VSMB294008RG, VSMB294008G
www.vishay.com Vishay Semiconductors
Rev. 1.1, 19-Nov-14 1Document Number: 84228
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, MQW
DESCRIPTION
VSMB294008 series are infrared, 940 nm emitting diodes in
GaAlAs multi quantum well (MQW) technology with high
radiant power and high speed, molded in clear, untinted
plastic packages (with lens) for surface mounting (SMD).
APPLICATIONS
• Data transmission
• Miniature light barrier
• Photointerrupters
• Optical switch
• Control and drive circuits
• Shaft encoders
FEATURES
• Package type: surface mount
• Package form: GW, RGW
• Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8
• Peak wavelength: p = 940 nm
• High reliability
• High radiant power
• High radiant intensity
• Angle of half intensity: = ± 7°
• Low forward voltage
• Suitable for high pulse current operation
• Terminal configurations: gullwing or reserve gullwing
• Package matches with detector VEMD2000X01 series
• Floor life: 4 weeks, MSL 2a, acc. J-STD-020
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
• Test conditions see table “Basic Characteristics“
Note
• MOQ: minimum order quantity
VSMB294008RG VSMB294008G
PRODUCT SUMMARY
COMPONENT Ie (mW/sr) (deg) P (nm) tr (ns)
VSMB294008RG 70 ± 7 940 15
VSMB294008G 70 ± 7 940 15
ORDERING INFORMATION
ORDERING CODE PACKAGING REMARKS PACKAGE FORM
VSMB294008RG Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing
VSMB294008G Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage VR5V
Forward current IF100 mA
Surge forward current tp = 100 μs IFSM 500 mA
Power dissipation PV160 mW
Junction temperature Tj100 °C
Operating temperature range Tamb -40 to +85 °C
Storage temperature range Tstg -40 to +100 °C
Soldering temperature according to fig. 10, J-STD-020 Tsd 260 °C
Thermal resistance junction/ambient J-STD-051, leads 7 mm, soldered on PCB RthJA 250 K/W
VSMB294008RG, VSMB294008G
www.vishay.com Vishay Semiconductors
Rev. 1.1, 19-Nov-14 2Document Number: 84228
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature
0
20
40
60
80
100
120
140
160
180
0 102030405060708090100
21343 Tamb - Ambient Temperature (°C)
PV - Power Dissipation (mW)
RthJA = 250 K/W
0
20
40
60
80
100
120
0 102030405060708090100
21344
R
thJA
= 250 K/W
T
amb
- Ambient Temperature (°C)
I
F
- Forward Current (mA)
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Forward voltage IF = 100 mA, tp = 20 ms VF1.15 1.45 1.75 V
IF = 500 mA, tp = 100 μs VF-1.8- V
Temperature coefficient of VFIF = 100 mA TKVF - -0.64 - mV/K
Reverse current VR = 5 V IR- - 10 μA
Junction capacitance VR = 0 V, f = 1 MHz, E = 0 mW/cm2CJ-38-pF
Radiant intensity IF = 100 mA, tp = 100 μs Ie30 70 115 mW/sr
IF = 500 mA, tp = 100 μs Ie- 260 - mW/sr
Radiant power IF = 100 mA, tp = 100 μs e-40-mW
Temperature coefficient
of radiant power IF = 100 mA TKe- -0.43 - %/K
Angle of half intensity -± 7-deg
Peak wavelength IF = 30 mA p920 940 960 nm
Spectral bandwidth IF = 30 mA -25-nm
Temperature coefficient of pIF = 30 mA TKp-0.25-nm/K
Rise time IF = 100 mA, 20 % to 80 % tr-15-ns
Fall time IF = 100 mA, 20 % to 80 % tf-15-ns
Cut-off frequency IDC = 70 mA, IAC = 30 mA pp fc-23-MHz
VSMB294008RG, VSMB294008G
www.vishay.com Vishay Semiconductors
Rev. 1.1, 19-Nov-14 3Document Number: 84228
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 3 - Forward Current vs. Forward Voltage
Fig. 4 - Forward Voltage vs. Ambient Temperature
Fig. 5 - Relative Forward Voltage vs. Ambient Temperature
Fig. 6 - Radiant Intensity vs. Forward Current
Fig. 7 - Radiant Intensity vs. Ambient Temperature
Fig. 8 - Relative Radiant Power vs. Wavelength
1
10
100
1000
1.0 1.2 1.4 1.6 1.8 2.0
IF - Forward Current (mA)
VF - Forward Voltage (V)
tp = 100 μs
1.35
1.37
1.39
1.41
1.43
1.45
1.47
-60 -40 -20 0 20 40 60 80 100
VF - Forward Voltage (V)
Tamb - Ambient Temperature (°C)
IF = 100 mA
tp = 20 ms
97
99
101
103
105
-60 -40 -20 0 20 40 60 80 100
VF, rel - Relative Forward Voltage (%)
Tamb - Ambient Temperature (°C)
IF = 100 mA
tp = 20 ms
0.1
1
10
100
1000
1 10 100 1000
Ie - Radiant Intensity (mW/sr)
IF - Forward Current (mA)
tp = 100 μs
60
70
80
90
100
110
120
130
-50 -25 0 25 50 75 100
Ie, rel - Relative Radiant Intensity (%)
Tamb - Ambient Temperature (°C)
IF = 100 mA
tp = 20 ms
0
10
20
30
40
50
60
70
80
90
100
840 880 920 960 1000 1040
λ - Wavelength (nm)
21445
Φ
e rel
- Relative Radiant Power (%)
I
F
= 30 mA
VSMB294008RG, VSMB294008G
www.vishay.com Vishay Semiconductors
Rev. 1.1, 19-Nov-14 4Document Number: 84228
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 9 - Relative Radiant Intensity vs. Angular Displacement
SOLDER PROFILE
Fig. 10 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Ie, rel - Relative Radiant Intensity
λ - Wavelength (nm)
0.6
80°
0°
0.7
0.4 0.2 0
30°
70°
60°
50°
40°
10° 20°
1.0
0.9
0.8
ϕ - Angular Displacement
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
240 °C 245 °C
max. 260 °C
max. 120 s max. 100 s
217 °C
max. 30 s
max. ramp up 3 °C/s max. ramp down 6 °C/s
19841
255 °C
VSMB294008RG, VSMB294008G
www.vishay.com Vishay Semiconductors
Rev. 1.1, 19-Nov-14 5Document Number: 84228
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters: VSMB294008RG
2.2
5.8 ± 0.2
2.77 ± 0.2
2.3 ± 0.2
Cathode
0.5
0.05 ± 0.1
0.254
1.1 ± 0.1
Anode
0.4
2.2
0.19
0.3
1.6
0.4
Z
Ø 1.8 ± 0.1
2.3 ± 0.2
specications
according to DIN
technical drawings
Not indicated tolerances ± 0.1
Drawing-No.: 6.544-5391.02-4
Pin ID
exposed copper
Issue: 2; 18.03.10
21517
0.75
6.7
1.7
Ø 2.3 ± 0.1
Solder pad proposal
acc. IPC 7351
Z 20:1
VSMB294008RG, VSMB294008G
www.vishay.com Vishay Semiconductors
Rev. 1.1, 19-Nov-14 6Document Number: 84228
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters: VSMB294008G
2.2
4.2 ± 0.2
2.77 ± 0.2
0.05
0.254
0.6
2.2
0.19
0.3
1.6
0.4 Ø 1.8
specifications
according to DIN
technical drawings
Not indicated tolerances ± 0.1
Drawing-No.: 6.544-5383.02-4
Issue: 4; 18.03.10
exposed copper
0.75
2.45
5.15
Solder pad proposal
acc. IPC 7351
21488
X
X 20:1
Cathode Anode
0.4
2.3 ± 0.2
2.3 ± 0.2
0.5
Pin ID
VSMB294008RG, VSMB294008G
www.vishay.com Vishay Semiconductors
Rev. 1.1, 19-Nov-14 7Document Number: 84228
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TAPING AND REEL DIMENSIONS in millimeters: VSMB294008RG
Issue: 2; 18.03.10
Drawing-No.: 9.800-5100.01-4
Leader and trailer tape:
Parts mounted
Empty (400 mm min.)
Empty (160 mm min.)
Direction of pulling out
Unreel direction
Ø 62 ± 0.5
Ø 330 ± 1
Reel
2.5± 0.5
Label posted here
coming out from reel
Tape position
X
Ø13± 0.5
12.4 ± 1.5
X 2:1
I
II
6000 pcs/reel
12 ± 0.3
5.5 ± 0.05 1.75 ± 0.1
2 ± 0.05
4 ± 0.1
4 ± 0.1
Ø 1.55 ± 0.05
3.05 ± 0.1
21572
Technical drawings
according to DIN
specifications
Terminal position in tape
Device
VEMD2000
VEMD2500
Cathode Anode
Anode Cathode
VSMB2000
VSMG2000
VSMY2850RG
VEMT2000
VEMT2500 Collector Emitter
Lead I Lead II
VSMB294008RG, VSMB294008G
www.vishay.com Vishay Semiconductors
Rev. 1.1, 19-Nov-14 8Document Number: 84228
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TAPING AND REEL DIMENSIONS in millimeters: VSMB294008G
Drawing-No.: 9.800-5091.01-4
Leader and trailer tape:
Parts mounted
Empty (400 mm min.)
Empty (160 mm min.)
Direction of pulling out
Unreel direction
Ø 62 ± 0.5
Ø 330 ± 1
Reel
2.5± 0.5
Label posted here
coming out from reel
Tape position
X
Ø13 ± 0.5
12.4 ± 1.5
X 2:1
I
II
6000 pcs/reel
12 ± 0.3
5.5 ± 0.05 1.75 ± 0.1
2 ± 0.05
4 ± 0.1
4 ± 0.1
Ø 1.55 ± 0.05
3.05 ± 0.1
21571
technical drawings
according to DIN
specifications
Issue: 3; 18.03.10
Terminal position in tape
Device
VSMB2020
VSMG2020
Cathode Anode
Anode Cathode
VEMD2020
VEMD2520
VSMY2850G
VEMT2020
VEMT2520 Collector Emitter
Lead I Lead II
Legal Disclaimer Notice
www.vishay.com Vishay
Revision: 08-Feb-17 1Document Number: 91000
Disclaimer
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
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including but not limited to the warranty expressed therein.
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