Page 1 of 11
Document No. 70-0244-04 www.psemi.com ©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
The PE43702 is a HaRP-enhanced, high linearity, 7-bit RF
Digital Step Attenuator (DSA). This highly versatile DSA
covers a 31.75 dB attenuation range in 0.25 dB steps. The
Peregrine 50 RF DSA provides both a serial and parallel
CMOS control interface. It maintains high attenuation accuracy
over frequency and temperature and exhibits very low insertion
loss and low power consumption. Performance does not
change with VDD due to on-board regulator. This next
generation Peregrine DSA is available in a 4x4 mm 24 lead
QFN footprint.
The PE43702 is manufactured on Peregrine’s UltraCMOS™
process, a patented variation of silicon-on-insulator (SOI)
technology on a sapphire substrate, offering the performance
of GaAs with the economy and integration of conventional
CMOS.
Product Specification
50 RF Digital Attenuator
7-bit, 31.75 dB, 9 kHz - 4.0 GHz
Product Description
Figure 2. Functional Schematic Diagram
PE43702
Features
 HaRP™-enhanced UltraCMOS™ device
 Attenuation: 0.25 dB steps to 31.75 dB
 High Linearity: Typical +57 dBm IIP3
 Excellent low-frequency performance
 3.3 V or 5.0 V Power Supply Voltage
 Fast switch settling time
 Programming Modes:
 Direct Parallel
 Latched Parallel
 Serial
 High-attenuation state @ power-up (PUP)
 CMOS Compatible
 No DC blocking capacitors required
 Packaged in a 24-lead 4x4x0.85 mm QFN
Figure 1. Package Type
24-lead 4x4x0.85 mm QFN Package
Control Logic Interface
RF Input RF Output
Serial In
LE
CLK
Parallel Control
7
P/S
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Product Specification
PE43702
Page 2 of 11
©2008-2009 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0244-04 UltraCMOS™ RFIC Solutions
-1.5
-1
-0.5
0
0.5
1
1.5
0 500 1000 1500 2000 2500 3000 3500 4000
Frequency (MHz)
Bit Error (dB)
0.25dB 0.5dB 1dB 2dB
4dB 8dB 16dB 31.75dB
-0.25
0
0.25
0.5
0.75
1
0 4 8 12 16 20 24 28 32
Attenuation Setting (dB)
Step Error (dB)
200 MHz 900 MHz 1800 MHz
2200 MHz 3000 MHz 4000 MHz
Table 1. Electrical Specifications @ +25°C, VDD = 3.3 V or 5.0 V
Parameter Test Conditions Frequency Min Typical Max Units
Frequency Range 9 kHz 4.0 GHz
Attenuation Range 0.25 dB Step 0 – 31.75 dB
Insertion Loss 9 kHz - 4 GHz 2.0 2.5 dB
Attenuation Error 0 dB - 7.75 dB Attenuation settings
8 dB - 31.75 dB Attenuation settings
9 kHz - 4 GHz
9 kHz - 4 GHz
±(0.2 + 3%)
±(0.3 + 4%)
dB
dB
Return Loss 9 kHz - 4 GHz 18 dB
Relative Phase All States 9 kHz - 4 GHz 44 deg
P1dB (note 1) Input 20 MHz - 4 GHz 30 32 dBm
IIP3 Two tones at +18 dBm, 20 MHz spacing 20 MHz - 4 GHz 57 dBm
Typical Spurious Value 1MHz -110 dBm
Video Feed Through 10 mVpp
Switching Time 50% DC CTRL to 10% / 90% RF 650 ns
RF Trise/Tfall 10% / 90% RF 400 ns
Settling Time RF settled to within 0.05 dB of final value.
RBW = 5 MHz, Averaging ON. 4 µs
*Monotonicity is held so long as Step-Error does not cross below -0.25
Figure 3. 0.25dB Step Error vs. Frequency*
5 1015202530035
5
10
15
20
25
30
0
35
Attenuation State
Attenuation dB
PE43702 Attenuation
900 MHz
2200 MHz
3800 MHz
Figure 4. 0.25dB Attenuation vs. Attenuation State
Performance Plots
Figure 5. 0.25dB Major State Bit Error Figure 6. 0.25dB Attenuation Error vs. Frequency
-1.5
-1
-0.5
0
0.5
1
1.5
0 4 8 121620242832
Attenuation Setting (dB)
Attenuation Error (dB
)
200MHz 900MHz 1800MHz
2200MHz 3000MHz 4000MHz
Note 1. Please note Maximum Operating Pin (50) of +23dBm as shown in Table 3.
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Product Specification
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30
35
40
45
50
55
60
65
70
0 500 1000 1500 2000 2500 3000 3500 4000 4500
Frequency (MHz)
Input IP3 (dBm)
0dB 0.25dB 0.5dB 1dB 2dB
4dB 8dB 16dB 31.75dB
-1.5
-1
-0.5
0
0.5
1
1.5
0 4 8 121620242832
Attenuation Setting (dB)
Attenuation Error (dB)
-40C +25C +85C
0
20
40
60
80
100
120
140
02468
Frequency (GHz)
Relative Phase Error (Deg)
0dB 0.25dB 0.5dB 1dB 2dB
4dB 8dB 16dB 31.75dB
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
0123456789
Frequency (GHz)
Input Return Loss (dB)
0dB 0.25dB 0.5dB 1dB 2dB
4dB 8dB 16dB 31.75dB
-40
-35
-30
-25
-20
-15
-10
-5
0
0123456789
Frequency (GHz)
Input Return Loss (dB)
0dB 0.25dB 0.5dB 1dB 2dB
4dB 8dB 16dB 31.75dB
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
0123456789
Frequency (GHz)
Insertion Loss (dB)
-40C +25C +85C
Figure 7. Insertion Loss vs. Temperature Figure 8. Input Return Loss vs. Attenuation
@ T = +25C
Figure 9. Output Return Loss vs. Attenuation
@ T = +25C
Figure 10. Relative Phase vs. Frequency
Figure 11. Attenuation Error vs. Temperature
@ 4 GHz
Figure 12. Input IP3 vs. Frequency
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Product Specification
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©2008-2009 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0244-04 UltraCMOS™ RFIC Solutions
0.0
5.0
10.0
15.0
20.0
25.0
30.0
1.0E+03 1.0E+04 1.0E+05 1.0E+06 1.0E+07 1.0E+08 1.0E+09
Hz
Pin (dBm)
Exposed
Solder
Pad
C0.25
VDD
P/S
GND GND
LE
CLK
SI
C4
C2
C1
C 0.5
C8
RF1
24
23
22
21
20
19
18
17
16
15
14
13
2
3
4
5
6
1
C16
RF2
GND GND
GND
GND
GND
GND
GND
GND
7
8
9
10
11
12
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS™ device, observe the
same precautions that you would use with other ESD-
sensitive devices. Although this device contains
circuitry to protect it from damage due to ESD,
precautions should be taken to avoid exceeding the
specified rating.
Exposed Solder Pad Connection
The exposed solder pad on the bottom of the package
must be grounded for proper device operation.
Figure 13. Pin Configuration (Top View)
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS™
devices are immune to latch-up.
Switching Frequency
The PE43702 has a maximum 25 kHz switching rate.
Switching rate is defined to be the speed at which the
DSA can be toggled across attenuation states.
Table 3. Operating Ranges
Table 4. Absolute Maximum Ratings
Exceeding absolute maximum ratings may cause
permanent damage. Operation should be restricted to
the limits in the Operating Ranges table. Operation
between operating range maximum and absolute
maximum for extended periods may reduce reliability.
Symbol Parameter/Conditions Min Max Units
VDD Power supply voltage -0.3 6.0 V
VI Voltage on any Digital input -0.3 5.8 V
TST Storage temperature range -65 150 °C
PIN
Input power (50)
9 kHz 20 MHz
20 MHz 4 GHz
Fig. 14
+23
dBm
dBm
VESD ESD voltage (HBM)1
ESD voltage (Machine Model) 500
100
V
V
Table 2. Pin Descriptions
Parameter Min Typ Max Units
VDD Power Supply Voltage 3.0 3.3 V
IDD Power Supply Current 50 350 μA
Digital Input High 2.6 5.5 V
PIN Input power (50):
9 kHz 20 MHz
20 MHz 4 GHz
Fig. 14
+23
dBm
dBm
TOP Operating temperature range -40 25 85 °C
Digital Input Low 0 1 V
Digital Input Leakage1 15 μA
VDD Power Supply Voltage 5.0 5.5 V
Note 1. Input leakage current per Control pin
Pin No. Pin Name Description
1 C0.25 (D0) Attenuation control bit, 0.25 dB
2 VDD Power supply pin
3 P/S Serial/Parallel mode select
4 GND Ground
5 RF1 RF1 port
6 - 13 GND Ground
14 RF2 RF2 port
15 GND Ground
16 LE Serial interface Latch Enable input
17 CLK Serial interface Clock input
18 SI Serial interface Data input
19 C16 (D6) Parallel control bit, 16 dB
20 C8 (D5) Parallel control bit, 8 dB
21 C4 (D4) Parallel control bit, 4 dB
22 C2 (D3) Parallel control bit, 2 dB
23 C1 (D2) Parallel control bit, 1 dB
24 C0.5 (D1) Parallel control bit, 0.5 dB
Paddle GND Ground for proper operation
Moisture Sensitivity Level
The Moisture Sensitivity Level rating for the PE43702 in
the 24-lead 4x4 QFN package is MSL1.
Note: 1. Human Body Model (HBM, MIL_STD 883 Method 3015.7)
Figure 14. Maximum Power Handling Capability
Note: Ground C0.25, C0.5, C1, C2, C4, C8, C16 if not in use.
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Table 6. Latch and Clock Specifications
Table 5. Control Voltage
State Bias Condition
Low 0 to +1.0 Vdc at 2 µA (typ)
High +2.6 to +5 Vdc at 10 µA (typ)
Table 7. Parallel Truth Table
Latch Enable Function
0 Shift Register Clocked
Contents of shift register
transferred to attenuator core
Shift Clock
X
Parallel Control Setting Attenuation
Setting
RF1-RF2
D6 D5 D4 D3 D2 D1 D0
L L L L L L L Reference I.L.
L L L L L L H 0.25 dB
L L L L L H L 0.5 dB
L L L L H L L 1 dB
L L L H L L L 2 dB
L L H L L L L 4 dB
L H L L L L L 8 dB
H L L L L L L 16 dB
H H H H H H H 31.75 dB
Table 9. Serial Attenuation Word Truth Table
Attenuation Word
D7 D6 D5 D4 D3 D2 D1 D0
(LSB)
L L L L L L L L Reference I.L.
L L L L L L L H 0.25 dB
L L L L L H L L 1 dB
L L L L H L L L 2 dB
L L L H L L L L 4 dB
L L H L L L L L 8 dB
L H L L L L L L 16 dB
L H H H H H H H 31.75 dB
Attenuation
Setting
RF1-RF2
L L L L L L H L 0.5 dB
Table 8. Serial Register Map
Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0
D7 D6 D5 D4 D3 D2 D1 D0
Attenuation Word
LSB (first in)
MSB (last in)
Bit must be set to logic low
Attenuation Word is derived directly from the attenuation value. For example, to program the 12.5 dB state:
Attenuation Word: Multiply by 4 and convert to binary 4 * 12.5 dB 50 00110010
Serial Input: 00110010
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Product Specification
PE43702
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©2008-2009 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0244-04 UltraCMOS™ RFIC Solutions
Programming Options
Parallel/Serial Selection
Either a parallel or serial interface can be used to
control the PE43702. The P/S bit provides this
selection, with P/S=LOW selecting the parallel
interface and P/S=HIGH selecting the serial
interface.
Parallel Mode Interface
The parallel interface consists of seven CMOS-
compatible control lines that select the desired
attenuation state, as shown in Table 7.
The parallel interface timing requirements are
defined by Fig. 16 (Parallel Interface Timing
Diagram), Table 11 (Parallel Interface AC
Characteristics), and switching speed (Table 1).
For latched-parallel programming the Latch Enable
(LE) should be held LOW while changing attenuation
state control values, then pulse LE HIGH to LOW
(per Fig. 16) to latch new attenuation state into
device.
For direct parallel programming, the Latch Enable
(LE) line should be pulled HIGH. Changing
attenuation state control values will change device
state to new attenuation. Direct Mode is ideal for
manual control of the device (using hardwire,
switches, or jumpers).
Serial Interface
The serial interface is a 8-bit serial-in, parallel-out
shift register buffered by a transparent latch. The 8-
bits make up the Attenuation Word that controls the
DSA. Fig. 15 illustrates a example timing diagram for
programming a state.
The serial-interface is controlled using three CMOS-
compatible signals: Serial-In (SI), Clock (CLK), and
Latch Enable (LE). The SI and CLK inputs allow
data to be serially entered into the shift register.
Serial data is clocked in LSB first.
The shift register must be loaded while LE is held
LOW to prevent the attenuator value from changing
as data is entered. The LE input should then be
toggled HIGH and brought LOW again, latching the
new data into the DSA. Attenuation Word truth table
is listed in Table 9. A programming example of the
serial register is illustrated in Table 8. The serial
timing diagram is illustrated in Fig. 15. It is required
that all parallel pins be grounded when the DSA is
used in serial mode.
Power-up Control Settings
The PE43702 will always initialize to the maximum
attenuation setting (31.5 dB) on power-up for both
the serial and latched-parallel modes of operation
and will remain in this setting until the user latches in
the next programming word. In direct-parallel mode,
the DSA can be preset to any state within the 31.5
dB range by pre-setting the parallel control pins prior
to power-up. In this mode, there is a 400-µs delay
between the time the DSA is powered-up to the time
the desired state is set. During this power-up delay,
the device attenuates to the maximum attenuation
setting (31.5 dB) before defaulting to the user
defined state. If the control pins are left floating in
this mode during power-up, the device will default to
the minimum attenuation setting (insertion loss
state).
Dynamic operation between serial and parallel
programming modes is possible.
If the DSA powers up in serial mode (P/S = HIGH),
all the parallel control inputs DI[6:0] must be set to
logic low. Prior to toggling to parallel mode, the DSA
must be programmed serially to ensure D[7] is set to
logic low.
If the DSA powers up in either latched or direct-
parallel mode, all parallel pins DI[6:0] must be set to
logic low prior to toggling to serial mode (P/S
= HIGH), and held low until the DSA has been
programmed serially to ensure bit D[7] is set to logic
low.
The sequencing is only required once on power-
up. Once completed, the DSA may be toggled
between serial and parallel programming modes at
will.
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Table 11. Parallel and Direct Interface AC Table 10. Serial Interface AC Characteristics
VDD = 3.3 or 5.0 V, -40° C < TA < 85° C, unless otherwise specified
VDD = 3.3 or 5.0 V, -40° C < TA < 85° C, unless otherwise specified
Figure 16. Latched-Parallel/Direct-Parallel Timing Diagram
Symbol Parameter Min Max Unit
FCLK Serial clock frequency - 10 MHz
TCLKH Serial clock HIGH time 30 - ns
TCLKL Serial clock LOW time 30 - ns
TLESU
Last serial clock rising edge
setup time to Latch Enable
rising edge
10 - ns
TLEPW Latch Enable min. pulse width 30 - ns
TSISU Serial data setup time 10 - ns
TSIH Serial data hold time 10 - ns
TDISU Parallel data setup time 100 - ns
TDIH Parallel data hold time 100 - ns
TASU Address setup time 100 - ns
TAH Address hold time 100 - ns
TPSSU Parallel/Serial setup time 100 - ns
TPSH Parallel/Serial hold time 100 - ns
TPD Digital register delay (internal) - 10 ns
Symbol Parameter Min Max Unit
TLEPW Latch Enable minimum
pulse width 30 - ns
TDISU Parallel data setup time 100 - ns
TDIH Parallel data hold time 100 - ns
TPSSU Parallel/Serial setup time 100 - ns
TPSIH Parallel/Serial hold time 100 - ns
TPD Digital register delay
(internal) - 10 ns
TDIPD Digital register delay
(internal, direct mode only) - 5 ns
Characteristics
VALID
T
DISU
T
DIH
DI[6:0]
LE
P/S
T
PSSU
T
PSH
T
LEPW
VALID
DO[6:0]
T
DIPD
T
PD
Figure 15. Serial Timing Diagram
D[7] must be set to logic low
Bits can either be set to logic high or logic low
D[0] D[1] D[2] D[3] D[4] D[5] D[7]
T
SISU
T
CLKL
T
LEPW
T
SIH
T
CLKH
SI
CLK
LE
P/S
T
LESU
T
PSSU
T
PSIH
VALID
T
DISU
T
PD
T
DIH
D[6]
DI[6:0]
DO[6:0]
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©2008-2009 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0244-04 UltraCMOS™ RFIC Solutions
Evaluation Kit
The Digital Attenuator Evaluation Kit board was
designed to ease customer evaluation of the
PE43702 Digital Step Attenuator.
Direct-Parallel Programming Procedure
For automated direct-parallel programming,
connect the test harness provided with the EVK
from the parallel port of the PC to the J1 & Serial
header pin and set the D0-D6 SP3T switches to
the ‘MIDDLE’ toggle position. Position the
Parallel/Serial (P/S) select switch to the Parallel
(or left) position. The evaluation software is
written to operate the DSA in either Parallel or
Serial-Addressable Mode. Ensure that the
software is set to program in Direct-Parallel mode.
Using the software, enable or disable each setting
to the desired attenuation state. The software
automatically programs the DSA each time an
attenuation state is enabled or disabled.
For manual direct-parallel programming,
disconnect the test harness provided with the EVK
from the J1 and Serial header pins. Position the
Parallel/Serial (P/S) select switch to the Parallel
(or left) position. The LE pin on the Serial header
must be tied to VDD. Switches D0-D6 are SP3T
switches which enable the user to manually
program the parallel bits. When any input D0-D6
is toggled ‘UP’, logic high is presented to the
parallel input. When toggled ‘DOWN’, logic low is
presented to the parallel input. Setting D0-D6 to
the ‘MIDDLE’ toggle position presents an OPEN,
which forces an on-chip logic low. Table 9 depicts
the parallel programming truth table and Fig. 16
illustrates the parallel programming timing
diagram.
Latched-Parallel Programming Procedure
For automated latched-parallel programming, the
procedure is identical to the direct-parallel
method. The user only must ensure that Latched-
Parallel is selected in the software.
For manual latched-parallel programming, the
procedure is identical to direct-parallel except now
the LE pin on the Serial header must be logic low
Figure 17. Evaluation Board Layout
Peregrine Specification 101-0310
as the parallel bits are applied. The user must
then pulse LE from 0V to VDD and back to 0V to
latch the programming word into the DSA. LE
must be logic low prior to programming the next
word.
Serial Programming Procedure
Position the Parallel/Serial (P/S) select switch to
the Serial (or right) position. The evaluation
software is written to operate the DSA in either
Parallel or Serial Mode. Ensure that the software
is set to program in Serial mode. Using the
software, enable or disable each setting to the
desired attenuation state. The software
automatically programs the DSA each time an
attenuation state is enabled or disabled.
Note: Reference Figure 18 for Evaluation Board Schematic
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Figure 19. Package Drawing
Figure 18. Evaluation Board Schematic
Peregrine Specification 102-0379
Note: Capacitors C1-C8, C13, & C14 may be omitted.
Z=50 Ohm
De-embedi ng t race
Z=50 Ohm
Z= 50 Ohm
43X0X DSA 50 Ohm 4x4 MLP24
3
1
2
4
D3
C7
100pF
C1
100pF
3
1
2
4
D0
1
2
J4
SM A
5
4
6
P/ S
C6
100pF
3
1
2
4
D4
C4
100pF
3
1
2
4
D5
1
13
35
57
7
22
44
66
88
10 10
12 12
14 14 13
13
9
911
11
J1
HEADER 14
1
2
J7
SM A
C3
100pF
C10
100pF
3
1
2
4
D6
1
2
J5
SM A
3
1
2
4
D1
1
2
J6
SM A
C2
100pF
C8
100pF
C9
0.1µF
3
1
2
4
D2
C5
100pF
1
2
J3
CON 2
1CLOCK
2DATA
3LE
4GN D
SERI A L
HEADER 4
C13
100pF
C14
100pF
1CP25
2VDD
3S/ P
4GND
5RF1
6GND
7GND
8GND
9GND
10 GND
11 GND
12 GND
13
GND
14
RF2
15
GND
16
LE
17
CLK
18
SI
19
C16
20
C8
21
C4
22
C2
23
C1
24
CP5
U1
VDD
VDD
P/ S
D3
D1
D4
D5
P/ S
D6
D3
D2
D1
D4
D5
D0
D0
D2
D6
CLK
DATA
LE
D1
D2
D3
D4
D5
D6
D0
VDD
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Table 12. Ordering Information
Figure 21. Marking Specifications
43702
YYWW
ZZZZZ
YYWW = Date Code
ZZZZZ = Last five digits of Lot Number
Figure 20. Tape and Reel Drawing
Order Code Part Marking Description Package Shipping Method
PE43702MLI 43702 PE43702 G - 24QFN 4x4mm-75A Green 24-lead 4x4mm QFN Bulk or tape cut from reel
PE43702MLI-Z 43702 PE43702 G – 24QFN 4x4mm-3000C Green 24-lead 4x4mm QFN 3000 units / T&R
EK43702-01 43702 PE43702 G – 24QFN 4x4mm-EK Evaluation Kit 1 / Box
Device Orientation in Tape
Top of
Device
Pin 1
Tape Feed Direction
A0 = 4.35
B0 = 4.35
K0 = 1.1
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Sales Offices
The Americas
Peregrine Semiconductor Corporation
9380 Carroll Park Drive
San Diego, CA 92121
Tel: 858-731-9400
Fax: 858-731-9499
Europe
Peregrine Semiconductor Europe
Bâtiment Maine
13-15 rue des Quatre Vents
F-92380 Garches, France
Tel: +33-1-4741-9173
Fax : +33-1-4741-9173
For a list of representatives in your area, please refer to our Web site at: www.psemi.com
Data Sheet Identification
Advance Information
The product is in a formative or design stage. The data
sheet contains design target specifications for product
development. Specifications and features may change in
any manner without notice.
Preliminary Specification
The data sheet contains preliminary data. Additional data
may be added at a later date. Peregrine reserves the right
to change specifications at any time without notice in order
to supply the best possible product.
Product Specification
The data sheet contains final data. In the event Peregrine
decides to change the specifications, Peregrine will notify
customers of the intended changes by issuing a CNF
(Customer Notification Form).
The information in this data sheet is believed to be reliable.
However, Peregrine assumes no liability for the use of this
information. Use shall be entirely at the user’s own risk.
No patent rights or licenses to any circuits described in this
data sheet are implied or granted to any third party.
Peregrine’s products are not designed or intended for use in
devices or systems intended for surgical implant, or in other
applications intended to support or sustain life, or in any
application in which the failure of the Peregrine product could
create a situation in which personal injury or death might occur.
Peregrine assumes no liability for damages, including
consequential or incidental damages, arising out of the use of
its products in such applications.
The Peregrine name, logo, and UTSi are registered trademarks
and UltraCMOS, HaRP, MultiSwitch and DuNE are trademarks
of Peregrine Semiconductor Corp.
High-Reliability and Defense Products
Americas
San Diego, CA, USA
Phone: 858-731-9475
Fax: 848-731-9499
Europe/Asia-Pacific
Aix-En-Provence Cedex 3, France
Phone: +33-4-4239-3361
Fax: +33-4-4239-7227
Peregrine Semiconductor, Asia Pacific (APAC)
Shanghai, 200040, P.R. China
Tel: +86-21-5836-8276
Fax: +86-21-5836-7652
Peregrine Semiconductor, Korea
#B-2607, Kolon Tripolis, 210
Geumgok-dong, Bundang-gu, Seongnam-si
Gyeonggi-do, 463-943 South Korea
Tel: +82-31-728-3939
Fax: +82-31-728-3940
Peregrine Semiconductor K.K., Japan
Teikoku Hotel Tower 10B-6
1-1-1 Uchisaiwai-cho, Chiyoda-ku
Tokyo 100-0011 Japan
Tel: +81-3-3502-5211
Fax: +81-3-3502-5213
OBSOLETE
REPLACE WITH PE43711
Logo updated under non-rev change. Peregrine products are protected under one or more of the following U.S. Patents: http://patents.psemi.com