ATest
ATest
ATest
GND
SB3V
GPIO6
NC
TestI
TestBI
VCC
GND
NBO
NBO
NBO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
LPCPD#
SERIRQ
LAD0
GND
VCC
LAD1
LFRAME#
LCLK
LAD2
VCC
GND
LAD3
LRESET#
CLKRUN#
28-pin Thin TSSOP
4.4 mm x 9.7 mm Body
0.65 mm Pitch
28-pinTSSOP
6.1 mm x 9.7 mm Body
0.65 mm Pitch
40-pin QFN
6.0 mm x 6.0 mm Body
0.50 mm Pitch
ATest
ATest
LPCPD#
SERIRQ
NBO
NBO
NBO
NBO
NBO
NBO
NBO
NBO
NBO
NBO
NBO
NBO
NBO
NBO
CLKRUN#
LRESET#
ATest
GND
SB3V
GPIO6
NC
TestI
TestBI
VCC
GND
NBO
LAD0
GND
VCC
LAD1
LFRAME#
LCLK
LAD2
VCC
GND
LAD3
1
2
3
4
5
6
7
8
9
10
30
29
28
27
26
25
24
23
22
21
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
TITLE DRAWING NO.GPC REV.
Package Drawing Contact:
packagedrawings@atmel.com 28A228A2TFL B
28A2, 28-lead, 4.4x9.7 mm Body, 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP)
6/17/08
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
D9.60 9.70 9.80 1,4
E6.40 BSC
E1 4.30 4.40 4.50 2,4
A1.20
A2 0.80 1.00 1.05
b0.19 0.30 3
e0.65 BSC
L0.45 0.60 0.75
L1 1.00 REF
This drawing is for general information only. Please refer to
JEDEC Drawing MO-153, Variation AE for additional information.
1. Dimension "D" does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions and gate burrs shall not exceed
.15mm (.006 in) per side.
2. Dimension "E1" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed .25mm (.010 in)
per side.
3. Dimension 'b' does not include Dambar protrusion. Allowable
Dambar protrusion shall be 0.08 mm total in excess of the 'b'
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
4. Dimension 'D' and 'E1' to be determined at Datum Plane H.
ADA2
e
b
EE1
L
L1
2325 Orchard Parkway
San Jose, CA 95131
TITLE DRAWING NO.
R
REV.
1/8/02
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
D 9.60 9.70 9.80 2, 5
E 8.10 BSC
E1 6.00 6.10 6.20 3, 5
A– – 1.20
A2 0.80 1.00 1.05
b 0.19 –0.30 4
e 0.65 BSC
L 0.45 0.60 0.75
L1 1.00 REF
28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP) 28A3
L1
A
L
DA2
EE1
e
b
Top View
Side View
End View
A
1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional
information.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
not exceed 0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
0.25 mm (0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of
the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
Note:
2325 Orchard Parkway
San Jose, CA 95131
TITLE DRAWING NO.
R
REV.
A1
A3
A
A2
0Side View
C40ML1
9/27/07
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
D 6.00 BSC
E 6.00 BSC
D2 3.95 4.10 4.25
E2 3.95 4.10 4.25
A -0.85 0.90
A1 0.0 0.01 0.05
A2 - 0.65 0.70
A3 0.20 REF
L 0.30 0.40 0.50
e 0.50 BSC
b 0.18 0.23 0.30 2
D
E
Top View
N
2
3
1Pin 1 Indicator
L
PIN1 ID
b
N
D2
3
2
1
e
Bottom View
E2
1. This drawing is for general information only. Refer to JEDEC Drawing MO-220, Variation WJJD-2, for proper
dimensions, tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal
tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be
measured in that radius area.
Note:
40ML1, , 40-lead 6.0 x 6.0 mm Body, 0.50 mm Pitch, Molded
Quad Flat No Lead Package (QFN) Punched
