Effective August 2017 Supersedes March 2007 Technical Data 0402-MLP 0402ESDA-MLP ESD suppressor 0 01 Applications 2 1, e d. 7 n 6 u J lete t is 43 e v it epe en et # c d em e e f is h f c s e y a l a d p t r e to re da u it n ven ed 1 n in nd LP o c l e -M i s t i D un mm DA or eco ES R 02 04 * * * * * * * * * * * Surface Mount Device Product features ESD port protection for mobile/smart phones Game console ESD port protection High speed ESD data port protection Set-top-boxes Tablets, notebooks, netbooks, laptops High definition television (HDTV) Media players Digital cameras Medical equipment Computers and peripherals ESD port protection Consumer electronics Ordering Information * Ultra-low capacitance (0.05 pF typ.) ideal for high speed data applications * Provides ESD protection with fast response time (<1 ns) allowing equipment to pass IEC 61000-4-2 level 4 test * Single-line, bi-directional device for placement flexibility * Low profile 0402/1005 design for board space savings * Low leakage current (<0.1 nA typ.) reduces power consumption Catalog Number 0402ESDA-MLP7 0402ESDA-MLP8 Packaging 10,000 pieces in paper tape on 7" (178mm) reel 2,500 pieces in paper tape on 7" (178mm) reel Electrical Characteristics Characteristic Value Rated Voltage Clamping Voltage 30 VDC maximum 1 35 V typical Trigger Voltage2 300 V typical Capacitance (@1 MHz) 0.05 pF typ., 0.15 pF max. Attenuation Change (0-6 GHz) -0.2 dB typical Leakage Current (@12 VDC) <0.1 nA typical ESD Capability IEC61000-4-2 Direct Discharge 8 kV typical IEC61000-4-2 Air Discharge 15 kV typical ESD Pulse Withstand 1 >1000 typical Notes: 1. Per IEC61000-4-2, Level 4 waveform (8 kV direct, 30 A) measured 30ns after initiation of pulse. 2. Trigger measurement made using Transmission Line Pulse (TLP) method. 3. Minor shifting in characteristics may be observed over multiple ESD pulses at very rapid rate. 0402ESDA-MLP ESD suppressor Technical Data 0402-MLP Effective August 2017 Product Dimensions: mm [inches] Solder Pad Recommendation: mm [inches] 2.20 0.70 0 01 0.40 2 1, e d. 7 n 6 u J lete t is 43 e v it epe en et # c d em e e f is h f c s e y a l a d p t r e to re da u it n ven ed 1 n in nd LP o c l e -M i s t i D un mm DA or eco ES R 02 04 Design Considerations The location in the circuit for the MLP family has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a "0-stub" pad design (pad directly on the signal/data line and second pad directly on common ground). Environmental Specifications: * Load Humidity: 12VDC per EIA/IS-772 Para. 4.4.2, +85C, 85% RH for 1000 hours * Thermal Shock: EIA/IS-722 Para 4.6, Air to Air -55C to +125C, 5 cycles * Moisture Resistance Test: MIL-STD-202G Method 106G, 10 cycles * Mechanical Shock: EIA/IS-722 Para. 4.9 * Vibration: EIA/IS-722 Para. 4.10 * Resistance to Solvent: EIA/IS-722 Para. 4.11 * Operating & Storage Temperature Range: -55C to +125C Soldering Recommendations * Compatible with lead and lead-free solder reflow processes * Peak reflow temperatures and durations: * IR Reflow = 260C max for 10 sec. max. * Wave Solder = 260C max. for 10 sec. max. * Recommended IR Reflow Profile: Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics (c) 2017 Eaton All Rights Reserved Printed in USA Publication No. 0402-MLP BUSB09615 August 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.