This is information on a product in full production.
March 2012 Doc ID022576 Rev 3 1/26
26
VNI4140K-32
Quad high side smart power solid state relay
Datasheet − production data
Features
■Output current: 1 A per channel
■Shorted load protections
■Junction overtemperature protection
■Case overtemperature protection for thermal
independence of the channels
■Thermal case shutdown restart not
simultaneous for the various channels
■Protection against loss of ground
■Current limitation
■Undervoltage shutdown
■Open drain diagnostic outputs
■3.3 V CMOS/TTL compatible inputs
■Fast demagnetization of inductive loads
■Conforms to IEC 61131-2
■ESD according to IEC 61000-4-2 up to +/-
25 KV
Description
The VNI4140K-32 is a monolithic device made
using STMicroelectronics VIPower technology,
intended for driving four independent resistive,
capacitive or inductive loads with one side
connected to ground. Active current limitation
avoids the system power supply dropping in the
case of shorted load. Built-in thermal shutdown
protects the chip from overtemperature and short-
circuit. In overload condition, the channel turns
OFF and back ON automatically so as to maintain
junction temperature between TTSD and TR. If this
condition causes case temperature to reach
TCSD, the overloaded channel is turned OFF and
restarts only when case temperature has
decreased down to TCR. In the case of more than
one channel in overload, re-start of the
overloaded channels is not simultaneous, in order
to avoid high peak current from the supply. Non-
overloaded channels continue to operate
normally. The open drain diagnostic outputs
indicate overtemperature conditions.
Figure 1. Block diagram
Type Vdemag(1)
1. Per channel
RDSon(1) Iout(1) VCC
VNI4140K-32 VCC-41 V 0.08 Ω1 A 41 V
PowerSSO-24
www.st.com
Contents VNI4140K-32
2/26 Doc ID022576 Rev 3
Contents
1 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Recommended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6 Thermal management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7 Switching waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
8 Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
9 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
9.1 VNI4140K-32 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
10 Reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
11 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
12 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
VNI4140K-32 Pin connection
Doc ID022576 Rev 3 3/26
1 Pin connection
Figure 2. Pin connection (top view)
Table 1. Pin description
Pin Name Description
Tab TAB Exposed tab internally connected to Vcc
1 Vcc Supply voltage
2 IN1 Channel 1 input 3.3 V CMOS/TTL compatible
3 STAT1 Channel 1 status in open drain configuration
4 IN2 Channel 2 input 3.3 V CMOS/TTL compatible
5 STA2 Channel 2 status in open drain configuration
6 GND Device ground connection
7 STAT3 Channel 3 status in open drain configuration
8 IN3 Channel 3 input 3.3 V CMOS/TTL compatible
9 STAT4 Channel 4 status in open drain configuration
10 IN4 Channel 4 input 3.3 V CMOS/TTL compatible
11 NC
12 NC
13 OUT4 Channel 4 power stage output, internally protected
14 OUT4 Channel 4 power stage output, internally protected
15 OUT4 Channel 4 power stage output, internally protected
16 OUT3 Channel 3 power stage output, internally protected
17 OUT3 Channel 3 power stage output, internally protected
OUT1
OUT1
OUT1
OUT2
OUT2
OUT2
VCC
IN1
STAT1
IN2
STAT2
GND
OUT3
OUT3
OUT3
OUT4
OUT4
OUT4
STAT3
IN3
STAT4
NC
NC
IN4
Pin connection VNI4140K-32
4/26 Doc ID022576 Rev 3
Pin Name Description
18 OUT3 Channel 3 power stage output, internally protected
19 OUT2 Channel 2 power stage output, internally protected
20 OUT2 Channel 2 power stage output, internally protected
21 OUT2 Channel 2 power stage output, internally protected
22 OUT1 Channel 1 power stage output, internally protected
23 OUT1 Channel 1 power stage output, internally protected
24 OUT1 Channel 1 power stage output, internally protected
Table 1. Pin description (continued)
VNI4140K-32 Maximum ratings
Doc ID022576 Rev 3 5/26
2 Maximum ratings
2.1 Thermal data
3 Recommended
Table 2. Absolute maximum rating
Symbol Parameter Value Unit
VCC Power supply voltage 41 V
-VCC Reverse supply voltage -0.3 V
IGND DC ground reverse current -250 mA
IOUT Output current (continuos) Internally limited A
IRReverse output current (per channel) -5 A
IIN Input current (per channel) ± 10 mA
VIN Input voltage +VCC V
VSTAT Status pin voltage +VCC V
ISTAT Status pin current ± 10 mA
VESD Electrostatic discharge (R = 1.5 kΩ; C = 100 pF) 2000 V
EAS
Single pulse avalanche energy per channel not
simultaneous 300 mJ
PTOT Power dissipation at Tc = 25 °C Internally limited W
TJJunction operating temperature Internally limited °C
TSTG Storage temperature -55 to 150 °C
Table 3. Thermal data
Symbol Parameter Value Unit
Rth(JC) Thermal resistance junction-case (1)
1. Per channel.
Max. 2 °C/W
Rth(JA) Thermal resistance junction-ambient Max. see Figure 11 °C/W
Table 4. Input switching limits
Symbol Parameter Value Unit
fVin MAX Maximum input switching frequency 10 kHz
Electrical characteristics VNI4140K-32
6/26 Doc ID022576 Rev 3
4 Electrical characteristics
10.5 V < VCC < 36 V; -40 °C < TJ < 125 °C; unless otherwise specified.
VCC = 24 V; -25 °C < TJ < 125 °C, RL = 48 Ω, input rise time < 0.1 µs)
Table 5. Power section
Symbol Parameter Test condition Min. Typ. Max. Unit
Vcc Supply voltage 10.5 36 V
RDS(ON) ON state resistance IOUT = 0.7 A at TJ = 25 °C
IOUT = 0.7 A
0.080
0.140
Ω
Ω
Vclamp Is = 20 mA 41 45 52 V
ISSupply current All channels in OFF state,
ON state with VIN = 5 V
250
2.4 4
µA
mA
VOUT(OFF)
OFF state output
voltage VIN = 0 V and IOUT = 0 A 1 V
IOUT(OFF)
OFF state output
current VIN = VOUT = 0 V 0 5 µA
ILGND
Output current in
ground disconnection
Vcc= VIN = GND = 24 V;
TJ = 125 °C 500 µA
FCP
Charge pump
frequency Channel in ON state (1)
1. To cover EN55022 class A and class B normative.
1450 kHz
Table 6. Switching
Symbol Parameter Test condition Min. Typ. Max. Unit
td(ON) Tu r n O N d elay 6 µS
trRise time 5 µS
td(OFF) Turn OFF 12 µS
tfFall time 5 µS
dV/dt(ON) Turn ON voltage slope 4 V/µS
dV/dt(off) Turn OFF voltage
slope 4V/µS
VNI4140K-32 Electrical characteristics
Doc ID022576 Rev 3 7/26
Figure 3. Switching parameter conventions
D6D4nT
RISET
FALL
TFTR
D6/.
D6/&&



6OUT
T
TD/.T
D/&&



TD/. TD/&& T
6IN
6OUT
T
Electrical characteristics VNI4140K-32
8/26 Doc ID022576 Rev 3
Table 7. Logical input
Symbol Parameter Test conditions Min. Typ. Max. Unit
VIL Input low level voltage 0.8 V
VIH Input high level voltage 2.20 V
VI(HYST)
Input hysteresis
voltage 0.15 V
IIN Input current VIN = 15 V 10
µΑ
VIN = 36 V 210
Table 8. Protection and diagnostic
Symbol Parameter Test conditions Min. Typ. Max. Unit
vSTAT
Status voltage
output low ISTAT = 1.6 mA 0.6 V
VUSD
Undervoltage
protection 710.5V
VUSDHYS
Undervoltage
hysteresis 0.4 0.5 V
ILIM
DC short-circuit
current VCC = 24 V; RLOAD < 10 mΩ1.01 2.6 A
IPEAK
Maximum DC output
current Dynamic load 1.6 A
ILSTAT Status leakage current VCC = VSTAT = 36 V 30 µΑ
TTSD
Junction shutdown
temperature 150 170 190 °C
TR
Junction reset
temperature 135 °C
THIST
Junction thermal
hysteresis 715 °C
TCSD
Case shutdown
temperature 125 130 135 °C
TCR
Case reset
temperature
110 °C
TCHYST
Case thermal
hysteresis 715 °C
Vdemag
Output voltage at
turn-OFF IOUT = 0.5 A; LLOAD >= 1 mH VCC-
41
VCC-
45
VCC-
52 V
VNI4140K-32 Electrical characteristics
Doc ID022576 Rev 3 9/26
Figure 4. Current and voltage conventions
Truth table VNI4140K-32
10/26 Doc ID022576 Rev 3
5 Truth table
Table 9. Truth table
Conditions INPUTn OUTPUTn STATUSn
Normal operation L
H
L
H
H
H
Overtemperature L
H
L
L
H
L
Undervoltage L
H
L
L
X
X
Shorted load
(Current limitation before thermal shutdown)
L
H
L
X
H
H
VNI4140K-32 Thermal management
Doc ID022576 Rev 3 11/26
6 Thermal management
The power dissipation in the IC is the main factor that sets the safe operating condition of
the device in the application. Therefore, it must be very carefully considered. Furthermore,
the available space on the PCB should be chosen considering the power dissipation.
Heatsinking can be achieved using copper on the PCB with proper area and thickness. Two
different protections have been implemented to guarantee safety of the device if it overheats
due to an overloaded condition or high environment temperature. The following flowchart
explains in detail this protection functionality.
Figure 5. Thermal behavior
NO
Tj ( i ) > Tt s d
Vi n ( i ) = H
OUT(i) Off
STAT(i) On (L)
Tc > Tc s d
NO
YES
NOYES
Tc > Tc r
YES
NO
Tj(i) > Tjr
YES
STAT(i) Off (H)
OUT(i) On
1)
4)
2)
3)
Switching waveforms VNI4140K-32
12/26 Doc ID022576 Rev 3
7 Switching waveforms
Figure 6. Switching waveforms
VNI4140K-32 Pin functions
Doc ID022576 Rev 3 13/26
8 Pin functions
Figure 7. Input circuit
Figure 8. Status circuit
Pin functions VNI4140K-32
14/26 Doc ID022576 Rev 3
Figure 9. Charge pump switching frequency (typical) vs. temperature
Freq_CP
800
1000
1200
1400
1600
1800
2000
-50 0 50 100 150 200
temperature("C)
CP_frequency (KHz)
Freq_CP
VNI4140K-32 Package and PCB thermal data
Doc ID022576 Rev 3 15/26
9 Package and PCB thermal data
9.1 VNI4140K-32 thermal data
Figure 10. VNI4140K-32 PCB
Note: Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias,
FR4 area = 77 mm x 86 mm, PCB thickness=1.6 mm, Cu thickness = 70 mm (front and back
side), Copper areas: from minimum pad layout to 8 cm2).
Figure 11. RthJA vs. PCB copper area in open box free air condition (one channel ON)
Package and PCB thermal data VNI4140K-32
16/26 Doc ID022576 Rev 3
Figure 12. VNI4140K-32 thermal impedance junction ambient single pulse
(one channel ON)
VNI4140K-32 Reverse polarity protection
Doc ID022576 Rev 3 17/26
10 Reverse polarity protection
This schematic can be used with any type of load.
The following is an indication on how to dimension the RGND resistor.
RGND = (-VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
Power dissipation in RGND (when VCC < 0: during reverse polarity situations) is:
PD = (-VCC)2/RGND
Note: In normal conditions (no reverse polarity) due to the diode there is a voltage drop between
GND of the device and GND of the system.
Figure 13. Reverse polarity protection
Statusi
Inputi
GND
Outputi
+ Vcc
RGND
Load
Diode
Statusi
Inputi
GND
Outputi
+ Vcc
RGND
Load
Diode
Package mechanical data VNI4140K-32
18/26 Doc ID022576 Rev 3
11 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at:www.st.com.
ECOPACK® is an ST trademark.
VNI4140K-32 Package mechanical data
Doc ID022576 Rev 3 19/26
Figure 14. PowerSSO-24 package dimensions
Table 10. PowerSSO-24 mechanical data
Symbol
mm
Min. Typ. Max.
A 2.15 2.47
A2 2.15 2.40
a1 0 0.075
b 0.33 0.51
c 0.23 0.32
D 10.10 10.50
E 7.4 7.6
e 0.8
e3 8.8
G 0.1
G1 0.06
H 10.1 10.5
h 0.4
L 0.55 0.85
N 10deg
X 4.1 4.7
Y 6.5 7.1
Package mechanical data VNI4140K-32
20/26 Doc ID022576 Rev 3
Figure 15. PowerSSO-24 tube shipment (no suffix)
Note: All dimensions are in mm.
Table 11. PowerSSO-24 tube shipment
Base Q.ty 49
Bulk Q.ty 1225
Tube length (± 0.5) 532
A 3.5
B 13.8
C (± 0.1) 0.6
VNI4140K-32 Package mechanical data
Doc ID022576 Rev 3 21/26
Figure 16. PowerSSO-24 reel shipment (suffix “TR”)
Table 12. PowerSSO-24 reel dimensions
Base Q.ty 1000
Bulk Q.ty 1000
A (max.) 330
B (min.) 1.5
C (± 0.2) 13
F 20.2
G (2 ± 0) 24.4
N (min.) 100
T (max.) 30.4
Package mechanical data VNI4140K-32
22/26 Doc ID022576 Rev 3
Figure 17. PowerSSO-24 tape dimensions
Note: According to the electronic industries association (EIA) standard 481 rev. A, Feb 1986.
Table 13. PowerSSO-24 tape dimensions
Tape width W 24
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 12
Hole Diameter D (± 0.05) 1.55
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.1) 11.5
Compartment Depth K (max) 2.85
Hole Spacing P1 (± 0.1) 2
VNI4140K-32 Package mechanical data
Doc ID022576 Rev 3 23/26
Figure 18. VNI4140K-32 suggested footprint
Note: STMicroelectronics is not responsible for any PCB related issues. The footprint shown in the
above figure is a suggestion which might not be in line to the customer PCB supplier design
rules.
All dimensions are in mm.
3OLDER-ASK/PENING





2

 n 
 


Ordering information VNI4140K-32
24/26 Doc ID022576 Rev 3
12 Ordering information
Table 14. Ordering information
Order codes Package Packaging
VNI4140K-32 PowerSSO-24 Tube
VNI4140KTR-32 PowerSSO-24 Tape and reel
VNI4140K-32 Revision history
Doc ID022576 Rev 3 25/26
13 Revision history
Table 15. Document revision history
Date Revision Changes
12-Dec-2011 1 Initial release.
06-Feb-2012 2
Updated Ilim minimum value in Table 8: Protection and
diagnostic.
Inserted new feature: ESD according to IEC 61000-4-2 up
to +/-25 KV, in cover page.
07-Mar-2012 3 Suggested footprint inserted.
In Table 5. parameter ILGND has been added.
VNI4140K-32
26/26 Doc ID022576 Rev 3
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