 9-1) tOXOV -- 100 ms Stop recovery start-up time (crystal oscillator) tILCH 100 ms tRL 1.5 -- tCYC Power-on RESET output pulse width 4064 cycle 16 cycle tPORL tPORL 4064 16 -- -- tCYC tCYC Watchdog RESET output pulse width tDOGL 1.5 -- tCYC Watchdog time-out tDOG 6144 7168 tCYC EEPROM byte erase time 0 to 70 (standard) - 40 to 85 (extended) 10 10 -- -- ms ms EEPROM byte program time(1) 0 to 70 (standard) - 40 to 85 (extended) tERA tERA tPROG tPROG 10 10 -- -- ms ms Timer (see Figure I-1) Resolution(2) Input capture pulse width Input capture pulse period tRESL tTH, tTL tTLTL 4 125 --(3) -- -- -- tCYC ns tCYC External RESET input pulse width Interrupt pulse width (edge-triggered) tILIH 125 -- ns Interrupt pulse period tILIL --(4) -- tCYC tOH, tOL 90 -- OSC1 pulse width Write/Erase endurance(5)(6) Data retention(5)(6) ns -- 10000 cycles -- 10 years (1) For bus frequencies less than 2 MHz, the internal RC oscillator should be used when programming the EEPROM. (2) Since a 2-bit prescaler in the timer must count four external cycles (tCYC), this is the limiting factor in determining the timer resolution. (3) The minimum period tTLTL should not be less than the number of cycle times it takes to execute the capture interrupt service routine plus 24 tCYC. (4) The minimum period tILIL should not be less than the number of cycle times it takes to execute the interrupt service routine plus 21 tCYC. (5) At a temperature of 85C (6) Refer to Reliability Monitor Report (current quarterly issue) for current failure rate information. 15 Freescale I-4 HIGH SPEED OPERATION MC68HC05B6 Rev. 4.1 tTLTL tTH tTL External signal (TCAP1, TCAP2) Figure I-1 Timer relationship MC68HC05B6 Rev. 4.1 HIGH SPEED OPERATION Freescale I-5 15 THIS PAGE LEFT BLANK INTENTIONALLY 15 Freescale I-6 HIGH SPEED OPERATION MC68HC05B6 Rev. 4.1 GLOSSARY This section contains abbreviations and specialist words used in this data sheet and throughout the industry. Further information on many of the terms may be gleaned from Freescale's M68HC11 Reference Manual, M68HC11RM/AD, or from a variety of standard electronics text books. $xxxx The digits following the `$' are in hexadecimal format. %xxxx The digits following the `%' are in binary format. A/D, ADC Analog-to-digital (converter). Bootstrap mode In this mode the device automatically loads its internal memory from an external source on reset and then allows this program to be executed. Byte Eight bits. CCR Condition codes register; an integral part of the CPU. CERQUAD A ceramic package type, principally used for EPROM and high temperature devices. Clear `0' -- the logic zero state; the opposite of `set'. CMOS Complementary metal oxide semiconductor. A semiconductor technology chosen for its low power consumption and good noise immunity. COP Computer operating properly. aka `watchdog'. This circuit is used to detect device runaway and provide a means for restoring correct operation. CPU Central processing unit. D/A, DAC Digital-to-analog (converter). EEPROM Electrically erasable programmable read only memory. aka `EEROM'. EPROM Erasable programmable read only memory. This type of memory requires exposure to ultra-violet wavelengths in order to erase previous data. aka `PROM'. ESD Electrostatic discharge. Expanded mode In this mode the internal address and data bus lines are connected to external pins. This enables the device to be used in much more complex systems, where there is a need for external memory for example. TPG MC68HC05B6 GLOSSARY Freescale i 277 EVS Evaluation system. One of the range of platforms provided by Freescale for evaluation and emulation of their devices. HCMOS High-density complementary metal oxide semiconductor. A semiconductor technology chosen for its low power consumption and good noise immunity. I/O Input/output; used to describe a bidirectional pin or function. Input capture (IC) This is a function provided by the timing system, whereby an external event is `captured' by storing the value of a counter at the instant the event is detected. Interrupt This refers to an asynchronous external event and the handling of it by the MCU. The external event is detected by the MCU and causes a predetermined action to occur. IRQ Interrupt request. The overline indicates that this is an active-low signal format. K byte A kilo-byte (of memory); 1024 bytes. LCD Liquid crystal display. LSB Least significant byte. M68HC05 Freescale's family of 8-bit MCUs. MCU Microcontroller unit. MI BUS Interconnect bus. A single wire, medium speed serial communications protocol. MSB Most significant byte. Nibble Half a byte; four bits. NRZ Non-return to zero. Opcode The opcode is a byte which identifies the particular instruction and operating mode to the CPU. See also: prebyte, operand. Operand The operand is a byte containing information the CPU needs to execute a particular instruction. There may be from 0 to 3 operands associated with an opcode. See also: opcode, prebyte. Output compare (OC) This is a function provided by the timing system, whereby an external event is generated when an internal counter value matches a predefined value. PLCC Plastic leaded chip carrier package. PLL Phase-locked loop circuit. This provides a method of frequency multiplication, to enable the use of a low frequency crystal in a high frequency circuit. Prebyte This byte is sometimes required to qualify an opcode, in order to fully specify a particular instruction. See also: opcode, operand. TPG Freescale ii GLOSSARY MC68HC05B6 278 Pull-down, pull-up These terms refer to resistors, sometimes internal to the device, which are permanently connected to either ground or VDD. PWM Pulse width modulation. This term is used to describe a technique where the width of the high and low periods of a waveform is varied, usually to enable a representation of an analog value. QFP Quad flat pack package. RAM Random access memory. Fast read and write, but contents are lost when the power is removed. RFI Radio frequency interference. RTI Real-time interrupt. ROM Read-only memory. This type of memory is programmed during device manufacture and cannot subsequently be altered. RS-232C A standard serial communications protocol. SAR Successive approximation register. SCI Serial communications interface. Set `1' -- the logic one state; the opposite of `clear'. Silicon glen An area in the central belt of Scotland, so called because of the concentration of semiconductor manufacturers and users found there. Single chip mode In this mode the device functions as a self contained unit, requiring only I/O devices to complete a system. SPI Serial peripheral interface. Test mode This mode is intended for factory testing. TTL Transistor-transistor logic. UART Universal asynchronous receiver transmitter. VCO Voltage controlled oscillator. Watchdog see `COP'. Wired-OR A means of connecting outputs together such that the resulting composite output state is the logical OR of the state of the individual outputs. Word Two bytes; 16 bits. XIRQ Non-maskable interrupt request. The overline indicates that this has an active-low signal format. TPG MC68HC05B6 GLOSSARY Freescale iii 279 THIS PAGE LEFT BLANK INTENTIONALLY TPG Freescale iv GLOSSARY MC68HC05B6 280 INDEX In this index numeric entries are placed first; page references in italics indicate that the reference is to a figure. A A/D converter block diagram 8-2 during STOP mode 8-6 during WAIT mode 8-6 operation 8-1 registers ADDATA 8-3 ADSTAT 8-4 PORTD 8-3 A/D converter characteristics 11-8 11-9 E-24 E-25 F-22 F-23 H-25 H-26 I-3 A/D status/control register ADON 4-5 absolute maximum ratings 11-1 ADDATA - A/D result data register 8-3 ADON - A/D converter on 8-5 ADON - A/D converter on bit 4-5 ADRC - A/D RC oscillator control 8-4 ADSTAT ADON 8-5 ADRC 8-4 CH3-CH0 8-5 COCO 8-4 ADSTAT - A/D status/control register 8-4 alternate counter register 5-3 analog input 8-6 , , B Baud rate register SCP1, SCP0 6-18 SCR2, SCR1, SCR0 6-19 SCT2, SCT1, SCT0 6-18 block diagrams MC68HC05B16 D-3 MC68HC05B32 G-2 MC68HC05B4 A-2 MC68HC05B8 B-2 MC68HC705B16 E-2 MC68HC705B16N F-2 MC68HC05B6 , , , , , MC68HC705B32 H-4 MC68HC705B5 C-2 PLM system 7-1 programmable timer 5-2 SCI 6-2 6-2 watchdog system 9-3 bootstrap mode C-8 E-10 H-12 , , , , C ceramic resonator 2-11 CH3-CH0 - A/D channels 3, 2, 1 and 0 8-5 COCO - Conversion complete flag 8-4 control timing 11-10 11-11 C-19 E-26 E-27 F-24 F-25 H-27 H-28 I-4 COP watchdog 9-3 during STOP mode 9-4 during WAIT mode 9-4 counter 5-1 counter register 5-3 CPHA - Clock phase 6-12 CPOL - Clock polarity 6-12 crystal 2-11 , , , , , , , , , D data direction registers DDRA, DDRB, DDRC 4-5 data format 6-5 DC electrical characteristics 11-2 11-5 C-19 E-22 E-23 F-20 F-21 H-23 H-24 I-2 , E , , , , , , , , , , E1ERA - EEPROM erase/programming bit 3-3 E-7 F-7 H-9 E1LAT - EEPROM programming latch enable 3-4 E1LAT - EEPROM programming latch enable bit E-7 F-7 H-10 , , INDEX , Freescale v 281 282 283 284 285 , E1PGM - EEPROM charge pump enable/disable 3-4 E-7 F-7 H-10 E6LAT - EPROM programming latch enable bit E-6 F-6 H-9 E6PGM - EPROM program enable bit E-6 F-6 H-9 ECLK - External clock output bit 4-3 EE1P - EEPROM protect bit E-9 F-9 EE1P - EEPROM protection bit H-12 EEPROM 3-1 3-3 erase operation 3-5 programming operation 3-6 read operation 3-5 STOP mode 3-7 WAIT mode 3-7 EEPROM control register E1ERA 3-3 E1LAT 3-4 E1PGM 3-4 ECLK 3-3 EEPROM options register EE1P E-9 F-9 SEC E-9, F-9 EEPROM/ECLK control ECLK 4-3 ELAT - EPROM programming latch enable bit C-6 EPGM - EPROM programming bit C-6 EPP - EPROM protect C-7 EPPT - EPROM protect test bit C-6 EPROM 13-2 C-5 E-5 F-5 control register C-6 E-6 F-6 options register C-7 program operation E-5 F-6 H-8 programming operation C-5 read operation E-5 F-5 H-8 EPROM control register ELAT C-6 EPGM C-6 EPPT C-6 EPROM electrical characteristics E-28 F-26 H-29 EPROM registers C-6 EPROM/EEPROM/ECLK control register E1ERA E-7 F-7 E1LAT E-7 F-7 E1PGM E-7 F-7 E6LAT E-6 F-6 E6PGM E-6 F-6 external clock 2-12 D-4 E-5 F-5 G-2 external interrupt 9-7 , , , , , , , , , , , , , , , , , , F FE - Framing error flag 6-17 H high speed operation I-1 I I/O pin states 4-2 I/O port structure 4-2 4-2 ICF1 - Input capture flag 1 5-6 ICF2 - Input capture flag 2 5-7 IDLE - Idle line detect flag 6-16 IEDG1 - Input edge 1 5-5 ILIE - Idle line interrupt enable 6-14 Input capture registers ICR1 5-7 ICR2 5-8 input/output programming 4-1 INTE - External interrupt enable 3-9 9-9 interrupts priorities 9-6 SCI 9-10 SWI 9-6 INTP, INTN - External interrupt sensitivity options 3-9 9-9 IRQ 9-7 IRQ sensitivity 9-9 , , , L LBCL - Last bit clock 6-13 low power modes SLOW 2-9 STOP 2-6 WAIT 2-8 , , , , , , , , , , , M M - Mode 6-11 Mask option register PBPD E-8 F-8 H-11 PCPD E-8 F-9 H-11 RTIM E-8 F-8 H-11 RWAT E-8 F-8 H-11 WWAT E-8 F-8 H-11 mask options MC68HC05B6 1-3 maskable hardware interrupts 9-7 maskset errata D-1 H-1 MC68HC05B16 D-1 block diagram D-3 memory map D-5 MC68HC05B32 G-1 block diagram G-2 memory map G-3 MC68HC05B4 block diagram A-2 memory map A-3 MC68HC05B6 block diagram 1-3 mask options 1-3 memory map 3-2 pinouts 12-1 12-2 12-3 , , , , , , , , , , , , , 286 Freescale vi INDEX MC68HC05B6 MC68HC05B8 B-1 block diagram B-2 memory map B-3 MC68HC705B16 E-1 block diagram E-2 memory map E-3 MC68HC705B16N F-1 block diagram F-2 memory map F-3 MC68HC705B32 H-3 block diagram H-4 memory map H-5 MC68HC705B5 C-1 block diagram C-2 memory map C-3 mechanical dimensions 12-4 12-5 12-6 memory map MC68HC05B16 D-5 MC68HC05B32 G-3 MC68HC05B4 A-3 MC68HC05B6 3-2 MC68HC05B8 B-3 MC68HC705B16 E-3 MC68HC705B16N F-3 MC68HC705B32 H-5 MC68HC705B5 C-3 Miscellaneous register INTE 3-9 9-9 INTP, INTN 3-9 9-9 POR 3-9 9-2 SFA 3-10 7-3 SFB 3-10 7-3 SM 2-9 3-10 7-3 WDOG 3-10 9-4 modes of operation jump to any address 2-4 low power modes 2-6 single chip mode 2-1 , , , , , , , , , , N NF - Noise error flag 6-17 nonmaskable software interrupt 9-6 O OCF1 - Output compare flag 2 5-6 OCF2 - Output compare flag 2 5-7 OCIE - Output compares interrupt enable 5-4 OLV1 - Output level 1 5-5 OLV2 - Output level 2 5-5 Options register SEC H-12 options register EE1P H-12 EPP C-7 PBPD C-8 MC68HC05B6 PCPD C-8 RTIM C-7 RWAT C-7 WWAT C-7 OPTR - options register 3-6 C-7 EE1P - EEPROM protection bit 3-7 SEC - Security bit 3-7 OR - Overrun error flag 6-17 oscillator connections 2-12 D-4 Output compare registers OCR1 5-9 OCR2 5-10 , , P , , , , , parallel bootstrap E-13 E-19 F-13 H-16 PBPD - Port B pull-down E-8 F-8 PBPD - Port B pull-down resistors C-8 PCPD - Port C pull-down E-8 F-9 PCPD - Port C pull-down resistors C-8 pin configurations 12-1 pins IRQ 2-10 OSC1, OSC2 2-11 PA0-PA7, PB0-PB7, PC0-PC7 2-13 PD0/AN0-PD7/AN7 2-13 PLMA, PLMB 2-13 RDI, TDO 2-13 RESET 2-10 9-3 SCLK 2-13 TCAP1 2-10 TCAP2 2-11 TCMP1, TCMP2 2-11 VDD, VSS 2-10 VPP1 2-13 VRH, VRL 2-13 PLCC 12-1 PLM 5-11 block diagram 7-1 clock selection 7-4 PLMA, PLMB 7-2 POR - Power-on reset bit 3-9 9-2 port registers PORTA, PORTB 4-4 PORTC 4-4 PORTD 4-5 PORTD - Port D data register 8-3 ports A and B 4-2 C 4-3 D 4-3 power-on reset 9-2 programmable timer block diagram 5-2 Pulse 5-11 pulse length modulation 5-11 registers PLMA, PLMB 5-11 , , INDEX Freescale vii pulse length modulation registers PLMA, PLMB 5-11 Q QFP 12-2 R R8 - Receive data bit 8 6-11 RAM 3-1 RDI 6-6 RDRF - Receive data register full flag 6-16 RE - receiver enable 6-15 receive data in 6-6 receiver 6-3 register outline 3-8 registers 3-1 RESET 9-3, E-5, F-5 reset timing diagram 9-1 resets 9-1 RIE - receiver interrupt enable 6-14 ROM 3-1 RTIM - Reset time C-7 E-8 F-8 RVU 13-2 RWAT - Watchdog after reset C-7 E-8 F-8 RWU - receiver wake-up 6-15 , , , , , SBK - Send break 6-15 SCI block diagram 6-2 receiver 6-3 sampling technique 6-7 synchronous transmission 6-9 transmitter 6-3 two-wire system 6-1 SCI interrupts 9-10 SCI registers BAUD 6-18 SCCR1 6-10 SCCR2 6-14 SCDR 6-10 SCSR 6-16 SCP1, SCP0 - Serial prescaler select bits 6-18 SCR2, SCR1, SCR0 - SCI rate select bits 6-19 SCT2, SCT1, SCT0 - SCI rate select bits 6-18 SDIP 12-3 SEC - Secure bit E-9 F-9 H-12 self-check mode A-5 self-check ROM 3-2 serial bootstrap E-16 Serial communications control register 1 6-10 CPHA 6-12 CPOL 6-12 , , , , , , , S Freescale viii LBCL 6-13 M 6-11 R8 6-11 T8 6-11 WAKE 6-11 Serial communications control register 2 ILIE 6-14 RE 6-15 RIE 6-14 RWU 6-15 SBK 6-15 TCIE 6-14 TE 6-14 TIE 6-14 Serial communications data register 6-10 Serial communications status register FE 6-17 IDLE 6-16 NF 6-17 OR 6-17 RDRF 6-16 TC 6-16 TDRE 6-16 serial RAM loader 2-2 F-16 H-19 SFA - Slow or fast mode selection for PLMA 3-10 7-3 SFB - Slow or fast mode selection for PLMB 3-10 7-3 single chip mode 2-1 SLOW 2-9 SM - Slow mode 3-10 7-3 SM - slow mode selection bit 2-9 start bit detection 6-6 STOP 2-6 3-7 5-12 6-21 7-4 8-6 9-4 , , , , , T T8 - transmit data bit 8 6-11 TC - Transmit complete flag 6-16 TCIE - Transmit complete interrupt enable 6-14 TDO 6-8 TDRE - Transmit data register empty flag 6-16 TE - Transmitter enable 6-14 TIE - Transmit interrupt enable 6-14 Timer control register IEDG1 5-5 OCIE 5-4 OLV1 5-5 OLV2 5-5 TOIE 5-4 timer interrupts 9-10 timer state diagrams 5-12 Timer status register ICF1 5-6 ICF2 5-7 OCF1 5-6 OCF2 5-7 TOF 5-6 TOF - Timer overflow status flag 5-6 TOIE - Timer overflow interrupt enable 5-4 transmit data out 6-8 INDEX MC68HC05B6 transmitter 6-3 TSR - Timer status register 5-6 V verification media 13-2 W , , , , , , WAIT 2-8 3-7 5-12 6-21 7-4 8-6 9-4 WAKE - Wake-up mode select 6-11 wake-up address mark 6-6 idle line 6-6 receiver 6-5 WDOG - Watchdog enable/disable 3-10 9-4 WWAT - Watchdog during WAIT mode C-7 E-8 F-8 , MC68HC05B6 , , INDEX Freescale ix THIS PAGE LEFT BLANK INTENTIONALLY Freescale x INDEX MC68HC05B6 CUSTOMER FEEDBACK QUESTIONNAIRE (MC68HC05B6/D rev. 4) Motorola wishes to continue to improve the quality of its documentation. 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TPG - Finally, tuck this edge into opposite flap - 288 INTRODUCTION 1 MODES OF OPERATION AND PIN DESCRIPTIONS 2 MEMORY AND REGISTERS 3 INPUT/OUTPUT PORTS 4 PROGRAMMABLE TIMER 5 SERIAL COMMUNICATIONS INTERFACE 6 PULSE LENGTH D/A CONVERTERS 7 ANALOG TO DIGITAL CONVERTER 8 RESETS AND INTERRUPTS 9 CPU CORE AND INSTRUCTION SET 10 ELECTRICAL SPECIFICATIONS 11 MECHANICAL DATA 12 ORDERING INFORMATION 13 APPENDICES 14 HIGH SPEED OPERATION 15 TPG 289 1 INTRODUCTION 2 MODES OF OPERATION AND PIN DESCRIPTIONS 3 MEMORY AND REGISTERS 4 INPUT/OUTPUT PORTS 5 PROGRAMMABLE TIMER 6 SERIAL COMMUNICATIONS INTERFACE 7 PULSE LENGTH D/A CONVERTERS 8 ANALOG TO DIGITAL CONVERTER 9 RESETS AND INTERRUPTS 10 CPU CORE AND INSTRUCTION SET 11 ELECTRICAL SPECIFICATIONS 12 MECHANICAL DATA 13 ORDERING INFORMATION 14 APPENDICES 15 HIGH SPEED OPERATION TPG 290 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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