28-pin Thin TSSOP 4.4 mm x 9.7 mm Body 0.65 mm Pitch 31 NBO 32 NBO 33 NBO 34 NBO 35 NBO 36 NBO 37 SERIRQ 39 ATest 40 ATest 28-pin TSSOP 6.1 mm x 9.7 mm Body 0.65 mm Pitch 38 LPCPD# 40-pin QFN 6.0 mm x 6.0 mm Body 0.50 mm Pitch ATest 1 28 LPCPD# ATest 1 30 LAD0 ATest 2 27 SERIRQ GND 2 29 GND ATest 3 26 LAD0 SB3V 3 28 VCC GPIO6 4 27 LAD1 NC 5 26 LFRAME# TestI 6 25 LCLK TestBI 7 24 LAD2 7 22 LFRAME# TestI 8 21 LCLK VCC 8 23 VCC TestBI 9 20 LAD2 GND 9 22 GND VCC 10 GND 11 19 VCC NBO 10 21 LAD3 NBO 12 NBO 13 17 LAD3 NBO 14 15 CLKRUN# 18 GND 16 LRESET# LRESET# 20 NC CLKRUN# 19 23 LAD1 NBO 18 6 NBO 17 GPIO6 NBO 16 24 VCC NBO 15 5 NBO 14 SB3V NBO 13 25 GND NBO 12 4 NBO 11 GND b L L1 E E1 e A D A2 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL 1. 2. 3. 4. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs shall not exceed .15mm (.006 in) per side. Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed .25mm (.010 in) per side. Dimension 'b' does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the 'b' dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. Dimension 'D' and 'E1' to be determined at Datum Plane H. D MIN NOM MAX NOTE 9.60 9.70 9.80 1,4 4.50 2,4 E E1 6.40 BSC 4.30 4.40 A 1.20 A2 0.80 b 0.19 e L L1 1.00 1.05 0.30 0.45 0.60 0.75 1.00 REF This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation AE for additional information. Package Drawing Contact: packagedrawings@atmel.com TITLE 28A2, 28-lead, 4.4x9.7 mm Body, 0.65 pitch, Thin Shrink Small Outline Package (TSSOP) 3 0.65 BSC 6/17/08 GPC TFL DRAWING NO. REV. 28A2 B b L L1 E E1 e End View Top View COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL D D A A2 NOM MAX NOTE 9.70 9.80 2, 5 6.10 6.20 3, 5 E E1 Side View MIN 9.60 8.10 BSC 6.00 A - - 1.20 A2 0.80 1.00 1.05 b 0.19 - 0.30 e L L1 Note: 1. 2. 3. 4. 5. R 4 0.65 BSC 0.45 0.60 0.75 1.00 REF This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional information. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. Dimension D and E1 to be determined at Datum Plane H. 1/8/02 2325 Orchard Parkway San Jose, CA 95131 TITLE 28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch, Thin Shrink Small Outline Package (TSSOP) DRAWING NO. REV. 28A3 A A D A1 N A2 A3 1 2 Pin 1 Indicator 3 E Top View L 0 Side View COMMON DIMENSIONS (Unit of Measure = mm) D2 SYMBOL MIN D E2 2 b 1 N Bottom View 2. R 4.10 4.25 E2 3.95 4.10 4.25 A - 0.85 0.90 A1 0.0 0.01 0.05 A2 - 0.65 0.70 0.20 REF 0.30 e PIN1 ID Note: 1. 3.95 L b NOTE 6.00 BSC D2 A3 e MAX 6.00 BSC E 3 NOM 0.40 0.50 0.50 BSC 0.18 0.23 0.30 2 This drawing is for general information only. Refer to JEDEC Drawing MO-220, Variation WJJD-2, for proper dimensions, tolerances, datums, etc. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 9/27/07 2325 Orchard Parkway San Jose, CA 95131 TITLE 40ML1, , 40-lead 6.0 x 6.0 mm Body, 0.50 mm Pitch, Molded Quad Flat No Lead Package (QFN) Punched DRAWING NO. REV. 40ML1 C