© 2006 Microchip Technology Inc. Preliminary DS41302A
PIC12F609/HV609
PIC12F615/HV615
Data Sheet
8-Pin Flash-Based, 8-Bit
CMOS Microcontrollers
*8-bit, 8-pin D evic es Prot ect ed by Mic rochip’s Low Pin C ount Pat ent: U .S. Patent N o. 5, 847,450. Addit ional U.S. and
f oreign patent s and applic ations m ay be is sued or pending.
DS41302A-page ii Preliminary © 2006 Microchip Technology Inc.
Information contained in this publication regarding device
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The Microchip name and logo, the Microchip logo, Accuron,
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© 2006, Microchip Technology Incorporated, Printed in the
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Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrit y of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violat ion of the Digital Millennium Copyright Act. If suc h ac t s
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Microchip received ISO/TS-16949:2002 certification for its worldwide
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microperipherals, nonvolatile memory and analog products. In addition,
Microchip’s quality system for the design and manufacture of
development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 1
PIC12F609/615/12HV609/615
High-Performance RISC CPU:
Only 35 instructions to learn:
- All single-cycle instructions except branches
Operati ng spe ed:
- DC – 20 MHz oscillator/clock input
- DC – 200 ns instruction cycle
Interrupt capability
8-level deep hardware stack
Direct, Indirect and Relative Addressing modes
Special Microcontroller Features:
Precision Internal Oscillator:
- Factory calibrated to ±1%, typical
- Software selectable frequency: 4 MHz or
8 MHz
Power-Saving Sleep mode
Volta ge rang e:
- PIC12F609/615: 2.0V to 5.5V
- PIC12HV609/615: 2.0V to user defined
maximum (see note)
Industri al and Extended Temperature range
Power-on Reset (POR)
Power-up Timer (PWRT) and Oscillator Start-up
Timer (OST)
Brown-out Reset (BOR)
Watchdog Timer (WDT) with independent
oscilla tor for reliable operation
Multiplexed Master Clear with pull-up/input pin
Programmable code protection
High Endurance Flash:
- 100,000 write Flash endurance
- Flash retenti on: > 40 years
Low-Power Features:
Standby Cu rre nt:
- 50 nA @ 2.0V, typical
Operati ng Curren t:
-11μA @ 32 kHz, 2.0V, typical
-260μA @ 4 MHz, 2.0V, typical
Watchdog Timer Current:
-1μA @ 2.0V, typical
Note: Voltage across the shunt regulator should
not exceed 5V.
Peripheral Feat ures:
Shunt Voltage Regulator (PIC12HV609/615 only):
- 5 volt regulation
- 4 mA to 50 mA shunt range
5 I/O pins and 1 input only
High current source/sink for direct LED drive
- Interrupt-on-pin change or pins
- Individually programmable weak pull-ups
Analog Comparator module with:
- One analog comparator
- Programmable on-chip voltage reference
(CVREF) module (% of VDD)
- Comparator inputs and output externally
accessible
- Built-In Hysteresis (software selectable)
Timer0: 8-bit timer/counter with 8-bit
progra mmab le pres caler
Enhanced Timer1:
- 16-bit timer/counter with prescaler
- External Timer1 Gate (count enable)
- Option to use OSC1 and OSC2 in LP mode
as Timer1 oscillator if INTOSC mode
selected
- Option to use system clock as Timer1
In-Circuit Serial ProgrammingTM (ICSPTM) via two
pins
PIC12F615/HV615 ONLY:
Enhanced Capture, Compare, PWM module:
- 16-bit Capture, max. resolut ion 12.5 ns
- Compare, max. resolution 200 ns
- 10-bit PWM with 1 or 2 output channels, 1
output channel programmable “dead time”,
max. frequency 20 kHz, auto-shutdown
A/D Converter:
- 10-bit resolution and 4 channels, samples
internal voltage references
Timer2: 8-bit timer/counter with 8-bit period
register, prescaler and postscaler
8-Pin Flash-Based, 8-Bit CMOS Microcontrollers
PIC12F609/615/12HV609/615
DS41302A-page 2 Preliminary © 2006 Microchip Technology Inc.
8-Pin Diagram, PIC12F609/HV609 (PDIP, SOI C, TSSOP, DFN)
TABLE 1: PIC12F609/HV609 PIN SUMMARY (PDIP, SOIC, TSSOP, DFN)
Device Program Memory Data Memory I/O 10-bit A/D
(ch) Comparators Timers
8/16-bit Voltage Range
Flash
(words) SRAM (bytes)
PIC12F609 1024 64 5 0 1 1/1 2.0V-5.5V
PIC12HV609 1024 64 5 0 1 1/1 2.0V-user defined
PIC12F615 1024 64 5 4 1 2/1 2.0V-5.5V
PIC12HV615 1024 64 5 4 1 2/1 2.0V-user defined
I/O Pin Comparators Timer Interrupts Pull-ups Basic
GP0 7CIN+ IOC YICSPDAT
GP1 6 CIN0- IOC Y ICSPCLK
GP2 5COUT T0CKI INT/IOC Y
GP3(1) 4— IOC Y(2) MCLR/VPP
GP4 3CIN1- T1G IOC YOSC2/CLKOUT
GP5 2 T1CKI IOC Y OSC1/CLKIN
1 VDD
8 ——— VSS
Note 1: Input only.
2: Only when pin is configured for external MCLR.
1
2
3
45
6
7
8
PIC12F609/
HV609
VSS
GP0/CIN+/ICSPDAT
GP1/CIN0-/ICSPCLK
GP2/T0CKI/INT/COUT
VDD
GP5/T1CKI/OSC1/CLKIN
GP4/CIN1-/T1G/OSC2/CLKOUT
GP3/MCLR/VPP
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 3
PIC12F609/615/12HV609/615
8-Pin Diagram, PIC12F615/HV615 (PDIP, SOIC, TSSOP, DFN)
TABLE 2: PIC12F615/HV615 PIN SUMMARY (PDIP, SOIC, TSSOP, DFN)
I/O Pin Analog Comparators Timer CCP Interrupts Pull-ups Basic
GP0 7AN0 CIN+ P1B IOC YICSPDAT
GP1 6 AN1 CIN0- IOC Y ICSPCLK/VREF
GP2 5AN2 COUT T0CKI CCP1/P1A INT/IOC Y
GP3(1) 4— T1G*— IOCY
(2) MCLR/VPP
GP4 3AN3 CIN1- T1G P1B* IOC YOSC2/CLKOUT
GP5 2 T1CKI P1A* IOC Y OSC1/CLKIN
1 VDD
—8 VSS
* Alternate pin function.
Note 1: Input only.
2: Only when pin is configured for external MCLR.
1
2
3
45
6
7
8
PIC12F615/
HV615
VSS
GP0/AN0/CIN+/P1B/ICSPDAT
GP1/AN1/CIN0-/VREF/ICSPCLK
GP2/AN2/T0CKI/INT/COUT/CCP1/P1A
VDD
GP5/T1CKI/P1A*/OSC1/CLKIN
GP4/AN3/CIN1-/T1G/P1B*/OSC2/CLKOUT
GP3/T1G*/MCLR/VPP
* Alternate pin function.
PIC12F609/615/12HV609/615
DS41302A-page 4 Preliminary © 2006 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 5
2.0 Memory O rganization................................................................................................................................................................... 9
3.0 Oscillator Module........................................................................................................................................................................ 25
4.0 I/O Ports ........... ...... ....... ...... .................................. ...... ...... ...... ....... ...... ...... ....... ......................................................................... 31
5.0 Timer0 Module ........................................................................................................................................................................... 41
6.0 Timer1 Module with Gate Control............................................................................................................................................... 45
7.0 Timer2 Module (PIC12F615/HV 615 only) .................................................................................................................................. 51
8.0 Comparator Module................... .... ....... .... .. .... .... ....... .... .... .. .... ....... .... .... .. .... ......... .. .... .... .. ......................................................... 53
9.0 Analog-to-Digital Converter (ADC) Module (PIC12F615/HV615 only)......... ......... .. .... .... .. ......... .... .. .... ....... .... ........................... 65
10.0 Enhanc ed Capture/Com pare/PW M (With Auto-Shutdown and Dead Band) Module (PIC12F615/HV615 only)........................ 75
11.0 Specia l Features of the CPU......... ....... ...... ...... ....................... ....... ....................... ...... ...... ......................................................... 93
12.0 Voltage Regulator................ .. .. .. .. .. ....... .. .. .. .. .. .. .. ..... .... .. .. .. .. .. .. ..... .. .... .. .. .. .. .. ..... .. .... .. .. .. ........................................................... 111
13.0 Instruction Set Summary.......................................................................................................................................................... 113
14.0 Development Support............................................................................................................................................................... 123
15.0 Electrical Specifications............................................................................................................................................................ 127
16.0 DC and AC Characteristics Graphs and Tables...................... ......... .... .. .... ......... .... .. .... .... ......... .... .. ........................................ 149
17.0 Packagin g In fo r mation............. ...... ....... ....................... ...... ...... ........................ ...... ...... ............................................................. 151
Appendix A: Data Sheet Revision History................................. .... .... ......... .... .... .... ......... .... .. .... ......................................................... 157
Appendix B: Migrating from other PIC® Devices.................... .... .... ......... ...... .... .... ......... .... .... .... ....................................................... 157
Index .................................................................................................................................................................................................. 159
The Micro chip Web Site........ ...... ...... ...... ....... ...... ...... ....... ...... ...... ....................... ....... ...... ................................................................. 163
Customer Change Notification Service ........................................... ............... .... ............... ...... ........................................................... 163
Customer Support....................... ...... ...... ........... ...... ............. ...... .... ............. ...... ............. ................................................................... 163
Reader Response.............................................................................................................................................................................. 164
Product Identification System............................................................................................................................................................. 165
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© 2006 Microchip Technology Inc. Preliminary DS41302A-page 5
PIC12F609/615/12HV609/615
1.0 DEVICE OVERVIEW
The PIC12F609/615/12HV609/615 devices are covered
by this data sheet. They are available in 8-pin PDIP,
SOIC, TSSOP and DFN packages.
Block Diagrams and pinout descriptions of the devices
are as follows:
PIC12F609/HV609 (Figure 1-1, Table 1-1)
PIC12F615/HV615 (Figure 1-2, Table 1-2)
FIGURE 1-1: PIC12F609/HV609 BLOCK DIAGRAM
Flash
Program
Memory
13 Data Bus 8
14
Program
Bus
Instruction Reg
Program Counter
RAM
File
Registers
Direct Addr 7
RAM Addr 9
Addr MUX
Indirect
Addr
FSR Reg
STATUS Reg
MUX
ALU
W Reg
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
GPIO
8
8
8
3
8-Level Stack 64 Bytes
1K X 14
(13-Bit)
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
MCLR VSS
Brown-out
Reset
Timer0 Timer1
GP0
GP1
GP2
GP3
GP4
GP5
Analog Comparator
T0CKI
INT
T1CKI
Configuration
Internal
Oscillator
and Reference
T1G VDD
Block
CIN+
CIN0-
CIN1-
COUT
Comparator Voltage Reference
Absolute Voltage Reference
Shunt Regulator
(PIC12HV609 only)
PIC12F609/615/12HV609/615
DS41302A-page 6 Preliminary © 2006 Microchip Technology Inc.
FIGURE 1-2: PIC12F615/HV615 BLOCK DIAGRAM
Flash
Program
Memory
13 Data Bus 8
14
Program
Bus
Instruction Reg
Program Counter
RAM
File
Registers
Direct Addr 7
RAM Addr 9
Addr MUX
Indirect
Addr
FSR Reg
STATUS Reg
MUX
ALU
W Reg
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
GPIO
8
8
8
3
8-Level Stack 64 Bytes
1K X 14
(13-Bit)
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
MCLR VSS
Brown-out
Reset
Timer0 Timer1
GP0
GP1
GP2
GP3
GP4
GP5
Analog Comparator
T0CKI
INT
T1CKI
Configuration
Internal
Oscillator
VREF
and Reference
T1G VDD
Timer2
Block Shunt Regulator
(PIC12HV615 only)
Analog-To-Digital Converter
AN0
AN1
AN2
AN3
CIN+
CIN0-
CIN1-
COUT
ECCP
CCP1/P1A
P1B
P1A*
P1B*
Comparator Voltage Reference
Absolute Voltage Reference
* Altern ate pin func ti on.
T1G*
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 7
PIC12F609/615/12HV609/615
TABLE 1-1: PIC12F609/HV609 PINOUT DESCRIPTION
Name Function Input
Type Output
Type Description
GP0/CIN+/ICSPDAT GP0 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-change
CIN+ AN Comparator non-inverting input
ICSPDAT S T CMOS Serial Programm ing Data I/O
GP1/CIN0-/ICSPCLK GP1 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-change
CIN0- AN Comparator inverting input
ICSPCLK ST Serial Programm ing Clock
GP2/T0CKI/INT/COUT GP2 ST CMOS General purpose I/O with prog. pull-up and interrupt-on-change
T0CKI ST Timer0 clock input
INT S T External Interrupt
COUT CMOS Comparator output
GP3/MCLR/VPP GP3 TTL General purpose input with interrupt-on-change
MCLR ST Master Clear w/internal pull-up
VPP HV Programming voltage
GP4/CIN1-/T1G/OSC2/
CLKOUT GP4 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-change
CIN1- AN Comparator inverting input
T1G ST Timer1 gate (count enable)
OSC2 XTAL Crystal/Resonator
CLKOUT CMOS FOSC/4 output
GP5/T1CKI/OSC1/CLKIN GP5 TTL CMOS General purpose I/O with prog. pull-up and int errupt -on-c hange
T1CKI ST Timer1 clock input
OSC1 XTAL Crystal/Resonator
CLKIN ST External clock input/RC oscillator connection
VDD VDD Power Positive supply
VSS VSS Power Ground reference
Legend: AN = Analog input or output CMOS= CMOS com patible input or output HV = H igh Voltage
ST = Schmitt Trigger input with CMOS levels T T L = TTL compatible input XTAL = C rystal
PIC12F609/615/12HV609/615
DS41302A-page 8 Preliminary © 2006 Microchip Technology Inc.
TABLE 1-2: PIC12F615/HV615 PINOUT DESCRIPTION
Name Function Input
Type Output
Type Description
GP0/AN0/CIN+/P1B/ICSPDAT GP0 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-
change
AN0 AN A/D Channel 0 input
CIN+ AN Comparator non-inverting input
P1B CMOS PWM output
ICSPDAT S T CMOS Serial Programm ing Data I/O
GP1/AN1/CIN0-/VREF/ICSPCLK GP1 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-
change
AN1 AN A/D Channel 1 input
CIN0- AN Comparator inverting input
VREF AN External Voltage Reference for A/D
ICSPCLK ST Serial Programm ing Clock
GP2/AN2/T0CKI/INT/COUT/CCP1/
P1A GP2 S T CMO S G eneral purpose I/O with prog. pull-up and interrupt-on-
change
AN2 AN A/D Channel 2 input
T0CKI ST Timer0 clock input
INT S T External Interrupt
COUT CMOS Comparator output
CCP1 ST CMOS Capture input/Compare input/PWM output
P1A CMOS PWM output
GP3/T1G*/MCLR/VPP GP3 TTL General purpose input with interrupt-on-change
T1G* ST Timer1 gate (count enable), alternate pin
MCLR ST Master Clear w/internal pull-up
VPP HV Programming voltage
GP4/AN3/CIN1-/T1G/P1B*/OSC2/
CLKOUT GP4 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-
change
AN3 AN A/D Channel 3 input
CIN1- AN Comparator inverting input
T1G ST Timer1 gate (count enable)
P1B* CMOS PWM output, alternate pin
OSC2 XTAL Crystal/Resonator
CLKOUT CMOS FOSC/4 output
GP5/T1CKI/P1A*/OS C 1/CLKIN GP5 TTL CMOS General purpose I/O with prog. pull-up and interrupt-on-
change
T1CKI ST Timer1 clock input
P1A* CMOS PWM output, alternate pin
OSC1 XTAL Crystal/Resonator
CLKIN ST External clock input/RC oscillator connection
VDD VDD Power Positive supply
VSS VSS Power Ground reference
* Alternate pin function.
Legend: A N = Analog input or output CMOS=CMOS compatible input or output HV = High Voltage
ST = Schmitt Trigger input with CMOS levels TTL =TTL compatible input XTAL= Crystal
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 9
PIC12F609/615/12HV609/615
2.0 MEMORY ORGANIZATION
2.1 Program Memory Organization
The PIC12F609/615/12HV609/615 has a 13-bit pro-
gram counter capable of addressing an 8K x 14 pro-
gram memory space. Only the first 1K x 14 (0000h-
03FFh) for the PIC12F609/615/12HV609/615 is physi-
cally implemented. Accessing a location above these
boundaries will cause a wraparound within the first 1K
x 14 sp ac e. The Rese t vec tor is at 0000 h and the int er-
rupt vector is at 0004h (see Figure 2-1).
FIGURE 2-1: PROGRAM MEMORY MAP
AND STACK FOR THE
PIC12F609/615/12HV609/615
2.2 Data Memory Organiza tion
The data memo ry (see Figure 2-2) is partitioned into two
banks, which contain the General Purpose Registers
(GPR) and the Special Function Registers (SFR). The
Special Function Registers are located in the first 32
locations of each bank. Register locations 40h-7Fh in
Bank 0 are General Purpose Registers, implemented as
static RAM. Register locations F0h-FFh in Bank 1 point
to addresses 70h-7Fh in Bank 0. All other RAM is
unimplemented and returns ‘0when read. The RP0 bit
of the STATUS register is the bank select bit.
RP0
0Bank 0 is selected
1Bank 1 is selected
2.2. 1 GENERAL PURPO SE REGISTER
FILE
The register file is organized as 64 x 8 in the
PIC12F609/615/12HV609/615. Each register is
accessed, either directly or indirectly, through the File
Select Register (FSR) (see Section 2.4 “Indirect
Addressing, INDF and FSR Registers”).
2.2.2 SPECIAL FUNCTION REGISTERS
The Special Function Registers are registers used by
the CPU and peripheral functions for controlling the
desired operation of the device (see Table 2-1). These
registers are static RAM.
The special registers can be classified into two sets:
core and peripheral. The Special Function Registers
associated with the “core” are described in this section.
Those related to the operation of the peripheral features
are described in the section of that peripheral feature.
PC<12:0>
13
0000h
0004h
0005h
03FFh
0400h
1FFFh
Stack Level 1
Stack Level 8
Reset V ector
Interrupt Vector
On-chip Program
Memory
CALL, RETURN
RETFIE, RETLW
Stack Level 2
Wraps to 0000h-07FFh
Note: The IRP and RP1 bits of the STATUS
register are reserved and should always be
maint ained as 0’s.
PIC12F609/615/12HV609/615
DS41302A-page 10 Preliminary © 2006 Microchip Technology Inc.
FIGURE 2-2: DATA MEMORY MAP OF
THE PIC12F60 9/HV 609 FIGURE 2-3: DATA MEMORY MAP OF
THE PIC12F61 5/HV 615
Indirect Addr.(1)
TMR0
PCL
STATUS
FSR
GPIO
PCLATH
INTCON
PIR1
TMR1L
TMR1H
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
20h
7Fh
Bank 0
Unimplemented data memory l ocations, read as ‘0’.
Note 1: Not a physical register.
General
Purpose
Registers
64 Bytes
File
Address File
Address
WPU
IOC
Indirect Addr.(1)
OPTION_REG
PCL
STATUS
FSR
TRISIO
PCLATH
INTCON
PIE1
PCON
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
A0h
FFh
Bank 1
ANSEL
Accesses 70h-7Fh F0h
VRCON
CMCON0
OSCTUNE
40h
3Fh
CMCON1
EFh
T1CON
Indirect Addr.(1)
TMR0
PCL
STATUS
FSR
GPIO
PCLATH
INTCON
PIR1
TMR1L
TMR1H
T1CON
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
20h
7Fh
Bank 0
Unimplemented data memory l ocations, read as ‘0’.
Note 1: Not a physical register.
General
Purpose
Registers
64 Bytes
File
Address File
Address
WPU
IOC
Indirect Addr.(1)
OPTION_REG
PCL
STATUS
FSR
TRISIO
PCLATH
INTCON
PIE1
PCON
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
A0h
FFh
Bank 1
ADRESH
ADCON0
ADRESL
ANSEL
Accesses 70h-7Fh F0h
TMR2
T2CON
CCPR1L
CCPR1H
CCP1CON
PWM1CON
ECCPAS
VRCON
CMCON0
OSCTUNE
PR2
40h
3Fh
CMCON1
EFh
APFCON
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 11
PIC12F609/615/12HV609/615
TABLE 2-1: PIC12F609/HV609 SPECIAL FUNCTION REGISTERS SUMMARY BANK 0
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 B it 0 Value on
POR, BOR Page
Bank 0
00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 22, 100
01h TMR0 Timer0 Module ’s Regi ster xxxx xxxx 41, 100
02h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 22, 100
03h STATUS IRP(1) RP1(1) RP0 TO PD ZDCC0001 1xxx 15, 100
04h FSR Indirect Data Memory Address Pointer xxxx xxxx 22, 100
05h GPIO GP5 GP4 GP3 GP2 GP1 GP0 --x0 x000 31, 100
06h Unimplemented
07h Unimplemented
08h Unimplemented
09h Unimplemented
0Ah PCLATH Write Buffer for upper 5 bits of Program Counter ---0 0000 22, 100
0Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 17, 100
0Ch PIR1 —CMIF—TMR1IF---- 0--0 19, 100
0Dh Unimplemented
0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx 45, 100
0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx 45, 100
10h T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 49, 100
11h Unimplemented
12h Unimplemented
13h Unimplemented
14h Unimplemented
15h Unimplemented
16h Unimplemented
17h Unimplemented
18h Unimplemented
19h VRCON CMVREN VRR FVREN VR3 VR2 VR1 VR0 0-00 0000 62, 101
1Ah CMCON0 CMON COUT CMOE CMPOL —CMR—CMCH0000 -0-0 58, 101
1Bh
1Ch CMCON1 T1ACS CMHYS T1GSS CMSYNC ---0 0-10 59, 101
1Dh Unimplemented
1Eh Unimplemented
1Fh Unimplemented
Legend: – = Unimpl em ent ed locat io ns rea d as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: IRP and RP1 bits are reserved, always maintain these bits clear.
PIC12F609/615/12HV609/615
DS41302A-page 12 Preliminary © 2006 Microchip Technology Inc.
TABLE 2-2: PIC12F615/HV615 SPECIAL FUNCTION REGISTERS SUMMARY BANK 0
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Page
Bank 0
00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 22, 101
01h TMR0 Timer0 Module ’s Regi ster xxxx xxxx 41, 101
02h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 22, 101
03h STATUS IRP(1) RP1(1) RP0 TO PD ZDCC0001 1xxx 15, 101
04h FSR Indirect Data Memory Address Pointer xxxx xxxx 22, 101
05h GPIO GP5 GP4 GP3 GP2 GP1 GP0 --x0 x000 31, 101
06h Unimplemented
07h Unimplemented
08h Unimplemented
09h Unimplemented
0Ah PCLATH Write Buffer for upper 5 bits of Program Counter ---0 0000 22, 101
0Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 17, 101
0Ch PIR1 ADIF CCP1IF —CMIF TMR2IF TMR1IF -00- 0-00 19, 101
0Dh Unimplemented
0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx 45, 101
0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx 45, 101
10h T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 49, 101
11h TMR2 Timer2 Module Reg ister 0000 0000 51, 101
12h T2CON TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 52, 101
13h CCPR1L Capture/Compare/PWM Register 1 Low Byte XXXX XXXX 76, 101
14h CCPR1H Capture/Compare/PWM Register 1 High Byte XXXX XXXX 76, 101
15h CCP1CON P1M DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0-00 0000 75, 101
16h PWM1CON PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 91, 101
17h ECCPAS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 0000 0000 88, 101
18h Unimplemented
19h VRCON CMVREN VRR FVREN VR3 VR2 VR1 VR0 0-00 0000 62, 101
1Ah CMCON0 CMON COUT CMOE CMPOL —CMR—CMCH0000 -0-0 58, 101
1Bh
1Ch CMCON1 T1ACS CMHYS T1GSS CMSYNC ---0 0-10 59, 101
1Dh Unimplemented
1Eh ADRESH Most Significant 8 bits of the left shifted A/D result or 2 bits of right shifted result xxxx xxxx 71, 101
1Fh ADCON0 ADFM VCFG CHS2 CHS1 CHS0 GO/DONE ADON 00-0 0000 70, 101
Legend: – = Unimpl em ent ed locat io ns rea d as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: IRP and RP1 bits are reserved, always maintain these bits clear.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 13
PIC12F609/615/12HV609/615
TABLE 2-3: PIC12F609/HV609 SPECIAL FUNCTION REGISTERS SUMMARY BANK 1
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Page
Bank 1
80h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 22, 101
81h OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 16, 101
82h PCL Pro gr am Coun ter’s (PC) Least Significa nt Byt e 0000 0000 22, 101
83h STATUS IRP(1) RP1(1) RP0 TO PD ZDCC0001 1xxx 15, 101
84h FSR Indirect Data Memory Address Pointer xxxx xxxx 22, 101
85h TRISIO TRISIO5 TRISIO4 TRISIO3(4) TRISIO2 TRISIO1 TRISIO0 --11 1111 31, 101
86h Unimplemented
87h Unimplemented
88h Unimplemented
89h Unimplemented
8Ah PCLATH Write Buffer for upper 5 bits of Program Counter ---0 0000 22, 101
8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF(3) 0000 0000 17, 101
8Ch PIE1 —CMIE—TMR1IE---- 0--0 18, 101
8Dh Unimplemented
8Eh PCON —PORBOR ---- --qq 20, 101
8Fh Unimplemented
90h OSCTUNE TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 29, 101
91h Unimplemented
92h Unimplemented
93h Unimplemented
94h Unimplemented
95h WPU(2) —WPU5WPU4 WPU2 WPU1 WPU0 --11 -111 34, 101
96h IOC IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 34, 101
97h Unimplemented
98h Unimplemented
99h Unimplemented
9Ah Unimplemented
9Bh Unimplemented
9Ch Unimplemented
9Dh Unimplemented
9Eh Unimplemented
9Fh ANSEL —ANS3 ANS1 ANS0 ---- 1-11 33, 101
Legend: – = Unimplemented locations read as0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: IRP and RP1 bits are reserved, always maintain these bits clear.
2: GP3 pull-up is enabled when MCLRE is1’ in the Configuration Word register.
3: MCLR and WDT Reset does not affect the previous value data latch. The GPIF bit will clear upon Reset but will set again if the mismatch
exists.
4: TRISIO3 always reads as ‘1’ since it is an input only pin.
PIC12F609/615/12HV609/615
DS41302A-page 14 Preliminary © 2006 Microchip Technology Inc.
TABLE 2-4: PIC12F615/HV615 SPECIAL FUNCTION REGISTERS SUMMARY BANK 1
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Page
Bank 1
80h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 22, 101
81h OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 16, 101
82h PCL Pro gr am Coun ter’s (PC) Least Significa nt Byt e 0000 0000 22, 101
83h STATUS IRP(1) RP1(1) RP0 TO PD ZDCC0001 1xxx 15, 101
84h FSR Indirect Data Memory Ad dress Pointer xxxx xxxx 22, 101
85h TRISIO TRISIO5 TRISIO4 TRISIO3(4) TRISIO2 TRISIO1 TRISIO0 --11 1111 31, 101
86h Unimplemented
87h Unimplemented
88h Unimplemented
89h Unimplemented
8Ah PCLATH Write Buffer for upper 5 bits of Program Counter ---0 0000 22, 101
8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF(3) 0000 0000 17, 101
8Ch PIE1 ADIE CCP1IE —CMIE TMR2IE TMR1IE -00- 0-00 18, 101
8Dh Unimplemented
8Eh PCON —PORBOR ---- --qq 20, 101
8Fh Unimplemented
90h OSCTUNE TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 29, 101
91h Unimplemented
92h PR2 Timer2 Module Period Register 1111 1111 51, 101
93h APFCON T1GSEL P1BSEL P1ASEL ---0 --00 18, 101
94h Unimplemented
95h WPU(2) —WPU5WPU4 WPU2 WPU1 WPU0 --11 -111 34, 101
96h IOC IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 34, 101
97h Unimplemented
98h Unimplemented
99h Unimplemented
9Ah Unimplemented
9Bh Unimplemented
9Ch Unimplemented
9Dh Unimplemented
9Eh ADRESL Least Significant 2 bits of the left shifted result or 8 bits of the right shifted result xxxx xxxx 71, 101
9Fh ANSEL ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 -000 1111 33, 101
Legend: – = Unimpl em ent ed locat io ns rea d as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: IRP and RP1 bits are reserved, always maintain these bits clear.
2: GP3 pull-up is enabled when MCLRE is1’ in the Configuration Word register.
3: MCLR and WDT Reset does not affect the previous value data latch. The GPIF bit will clear upon Reset but will set again if the mismatch
exists.
4: TRISIO3 always reads as ‘1’ since it is an input only pin.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 15
PIC12F609/615/12HV609/615
2.2.2.1 STATUS Register
The S TATUS register, shown in R e gis ter 2-1, cont ains:
the arithmetic status of the ALU
the Reset status
the bank select bits for data memory (RAM)
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabl ed. These bit s are set or clea red according to the
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
For exam ple, CLRF STATUS, will clear the upper three
bits and set the Z bit. This leaves the STATUS register
as ‘000u u1uu’ (where u = unchanged).
It is recommended, therefore, that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
STATUS register, because these instructions do not
affect any Status bits. For other instructions not affect-
ing any Status bits, see the Section 13.0 “Instruction
Set Summary”.
Note 1: Bi t s IRP a nd RP 1 of th e STATUS register
are not used by the PIC12F609/615/
12HV609/615 and should be maintained
as clear. Use of these bits is not recom-
mended, since this may affect upward
compatibility with future products.
2: The C and DC bits operate as a Borrow
and Digit Borrow out bit, respectively, in
subtraction. See the SUBLW and SUBWF
instructions for examples.
REGISTER 2-1: STATUS: STATUS REGISTER
Reserved Reserved R/W-0 R-1 R-1 R/W-x R/W-x R/W-x
IRP RP1 RP0 TO PD ZDCC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 IRP: This bit is reserved and should be maintained as ‘0
bit 6 RP1: This bit is reserved and should be maintained as ‘0
bit 5 RP0: Register Bank Select bit (used for direct addressing)
1 = Bank 1 (80h FFh)
0 = Bank 0 (00h 7Fh)
bit 4 TO: Time-out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 3 PD: Power-down bit
1 = After power-up or by the CLRWDT inst ruction
0 = By execution of the SLEEP instruction
bit 2 Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1 DC: Digit Carry/Borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions), For Borrow, the polarity is
reversed.
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand. For rot ate (RRF, RLF) instructi ons, this bit is loa ded with ei ther the high-order or low-or der
bit of the source register.
PIC12F609/615/12HV609/615
DS41302A-page 16 Preliminary © 2006 Microchip Technology Inc.
2.2.2.2 OPTION Register
The OPTION register is a readable and writable regis-
ter, which contains various control bits to configure:
Timer0/WDT prescaler
External GP2 /INT inte rrup t
•Timer0
Weak pull-ups on GPI O
Note: To achieve a 1:1 prescaler assignment for
Timer0, assign the prescaler to the WDT
by setting PSA bit to ‘1’ of the OPTION
register. See Section 5.1.3 “Software
Programmable Prescaler”.
REGISTER 2-2: OPTION_REG: OPTION REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GPPU: GPIO Pull-up Enable bit
1 = GPIO pull-ups are disabled
0 = GPIO pull-ups are enabled by individual PORT latch values
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of GP2/INT pin
0 = Interrupt on falling edge of GP2/INT pin
bit 5 T0CS: Timer0 Clock Source Select bit
1 = Transition on GP2/T0CKI pin
0 = Internal instruction cycle cloc k (FOSC/4)
bit 4 T0SE: Timer0 Source Edge Select bit
1 = Increm ent on high-to-low transition on GP2/T0CKI pin
0 = Increment on low-to-high transition on GP2/T0CKI pin
bit 3 PSA: Prescaler Assignment bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS<2:0>: Prescaler Rate Select bits
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
BIT VALUE TIMER0 RATE WDT RATE
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 17
PIC12F609/615/12HV609/615
2.2.2.3 INTCON Register
The INTCON register is a readable and writable
register, which c ontains the various en able and fl ag bit s
for TMR0 re gis ter overflow, GPIO chan ge a nd external
GP2/INT pin interrupts.
Note: Interru pt flag bi ts are set when an interrupt
conditi on occ urs, regar dless o f the s tate of
its corresponding enable bit or the Global
Enable bit, GIE of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
REGISTER 2-3: INTCON: INTERRUPT CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
GIE PEIE T0IE INTE GPIE T0IF INTF GPIF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GIE: Global Interrupt Enable bit
1 = Enables all unmasked interrupts
0 = Disables all interrupts
bit 6 PEIE: Peripheral Interrupt Enable bit
1 = Enables all unmasked peripheral interrupts
0 = Disables all peripheral interrupts
bit 5 T0IE: T imer0 Ov erfl ow Interru pt Enab le bit
1 = Enables the Timer0 interrupt
0 = Disables the Timer0 interrupt
bit 4 INTE: GP2/INT External Interrupt Enable bit
1 = Enables the GP2/INT external interrupt
0 = Disables the GP2/INT external interrupt
bit 3 GPIE: GPIO Change Interrupt Enable bit(1)
1 = Enables the GPIO change interrupt
0 = Disables the GPIO change interrupt
bit 2 T0IF: Timer0 Overflow Interrupt Flag bit(2)
1 = Timer0 register has overflowed (must be cleared in software)
0 = Timer0 register did not overflow
bit 1 INTF: GP2/INT External Interrupt Flag bit
1 = The GP2/INT external interrupt occurred (must be cleared in software)
0 = The GP2/INT external interrupt did not occur
bit 0 GPIF: GPIO Change Interrupt Flag bit
1 = When at least one of the GPIO <5:0> pins changed state (must be cleared in software)
0 = None of the GPIO <5:0> pins have changed state
Note 1: IOC register must also be enabled.
2: T0IF bit is set when TMR0 rolls over. TMR0 is unchanged on Reset and should be initialized before
clearing T0IF bit.
PIC12F609/615/12HV609/615
DS41302A-page 18 Preliminary © 2006 Microchip Technology Inc.
2.2.2.4 PIE1 Register
The PIE1 register contains the Peripheral Interrupt
Enable bits, as shown in Register 2-4.
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
REGISTER 2-4: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
U-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0
—ADIE
(1) CCP1IE(1) —CMIE —TMR2IE
(1) TMR1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0
bit 6 ADIE: A/D Converter (ADC) Interrupt Enable bit(1)
1 = Enables the ADC interrupt
0 = Disables the ADC interrupt
bit 5 CCP1IE: CCP1 Interrupt Enable bit(1)
1 = Enables the CCP1 interrupt
0 = Disables the CC P1 interrupt
bit 4 Unimplemented: Read as ‘0
bit 3 CMIE: Comparator I nterr upt Enab le bit
1 = Enables the Comparator interrupt
0 = Disables the Comparator interrupt
bit 2 Unimplemented: Read as ‘0
bit 1 TMR2IE: Timer2 to PR2 Match Interrupt Enable bit(1)
1 = Enables the Timer2 to PR2 match interrupt
0 = Disables the Timer2 to PR2 match interrupt
bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit
1 = Enables the Timer1 overflow interrupt
0 = Disables t he Timer1 overf low interrupt
Note 1: PIC12F615/HV615 only. PIC12F609/HV609 unimplemented, read as ‘0’.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 19
PIC12F609/615/12HV609/615
2.2.2.5 PIR1 Register
The PIR1 register c ont ains the Periphe ral Interrupt fla g
bits, as shown in Register 2-5.
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE of the INTCON register.
User software should ensure the
appropriate int errupt fla g bits are clear prior
to enabling an interrupt.
REGISTER 2-5: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1
U-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0
—ADIF
(1) CCP1IF(1) —CMIF —TMR2IF
(1) TMR1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0
bit 6 ADIF: A/D Interrupt Flag bit(1)
1 = A/D conversion complete
0 = A/D conversion has not completed or has not been started
bit 5 CCP1IF: CCP1 Interrupt Flag bit(1)
Capture mode:
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TMR1 register capture occurred
Compare mode:
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM mode:
Unused in this mode
bit 4 Unimplemented: Read as ‘0
bit 3 CMIF: Comparator Interrupt Flag bit
1 = Comparator output has changed (must be cleared in software)
0 = Comparator output has not changed
bit 2 Unimplemented: Read as ‘0
bit 1 TMR2IF: Timer2 to PR2 Match Interrupt Flag bit(1)
1 = Timer2 to PR2 match occurred (must be cleared in software)
0 = Timer2 to PR2 match has not occurred
bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit
1 = Timer1 register overflowed (must be cleared in software)
0 = Timer1 has not overflowed
Note 1: PIC12F615/HV615 only. PIC12F609/HV609 unimplemented, read as ‘0’.
PIC12F609/615/12HV609/615
DS41302A-page 20 Preliminary © 2006 Microchip Technology Inc.
2.2.2.6 PCON Register
The Power Control (PCON) register (see Table 11-2)
contains flag bits to differentiate between a:
Power-on Rese t (POR )
Brown-out Reset (BOR)
Watchdog Ti mer Reset (WDT)
External MCLR Reset
The PCON reg ister also controls the software enable of
the BOR.
The PCON register bits are shown in Register 2-6.
REGISTER 2-6: PCON: POWER CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0(1)
—PORBOR
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-2 Unimplemented: Read as ‘0
bit 1 POR: Power-o n Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR: Brown-out Reset Status bit
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
Note 1: Reads as ‘0’ if Brown-out Reset is disabled.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 21
PIC12F609/615/12HV609/615
2.2.2.7 APFCON Register
(PIC12F615/HV615 only)
The Alternat e Pin Fun ct ion Control (APFC ON) reg is ter
is used to steer specific peripheral input and output
functions between different pins. For this device, the
P1A, P1B and Timer1 Gate functions can be moved
between different pins.
The APFCON register bits are shown in Register 2-7.
REGISTER 2-7: APFCON: POWER CONTROL REGISTER(1)
U-0 U-0 U-0 R/W-0 U-0 U-0 R/W-0 R/W-0
T1GSEL P1BSEL P1ASEL
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0
bit 4 T1GSEL: TMR1 Input Pin Select bit
1 = T1G function is on GP3/T1G(2)/MCLR/VPP
0 = T1G function is on GP4/AN3/CIN1-/T1G/P1B(2)/OSC2/CLKOUT
bit 3-2 Unimplemented: Read as ‘0
bit 1 P1BSEL: P1B Output Pin Select bit
1 = P1B function is on GP4/AN3/CIN1-/T1G/P1B(2)/OSC2/CLKOUT
0 = P1B function is on GP0/AN0/CIN+/P1B/ICSPDAT
bit 0 P1ASEL: P1A Output Pin Select bit
1 = P1A function is on GP5/T1CKI/P1A(2)/OSC1/CLKIN
0 = P1A function is on GP2/AN2/T0CKI/INT/COUT/CCP1/P1A
Note 1: PIC12F615/HV615 only.
2: Alternate pin funct ion .
PIC12F609/615/12HV609/615
DS41302A-page 22 Preliminary © 2006 Microchip Technology Inc.
2.3 PCL and PCLATH
The Program Counte r (PC) is 13 bit s wide. The lo w byte
comes from the PCL register, which is a readable and
writable register . The high byte (PC<12: 8>) is not directl y
readable or writable and comes from PCLATH. On any
Reset, the PC is cleared. Figure 2-4 shows the two
situations for the loading of the PC. The upper example
in Figure 2-4 shows how the PC is loaded on a write to
PCL (PCLATH<4:0> PCH). The lower example in
Figure 2-4 show s how the PC is l oaded during a CALL or
GOTO instructi on (PC L ATH<4:3> PCH).
FIGURE 2-4: LOADING OF PC IN
DIFFERENT SITUATIONS
2.3.1 MODIFYING PCL
Executing any instruction with the PCL register as the
destination simultaneously causes the Program
Counter PC<12:8> bits (PCH) to be replaced by the
content s of th e PCLATH registe r. This allo ws the enti re
contents of the program counter to be changed by
writing the desire d upper 5 bit s to the PCLA T H registe r .
When th e lower 8 bits are written to the PCL register, all
13 bit s of the program cou nter will chan ge to the values
contained in the PCLATH register and those being
written to the PCL register.
A comput ed GOTO is a ccom pli shed by a ddi ng a n offset
to the program counter (ADDWF PCL). Care should be
exercised when jumping into a look-up table or
program branch table (computed GOTO) by modifying
the PCL register. Assuming that PCLATH is set to the
table start address, if the table length is greater than
255 instructions or if the lower 8 bits of the memory
address rolls over from 0xFF to 0x00 in the middle of
the table, then PCLATH must be incremented for each
address rollover that occurs between the table
beginning and the target location within the table.
For more information refer to Application Note AN556,
Implementing a Table Read” (DS00556).
2.3.2 STACK
The PIC12F609/615/12HV609/615 Family has an 8-
level x 13-bit wide hardware stack (see Figure 2-1).
The stack space is not part of either program or data
spac e and th e S ta ck Point er is not readable or writa ble.
The PC is PUSHed onto the stack when a CALL
instruc tion is exec uted or an interru pt causes a bra nch.
The st ack i s POPed in th e even t of a RETURN, RETLW
or a RETFIE instruction execution. PCLATH is not
affected by a PUS H or POP operation.
The st ack operates as a circular buf fer . This means that
after the stack has been PUSHed eight times, the ninth
push ov erwrite s the va lue tha t was store d from th e first
push. The tenth p us h ov erwr i tes the se co nd p us h (and
so on).
2.4 Indirect Addressing, INDF and
FSR Registers
The INDF register is no t a physical reg ister . Addr essing
the INDF register w ill cause indi rect addressing.
Indirect addressing is possible by using the INDF
register. Any instruction using the INDF register
actually accesses data pointed to by the File Select
Register (FSR). Reading INDF itself indirectly will
produce 00h. Writing to the INDF register indirectly
results in a no operation (although Status bits may be
affected). An effective 9-bit address is obtained by
concatenating the 8-bit FSR and the IRP bit of the
STATUS register, as shown in Figure 2-5.
A simple program to clear RAM location 40h-7Fh using
indirect addressing is shown in Example 2-1.
EXAMPLE 2-1: INDIR ECT ADDRESSING
PC
12 8 7 0
5PCLATH<4:0>
PCLATH
Instruction wit
h
ALU Result
GOTO, CALL
OPCODE <10:0
>
8
PC
12 11 10 0
11
PCLATH<4:3>
PCH PCL
87
2
PCLATH
PCH PCL
PCL a
s
Destinatio
n
Note 1: There are no Status bits to indicate stack
overflow or stack underflow conditions.
2: There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the
CALL, RETURN, RETLW and RETFIE
instructions or the vectoring to an
interr upt add ress.
MOVLW 0x40 ;initialize pointer
MOVWF FSR ;to RAM
NEXT CLRF INDF ;clear INDF register
INCF FSR ;inc pointer
BTFSS FSR,7 ;all done?
GOTO NEXT ;no clear next
CONTINUE ;yes continue
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 23
PIC12F609/615/12HV609/615
FIGURE 2-5: DIRECT/INDIRECT ADDRESSING PIC12F609/615/12HV609/615
Note 1: The RP1 and IRP bits are reserved; always maintain these bits clear.
2: Accesses in this area are mirrored back into Bank 0 and Bank 1.
Data
Memory
Indirect AddressingDirect Addressing
Bank Select Location Select
RP1(1) RP0 6 0
From Opcode IRP(1) File Select Register
70
Bank Select Location Select
00 01 10 11 180h
1FFh
00h
7Fh
Bank 0 Bank 1 B ank 2 Bank 3
NOT USED(2)
For memory map detail, see Figure 2-2.
PIC12F609/615/12HV609/615
DS41302A-page 24 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 25
PIC12F609/615/12HV609/615
3.0 OSCILLATOR MODULE
3.1 Overview
The Oscillator module has a wide variety of clock
sources and selection features that allow it to be used
in a wide range of applications while maximizing perfor-
mance and minimizing power consumption. Figure 3-1
illustrates a block diagram of the Oscillator module.
Clock sources can be configured from external
oscilla tors, quartz crystal resonators , ceramic resonators
and Resistor-Capacitor (RC) circuits. In addition, the
system clock source can be configured with a choice of
two selectable speeds: internal or external system clock
source.
The Os cillator mod ule can be c onfigured in one of eig ht
clock modes.
1. EC – External clock with I/O on O SC2/CLKOUT.
2. LP – 32 kHz Low-Power Crystal mode.
3. XT – Medium Gain Crystal or Ceramic Resonator
Oscillator mode.
4. HS – High Gain Crystal or Ceramic Resonator
mode.
5. RC – External Resistor-Capacitor (RC) with
FOSC/4 output on OSC2/CLKOUT.
6. RCIO – External Resistor-Capacitor (RC) with
I/O on OSC2/CLKOUT.
7. INTOSC – Internal oscillator with FOSC/4 output
on OSC2 and I/O on OSC1/CLKIN.
8. INTOSCIO – Internal oscillator with I/O on
OSC1/CLKIN and OSC2/CLKOUT.
Clock Source modes are configured by the FOSC<2:0>
bits in the Configuration Word register (CONFIG). The
Internal Oscillator module provides a selectable system
clock mode of either 4 MHz (Postscaler) or 8 MHz
(INTOSC).
FIGURE 3-1: PI C ® MCU CLOCK SOURCE BLOCK DIAGRAM
(CPU and Peripherals)
OSC1
OSC2
Sleep
External Oscillator
LP, XT, HS, RC, RCIO, EC
System Clock
MUX
FOSC<2:0>
(Configuration Word Register)
Internal Oscillator
INTOSC
8 MHz
Postscaler
4 MHz
INTOSC
IOSCFS<7>
PIC12F609/615/12HV609/615
DS41302A-page 26 Preliminary © 2006 Microchip Technology Inc.
3.2 Clock Source Modes
Clock Source modes can be classified as external or
internal.
External Clock mod es rely on e xternal circui try fo r
the clock source. Examples are: Oscillator mod-
ules (EC mode), quartz crystal resonators or
ceramic resonators (LP, XT and HS modes) and
Resistor-Capacitor (RC) mode cir c uits.
Internal clock sources are contained internally
within the Oscillator module. The Oscillator
module has two selectable clock frequencies:
4 MHz and 8 MHz
The syste m cl oc k ca n be selected between ex tern al or
internal clock sources via the FOSC<2:0> bits of the
Configuration Word register.
3.3 External Clock Modes
3.3.1 OSCILLATOR START-UP TIMER (OST)
If the Oscillator module is configured for LP, XT or HS
modes, the Oscillator Start-up Timer (OST) counts
1024 oscillations from OSC1. This occurs following a
Power-on Reset (POR) and when the Power-up Timer
(PWRT) has expired (if configured), or a wake-up from
Sleep. During this time, the program counter does not
increment and program execution is suspended. The
OST ensures that the oscillator circuit, using a quartz
cryst al res onator o r ce ramic res onator, has st arted an d
is providing a stable system clock to the Oscillator
module. When switching between clock sources, a
delay is required to allow the new clock to stabilize.
These oscillator delays are shown in Table 3-1.
TABLE 3-1: OSCILLATOR DELAY EXAMPLES
3.3.2 EC MODE
The External Clock (EC) mode allows an externally
generated logic level as the system clock source. When
operating in this mode, an external clock source is
connected to the OSC1 input and the OSC2 is available
for general purpose I/O. Figure 3-2 shows the pin
connections for EC mode.
The Oscillator Start-up Timer (OST) is disabled when
EC mode is selected. Therefore, there is no delay in
operation after a Power-on Reset (POR) or wake-up
from Sleep. Because the PIC® MCU design is fully
static, stopping the external clock input will have the
effect of halting the device while leaving all data intact.
Upon restarting the external clock, the device will
resume operation as if no time had elapsed.
FIGURE 3-2: EXTERNAL CLOCK (EC)
MODE OPERATION
Switch From Switch To Frequency Oscillator Delay
Sleep/POR INTOSC 125 kHz to 8 MHz Oscillator Warm-Up Delay (TWARM)
Sleep/POR EC, RC DC – 20 MHz 2 in struction cycles
Sleep/POR LP, XT, HS 32 kHz to 20 MHz 1024 Clock Cycles (OST)
OSC1/CLKIN
OSC2/CLKOUT(1)
I/O
Clock from
Ext. System PIC® MCU
Note 1: Alternate pin functions are listed in the
Section 1.0 “Device Overview.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 27
PIC12F609/615/12HV609/615
3.3.3 LP, XT, HS MODES
The LP, XT and HS modes support the use of quartz
crystal resonators or ceramic resonators connected to
OSC1 a nd OSC2 (Figur e 3-3). The mod e selects a low ,
medium or high gain setting of the internal
inverter-amplifier to support various resonator types
and speed.
LP Oscillator mode selects the lowest gain setting of
the internal inverter-amplifier. LP mode current
consum ption is the least of the three modes. This mode
is designed to drive only 32.768 kHz tuning-fork type
crystals (watch crystals).
XT Oscillator mode selects the intermediate gain
setting of the internal inverter-amplifier. XT mode
current c onsumption is the medium of the three mo des.
This mode is best suited to drive resonators with a
medium drive level specification.
HS Oscillator mode selects the highest gain setting of
the internal inverter-amplifier. HS mode current
consumption is the highest of the three modes. This
mode is best suited for resonators that require a high
drive setting.
Figure 3-3 and Figure 3-4 show typical circuits for
quartz crystal and ceramic resonators, respectively.
FIGURE 3-3: QUARTZ CRYSTAL
OPERATION (LP, XT OR
HS MODE)
FIGURE 3-4: CERAMIC RESONATOR
OPERATION
(XT OR HS MODE)
Note 1: A series resistor (RS) may be required for
quartz crystals with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 MΩ to 10 MΩ).
C1
C2
Quartz
RS(1)
OSC1/CLKIN
RF(2) Sleep
To Internal
Logic
PIC® MCU
Crystal
OSC2/CLKOUT
Note 1: Quartz crystal characteristics vary according
to type, package and manufacturer. The
user should consult the manufacturer data
sheet s for sp ecifi catio ns an d reco mmen ded
application.
2: Always veri fy os ci lla tor performance over
the VDD and temperature range that is
expected for the application.
3: For oscillator de sign assistance, re ference
the following Microchip Applications Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC® and PIC®
Devices” (DS00826)
• AN849, “Basic PIC® Oscillator Design
(DS00849)
• AN943, “Practical PIC® Oscillator
Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work
(DS00949)
Note 1: A series resistor (RS) may be required for
ceramic resonators with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 MΩ to 10 M Ω).
3: An additional parallel feedback resistor (RP)
may be required for proper ceramic resonator
operation.
C1
C2 Ceramic RS(1)
OSC1/CLKIN
RF(2) Sleep
To Internal
Logic
PIC® MCU
RP(3)
Resonator OSC2/CLKOUT
PIC12F609/615/12HV609/615
DS41302A-page 28 Preliminary © 2006 Microchip Technology Inc.
3.3.4 EXT ERNAL RC MODES
The external Resistor-Capacitor (RC) modes support
the use of an external RC circuit. This allows the
designer maximum flexibility in frequency choice while
keeping costs to a minimum when clock accuracy is not
required. There are two modes: RC and RCIO.
In RC mode, the RC circuit connects to OSC1.
OSC2/CLKOUT outputs the RC oscillator frequency
divide d by 4. This signal ma y b e u se d to provide a clock
for external circuitry, synchronization, calibration, test
or other application requirements. Figure 3-5 shows
the external RC mode connections.
FIGURE 3-5: EXTERNAL RC MODES
In RCIO mode, the RC circuit is connected to OSC1.
OSC2 becomes an additional general purpose I/O pin.
The RC oscillator frequency is a function of the supply
voltage, the resis tor (REXT) and capacito r (CEXT) values
and the operating temperature. Other factors affecting
the oscillator frequency are:
threshold voltage variation
component tolerances
pack aging variations in capacitance
The user also needs to take into account variation due
to tolerance of external RC components used.
3.4 Internal Clock Modes
The Oscillator module provides a selectable system
clock source of either 4 MHz or 8 MHz. The selectable
frequency is configured through the IOSCFS bit of the
Configuration Word.
The frequency o f the int erna l os ci llator can be trim me d
with a calibration value in the OSCTUNE register.
3.4.1 INTOSC AND INTOSCIO MODES
The INTOSC and INTOSCIO modes configure the
internal oscillators as the system clock source when
the devi ce is pr ogrammed using the o scillato r selectio n
or the FOSC<2:0> bits in the Configuration Word
register (CONFIG). See Section 11.0 “Special
Features of the CPU” for more information.
In INTOSC mode , OSC1/CLKIN i s availab le for genera l
purpose I/O. OSC2/CLKOUT outputs the selected
internal oscillator fre quency divide d by 4. The CLKO UT
signal may be used to provide a clock for external
circuitry, synchronization, calibration, test or other
application requirements.
In INTOSCIO mode, OSC1/CLKIN and OSC2/CLKOUT
are available for general purpose I/O.
OSC2/CLKOUT(1)
CEXT
REXT
PIC® MCU
OSC1/CLKIN
FOSC/4 o r
Internal
Clock
VDD
VSS
Recommended values: 10 kΩ REXT 100 kΩ, <3V
3 kΩ REXT 100 kΩ, 3-5V
CEXT > 20 pF, 2-5V
Note 1: Alternate pin functions are listed in
Section 1.0 “Device Overview”.
2: Output depends upon RC or RCIO Clock
mode.
I/O(2)
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 29
PIC12F609/615/12HV609/615
3.4.1.1 OSCTUNE Register
The oscillator is factory calibrated but can be adjusted
in software by writing to the OSCTUNE register
(Register 3-1).
The default value of the OSCTUNE register is ‘0’. The
value is a 5-bit two’s complement number.
When the OSCTUNE register is modified, the frequenc y
will begin shifting to the new frequency. Code execution
continues during this shift. There is no indicatio n that the
shift has occurred.
TABLE 3-2: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES
REGISTER 3-1: OSCTUNE: OSCILLATOR TUNING REGISTER
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TUN4 TUN3 TUN2 TUN1 TUN0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0
bit 4-0 TUN<4:0>: Frequency Tuning bits
01111 = Maximu m frequency
01110 =
00001 =
00000 = Oscillator module is running at the calibrated frequency.
11111 =
10000 = Minimum frequency
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Val ue on
POR, BOR
Value on
all other
Resets(1)
CONFIG(2) IOSCFS CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0
OSCTUNE —— TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 ---u uuuu
Legend: x = unknown, u = unchanged, = unimplemented locations read as ‘0’. Shaded cells are not used by oscillators.
Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.
2: See Configuration Word register (Register 11-1) for operation of all register bits.
PIC12F609/615/12HV609/615
DS41302A-page 30 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 31
PIC12F609/615/12HV609/615
4.0 I/O PORT
There are as many as six general purpose I/O pins
available. Depending on which peripherals are enabled,
some or all of the pins may not be a vailable as general
purpose I /O. In gen eral, when a per ipheral is enabled,
the associated pin may not be used as a general
purpose I/O pin.
4.1 GPIO and the TRISIO Registers
GPIO is a 6-bit wide port with 5 bidirectional and 1
input-only pin. The corres pond ing dat a di rec tion regis t er
is TRISIO (Register 4-2). Setting a TRISIO bit (= 1) will
make the corresponding GPIO pin an input (i.e., disable
the output driver). Clearing a TRISIO bit (= 0) will make
the corresponding GPIO pin an output (i.e., enables
output driver and put s the conten ts of the ou tput latch on
the selected pin). The exception is GP3, which is input
only and its TRIS bit will always read as1’. Example 4-1
shows how to ini tial ize G PIO.
Reading the GPIO register (Register 4-1) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then
written to the PORT data latch. GP3 reads ‘0’ when
MCLRE = 1.
The TRISIO register controls the direction of the
GPIO pins, even when they are being used as analog
inputs. The user must ensure the bits in the TRISIO
register are maintai ned set when usin g them as analo g
input s. I/O pin s co nfigure d as analo g inpu t alw ays rea d
0’.
EXAMPLE 4- 1: INITIALIZING GPIO
Note: The ANSEL register must be initialized to
configure an analog channel as a digital
input. Pi ns configu red as analo g inputs will
read ‘0’ and cannot generate an interrupt.
BANKSEL GPIO ;
CLRF GPIO ;Init GPIO
BANKSEL ANSEL ;
CLRF ANSEL ;digital I/O, ADC clock
;setting ‘don’t care’
MOVLW 0Ch ;Set GP<3:2> as inputs
MOVWF TRISIO ;and set GP<5:4,1:0>
;as outputs
REGISTER 4-1: GPIO: GPIO REGISTER
U-0 U-0 R/W-x R/W-0 R-x R/W-0 R/W-0 R/W-0
GP5 GP4 GP3 GP2 GP1 GP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Va lue at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 GP<5:0>: GPIO I/O Pin bit
1 = GPIO pin is > VIH
0 = GPIO pin is < VIL
REGISTER 4-2: TRISIO: GPIO TRI-STATE REGISTER
U-0 U-0 R/W-1 R/W-1 R-1 R/W-1 R/W-1 R/W-1
TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Va lue at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 TRISIO<5:0>: GPIO Tri-State Control bit
1 = GPIO pin configured as an input (tri-stated)
0 = GPIO pin configured as an output
Note 1: TRISIO<3> always reads ‘1’.
2: TRISIO<5:4> always reads ‘1’ in XT, HS and LP Oscillator modes.
PIC12F609/615/12HV609/615
DS41302A-page 32 Preliminary © 2006 Microchip Technology Inc.
4.2 Additional Pin Functions
Every GPIO pin on the PIC12F609/615/12HV609/615
has an interrupt-on-change option and a weak pull-up
option. The next three sections describe these
functions.
4.2.1 ANSEL REGISTER
The ANSEL register is used to configure the Input
mode of an I/O pin to analog. Setting the appropriate
ANSEL bit hi gh wil l ca us e all digi t al read s on the pi n to
be rea d as 0’ and allow analog functions on the pin to
operate correctly.
The state of the ANSEL bits has no affect on digital
output functions. A pin with TRIS clear and ANSEL set
will still operate as a digital output, but the Input mode
will be analog. This can cause unexpected behavior
when executing read-modify-write instructions on the
affec ted port.
4.2.2 WEAK PULL-UPS
Each of the GPIO pins, ex cept GP3, has an indi vidually
configurable internal weak pull-up. Control bits WPUx
enable or disable each pull-up. Refer to Register 4-5.
Each weak pull-up is automatically turned off when the
port pin is configured as an output. The pull-ups are
disabled on a Power-on Reset by the GPPU bit of the
OPTION register). A weak pull-up is automatically
enabled for GP3 when configured as MCLR and
disabled when GP3 is an I/O. There is no software
control of the MCLR pull-up.
4.2.3 INTERRUPT-ON-CHANGE
Each GPIO pin is individually configurable as an inter-
rupt-on-change pin. Control bits IOCx enable or disable
the interrupt funct ion for ea ch pin. Refer to Register 4-6 .
The interrupt-on-change is disabled on a Power-on
Reset.
For enabled interrupt-on-change pins, the values are
comp ared w ith the old value la tched on the last rea d of
GPIO. Th e ‘mismatch’ o utputs of t he last read are O R’d
together to set the GPIO Change Interrupt Flag bit
(GPIF) in the INTCON register (Register 2-3).
This interrupt can wake the device from Sleep. The
user, in the Interrupt Service Routine, clears the inter-
rupt by:
a) Any read o f GPIO AND Cle ar fl ag b it G PIF. This
will end the mismatch condition;
OR
b) Any write of GPIO AND Clear flag bit GPIF will
end the mismatch condition;
A mismatch condition will continue to set flag bit GPIF.
Reading GPIO will end the mismatch condition and
allow flag bit GPIF to be cleared. The latch holding the
last read value is not affected by a MCLR nor BOR
Reset. Afte r these res ets , the G PIF fla g will con tinue to
be set if a mismatch is present.
Note: If a change on the I/O pin should occur
when any GPIO operation is being
executed, then the GPIF interrupt flag may
not get set.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 33
PIC12F609/615/12HV609/615
REGISTER 4-3: ANSEL: ANALOG SELECT REGISTER (PIC12F609/HV609)
U-0 U-0 U-0 U-0 R/W-1 U-0 R/W-1 R/W-1
—ANS3 ANS1 ANS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Uni m plemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-4 Unimplemented: Read as ‘0
bit 3 ANS3: Analog Se lect bi ts
Analog se le ct betw een analog or digital functi on on pi ns AN<7:0 >, res pectively.
1 = Analog input. Pin is assi gn ed as analog in pu t(1).
0 = Digital I/O. Pin is assigned to port or special function.
bit 2 Unimplemented: Read as ‘0
bit 1 ANS1: Analog Select Between Analog or Digital Function on Pins GP1
1 = Analog input. Pin is assigned as analog in put. (1)
0 = Digital I/O. Pin is assigned to port or special function.
bit 0 ANS0: Analog Select Between Analog or Digital Function on Pins GP0
0 = Digital I/O. Pin is assigned to port or special function.
1 = Analog input. Pin is assigned as analog in put. (1)
Note 1: Setting a pin to an analo g in put automat i call y di s abl es the digital input ci rc ui try, weak pull-ups, an d
interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow external
contro l of the voltage on the pi n.
REGISTER 4-4: ANSEL: ANALOG SELECT REGISTER (PIC12F615/HV615)
U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Uni m plemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0
bit 6-4 ADCS<2:0>: A/D Conversion Cloc k Se le ct bits
000 = FOSC/2
001 = FOSC/8
010 = FOSC/32
x11 = FRC (clock derived from a dedicated internal oscillator = 500 kHz max)
100 = FOSC/4
101 = FOSC/16
110 = FOSC/64
bit 3-0 ANS<3:0>: Analog Select bits
Analog se le ct betw een analog or digital functi on on pi ns AN<7:0 >, res pectively.
1 = Analog input. Pin is assi gn ed as analog in pu t(1).
0 = Digital I/O. Pin is assigned to port or special function.
Note 1: Setting a pin to an analo g in put automat i call y di s abl es the digital input ci rc ui try, weak pull-ups, an d
interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow external
contro l of the voltage on the pi n.
PIC12F609/615/12HV609/615
DS41302A-page 34 Preliminary © 2006 Microchip Technology Inc.
REGISTER 4-5: WPU: WEAK PULL-UP GPIO REGISTER
U-0 U-0 R/W-1 R/W-1 U-0 R/W-1 R/W-1 R/W-1
WPU5 WPU4 WPU2 WPU1 WPU0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as0
bit 5-4 WPU<5:4>: Weak Pull-up Control bits
1 = Pull-up enabled
0 = Pull-up disabled
bit 3 Unimplemented: Read as0
bit 2-0 WPU<2:0>: Weak Pull-up Control bits
1 = Pull-up enabled
0 = Pull-up disabled
Note 1: Global GPPU must be enabled for individual pull-ups to be enabled.
2: The weak pull-up device is automatically disabled if the pin is in Output mode (TRISIO = 0).
3: The GP3 pull-up is enabled when configured as MCLR and disabled as an I/O in the Configuration Word.
4: WPU<5:4> always reads ‘1’ in XT, HS and LP Oscillator modes.
REGISTER 4-6: IOC: INTERRUPT-ON-CHANGE GPIO REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IOC5 IOC4 IOC3 IOC2 IOC1 IOC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as0
bit 5-0 IOC<5:0>: Interrupt-on-change GPIO Control bit
1 = Interrupt-on-change enabled
0 = Interrupt-on-change disabled
Note 1: Global Interrupt Enable (GIE) must be enabled for individual interrupts to be recognized.
2: IOC<5:4> always reads ‘1 in XT, HS and LP Oscillator modes .
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 35
PIC12F609/615/12HV609/615
4.2.4 PIN DESCRIPTIONS AND
DIAGRAMS
Each GPIO pin is multiplexed with other functions. The
pins and their combined f unc tio ns a r e bri efl y de sc ribe d
here. For specific information about indi vidual function s
such as the Comparator or the ADC, refer to the
appropriate section in this data sheet.
4.2.4.1 GP0/AN0(1)/CIN+/P1B(1)/ICSPDAT
Figure 4-1 shows th e dia gram fo r this pin. T he GP0 pin
is configurable to function as one of the following:
a general purpose I/O
an analog input for the ADC(1)
an analog non-inverting input to the comparator
a PWM output(1)
In-Circuit Serial Programming data
4.2.4.2 GP1/AN1(1)/CIN0-/VREF(1)/ICSPCLK
Figur e 4-1 s hows th e diag ram fo r this pin. T he GP1 pin
is configurable to function as one of the following:
a general purpo se I/O
an analog input for the ADC(1)
an analog inverting input to the comparator
a voltage reference input for the ADC(1)
In-Circuit Serial Programming clock
FIGURE 4-1: BLOCK DIAGRAM OF GP<1:0>
Note 1: PIC12F615/HV615 only.
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
VDD
D
EN
Q
D
EN
Q
Weak
RD GPIO
RD
WR
WR
RD
WR
IOC
RD
IOC
Interrupt-on-
To Comparator
Analog(1)
Input Mode
GPPU
Analog(1)
Input Mode
Change
Q1
WR
RD
WPU
Data Bus
WPU
GPIO
TRISIO
TRISIO
GPIO
Note 1: Comparator mode and ANSEL det ermines Analog Input mode.
2: Set has priority over Reset.
3: PIC12F615/HV615 only.
To A/D Converter(3)
I/O Pin
S(2)
R
Q
From other
GP<5:0> pins (GP0)
Write 0’ to GBIF GP<5:2, 0> pins (GP1)
PIC12F609/615/12HV609/615
DS41302A-page 36 Preliminary © 2006 Microchip Technology Inc.
4.2.4.3 GP2/AN2(1)/T0CKI/INT/COUT/CCP1(1)/
P1A(1)
Figure 4-2 shows th e dia gram fo r this pi n. T he GP2 pin
is configurable to function as one of the following:
a general purpose I/O
an analog input for the ADC(1)
the clock inp ut fo r TMR0
an external edge triggered interrupt
a digital output from Comparator
a Capture input/Co mpare input/PWM output(1)
a PWM output(1)
FIGURE 4-2: BLOCK DIAGRAM OF GP2
Note 1: PIC12F615/HV615 only.
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
VDD
D
EN
Q
D
EN
Q
Weak
RD GPIO
RD
WR
WR
RD
WR
IOC
RD
IOC
Interrupt-on-
To INT
Analog(1)
Input Mode
GPPU
Analog(1)
Input Mode
Change
Q1
WR
RD
WPU
Data Bus
WPU
GPIO
TRISIO
TRISIO
GPIO
Note 1: Comparator mode and ANSEL determines Analog Input mode.
2: Set has priority over Reset.
3: PIC12F615/HV615 only.
To A/D Converter(3)
I/O Pin
S(2)
R
Q
From other
GP< 5 :3, 1:0> pins
Write 0’ to GBIF
0
1
C1OE
C1OE
Enable
To Timer0
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 37
PIC12F609/615/12HV609/615
4.2.4.4 GP3/T1G(1, 2)/MCLR/VPP
Figure 4-3 shows th e dia gram fo r this pin. T he GP3 pin
is configurable to function as one of the following:
a general purpose input
a Timer1 gate (count enable), alternate pin(1, 2)
as Master Clear Reset with weak pull-up
FIGURE 4-3: BLOCK DIAGRAM OF GP3
Note 1: Al tern ate pin funct ion .
2: PIC12F615/HV615 only.
VSS
D
Q
CK
Q
D
EN
Q
Data Bus
RD GPIO
RD
GPIO
WR
IOC
RD
IOC
Reset MCLRE
RD
TRISIO VSS
D
EN
Q
MCLRE
VDD
Weak
MCLRE
Q1
Input
Pin
Interrupt-on-
Change
S(1)
R
Q
From other
Write ‘0’ to GBIF
Note 1: Set has priority over Reset
GP<5:4, 2:0> pins
PIC12F609/615/12HV609/615
DS41302A-page 38 Preliminary © 2006 Microchip Technology Inc.
4.2.4.5 GP4/AN3(1)/CIN1-/T1G/
P1B(1, 2)/OSC2/CLKOUT
Figure 4-4 shows th e dia gram fo r this pi n. T he GP4 pin
is configurable to function as one of the following:
a general purpose I/O
an analog input for the ADC(1, 2)
Comparator inverting input
a Timer1 gate (count enable)
PWM output, alternate pin(1, 2)
a cryst al/ reso nator connectio n
a cloc k outpu t
FIGURE 4-4: BLOCK DIAGRAM OF GP4
Note 1: Alternate pin function.
2: PIC12F615/HV615 only.
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
VDD
D
EN
Q
D
EN
Q
Weak
Analog
Input Mode
Data Bus
WR
WPU
RD
WPU
RD
GPIO
WR
GPIO
WR
TRISIO
RD
TRISIO
WR
IOC
RD
IOC
FOSC/4
To A/D Converter(5)
Oscillator
Circuit
OSC1
CLKOUT
0
1
CLKOUT
Enable
Enable
Analog(3)
Input Mode
GPPU
RD GPIO
To T1G
INTOSC/
RC/EC(2)
CLK(1)
Modes
CLKOUT
Enable
Note 1: CLK modes are XT, HS, LP, TMR1 LP and CLKOUT Enable.
2: With CLKOUT option.
3: Analog Input mode comes from ANSEL.
4: Set has priority over Reset.
5: PIC12F61 5/H V615 only.
Q1
I/O Pin
Interrupt-on-
Change
S(4)
R
Q
From other
Write ‘0’ to GBIF
GP<5, 3:0> pins
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 39
PIC12F609/615/12HV609/615
4.2.4.6 GP5/T1CKI/P1A(1, 2)/OSC1/CLKIN
Figure 4-5 shows th e dia gram fo r this pin. T he GP5 pin
is configurable to function as one of the following:
a general purpose I/O
a Timer1 clock input
PWM output, alternate pin(1, 2)
a crystal/resonator connection
a clock input
FIGURE 4-5: BLOCK DIAGRAM OF GP5
Note 1: Alternate pin function.
2: PIC12F6 15/HV615 only.
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
VDD
D
EN
Q
D
EN
Q
Weak
Data Bus
WR
WPU
RD
WPU
RD
GPIO
WR
GPIO
WR
TRISIO
RD
TRISIO
WR
IOC
RD
IOC
To Timer1
INTOSC
Mode
RD GPIO
INTOSC
Mode
GPPU
OSC2
Note 1: Timer1 LP Oscillator enabled.
2: Set has priority over Reset.
TMR1LPEN(1)
Oscillator
Circuit
Q1
I/O Pin
Interrupt-on-
Change
S(2)
R
Q
From other
GP<4:0> pins
Write ‘0’ to GBIF
PIC12F609/615/12HV609/615
DS41302A-page 40 Preliminary © 2006 Microchip Technology Inc.
TABLE 4-1: SUMMARY OF REGISTERS ASSOCIATED WITH GPIO
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
ANSEL ADCS2(1) ADCS1(1) ADCS0(1) ANS3 ANS2(1) ANS1 ANS0 -000 1111 -000 1111
CMCON0 CMON COUT CMOE CMPOL —CMR—CMCH0000 -0-0 0000 -0-0
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
IOC IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 --00 0000
OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
GPIO GP5 GP4 GP3 GP2 GP1 GP0 --x0 x000 --u0 u000
TRISIO TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
WPU WPU5 WPU4 WPU2 WPU1 WPU0 --11 -111 --11 -111
T1CON T1OSCEN ———---- 0---
CCP1CON CCP1M3 CCP1M2 CCP1M1 CCP1M0 ---- 0000
APFCON T1GSEL P1BSEL P1ASEL ---0 --00
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by GPIO.
Note 1: PIC12F615/HV615 only.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 41
PIC12F609/615/12HV609/615
5.0 TIMER0 MODULE
The Timer0 module is an 8-bit timer/counter with the
following features:
8-bit timer/counter register (TMR0)
8-bit prescaler (shared with Watchdog Timer)
Programmable internal or external clock source
Programmable external clock edge selection
Interrupt on ov erfl ow
Figure 5-1 is a block diagram of the Timer0 module.
5.1 Timer0 Operation
When use d as a tim er, the Timer0 modul e can be used
as either an 8-bit timer or an 8-bit counter.
5.1.1 8-BIT TIMER MODE
When used as a timer, the Timer0 module will
increment every instruction cycle (without prescaler).
Timer mode is selected by clearing the T0CS bit of the
OPTION register to ‘0’.
When TMR0 is written, the increment is inhibited for
two instruction cycles immediately following the write.
5.1.2 8-BIT COUNTER MODE
When used as a counter, the Timer0 module will
increment on every rising or falling edge of the T0CKI
pin. The incrementing edge is determined by the T0SE
bit of the OPTION register . Counter mode is selected by
setting the T0CS bit of the OPTION register to 1’.
FIGURE 5-1: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER
Note: The value writ ten to the T MR0 register can
be adju sted, in order to ac count for th e two
instruction cycle delay when TMR0 is
written.
T0CKI
T0SE
pin
TMR0
Watchdog
Timer
WDT
Time-out
PS<2:0>
WDTE
Data Bus
Set Flag bit T0IF
on Overflow
T0CS
Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION register.
2: WDTE bit is in the Configuration Word regist er.
0
1
0
1
0
1
8
8
8-bit
Prescaler
0
1
FOSC/4
PSA
PSA
PSA
Sync
2 TCY
PIC12F609/615/12HV609/615
DS41302A-page 42 Preliminary © 2006 Microchip Technology Inc.
5.1.3 SOFTWAR E PROGRAMMABLE
PRESCALER
A single software programmable prescaler is available
for use with either Timer0 or the Watchdog Timer
(WDT), but not both simultaneously. The prescaler
assignme nt is control led by the PSA bit o f the OPTI ON
register. To assi gn t he p res ca ler t o Timer0, the PSA b it
must be cleared to a ‘0’.
There are 8 prescaler options for the Timer0 module
ranging from 1:2 to 1:256. The prescale values are
select able via the PS<2:0> bit s of the OPTIO N register .
In order to have a 1:1 prescaler value for the Timer0
module, the prescaler must be assigned to the WDT
module.
The prescaler is not readable or writable. When
assigned to the T im er0 module, all instructions writing to
the TMR0 register will clear the prescaler.
When the prescaler is assigned to WDT, a CLRWDT
instruction will clear the prescaler along with the WDT.
5.1.3.1 Switching Prescaler Between
Timer0 and WDT Modules
As a result of having the prescaler assigned to either
Timer0 or the WDT, it is possible to generate an
unintended device Reset when switching prescaler
values . When chan gin g th e presca le r ass ig nme nt from
Timer0 to the WDT module, the instruction sequence
shown in Example 5-1, must be executed.
EXAMPLE 5-1: CHANGING PRESCALER
(TIMER0 WDT)
When changing the prescaler assignment from the
WDT to the Timer0 module, the following instruction
sequence must be execute d (see Example 5-2) .
EXAMPLE 5-2: CHANGIN G PRESCALER
(WDT TIMER0)
5.1.4 TIMER0 INTERRUPT
Timer0 will generate an interrupt when the TMR0
register overflows from FFh to 00h. The T0IF interrupt
flag bit of the INTCON register is set every time the
TMR0 register overflows, regardless of whether or not
the Timer0 interrupt is enabled. The T0IF bit must be
cleared in software. The Timer0 interrupt enable is the
T0IE bit of the INTCON register.
5.1.5 USING TIMER0 WITH AN
EXTERNAL CLOCK
When Timer0 is in Count er mo de, the syn chronizatio n
of the T0CKI input and the Timer0 register is accom-
plished by sampling the prescaler output on the Q2 and
Q4 cycles of the internal phase clocks. Therefore, the
high and low peri od s of the ex tern al cl oc k so urc e mus t
meet the timing requirements as shown in the
Section 15.0 “Electrical Specifications”.
BANKSEL TMR0 ;
CLRWDT ;Clear WDT
CLRF TMR0 ;Clear TMR0 and
;prescaler
BANKSEL OPTION_REG ;
BSF OPTION_REG,PSA ;Select WDT
CLRWDT ;
;
MOVLW b’11111000’ ;Mask prescaler
ANDWF OPTION_REG,W ;bits
IORLW b’00000101’ ;Set WDT prescaler
MOVWF OPTION_REG ;to 1:32
Note: The Timer0 interrupt cannot wake the
processor from Sleep since the timer is
frozen during Sle ep.
CLRWDT ;Clear WDT and
;prescaler
BANKSEL OPTION_REG ;
MOVLW b’11110000’ ;Mask TMR0 select and
ANDWF OPTION_REG,W ;prescaler bits
IORLW b’00000011’ ;Set prescale to 1:16
MOVWF OPTION_REG ;
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 43
PIC12F609/615/12HV609/615
TABLE 5-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0
REGISTER 5-1: OPTION_REG: OPTION REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GPPU: GPIO Pull-up Enable bit
1 = GPIO pull-ups are disabled
0 = GPIO pull-ups are enabled by individual PORT latch values in WPU register
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of INT pin
0 = Interrupt on falling edge of INT pin
bit 5 T0CS: TMR0 Clock Sourc e Sele ct bit
1 = Transit ion on T0CK I pin
0 = Internal instruction cycle cloc k (FOSC/4)
bit 4 T0SE: TMR0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3 PSA: Prescaler Assignme nt bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS<2:0>: Prescaler Rate Select bits
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
BIT VA LUE T MR0 R ATE WDT RAT E
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 000x 0000 000x
OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
TRISIO TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
Legend: – = Unimplemented locations, read as0’, u = unchanged, x = unknown. Shaded cells are not used by the T imer0
module.
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DS41302A-page 44 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 45
PIC12F609/615/12HV609/615
6.0 TIMER1 MODULE WITH GATE
CONTROL
The Timer1 module is a 16-bit timer/counter with the
following features:
16-bit tim er/coun ter register p air (TMR 1H:TMR 1L)
Programmable internal or external clock source
3-bit prescaler
Op tional LP oscillator
Synchronous or asynchronous operation
Timer1 gate (count enable) via comparator or
T1G pin
Interrupt on ov erfl ow
Wake-up on ov erfl ow (external clock,
Asynchronous mode only)
Time base for the Capture/Compare function
Specia l Event Trigger (with ECCP)
Comparator output synchronization to Timer1
clock
Figure 6-1 is a block diagram of the Timer1 module.
6.1 Timer1 Operation
The Timer1 module is a 16-bit incrementing counter
which is accessed through the TMR1H:TMR1L register
pair. Writes to TMR1H or TMR1L directly update the
counter.
When used with an interna l clock source, t he modul e is
a time r. Whe n used with an extern al clo ck source , the
module can be used as either a timer or counter.
6.2 Clock Source Selection
The TMR1CS bit of the T1CON register is used to select
the clock source. When TMR1CS = 0, the clock source
is FOSC/4. When TMR1CS = 1, the clock source is
supplied exte rnally.
Clock Source TMR1CS T1ACS
FOSC/4 00
FOSC 01
T1CKI pin 1x
PIC12F609/615/12HV609/615
DS41302A-page 46 Preliminary © 2006 Microchip Technology Inc.
FIGURE 6-1: TIMER1 BLOCK DIAGRAM
TMR1H TMR1L
Oscillator T1SYNC
T1CKPS<1:0>
FOSC/4
Internal
Clock
Prescaler
1, 2, 4, 8
1
0
0
1
Synchronized
clock input
2
Set fl ag b it
TMR1IF on
Overflow TMR1(2)
TMR1GE
TMR1ON
T1OSCEN
1
0
COUT
T1GSS
T1GINV
To Comparator Module
Timer1 Clock
TMR1CS
OSC2/T1G
OSC1/T1CKI
Note 1: ST Buffer is low power type when using LP oscillator, or high speed type when using T1CKI.
2: Timer1 register increments on rising edge.
3: Synchronize does not operate while in Sleep.
4: Alternate pi n function.
5: PIC12F615/HV615 only.
(1)
EN
INTOSC
Without CLKOUT 1
0
T1ACS
FOSC
0
1
T1GSEL(2)
GP3/T1G(4, 5)
Synchronize(3)
det
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 47
PIC12F609/615/12HV609/615
6.2.1 INTERNAL CLOCK SOURCE
When the internal clock source is selected, the
TMR1H:TMR1L register pair will increment on multiples
of TCY as determined by the Timer1 prescaler.
6.2.2 EXT ERNAL CLOCK SOURCE
When the external clock sour ce is selected, the Timer1
module may wo rk as a timer or a cou nter.
When counting, Timer1 is incremented on the rising
edge of the external clock input T1CKI. In addition, the
Counter mode clock can be synchronized to the
microcontroller system clock or run async hronously.
If an external clock oscillator is needed (and the
microc ontroller is using the INTOS C withou t CLKOUT),
Timer1 can use the LP oscillator as a clock source.
In Counter mode, a falling edge must be registered by
the counter prior to the first incrementing rising edge
after one or more of the following conditions:
Timer1 is enabled after POR or BOR Reset
A write to TMR1H or TMR1L
T1CKI is high when Timer1 is disabled and when
Timer1 is reenabl ed T1 CK I is low. See Figure 6-2.
6.3 Timer1 Prescaler
Timer1 has four prescaler options allowing 1, 2, 4 or 8
divisions of the clock input. The T1CKPS bits of the
T1CON register control the prescale counter. The
prescale counter is not directly readable or writable;
however , the prescaler counter is cleared upon a write to
TMR1H or TMR1L.
6.4 Timer1 Oscillator
A low-power 32.768 kHz crystal oscillator is built-in
between pins OSC1 (input) and OSC2 (output). The
oscillator is enabled by setting the T1OSCEN control
bit of th e T1CON register. The oscillat or will continue to
run during Sleep.
The Timer1 oscillator is shared with the system LP
oscillator. Thus, Timer1 can us e this mode only when
the primary system clock is derived from the internal
oscill ator or when in LP osci llator mod e. The user m ust
provide a software time delay to ensure proper oscilla-
tor start-up.
TRISIO5 and TRISIO4 bits are set when the Timer1
oscill ator is enable d. GP5 an d GP 4 bit s read as ‘0’ an d
TRISIO5 and TRISIO4 bits read as ‘1’.
6.5 Timer1 Operation in
Asynchronous Counter Mode
If control bit T1SYNC of the T1CON register is set, the
external clock input is not synchronized. The timer
continues to increment asynchronous to the internal
phase clocks. The timer will continue to run during
Sleep and can generate an interrupt on overflow,
which will wake-up the processor. However, special
precautions in software are needed to read/write the
timer (see Section 6.5.1 “Reading and Writing
Timer1 in Asynchronous Counter Mode”).
6.5.1 READING AND WRITING TIMER1 IN
ASYNCHRONOUS COUNTER
MODE
Reading TMR1H or TMR1L while the timer is running
from an e xternal asyn chronous cl ock will ens ure a valid
read (taken care of in hardware). However, the user
should keep i n mind that rea ding t he 16-bi t time r in tw o
8-bit values itself poses certain problems, since the
timer may overflow between the reads.
For writes , it is re commend ed that th e user s imply sto p
the timer and write the desired values. A write
conte ntion may occ ur by w ritin g to th e timer regist ers,
while the register is incrementing. This may pro duce an
unpredictable value in the TMR1H:TTMR1L register
pair.
6.6 Timer1 Gate
Timer1 gate source is software configurable to be the
T1G pin (or the alternate T1G pin) or the output of the
Comparator. This allows the device to directly time
external events using T1G or analog events using the
Comparator. See the CMCON1 Register (Register 8-2)
for selecting the Timer1 gate source. This feature can
simplify the software for a Delta-Sigma A/D converter
and many other applications. For more information on
Delta-Sigma A/D converters, see the Microchip web site
(www.microchip.com).
Timer1 gate can be inverted using the T1GINV bit of
the T1CON register, whether it orig inates from the T1G
pin or th e Comparator output. This configures T imer1 to
measure either the active-high or active-low time
between events.
Note: The oscillator requires a start-up and
stabilization time before use. Thus,
T1OSCEN should be set and a suitable
delay observed prior to enabling Timer1.
Note: When switching from synchronous to
asynchronous operation, it is possible to
skip an increment. When switching from
asynchronous to synchronous operation,
it is possible to produce a single spurious
increment.
Note: TMR1GE bit of the T1CON register must
be set to use either T1G or COUT as the
Timer1 gate source. See Register 8-2 for
more information on selecting the Timer1
gate sou rce .
PIC12F609/615/12HV609/615
DS41302A-page 48 Preliminary © 2006 Microchip Technology Inc.
6.7 Timer1 Interrupt
The Timer1 register pair (TMR1H:TMR1L) increments
to FFFFh and rolls over to 0000h. When Timer1 rolls
over, the Ti mer1 in terrupt fl ag bit of th e PIR1 regis ter is
set. To enable the interrupt on rollover, you must set
these bits:
Timer1 interrupt enable bit of the PIE1 register
PEIE bit of the INTCON register
GIE bit of the INTCON register
The interrupt is cleared by clearing the TMR1IF bit in
the Interrupt Service Routine.
6.8 Timer1 Operation During Sleep
Timer1 can only operate during Sleep when setup in
Asynch ronous Counter mode. In this mode, an external
crystal or clock source can be used to increment the
counter. To set up the timer to wake the device:
TMR1ON bit of the T1CON register must be set
TMR1IE bit of the PIE1 register must be set
PEIE bit of the INTCON register must be set
The device will wake-up on an overflow and execute
the next instruction. If the GIE bit of the INTCON
register is set, the device will call the Interrupt Service
Routine (0004h).
6.9 ECCP Capture/Compare Time
Base (PIC12F615/HV615 only)
The ECCP module uses the TMR1H:TMR1L register
pair as the time base when operating in Capture or
Compare mode.
In Capture mode, the value in the TMR1H:TMR1L
register pair is copied into the CCPR1H:CCPR1L
register pair on a configured event.
In Compare mode, an event is triggered when the v alue
CCPR1H:CCPR1L register pair matches the value in
the TMR1H:TMR1L register pair. This event can be a
Special Event Trigger.
For more information, see Section 10.0 “Enhanced
Capture/Compare/PWM (With Auto-Shutdown and
Dead Band) Module (PIC12F615/HV615 only)”.
6.10 ECCP Special Event Trigger
(PIC12F615/HV615 only)
If a ECCP is configured to trigger a special event, the
trigger will clear the TMR1H:TMR1L register pair. This
special event does not cause a Timer1 interrupt. The
ECCP module may still be configured to generate a
ECCP interrupt.
In this mode of o peration, the CCPR1H:CCPR1L regis-
ter pair effectively becomes the period register for
Timer1.
Timer1 should be synchronized to the FOSC to utilize
the Special Event Trigger. Asynchronous operation of
Timer1 can cause a Special Event Trigger to be
missed.
In the eve nt that a wri te to TMR1H or TM R1L coinci des
with a Special Event Trigger from the ECCP, the write
will take precedence.
For more information, see Section 10.0 “Enhanced
Capture/Compare/PWM (With Auto-Shutdown and
Dead Band) Module (PIC12F615/HV615 only)”.
6.11 Comparator Synchronization
The same cloc k used to incr ement Timer1 can also be
used to synchronize the comparator output. This
feature is enabled in the Comparator module.
When using the comparator for Timer1 gate, the
comparator output should be synchronized to Timer1.
This ensures Timer1 does not miss an increment if the
comp ara tor changes.
FIGURE 6-2: TIMER1 INCREMENTING EDGE
Note: The T MR1H:TTMR1L register p air and the
TMR1IF bit should be cleared before
enabling interrupts.
T1CKI = 1
when TMR1
Enabled
T1CKI = 0
when TMR1
Enabled
Note 1: Arrows indicate counter increm ents.
2: In Counter mode, a falling edge must be re gistered by the counter prior to t he first incrementing rising edge of
the clock.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 49
PIC12F609/615/12HV609/615
6.12 Timer1 Control Register
The Timer1 Control register (T1CON), shown in
Register 6-1, is used to control Timer1 and select the
various features of the Timer1 module.
REGISTER 6-1: T1CON: TIMER 1 CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
T1GINV(1) TMR1GE(2) T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7 T1GINV: Timer1 Gate Invert bit(1)
1 = Timer1 gate is active-high (Timer1 counts when gate is high)
0 = Timer1 gate is active-low (Timer1 counts when gate is low)
bit 6 TMR1GE: Timer1 Gate Enable bit(2)
If TMR1ON = 0:
This bit is ignored
If TMR1ON = 1:
1 = Timer1 is on if Timer1 gate is active
0 = Timer1 is on
bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale Value
10 = 1:4 Prescale Value
01 = 1:2 Prescale Value
00 = 1:1 Prescale Value
bit 3 T 1OSCEN: LP Osci lla tor Enab le C ontro l bit
If INTOSC without CLKOUT oscillator is active:
1 = LP oscillator is enabled for Timer1 clock
0 = LP oscillator is off
Else:
This bit is ignored. LP oscillator is disabled.
bit 2 T1SYNC: Timer1 External Clock Input Synchronization Control bit
TMR1 CS = 1:
1 = Do not synchroniz e exte rnal cloc k inp ut
0 = Synchronize external clock input
TMR1 CS = 0:
This bit is ignored. Timer1 uses the internal clock
bit 1 TMR1CS: Timer1 Cloc k Source Sele ct bit
1 = External clock from T1CKI pin (on the rising edge)
0 = Internal clock (FOSC/4)
bit 0 TMR1ON: Ti mer1 On bit
1 = Enables Timer1
0 = Stops Timer1
Note 1: T1GINV bit inverts the Timer1 gate logic, regardless of source.
2: TMR1GE bit must be set to use either T1G pin or COUT, as selected by the T1GSS bit of the CMCON1
register, as a Timer1 gate source.
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DS41302A-page 50 Preliminary © 2006 Microchip Technology Inc.
TABLE 6-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
APFCON(1) T1GSEL P1BSEL P1ASEL ---0 --00 ---0 --00
CMCON0 CMON COUT CMOE CMPOL —CMR —CMCH0000 -0-0 0000 -0-0
CMCON1 T1ACS CMHYS T1GSS CMSYNC ---0 0-10 ---0 0-10
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 000x 0000 000x
PIE1 ADIE(1) CCP1IE(1) CMIE TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 ADIF(1) CCP1IF(1) CMIF TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu
Legend: x = unknown, u = unchanged, - = unimplemented, read as0’. Shaded cells are not used by the Timer1 module.
Note 1: PIC12F615/HV615 only.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 51
PIC12F609/615/12HV609/615
7.0 TIMER2 MO DULE
(PIC12F615/HV615 ONLY)
The Timer2 module is an 8-bit timer with the following
features:
8-bit timer register (TMR2)
8-bit period register (PR2)
Interrupt on TMR2 match with PR2
Software programmable prescaler (1:1, 1:4, 1:16)
Software programmable postscaler (1:1 to 1:16)
See Figure 7-1 for a block diagram of Timer2.
7.1 Timer2 Operation
The clock input to the Timer2 module is the system
instruction clock (FOSC/4). The clock is fed into the
Timer2 prescaler, which has prescale options of 1:1,
1:4 or 1:16. The output of the prescaler is then use d to
increm ent the TM R2 regis ter.
The val ues of T MR2 and PR2 are co nstan tly com pared
to determine when they match. TMR2 will increment
from 00h until it matches the value in PR2. When a
match occurs, two things happen:
TMR2 is reset to 00h on the next increment cycle.
The Timer2 postscaler is incremented
The match output of the Timer2/PR2 comparator is
then fed into th e T i mer2 post sca ler. The post sca ler ha s
post scal e options of 1 :1 to 1: 16 inclus ive. The output of
the Timer2 postscaler is used to set the TMR2IF
interrupt flag bit in the PIR1 register.
The TMR2 and PR2 registers are both fully readable
and w rita ble. O n any Rese t, the TMR2 regis ter is set to
00h and the PR2 register is set to FFh.
Timer2 is turned on by setting the TMR2ON bit in the
T2CON register to a ‘1’. Tim er2 is turned off by clearin g
the TMR2ON bit to a ‘0’.
The Timer2 prescaler is contro lle d by the T2CKPS bits
in the T2CON register. The Timer2 postscaler is
controlled by the TOUTPS bits in the T2CON register.
The prescaler and postscaler counters are cleared
when:
A write to TMR2 occurs.
A write to T2CON occurs.
Any device Reset occu rs (Power-on Reset, MCLR
Reset, Watchdog Timer Reset, or Brown-out
Reset).
FIGURE 7-1: TIMER2 BLOCK DIAGRAM
Note: TMR2 is not cleared when T2CON is
written.
Comparator
TMR2 Sets Flag
TMR2
Output
Reset
Postscaler
Prescaler
PR2
2
FOSC/4
1:1 to 1:16
1:1, 1:4, 1:16
EQ
4
bit TMR2IF
TOUTPS<3:0>
T2CKPS<1:0>
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DS41302A-page 52 Preliminary © 2006 Microchip Technology Inc.
TABLE 7-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2
REGISTER 7-1: T2CON: TIMER 2 CONTROL REGISTER
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0
bit 6-3 TOUTPS<3:0>: Timer2 Output Postscaler Select bits
0000 = 1:1 Postscal er
0001 = 1:2 Postscal er
0010 = 1:3 Postscal er
0011 = 1:4 Postscal er
0100 = 1:5 Postscal er
0101 = 1:6 Postscal er
0110 = 1:7 Postscal er
0111 = 1:8 Postscal er
1000 = 1:9 Postscal er
1001 = 1:10 Postscaler
1010 = 1:11 Postscal er
1011 = 1:12 Postscaler
1100 = 1:13 Postscaler
1101 = 1:14 Postscaler
1110 = 1:15 Postscaler
1111 = 1:16 Postscaler
bit 2 TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits
00 =Prescaler is 1
01 =Prescaler is 4
1x = Prescaler is 16
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
PIE1 ADIE(1) CCP1IE(1) CMIE —TMR2IE
(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 ADIF(1) CCP1IF(1) CMIF —TMR2IF
(1) TMR1IF -00- 0-00 -00- 0-00
PR2 Timer2 Module Period Register 1111 1111 1111 1111
TMR2 Holding Register for the 8-bit TMR2 Register 0000 0000 0000 0000
T2CON TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
Legend: x = unknown, u = unchanged, - = unimplemented read as 0’. Shaded cells are not used for Timer2 module.
Note 1: For PIC12F615/HV615 only.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 53
PIC12F609/615/12HV609/615
8.0 COMPARATOR MODULE
The comparator can be used to interface analog
circuits to a digital circuit by comparing two analog
voltages and providing a digital indication of their
relative magnitudes. The comparator is a very useful
mixed s ign al bu ilding bloc k be ca us e it prov id es analog
functionality independent of the program execution.
The Analog Comparator module includes the following
features:
Programmable input section
Comparator output is available internally/externally
Programmable output polarity
Interrupt-on-change
Wake-up from Sleep
•PWM shutdown
Timer1 gate (count enable )
Output synchronization to Timer1 clock input
Programmable voltage reference
User-e nab le Comparator Hysteresis
8.1 Comparator Overview
The comparator is shown in Figure 8-1 along with the
relationship between the analog input levels and the
digital output. When the analog voltage at VIN+ is less
than the analog voltage at VIN-, the output of the com-
parator is a digital low level. When the analog voltage
at VIN+ is greater than the analog voltage at VIN-, the
output of the comparator is a digital high level.
FIGURE 8-1:SINGLE COMPARATOR
FIGURE 8-2: COMPARATOR SIMPLIFIED BLOCK DIAGRAM
+
VIN+
VIN-Output
Output
VIN+
VIN-
Note: The black areas of the output of the
comparator represents the uncertainty
due to input offsets and response time.
CMOE
MUX
CMPOL
0
1
CMON(1)
CMCH
From Timer1
Clock
Note 1: When CMON = 0, the comparator will produce a ‘0’ output to the XOR Gate.
2: Q1 and Q3 are phases of the four-phase system clock (FOSC).
3: Q1 is held high during Sleep mode.
4: Output shown for reference only. See I/O port pin diagram for more details.
DQ
EN
DQ
EN
CL
DQ
RD_CMCON0
Q3*RD_CMCON0
Q1
Set CMIF
To
Reset
CMVIN-
CMVIN+
CIN0-
CIN1-
0
1
CMSYNC
CMPOL Data Bus
MUX COUT(4)
To PWM Auto-Shutdown
To Timer1 Gate
0
1
CMR
MUX
CIN+
0
1
MUX
CVREF
CMVREN
FixedRef CMVREF SYNCCMOUT
PIC12F609/615/12HV609/615
DS41302A-page 54 Preliminary © 2006 Microchip Technology Inc.
8.2 Analog Input Connection
Considerations
A simplified circuit for an analog input is shown in
Figure 8-3. Since the analog i nput pins share thei r con-
nection with a digital input, they have reverse biased
ESD protection diodes to VDD and VSS. The analog
input, therefore, must be between VSS and VDD. If the
input voltage deviates from this range by more than
0.6V in either direction, one of the diodes is forward
biased and a latch-up may occur.
A maximum source impedance of 10 kΩ is recom-
mended for the analog sources. Also, any external
component connected to an analog input pin, such as
a capacitor or a Zener diode, should have very little
leakage current to minimize inaccuracies introduced.
FIGURE 8-3: ANALOG INPUT MODEL
Note 1: When reading a GPIO register, all pins
configu red a s anal og inp uts will read as a
0’. Pins configured as digital inputs will
convert as an analog input, according to
the input specification.
2: Analog l evels o n any p in defin ed as a dig-
ital input, may cause the input buffer to
consume more current than is specified.
VA
RS < 10K
CPIN
5 pF
VDD
VT 0.6V
VT 0.6V
RIC
ILEAKAGE
±500 nA
VSS
AIN
Legend: CPIN = Input Capacitance
ILEAKAGE = Leakage Current at the pin due to various junctions
RIC = Interconnect Re sistance
RS= Source I mpedance
VA= Analog Voltage
VT= Threshold Voltage
To Comp ara tor
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 55
PIC12F609/615/12HV609/615
8.3 Comparator Control
The comp arat or has two cont rol and Con figuration reg-
isters: CMCON0 and CMCON1. The CMCON1 register
is used for controlling the interaction with Timer1 and
simultaneously reading the comp arato r outpu t.
The CMCON0 register (Register 8-1) contain the
control and Status bits f or th e following:
Enable
Input selection
Reference selection
•Output selection
Output pol arit y
8.3.1 COMPARATOR ENABLE
Setting the CMON bit of the CMCON0 register enables
the comparator for operation. Clearing the CMON bit
disables the comparator for minimum current
consumption.
8.3.2 COMPARATOR INPUT SELECTION
The CMCH bit of the CMCON0 register directs one of
four anal og input pins to the compara tor inverting i nput.
8.3.3 COMPARATOR REFERENCE
SELECTION
Setting the CMR bit of the CMxCON0 register directs
an internal voltage reference or an analog input pin to
the non-inverting input of the comparator. See
Section 8.10 “Comparator Voltage Reference” for
more information on the internal voltage reference
module.
8.3.4 COMPARATOR OUTPUT
SELECTION
The output of the comparator can be monitored by
reading either the COUT bit of the CMCON0 register . In
order to make the output available for an external
connection, the following conditions must be true:
CMOE bit of the CMxCON0 register must be set
Corresponding TRIS bit must be cleared
CMON bit of the CMCON0 register must be set.
8.3.5 COMPARATOR OUTPUT POLARITY
Inverting the output of the comparator is functionally
equivalent to swapping the comparator inputs. The
polarity of the comparator output can be inverted by
setting the CMPOL bit of the CMCON0 register. Clear-
ing CMPOL results in a non-inverted output. A com-
plete table showing the output state versus input
conditions and the polarity bit is shown in Table 8-1.
TABLE 8-1: OUTPUT STATE VS. INPUT
CONDITIONS
8.4 Comparator Response Time
The comparator output is indeterminate for a period of
time afte r the change of an i nput source or the selection
of a new refe rence volta ge. This period is refer red to as
the response time. The response time of the compara-
tor differs from the settling time of the voltage refer-
ence. Therefore, both of these times must be
considered when determining the total response time
to a comparator input change. See Section 15.0
“Electrical Specifications” for more details.
Note: To use CIN+ and CIN- pins as analog
inputs , the appropriate bits must be set in
the ANSEL register and the corresponding
TRIS bits must also be set to disable the
output drivers.
Note 1: The CMOE bit overrides the PORT data
latch. Setting the CMON has no impact
on the por t override.
2: The internal output of the comparator is
latched with each instruction cycle.
Unless otherwise specified, external
outputs are not latched.
Input Conditions CMPOL COUT
CMVIN- > CMVIN+00
CMVIN- < CMVIN+01
CMVIN- > CMVIN+11
CMVIN- < CMVIN+10
Note: COUT refers to both the register bit and
output pin.
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DS41302A-page 56 Preliminary © 2006 Microchip Technology Inc.
8.5 Comparator Interrupt Operation
The comparator interrupt flag can be set whenever
there is a chang e in the o utput val ue of the compa rator.
Changes are recognized by means of a mismatch
circuit which consists of two latches and an
exclus ive-or gate (se e Figur e 8-4 an d Figure 8-5). One
latch is updated with the comparator output level when
the CMCON0 register is read. This latch retains the
value unti l the next read of the CMCON0 regist er or the
occurre nce of a Reset. The other la tch of the mism atch
circuit is updated on every Q1 system clock. A
mismatch condition will occur when a comparator
output change is clocked through the second latch on
the Q1 clock cycle. At this point the two mismatch
latches have opposite output levels which is detected
by the exclusive-or gate and fed to the interrupt
circuitry. The mismatch condition persists until either
the CMCON 0 re gis te r is re ad o r the c om p a rator outp ut
returns to the previous state.
The comparator interrupt is set by the mismatch edge
and not the mismatch level. This means that the
inter rupt fla g can be res et w ithout the ad dition al st ep of
reading or writing the CMCON0 register to clear the
mismatch registers. When the mismatch registers are
cleared, an interrupt will occur upon the comparator ’s
return to the previous state, otherwise no interrupt will
be generated.
Software will need to maintain information about the
status of the comparator output, as read from the
CMCON1 reg is ter, to determine the actual ch ange that
has occurred.
The CMIF bit of the PIR1 register is the Comparator
Interrupt flag. This bit must be reset in software by
clearing it to ‘0’. Since it is also p ossib le to wr ite a '1' to
this register, an interrupt can be generated.
The CMIE bit of the PIE1 register and the PEIE and GIE
bits of the INTCON register must all be set to enable
comparator interrupts. If any of these bits are cleared,
the interrupt is not enabled, although the CMIF bit of
the PIR1 regist er will s till b e set i f an inte rrupt co nditio n
occurs.
FIGURE 8-4: COMPARATOR
INTERRUPT TIMING W/O
CMCON0 READ
FIGURE 8-5: COMPARATOR
INTERRUPT TIMING WITH
CMCON0 READ
Note 1: A write operatio n to the CMCON0 regis ter
will also clear the mismatch condition
because all writes include a read opera-
tion at the beginning of the write cycle.
2: Comparator interrupts will operate cor-
rectly regardless of the state of CMOE.
Note 1: If a change in the CMCON0 register
(COUT) should occur when a read
operation is being executed (start of the
Q2 cycle), then the CMIF of the PIR1
register interrupt flag may not get set.
2: When a comparator is first enabled, bias
circuitry in the comparator module may
cause an invalid output from the
comparator until the bias circuitry is
stable. Allow about 1 μs for bias settling
then clear the mismatch condition and
interrupt flags before enabling
comp ara tor int errup ts.
Q1
Q3
CIN+
COUT
Set CMIF (edge)
CMIF
TRT
reset by software
Q1
Q3
CIN+
COUT
Set CMIF (edge )
CMIF
TRT
reset by software
cleared by CMCON0 read
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 57
PIC12F609/615/12HV609/615
8.6 Operation During Sleep
The comparator, if enabled before entering Sleep mode,
remains active during Sleep. The additional current
consumed by the comparator is shown separately in the
Section 15.0 “Electrical Specifications”. If the
comparator is not used to wake the device, power
consumpti on can be minimized while in Sleep mode by
turning off the comparator . The comparator is turned off
by clearing the CMON bit of the CMCON0 register .
A change to the comparator output can wake-up the
device from Sleep. To enable the comparator to wake
the dev ice from Sleep, th e CMIE bit of the PIE1 register
and the PEIE bit of the INTCON register must be set.
The instruction following the SLEEP instr uction always
executes following a wake from Sleep. If the GIE bit of
the INTCON register is also set, the device will then
execute the Interrupt Service Routine.
8.7 Effects of a Reset
A device Reset forces the CMCON1 register to its
Reset state. This sets the comparator and the voltage
reference to the OFF state.
PIC12F609/615/12HV609/615
DS41302A-page 58 Preliminary © 2006 Microchip Technology Inc.
REGISTER 8-1: CMCON0: COMPARATOR CONTROL REGISTER 0
R/W-0 R-0 R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0
CMON COUT CMOE CMPOL CMR CMCH
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7 CMON: Comparator Enable bit
1 = Comparator is enabled
0 = Compar ator is disabled
bit 6 COUT: Comparator Output bit
If C1POL = 1 (inverted polarity):
COUT = 0 when CMVIN+ > CMVIN-
COUT = 1 when CMVIN+ < CMVIN-
If C1POL = 0 (non-inverted polarity):
COUT = 1 when CMVIN+ > CMVIN-
COUT = 0 when CMVIN+ < CMVIN-
bit 5 CMOE: Comparator Output Enable bit
1 = COUT is present on the COUT pin(1)
0 = COUT is internal only
bit 4 CMPOL: Comparator Output Polarity Select bit
1 = COUT logic is inverted
0 = COUT logic is not inverted
bit 3 Unimplemented: Read as ‘0
bit 2 CMR: Compara tor Reference Select bit (non-inverti ng input)
1 = CMVIN+ connects to CMVREF output
0 = CMVIN+ connects to CIN+ pin
bit 1 Unimplemented: Read as ‘0
bit 0 CMCH: Comparator C1 Channel Select bit
00 = CMVIN- pin of the Comparator connects to CIN0-
01 = CMVIN- pin of the Comparator connects to CIN1-
Note 1: Comparator output requires the following three conditions: CMOE = 1, CMON = 1 and corr espondin g p ort
TRIS bit = 0.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 59
PIC12F609/615/12HV609/615
8.8 Comparator Gating Timer1
This feat ure can be used to time the d uration or interva l
of analog events. Clearing the T1GSS bit of the
CMCON1 register will enable Timer1 to increment
based on the output of the comparator. This requires
that Timer1 is on and gating is enabled. See
Section 6.0 “Timer1 Module with Gate Control” for
details.
It is recommended to synchronize the comparator with
Timer1 by setting the CMSYNC bit when the compara-
tor is used as the Timer1 gate source. This ensures
Timer1 does not miss an increment if the comparator
changes during an increment.
8.9 Synchronizing Comparator Output
to Timer1
The comparator output can be synchronized with
Timer1 by setting the CMSYNC bit of the CMCON1
register. When enabled, the comparator output is
latc hed on the fall ing ed ge of the Timer1 clock sou rce.
If a prescaler is used with Timer1, the comparator
output is latched after the prescaling function. To
prevent a race condition, the comparator output is
latc hed on the fa lling edge of the Timer 1 clock source
and Timer1 increments on the rising edge of its clock
source. See the Comparator Block Diagram
(Figur e 8-2) and the T imer1 Blo ck Diagram (F igure 6-1 )
for more inform ati on .
REGISTER 8-2: CMCON1: COMPARATOR CONTROL REGISTER 1
U-0 U-0 U-0 R/W-0 R/W-0 U-0 R/W-1 R/W-0
T1ACS CMHYS T1GSS CMSYNC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0
bit 4 T1ACS: Timer1 Alternate Clock Select bit
1 = Timer 1 Clock Source is System Clock (FOSC)
0 = Timer 1 Clock Source is Instruction Clock (FOSC\4)
bit 3 CMHYS: Comparator Hyster esis Select b it
1 = Comparator Hysteresis enabled
0 = Comparator Hysteresis disabled
bit 2 Unimplemented: Read as ‘0
bit 1 T1GSS: Timer1 Gate Source Select bit(1)
1 = Timer 1 Gate Source is T1G pin (pin should be configured as digital input)
0 = Timer 1 Gate Source is comparator output
bit 0 CMSYNC: Comparator Output Synchronization bit(2)
1 = Output is synchronized with falling edge of Ti mer1 clock
0 = Output is asynchronous
Note 1: Refer to Section 6.6 “Timer1 Gate.
2: Refer to Figure 8-2.
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8.10 Comparator Voltage Reference
The Comparator Voltage Reference module provides
an internally generated voltage reference for the com-
parators. The following features are av ailable:
Independent from Comparator operation
16-level voltage range
Output clamped to VSS
Ratiometric with VDD
Fixed Reference (0.6)
The VRCON register (Register 8-3) controls the Volt-
age Reference module shown in Register 8-6.
8.10.1 INDEPENDENT OPERATION
The comparator voltage reference is independent of
the comparator configuration. Setting the VREN bit of
the VRCON register will enable the voltage reference.
8.10.2 OUTPUT VOLTAGE SELECTION
The CVREF voltage reference has 2 ranges with 16
voltage levels in each range. Range selection is con-
trolled by the VRR bit of the VRCON register. The 16
levels are s et with the VR< 3:0> bit s of the VRCON reg-
ister.
The CVREF output voltage is determined by the
following equations:
EQUATION 8-1: CVREF OUTPUT VOLTAGE
The full range of VSS to VDD cannot be realized due to
the construction of the module. See Figure 8-6.
8.10.3 OUTPUT CLAMPED TO VSS
The CVREF output voltage can be set to Vss with no
power consumption by configurin g VRCON as follo ws:
•VREN=0
•VRR=1
•VR<3:0>=0000
This allows the comparator to detect a zero-crossing
while not consuming additional CVREF module curren t.
8.10.4 OUTPUT RATIOMETRIC TO VDD
The comparator voltage reference is VDD derived and
therefore, the CVREF output changes with fluctuations in
VDD. The tested absolute accuracy of the Comparator
Voltage Reference can be found in Section 15.0
“Electrical Specifications”.
8.10.5 FIXED VOLTAGE REFERENCE
The fixed volta ge reference is ind ependent of VDD, with
a nomina l output volt age of 0.6V. This ref erence can be
enabled by setting the FVREN bit of the VRCON
register to1’. This reference is always enabled when
the HFINTOSC oscillator is active.
8.10.6 FIXED VOLTAGE REFERENCE
STABILIZATION PERIOD
When the Fix ed Volt age Refe rence mo dule is enable d,
it will require some t ime for t he refere nce an d its ampli-
fier circ ui t s to s t a bil iz e. T he u se r program mus t i nc lud e
a smal l d ela y routine to allow th e m od ule to se ttl e. Se e
Section 15.0 “Electrical Specifications” for the
minimu m del ay require me nt.
8.10.7 VOLTAGE REFERENCE
SELECTION
Multiplexers on the output of the Voltage Reference
module enable selection of either the CVREF or fixed
voltage reference for use by the comparators.
Setting the CMVREN bit of the VRCON register
enables current to flow in the CVREF voltage divider
and selects the CVREF voltage for use by the Compar-
ator . Clearing the CMVREN bit se lects th e fixed volt age
for use by the Comparator.
When the CMVREN bit is cleared, current flow in the
CVREF volt age div ider is disabled minimizi ng the power
drain of the voltage reference peripheral.
VRR 1 (low range):=
VRR 0 (high range):=
CVREF (VDD/4) + =
CVREF (VR<3:0>/24) VDD×=
(VR<3:0> VDD/32)×
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 61
PIC12F609/615/12HV609/615
FIGURE 8-6: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM
VRR
8R
VR<3:0>(1)
Analog
8RRR RR
16 Stages
VDD
MUX
Fixed Voltage
CMVREN
CVREF(1)
Reference
EN
FVREN
Sleep
HFINTOSC enable
0.6V
FixedRef
To Comparators
and ADC Module
To Comparators
and ADC Module
Note 1: Care should be taken to ensure CVREF remains within the comparator common mode input range. See
Section 15.0 “Electrical Specifications” for more detail.
15
0
4
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DS41302A-page 62 Preliminary © 2006 Microchip Technology Inc.
REGISTER 8-3: VRCON: VOLTAGE REFERENCE CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CMVREN VRR FVREN VR3 VR2 VR1 VR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7 CMVREN: Comparator Voltage Reference Enable bit(1, 2)
1 = CVREF circuit powered on and routed to CVREF input of the Compara tor
0 = 0.6 Volt constant reference routed to CMVREF input of the Comparator
bit 6 Unimplemented: Read as ‘0
bit 5 VRR: CVREF Range Selection bit
1 = Low range
0 = High range
bit 4 FVREN: 0.6V Reference Enable bit(2)
1 = Enabled
0 = Disabled
bit 3-0 VR<3:0>: Comparator Voltage Reference CVREF Value Selection bits (0 VR<3:0> 15)
When VRR = 1: CVREF = (VR<3:0>/24) * VDD
When VRR = 0: CVREF = VDD/4 + (VR<3:0>/32) * VDD
Note 1: When CMVREN is low, the CVREF circuit is powered down and does not contribute to IDD current.
2: When CMVREN is low and the FVREN bit is low, the CMVREF signal should provide Vss to the comp arator.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 63
PIC12F609/615/12HV609/615
8.11 Comparator Hysteresis
Each comparator has built-in hysteresis that is user
enabled by setti ng the CMHYS bit of the CMCON1 reg-
ister. The hysteresis feature can help filter noise and
reduce m ultiple comp arator output tran sitions when th e
output is changing state.
Figure 8-7 shows the relationship between the analog
input levels and di gital output of a com p arator with and
without hysteresis. The output of the comparator
changes from a low state to a high state only wh en the
analog voltage at VIN+ rises above the upper h ysteresis
threshol d (VH+). The output of th e compara tor changes
from a high state to a low state only when the analog
voltage at VIN+ falls below the lower hysteresis
threshold (VH-).
FIGURE 8-7: COMPARATOR HYSTERESIS
+
VIN+
VIN-Output
Note: The black areas of the comparator output represents the uncertainty due to input offsets and response time
.
VH-
VH+
VIN-
V+
VIN+
Output
(Without Hysteresis)
Output
(With Hysteresis)
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DS41302A-page 64 Preliminary © 2006 Microchip Technology Inc.
TABLE 8-2: SUMMARY OF REGISTERS ASSOCIATED WITH THE COMPARATOR AND VOLTAGE
REFERENCE MODULES
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Valu e on
POR, BOR
Value on
all other
Resets
ANSEL ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 -000 1111 -000 1111
CMCON0 CMON COUT CMOE CMPOL —CMR —CMCH0000 -000 0000 -000
CMCON1 T1ACS CMHYS T1GSS CMSYNC 0000 0000 0000 0000
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 000x 0000 000x
PIE1 ADIE(1) CCP1IE(1) —CMIETMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 ADIF(1) CCP1IF(1) —CMIFTMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
GPIO GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --uu uuuu
TRISIO TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
VRCON CMVREN VRR FVREN VR3 VR2 VR1 VR0 0-00 0000 0-00 0000
Legend: x = unknown, u = unchanged, - = unimplemented, read as0’. Shaded cells are not used for comparator.
Note 1: F or PIC12F615/HV615 only.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 65
PIC12F609/615/12HV609/615
9.0 ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
(PIC12F615/HV615 ONLY)
The Analog-to-Digital Converter (ADC) allows
conversion of an analog input signal to a 10-bit binary
representation of that signal. This device uses analog
inputs, which are multiplexed into a single sample and
hold circuit. The output of the sample and hold is
connected to the input of the converter. The converter
generates a 10-bit binary result via successive
approximation and stores the conversion result into the
ADC result registers (ADRESL and ADRESH).
The ADC voltage reference is software selectable to
either VDD or a v olt age applied to the ex ternal reference
pins.
The ADC can generate an interrupt upon completion of
a conversion. This interrupt ca n be used to wake-up the
device from Sleep.
Figure 9-1 shows the block diagram of the ADC.
FIGURE 9-1: ADC BLOCK DIAGRAM (+3 INTERNAL)
GP0/AN0
A/D
GP1/AN1/VREF
GP2/AN2
CVREF
VDD
VREF
ADON
GO/DONE
VCFG = 1
VCFG = 0
CHS VSS
0.6V Reference
1.2V Reference
GP4/AN3
ADRESH ADRESL
10
10
ADFM 0 = Left Justify
1 = Right Justify
000
001
010
011
100
101
110
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9.1 ADC Configuration
When configuring and using the ADC the following
functio ns must be considere d:
Port configuration
Channel selection
ADC voltage reference selection
ADC co nversion cl ock source
Interrupt control
Results formatting
9.1.1 PORT CONFIGURATION
The ADC can be used to convert both analog and digital
signals. When converting analog signals, the I/O pin
should be configured for analog by setting the associated
TRIS and ANSEL bits. See the corresponding port
section for more information.
9.1.2 CHANNEL SELECTION
The CHS bi ts of the ADCON0 r egister det ermine whic h
channel is connected to the sample and hold circuit.
When changing channels, a delay is required before
starting the next conversion. Refer to Section 9.2
“ADC Operation” for more information.
9.1.3 ADC VOLTAGE REFERENCE
The VCFG bit of the ADCON0 registe r provides contro l
of the positive voltage reference. The positive voltage
reference can be either VDD or an external voltage
source. The negative voltage reference is always
connected to the ground reference.
9.1.4 CONVERSION CLOCK
The so urce of th e conver sion cloc k is sof tware sele ct-
able via the ADCS bits of the ANSEL register. There
are seven possible clock options:
•F
OSC/2
•F
OSC/4
•FOSC/8
•FOSC/16
•F
OSC/32
•FOSC/64
•FRC (dedicated internal oscillator)
The time to complete one bit conversion is defined as
TAD. One ful l 1 0-bit conve rsi on requires 11 TAD period s
as shown in Figure 9-3.
For correct conversion, the approp riate TAD specificatio n
must be met. See A/D conversion requirements in
Section 15.0 “Electrical Specifications” for more
information. Table 9-1 gives examples of appropriate
ADC clock selections.
Note: Analog voltages on any pin that is defined
as a digital input may cause the input
buffer to conduct excess current.
Note: Unless using the FRC, any changes in the
system clock frequency will change the
ADC clock frequency, which may
adversely affect the ADC result.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 67
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TABLE 9-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES (VDD > 3.0V)
FIGURE 9-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES
9.1.5 INTERRUPTS
The ADC module allows for the ability to generate an
interrupt upon completion of an Analog-to-Digital
conversion. The ADC interrupt flag is the ADIF bit in the
PIR1 reg ister. The AD C inte rrupt en able i s the ADIE bit
in the PIE1 register. The ADIF bit must be cleared in
software.
This interrupt can be generated while the device is
operatin g or while in Sle ep. If the device is in Sle ep, the
interrupt will wake-up the device. Upon waking from
Sleep, the next instruction following the SLEEP
instruc tio n is alw ays exe cu ted . If the user i s att em ptin g
to wake-up from Sleep and resume in-line code
execution, the global interrupt must be disabled. If the
global interrupt is enabled, execution will switch to the
Interr upt Service Routine.
Please see Section 9.1.5 “Interrupts” for more
information.
ADC Clock Period (TAD) Device Frequency (FOSC)
ADC Clock Source ADCS<2:0> 20 MHz 8 MHz 4 MHz 1 MHz
FOSC/2 000 100 ns(2) 250 ns(2) 500 ns(2) 2.0 μs
FOSC/4 100 200 ns(2) 500 ns(2) 1.0 μs(2) 4.0 μs
FOSC/8 001 400 ns(2) 1.0 μs(2) 2.0 μs8.0 μs(3)
FOSC/16 101 800 ns(2) 2.0 μs4.0 μs16.0 μs(3)
FOSC/32 010 1.6 μs4.0 μs8.0 μs(3) 32.0 μs(3)
FOSC/64 110 3.2 μs8.0 μs(3) 16.0 μs(3) 64.0 μs(3)
FRC x11 2-6 μs(1,4) 2-6 μs(1,4) 2-6 μs(1,4) 2-6 μs(1,4)
Legend: Shaded cells are outside of recommended range.
Note 1: The FRC source has a typical TAD time of 4 μs for VDD > 3.0V.
2: These values violate the minimum required TAD time.
3: For faster conversion times, the selection of another clock source is recommended.
4: When the device frequency is greater than 1 MHz, the FRC clock source is only recommended if the
conversion will be performed during Sleep.
TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9
Set GO/DONE bit
Holding Capacitor is Disconnected from Analog Input (typically 100 ns)
b9 b8 b7 b6 b5 b4 b3 b2
TAD10 TAD11
b1 b0
TCY to TAD
Conversion Starts
ADRESH and ADRESL registers are loaded,
GO bit is cleared,
ADIF bit is set,
Holding capacitor is connected to analog input
Note: The ADIF bit is set at the completion of
every conversion, regardless of whether
or not the ADC interrupt is enabled.
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9.1.6 RESULT FORMATTING
The 10-bit A/D conversion res ult can be supplied in two
formats, left justified or right justified. The ADFM bit of
the ADCON0 register controls the output format.
Figure 9-4 shows the two output formats.
FIGURE 9-3: 10-BIT A/D CONVERSION RESULT FORMAT
9.2 ADC Operation
9.2.1 STARTING A CONVERSION
To enable the ADC module, the ADON bit of the
ADCON0 register must be set to a ‘1’. Setting the GO/
DONE bit of the ADCON0 register to a ‘1 will start the
Analog-to-Digital conversion.
9.2.2 COMPLETION OF A CONVERSION
When the conversion is complete, the ADC module will:
Clear the GO/DONE bit
Set the ADIF flag bit
Update the ADRESH:A DRESL regis ters with new
conversion result
9.2.3 TERMINATING A CONVERSION
If a co nver sion must b e term ina ted be fore comp leti on,
the GO/DONE bit can be cleared in software. The
ADRESH:ADRESL registers will not be updated with
the partially complete Analog-to-Digital conversion
sample. Instead, the ADRESH:ADRESL register pair
will retain the value of the previous conversion. Addi-
tionall y, a 2 TAD delay is requir ed before anothe r acqui-
sition can be initiated. Following this delay, an input
acquisition is automatically started on the selected
channel.
9.2.4 ADC OPERATION DURING SLEEP
The ADC module can operate during Sleep. This
requires the ADC clock source to be set to the FRC
option. When the FRC clock source is selected, the
ADC wa its on e addition al instru ction bef ore sta rting the
conversion. This allows the SLEEP instruction to be
executed, which can reduce system noise during the
conversion. If the ADC interrupt is enabled, the device
will wake-up from Sleep when the conversion
completes. If the ADC interrupt is disabled, the ADC
module is turned off after the conversion completes,
although the ADON bit remains set.
When the ADC clock source is something other than
FRC, a SLEEP instruction causes the present conver-
sion to be aborted and the ADC module is turned off,
although the ADON bit remains set.
9.2.5 SPECIAL EVENT TRIGGER
The ECCP Special Event Trigger allows periodic ADC
measurements without software intervention. When
this trigger occurs, the GO/DONE bit is set by hardware
and the Timer1 counter resets to zero.
Using the Special Event Trigger does not assure proper
ADC timi ng. It is the user’s resp onsib ility t o ensu re that
the ADC timing requirements are met.
See Section 10.0 “Enhanced Capture/Compare/
PWM (With Auto-Shutdown and Dead Band) Mod-
ule (PIC12 F615/HV615 only)” for more information.
ADRESH ADRESL
(ADFM = 0)MSB LSB
bit 7 bit 0 bit 7 bit 0
10-bit A/D Result Unimplemented: Read as ‘0
(ADFM = 1)MSB LSB
bit 7 bit 0 bit 7 bit 0
Unimplemented: Read as ‘0 10-bit A/D Result
Note: The GO/DONE bit shou ld not be set in th e
same instruction that turns on the ADC.
Refer to Section 9.2.6 “A/D Conversion
Procedure”.
Note: A device Reset forces all registers to their
Reset state. Thus, the ADC module is
turned off and any pending conversion is
terminated.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 69
PIC12F609/615/12HV609/615
9.2.6 A/D CONVERSION PROCEDURE
This is an example procedure for using the ADC to
perform an Analog-to-Digit al conve rsion:
1. Configu re Port:
Disable pin output driver (See TRIS register)
Configure pin as analog
2. Configu re th e ADC module:
Select ADC co nversion clock
Configure voltage reference
Select ADC input channel
Select result format
Turn on ADC module
3. Configure ADC interrupt (optional):
Clear ADC interrupt flag
Enable ADC interrupt
Enable peripheral interrupt
Enable global interrupt(1)
4. Wait the required acquisition time(2).
5. Start conversion by setting the GO/DONE bit.
6. Wait for ADC conv ers ion to com ple te b y o ne o f
the following:
Polling the GO/DONE bit
Waiting for the ADC interrupt (interrupts
enabled)
7. Read ADC Result
8. Clear the ADC in terrupt flag (re quired if in terrupt
is enabled).
EXAMPLE 9-1: A/D CONVE RSION
Note 1: Th e glob al int errupt c an be d isabl ed if th e
user is attempting to wake-up from Sleep
and resume in-line code execution.
2: See Section 9.3 “A/D Acquisition
Requirements”.
;This code block configures the ADC
;for polling, Vdd reference, Frc clock
;and GP0 input.
;
;Conversion start & polling for completion
; are included.
;
BANKSEL TRISIO ;
BSF TRISIO,0 ;Set GP0 to input
BANKSEL ANSEL ;
MOVLW B’01110001’ ;ADC Frc clock,
IORWF ANSEL ; and GP0 as analog
BANKSEL ADCON0 ;
MOVLW B’10000001’ ;Right justify,
MOVWF ADCON0 ;Vdd Vref, AN0, On
CALL SampleTime ;Acquisiton delay
BSF ADCON0,GO ;Start conversion
BTFSC ADCON0,GO ;Is conversion done?
GOTO $-1 ;No, test again
BANKSEL ADRESH ;
MOVF ADRESH,W ;Read upper 2 bits
MOVWF RESULTHI ;Store in GPR space
BANKSEL ADRESL ;
MOVF ADRESL,W ;Read lower 8 bits
MOVWF RESULTLO ;Store in GPR space
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DS41302A-page 70 Preliminary © 2006 Microchip Technology Inc.
9.2.7 ADC REGISTER DEFINITIONS
The following registers are used to control the operation of the ADC.
REGISTER 9-1: ADCON0: A/D CONTROL REGISTER 0
R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADFM VCFG CHS2 CHS1 CHS0 GO/DONE ADON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7 ADFM: A/D Conversion Result Format Select bit
1 = Right justified
0 = Left justified
bit 6 VCFG: V oltage Reference bit
1 = V REF pin
0 = VSS
bit 5 Unimplemented: Read as ‘0
bit 4-2 CHS<2:0>: Analog Channel Select bits
000 = Channel 00 (AN0)
001 = Channel 01 (AN1)
010 = Channel 02 (AN2)
011 = Channel 03 (AN3)
100 = CVREF
101 = 0.6V Reference
110 = 1.2V Reference
111 = Reserved. Do not use.
bit 1 GO/DONE: A/D Conversion Status bit
1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle.
This bit is automatically cleared by hardware when the A/D conversion has completed.
0 = A/D conversion completed/not in progress
bit 0 ADON: ADC Enable bit
1 = ADC is enabled
0 = ADC is disabled and consumes no operating current
Note 1: When the CHS<2:0> bits change to select the 1.2V or 0.6V reference, the reference output voltage will
have a transient. If the Comparator module uses this 0.6V reference voltage, the comparator output may
momentarily change state due to the transient.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 71
PIC12F609/615/12HV609/615
REGISTER 9-2: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0 (READ-ONLY)
R-x R-x R-x R-x R-x R-x R-x R-x
ADRES9 ADRES8 ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Va lue at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-0 ADRES<9:2>: ADC Result Register bits
Upper 8 bits of 10-bit conversion result
REGISTER 9-3: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 (READ-ONLY)
R-x R-x U-0 U-0 U-0 U-0 U-0 U-0
ADRES1 ADRES0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Va lue at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-6 ADRES<1:0>: ADC Result Register bits
Lower 2 bits of 10-bit conversion result
bit 5-0 Unimplemented: Read as ‘0
REGISTER 9-4: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 (READ-ONLY)
U-0 U-0 U-0 U-0 U-0 U-0 R-x R-x
ADRES9 ADRES8
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Va lue at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-2 Unimplemented: Read as ‘0
bit 1-0 ADRES<9:8>: ADC Result Register bits
Upper 2 bits of 10-bit conversion result
REGISTER 9-5: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 (READ-ONLY)
R-x R-x R-x R-x R-x R-x R-x R-x
ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Va lue at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7-0 ADRES<7:0>: ADC Result Register bits
Lower 8 bits of 10-bit conversion result
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DS41302A-page 72 Preliminary © 2006 Microchip Technology Inc.
9.3 A/D Acquisition Requirements
For the A DC t o meet its specif ied accuracy, the char ge
holding capacitor (CHOLD) must be allowed to fully
charge to the input channel voltage level. The Analog
Input model is shown in Figure 9-4. The source
impedance (RS) and the internal sampling switch (RSS)
impedance directly affect the time required to charge the
capacitor CHOLD. The sampling switch (RSS) impedance
varies over the device voltage (VDD), see Figure 9-4.
The maximum recommended impedance for analog
sources is 10 kΩ. As the source impedance is
decreased, the acquisition time may be decreased.
After the analog input channel is selected (or changed),
an A/D acquisition must be done before the conversion
can be started. To calculate the minimum acquisition
time, Equation 9-1 may be used. This equation
assumes that 1/2 LSb error is used (1024 steps for the
ADC). The 1/2 LSb erro r is the maximum er ror allow ed
for the ADC to meet its specified resolution.
EQUATION 9-1: ACQUISITION TIME EXAMPLE
TACQ Amplifier Settling Time Hold Ca pacitor Charging Time Temperature Coeffici ent++=
TAMP TCTCOFF++=
s TCTemperature - 25°C()0.05µs/°C()[]++=
TCCHOLD RIC RSS RS++() ln(1/2047)=
10pF 1k
Ω
7k
Ω
10k
Ω
++() ln(0.0004885)=
1.37
=µs
TACQ S1.37µS50°C- 25°C()0.05µSC()[]++=
4.67µS=
VAPPLIED 1e
Tc
RC
---------
⎝⎠
⎜⎟
⎛⎞
VAPPLIED 11
2047
------------
⎝⎠
⎛⎞
=
VAPPLIED 11
2047
------------
⎝⎠
⎛⎞
VCHOLD=
VAPPLIED 1e
TC
RC
----------
⎝⎠
⎜⎟
⎛⎞
VCHOLD=
;[1] V CHOLD charged to within 1/2 lsb
;[2] VCHOLD charge response to VAPPLIED
;combining [1] and [2]
The value for TC can be approximated with the following equations:
Solving for TC:
Therefore:
Temperature 50°C and external impedance of 10k
Ω
5.0 V VDD=
Assumptions:
Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out.
2: The charge holding capacitor (CHOLD) is not discharged after each conversion.
3: The maximum recommended impedance for analog sources is 10 kΩ. This is required to meet the pin
leakage specification.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 73
PIC12F609/615/12HV609/615
FIGURE 9-4: ANALOG INPUT MODEL
FIGURE 9-5: ADC TRANSFER FUNCTION
CPIN
VA
Rs ANx
5 pF
VDD
VT = 0.6V
VT = 0.6V I LEAKAGE
RIC 1k
Sampling
Switch
SS Rss
CHOLD = 10 pF
VSS/VREF-
6V
Sampling Switch
5V
4V
3V
2V
567891011
(kΩ)
VDD
± 500 nA
Legend: CPIN
VT
I LEAKAGE
RIC
SS
CHOLD
= Input Capacitance
= Threshold Voltage
= Leakage current at the pin due to
= Interconnect Resistance
= Sampling Switch
= Sample/Hold Capacitance
various junctions
RSS
3FFh
3FEh
ADC Output Code
3FDh
3FCh
004h
003h
002h
001h
000h
Full-Scale
3FBh
1 LSB ideal
VSS/VREF-Zero-Scale
Transition VDD/VREF+
Transition
1 LSB ideal
Full-Scale Range
Analog Input Voltage
PIC12F609/615/12HV609/615
DS41302A-page 74 Preliminary © 2006 Microchip Technology Inc.
TABLE 9-2: SUMMARY OF ASSOCIATED ADC REGISTERS
Name Bit 7 Bit 6 B it 5 Bit 4 B it 3 Bit 2 Bit 1 Bit 0 Valu e on
POR, BOR
Valu e on
all othe r
Resets
ADCON0 ADFM VCFG CHS2 CHS1 CHS0 GO/DONE ADON 00-0 0000 00-0 0000
ANSEL ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 -000 1111 -000 1111
ADRESH A/D Result Register High Byte xxxx xxxx uuuu uuuu
ADRESL A/D Result Register Low Byte xxxx xxxx uuuu uuuu
GPIO GP5 GP4 GP3 GP2 GP1 GP0 --x0 x000 --x0 x000
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
PIE1 —ADIE
(1) CCP1IE(1) CMIE TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 —ADIF
(1) CCP1IF(1) CMIF TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
TRISIO TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
Legend: x = unknown, u = unchanged, = unimplemented read as ‘0’. Shaded cells are not used for ADC module.
Note 1: F or PIC12F615/HV615 only.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 75
PIC12F609/615/12HV609/615
10.0 ENHANCED CAPTURE/
COMPARE/PWM (WITH AUTO-
SHUTDOWN AND DEAD BAND)
MODULE (PIC12F615/HV615
ONLY)
The Enhanced Capture/Compare/PWM module is a
peripheral which allows the user to time and control
different events. In Capture mode, the peripheral
allows the timing of the duration of an event.The
Compare mode allows the user to trigger an external
event when a predetermined amount of time has
expired. The PWM mode can generate a Pulse-Width
Modulated signal of varying frequency and duty cycle.
Table 10-1 shows the timer resources required by the
ECCP module.
TABLE 10-1: ECCP MODE – TIMER
RESOURCES REQUIRED
ECCP Mode Timer Resource
Capture Timer1
Compare Timer1
PWM Timer2
REGISTER 10-1: CCP1CON: ENHANCED CCP1 CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
P1M DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 P1M: PWM Output Configuration bits
If CCP 1M<3:2> = 00, 01, 10:
x = P 1A assig ne d as Capt ur e/C om pare inpu t; P1 B as sig ne d as po rt pin s
If CCP1M<3:2> = 11:
0 = Single output; P1A modulated; P1B assigned as port pins
1 = Half-Bridge output; P1A, P1B modulated with dead-band control
bit 6 Unimplemented: Read as ‘0
bit 5-4 DC1B<1:0>: PWM Duty Cycle Least Significant bits
Capture mode:
Unused.
Compare mode:
Unused.
PWM mode:
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L.
bit 3-0 CCP1M<3:0>: EC CP Mod e Se lec t bits
0000 = Capture/Compare/PWM off (resets ECCP module)
0001 = Unus ed (rese rv ed )
0010 = Compare mode, toggle output on match (CCP1IF bit is set)
0011 = Unus ed (rese rv ed )
0100 = Capture mode, every falling edge
0101 = Capture mode, every rising edge
0110 = Capture mode, every 4th rising edge
0111 = Capture mode, every 16th rising edge
1000 = Compare mode, set output on match (CCP1IF bit is set)
1001 = Compare mode, clear output on match (CCP1IF bit is set)
1010 = Compare mode, generate software interrupt on match (CCP1IF bit is set, CCP1 pin is
unaffected)
1011 = Compa re mode , tri gger s pecia l even t (CCP1 IF bi t is se t; CCP 1 rese ts T MR1 or T MR2 and star ts
an A/D conversion, if the ADC module is enabled)
1100 = PWM mod e; P1 A ac tive -h igh ; P1 B act ive -h igh
1101 = PWM mod e; P1 A ac tive -h igh ; P1 B act ive -lo w
1110 = PWM mod e; P1 A ac tive -lo w ; P1B activ e- hig h
1111 = PWM mode ; P1 A act ive -lo w; P1B ac tiv e-lo w
PIC12F609/615/12HV609/615
DS41302A-page 76 Preliminary © 2006 Microchip Technology Inc.
10.1 Capture Mode
In Capture mode, CCPR1H:CCPR1L captures the
16-bit val ue of the TMR1 register when an event occurs
on pin CCP1. An event is defined as one of the
following and is configured by the CCP1M<3:0> bits of
the CCP1CON register:
Every falling edge
Every rising edge
Every 4th rising edge
Every 16th rising edge
When a cap ture i s m ade, the I nterrupt Reque st Flag bit
CCP1IF of the PIR1 register is set. The interrupt flag
must be cleared in software. If another capture occurs
before the value in the CCPR1H, CCPR1L register pair
is read, the o ld captured value is overwri tten by the new
captured value (see Figure 10-1).
10.1.1 CCP1 PIN CONFIGURATION
In Capture mode, the CCP1 pin should be configured
as an input by setting the associated TRIS control bit.
FIGURE 10-1: CAP TURE MODE
OPERATION BLOCK
DIAGRAM
10.1.2 TIMER1 MODE SELECTION
T imer1 must be running in T imer mode or Synchroni zed
Counter mode for the CCP module to use the capture
feature. In Asynchronous Counter mode, the capture
operation may not work.
10.1.3 SOFTWARE INTERRUPT
When the Capture mode is changed, a false capture
interrupt may be generated. The user should keep the
CCP1IE i nterrupt en able bit of the PIE1 regis ter clear to
avoid false interrupts. Additionally, the user should
clear the CCP1IF interrupt flag bit of the PIR1 register
following any change in operating mode.
10.1.4 CCP PRESCALER
There are four prescaler settings specified by the
CCP1M<3:0> bits of the CCP1CON register.
Whenever the CCP module is turned off, or the CCP
module is not in Capture mode, the prescaler counter
is cleared. Any Reset will clear the pres caler counter.
Switching from one capture prescaler to another does not
clear the prescaler and may generate a false interrupt. To
avoid this unexpected operation, turn the module off by
clearing the CCP1CON register before changing the
prescaler (see Example 10-1).
EXAMPLE 10-1: CHANGING BETWEEN
CAPTURE PRESCALERS
Note: If the C CP1 pin is con figured as an output ,
a write to the port can cause a capture
condition.
CCPR1H CCPR1L
TMR1H TMR1L
Set Flag bit CCP1IF
(PIR1 reg i ster)
Capture
Enable
CCP1CON<3:0>
Prescaler
÷ 1, 4, 16
and
Edge Detect
pin
CCP1
System Clock (FOSC)
BANKSEL CCP1CON ;Set Bank bits to point
;to CCP1CON
CLRF CCP1CON ;Turn CCP module off
MOVLW NEW_CAPT_PS ;Load the W reg with
; the new prescaler
; move value and CCP ON
MOVWF CCP1CON ;Load CCP1CON with this
; value
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 77
PIC12F609/615/12HV609/615
TABLE 10-2: SUMMARY OF REGISTERS ASSOCIATED WITH CAPTURE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 B i t 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
CCP1CON P1M DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0-00 0000 0-00 0000
CCPR1L Capture/Compare/PWM Regist er 1 Low Byte xxxx xxxx uuuu uuuu
CCPR1H C apture/Com pare/PWM Register 1 High Byte xxxx xxxx uuuu uuuu
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
PIE1 ADIE(1) CCP1IE(1) CMIE TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 ADIF(1) CCP1IF(1) CMIF TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TRISIO —TRISIO5TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
Legend: - = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Capture.
Note 1: For PIC12F615/HV615 only.
PIC12F609/615/12HV609/615
DS41302A-page 78 Preliminary © 2006 Microchip Technology Inc.
10.2 Compar e Mode
In C ompare mo de, t he 16- bit CC PR1 re gist er va lue is
constantly compared against the TMR1 register pair
value. When a match occurs, the CCP1 module may:
Tog gle the CCP1 output.
Set the CCP1 output.
Clear the CCP1 output.
Generate a Special Event Trigger.
Generate a Software Interrupt.
The action on the pin is based on the value of the
CCP1M<3:0> control bits of the CCP1CON register.
All Compare modes can generate an interrupt.
FIGUR E 1 0-2: COMPARE MODE
OPERATION BLOCK
DIAGRAM
10.2.1 CCP1 PIN CONFIGURATION
The user m us t co nfi gure the C CP 1 p in a s an out put b y
clearing the associated TRIS bit.
10.2.2 TIMER1 MODE SELECTION
In Compare mode, Timer1 must be running in either
Timer mode or Synchronized Counter mode. The
compare operation may not work in Asynchronous
Counter mode.
10.2.3 SOFTWARE INTERRUPT MODE
When Generate Software Interrupt mode is chosen
(CCP1M<3:0> = 1010), the CCP1 module does not
assert control of the CCP1 pin (see the CCP1CON
register).
10.2.4 SPECIAL EVENT TRIGGER
When Special Event Trigger mode is chosen
(CCP1M<3:0> = 1011), the CCP1 module does the
following:
Resets Timer1
Starts an ADC conv ersion if ADC is ena bled
The CCP 1 module do es not assert co ntrol of the CC P1
pin in this mode (see the CCP1CON register).
The Special Event Trigger output of the CCP occurs
immediately upon a match between the TMR1H,
TMR1L register pair and the CCPR1H, CCPR1L
register pair. The TMR1H, TMR1L register pair is not
reset until th e next r ising ed ge of the T imer1 clock. This
allows the CCPR1H, CCPR1L register pair to
effectively provide a 16-bit programmable period
register for Timer1.
Note: Clearing the CCP1CON register will force
the CCP1 compare output latch to the
default lo w level. This is not the PORT I/O
data l atch.
CCPR1H CCPR1L
TMR1H TMR1L
Comparator
QS
ROutput
Logic
Specia l Event Trigge r
Set CCP1IF Interrupt Flag
(PIR1)
Match
TRIS
CCP1CON<3:0>
Mode Select
Output Enable
Pin
Special Event Trigger will:
Clear TMR1H and TMR1L registers.
NOT set interrupt flag bit TMR1IF of the PIR1 register.
Set the GO/DONE bit to start the ADC conversion.
CCP1 4
Note 1: The Special Event Trigger from the CCP
module does not set interrupt flag bit
TMRxIF of the PIR1 register.
2: Removing the match condition by
changing the contents of the CCPR1H
and CCPR1L register pair, between the
clock edge that generates the Special
Event Trigger and the clock edge that
generate s the T imer1 Reset, wi ll preclude
the Reset from occurring.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 79
PIC12F609/615/12HV609/615
TABLE 10-3: SUMMARY OF REGISTERS ASSOCIATED WITH COMPARE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on:
POR, BOR
Value on
all other
Resets
CCP1CON P1M DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0-00 0000 0-00 0000
CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx uuuu uuuu
CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx uuuu uuuu
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
PIE1 ADIE(1) CCP1IE(1) CMIE TMR2IE(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 ADIF(1) CCP1IF(1) CMIF TMR2IF(1) TMR1IF -00- 0-00 -00- 0-00
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR2 Timer2 Module Register 0000 0000 0000 0000
TRISIO —TRISIO5TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
Legend: - = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Compare.
Note 1: For PIC12F615/HV615 only.
PIC12F609/615/12HV609/615
DS41302A-page 80 Preliminary © 2006 Microchip Technology Inc.
10.3 PWM Mode
The PWM mode generates a Pulse-Width Modulated
signal on the CCP1 pin. The duty cycle, period and
resolution are determined by the following registers:
•PR2
•T2CON
CCPR1L
CCP1CON
In Pulse-Width Modulation (PWM) mode, the CCP
module produce s up to a 10 -bit resoluti on PWM outp ut
on the CCP1 pin. Since the CCP1 pin is multiplexed
with the POR T dat a latch, the TRIS for that pi n must be
cleared to enable the CCP1 pin output driver.
Figur e 10- 3 sh ows a s impl ifi ed b loc k dia gram of PWM
operation.
Figure 10-4 shows a typical waveform of the PWM
signal.
For a ste p-by-step proced ure on how t o set up the CCP
module for PWM operation, see Section 10.3.7
“Setup for PWM Operation”.
FIGURE 10-3: SIMPLIFIED PWM BLOCK
DIAGRAM
The PWM output (Figure 10-4) has a time base
(period) and a time that the output stays high (duty
cycle).
FIGURE 10-4: CCP PWM OUTPUT
Note: Clearing the CCP1CON register will
relinquish CCP1 control of the CCP1 pin.
CCPR1L
CCPR1H(2) (Slave)
Comparator
TMR2
PR2
(1)
RQ
S
Duty Cycle Registers CCP1CON<5:4>
Clear Timer2 ,
toggle CCP1 pin and
latch duty cycle
Note 1: The 8-bit timer TMR2 register is concatenated
with the 2-bit internal system clock (FOSC), or
2 bits of the prescaler , to create the 10-bit time
base.
2: In PWM mode, CCPR1H is a read-only register
.
TRIS
CCP1
Comparator
Period
Pulse Width
TMR2 = 0
TMR2 = CCPRxL:CCPxCON<5:4>
TMR2 = PR2
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 81
PIC12F609/615/12HV609/615
10.3.1 PWM PERIOD
The PWM period is specified by the PR2 register of
Timer2. The PWM period can be calculated using the
formula of Equation 10-1.
EQUATION 10-1: PWM PERIOD
When TMR 2 is equa l to PR2, t he followi ng three ev ents
occur on the next inc rement cycle:
TMR2 is cl eare d
The CCP 1 pi n is se t. (Excep tio n: If the PWM duty
cycle = 0%, the pin will not be set.)
The PWM dut y cycl e is latched from CCPR1L i nto
CCPR1H.
10.3.2 PWM DUTY CYCLE
The PWM duty cycle is specified by writing a 10-bit
value to multiple registers: CCPR1L register and
DC1B<1:0> bits of the CCP1CON register. The
CCPR1L contains the eight MSbs and the DC1B<1:0>
bits of the CCP1CON register contain the two LSbs.
CCPR1L and DC1B<1:0> bits of the CCP1CON
register can be written to at any time. The duty cycle
value is not latched into CCPR1H until after the period
completes (i.e., a match between PR2 and TMR2
registers occurs). While using the PWM, the CCPR1H
register is read-only.
Equation 10-2 is used to calculate the PWM pulse
width.
Equat ion 10-3 is used to calculate the PW M duty cycl e
ratio.
EQUATION 10-2: PULSE WIDTH
EQUATION 10-3: DUTY CYCLE RATIO
The CCPR1H register and a 2-bit internal latch are
used to dou ble buf fer th e PWM duty cycle. Thi s doubl e
buffering is essential for glitchless PWM operation.
The 8-bit timer TMR2 register is concatenated with
either the 2-bit internal system clock (FOSC), or 2 bits of
the prescaler , to create the 10-bit time ba se. The system
clock is used if the Timer2 prescaler is set to 1:1.
When the 10-bit time base matches the CCPR1H and
2-bit latch, then the CCP1 pin is cleared (see
Figure 10-3).
10.3.3 PWM RESOLUTIO N
The res olution de termines the number of avai lable duty
cycles for a given period. For exampl e, a 10-bit r esolution
will result in 1024 discrete duty cycles, whereas an 8-bit
resolu ti on will result in 2 56 di sc re te du ty c ycl es .
The maximum PWM resolution is 10 bits when PR2 is
255. The resolution is a function of the PR2 register
value as shown by Equation 10-4.
EQUATION 10-4: PWM RESOLUTION
TABLE 10-4: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz)
TABLE 10-5: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz)
Note: The Timer2 postscaler (see Section 7.1
“Timer2 Operation”) is not used in the
determination of the PWM frequency.
PWM Period PR2()1+[]4TOSC =
(TM R2 Prescale Value)
Note: If the pulse width value is greater than the
period the assigned PWM pin(s) will
remain unchanged.
Pulse Width CCPR1L:CCP1CON<5:4>()
=
TOSC
(TMR2 Prescale Value)
Duty Cycle Ratio CCPR1L:CCP1CON<5:4>()
4PR2 1+()
-----------------------------------------------------------------------=
Resolution 4PR2 1+()[]log 2()log
------------------------------------------ bits=
PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17
Maximum Resolution (bits) 10 10 10 8 7 6.6
PWM Frequency 1.22 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0x65 0x65 0x65 0x19 0x0C 0x09
Maximum Resolution (bits) 8 8 8 6 5 5
PIC12F609/615/12HV609/615
DS41302A-page 82 Preliminary © 2006 Microchip Technology Inc.
10.3.4 OPERATION IN SLEEP MODE
In Sleep mode, the TMR2 register will not increment
and the st ate of the module will not change. If th e CCP1
pin is dri ving a value , it wi ll cont inue to d rive th at valu e.
When the device wakes up, TMR2 wil l continue from it s
previous state.
10.3.5 CHANGES IN SYSTEM CLOCK
FREQUENCY
The PWM frequency is derived from the system clock
frequency. Any changes in the system clock frequency
will result in changes to the PWM frequency. See
Section 3.0 “Oscillator Module” for additional
details.
10.3.6 EFFECTS OF RESET
Any Reset will force all ports to Input mode and the
CCP registers to their Reset states.
10.3.7 SETUP FOR PWM OPERATION
The following steps should be taken when configuring
the CCP module for PWM operation:
1. Disable the PWM pin (CCP1) output drivers by
setting the associated TRIS bit.
2. Set the PWM period by loading the PR2 register .
3. Configure the CCP module for the PWM mode
by loading the CCP1CON register with the
appropriate values.
4. Set the PWM duty cycle by loading the CCPR1L
register and DC1B bits of the CCP1CON register .
5. Configure and start Timer2:
Clear the TMR2IF interrupt flag bit of the
PIR1 register.
Set the T im er2 pres cale value by loa din g the
T2CKPS bits of the T2CON register.
Enabl e Timer2 by se ttin g th e TM R 2ON bit of
the T2CON register.
6. Enable PWM outpu t afte r a ne w PW M cy cle has
started:
Wait until Ti mer2 overflows (TMR2IF bit of
the PIR1 register is set).
Enable the CCP1 pin output driver by clear-
ing the associated TRIS bit.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 83
PIC12F609/615/12HV609/615
10.4 PWM (Enhanced Mode)
The Enhanced PWM Mode can generate a PWM signal
on up to four different output pins with up to 10-bits of
resolution. It can do this through four different PWM
output modes:
Single PWM
Half-Bridge PWM
To select an Enhanced PWM mode, the P1M bits of the
CCP1CON register must be se t appropriately.
The PWM outputs are multiplexed with I/O pins and are
designated P1A and P1B. The polarity of the PWM p ins
is configurable and is selected by setting the CCP1M
bits in the CCP1CON register appropriatel y.
Table 10-6 shows the pin assignments for each
Enhanced PWM mode.
Figure 10-5 shows an example of a simplified block
diagram of the Enhanced PWM module.
FIGURE 10- 5: EXAMPLE SIMPLIFIED B LOCK DIA GRAM OF T HE ENH ANC ED PW M MODE
TABLE 10-6: EXAMPLE PIN ASSIGNMENTS FOR VARIOUS PWM ENHANCED MODES
Note: To prevent the generation of an
incomplete waveform when the PWM is
first enabl ed, the ECCP module w aits unti l
the start of a new PWM period before
generating a PWM signal.
CCPR1L
CCPR1H (Slave)
Comparator
TMR2
Comparator
PR2
(1)
RQ
S
Duty Cycle Registers CCP1<1:0>
Clear Timer2,
toggle PWM pin and
latch duty cycle
* Alternate pin function.
Note 1: The 8-bit timer TMR2 register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler to create the 10-bit time base
.
TRISIO2
CCP1/P1A
Output
Controller
P1M<1:0> 2CCP1M<3:0>
4
PWM1CON
CCP1/P1A
P1B
0
1
TRISIO5
CCP1/P1A*
P1ASEL
(APFCON<0>)
TRISIO0
P1B
0
1
TRISIO4
P1B*
P1BSEL
(APFCON<1>)
Note 1: The TRIS register value for each PWM output must be configured appropriately.
2: Clearing the CCP1CON register will relinquish ECCP control of all PWM output pins.
3: Any pin not used by an Enhanced PWM mode is available for alternate pin functions.
ECCP Mode P1M<1:0> CCP1/P1A P1B
Single 00 Yes(1) Yes(1)
Half-Bridge 10 Yes Yes
Note 1: Pulse Steering enables outputs in Single mode.
PIC12F609/615/12HV609/615
DS41302A-page 84 Preliminary © 2006 Microchip Technology Inc.
FIGURE 10-6: EXAMPLE PWM (ENHANCED MODE) OUTPUT RELATIONSHIPS (ACTIVE-HIGH
STATE)
FIGURE 10-7: EXAMPLE ENHANCED PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE)
0
Period
00
10
Signal PR2+1
P1M<1:0>
P1A Modulated
P1A Modulated
P1B Modulated
P1A Active
P1B Inactive
P1C Inactive
P1D Modulated
P1A Inactive
Pulse
Width
(Single Output)
(Half-Bridge)
Delay(1) Delay(1)
Relationships:
Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value)
Pulse Width = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value)
De lay = 4 * TOSC * (PWM1CON<6:0>)
Note 1: Dead-band delay is programmed using the PWM1CON register (Section 10.4.5 “Programmable Dead-Band Delay
mode”).
0
Period
00
10
Signal PR2+1
P1M<1:0>
P1A Modulated
P1A Modulated
P1B Modulated
P1A Active
P1B Inactive
P1C Inact ive
P1D Modulated
Pulse
Width
(Single Output)
(Half-Bridge) Delay(1) Delay(1)
Relationships:
Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value)
Pulse W idth = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value)
Delay = 4 * TOSC * (PWM1CON<6:0>)
Note 1: Dead-band delay is programmed using the PWM1CON register (Section 10.4.5 “Programmable Dead-Band Delay
mode”).
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 85
PIC12F609/615/12HV609/615
10.4.1 HALF-BRIDGE MODE
In Half-Bridge mode, two pins are used as outputs to
drive push-p ull loa ds. The PW M outp ut sign al is output
on the C CP1/P1A pin, whil e the complementary P WM
output signal is output on the P1B pin (see Figure 10-8).
This mode can be used for Hal f-Bridge applications, as
shown in Figure 10-9, or for Full-Bridge applications,
where four power switches are being modulated with
two PWM signals.
In Half-Bridge mode, the programmable dead-band delay
can be used to prevent shoot-through current in Half-
Bridge power devices. The value of the PDC<6:0> bits of
the PWM1CON register sets the number of instruction
cycles before the output is driven active. If the value is
greater than the duty cycle, the corresponding output
remains inactive during the entire cycle. See
Section 10.4.5 “Programmable Dead-Band Delay
mode” for more details of the dead-band delay
operations.
Since the P1A and P1B outputs are multiplexed with
the PORT data latches, the associated TRIS bits must
be cleared to configure P1A and P1B as outputs.
FIGURE 10-8: EXAMPLE OF HALF-
BRIDGE PWM OUTPUT
FIGURE 10-9: EX AMPLE OF HALF-BRIDGE APPLICATIONS
Period
Pulse Width
td
td
(1)
P1A(2)
P1B(2)
td = Dead-Band Delay
Period
(1) (1)
Note 1: At this time, the TM R2 register is equal to the
PR2 register.
2: Output signals are shown as active-high.
P1A
P1B
FET
Driver
FET
Driver
Load
+
-
+
-
FET
Driver
FET
Driver
V+
Load
FET
Driver
FET
Driver
P1A
P1B
Standard Half-Bridge Circuit (“Push-Pull”)
Half-Bridge Output Driving a Full-Bridge Circuit
PIC12F609/615/12HV609/615
DS41302A-page 86 Preliminary © 2006 Microchip Technology Inc.
10.4.2 START-UP CONSIDERATIONS
When any PWM mode is used, the application
hardware must use the proper external pull-up and/or
pull-down resistors on the PWM output pins.
The CCP1M<1:0> bits of the CCP1CON register allow
the us er t o ch oose whe the r the P WM out put si gna ls ar e
active-hi gh or acti ve-low fo r each PWM output pin (P 1A
and P1B ). Th e PWM output pol arities must be selected
before the PWM pin output drivers are enabled.
Changing the polarity configuration while the PWM pin
output drivers are enable is not recommended since it
may result in damage to the application circuits.
The P1A and P1B output latches may not be in the proper
states when the PWM module is initialized. Enabling the
PWM pin output drivers at the same time as the
Enhanced PWM modes may cause damage to the
applic ation circuit. The Enhanc ed PWM modes must be
enabled in the proper Output mode and complete a full
PWM cycle before configuring the PWM pin output
drivers. Th e completi on of a f ull PWM cycle i s indicate d
by the TMR 2IF bit of the PIR1 regi ster being set as the
second PWM period begins.
Note: When the microcontroller is released from
Reset, all of the I/O pins are in the
high-impedance state. The external cir-
cuits must keep t he powe r switch devic es
in the OFF state until the microcontroller
drives the I/O pins with the proper signal
levels or activates the PWM output(s).
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 87
PIC12F609/615/12HV609/615
10.4.3 ENHANCED PWM AUTO-
SHUTDOWN MODE
The PWM mod e supp orts an Auto-Shut dow n m ode that
will disable the PWM outputs when an external
shutdown event occurs. Auto-Shutdown mode places
the PWM output pins into a predetermined state. This
mode is used to help prevent the PWM from damaging
the application.
The auto-shutdown sources are selected using the
ECCPASx bits of the ECCPAS register. A shutdown
event may be generated by:
•A logic0’ on the INT pin
•Comparator
Setting the ECCPASE bit in firmware
A shutdown condition is indicated by the ECCPASE
(Auto-Shutdown Event Status) bit of the ECCPAS
register. If the bit is a0’, the PWM pins are operating
normally. If the bit is a ‘1’, the PWM outputs are in the
shutdown state. Refer to Figure 1.
When a shutdow n event oc curs, two things ha ppen:
The ECCPASE bit is set to ‘1’. The ECCPASE will
remain set until cleared in firmware or an auto-restart
occurs (see Section 10.4.4 “Auto-Restart Mode”).
The enabled PWM pins are asynchronously placed in
their shutdown states. The PWM output pins are
grouped into pairs [P1A/P1C] and [P1B/P1D]. The state
of each pin pair is determined by the PSSAC and
PSSBD bits of the ECCPAS register. Each pin pair may
be placed into one of three states:
Drive logic 1
Drive logic 0
Tri-state (high-impedance)
FIGURE 10-10: AUTO-SHUTDOWN BLOCK DIAGRAM
PSSAC<1>
TRISx P1A
0
1
P1A_DRV
PSSAC<0>
PSSBD<1>
TRISx P1B
0
1
PSSBD<0>
P1B_DRV
000
001
010
011
100
101
110
111
From Comparator
ECCPAS<2:0>
R
DQ
S
ECCPASE
From Data Bus
Write to ECCPASE
PRSEN
INT
PIC12F609/615/12HV609/615
DS41302A-page 88 Preliminary © 2006 Microchip Technology Inc.
REGISTER 10-2: ECCPAS: ENHANCED CAPTURE/COMPARE/PWM AUTO-SHUTDOWN
CONTROL REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7 ECCPASE: ECCP Auto-Shutdown Event Status bit
1 = A shutdown event has occurred; ECCP outputs are in shutdown state
0 = ECCP outputs are operating
bit 6-4 ECCPAS<2:0>: ECCP Auto-shutdown Source Select bits
000 = Auto-Shutdown is disabled
001 = Comparator output change
010 = Auto-Shutdown is disabled
011 = Comparator output change(1)
100 =VIL on INT pin
101 =V
IL on INT pin or Comparator change
110 =V
IL on INT pin(1)
111 =VIL on INT pin or Comparator change
bit 3-2 PSSAC<1:0>: Pin P1A Shutd own State C ontro l bit s
00 = Drive pin P1A to ‘0
01 = Drive pin P1A to ‘1
1x = Pin P1A tri-state
bit 1-0 PSSBD<1:0>: Pin P1B Shutdown State Control bi ts
00 = Drive pin P1B to ‘0
01 = Drive pin P1B to ‘1
1x = Pin P1B tri-state
Note 1: If CMSYNC is enabled, the shutdown will be delayed by Timer1.
Note 1: The auto-shutdown condition is a level-
based signal, not an edge-based signal.
As long as the level is present, the auto-
shutdown will persist.
2: Writing to the ECCPASE bit is disabled
while an auto-shutdown condition
persists.
3: Once the auto-shutdown condition has
been removed and the PWM restarted
(either through firmware or auto-restart)
the PWM signal will always restart at the
beginning of the next PWM period.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 89
PIC12F609/615/12HV609/615
FIGURE 10-11: PWM AUTO-SHUTDOW N WITH FIRMWARE RESTART (PRSEN = 0)
10.4.4 AUTO-RESTART MODE
The Enhanced PWM can be configured to automati-
cally restart the PWM signal once the auto-shutdown
condition has been removed. Auto-restart is enabled by
setting the PRSEN bit in the PWM1CON register.
If auto-restart is enabled, the ECCPASE bit will remain
set as long as the auto-shutdown condition is active.
When the auto-shutdown condition is removed, the
ECCPASE bit will be cleared via hardware and normal
operation will resume.
FIGURE 10-12: PWM AUTO-SHUTDOWN WITH AUTO-RESTART ENABLED (PRSEN = 1)
Shutdown
PWM
ECCPASE bi t
Activity
Event
Shutdown
Event Occurs Shutdown
Event Clears PWM
Resumes
PWM Per iod
Start of
PWM Period
ECCPASE
Cleared by
Firmware
Shutdown
PWM
ECCPAS E bi t
Activity
Event
Shutdown
Event Occurs Shutdown
Event Cle ars PWM
Resumes
PWM Period
Start of
PWM Period
PIC12F609/615/12HV609/615
DS41302A-page 90 Preliminary © 2006 Microchip Technology Inc.
10.4.5 PROGRAMMABLE DEAD-BAND
DELAY MODE
In Half-Bridge applications where all power switches
are modulated at the PWM frequency, the power
switches normally require more time to turn off than to
turn on. If b oth the uppe r and lowe r power swit ches ar e
switched at the same time (one turned on, and the
other turned off), both switches may be on for a short
period of time until one switch completely turns off.
During this brief interval, a very high current (shoot-
through c urre nt) wi ll flow throu gh bot h power switc hes ,
shorting the bridge supply. To avoid this potentially
destructive shoot-through current from flowing during
switching, turning on either of the power switches is
normally delayed to allow the other switch to
completely turn off.
In Half-Bridge mode, a digitally programmable dead-
band delay is available to avoid shoot-through current
from destroying the bridge power switches. The delay
occurs at the signa l tra nsition fro m the no n-acti ve sta te
to the active state. See Figure 10-13 for illustration.
The lower seven bits of the associated PWMxCON
register (Register 10-3) sets the delay period in terms
of microcontroller instruction cycles (TCY or 4 TOSC).
FIGURE 10-13: EXAMPLE OF HALF-
BRIDGE PWM OUTPUT
FIGURE 10-14: EXAMPLE OF HALF-BRIDGE APPLICATIONS
Period
Pulse Width
td
td
(1)
P1A(2)
P1B(2)
td = Dead-Band Delay
Period
(1) (1)
Note 1: At this time, the TMR2 register is equal to the
PR2 register.
2: Output signals are shown as active-high.
P1A
P1B
FET
Driver
FET
Driver
V+
V-
Load
+
V
-
+
V
-
Standard Half-Bridge Circuit (“Push-Pull”)
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 91
PIC12F609/615/12HV609/615
TABLE 10-7: SUMMARY OF REGISTERS ASSOCIATED WITH PWM
REGISTER 10-3: PWM1CON: ENHANCED PWM CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set 0’ = Bit is cleared x = Bit is unknown
bit 7 PRSEN: PWM Restart Enable bit
1 = Upon auto-shutdown, the ECCPASE bit clears automatically once the shutdown event goes
away; the PWM restarts automatically
0 = Upon auto-shutdown, ECCPASE must be cleared in software to restart the PWM
bit 6-0 PDC<6:0>: PWM Delay Count bits
PDCn = Number of FOSC/4 (4 * TOSC) cycles between the scheduled time when a PWM signal
should transition active and the actual time it transitions active
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Valu e on
all othe r
Resets
APFCON —T1GSEL P1BSEL P1ASEL ---0 --00 ---0 --00
CCP1CON P1M DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0-00 0000 0-00 0000
CCPR1L Capture/Compare/PWM Regist er 1 Low Byte xxxx xxxx uuuu uuuu
CCPR1H Capture/Compare/P WM Regist er 1 High Byte xxxx xxxx uuuu uuuu
CMCON0 CMON COUT CMOE CMPOL —CMR—CMCH0000 -0-0 0000 -0-0
CMCON1 T1ACS CMHYS —T1GSSCMSYNC ---0 0-10 ---0 0-10
ECCPAS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 0000 0000 0000 0000
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
PIE1 ADIE(1) CCP1IE(1) CMIE —TMR2IE
(1) TMR1IE -00- 0-00 -00- 0-00
PIR1 ADIF(1) CCP1IF(1) CMIF —TMR2IF
(1) TMR1IF -00- 0-00 -00- 0-00
T2CON TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
TMR2 Timer2 Module Register 0000 0000 0000 0000
TRISIO TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111
Legend: - = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the PWM.
Note 1: For PIC12F615/HV615 only.
PIC12F609/615/12HV609/615
DS41302A-page 92 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 93
PIC12F609/615/12HV609/615
11.0 SPECIAL FEATURES OF THE
CPU
The PIC12F609/615/12HV609/615 has a host of
features intended to maximize system reliability,
minimize cost through elimination of external
components, provide power-saving features and offer
code protection.
These features are:
Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Ti mer (OST)
- Brown-out Reset (BOR)
Interrupts
Watchdog Timer (WDT)
Oscillator selection
Sleep
Code protection
ID Locations
In-Circuit Serial Programming
The PIC12 F60 9/6 15/1 2H V60 9/6 15 h as tw o time rs th at
offer necessary delays on power-up. One is the
Oscillator Start-up Timer (OST), intended to keep the
chip in Reset until the crystal oscillator is stable. The
other is t he Power-up T im er (PWR T), which prov ide s a
fixed delay of 64 ms (nominal) on power-up only,
designed to keep the part in Reset while the power
supply stabilizes. There is also circuitry to reset the
device if a brown-out occurs , which can use the Power-
up Timer to provide at lea st a 64 ms Reset. With thes e
three functions-on-chip, most applications need no
external Reset circuitry.
The Sleep mode is de signe d to of fer a very low-c urrent
Power-Down mode. The user ca n wa ke -up fro m Slee p
through:
External Reset
Watchdog Timer Wake-up
An interrupt
Several oscillator options are also made available to
allow the part to fit the application. The INTOSC option
saves system cost while the LP crystal option saves
power. A set of Configuration bits are used to select
various options (see Register 11-1).
11.1 Configuration Bits
The Configuration bits can be programmed (read as
0’), or left unprogrammed (read as ‘1’) to select various
device configurations as shown in Register 11-1.
These bits are mapped in program memory location
2007h.
Note: Address 2007h is beyond the user program
memory space. It belongs to the special
configuration memory space (2000h-
3FFFh), which can be accessed only during
programming. See “PIC12F6XX/16F6XX
Memory Programming Specification”
(DS41204) for m o re i nfo r mation .
PIC12F609/615/12HV609/615
DS41302A-page 94 Preliminary © 2006 Microchip Technology Inc.
REGISTER 11-1: CONFIG: CONFIGURATION W ORD REGISTER
—BOREN1
(1) BOREN0(1)
bit 15 bit 8
IOSCFS CP(2) MCLRE(3) PWRTE WDTE FOSC2 FOSC1 FOSC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit P = Programmable U = Unimplemented bit,
read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-10 Unimplemented: Read as1
bit 9-8 BOREN<1:0>: Brown-out Reset Selection bits(1)
11 = BOR enabled
10 = BOR enabled during operation and disabled in Sleep
0x = BOR disabled
bit 7 IOSCFS: Internal Oscillator Frequency Select bit
1 = 8 MHz
0 = 4 MHz
bit 6 CP: Code Protection bit(2)
1 = Program memory code protection is disabled
0 = Program memory code protection is enabled
bit 5 MCLRE: MCLR Pin Function Select bit(3)
1 = MCLR pin function is MCLR
0 = MCLR pin function is digital input, MCLR internally tied to VDD
bit 4 PWRTE: Power-up Timer Enable bit
1 = PWRT disabled
0 = PWRT enabled
bit 3 WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 2-0 FOSC<2:0>: Oscillator Select ion bits
111 = RC oscillator: CLKOUT function on GP4/OSC2/CLKOUT pin, RC on GP5/OSC1/CLKIN
110 = RCIO oscillator: I/O function on GP4/OSC2/CLKOUT pin, RC on GP5/OSC1/CLKIN
101 = INTOSC oscillator: CLKOUT function on GP4/OSC2/CLKOUT pin, I/O function on
GP5/OSC1/CLKIN
100 = INTOSCIO oscillator: I/O function on GP4/OSC2/CLKOUT pin, I/O function on
GP5/OSC1/CLKIN
011 = EC: I/O function on GP4/OSC2/CLKOUT pin, CLKIN on GP5/OSC1/CLKIN
010 = HS oscillator: High-speed crystal/resonator on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN
001 = XT oscillator : Crystal/resona tor on GP4/ OSC2/CLKOUT and GP5/OSC1/CLKIN
000 = LP oscillator: Low-power crystal on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN
Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer.
2: The entire program memory will be erased when the code protection is turned off.
3: When MCLR is asserted in INTOSC or RC mode, the internal clock oscillator is disabled.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 95
PIC12F609/615/12HV609/615
11.2 Calibrati on Bits
The 8 MHz internal oscillator is factory calibrated.
These calibration values are stored in fuses located in
the Calibration Word (2009h). The Calibration Word is
not erased when using the specified bulk erase
sequence in the “PIC12F6XX/16F6XX Memory Pro-
grammi ng Specificat ion” (DS41204 ) and thus, doe s not
require reprogramming.
11.3 Reset
The PIC12F609/615/12HV609/615 device differenti-
ates between various kinds of Reset:
a) Power-on Reset (POR)
b) WDT Reset during normal operation
c) WDT Reset during Sleep
d) MCLR Reset during normal operation
e) MCLR Reset during Sleep
f) Brown-out Reset (BOR)
Some regi sters a re not af fected in a ny Rese t conditio n;
their status i s un kn ow n on POR a nd unchang ed i n an y
other Reset. Most other registers are reset to a “Reset
state” on:
Power-on Reset
•MCLR Reset
•MCLR
Reset during Sleep
WDT Reset
Brown-out Reset (BOR)
WDT wake-up does not cause register resets in the
same manner as a WDT Reset since wake-up is
viewed as the resump tio n of no rm al op era tion . TO and
PD bits are set or cleared differently in different Reset
situati ons, as ind icated in Table 11-2. Softwar e can use
these bits to determine the nature of the Reset. See
Table 11-5 for a full description of Reset states of all
registers.
A simplif ied block diagra m of the On-Chip Rese t Circu it
is sh own i n Figure 11-1.
The MCLR Reset path has a noise filter to detect and
ignore small pulses. See Section 15.0 “Electrical
Specifications” for pulse-width specifications.
FIGURE 11-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
S
RQ
External
Reset
MCLR/VPP pin
VDD
OSC1/
WDT
Module
VDD Rise
Detect
OST/PWRT
On-Chip
WDT
Time-out
Power-on Reset
OST
10-bit Ripple Counter
PWRT
Chip_Reset
11-bit Ripple Counter
Reset
Enable OST
Enable PWRT
Sleep
Brown-out(1)
Reset BOREN
CLKIN pin
Note 1: Refer to the Configuration Word register (Register 11-1).
RC OSC
PIC12F609/615/12HV609/615
DS41302A-page 96 Preliminary © 2006 Microchip Technology Inc.
11.3.1 POWER-ON RESET (POR)
The on-chip POR circuit holds the chip in Reset until
VDD has reached a high enough level for proper
operation. To take advantage of the POR, simply
connect the MCLR pin through a resistor to VDD. This
will eliminate external RC components usually needed
to create Power-on Reset. A maximum rise time for
VDD is required. See Section 15.0 “Electrical
Specifications” for details. If the BOR is enabled, the
maximum rise time specification does not apply. The
BOR circuitry will keep the device in Reset until VDD
reaches VBOR (see Section 11.3.4 “Brown-out Reset
(BOR)”).
When the device starts normal operation (exits the
Reset condition), device operating parameters (i.e.,
voltage, frequency, temperature, etc.) must be met to
ensure proper operation. If these conditions are not
met, the device must be held in Reset until the
operating conditions are met.
For additional information, refer to Application Note
AN607, “Power-up Trouble Shooting” (DS00607).
11.3.2 MCLR
PIC12F609/615/12HV609/615 has a noise filter in the
MCLR Reset path. The filter will detect and ignore
small pul ses.
It should be noted that a WDT Reset does not drive
MCLR pin low.
Voltages applied to the MCLR pin that exceed its
specification can result in both MCLR Resets and
excessive current beyond the device specification
during the ESD event. For this reason, Microchip
recommends that the MCLR pin no longer be tied
directly to VDD. The use of an RC netw ork, as shown in
Figure 11-2, is suggested.
An internal MCLR option is enabled by clearing the
MCLRE bit in the Configuration Word register. When
MCLRE = 0, the Reset signal to the chip is generated
internally. When the MCLRE = 1, the GP3/MCLR pin
becomes an external Reset input. In this mode, the
GP3/MCLR pin has a weak pull-up to VDD.
FIGURE 11-2: RECOMMENDED MCLR
CIRCUIT
11.3.3 POWER-UP TIMER (PWRT)
The Power-up Ti mer provides a fixed 64 ms (nominal)
time-out on power-up only, from POR or Brown-out
Reset. The Power-up Timer operates from an internal
RC oscillator. For more information, see Section 3.4
“Internal Clock Modes”. The chip is kept in Reset as
long as PWRT is active. The PWRT delay allows the
VDD to rise to an acceptable level. A Configuration bit,
PWRTE, can disable (if set) or enable (if cleared or
programmed) the Power-up Timer. The Power-up
Timer should be enabled when Brown-out Reset is
enabled, although it is not required.
The Power-up Timer delay will vary from chip-to-chip
due to:
•V
DD variation
Temperature variation
Process variation
See DC parameters for details (Section 15.0
“Electrical Specifications”).
Note: The POR circuit does not produce an
internal Reset when VDD declines. To re-
enable the POR, VDD must reach Vss for
a minimum of 100 μs.
Note: Voltage spikes below VSS at the MCLR
pin, induc ing cu rrent s gre ater than 80 mA,
may ca use la tch-up . Thus , a ser ies res is-
tor of 50-100 Ω should be used when
applying a “low” level to the MCLR pin,
rather than pulling this pin directly to VSS.
VDD
PIC®
MCLR
R1
1kΩ (or greater)
C1
0.1 μF
(optional, not critical)
R2
100 Ω
(needed with capacitor)
SW1
(optional)
MCU
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 97
PIC12F609/615/12HV609/615
11.3.4 BROWN-OUT RESET (BOR)
The BOREN0 and BOREN1 bits in the Configuration
Word register select one of three BOR modes. One
mode has been added to allow control of the BOR
enable for lower current during Sleep. By selecting
BOREN<1:0> = 10, the BOR is automatically disabled
in Sl eep to conserve power an d enabl ed on wa ke-up.
See Register 11-1 for the Configuration Word
definition.
A brown-out occurs when VDD falls below VBOR for
greater than parameter TBOR (see Section 15.0
“Electrical Specifications). The brown-out condition
will reset the device. This will occur regardless of VDD
slew rate. A Brown-out Reset may not occur if VDD falls
below VBOR for less than parameter TBOR.
On any Reset (Power-on, Brown-out Reset, Watchdog
timer, etc.), the chip will remain in Reset until VDD rises
above VBOR (see Figure 11-3). If enabled, the Power-
up T imer will be invoked by the Re set and keep the chip
in Reset an additi onal 64 ms.
If VDD drops below VBOR while the Power-up Timer is
running, the chip will go back into a Brown-out Reset
and the Power-u p Timer will be re-initialized. Onc e VDD
rises above VBOR, the Power-up Timer will execute a
64 ms Reset.
11.3 .5 BOR CAL IBRAT ION
The PIC12F609/615/12HV609/615 stores the BOR
calibration values in fuses located in the Calibration
Word register (20 08h). The C alibration W ord reg ister is
not erased when using the specified bulk erase
sequence in the “PIC12F6XX/16F6XX Memory Pro-
grammi ng Specificat ion” (DS41204) and thus, does not
require reprogramming.
FIGURE 11 -3: BROWN-OUT SITUATIONS
Note: The Power-up Timer is enabled by the
PWRTE bit in the Configuration Word
register.
Note: Address 2008h is beyond the user pro-
gram memory space. It belongs to the
special configuration memory space
(2000h-3FFFh), which can be accessed
only during programming. See
PIC12F6XX/16F6XX Memory Program-
ming Specification” (DS41204) for more
information.
64 ms(1)
VBOR
VDD
Internal
Reset
VBOR
VDD
Internal
Reset 64 ms(1)
< 64 ms
64 ms(1)
VBOR
VDD
Internal
Reset
Note 1: 64 ms delay only if PWRTE bit is programmed to ‘0’.
PIC12F609/615/12HV609/615
DS41302A-page 98 Preliminary © 2006 Microchip Technology Inc.
11.3.6 TIME-OUT SEQUENCE
On power-up, the time-out seque nce is a s follows:
PWRT time-out is invoked after POR has expired.
OST is acti vated after the PWRT time-out has
expired.
The total time-out will vary based on oscillator
configuration and PWR TE bit status. For example, in EC
mode with PWRTE bit erased (PWRT disabled), there
will be no time-out at all. Figure 11-4, Figure 11-5 and
Figure 11-6 depict time-out sequences.
Since the time-outs occur from the POR pulse, if MCLR
is kept low long enough, the time-outs will expire. Then,
bringing MCLR high will begin execution immediately
(see Figure 11-5). This is useful for testing purposes or
to synchronize more than one PIC12F609/615/
12HV609/615 device op erating in parallel.
Table 11-6 shows the Reset conditions for some
special registers, while Table 11-5 shows the Reset
conditions for all the registers.
11.3.7 POWER CONTROL (PCON)
REGISTER
The Power Control register PCON (address 8Eh) has
two Status bits to indicate what type of Reset occurred
last.
Bit 0 is BOR (Brown-out). BOR is unknown on Power-
on Reset. It must then be set by the user and checked
on subsequent Resets to see if BOR = 0, indicating that
a Brown-out has occurred. The BOR Status bit is a
“don’t care” and is not necessarily predictable if the
brown-o ut circuit is disabl ed (BOREN<1:0> = 00 in the
Configuration Word register).
Bit 1 is POR (Power-on Reset). It is a ‘0’ on Power-on
Reset and unaf fec ted oth erwise. T he user m ust write a
1’ to this bit following a Power-on Reset. On a subse-
quent Reset, if POR is ‘0’, it will indicate that a Power-
on Reset has occurred (i.e., VDD may have gone too
low).
For more in form at ion , s ee Sect ion 1 1.3.4 “B rown- out
Reset (BOR)”.
TABLE 11-1: TIME-OUT IN VARIOUS SITUATIONS
TABLE 11-2: STATUS/PCON BITS AND THEIR SIGNIFICANCE
TABLE 11-3: SUMMARY OF REGISTERS ASSOCIATED WITH BROWN-OUT RESET
Oscillator Configuration Po wer-up Brown-out Reset W ake-up from
Sleep
PWRTE = 0PWRTE = 1PWRTE = 0PWRTE = 1
XT, HS, LP TPWRT + 1024 •
TOSC 1024 • TOSC TPWRT + 1024 •
TOSC 1024 • TOSC 1024 • TOSC
RC, EC, INTOSC TPWRT —TPWRT ——
POR BOR TO PD Condition
0x11Power-on Reset
u011Brown-out Reset
uu0uWDT Re set
uu00WDT Wake-up
uuuuMCLR Reset during normal operation
uu10MCLR Reset during Sleep
Legend: u = unchanged, x = unknown
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 V a lue on
POR, BOR
Value on
all other
Resets(1)
PCON —PORBOR ---- --qq ---- --uu
STATUS IRP RP1 RP0 TO PD ZDC C0001 1xxx 000q quuu
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition.
Shaded cell s are not us ed by BOR.
Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 99
PIC12F609/615/12HV609/615
FIGURE 11-4: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 1
FIGURE 11-5: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 2
FIGURE 11-6: TIME-OUT SEQUENCE ON POWER-UP (MCLR WITH VDD)
TPWRT
TOST
VDD
MCLR
Internal POR
PWRT T ime-out
OST Time-out
Internal Reset
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
TPWRT
TOST
TOST
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
TPWRT
PIC12F609/615/12HV609/615
DS41302A-page 100 Preliminary © 2006 Microchip Technology Inc.
TABLE 11-4: INITIALIZATION CONDITION FOR REGISTERS (PIC12F609/HV609)
Register Address Power-on
Reset
MCLR Reset
WDT Reset
Brown-out Reset(1)
Wake-up from Sleep through
Interrupt
Wake-up from Sleep through
WDT Time-out
W—xxxx xxxx uuuu uuuu uuuu uuuu
INDF 00h/80h xxxx xxxx xxxx xxxx uuuu uuuu
TMR0 01h xxxx xxxx uuuu uuuu uuuu uuuu
PCL 02h/82h 0000 0000 0000 0000 PC + 1(3)
STATUS 03h/83h 0001 1xxx 000q quuu(4) uuuq quuu(4)
FSR 04h/84h xxxx xxxx uuuu uuuu uuuu uuuu
GPIO 05h --x0 x000 --u0 u000 --uu uuuu
PCLATH 0Ah/8Ah ---0 0000 ---0 0000 ---u uuuu
INTCON 0Bh/8Bh 0000 0000 0000 0000 uuuu uuuu(2)
PIR1 0Ch ----- 0--0 ---- 0--0 ---- u--u(2)
TMR1L 0Eh xxxx xxxx uuuu uuuu uuuu uuuu
TMR1H 0Fh xxxx xxxx uuuu uuuu uuuu uuuu
T1CON 10h 0000 0000 uuuu uuuu -uuu uuuu
VRCON 19h 0-00 0000 0-00 0000 u-uu uuuu
CMCON0 1Ah 0000 -0-0 0000 -0-0 uuuu -u-u
CMCON1 1Ch ---0 0-10 ---0 0-10 ---u u-qu
OPTION_REG 81h 1111 1111 1111 1111 uuuu uuuu
TRISIO 85h --11 1111 --11 1111 --uu uuuu
PIE1 8Ch ----- 0--0 ---- 0--0 ---- u--u
PCON 8Eh ---- --0x ---- --uu(1, 5) ---- --uu
OSCTUNE 90h ---0 0000 ---u uuuu ---u uuuu
WPU 95h --11 -111 --11 -111 --uu -uuu
IOC 96h --00 0000 --00 0000 --uu uuuu
ANSEL 9Fh ---- 1-11 ---- 1-11 ---- q-qq
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition.
Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently.
2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt
vector (0004h).
4: See Table 11-6 for Reset value for specific condition.
5: If Reset was due to brown-out, then bit 0 = 0. All other Resets will ca use bit 0 = u.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 101
PIC12F609/615/12HV609/615
TABLE 11-5: INITIALIZATION CONDITION FOR REGISTERS (PIC12F615/HV615)
Register Address Power-on Re set MCLR Reset
WDT Reset
Brown-out Reset (1)
Wake-up from Slee p th rou gh
Interrupt
Wake-up from Slee p th rou gh
WDT Time-out
W—xxxx xxxx uuuu uuuu uuuu uuuu
INDF 00h/80h xxxx xxxx xxxx xxxx uuuu uuuu
TMR0 01h xxxx xxxx uuuu uuuu uuuu uuuu
PCL 02h/82h 0000 0000 0000 0000 PC + 1(3)
STATUS 03h/83h 0001 1xxx 000q quuu(4) uuuq quuu(4)
FSR 04h/84h xxxx xxxx uuuu uuuu uuuu uuuu
GPIO 05h --x0 x000 --u0 u000 --uu uuuu
PCLATH 0Ah/8Ah ---0 0000 ---0 0000 ---u uuuu
INTCON 0Bh/8Bh 0000 0000 0000 0000 uuuu uuuu(2)
PIR1 0Ch -000 0-00 -000 0-00 -uuu u-uu(2)
TMR1L 0Eh xxxx xxxx uuuu uuuu uuuu uuuu
TMR1H 0Fh xxxx xxxx uuuu uuuu uuuu uuuu
T1CON 10h 0000 0000 uuuu uuuu -uuu uuuu
TMR2(1) 11h 0000 0000 0000 0000 uuuu uuuu
T2CON(1) 12h -000 0000 -000 0000 -uuu uuuu
CCPR1L(1) 13h xxxx xxxx uuuu uuuu uuuu uuuu
CCPR1H(1) 14h xxxx xxxx uuuu uuuu uuuu uuuu
CCP1CON(1) 15h 0-00 0000 0-00 0000 u-uu uuuu
PWM1CON(1) 16h 0000 0000 0000 0000 uuuu uuuu
ECCPAS(1) 17h 0000 0000 0000 0000 uuuu uuuu
VRCON 19h 0-00 0000 0-00 0000 u-uu uuuu
CMCON0 1Ah 0000 -0-0 0000 -0-0 uuuu -u-u
CMCON1 1Ch ---0 0-10 ---0 0-10 ---u u-qu
ADRESH(1) 1Eh xxxx xxxx uuuu uuuu uuuu uuuu
ADCON0(1) 1Fh 00-0 0000 00-0 0000 uu-u uuuu
OPTION_REG 81h 1111 1111 1111 1111 uuuu uuuu
TRISIO 85h --11 1111 --11 1111 --uu uuuu
PIE1 8Ch -00- 0-00 -00- 0-00 -uu- u-uu
PCON 8Eh ---- --0x ---- --uu(1, 5) ---- --uu
OSCTUNE 90h ---0 0000 ---u uuuu ---u uuuu
PR2 92h 1111 1111 1111 1111 1111 1111
APFCON 93h ---0 --00 ---0 --00 ---u --uu
WPU 95h --11 -111 --11 -111 --uu -uuu
IOC 96h --00 0000 --00 0000 --uu uuuu
ADRESL 9Eh xxxx xxxx uuuu uuuu uuuu uuuu
ANSEL 9Fh -000 1111 -000 1111 -uuu qqqq
Legend: u = unchang ed, x = unknow n , – = un i m pl em ented bit, reads as ‘0’, q = value depe nds on condit i on.
Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently.
2: One or mor e bi ts in IN TC O N and/or PIR1 will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h).
4: See Table 11-6 for Reset valu e fo r sp ecific condit i on.
5: If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u.
PIC12F609/615/12HV609/615
DS41302A-page 102 Preliminary © 2006 Microchip Technology Inc.
TABLE 11-6: INITIALIZATION CONDITION FOR SPECIAL REGISTERS
Condition Program
Counter Status
Register PCON
Register
Power-on Reset 000h 0001 1xxx ---- --0x
MCLR Reset during normal operation 000h 000u uuuu ---- --uu
MCLR Reset during Sleep 000h 0001 0uuu ---- --uu
WDT R eset 000h 0000 uuuu ---- --uu
WDT Wake-up PC + 1 uuu0 0uuu ---- --uu
Brown-out Reset 000h 0001 1uuu ---- --10
Interrupt Wake-up from Sleep PC + 1(1) uuu1 0uuu ---- --uu
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as 0’.
Note 1: When the w a ke -up i s du e to an i nterrupt and Global Int errup t Ena ble bit, GIE, is set, the PC is l oad ed wi th
the inter rupt vector ( 0004h) a fter exec ution of PC + 1.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 103
PIC12F609/615/12HV609/615
11.4 Interrupts
The PIC12F609/615/12HV609/615 has 8 sources of
interrupt:
External Inte rrup t GP2/INT
Timer0 Overflow Inter rupt
GPIO Change Interrupts
Comparator Interrupt
A/D Interrupt (615 only)
Timer1 Overflow Inter rupt
Timer2 Match Interrupt (615 only)
Enhanced CCP Interrupt (615 only)
The Interrup t Control register (INTCON) and Peripheral
Interrupt Request Register 1 (PIR1) record individual
interrupt requests in flag bits. The INTCON register
also has individual and global interrupt enable bits.
The Global Interrupt Enable bit, GIE of the INTCON
register, enables (if set) all unmasked interrupts, or
disables (if cleared) all interrupts. Individual interrupts
can be disabled through their corresponding enable
bits in the INTCON register and PIE1 register. GIE is
cleared on Reset.
When an interrupt is serviced, the following actions
occu r automatically:
The GIE i s clea red to disable any fu rthe r int errup t.
The return address is pushed onto the stack.
The PC is loaded with 0004h.
The Return from Interrupt instruction, RETFIE, exits
the interrupt routine, as well as sets the GIE bit, which
re-enable s unm as ke d inte rrupts.
The following interrupt flags are contained in the
INTCON register:
INT Pin Interrupt
GPIO Change Interrupt
Timer0 Overflow Inter rupt
The peripheral interrupt flags are contained in the
special register, PIR1. The corresponding interrupt
enable bit is contained in special register, PIE1.
The following interrupt flags are contained in the PIR1
register:
A/D Interrupt
Comparator Interrupt
Timer1 Overflow Inter rupt
Timer2 Match Interrupt
Enhanced CCP Interrupt
For external interrupt events, such as the INT pin or
GPIO change interrupt, the interrupt latency will be
three or four instruction cycles. The exact latency
depends upon when the interrupt event occurs (see
Figure 11-8). The latency is the same for one or two-
cycle instructions. Once in the Interrupt Service
Routine, the source(s) of the interrupt can be
determined by polling the interrupt flag bits. The
interrupt flag bit(s) must be cleared in software before
re-enabling interrupts to avoid multiple interrupt
requests.
For additional information on Timer1, Timer2,
comparators, ADC, Enhanced CCP modules, refer to
the respective peripheral section.
11.4.1 GP2/INT INTERRUPT
The external interrupt on the GP2/INT pin is edge-
triggered; either on the rising edge if the INTEDG bit of
the OPTION register is set, or the falling edge, if the
INTEDG b it is cle ar. When a valid e dge ap pears o n the
GP2/INT pin, the INTF bit of the INTCON register is set.
This interrupt can be disabled by clearing the INTE
control bit of the INTCON register. The INTF bit must
be cleared by software in the Inte rrup t Servic e R ou tin e
before re -enabling this int errupt. The GP2/INT in terrupt
can wake-up the processor from Sleep, if the INTE bit
was set prior to going into Sleep. See Section 11.7
“Power-Down M ode (Sleep)” f or deta ils on Sl eep and
Figure 11-9 for timing of wake-up from Sleep through
GP2/INT interrupt.
Note 1: Individual interrupt flag bits are set,
regardless of the status of their
corresponding mask bit or the GIE bit.
2: When an instruction that clears the GIE
bit is executed, any interrupts that were
pending for execution in the next cycle
are ignored. The interrupts, which were
ignored, are still pending to be serviced
when the GIE bit is set again.
Note: The ANSEL register must be initialized to
configure an analog channel as a digital
input. Pi ns configu red as analo g inputs will
read ‘0’ and cannot generate an interrupt.
PIC12F609/615/12HV609/615
DS41302A-page 104 Preliminary © 2006 Microchip Technology Inc.
11.4.2 TIMER0 INTERRUPT
An overflow (FFh 00h) in the TMR0 register will set
the T0IF bit of the INTCON register. The interrupt can
be enabled/disabled by setting/clearing T0IE bit of the
INTCON register. See Section 5.0 “Timer0 Module”
for operation of the Timer0 module.
11.4.3 GPIO INTERRUPT-ON-CHANGE
An input change on GPIO sets the GPIF bit of the
INTCON register. The interrupt can be enabled/
disabled by setting/clearing the GPIE bit of the
INTCON register. Plus, individual pins can be
configured through the IOC register.
FIGURE 11 -7: INTERRUPT LOGIC
Note: If a change on the I/O pin should occur
when any GPIO operation is being
executed, then the GPIF interrupt flag may
not get set.
TMR1IF
TMR1IE
CMIF
CMIE
T0IF
T0IE
INTF
INTE
GPIF
GPIE
GIE
PEIE
Wake-up (If in Sleep mode)(1)
Inte rrup t to C PU
ADIF
ADIE
IOC-GP0
IOC0
IOC-GP1
IOC1
IOC-GP2
IOC2
IOC-GP3
IOC3
IOC-GP4
IOC4
IOC-GP5
IOC5
TMR2IF
TMR2IE
CCP1IF
CCP1IE
Note 1: Some peripherals depend upon the system clock for
operation. Since the system clock is suspended during Sleep, only
those peripherals which do not depend upon the system clock will wake
the part from Sleep. See Section 11.7.1 “Wake-up from Sleep”.
(615 only)
(615 only)
(615 only)
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 105
PIC12F609/615/12HV609/615
FIGURE 11-8: INT PIN INTERRUPT TIMING
TABLE 11-7: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000
IOC IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 --00 0000
PIR1 —ADIF
(1) CCP1IF(1) CMIF —TMR2IF
(1) TMR1IF -00- 0-00 -000 0-00
PIE1 —ADIE
(1) CCP1IE(1) CMIE —TMR2IE
(1) TMR1IE -00- 0-00 -000 0-00
Legend: x = unknown, u = unchanged, – = unimplemented read as ‘0’, q = value depends upon condition.
Shaded cells are not used by the interrupt module.
Note 1: PIC12F615/HV615 only.
Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4
OSC1
CLKOUT
INT p i n
INTF flag
(INTCON reg.)
GIE bit
(INTCON reg.)
INSTRUCTION FLOW
PC
Instruction
Fetched
Instruction
Executed
Interrupt Latency
PC PC + 1 PC + 1 0004h 0005h
Inst (0004h) Inst (0005h)
Dummy Cycle
Inst (PC) Inst (PC + 1)
Inst (PC – 1) Inst (0004h)
Dummy Cycle
Inst (PC)
Note 1: INTF flag is sampled here (every Q1).
2: Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where T CY = instruction cycle time. Latency
is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT is available only in INTOSC and RC Oscillator modes.
4: For minimum width of INT pulse, refer to AC specifications in Section 15.0 “Electrical Specifications”.
5: INTF is enabled to be set any time during the Q4-Q1 cycles.
(1) (2)
(3) (4)
(5)
(1)
PIC12F609/615/12HV609/615
DS41302A-page 106 Preliminary © 2006 Microchip Technology Inc.
11.5 Context Saving During Inte rrupts
During an interrupt, only the return PC value is saved
on the stack. Typically, users may wish to save key
registers during an interrupt (e.g., W and STATUS
registers). This must be implemented in software.
Temporary holding registers W_TEMP and
STATUS_TEMP should be placed in the last 16 bytes
of GPR (see Figure 2-2). These 16 locations are
common to all banks and do not require banking. This
makes context save and restore operations simpler.
The code shown in Example 11-1 can be used to:
Store the W register
Store the STATUS register
Execute the ISR code
Restore the Status (and Bank Select Bit register)
Restore the W register
EXAMPLE 11-1: SAVING STATUS AND W REGISTERS IN RAM
11.6 Watchdog Timer (WDT)
The Watchdog Timer is a free running, on-chip RC
oscillator , which requires no external components. This
RC oscillator is separate from the external RC oscillator
of the CLKIN pin and INTOSC. That means that the
WDT wi ll run, even if th e clock on th e OSC1 and OSC 2
pins of the device has been stopped (for example, by
execut ion of a SLEEP instruc t io n). Du ring normal oper-
ation, a WDT time out generates a device Reset. If the
device is in Sleep mode, a WDT time out causes the
device to wake-up and continue with normal operation.
The WDT can be permanently disabled by program-
ming the Configuration bit, WDTE, as clear
(Section 11.1 “Configuration Bits”).
11.6.1 WDT PERIOD
The WDT ha s a nomin al time -out perio d of 18 ms (wi th
no prescaler). The time-out periods vary with
temperature, VDD and process variations from part to
part (see DC specs). If longer time-out periods are
desired, a prescaler with a division ratio of up to 1:128
can be as si gne d to the WDT under software c ontr ol by
writing to the OPTIO N register. Thus, time-out periods
up to 2.3 seconds can be realized.
The CLRWDT and SLEEP instructions clear the WDT
and the presc al er, if assigned to the WDT, and preve nt
it from timing out and generating a device Reset.
The TO bit in the STATUS registe r will be cle ared upo n
a Watchdog Timer time out.
Note: The PIC12F609/615/12HV609/615 does
not require saving the PCLATH. However,
if computed GOTOs are used in both the
ISR an d the main code , the PCLATH must
be saved and restored in the ISR .
MOVWF W_TEMP ;Copy W to TEMP register
SWAPF STATUS,W ;Swap status to be saved into W
;Swaps are used because they do not affect the status bits
MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register
:
:(ISR) ;Insert user code here
:
SWAPF STATUS_TEMP,W ;Swap STATUS_TEMP register into W
;(sets bank to original state)
MOVWF STATUS ;Move W into STATUS register
SWAPF W_TEMP,F ;Swap W_TEMP
SWAPF W_TEMP,W ;Swap W_TEMP into W
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 107
PIC12F609/615/12HV609/615
11.6 .2 WDT PROG RA MMI NG
CONSIDERATIONS
It should also be taken in account that under worst-
case conditions (i.e., VDD = Min., Temperature = Max.,
Max. WDT prescaler) it may take several seconds
before a WDT time out occurs.
FIGURE 11 -2: WATCHDOG TIMER BLOCK DIAGRAM
TABLE 11-9: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER
TABLE 11-8: WDT STATUS
Conditions WDT
WDTE = 0
Cleared
CLRWDT Command
Oscillator Fail Detected
Exit Sleep + System Clock = T1OSC, EXTRC, INTRC, EXTCLK
Exit Sleep + System Clock = XT, HS, LP Cleared until the end of OST
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
CONFIG IOSCFS CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0
Legend: Shaded cells are not used by the Watchdog Timer.
Note 1: See Register 11-1 for operation of all Configuration Wo r d register bits.
T0CKI
T0SE
pin
CLKOUT
TMR0
Watchdog
Timer
WDT
Time-Out
PS<2:0>
WDTE
Data Bus
Set Flag bit T0IF
on Overflow
T0CS
Note 1: T0SE , T0CS, PSA , PS<2:0> are bits in the OPTION register.
0
1
0
1
0
1
SYNC 2
Cycles
8
8
8-bit
Prescaler
0
1
(= FOSC/4)
PSA
PSA
PSA
3
PIC12F609/615/12HV609/615
DS41302A-page 108 Preliminary © 2006 Microchip Technology Inc.
11.7 Power-Down Mode (Sleep)
The Power-Down mode is entered by executing a
SLEEP instruction.
If the Watchdog Timer is enabled:
WDT will be cleared but keeps running.
•PD
bit in the STATUS register is cleared.
•TO
bit is set.
Oscillator driver is turned off.
I/O ports maintain the status they had before SLEEP
was executed (driving high, low or high-impedance).
For lowest current consumption in this mode, all I/O pins
should be either at V DD or VSS, with no external circuitry
drawing current from the I/O pin and the comparators
and CVREF should be disabled. I/O pins that are high-
impedance inputs should be pu lled high or low externally
to avoid switching currents caused by floating inputs.
The T0CKI input should also be at VDD or VSS for lowest
current cons umption. The contribution from on-chip pull-
ups on GPIO should be c onside red .
The MCLR pin must be at a logic high level.
11.7.1 WAKE-UP FROM SLEEP
The devi ce can wake -up from Sleep through one of th e
following events:
1. External Reset input on MCLR pin.
2. Watchdog Timer wake-up (if WDT was
enabled).
3. Interrupt from GP2/INT pin, GPIO change or a
peripheral interrupt.
The firs t event wi ll cause a devic e Reset. The two latter
events are considered a continuation of program
execution. The TO and PD bits in the STATUS register
can be used to determine the cause of device Reset.
The PD bit , whi ch i s set on p ow er-u p, is cl ear ed wh en
Sleep is invoked. TO bit is cleared if WDT wake-up
occurred.
The follo wing periph eral interrupt s can wake the device
from Sleep:
1. Timer1 interrupt. Timer1 must be operating as
an asynchronous counter.
2. ECCP Capture mode interrupt.
3. A/D conversion (when A/D clock source is RC).
4. Comparator output changes state.
5. Interrupt-on-change.
6. External Interrupt from INT pin.
Other peripherals cannot generate interrupts since
during Sleep, no on-chip clocks are present.
When the SLEEP instruction is being e xecuted, the next
instruction (PC + 1) is prefetched. For the device to
wake-up thro ugh an interrupt eve nt, the co rres pon din g
interrupt enable bit must be set (enabled). Wake-up is
regardless of the state of the GIE bit. If the GIE bit is
clear (disabled), the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
set (enabled), the device executes the instruction after
the SLEEP instruction, then branches to the interrupt
address (0004h). In cases where the execution of the
instruction following SLEEP is not desirable, the user
should hav e a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
11.7.2 WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and inte rrupt fla g bit s et, one of the fo llow ing wil l occur:
If the interrupt occurs before the execution of a
SLEEP instruction, the SLEEP instruction will
comple te as a NOP. Therefo re, the WDT and WD T
prescaler and postscaler (if enabled) will not be
cleared, the TO bit will not be set and the PD bit
will not be cleared.
If the interrupt occurs during or after the
execution of a SLEEP ins truc tio n, the dev ic e will
Immediately wake-up from Sleep. The SLEEP
instruction is executed. Therefore, the WDT and
WDT prescal er and pos t s ca ler (if ena bled) will be
cleared, the TO bit will be set and the PD bit will
be cleared.
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes . To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
To ensu re that the WDT is cleared , a CLRWDT ins truction
should be executed before a SLEEP instruction. See
Figure 11-9 for more details.
Note: It should be noted that a Reset generated
by a WDT time-out does not drive MCLR
pin low.
Note: If the g lobal interrup ts a re disa bled (G IE is
cleared) and any interrupt source has both
it s interrupt enabl e bit and the corres pond-
ing interrupt flag bits set, the device will
immediately wake-up from Sleep.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 109
PIC12F609/615/12HV609/615
FIGURE 11-9: WAKE-UP FROM SLEEP THROUGH INTERRUPT
11.8 Code Protection
If the code protection bit(s) have not been
programmed, the on-chip program memory can be
read out using ICSP for ver ification pu rposes.
11.9 ID Locations
Four memory locations (2000h-2003h) are designated
as ID locations where the us er can store checksum or
other code identification numbers. These locations are
not accessible during normal execution but are
readable and writable during Program/Verify mode.
Only the Least Significant 7 bits of the ID locations are
used.
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
CLKOUT(4)
INT pin
INTF flag
(INTCON reg.)
GIE bit
(INTCON reg.)
Instruction Flow
PC
Instruction
Fetched
Instruction
Executed
PC PC + 1 PC + 2
Inst(PC) = Sleep
Inst(PC – 1)
Inst(PC + 1)
Sleep
Processor in
Sleep
Interrupt Latency(3)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h) Inst(0005h)
Inst(0004h)
Dummy Cycle
PC + 2 0004h 0005h
Dummy Cycle
TOST(2)
PC + 2
Note 1: XT, HS or LP Osc illa tor mode assume d.
2: TOST = 1024 TOSC (drawing not to scale). This delay does not apply to EC, INTOSC and RC Oscillator modes.
3: GIE = ‘1’ assumed. In this case after wake-up, the processor jumps to 0004h. If GIE = ‘0’, execution will continue in-line.
4: CLKOUT is not available in XT, HS, LP or EC Oscillator modes, but shown here for timing reference.
Note: The entire Flash program memory will be
erased when the code protection is turned
off. See the “PIC12F6XX/16F6XX Memory
Programming Specification” (DS41204)
for more information.
PIC12F609/615/12HV609/615
DS41302A-page 110 Preliminary © 2006 Microchip Technology Inc.
11.10 In-Circuit Serial Programming™
The PIC12F609/615/12HV609/615 microcontrollers
can be serially programmed while in the end
application circuit. This is simply done with five
connections for:
•clock
•data
power
ground
programming voltage
This allows customers to manufacture boards with
unprogrammed devices and then program the micro-
controller just before shipping the product. This also
allows the most recent firmware or a custom firmware
to be programmed.
The device is placed into a Program/Verify mode by
holding the GP0 and GP1 pins low, while raising the
MCLR (VPP) pin from VIL to VIHH. See the “PIC12F6XX/
16F6XX Memory Programming Specification”
(DS41204) for more information. GP0 becomes the
programming data and GP1 becomes the
programming clock. Both GP0 and GP1 are Schmitt
Trigger inputs in Program/Verify mode.
A typical In-Circuit Serial Programming connection is
shown in Figure 11-1 0.
FIGURE 11 -10: TYPICAL IN-CIRCUIT
SERIAL PROGRAMMING
CONNECTION
11.11 In-Ci rcuit Debugger
Since in-circuit debugging requires access to three pins,
MPLAB® ICD 2 development with an 14-pin device is
not practical. A special 28-pin PIC12F609/615/
12HV609/615 ICD device is used with MPLAB ICD 2 to
provide separ ate cloc k, data and MCLR pi ns an d fre es
all normally available pins to the user .
A special debugging adapter allows the ICD device to
be used in place of a PIC12F609/615/12HV609/615
device . The debugging a dapter is the onl y source of the
ICD devi ce.
When the ICD pin on the PIC12F609/615/12HV609/
615 ICD device is held low, the In-Circuit Debugger
functionality is enabled. This function allows simple
debugging functions when used with MPLAB ICD 2.
When the microcontroller has this feature enabled,
some of the resources are not available for general
use . Ta ble 11- 10 sh ows wh ich fe ature s are c onsum ed
by the background debugger.
TABLE 11-10: DEBUGGER RESOURCES
For more information, see “MPLAB® ICD 2 In-Circuit
Debugger User’s Guide” (DS51331), available on
Micro c hip’s we b site (www.microchip.com).
Note: To erase the device VDD must be above
the Bulk Erase VDD minimum given in the
PIC12F609/615/12HV609/615 Memory
Programming Specification” (DS412 84)
External
Connector
Signals
To Normal
Connections
To Normal
Connections
PIC12F615/12HV615
VDD
VSS
MCLR/VPP/GP3
GP1
GP0
+5V
0V
VPP
CLK
Data I/O
* * *
*
* Isolation devices (as required)
PIC12F609/12HV609
Resource Description
I/O pins ICDCLK, ICDDATA
Stack 1 level
Program Memory Address 0h must be NOP
700h-7FFh
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 111
PIC12F609/615/12HV609/615
12.0 VOLTAGE REGULATOR
The PIC12HV609/HV615 includes a permanent
internal 5 volt (nominal) shunt regulator in parallel with
the VDD pin. This eliminates the need for an external
voltage regulator in systems sourced by an
unregulated supply. All external devices connected
directly to the VDD pin will share the regulated supply
voltage and contribute to the total VDD supply current
(ILOAD).
12.1 Regulator Operation
A shunt regulator generates a specific supply voltage
by creati ng a volt age drop ac ross a p ass resistor R SER.
The voltage at the VDD pin of the microcontroller is
monitored and compared to an internal voltage refer-
ence. The current through the resistor is then adjusted,
based on the result of the comparison, to produce a
volt age drop equal to the difference between the supply
voltage VUNREG and the VDD of the microcontroller.
See Figure 12-1 for voltage regulator schematic.
FIGURE 12-1: VOLTAGE REGULATOR
An external current limiting resistor, RSER, located
betwee n the u nreg ula ted s upp ly, VUNREG, and the VDD
pin, drops the difference in voltage between VUNREG
and VDD. RSER must be between RMAX and RMIN as
defined by Equatio n 12-1.
EQUATION 12-1: RSER LIMITING RESISTOR
12.2 Regulator Considerations
The supply voltage VUNREG and load current are not
constant. Therefore, the current range of the regulator
is limited. Selecting a value for RSER must take these
three factors into consideration.
Since the regulator uses the band gap voltage as the
regulated voltage reference, this voltage reference is
permanently enabled in the PIC12HV609/HV615
device.
The shunt regulator will still consume current when
below operating voltage range for the shunt regulator.
12.3 Design Considerations
For more information on using the shunt regulator and
managing current load, see Application Note AN1035,
Designing with HV Microcontrollers” (DS01035).
Feedback
VDD
VSS
CBYPASS
RSER
VUNREG
ISUPPLY
ISHUNT
ILOAD
Device
RMAX = (VUMIN - 5V)
1.05 • (4 MA + ILOAD)
RMIN = (VUMAX - 5V)
0.95 • (50 MA)
Where:
RMAX = maximum value of RSER (ohms)
RMIN = minimum value of RSER (ohms)
VUMIN = minimum value of VUNREG
VUMAX= maximum value of VUNREG
VDD = regulated voltage (5V nominal)
ILOAD = maximum expected load current in mA
including I/O pin currents and externa
l
circuits connected to VDD.
1.05 = compen satio n for +5% to leranc e of RSER
0.95 = compensation for -5% tolerance of RSER
PIC12F609/615/12HV609/615
DS41302A-page 112 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 113
PIC12F609/615/12HV609/615
13.0 INSTRUCTION SET SUMMARY
The PIC12F609/615/12HV609/615 instruction set is
highly orthogo nal and is co mpris ed of three b asic ca te-
gories:
Byte-oriented operations
Bit-oriented operations
Literal and cont rol operations
Each PIC16 instruction is a 14-bit word divided into an
opcode, which specifies the instru ction type and one or
more operands, which further specify the operation of
the instruction. The formats for each of the categories
is presented in Figure 13-1, while the various opcode
fields are sum m ariz ed in Table 13-1.
Table 13-2 lists the instructions recognized by the
MPASMTM assembler.
For byte-oriented instructions, ‘f’ represents a file
register designator and ‘d’ represents a destination
designator. The file register designator specifies which
file register is to be used by the instruction.
The desti nation designator specifies where the resul t of
the operation is to be placed. If ‘d’ is zero, the result is
placed in the W regis ter . If ‘d’ is one, the res ult is place d
in the file register specified in the instruction.
For bit-oriented instructions, ‘b’ represents a bit field
designator, which selects the bit affected by the
operation, while ‘f’ represents the address of the file in
which the bit is located.
For literal and control operations, ‘k’ represents an
8-bit or 11-bit constant, or literal value.
One instr uction cycle co nsists of four os cillator periods ;
for an oscillator frequency o f 4 MHz, t his gives a normal
instruction execution time of 1 μs. All instructions are
executed within a single instruction cycle, unless a
conditional test is true, or the program counter is
change d as a result of an instruction. When this occurs,
the execution takes two instruction cycles, with the
second cycle executed as a NOP.
All instruction examples use the format0xhh’ to
represent a hexadecimal number, where ‘h’ signifies a
hexadecimal digit.
13.1 Read-Modify-Write Operations
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (RMW)
operation. The register is read, the data is modified,
and the result is stored according to either the instruc-
tion or the destination designator ‘d’. A read operation
is performed on a register even if the instruction writes
to that register.
For example, a CLRF GPIO i nst ruc tio n w i ll rea d G PIO ,
clear all the data bits, then write the result back to
GPIO. This example would have the unintended co nse-
quence of clearing the condition that set the GPIF flag.
TABLE 13-1: OPCODE FIELD
DESCRIPTIONS
FIGURE 13-1: GE NERAL FORMAT FOR
INSTRUCTIONS
Field Description
fRegister file address (0x00 to 0x7F)
WWorking register (accumulator)
bBit address within an 8-bit file register
kLiteral field, constant data or label
xDon’t care location (= 0 or 1).
The assembler will generate code with x = 0.
It is the recommended form of use for
compatibility with all Microchip software tools.
dDestination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1.
PC Program Counter
TO Time-out bit
CCarry bit
DC Digit carry bit
ZZero bit
PD Power-down bit
Byte-oriented file register operations
13 8 7 6 0
d = 0 for destination W
OPCODE d f (FILE #)
d = 1 for destination f
f = 7-bit file register address
Bit-oriented file register operati ons
13 10 9 7 6 0
OPCODE b (BIT #) f (FILE #)
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
13 8 7 0
OPCODE k (litera l )
k = 8-bit immediate value
13 11 10 0
OPCODE k (literal)
k = 11-bit immediate value
General
CALL and GOTO instructions only
PIC12F609/615/12HV609/615
DS41302A-page 114 Preliminary © 2006 Microchip Technology Inc.
TABLE 13-2: PIC12F609/615/12HV609/615 INSTRUCTION SET
Mnemonic,
Operands Description Cycles 14-B it Opcod e Status
Affected Notes
MSb LSb
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ANDWF
CLRF
CLRW
COMF
DECF
DECFSZ
INCF
INCFSZ
IORWF
MOVF
MOVWF
NOP
RLF
RRF
SUBWF
SWAPF
XORWF
f, d
f, d
f
f, d
f, d
f, d
f, d
f, d
f, d
f, d
f
f, d
f, d
f, d
f, d
f, d
Add W and f
AND W with f
Clear f
Clear W
Complement f
Decrement f
Decrement f, Skip if 0
Increment f
Increment f, Skip if 0
Inclusive OR W with f
Move f
Move W to f
No Operation
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1(2)
1
1(2)
1
1
1
1
1
1
1
1
1
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
0111
0101
0001
0001
1001
0011
1011
1010
1111
0100
1000
0000
0000
1101
1100
0010
1110
0110
dfff
dfff
lfff
0xxx
dfff
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0xx0
dfff
dfff
dfff
dfff
dfff
ffff
ffff
ffff
xxxx
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
0000
ffff
ffff
ffff
ffff
ffff
C, DC, Z
Z
Z
Z
Z
Z
Z
Z
Z
C
C
C, DC, Z
Z
1, 2
1, 2
2
1, 2
1, 2
1, 2, 3
1, 2
1, 2, 3
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
BTFSC
BTFSS
f, b
f, b
f, b
f, b
Bit Clear f
Bit Set f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1
1
1 (2)
1 (2)
01
01
01
01
00bb
01bb
10bb
11bb
bfff
bfff
bfff
bfff
ffff
ffff
ffff
ffff
1, 2
1, 2
3
3
LITERAL AND CONTROL OPERATIONS
ADDLW
ANDLW
CALL
CLRWDT
GOTO
IORLW
MOVLW
RETFIE
RETLW
RETURN
SLEEP
SUBLW
XORLW
k
k
k
k
k
k
k
k
k
Add literal and W
AND literal with W
Call Subroutine
Clear Watchdog Timer
Go to address
Inclusive OR literal with W
Move litera l to W
Return from interrupt
Return with literal in W
Return from Subroutine
Go into Standby mode
Subtract W from literal
Exclusive OR literal with W
1
1
2
1
2
1
1
2
2
2
1
1
1
11
11
10
00
10
11
11
00
11
00
00
11
11
111x
1001
0kkk
0000
1kkk
1000
00xx
0000
01xx
0000
0000
110x
1010
kkkk
kkkk
kkkk
0110
kkkk
kkkk
kkkk
0000
kkkk
0000
0110
kkkk
kkkk
kkkk
kkkk
kkkk
0100
kkkk
kkkk
kkkk
1001
kkkk
1000
0011
kkkk
kkkk
C, DC, Z
Z
TO, PD
Z
TO, PD
C, DC, Z
Z
Note 1: When an I/O register is modified as a function of itself (e.g., MOVF GPIO, 1), the value used will be that value present
on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external
device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if
assigned to the Timer0 module.
3: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second
cycle is executed as a NOP.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 115
PIC12F609/615/12HV609/615
13.2 Instruction Descriptions
ADDLW Add literal and W
Syntax: [ label ] ADDLW k
Operands: 0 k 255
Operation: (W) + k (W)
Status Affected: C, DC, Z
Description: The contents of the W register
are added to the eight-bit literal ‘k’
and the result is placed in the
W register.
ADDWF Add W and f
Syntax: [ label ] ADDWF f,d
Operands: 0 f 127
d ∈ [0,1]
Operation: (W) + (f) (destination)
Status Affected: C, DC, Z
Desc ription: Add the conten ts of the W regis ter
with register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W registe r . I f
‘d’ is ‘1’, the result is stored back
in register ‘f’.
ANDLW AND literal with W
Syntax: [ label ] ANDLW k
Operands: 0 k 255
Operation: (W) .AND. (k) (W)
Status Affected: Z
Description: The contents of W register are
AND’ed with the eight-bit literal
‘k’. The result is placed in the W
register.
ANDWF AND W with f
Syntax: [ label ] ANDWF f,d
Operands: 0 f 127
d ∈ [0,1]
Operation: (W) .AND. (f) (desti nation)
Status Affected: Z
Description: AND the W register with register
‘f’. If ‘d’ is ‘0’, the resu lt is stored in
the W register. If ‘d’ is 1’, the
result is sto r ed bac k in regi ste r ‘f’.
BCF Bit Clear f
Syntax: [ label ] BCF f,b
Operands: 0 f 127
0 b 7
Operation: 0 (f<b>)
Status Af fe cte d: None
Description: Bit ‘b’ in register ‘f’ is cleared.
BSF Bit Set f
Syntax: [ label ] BSF f,b
Operands: 0 f 127
0 b 7
Operation: 1 (f<b>)
Status Af fe cte d: None
Description: Bit ‘b’ in register ‘f’ is set.
BTFSC Bit Test f, Skip if Clear
Syntax: [ label ] BTFSC f,b
Operands: 0 f 127
0 b 7
Operation: skip if (f<b>) = 0
Status Af fe cte d: None
Descr iption: If bit ‘b’ in regis ter ‘f’ is ‘1’, the next
instruction is executed.
If bit ‘b’ in reg ister ‘f’ is ‘0’, t he ne xt
instruction is discarded, and a NOP
is exec uted ins tea d, m ak ing thi s a
two-cycle instruction.
PIC12F609/615/12HV609/615
DS41302A-page 116 Preliminary © 2006 Microchip Technology Inc.
BTFSS Bit Te st f, Skip if Set
Syntax: [ label ] BTFSS f,b
Operands: 0 f 127
0 b < 7
Operation: skip if (f<b>) = 1
Status Affected: None
Desc ription: If bi t ‘b’ in regi ster ‘f’ is ‘0’, the ne xt
instructi on is exec uted .
If bit ‘b’ is ‘1’, then the next
instructi on is discarded an d a NOP
is exec ute d i nst ead, making this a
two -cycle instruction.
CALL C all Subroutine
Syntax: [ label ] CALL k
Operands: 0 k 204 7
Operation: (PC)+ 1 TOS,
k PC<10:0>,
(PCLATH<4:3>) PC<12:11>
Status Affected: None
Description: Call Subroutine. First, return
address (PC + 1) is pushed onto
the stack. The eleven-bit
immediate address is loaded into
PC bits <10:0>. The upper bits of
the PC are loa ded from PC LATH.
CALL is a two-cycle instruction.
CLRF Clear f
Syntax: [ label ] CLRF f
Operands: 0 f 127
Operation: 00h (f)
1 Z
Status Affected: Z
Desc ript ion : The cont en t s of regi ste r ‘f’ are
cleared and the Z bit is set.
CLRW Clear W
Syntax: [ label ] CLRW
Operands: None
Operation: 00h (W)
1 Z
Status Affected: Z
Description: W register is cleared. Zero bit (Z)
is set.
CLRWDT Clear Watchdog Timer
Syntax: [ label ] CLRWDT
Operands: None
Operation: 00h WDT
0 WDT prescaler,
1 TO
1 PD
Status Af fe cte d: TO, PD
Description: CLRWDT instruction resets the
W atchdog T imer . It also resets the
prescaler of the WDT.
Status bits TO and PD are set.
COMF Complement f
Syntax: [ label ] COMF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination)
Status Af fe cte d: Z
Description: The contents of register ‘f’ are
complemented. If ‘d’ is 0’, the
result is stored in W. If ‘d’ is ‘1’,
the result is stored back in
register ‘f’.
DECF Decrement f
Syntax: [ label ] DECF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination)
Status Af fe cte d: Z
Description: Decrement register ‘f’. If ‘d’ is ‘0’,
the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 117
PIC12F609/615/12HV609/615
DECFSZ Decrement f, Skip if 0
Syntax: [ label ] DECFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination);
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are
decrem ented. If ‘d’ is ‘0’, th e result
is placed in the W register. If ‘d’ is
1’, the result is placed back in
register ‘f’.
If the result is ‘1’, the next
instruction is executed. If the
resu lt is ‘0’, then a NOP is
executed instead, making it a
two-cycle instruction.
GOTO Unconditional Branch
Syntax: [ label ] GOTO k
Operands: 0 k 2047
Operation: k PC<10:0>
PCLATH<4:3> PC<12:11>
Status Affected: None
Description: GOTO is an unconditional branch.
The e le ven -bi t im me dia t e v al ue i s
loaded into PC bits <10:0>. The
upper bits of PC are loaded from
PCLATH<4:3>. GOTO is a
two-cycle instruction.
INCF Increment f
Syntax: [ label ] INCF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination)
Status Affected: Z
Description: The contents of register ‘f’ are
incremen ted. If ‘d’ is 0’, th e res ult
is placed in the W registe r. If ‘d’ is
1’, the result is placed back in
register ‘f’.
INCFSZ Increment f, Skip if 0
Syntax: [ label ] INCFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination),
skip if result = 0
Status Af fe cte d: None
Description: The contents of register ‘f’ are
incremented. If ‘d’ is ‘0’, the result
is placed in the W register. If ‘d’ is
1’, the result is placed back in
register ‘f’.
If the result is ‘1’, the next
instruction is executed. If the
result is0’, a NOP is executed
instead, making it a two-cycle
instruction.
IORLW Inclusive OR literal with W
Syntax: [ label ] IORLW k
Operands: 0 k 255
Operation: (W) .OR. k (W)
Status Af fe cte d: Z
Descr iption: The content s of the W register are
OR’ed with the eight-bit literal ‘k’.
The result is placed in the
W registe r.
IORWF Inclusive OR W with f
Syntax: [ label ] IORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .OR. (f) (destin ation)
Status Af fe cte d: Z
Description: Inclusive OR the W register with
register ‘f’. If ‘d’ is ‘0’, the result is
placed in the W register. If ‘d’ is
1’, the result is pla ce d back in
register ‘f’.
PIC12F609/615/12HV609/615
DS41302A-page 118 Preliminary © 2006 Microchip Technology Inc.
MOVF Move f
Syntax: [ label ] MOVF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (dest)
Status Affected: Z
Desc ript ion : The con ten t s of regi ste r ‘f’ is
moved to a dest ination dependent
upon the status of ‘d’. If d = 0,
destination is W register. If d = 1,
the destination is file register ‘f’
itsel f. d = 1 is useful to test a file
register since Status flag Z is
affected.
Words: 1
Cycles: 1
Example: MOVF FSR, 0
After Instruction
W= value in FSR
register
Z= 1
MOVLW Move literal to W
Syntax: [ label ] MOVLW k
Operands: 0 k 255
Operation: k (W)
Status Affected: None
Desc ription: The eig ht-bit literal ‘k’ i s loaded i nto
W register. The “don’t cares” will
assemble as 0’s.
Words: 1
Cycles: 1
Example: MOVLW 0x5A
After Instruction
W= 0x5A
MOVWF Move W to f
Syntax: [ label ] MOVWF f
Operands: 0 f 127
Operation: (W) (f)
Status Af fe cte d: None
Description: Move data from W register to
register ‘f’.
Words: 1
Cycles: 1
Example: MOVW
F
OPTION
Before Instruction
OPTION= 0xFF
W = 0x4F
After Instruction
OPTION= 0x4F
W = 0x4F
NOP No Operation
Syntax: [ label ] NOP
Operands: None
Operation: No operation
Status Af fe cte d: None
Description: No operation.
Words: 1
Cycles: 1
Example: NOP
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 119
PIC12F609/615/12HV609/615
RETFIE Return from Interrupt
Syntax: [ label ] RETFIE
Operands: None
Operation: TOS PC,
1 GIE
Status Affected: None
Description: Return from Interrupt. Stack is
POPed an d Top-of-S t ack (TOS) is
loaded in the PC. Interrupts are
enabled by setting Global
Interrupt Enable bit, GIE
(INTCON<7>). This is a two-cycle
instruction.
Words: 1
Cycles: 2
Example: RETFIE
After Interrupt
PC = TOS
GIE = 1
RETLW Return with literal in W
Syntax: [ label ] RETLW k
Operands: 0 k 255
Operation: k (W);
TOS PC
Status Af fe cte d: None
Description: The W register is loaded with the
eight-bit literal ‘k’. The program
counter is loaded from the top of
the stack (the return address).
This is a two-cycle instruction.
Words: 1
Cycles: 2
Example:
TABLE
DONE
CALL TABLE;W contains
;table offset
;value
GOTO DONE
ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
RETLW kn ;End of table
Before Instruction
W = 0x07
After Instruction
W = value of k8
RETURN Return from Subroutine
Syntax: [ label ] RETURN
Operands: None
Operation: TOS PC
Status Af fe cte d: None
Description: Return from subroutine. The stack
is POPed an d the top of th e s t a ck
(TOS) is loaded into the program
counter. This is a two-cycle
instruction.
PIC12F609/615/12HV609/615
DS41302A-page 120 Preliminary © 2006 Microchip Technology Inc.
RLF Rotate Left f through Carry
Syntax: [ label ] RLF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are
rotated one bit to the left through
the Carry flag. If ‘d’ is ‘0’, the
result is placed in the W register.
If ‘d’ is1’, the result is stored
back in register ‘f’.
Words: 1
Cycles: 1
Example: RLF REG1,0
Before Instruction
REG1 = 1110 0110
C=0
After Instruction
REG1 = 1110 0110
W = 1100 1100
C=1
RRF Rotate Right f through Carry
Syntax: [ label ] RRF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Desc ript ion : The content s of regis te r ‘f’ are
rotat ed one bit to the r ight throug h
the Carry flag. If ‘d’ is ‘0’, the
result is placed in the W register.
If ‘d’ is ‘1’, the resu lt is placed
back in register ‘f’.
Register fC
Register fC
SLEEP Enter Sleep mode
Syntax: [ label ] SLEEP
Operands: None
Operation: 00h WDT,
0 WDT prescaler,
1 TO,
0 PD
Status Af fe cte d: TO, PD
Descripti on: The power-down S tat us bit, PD is
cleared. Time-out Status bit, TO
is set. Watchdog Timer and its
prescaler are cleare d.
The processor is put into Sleep
mode with th e oscillator sto pped.
SUBLW Subtract W from literal
Syntax: [ label ] SUBLW k
Operands: 0 k 255
Operation: k - (W) → (W)
Status Affected: C, DC, Z
Description: The W register is subtracted (2’s
complement method) from the
eight-bit literal ‘k’. The result is
placed in the W register.
Result Condition
C = 0W > k
C = 1W k
DC = 0W<3:0> > k<3:0>
DC = 1W<3:0> k<3:0>
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 121
PIC12F609/615/12HV609/615
SUBWF Subtract W from f
Syntax: [ label ] SUBWF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - (W) → (destination)
Status Affected: C, DC, Z
Description: Subtract (2’s complement method)
W register from register ‘f’. If ‘d’ is
0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
SWAPF Swap Nibbles in f
Syntax: [ label ] SWAPF f,d
Operands: 0 f 127
d [0,1]
Operation: (f<3:0>) (destination<7:4>),
(f<7:4>) (destination<3:0>)
Status Affected: None
Description: The upper and lower nibbles of
register ‘f’ are exchanged. If ‘d’ is
0’, the result is placed in the W
register. If ‘d’ is 1’, the result is
placed in register ‘f’.
XORLW Exclusive OR literal with W
Syntax: [ label ] XORLW k
Operands: 0 k 255
Operation: (W) .XOR. k → (W)
Status Affected: Z
Description: The contents of the W register
are XOR’ed with the eight-b it
literal ‘k’. The result is placed in
the W register.
C = 0W > f
C = 1W f
DC = 0W<3:0> > f<3:0>
DC = 1W<3:0> f<3:0>
XORWF Exclusive OR W with f
Syntax: [ label ] XORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .XOR. (f) → (destination)
Status Af fe cte d: Z
Description: Exclusive OR the contents of the
W register with register ‘f’. If ‘d’ is
0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
PIC12F609/615/12HV609/615
DS41302A-page 122 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 123
PIC12F609/615/12HV609/615
14.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers are supported with a full
range of hardware and software development tools:
Integrated Development Environment
- MPLAB® IDE Software
Assemblers/Compilers/Linkers
- MPASMTM Assembler
- MPLAB C18 and MPLAB C30 C Compilers
-MPLINK
TM Object Linker/
MPLIBTM Object Librarian
- MPLAB ASM30 Assembler/Linker/Library
Simulators
- MPLAB SIM Software Simulator
•Emulators
- MPLAB ICE 2000 In-Circuit Emulator
- MPLAB ICE 4000 In-Circuit Emulator
In-Circuit Debugger
- MPLAB ICD 2
Device Progra mmers
- PICSTART® Plus Development Programmer
- MPLAB PM3 Device Programmer
- PICkit™ 2 Development Programmer
Low-Cost Demonstration and Development
Boards and Evaluation Kits
14.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16-bit micro-
controller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- Emulator (sold separatel y)
- In-Circuit D ebugger (sold separately)
A full-featured editor with color-coded context
A multiple project manager
Customizable data windows with direct edit of
contents
High-level source code debugging
Visual device initializer for easy register
initialization
Mouse over variable inspection
Drag and drop variables from source to watch
windows
Exten si ve on-l in e help
Integration of select third par ty to ols, su ch as
HI-TECH Software C Compilers and IAR
C Compilers
The MPLAB IDE allows you to:
Edit your source files (either assembly o r C)
One touch assemble (or compile) and download
to PIC MCU emulator and simulator tools
(automatically updates all project information)
Debug us ing :
- Source files (assembly or C)
- Mixed assembly and C
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
PIC12F609/615/12HV609/615
DS41302A-page 124 Preliminary © 2006 Microchip Technology Inc.
14.2 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assemb ler for all PIC MCUs.
The MPASM Assembler generates relocatable object
files fo r the MPLINK Ob ject Linker , Int el® standa rd HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
Integration into MPLAB IDE projects
User-defined macros to streamline
assembly co de
Conditional assembly for multi-purpose
sour ce fil es
Directives that allow complete control over the
assembly process
14.3 MPLAB C18 and MPLAB C30
C Compilers
The MPLAB C18 and MPLAB C30 Code Development
Systems are complete ANSI C compilers for
Microchip’s PIC18 family of microcontrollers and the
dsPIC30, dsPIC33 and PIC24 family of digital signal
controllers. These compilers provide powerful integra-
tion capabilities, superior code optimization and ease
of use not found with other compilers.
For easy source level debugging, the compilers provide
symbol info rmation tha t is optimized to the MPLAB IDE
debugger.
14.4 MPLINK Object Linker/
MPLIB Object Librari an
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB O bject Li brarian manag es the cre ation an d
modification of library files of precompiled code. When
a routine from a library is called from a source file , only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
Efficient linking of single libraries instead of many
smaller files
Enhanced code maintainability by grouping
related modules together
Flexible creation of libraries with easy module
listing, replacement, deletion and extract ion
14.5 MPLAB ASM30 Assembler, Linker
and Librarian
MPLAB ASM30 Assembler produces relocatable
machine code from symbolic assembly language for
dsPIC30F devices. MPLAB C30 C Compiler uses the
assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with oth er relocatabl e object files and
arch ives to c rea te an e xecu tabl e fil e. N otabl e fe atu res
of the assembler include:
Support for the entire dsPIC30F instruction set
Support for fixed-point and floating-point data
Command line interface
Rich dire cti ve set
Flexible macro language
MPLAB IDE compatibility
14.6 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most periph erals and inte rnal regi sters.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C18 and
MPLAB C30 C Compilers, and the MPASM and
MPLAB ASM30 Assemblers. The software simulator
offers the flexibility to develop and debug code outside
of the hardware laboratory environment, making it an
excellent, economical software development tool.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 125
PIC12F609/615/12HV609/615
14.7 MPLAB ICE 2000
High-Performance
In-Circui t Emu lator
The MPLAB ICE 2000 In-Circuit Emulator is intended
to provide the product development engineer with a
complete microcontroller design tool set for PIC micro-
controllers. Software control of the MPLAB ICE 2000
In-Circuit Emulator is advanced by the MPLAB Inte-
grated Development Environment, which allows edit-
ing, building, downloading and source debugging from
a sin gle environment.
The MPLAB ICE 2000 is a full-featured emulator
system with enhanced trace, trigger and data monitor-
ing feat ures. Interc hangeabl e proces sor modul es allow
the system to be easily reconfigured for emulation of
different processors. The architecture of the MPLAB
ICE 2000 In-Circuit Emulator allows expansion to
support new PIC microcontrollers.
The MPLAB ICE 2000 In-Circuit Emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft® Windows® 32-bit operating system were
chosen to best make these features available in a
simple, unified application.
14.8 MPLAB ICE 4000
High-Performance
In-Circui t Emu lator
The MPLAB ICE 4000 In-Circuit Emu lator is intende d to
provide the product development engineer with a
complete microcontroller design tool set for high-end
PIC MCUs and dsPIC DSCs. Software control of the
MPLAB ICE 4000 In-Circuit Emulator is provided by the
MPLAB Integrated Development Environment, which
allows editing, building, downloading and source
debugging from a single environm ent.
The MPLAB ICE 4000 is a premium emulator system,
providing the features of MPLAB ICE 2000, but with
increased emulation memory and high-speed perfor-
mance for dsPIC30F and PIC18XXXX devices. Its
advanc ed emulator fe atures inc lude complex t riggering
and timing, and up to 2 Mb of emulation memory.
The MPLAB ICE 4000 In-Circuit Emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft Windows 32-bit operating system were
chosen to best make these features available in a
simple, unified application.
14.9 MPLAB ICD 2 In-Circuit Debugger
Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a
powerful, low-cost, run-time development tool,
connecting to the host PC via an RS-232 or high-speed
USB interface. This tool is based on the Flash PIC
MCUs and can be used to develop for these and other
PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes
the in-circuit debugging capability built into the Flash
devices. This feature, along with Microchip’s In-Circuit
Serial ProgrammingTM (ICSPTM) protocol, offers cost-
effective, in-circuit Flash debugging from the graphical
user interface of the MPLAB Integrated Development
Environment. This enables a designer to develop and
debug sou rce code by s etting bre akpoi nts , singl e step-
ping and watching variables, and CPU status and
peripheral registers. Running at full speed enables
testing hardware and applications in real time. MPLAB
ICD 2 also serves as a development programmer for
selected PIC devices.
14.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64 ) for men us an d error m essages and a m odu-
lar, detachable socket assembly to support various
pack age types. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Devic e Programmer ca n read, verif y and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 h as high-spe ed co mmunicat ions and
optimized algorithms for quick programming of large
memory devices and in corporates an SD/MMC card for
file storage and secure data applications.
PIC12F609/615/12HV609/615
DS41302A-page 126 Preliminary © 2006 Microchip Technology Inc.
14.11 PICSTART Plus Development
Programmer
The PICSTART Plus Development Programmer is an
easy-to-use, low-cost, prototype programmer. It
connects to the PC via a COM (RS-232) port. MPLAB
Inte grated Dev elopmen t En vironme nt so ftware makes
using the programmer simple and efficient. The
PICSTART Plus Development Programmer supports
most PIC devices in DIP packages up to 40 pins.
Larger pin count devices, such as the PIC16C92X and
PIC17C76 X, may be sup ported with an a dapter socket.
The PICSTART Plus Development Programmer is CE
compliant.
14.12 PICkit 2 Development Programmer
The PICkit™ 2 Development Programmer is a low-cost
programmer with an easy-to-use interface for pro-
gramming many of Microchip’s baseline, mid-range
and PIC1 8F families of Fl ash memory mic rocontrollers.
The PICkit 2 S tar ter Kit includes a pr ototypin g develop-
ment board, twelve sequential lessons, software and
HI-TECH’s PICC™ Lite C compiler, and is designed to
help get up to speed quickly using PIC® micro-
controllers. The kit provides everything needed to
program, evaluate and develop applications using
Microchip’s powerful, mid-range Flash memory family
of microcontrollers.
14.13 Demonstration, Development and
Evaluation Boards
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully func-
tional systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The board s support a varie ty of features, i ncluding LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory .
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demon-
stration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart® battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Check the Microchip web page (www.microchip.com)
and the latest “Product Selector Guide” (DS00148) for
the complete list of demonstration, development and
evaluation kits.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 127
PIC12F609/615/12HV609/615
15.0 ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings(†)
Ambient temperature under bias..........................................................................................................-40° to +125°C
Storage temperature........................................................................................................................ -65°C to +150°C
Volta ge on VDD with respect to VSS ................................................................................................... -0.3V to +6.5V
Volta ge on MCLR with respect to Vss ............................................................................................... -0.3V to +13.5V
Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V)
Total po wer dissipation(1) ...............................................................................................................................800 mW
Maximum curr ent out of VSS pin ...................................................................................................................... 95 mA
Maximum curr ent into VDD pin......................................................................................................................... 95 mA
Input clamp current, IIK (VI < 0 or VI > VDD)...............................................................................................................± 20 mA
Output clamp current , IOK (Vo < 0 or Vo >VDD).........................................................................................................± 20 mA
Maximum output current sunk by any I/O pin....................................................................................................25 mA
Maximum output current sourced by any I/O pin ..............................................................................................25 mA
Maximum current sunk by GPIO............................................................................................................. ..... .... 90 mA
Maximum current sourced GPIO............................................................................................................. ..... .... 90 mA
Note 1: Power d issip ati on is calc ulated as fo llows: PDIS = VDD x {IDD IOH} + {(VDD – VOH) x IOH} + (VOl x IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
PIC12F609/615/12HV609/615
DS41302A-page 128 Preliminary © 2006 Microchip Technology Inc.
FIGURE 15-1: PIC12F609/615 VOLTAGE-FREQUENCY GRAPH,
-40°C
TA
+125°C
FIGURE 15-2: PIC12HV609/615 VOLTAGE-FREQUENCY GRAPH,
-40°C
TA
+125°C
2.0
3.5
2.5
0
3.0
4.0
4.5
5.0
Frequency (MHz)
VDD (V)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
82010
5.5
2.0
3.5
2.5
0
3.0
4.0
4.5
5.0
Frequency (MHz)
VDD (V)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
82010
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 129
PIC12F609/615/12HV609/615
15.1 DC Characteristics: PIC12F609/615/12HV609/615-I (Industrial)
PIC12F609/615/12HV609/615-E (Extended)
DC CHARACTERISTICS Standard Operating Conditions (unle ss otherw is e stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym Characteristic Min Typ† Max Units Conditions
VDD Supply Voltage 2.0 5.5 V FOSC < = 8 MHz: INTOSC, EC
D001 PIC12F609/615 2.0 5.5 V FOSC < = 4 MHz
D001 PIC12HV609/615 2.0 (2) V FOSC < = 4 MHz
D001B PIC12F609/F615 2.0 5.5 V FOSC < = 8 MHz: INTOSC, EC
D001B PIC12HV609/615 2.0 (2) V FOSC < = 8 MHz: INTOSC, EC
D001C PIC12F609/615 3.0 5.5 V FOSC < = 10 MHz
D001C PIC12HV609/615 3.0 (2) V FOSC < = 10 MHz
D001D PIC12F609/615 4.5 5.5 V FOSC < = 20 MHz
D001D PIC12HV609/615 4.5 (2) V FOSC < = 20 MHz
D002* VDR RAM Data Retention
Voltage(1) 1.5 V Device in Sleep mode
D003 VPOR VDD Start Voltage to
ensure internal Power-on
Reset signal
—V
SS —VSee Section 11.3.1 “Power-on Reset
(POR)” for details.
D004* SVDD VDD Rise Rate to ensure
internal Power-on Reset
signal
0.05 V/ms See Section 11.3.1 “Power- on Reset
(POR)” for details.
* These parameters are characterized but not tested.
Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
2: User defined. Voltage across the shunt should not exceet 5V.
PIC12F609/615/12HV609/615
DS41302A-page 130 Preliminary © 2006 Microchip Technology Inc.
15.2 DC Characteristics: PIC12F609/615/12 HV6 09/615-I (Industrial)
PIC12F609/615/12HV609/615-E (Extended)
DC CHARACTERISTICS Standard Operating Conditions (unless othe rwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Char ac teri st ics Min Typ† Max Unit s Conditions
VDD Note
D010 Supply Current (IDD)(1, 2) —1116μA2.0FOSC = 32 kHz
LP Oscillator mode
—1828μA3.0
—3554μA5.0
D011* 140 240 μA2.0F
OSC = 1 MHz
XT Oscillator mode
220 380 μA3.0
380 550 μA5.0
D012 260 360 μA2.0F
OSC = 4 MHz
XT Oscillator mode
420 650 μA3.0
0.8 1.1 mA 5.0
D013* 130 220 μA2.0F
OSC = 1 MHz
EC Osci ll ator mo de
215 360 μA3.0
360 520 μA5.0
D014 220 340 μA2.0F
OSC = 4 MHz
EC Osci ll ator mo de
375 550 μA3.0
0.65 1.0 mA 5.0
D016* 340 450 μA2.0F
OSC = 4 MHz
INTOSC mode
500 700 μA3.0
0.8 1.2 mA 5.0
D017 410 650 μA2.0F
OSC = 8 MHz
INTOSC mode
700 950 μA3.0
1.30 1.65 mA 5.0
D018 230 400 μA2.0F
OSC = 4 MHz
EXTRC mode(3)
400 680 μA3.0
0.63 1.1 mA 5.0
D019 2.6 3.25 mA 4.5 FOSC = 20 MHz
HS Osci llator mode
2.8 3.35 mA 5.0
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The test co nditio ns for all I DD measurement s in activ e operati on mode are: OSC1 = exte rnal squ are wave,
from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WD T disa bl ed.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading an d swit ching rate, oscillator type, internal cod e execution pattern and temp erat ure, also have
an impact on the current consumption.
3: For RC oscillator configurations, current through REXT is not inc luded. The c urrent through the resist or can
be extended by the formula IR = VDD/2REXT (mA) with REXT in kΩ.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 131
PIC12F609/615/12HV609/615
15.3 DC Characteristi cs: PIC12F615/HV615 - I (Industrial)
DC CHARACTERISTICS Standard Operating Conditions (unless othe rwise stated)
Operating temperature -40°C TA +85°C for industrial
Param
No. Device Char ac teri st ics Min Typ† Max Unit s Conditions
VDD Note
D020 Power-down Base
Current(IPD)(2) 0.05 1.2 μA 2.0 WDT, BOR, Comparators, VREF and
T1OSC disabled
0.15 1.5 μA3.0
PIC12F609/615 0.35 1.8 μA5.0
150 500 nA 3.0 -40°C TA +25°C
PIC12HV609/HV615 350 μA2.0
350 μA3.0
4 200 nA 5.0
D021 1.0 2.2 μA 2.0 WDT Current(1)
—2.04.0μA3.0
—3.07.0μA5.0
D022 42 60 μA 3.0 BOR Current(1)
—85122μA5.0
D023 32 45 μA 2.0 Comparator Current(1), both
comparators enabled
—6078μA3.0
120 160 μA5.0
D024 30 36 μA2.0CV
REF Current(1) (high range)
—4555μA3.0
—7595μA5.0
D025* 39 47 μA2.0CV
REF Current(1) (low range)
—5972μA3.0
—98124μA5.0
D026 4.5 7.0 μA 2.0 T1OSC Current(1), 32.768 kHz
—5.08.0μA3.0
—6.012 μA5.0
D027 0.30 1.6 μA 3.0 A/D Current(1), no conversion in
progress
0.36 1.9 μA5.0
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this
peripheral is enabled. The per i pheral Δ current can be determined by subtracting the base IDD or IPD
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.
PIC12F609/615/12HV609/615
DS41302A-page 132 Preliminary © 2006 Microchip Technology Inc.
15.4 DC Characteristics: PIC12F609/615/12HV609/615-E (Extended)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C for extended
Param
No. Device Characterist ics Min Typ† Max Units Conditions
VDD Note
D020E Power-down Base
Current (IPD)(2) —0.05 9 μA 2.0 WDT, BOR, Comparators, VREF and
T1OSC disabled
—0.1511 μA3.0
—0.3515 μA5.0
PIC12HV609/HV615 —350 μA2.0
—350 μA3.0
4 200 nA 5.0
D021E 1 17.5 μA 2.0 WDT Current(1)
—219μA3.0
—322μA5.0
D022E 42 65 μA 3.0 BOR Current(1)
—85127μA5.0
D023E 32 45 μA 2.0 Comparator Current(1), both
comparators enabled
—6078μA3.0
—120160μA5.0
D024E 30 70 μA2.0CV
REF Current(1) (high range)
—4590μA3.0
—75120μA5.0
D025E* 39 91 μA2.0CV
REF Current(1) (low range)
—59117μA3.0
—98156μA5.0
D026E 4.5 25 μA 2.0 T1OSC Current(1), 32.768 kHz
—530μA3.0
—640μA5.0
D027E 0.30 12 μA 3.0 A/D Current(1), no conversion in
progress
—0.3616 μA5.0
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this
peripheral is enabled. The per i pheral Δ current can be determined by subtracting the base IDD or IPD
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 133
PIC12F609/615/12HV609/615
15.5 DC Characteristics: PIC12F609/615/1 2HV6 09/615-I (Industrial)
PIC12F609/615/12HV609/615-E (Extended)
DC CHARACTERISTICS Stand ard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym Characteristic Min Typ† Max Units Conditions
VIL Input Low Voltage
I/O port:
D030 with TTL buffer Vss 0.8 V 4.5V VDD 5.5V
D030A Vss 0.15 VDD V2.0V VDD 4.5V
D031 with Schmitt Tr igger buffer Vss 0.2 VDD V2.0V VDD 5.5V
D032 MCLR, OSC1 (RC mode)(1) VSS —0.2 VDD V
D033 O SC1 (XT and LP modes) VSS —0.3V
D033A OSC1 (HS mode) VSS —0.3 VDD V
VIH Input High Voltage
I/O ports:
D040 with TTL buffer 2.0 VDD V4.5V VDD 5.5V
D040A 0.25 VDD + 0.8 VDD V2.0V VDD 4.5V
D041 with Schmitt Trigger buffer 0.8 VDD —VDD V2.0V VDD 5.5V
D042 MCLR 0.8 VDD —VDD V
D043 O SC1 (XT and LP modes) 1.6 VDD V
D043A OSC1 (HS mode) 0.7 VDD —VDD V
D043B OSC1 (RC mode) 0.9 VDD —VDD V(Note 1)
IIL Input Leakage Current(2)
D060 I /O ports ± 0.1 ± 1μAVSS VPIN VDD,
Pin at high-impedance
D061 MCLR(3) ± 0.1 ± 5μAVSS VPIN VDD
D063 OSC1 ± 0.1 ± 5μAVSS VPIN VDD, XT, HS and
LP oscillator configuration
D070* IPUR GPIO Weak Pull-up Current 50 250 400 μAVDD = 5.0V, VPIN = VSS
VOL Output Low Voltage(4)
D080 I /O ports 0.6 V IOL = 8.5 mA, VDD = 4.5V (Ind.)
VOH Output H igh Voltage (4)
D090 I /O ports VDD – 0.7 V IOH = -3.0 mA, VDD = 4.5V (Ind.)
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stat ed. These parameters are for design guidance only and are
no t te sted.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
4: Including OSC2 in CLKOUT mode.
PIC12F609/615/12HV609/615
DS41302A-page 134 Preliminary © 2006 Microchip Technology Inc.
D100
Capacitive Loading Specs on
Output Pins
D101* COSC2 OSC2 pin 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1
D101A* CIO All I/O pins 50 pF
Program Flash Memory
D130 EPCell Endurance 10K 100K E/W -40°C TA +85°C
D130A EDCell Endurance 1K 10K E/W +85°C TA +125°C
D131 VPR VDD for Read VMIN —5.5VVMIN = Minimum operating
voltage
D132 VPEW VDD for Erase/Write 4.5 5.5 V
D133 TPEW Erase/Write cycle time 2 2.5 ms
D134 TRETD Characteristic Retention 40 Y ear Provided no other specifications
are violated
15.5 DC Characteristics: PIC12F609/615/1 2HV6 09/615-I (Industrial)
PIC12F609/615/12HV609/615-E (Extended) (Cont inued)
DC CHARACTERISTICS Stand ard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym Characteristic Min Typ† Max Units Conditions
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stat ed. These parameters are for design guidance only and are
no t te sted.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
4: Including OSC2 in CLKOUT mode.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 135
PIC12F609/615/12HV609/615
15.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Ope rati ng temperature -40°C TA +125°C
Param
No. Sym Characteristic Typ Units Conditions
TH01 θJA Thermal Resistance
Junction to Ambient 84.6* C/W 8-pin PDIP pa ckage
163* C/W 8-pin SOIC package
124* C/W 8-pin TSSOP package
44* C/W 8-pin DFN 4x4mm package
TH02 θJC Thermal Resistance
Junction to Case 41.2* C/W 8-pin PDIP package
38.8* C/W 8-pin SOIC package
36.6* C/W 8-pin TSS OP package
3.0* C/W 8-pin DFN 3x3mm package
TH03 TDIE Die Temperature 150* C
TH04 PD Power Dissipation W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation W PINTERNAL = IDD x VDD
(NOTE 1)
TH06 PI/OI/O Power Dissipation W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))
TH07 PDER Derated Power W PDER = PDMAX (TDIE - TA)/θJA
(NOTE 2)
* These parameters are characterized but not tested.
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
PIC12F609/615/12HV609/615
DS41302A-page 136 Preliminary © 2006 Microchip Technology Inc.
15.7 Timing Parameter Symbology
The timing parameter symbols have been created with
one of the following formats:
FIGURE 15-3: LOA D CONDITIONS
1. TppS2ppS
2. TppS
TF Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O Port t1 T1CKI
mc MCLR wr WR
Uppe rcase lett ers an d their meanings:
SFFall PPeriod
HHigh RRise
I Invalid (High-impedance) V Valid
L Low Z High-impedance
V
SS
C
L
Legend: CL= 50 pF for all pins
15 pF for OSC2 output
Load Con dition
Pin
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 137
PIC12F609/615/12HV609/615
15.8 AC Characteristics: PIC12F609/615/12HV609/615 (Industrial, Extended)
FIGURE 15-4: CLOCK TIMING
TABLE 15-1: CLOCK OSCILLATOR TIMING REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
OS01 FOSC External CLKIN Frequency(1) DC 37 kHz LP Oscillator mode
DC 4 MHz XT Oscillator mode
DC 20 MHz HS Oscillator mode
DC 20 MHz EC Oscillator mode
Oscillator Frequency(1) 32.768 kHz LP Oscillator mode
0.1 4 MHz XT Oscillator mode
1 20 MH z HS Oscillator mode
DC 4 MHz RC Oscillator mode
OS02 TOSC External CLKIN Period(1) 27 ∞μs LP Oscillator mode
250 ns XT Oscillator mode
50 ns HS O s cillator mode
50 ns EC O s cillator mode
Oscillator Period(1) 30.5 μs LP Oscillator mode
250 10,000 ns XT Oscillator mode
50 1,000 ns HS Oscillator mode
250 ns RC Oscillator mode
OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC
OS04* TOSH,
TOSLExternal CLKIN High,
External CLKIN Low 2—μs LP oscillator
100 ns XT oscillator
20 ns HS oscillator
OS05* TOSR,
TOSFExternal CLKIN Rise,
External CLKIN Fall 0—ns LP oscillator
0—ns XT oscillator
0—ns HS oscillator
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing
code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher t han expected current
consumption. All devices are tested to operate at ‘min’ values with an external clock applied to OSC1 pin. When an
external clock input is used, the ‘max’ cycle time limit is ‘DC’ (no clock) for all devices.
OSC1/CLKIN
OSC2/CLKOUT
Q4 Q1 Q2 Q3 Q4 Q1
OS02
OS03OS04 OS04
OSC2/CLKOUT
(LP,XT,HS Modes)
(CLKOUT Mode)
PIC12F609/615/12HV609/615
DS41302A-page 138 Preliminary © 2006 Microchip Technology Inc.
TABLE 15-2: OSCILLATOR PARAMETERS
Standard Operati ng Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Freq.
Tolerance Min Typ† Max Units Conditions
OS06 TWARM Internal Oscillator Switch
when running(3) ——2TOSC Slowest clock
OS08 INTOSC Internal Calibrated
INTOSC Frequency(2) ±1% 7.92 8.0 8.08 MHz VDD = 3.5V, 25°C
±2% 7.84 8.0 8.16 MHz 2.5V VDD 5.5V,
0°C TA +8 5 °C
±5% 7.60 8.0 8.40 MHz 2.0V VDD 5.5V,
-40°C TA +85°C (Ind.),
-40°C TA +125°C (Ext.)
OS10* TIOSC ST INTOSC Oscillator Wake-
up from Sleep
Start-up Time
5.5 12 24 μsVDD = 2.0V, -40°C to +85°C
—3.5714μsV
DD = 3.0V, -40°C to +85°C
—3611μsV
DD = 5.0V, -40°C to +85°C
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing
code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected
current consumption. All devices are tested to operate at ‘min’ values with an external clock applied to the OSC1 pin.
When an external clock input is used, the ‘max’ cycle time limit is ‘DC’ (no clock) for all devices.
2: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1 μF and 0.01 μF values in parallel are recommended.
3: By design.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 139
PIC12F609/615/12HV609/615
FIGURE 15-5: CLKOUT AND I/O TIMING
FOSC
CLKOUT
I/O pi n
(Input)
I/O pin
(Output)
Q4 Q1 Q2 Q3
OS11
OS19
OS13
OS15
OS18, OS19
OS20
OS21
OS17 OS16
OS14
OS12
OS18
Old Value New Value
Write Fetch Read ExecuteCycle
TABLE 15-3: CLKOUT AND I/O TIMING PARAMETERS
Standard Operating Conditi ons (unle ss otherw is e stated )
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
OS11 TOSH2CKLFOSC to CLKOUT (1) 70 ns VDD = 5.0V
OS12 TOSH2CKHFOSC to CLKOUT (1) 72 ns VDD = 5.0V
OS13 TCKL2IOVCLKOUT to Port out valid(1) 20 ns
OS14 TIOV2CKH Port input valid before CLKOUT(1) TOSC + 200 ns ns
OS15 TOSH2IOVFOSC (Q1 cycle) to Port out valid 50 70* ns VDD = 5.0V
OS16 TOSH2IOIFOSC (Q2 cycle) to Port input invalid
(I/O in hold time) 50 ns VDD = 5.0V
OS17 TIOV2OSH Port input valid to FOSC(Q2 cycle)
(I/O in setup time) 20 ns
OS18 TIOR Port output rise time(2)
15
40 72
32 ns VDD = 2.0V
VDD = 5.0V
OS19 TIOF Port output fall time(2)
28
15 55
30 ns VDD = 2.0V
VDD = 5.0V
OS20* TINP INT pin input high or low time 25 ns
OS21* TRAP GPIO interrupt-on-change new input
level time TCY ——ns
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated.
Note 1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC.
2: Includes OSC2 in CLKOUT mode.
PIC12F609/615/12HV609/615
DS41302A-page 140 Preliminary © 2006 Microchip Technology Inc.
FIGURE 15-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND
POWER-UP TIMER TIMING
FIGURE 15-7: BROW N-OUT RESET TIMING AND CHARACTERISTICS
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Start-Up Time
Internal Reset(1)
Wat c hdog Timer
33
32
30
31
34
I/O pins
34
Note 1: Asserted low.
Reset(1)
VBOR
VDD
(Device in Brown-out Reset) (Device not in Brown-out Reset)
33*
37
* 64 ms delay only if PWRTE bit in the Configuration Word register is programmed to 0’.
Reset
(due to BOR)
VBOR + VHYST
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 141
PIC12F609/615/12HV609/615
TABLE 15-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET PARAMETERS
Standard Operating Conditi ons (unle ss otherw is e stated )
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
30 TMCLMCLR Pulse Width (low) 2
5
μs
μsVDD = 5V, -40°C to +85°C
VDD = 5V, -60°C to +125°C
31 TWDT Watchdog Timer Time-out
Period (No Prescaler) 10
10 20
20 45
50 ms
ms VDD = 5V, -40°C to +85°C
VDD = 5V, -40°C to +125°C
32 TOST Oscillation Start-up Timer
Period(1, 2) 1024 TOSC (NOTE 3)
33* TPWRT Power-up Timer Period 40 65 140 ms
34* TIOZ I/O High-impedance from
MCLR Low or Watchdog Timer
Reset
——2.0μs
35 VBOR Brown-out Reset Voltage 2.0 2.2 V (NOTE 4)
36* VHYST Brown-out Reset Hysteresis 50 mV
37* TBOR Brown-out Reset Minimum
Detection Period 100 μsVDD VBOR
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values
are based on charac teri za tion data for that p art ic ula r osci lla tor typ e unde r standard operating condi tions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator oper-
ation and/or higher than expected current consumption. All devices are tested to operate at ‘min’ values
with an external clock applied to the OSC1 pin. When an external clock input is used, the ‘max’ cycle time
limit is ‘DC’ (no clock) for all devices.
2: By design.
3: Period of the slow er clock.
4: To ens ure these vol tage to lerances, V DD a nd VSS must be c apa citively de coupl ed as clo se to the d evice as
possible. 0.1 μF and 0.01 μF values in parallel are recommended.
PIC12F609/615/12HV609/615
DS41302A-page 142 Preliminary © 2006 Microchip Technology Inc.
FIGURE 15-8: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 15-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
40* TT0H T0CKI High Pulse Width No Presca ler 0.5 TCY + 20 ns
With Prescaler 10 ns
41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 ns
With Prescaler 10 ns
42* TT0P T 0CK I Period Greater of:
20 or TCY + 40
N
ns N = prescale value
(2, 4, ..., 256)
45* TT1H T1CKI High
Time Synchronous, No Prescaler 0.5 TCY + 20 ns
Synchronous,
with Pres c aler 15 ns
Asynchronous 30 ns
46* TT1L T1CKI Low
Time Synchronous, No Prescaler 0.5 TCY + 20 ns
Synchronous,
with Pres c aler 15 ns
Asynchronous 30 ns
47* TT1P T1CKI Input
Period Synchronous Greater of:
30 or TCY + 40
N
ns N = prescale value
(1, 2, 4, 8)
Asynchronous 60 ns
48 FT1 Timer1 Oscillator Input Frequency Range
(oscillator enabled by setting bit T1OSCEN) 32.768 — kHz
49* TCKEZTMR1 Delay from External Clock Edge to Timer
Increment 2 TOSC —7 TOSC Timers in Sync
mode
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5V, 25°C unless otherwise stated. These p arameters are for design guidance only and are not
tested.
T0CKI
T1CKI
40 41
42
45 46
47 49
TMR0 or
TMR1
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 143
PIC12F609/615/12HV609/615
FIGURE 15-9: PIC12F615/HV 61 5 CAPTURE/COMP ARE/PWM T IMINGS (ECCP)
TABLE 15-6: PIC12F615/HV615 CAPTURE/COMPARE/PWM REQUIREMENTS (ECCP)
Standard Operating Conditi ons (unle ss otherw is e stated )
Operating Temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
CC01* TccL CCP1 Input Low Time No Prescaler 0.5TCY + 20 ns
With Prescaler 20 ns
CC02* TccH C CP1 Input High Time No Prescaler 0 .5TCY + 20 ns
With Prescaler 20 ns
CC03* TccP CCP1 Input Period 3TCY + 40
N ns N = prescale
value (1, 4 or
16)
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note: Refer to Figure 15-3 for load conditions.
(Capture mode)
CC01 CC02
CC03
CCP1
PIC12F609/615/12HV609/615
DS41302A-page 144 Preliminary © 2006 Microchip Technology Inc.
TABLE 15-7: COMPARATOR SPECIFICATIONS
TABLE 15-8: COMPARATOR VOLTAGE REFERENCE (CVREF) SPECIFICATIONS
TABLE 15-9: VOLTAGE REFERENCE SPECIFICATIONS
Standard Operating Conditions (unless otherwise stated)
Operati ng Tem per ature -40°C TA +125°C
Param
No. Sym Characteristics Min Typ† Max Units Comments
CM01 VOS Input Offset Voltage ± 5.0 ± 10 mV (VDD - 1.5)/2
CM02 VCM Input Co mmon Mode Voltage 0 VDD – 1.5 V
CM03* CMRR Common Mode Rejection Ratio +55 dB
CM04* TRT Response Time Falling 150 600 ns (NOTE 1)
Rising 200 1000 ns
CM05* TMC2COV Comparator Mode Change to Output Valid 10 μs
CM06* VHYS Input Hysteresis Voltage 45 mV
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Respons e tim e is meas ured wi th one comp arator input at (VDD - 1.5)/2 - 100 mV to (VDD -1.5)/2+20mV.
S tandard Operating Conditions (unless othe rwis e stated)
Operati ng tem pera ture -40°C TA +125°C
Param
No. Sym Characteristics Min Typ† Max Units Comments
CV01* CLSB Step Size(2)
VDD/24
VDD/32
V
VLow Range (VRR = 1)
High Range (VRR = 0)
CV02* CACC Absolute Accuracy
± 1/2
± 1/2 LSb
LSb Low Range (VRR = 1)
High Range (VRR = 0)
CV03* CRUnit Resistor Value (R) 2k Ω
CV04* CST Se ttli ng Time(1) ——10μs
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.
Note 1: Settling time measured while VRR = 1 and VR<3:0> transitions from0000’ to ‘1111’.
2: See Section 8.10 “Comparator Voltage Reference” for more information.
VR Voltage Reference Specifications Standard Operating Conditions (unless otherwise stated)
Operati ng tem pera ture -40°C TA +125°C
Param
No. Symbol Characteristics Min Typ Max Units Comments
VR01 VP6OUT VP6 voltage output 0.55 0.6 0.65 V
VR02 V1P2OUT V1P2 voltage output 1.200 V
VR03 TSTABLE Settling Time 10 μs
* These parameters are characterized but not tested.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 145
PIC12F609/615/12HV609/615
TABLE 15-10: SHUNT REGULATOR SPECIFICATIONS (PIC12HV609/615 only)
TABLE 15-11: PIC12F615/HV615 A/D CONVERTER (ADC) CHARACTERISTICS:
SHUNT REGULATOR CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temp erature -40° C TA +125°C
Param
No. Symbol Characteristics Min Typ Max Units Comments
SR01 VSHUNT Shunt Voltage 4.75 5 5.25 V
SR02 ISHUNT Shunt Current 4 50 mA
SR03* TSETTLE Settling Time 150 n s To 1% of final value
SR04 CLOAD Load Capacitance 0.01 10 μF Bypass capacitor on VDD
pin
SR05 ΔISNT Regulator operating current 180 μA Incl ud es band gap
reference current
Legend: TBD = To Be Determined
* These parameters are characterized but not tested.
Standard Operating Conditions (unless otherwise stated)
Ope rati ng temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
AD01 NRResolution 10 bits bit
AD02 EIL Integral Error ±1LSbVREF = 5.12V
AD03 EDL Differential Error ±1 L Sb No missing codes to 10 bits
VREF = 5.12V
AD04 EOFF Offset Error 1.5 LSb VREF = 5.12V
AD07 EGN Gain Error ±1LSbVREF = 5.12V
AD06
AD06A VREF Reference Voltage(3) 2.2
2.5 ——
VDD VAbsolute minimum to ensure 1 LSb
accuracy
AD07 VAIN Full-Scale Range VSS —VREF V
AD08 ZAIN Recommended
Impedance of Analog
Voltage Source
—— 10kΩ
AD09* IREF VREF Input Current(3) 10 1000 μADuring VAIN acquisition.
Based on different ial of VHOLD to VAIN.
—— 50μA During A/D conversion cycle.
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note 1: Total Absolute Error includes integral, differential, offset and gain errors.
2: The A/D conversion result never decreases with an increase in the input voltage and has no missing
codes.
3: ADC VREF is from external VREF or VDD pin, whichever is selected as reference input.
4: When ADC is off, it will not consume any current other than leakage current. The power-down current
specific ati on inc lu des any suc h leakage from the ADC module.
PIC12F609/615/12HV609/615
DS41302A-page 146 Preliminary © 2006 Microchip Technology Inc.
TABLE 15-12: PIC12F615/HV615 A/D CONVERSION REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Ope rati ng temperature -40°C TA +125°C
Param
No. Sym Characteristic Min Typ† Max Units Conditions
AD130* TAD A/D Clock Per iod 1.6 9.0 μsTOSC-based, VREF 3.0V
3.0 9.0 μsTOSC-based, VREF full range(3)
A/D Internal RC
Oscillator Period 3.0 6.0 9.0 μsADCS<1:0> = 11 (ADRC mode)
At V DD = 2.5V
1.6 4.0 6.0 μsAt VDD = 5.0V
AD131 TCNV Conversion Time
(not includin g
Acquisiti on Time)(1)
—11TAD Set GO/DONE bit to new data in A/D
Result register
AD132* TACQ Acquisiti on Time 11.5 μs
AD133* TAMP Amplifier Settling Time 5 μs
AD134 TGO Q4 to A/D Clock Start
TOSC/2
TOSC/2 + TCY
If the A/D clock source is selected as
RC, a time of TCY is added before the
A/D clock st art s. This allo ws the SLEEP
instruction to be executed.
* These parameters are characterized but not tested.
Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note 1: ADRESH and ADRESL registers may be read on the following TCY cycle.
2: See Section 9.3 “A/D Acquisition Requirements” for minimum conditions.
3: Full range for PIC12HV609/HV615 powered by the shunt regulator is the 5V regulated voltage.
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 147
PIC12F609/615/12HV609/615
FIGURE 15-10: PIC12F615/HV615 A/D CONVERSION TIMING (NORMAL MODE)
FIGURE 15-11: PIC12F61 5/HV 61 5 A/D CONVERSION TIMING (SLEEP MODE)
AD131
AD130
BSF ADCON0, GO
Q4
A/D CLK
A/D Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
987 3210
Note 1: If the A /D clock sourc e is select ed as RC, a time of TCY is added before the A/D clock starts. This allows the
SLEEP instruction to be executed.
1 TCY
6
AD134 (TOSC/2(1))
1 TCY
AD132
AD132
AD131
AD130
BSF ADCON0, GO
Q4
A/D CLK
A/D Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
9 7 3210
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the
SLEEP instruction to be executed.
AD134
6
8
1 TCY
(TOSC/2 + TCY(1))
1 TCY
PIC12F609/615/12HV609/615
DS41302A-page 148 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 149
PIC12F609/615/12HV609/615
16.0 DC AND AC
CHARACTERISTICS GRAPHS
AND TABLES
Graphs are not available at this time.
PIC12F609/615/12HV609/615
DS41302A-page 150 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 151
PIC12F609/615/12HV609/615
17.0 PACKAGING INFORMATION
17.1 Package Marking Information
*Standard PIC device marking consists of Microchip part number, year code, week code, and traceability
code. For PIC device marking beyond this, certain price adders apply. Please check with your Microchip
Sales Office. For QTP devices, any special marking adders are included in QTP price.
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer pa ckaging for this package.
Note: In the event the full Mi cro chip pa rt num ber cannot be ma rked on on e line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
8-Lead TSSOP
XXXX
YYWW
NNN
Example
/ST
0610
017
XXXXXNNN
8-Lead PDIP
XXXXXXXX
YYWW 017
Example
XXFXXX/P
0610
8-Lead SOIC (.150”)
XXXXXXXX
XXXXYYWW
NNN
Example
PICXXCXX
/SN0610
017
XXXXXX
8-Lead DFN (4x4 mm)
YYWW
NNN
Example
XXXXXX XXXXXX
0610
017
XXXX
3
e
3
e
3
e
3
e
PIC12F609/615/12HV609/615
DS41302A-page 152 Preliminary © 2006 Microchip Technology Inc.
17.2 Package Details
The following sections give the technical details of the packages.
8-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
B1
B
A1
A
L
A2
p
α
E
eB
β
c
E1
n
D
1
2
Units INCHES*MILLIMETERS
Dime nsion Limits MIN NOM MAX MIN NOM MAX
Number of Pins n88
Pitch p.100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .385 9.14 9.46 9.78
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness c.008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing §eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top α51015 51015
Mold Draft Angle Bottom β51015 51015
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
§ Significant Characteristic
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 153
PIC12F609/615/12HV609/615
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil Body (SOIC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Foot A ngle φ048048
1512015120
β
Mold Draft Angle Bottom 1512015120
α
Mold Draft Angle Top 0.510.420.33.020.017.013BLead Width 0.250.230.20.010.009.008
c
Lead Thickness
0.760.620.48.030.025.019LFoot Length 0.510.380.25.020.015.010hChamfer Distance 5.004.904.80.197.193.189DOverall Length 3.993.913.71.157.154.146E1Molded Pa ckag e Width 6.206.025.79.244.237.228EOverall Width 0.250.180.10.010.007.004A1Standoff §1.551.421.32.061.056.052A2Molded Packag e Thickness 1.751.551.35.069.061.053AOverall Height 1.27
.050
p
Pitch 88
n
Numb er of Pin s MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2
1
D
n
p
B
E
E1
h
L
β
c
45°
φ
A2
α
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per si de.
JEDEC Equivalent: MS-012
Drawing No. C04-057
§ Significant Characteristic
PIC12F609/615/12HV609/615
DS41302A-page 154 Preliminary © 2006 Microchip Technology Inc.
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body (TSSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
D
e
n
b
2
1
c
L
A
A1 A2
ϕ
β
α
MILLIMETERS*
MIN NOM MAX
1.20
1.05
0.15
4.50
3.10
0.75
0.20
0.30
8
1.00
4.40
3.00
0.60
0.80
0.05
4.30
2.90
0.45
0.09
0.19
INCHES
MIN NOM MAX
8
.039
.173
.118
.024
.047
.041
.006
.177
.122
.030
.008
.012
.031
.002
.169
.114
.018
.004
.007
.026 BSC 0.65 BSC
.252 BSC 6.40 BSC
12° REF
12° REF
12° REF
12° REF
Units
Dimension Limits
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
1. Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Drawing No. C04-086 Revised 7-25-06
n
e
A
A2
A1
E
E1
D
L
ϕ
c
b
α
β
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 155
PIC12F609/615/12HV609/615
8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x09 mm Body [DFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Width
Overall Width
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
Units
Dimension Limits
N
e
A
A1
A3
D
E2
E
D2
b
L
K
0.80
0.00
0.00
0.00
0.25
0.30
0.20
8
0.80 BSC
0.90
0.02
0.20 REF
4.00 BSC
2.20
4.00 BSC
3.00
0.30
0.55
1.00
0.05
2.80
3.60
0.35
0.65
MIN NOM MAX
MILLIMETERS
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. § Significant Characteristic
4. Package is saw singulated
5. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04–131, Sept. 8, 2006
A3
A1
A
NOTE 2
TOP VIEW BOTTOM VIEW
NOTE 1
NOTE 1
EXPOSED
PAD
12
E
D
N
K
b
e
N
L
E2
D2
21
PIC12F609/615/12HV609/615
DS41302A-page 156 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 157
PIC12F609/615/12HV609/615
APPENDIX A: DATA SHEET
REVISION HISTORY
Revision A
This is a new data sheet.
APPENDIX B: MIGRATING FROM
OTHER PIC®
DEVICES
This discusses some of the issues in migrating from
other PIC devices to the PIC12F6XX Family of devices.
B.1 PIC12F675 to PIC12F609/615/
12HV609/615
TABLE B-1: FEATURE COMPARISON
Feature PIC12F675 PIC12F609/
615/
12HV609/615
Max Operating Speed 20 MHz 20 MHz
Max Program
Memory (Words) 1024 1024
SRAM (bytes) 64 64
A/D Resolution 10-bit 10-bit (615
only)
Timers (8/16-bit) 1/1 2/1 (615)
1/1 (609)
Oscillator Modes 8 8
Brown-out Reset Y Y
Internal Pull -up s RA0 /1/2 /4/5 GP0/1/2/4/5,
MCLR
Interrupt-on-change RA0/1/2/3/4/5 GP0/1/2/3/4/5
Compar ator 1 1 w/hysteresis
ECCP N Y (615)
INTOSC Frequencies 4 MHz 4/8 MHz
Internal Shun t
Regulator NY
(PIC12HV609/
615)
Note: This device has been designed to perform
to the parameters of its data sheet. It has
been tested to an electrical specification
designed to determine its conformance
with these parameters. Due to process
differences in the manufacture of this
device, this device may have different
performan ce c harac teristi cs than it s ea rlier
version. These differences may cause this
device to perform differently in your
application than the earlier version of this
device.
PIC12F609/615/12HV609/615
DS41302A-page 158 Preliminary © 2006 Microchip Technology Inc.
NOTES:
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 159
PIC12F609/615/12HV609/615
INDEX
A
A/D Specifications....................................................145, 146
Absolute Maximum Ratings ..............................................127
AC Characteristics
Industrial and Extended............................................137
Load Conditions............................. .. .. .. .. .. .. ....... .. .. .. ..136
ADCAcquisition Requirements... .... ......... .... .... .... ......... .... ..72
Associ a te d registers................... ....................... ...... ....74
Block Diag ram.... ....... ....................... ...... ...... ...............65
Calculating Acquisition Time.......................................72
Channel Selection.............................. .. .... .. ....... .... .. ....66
Configuration...............................................................66
Configuring Interrupt...................................................69
Conversi o n Clo ck...... ...... ...... ....................... ............. ..66
Conversion Procedure ............ ....... .... .... .. .... ....... .... ....69
Internal Sampling Switch (RSS) Impedance................72
Interrupts.....................................................................67
Operation....................................................................68
Operation During Sleep ..............................................68
Port Configuration.......................................................66
Reference Voltage (VREF)...........................................66
Result For matting.......... ............. ...... ............ ....... ........68
Source Impedance......................... .... .... ...... ......... .... ..72
Special Event Trigger..................................................68
Starting an A/D Conversion ........................................68
ADC (PIC12F615/HV615 Only) ..........................................65
ADCON0 Register ...............................................................70
ADRESH Register (ADFM = 0)...........................................71
ADRESH Register (ADFM = 1)...........................................71
ADRESL Register (ADFM = 0)............................................71
ADRESL Register (ADFM = 1)............................................71
Analog Input Connection Considerations............................54
Analog-to-Digital Converter. See ADC
ANSEL Register (PIC12F609/HV609) ................................33
ANSEL Register (PIC12F615/HV615) ................................33
APFCON Register...............................................................21
Assembler
MPASM Assembler...................................................124
B
Block Diagrams
(CCP) Capture Mode Operation .................................76
ADC ............................................................................65
ADC Transfer Function...............................................73
Analog Input Model...............................................54, 73
Auto-Shutdown ...........................................................87
CCP PWM...................................................................80
Clock Source...............................................................25
Comparator.................................................................53
Compare.....................................................................78
Crystal Operation........................................................27
External RC Mode.......................................................28
GP0 and GP1 Pins......................... .. .. .... .. .. .. ..... .... .. .. ..35
GP2 Pins.....................................................................36
GP3 Pin.......................................................................37
GP4 Pin.......................................................................38
GP5 Pin.......................................................................39
In-Circuit Serial Programming Connections..............110
Inter rupt Logic.... ....... ...... ...... ....................... ....... ......104
MCLR Circuit........................... ....... ....................... ......96
On-Chip Rese t Circuit.................. ............ ...................95
PIC16F609/16HV609 ................................................... 5
PIC16F615/16HV615 ................................................... 6
PWM (Enhanced)....................................................... 83
Resonator Operation. ................................................. 27
Timer1 .................................................................. 45, 46
Timer2 ........................................................................ 51
TMR0/WDT Prescaler ................................................ 41
Watchdog Timer ........... ....... .... .. .. .... .. .. ....... .... .. .... .. .. 107
Brown-o u t Re set (BOR)...... ............. ...... ............. ...... .......... 97
Associ a te d Re g i sters.... ....... ...... ...... ....................... .... 98
Calibration .................................................................. 97
Specifications ........................................................... 141
Timing and Characteristics..................................... .. 140
C
C Compilers
MPLAB C18........ ................. ...... ...... ....... ...... ............ 124
MPLAB C30........ ................. ...... ...... ....... ...... ............ 124
Calibration Bits.................................................................... 95
Capture Module. See Enhanced
Capture/Compare/PWM (ECCP)
Capture/Compare/PWM (CCP)
Associ a te d r egisters w/ Capture.......... ....... ................ 77
Associ a te d r egisters w/ Comp a r e................... ............ 79
Associ a te d registers w/ PWM...... ....................... ...... .. 91
Capture Mod e................. ....... ....................... ...... ...... .. 76
CCP1 Pin Configuratio n .... ....................... ...... ............ 76
Compare Mode........................ ...... ...... ............. ...... .... 78
CCP1 Pin Configuratio n......................... ............ 78
Software Interrupt Mode............................... 76, 78
Special Event Trigger......................................... 78
Timer1 Mode Selection................................. 76, 78
Prescaler .................................................................... 76
PWM Mode........... ...... ....... ...... ....................... ...... ...... 80
Duty Cycle................... ...... ............. ...... ...... ........ 81
Effects of Reset............. ...... ....................... ...... .. 82
Example PWM Frequencies and
Resolutions, 20 MHZ.................................. 81
Example PWM Frequencies and
Resolutions, 8 MHz.................................... 81
Operation in Sleep Mode............................ .. .. .. .. 82
Setup for Operation............................................ 82
System Clock Frequency Changes. ................... 82
PWM Period ... . ..... ...... ....... ...... ...... ...... ....... ...... ...... .... 81
Setup for PWM Operation .......................................... 82
CCP1CON (Enhanced) Register.............................. .... .. .... 75
Clock Sources
External Modes........................................................... 26
EC ...................................................................... 26
HS ...................................................................... 27
LP....................................................................... 27
OST.................................................................... 26
RC ...................................................................... 28
XT....................................................................... 27
Internal Modes............................................................ 28
INTOSC.............................................................. 28
INTOSCIO.......................................................... 28
CMCON0 Regis te r........ ...... ....... ...... ............ ....... ...... .......... 58
CMCON1 Regis te r........ ...... ....... ...... ............ ....... ...... .......... 59
Code Examples
A/D Conver sion ................... ...... ...... ....................... .... 69
Assigni n g Prescal e r to Timer0.................. ...... ...... ...... 42
Assigni n g Prescal e r to WDT.... ...... ...... ....... ...... ...... .... 42
Changing Between Capture Prescalers ..................... 76
PIC12F609/615/12HV609/615
DS41302A-page 160 Preliminary © 2006 Microchip Technology Inc.
Indirect Addressing.....................................................22
Initializing GPIO..........................................................31
Saving Status and W Registers in RAM ...................106
Code Protection ................................................................109
Comparator.........................................................................53
Associ a te d registers............ ....................... ...... ....... ....64
Control ........................................................................55
Gating Timer1.............................................................59
Operation During Sleep ..............................................57
Overview.....................................................................53
Response Time.............................................. .... .........55
Synchronizing COUT w/Timer1 ..................................59
Comparator Hysteresis.. ....... ............ ...... ............. ............. ..63
Comparator Voltage Reference (CVREF)
Response Time.............................................. .... .........55
Comparator Voltage Reference (CVREF)............................60
Effects of a Reset ........................................................57
Specifications............................................................144
Comparators
C2OUT as T1 Gate....... ....................... .......................47
Effects of a Reset ........................................................57
Specifications............................................................144
Compare Module. See Enhanced
Capture/Compare/PWM (ECCP)
CONFIG Regi ster............... ....... ............ ....... ...... .................94
Configuration Bits................................................................93
CPU Features .....................................................................93
Customer Change Notification Service .............................163
Custome r Notification Se r vice............... ....... ............ .........163
Customer Support............ ........... .... ...... ........... .... .... .... .....163
D
Data Memory.........................................................................9
DC Characteristics
Extended and Industrial............................................133
Industrial and Extended............................................129
Development Support .......................................................123
Device Overview...................................................................5
E
ECCP. See Enhanced Captur e/Compare/ PWM
ECCPAS Register................................. ....... ...... .................88
Effects of Reset
PWM mode................... ....................... ...... ...... ....... ....82
Electrical Specifications ....................................................127
Enhanced Capture/Compare/PWM (ECCP)
Enhanced PWM Mode................................. .... .... .......83
Auto-Restart........................................................89
Auto-shutdown....................................................87
Half-Bridge Application .......................................85
Half-Bridge Application Examples .......................90
Half-Bridge Mode................................................85
Output Relationships (Active-High and
Active-Low).................................................84
Output Re latio n ships Diagram................. ...........84
Programmable Dead Band Delay ................ .......90
Shoot-through Current. .......................................90
Start- u p Consid e rations........ ..............................86
Specifications............................................................143
Timer Resources.........................................................75
Enhanced Capture/Compare/PWM
(PIC12F615/HV615 Only)...........................................75
Errata ....................................................................................4
F
Firmware Instructions ....................................................... 113
Fuses. See Configuration Bits
G
General Purpose Register File ............................ ......... ...... .. 9
GPIO................................................................................... 31
Additional Pin Functions............................................. 32
ANSEL Register ................................................. 32
Interrupt-on-Change ........................................... 32
Weak Pull-Ups.................................................... 32
Associ a te d registers ............... ........................ ...... ...... 40
GP0 ............................................................................ 35
GP1 ............................................................................ 35
GP2 ............................................................................ 36
GP3 ............................................................................ 37
GP4 ............................................................................ 38
GP5 ............................................................................ 39
Pin Descriptions and Diagrams .................................. 35
Specifications ........................................................... 139
GPIO Regis te r .............. ....................... ...... ...... ................... 31
I
ID Locations...................................................................... 109
In-Circuit Debugger ........................................................... 110
In-Circuit Serial Programming (ICSP)............................... 110
Indirect Addressing, INDF and FSR registers . .................... 22
Instruction Format............................................................. 113
Instruction Set................................................................... 113
ADDLW..................................................................... 115
ADDWF..................................................................... 115
ANDLW..................................................................... 115
ANDWF..................................................................... 115
BCF .......................................................................... 115
BSF........................................................................... 115
BTFSC...................................................................... 115
BTFSS...................................................................... 116
CALL......................................................................... 116
CLRF ........................................................................ 116
CLRW....................................................................... 116
CLRWDT .................................................................. 116
COMF....................................................................... 116
DECF........................................................................ 116
DECFSZ ................................................................... 117
GOTO....................................................................... 117
INCF ......................................................................... 117
INCFSZ..................................................................... 117
IORLW...................................................................... 117
IORWF...................................................................... 117
MOVF ....................................................................... 118
MOVLW.................................................................... 118
MOVWF.................................................................... 118
NOP.......................................................................... 118
RETFIE..................................................................... 119
RETLW..................................................................... 119
RETURN................................................................... 119
RLF........................................................................... 120
RRF .......................................................................... 120
SLEEP...................................................................... 120
SUBLW..................................................................... 120
SUBWF..................................................................... 121
SWAPF..................................................................... 121
XORLW .................................................................... 121
XORWF .................................................................... 121
Summary Ta b l e............................. ...... ...... ....... ...... .. 114
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 161
PIC12F609/615/12HV609/615
INTCON Register................................................................17
Internal Oscillator Block
INTOSC
Specifications............................................138, 139
Internal Sampling Switch (RSS) Impedance........................72
Inter n e t Ad d ress.................... ...... ....... ...... ...... ...... ....... ......16 3
Interrupts...........................................................................103
ADC ............................................................................69
Associ a te d Re g i sters.......... ....................... ....... ...... ..105
Context Saving..........................................................106
GP2/INT....................................................................103
GPIO Interrupt-on-Change ........................................104
Interrupt-on-Change....................................................32
Timer0.......................................................................104
TMR1..........................................................................48
INTOSC Specifications ................... ........... .... .... .......138, 139
IOC Register.......................................................................34
L
Load Conditions......... ..... .. .. .... .. .. .. .. ....... .. .. .. .. .. .. ....... .. .. .. ..136
M
MCLR..................................................................................96
Internal........................................................................96
Memory Organization............................................................9
Data ..............................................................................9
Program........................................................................9
Microc h i p In ternet Web Site........ ....... ....................... ...... ..163
Migra tin g from other PIC D e vices. ................. ...... ....... ......1 5 7
MPLAB ASM30 Assembler, Linker, Librarian ...................124
MPLAB ICD 2 In-Circuit Debugger .......... .... .... .... ....... .... ..125
MPLAB ICE 2000 High-Perform ance Universal
In-Circuit Emulator....................................................125
MPLAB ICE 4000 High-Perform ance Universal
In-Circuit Emulator....................................................125
MPLAB Integrated Development Environment Software..123
MPLAB PM3 Device Programmer ....................................125
MPLINK Object Linker/MP L IB Object Librar ian................124
O
OPCODE Fiel d Descri p tions....... ............. ............ ....... ......11 3
Operational Amplifier (OPA) Module
AC Specifications ......................................................145
OPTION Register................................................................16
OPTION_R EG Re g i ster.. ...... ...... ....... ....................... ...... ....43
Oscillator
Associ a te d registers................... ....................... ....29, 50
Oscillator Module ................................................................25
EC...............................................................................25
HS...............................................................................25
INTOSC ......................................................................25
INTOSCIO...................................................................25
LP................................................................................25
RC...............................................................................25
RCIO...........................................................................25
XT ...............................................................................25
Oscillator Parameters .......................................................138
Oscillator Specifications....................................................137
Oscillator Start-up Timer (OST)
Specifications............................................................141
OSCTUNE Regis te r...................... ....................... ....... ........29
P
P1A/P1B/P1C/P1D.See Enhanced
Capture/Compare/P WM (ECCP)............. ............. ......83
Packaging.........................................................................151
Marking..................................................................... 151
PDIP Details............................................................. 152
PCL and PCLATH............................................................... 22
Stack........................................................................... 22
PCON Register............................................................. 20, 98
PICSTART Plus Development Programmer..................... 126
PIE1 Register ..................................................................... 18
Pin Diagram
PDIP, SOIC, TSSOP, DFN (PIC12F609/HV609)..... .... 2
PDIP, SOIC, TSSOP, DFN (PIC12F615/HV615)..... .... 3
Pinout Descriptions
PIC12F609/12HV609 ................................................... 7
PIC12F615/12HV615 ................................................... 8
PIR1 Register ..................................................................... 19
Power-Down Mode (Sleep)............................................... 108
Power-on Reset (POR)....................................................... 96
Power-up Timer (PWRT).................................................... 96
Specifications ........................................................... 141
Precisio n In ternal Oscillator Par ameters .............. ............ 139
Prescaler
Shared WDT/Timer0.................. ...... ....... .................... 42
Switching Prescaler Assignment................................ 42
Program Memory.................................................................. 9
Map and Stack .............................................................. 9
Programming, Device Instructions.................................... 113
PWM Mode. See Enh anced Captur e/Compare/PW M........ 83
PWM1CON Registe r........................ ............ ....................... 91
R
Reader Response............................................................. 164
Read-Modify-Write Operations......................................... 113
Registers
ADCON0 (ADC Control 0).......................................... 70
ADRESH (ADC Result High) wi th ADFM = 0).. .......... 71
ADRESH (ADC Result High) wi th ADFM = 1).. .......... 71
ADRESL (ADC Result Low) with ADFM = 0).............. 71
ADRESL (ADC Result Low) with ADFM = 1).............. 71
ANSEL (Analog Select).............................................. 33
APFCON (Alternate Pin Function Register) ............... 21
CCP1CON (Enhanced CCP1 Control) ....................... 75
CMCON0 (Comparator Control 0).............................. 58
CMCON1 (Comparator Control 1).............................. 59
CONFIG (Configuration Word)................................... 94
Data Memory Map (PIC12F609/HV609) .................... 10
Data Memory Map (PIC12F615/HV615) .................... 10
ECCPAS (Enhanced CCP Auto-shutdown Control)... 88
GPIO........................................................................... 31
INTCON (Interrupt Control) ........................................ 17
IOC (Interrupt-on-Change GPIO) . .............................. 34
OPTION_R EG (OPTION)........ ...... ...... ....... ...... ...... .... 16
OPTION_R EG (Option)....... ............ ....... ...... ...... ........ 43
OSCTUNE (Oscillator Tunin g )..... ................... ............ 29
PCON (Power Control Register)................................. 20
PCON (Power Control)............................................... 98
PIE1 (Peripheral Interrupt Enable 1) ..... ..................... 18
PIR1 (Peripheral Interrupt Register 1)........................ 19
PWM1CON (Enhanced PWM Control)................... .... 91
Reset Values (PIC12F609/HV609)........................... 100
Reset Values (PIC12F615/HV615)........................... 101
Reset Values (special registers)............................... 102
Special Function Registers........................................... 9
Special Register Summary (PIC12F609/HV609) . 11, 13
Special Register Summary (PIC12F615/HV615) . 12, 14
STATUS ..................................................................... 15
T1CON ....................................................................... 49
T2CON ....................................................................... 52
PIC12F609/615/12HV609/615
DS41302A-page 162 Preliminary © 2006 Microchip Technology Inc.
TRISIO (Tri-St at e GPIO)......... ...... ....... ...... ...... ...........31
VRCON (Voltage Reference Control) .........................62
WPU (Weak Pull-Up GPIO) ........................................34
Reset...................................................................................95
Revision History................ ................................................157
S
Shoot-through Current ........................................................90
Sleep
Power-Down Mode ...................................................108
Wake-up....................................................................108
Wake-up using Interrupts..........................................108
Softwa re Simulato r ( MP L AB SIM)................ ...... ...... ....... ..124
Special Event Trigger..........................................................68
Special Function Registers ...................................................9
STATUS Regi ster............................ ...... ....................... .......15
T
T1CON Regis te r... ...... ............. ...... ............. ...... ...................49
T2CON Regis te r... ...... ............. ...... ............. ...... ...................52
Thermal Considerations....................................................135
Time-out Sequence............................................ .... .... .. .......98
Timer0.................................................................................41
Associ a te d Re g i sters.............. ...... ....... .......................43
External Clock.............................................................42
Interrupt.......................................................................43
Operation ..............................................................41, 45
Specifications............................................................142
T0CKI..........................................................................42
Timer1.................................................................................45
Associ a te d registers............ ...... ....................... ....... ....50
Asynchronous Counter Mode ...................... ...... .........47
Reading and Writing ....... .. .. .. .. ....... .. .. .. .. .. .. .. ..... ..47
Comparat o r S ync h ronization ...... ................... .............48
ECCP Special Event Trigger
(PIC12F615/HV515 Only)...................................48
ECCP Time Base (PIC12F615/HV515 Only)..............48
Interrupt.......................................................................48
Modes of Operation ................ .... .... ....... .. .... .... .. ....... ..45
Operation During Sleep ..............................................48
Oscillator.....................................................................47
Prescaler.....................................................................47
Specifications............................................................142
Timer1 Gate
Inverting Gate .....................................................47
Selectin g So u rce............................ ...............47, 59
Sync h ro n i z i n g C O U T w/Timer1 .. ...... ...... .. ..... .....59
TMR1H Register.........................................................45
TMR1L Register..........................................................45
Timer2 (PIC12F615/HV615 Only).......................................51
Associ a te d registers............ ...... ....................... ....... ....52
Timers
Timer1
T1CON................................................................49
Timer2
T2CON................................................................52
Timing Diagrams
A/D Conversion................... ....................... ...............147
A/D Conversion (Sleep Mode) ..................................147
Brown-out Reset (BOR)............................................140
Brown-out Reset Situations ........................................97
CLKOUT and I/O.......................................................139
Clock Timing.............................................................137
Comparator Output......... ...... ...... ....................... ....... ..53
Enhanced Capture/Compare/PWM (ECCP).............143
Half-Bridge PWM Output ......................................85, 90
INT Pin Interrupt .......................................................105
PWM Auto-shutdown
Auto-restart Enabled........................................... 89
Firmware Restart................................................ 89
PWM Output (Active-High)........ ............ ...... ............. .. 84
PWM Output (A ct ive-Low)......................... ....... .......... 84
Reset, WDT, OST and Power-up Timer................... 140
Time-out Sequence
Case 1................................................................ 99
Case 2................................................................ 99
Case 3................................................................ 99
Timer0 and Timer1 External Clock........................... 142
Timer1 Incrementing Edge ......................................... 48
Wake-up from Interrupt............................................. 109
Timing Pa rameter Symb o l o g y ........ ....... ...... ..................... 136
TRISIO................................................................................ 31
TRISIO Register ................................................................. 31
V
Voltage Reference (VR)
Specifications ........................................................... 144
Voltage Reference. See Comparator
Voltage Reference (CVREF)
Voltage References
Associ a te d registers ............... ........................ ...... ...... 64
VP6 Stabilization .................... ............. ....................... 60
VREF. SEE ADC Reference Voltage
W
Wake-up Using Interrupts................................................. 108
Watchdog Timer (WDT)....................................... ......... .... 106
Associ a te d registers ............... ........................ ...... .... 107
Specifications ........................................................... 141
WPU Register..................................................................... 34
WWW Addres s .................................... ...... ...... ....... ...... .... 163
WWW, On-Line Support....................................................... 4
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 163
PIC12F609/615/12HV609/615
THE MICROCHIP WEB SITE
Microc hip pro vides onl ine s upport v ia our W WW site at
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Technical support is avail able throug h the web si te
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PIC12F609/615/12HV609/615
DS41302A-page 164 Preliminary © 2006 Microchip Technology Inc.
READER RESPONSE
It is ou r intention to provi de you wit h th e best documentation po ss ib le to ensure suc c es sfu l u se of y ou r M icr oc hip pro d-
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DS41302APIC12F609/615/12HV609/615
1. What are the best f eatures of thi s document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
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7. How would you improve this document?
© 2006 Microchip Technology Inc. Preliminary DS41302A-page 165
PIC12F609/615/12HV609/615
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device: PIC12F609, PIC12F609T(1), PIC12HV609, PIC12HV609T(1),
PIC1 2F 61 5, P IC 1 2F 61 5 T(1)), PIC12HV615, PIC12HV615T(1)
VDD range 2.0V to 5.5V (F devices only)
Temperature
Range: I= -40°C to +85°C (Industrial)
E= -40°C to +125°C (Extended)
Package: P = Plastic DIP
MD = 8-lead Plastic Dual Flat, No Lead (4x4x0.9mm)
SN = 8-lead Small Outline (150 mil)
ST = Thin Shrink Small Outline (4.4 mm)
Pattern: QTP, SQTP or ROM Code; Special Requirements
(blank oth erwi se )
Examples:
a) PIC12F615-E/P 301 = Ext ended Temp., PDIP
package, 20 MHz, QTP patter n #301
b) PIC12F615-I/SN = Industrial Temp., SOIC
package, 20 MHz
Note 1: T = in tape and reel TSSO P and SO IC
packages only.
DS41302A-page 166 Preliminary © 2006 Microchip Technology Inc.
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08/29/06