Semiconductor Components Industries, LLC, 2011
November, 2011 Rev. 3
1Publication Order Number:
MMBTA56WT1/D
MMBTA56WT1G,
SMMBTA56WT1G
Driver Transistor
PNP Silicon
Features
Moisture Sensitivity Level: 1
ESD Rating:
Human Body Model 4kV
Machine Model 400 V
AECQ101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating Symbol Value Unit
CollectorEmitter Voltage VCEO 80 Vdc
CollectorBase Voltage VCBO 80 Vdc
EmitterBase Voltage VEBO 4.0 Vdc
Collector Current Continuous IC500 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR5 Board
TA = 25C
PD150
mW
Thermal Resistance, Junction to Ambient RqJA 833 C/W
Junction and Storage Temperature TJ, Tstg 55 to +150 C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
Device Package Shipping
ORDERING INFORMATION
COLLECTOR
3
1
BASE
2
EMITTER
http://onsemi.com
MMBTA56WT1G SC70
(PbFree)
3,000 /
Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
SC70 (SOT323)
CASE 419
STYLE 3
MARKING DIAGRAM
FM = Device Code
M = Date Code*
G= PbFree Package
FM M G
G
1
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
SMMBTA56WT1G SC70
(PbFree)
3,000 /
Tape & Reel
MMBTA56WT1G, SMMBTA56WT1G
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
CollectorEmitter Breakdown Voltage (Note 1)
(IC = 1.0 mAdc, IB = 0)
V(BR)CEO 80
Vdc
EmitterBase Breakdown Voltage
(IE = 100 mAdc, IC = 0)
V(BR)EBO 4.0
Vdc
Collector Cutoff Current
(VCE = 60 Vdc, IB = 0)
ICES 0.1
mAdc
Collector Cutoff Current
(VCB = 60 Vdc, IE = 0)
(VCB = 80 Vdc, IE = 0)
ICBO
0.1
mAdc
ON CHARACTERISTICS
DC Current Gain
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)
hFE 100
100
CollectorEmitter Saturation Voltage
(IC = 100 mAdc, IB = 10 mAdc)
VCE(sat) 0.25
Vdc
BaseEmitter On Voltage
(IC = 100 mAdc, VCE = 1.0 Vdc)
VBE(on) 1.2
Vdc
SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product (Note 2)
(IC = 100 mAdc, VCE = 1.0 Vdc, f = 100 MHz)
fT50
MHz
1. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.
2. fT is defined as the frequency at which |hfe| extrapolates to unity.
Figure 1. Switching Time Test Circuits
OUTPUT
TURN-ON TIME
-1.0 V VCC
+40 V
RL
* CS t 6.0 pF
RB
100
100
Vin
5.0 mF
tr = 3.0 ns
0
+10 V
5.0 ms
OUTPUT
TURN-OFF TIME
+VBB VCC
+40 V
RL
* CS t 6.0 pF
RB
100
100
Vin
5.0 mF
tr = 3.0 ns
5.0 ms
*Total Shunt Capacitance of Test Jig and Connectors
For PNP Test Circuits, Reverse All Voltage Polarities
MMBTA56WT1G, SMMBTA56WT1G
http://onsemi.com
3
Figure 2. CurrentGain — Bandwidth Product Figure 3. Capacitance
Figure 4. Switching Time
IC, COLLECTOR CURRENT (mA)
-100 -200-10
200
100
70
50
20
VR, REVERSE VOLTAGE (VOLTS)
-1.0 -100-0.1
100
70
50
30
20
10
-2.0
VCE = -2.0 V
TJ = 25C
fT, CURRENT-GAIN - BANDWIDTH PRODUCT (MH
z
C, CAPACITANCE (pF)
-2.0 -3.0 -5.0 -7.0 -20 -30 -50 -70
30
7.0
5.0 -0.2 -0.5 -5.0 -10 -20 -50
TJ = 25C
Cibo
Cobo
IC, COLLECTOR CURRENT (mA)
-10-5.0
500
200
100
50
20
10
-100
t, TIME (ns)
-50 -200 -500
1.0 k
300
700
70
30
-7.0 -300-70-20 -30
VCC = -40 V
IC/IB = 10
IB1 = IB2
TJ = 25C
ts
tf
tr
td @ VBE(off) = -0.5 V
Figure 5. ActiveRegion Safe Operating Area
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
-10 -50-1.0
-500
-200
-100
-50
-20
-10
-20-2.0 -5.0
-1.0 k
IC, COLLECTOR CURRENT (mA)
1.0 ms
1.0 s
TA = 25C
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
100 ms
TC = 25C
-3.0 -7.0 -30 -100-70
-30
-70
-300
-700
Figure 6. DC Current Gain
-2.0 -500-0.5
IC, COLLECTOR CURRENT (mA)
400
200
100
80
60
40
-10
, DC CURRENT GAIN
TJ = 125C
-1.0 -5.0
VCE = -1.0 V
-20 -100-50 -200
hFE
25C
-55C
Figure 7. “ON” Voltages
V, VOLTAGE (VOLTS)
-10 -500-1.0
IC, COLLECTOR CURRENT (mA)
-1.0
-0.8
-0.6
-0.4
-0.2
0
-100
TJ = 25C
VBE(sat) @ IC/IB = 10
VCE(sat) @ IC/IB = 10
VBE(on) @ VCE = -1.0 V
-0.5 -2.0 -5.0 -200-20 -50
MMBTA56WT1G, SMMBTA56WT1G
http://onsemi.com
4
Figure 8. Collector Saturation Region Figure 9. BaseEmitter Temperature
Coefficient
IC, COLLECTOR CURRENT (mA)
IB, BASE CURRENT (mA)
RVB , TEMPERATURE COEFFICIENT (mV/ C)
q
, COLLECTOR-EMITTER VOLTAGE (VOLTS
)
VCE
-100 -500-0.5
-0.8
-1.2
-1.6
-2.0
-2.4
-2.8
-10
RqVB for VBE
-1.0 -2.0 -5.0 -20 -50 -200
-0.1 -10-0.05
-1.0
-0.8
-0.6
-0.4
-0.2
0
-1.0
TJ = 25C
-50
IC =
-100 mA
IC =
-50 mA
IC =
-250 mA
IC =
-500 mA
IC =
-10 mA
-20-2.0 -5.0-0.2 -0.5
MMBTA56WT1G, SMMBTA56WT1G
http://onsemi.com
5
PACKAGE DIMENSIONS
SC70 (SOT323)
CASE 41904
ISSUE N
STYLE 3:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
AA2
D
e1
b
e
E
A1
c
L
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
0.05 (0.002)
1.9
0.075
0.65
0.025
0.65
0.025
0.9
0.035
0.7
0.028 ǒmm
inchesǓ
SCALE 10:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HE
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.80 0.90 1.00 0.032
INCHES
A1 0.00 0.05 0.10 0.000
A2 0.70 REF
b0.30 0.35 0.40 0.012
c0.10 0.18 0.25 0.004
D1.80 2.10 2.20 0.071
E1.15 1.24 1.35 0.045
e1.20 1.30 1.40 0.047
0.035 0.040
0.002 0.004
0.014 0.016
0.007 0.010
0.083 0.087
0.049 0.053
0.051 0.055
NOM MAX
L
2.00 2.10 2.40 0.079 0.083 0.095
HE
e1 0.65 BSC
0.38
0.028 REF
0.026 BSC
0.015
0.20 0.56 0.008 0.022
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