REVISIONS
LTR DESCRIPTION DATE (YR-MO-DA) APPROVED
A
Table I: Exclude VIO and VIO / temp from PDA. Guarantee, if not tested, en
and in at fO = 100 Hz. Delete subgroups 2 and 3 for IOS. Change ZO to RO
and maximum limit to PD, subgroup 1. Update format and editorial changes
throughout.
89-11-15 M. A. FRYE
B Add vendor CAGE number 01295 and case 2. Make changes to JA.
Add footnote 3/ to VIO / temp, en, and in tests as specified under Table I.
Make change to the first sentence of footnote 4/ as specified under Table I.
Changes in accordance with N.O.R. 5962-R321-92. 92-12-08 M. A. FRYE
C Drawing updated to reflect current requirements. Redrawn. - ro 09-02-04 R. HEBER
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS REV C C C C C C C C
OF SHEETS SHEET 1 2 3 4 5 6 7 8
PMIC N/A PREPARED BY
JOSEPH A. KIRBY
CHECKED BY
RAY MONNIN
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
88-06-15
MICROCIRCUIT, LINEAR, LOW NOISE HIGH
SPEED PRECISION OPERATIONAL AMPLIFIER,
MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
C SIZE
A CAGE CODE
67268
5962-88567
SHEET 1 OF 8
DSCC FORM 2233
APR 97 5962-E031-09
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88567
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET 2
DSCC FORM 2234
APR 97
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-88567 01 G A
Drawing number Device type
(see 1.2.1) Case outline
(see 1.2.2) Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function
01 LT1037A Low noise, high speed precision
operational amplifier
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
G MACY1-X8 8 Can
P GDIP1-T8 or CDIP2-T8 8 Dual-in-line
2 CQCC1-N20 20 Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage (VS) .......................................................................... 22.0 V dc
Input voltage ..................................................................................... Equal to supply voltage
Differential input current .................................................................... 25 mA 1/
Lead temperature (soldering, 10 seconds) ....................................... +300C
Storage temperature range ............................................................... -65C to +150C
Junction temperature (TJ) ................................................................. +150C
Thermal resistance, junction-to-case (JC) ....................................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (JA):
Case G .......................................................................................... 150C/W
Case P .......................................................................................... 110C/W
Case 2 ........................................................................................... 65C/W
1.4 Recommended operating conditions.
Supply voltage (VS) .......................................................................... 15.0 V dc
Ambient operating temperature range (TA) ....................................... -55C to +125C
_____
1/ Inputs are protected by back-to-back diodes. If differential input voltage exceeds 0.7 V, the current should be limited
to 25 mA.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88567
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET 3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICAT ION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE ST ANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to
MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and
qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management
(QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the
device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with
MIL-PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88567
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET 4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55C TA +125C
VS = 15 V, VCM = 0 V
Group A
subgroups
Device
type
Limits Unit
unless otherwise specified Min Max
Input offset voltage VIO 1/ 1, 2, 3 01 60 V
Long term input offset
voltage stability VIO /
time
2/ 3/ 1, 2, 3 01 1.0 V/Mo
Average input offset drift VIO /
temp
1/ 3/ 1, 2, 3 01 0.6 V/C
Input offset current IIO 1, 2, 3 01 50 nA
Input bias current IIB 1, 2, 3 01 60 nA
Input noise voltage 3/ enp-p 0.1 Hz to 10 Hz,
TA = +25C
4 01 0.13
Vp-p
Input noise voltage 4/
density en f
O = 10 Hz, 3/
TA = +25C
4 01 4.5 nV /
Hz
fO = 1000 Hz, 3/
TA = +25C
3.8
Input noise current 4/
density in f
O = 10 Hz, 3/
TA = +25C
4 01 4.0 pA /
Hz
fO = 1000 Hz, 3/
TA = +25C
0.6
Input voltage range VIN 1 01
11.0 V
2,3
10.3
Common mode rejection
ratio CMRR VCM = 10.3 V 1, 2, 3 01 112 dB
Power supply rejection
ratio PSRR 4.5 V VS 18 V 1, 2, 3 01 104 dB
Large signal voltage gain AVOL R
L 1 k, VO = 10 V dc 4, 5, 6 01 2.0 V/V
Maximum output voltage
swing VOUT R
L 2 k 1, 2, 3 01 12.5 V
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88567
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET 5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions
-55C TA +125C
VS = 15 V, VCM = 0 V
Group A
subgroups
Device
type
Limits Unit
unless otherwise specified Min Max
Slew rate SR AVCL 5, RL = 2 k,
TA = +25C
4 01 11
V/s
Output short circuit current IOS t 25 ms, TA = +25C 1 01 80 mA
Gain bandwidth product 3/ GBW fO = 10 kHz, AVCL 5,
TA = +25C
4 01 45 MHz
Open loop output 3/
resistance RO V
O = 0 V, TA = +25C,
IO = 0 mA
4 01 2000
Power dissipation PD 1 01 130 mW
2, 3 150
1/ Input offset voltage is guaranteed fully warmed up. The VIO and VIO / temp tests are not included in the PDA
calculation.
2/ Long term input offset voltage stability refers to the average trend line of offset voltage versus time over extend periods
after the first 30 days of operation. Excluding the first hour of operation, changes in VIO during the first 30 days are
normally 2.5 V.
3/ This parameter is guaranteed, if not tested, to the limits specified.
4/ Noise voltage density is guaranteed if not tested. Tested in the applications information section.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of
MIL-PRF-38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88567
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET 6
DSCC FORM 2234
APR 97
Device type 01
Case outlines G P 2
Terminal
number Terminal symbol
1 VOS TRIM VOS TRIM NC
2 -INPUT -INPUT
VOS TRIM
3 +INPUT +INPUT NC
4 -VS (CASE) -VS NC
5 NC NC -INPUT
6 OUTPUT OUTPUT NC
7 +VS +VS +INPUT
8 VOS TRIM VOS TRIM NC
9 --- --- NC
10 --- ---
-VS
11 --- --- NC
12 --- --- NC
13 --- --- NC
14 --- --- NC
15 --- --- OUTPUT
16 --- --- NC
17 --- ---
+VS
18 --- --- NC
19 --- --- NC
20 --- ---
VOS TRIM
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88567
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET 7
DSCC FORM 2234
APR 97
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1015 of MIL-STD-883.
(2) TA = +125C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of
MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.
4.3.2 Groups C and D inspections.
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test conditions, method 1005 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1005 of MIL-STD-883.
(2) TA = +125C, minimum.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-ST D-883.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88567
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET 8
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
MIL-STD-883 test requirements Subgroups
(in accordance with
MIL-STD-883, method 5005,
table I)
Interim electrical parameters
(method 5004) ---
Final electrical test parameters
(method 5004) 1*, 2, 3, 4
Group A test requirements
(method 5005) 1, 2, 3, 4, 5, 6
Groups C and D end-point
electrical parameters
(method 5005)
1
* PDA applies to subgroup 1. VIO and VIO / temp tests are not
included in the PDA calculation.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be
used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices
(FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone
(614) 692-0547.
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in
MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and
accepted by DSCC-VA.
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 09-02-04
Approved sources of supply for SMD 5962-88567 are listed below for immediate acquisition information only and shall
be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate
of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of
supply at http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8856701GA 3/ LT1037AMH/883B
3/ LT1037AML
5962-8856701PA 3/ LT1037AMJ8/883B
3/ LT1037AMJG
5962-88567012A 3/ LT1037AMFK
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
The last known suppliers are listed below.
Vendor CAGE Vendor name
number and address
01295 Texas Instruments, Inc.
Semiconductor Group
8505 Forest Lane
P.O. Box 660199
Dallas, TX 75243
Point of contact: U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-9493
64155 Linear Technology Corporation
1630 McCarthy Blvd.
Milpitas, CA 95035-7417
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
