Page 1 of 1 Product Name Series Type Model Part Number Chip Beads MMZ Series 1608 Type t=0.8mm MMZ1608Y121BT000 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Summary Processing MULTI-LAYER Shape Chip Number of Circuits Nom 1 Material Code Y Size Code 1608 Nom 1.6 m m Body Breadth(W) Nom 0.8 m m Body Height(T) Nom 0.8 m m Impedance Min 90 Ohm Impedance Nom 120 Ohm Min -25 % Max 25 % Nom 100 M Hz Impedance Tolerance Frequency of Impedance Rated Current Max 0.5 A DC Resistance Max 0.2 Ohm Soldering Method Category Temperature Range Storage Temperature Range Weight Personal computers, CRTs, liquid crystal Applications display panels, printers,hard disk drives, game machines, cellular phones, etc. Feature Body Length(L) This is a multilayered chip bead product with dimensions of L1.6xW0.8xT0.8mm. The MMZ series provide effective EMC suppression in signal lines through simple inseries implementation. It is applicable for lead free soldering. Packaging Punched (Paper)Taping [180mm Reel] Packing Minumum Package Qty Nom 4000 Pcs Minimum Order Qty 4000 Pcs Nom Flow,Reflow,Iron Soldering Min -55 Cel Max 125 Cel Min -55 Cel Max 125 Cel Nom 0.003 g [ Caution ] Specifications which provide more details for the proper and safe use of the described product are available upon request. [ Notice of Revision and Improve ] All specifications are subject to change without notice. Copyright(c) 1996-2008 All rights reserved. http://roots.tdk.co.jp/rootsme.asp?ID=TJA102&NO=MMZ1608Y121BT000&... 3/27/2009