Datasheet DC/DC Driver Power Factor Correction Controller IC BD7690FJ Key Specifications General Description BD7690FJ is Power Factor Correction for AC/DC supplies the system which is suitable for all the products needing power factor improvement. The PFC adopts boundary conduction mode (BCM), and switching loss reduction and noise reduction are possible by Zero Current Detection (ZCD). ZCD is detected by auxiliary winding. Input Voltage Range: 10V to 26V 310uA(Typ) Operating Current: Max Frequency: 220kHz(RT:220k) Operating Temperature Range: -40C to +105C Package(s) W(Typ) x D(Typ) x H(Max) 4.90mm x 6.00mm x 1.65mm SOP-J8 Features Boundary Conduction Mode Low Power consumption VCCUVLO The ZCD detection by auxiliary winding Switching loss reduction, noise reduction by ZCD Improving the efficiency by the max frequency control Dynamic and Static OVP by the VS pin High accuracy over current detection(4%) Error amplifier input short protection Restart timer Stable MOSFET gate drive by the Clamper SOP-J8 Applications AC adopter, TV, Lighting equipment, Refrigerator, etc. Typical Application Circuit(s) 400V Diode Bridge VS CS VCC 8 7 6 VCC OUT GND 5 ZCD BD7690FJ VS EO RT CS 1 2 3 4 VS CS Figure 1. Application Circuit Product structure : Silicon monolithic integrated circuit .www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 14 * 001 This product has no designed protection against radioactive rays 1/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 Contents General Description ...................................................................................................................................................................... 1 Contents ........................................................................................................................................................................................ 2 Pin Configuration(s) ..................................................................................................................................................................... 3 Pin Description(s) ......................................................................................................................................................................... 3 Block Diagram(s) .......................................................................................................................................................................... 3 Description of Block(s)................................................................................................................................................................. 4 Operation mode of the protective circuit .................................................................................................................................... 9 Absolute Maximum Ratings (Ta = 25C) ................................................................................................................................... 10 Thermal Resistance(Note 1) ........................................................................................................................................................... 10 Recommended Operating ConditionsTa=25C ................................................................................................................. 10 Electrical Characteristics (Unless otherwise specified VCC=15V Ta=25C) .......................................................................... 11 I/O Equivalence Circuits ............................................................................................................................................................. 14 Application Example................................................................................................................................................................... 14 Attention in the board design .................................................................................................................................................... 16 About parts placement ............................................................................................................................................................... 16 Operational Notes ....................................................................................................................................................................... 18 Ordering Information .................................................................................................................................................................. 20 Marking Diagrams ....................................................................................................................................................................... 20 Physical Dimension, Tape and Reel Information ..................................................................................................................... 21 Revision History ......................................................................................................................................................................... 22 Product structure : Silicon monolithic integrated circuit .www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 14 * 001 This product has no designed protection against radioactive rays 2/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ Pin Configuration(s) 8 7 6 VCC OUT GND 5 ZCD BD7690FJ VS EO RT CS 1 2 3 4 Figure 2. Pin ConfigurationTop View Pin Description(s) Table 1. Pin Description Pin Name I/O Pin No. VS EO RT CS ZCD GND OUT VCC I I/O I/O I I O I 1 2 3 4 5 6 7 8 ESD Diode VCC GND Function Feedback input Error amp output Max frequency setting Over current detection Zero current detection GND MOSFET gate control VCC Block Diagram(s) VOUT FUSE Diode Bridge Filter VS VCC GND + AC 85265Vac 1shot + - UVLO BGR 4.0V Reg 13.0V/ 9.0V out TSD VGUP Comp 0.3V + - 2.25V VS ErrAmp + EO RRT 1.15V 2.625V DOVP Comp + - 2.725V + - TSD SHORT Comp SP GCLAMP (12V) RT_L Comp + - SOVP AND OR S POUT OUT UVLO Q 2.5V UVLO RT_H RT Timer 30us reset SOVP Comp VS PWM Comp 1.9V + RT_H + RT_H Comp 0.65V + - ZCD Internal Supply BGRBUF + - 0.67V/1.80V SOVP OR R SP AND PRE Driver NOUT 100k TSD OSC EN ISOCP Comp CS Figure 3. Block Diagram www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 3/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ Description of Block(s) (1) VCC protection This IC incorporates VCC UVLO (Under Voltage Lock Out) of the VCC pin. Switching stops at the time of VCC voltage drop. (2) Power Factor Correction The power factor improvement circuit is a voltage control method of Boundary Conduction Mode. The outline operation circuit diagram is shown in Figure 4. The switching operation is shown in Figure 5. Switching Operation 1. MOSFET is turned on, and IL increases 2. The IC compares VEO with Vramp, and MOSFET is off when the Vramp voltage higher than VEO 3. MOSFET is off, and IL decreases 4. The IC detects a zero point of the IL in ZCD and turns on MOSFET Auxiliary winding for zero current detection IL Diode Bridge PFC OUT ACIN FRD MOSFET OUT ZCD PFC OUT Feedback Resistance VS EO CS GND RCS GND OCP detected Resistance Figure 4. Operation circuit outline OUT (Gate) MOSFET (Vds) IL V EO Vramp (Internal) VZCD 1 2 3 4 Figure 5. Switching operation timing chart www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 4/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ (3) About ErrAMP (3-1) gmAMP The VS pin monitors a divided voltage of the output voltage. The ripple voltage of AC frequency (50Hz/60Hz) overlaps with VS pin. gmAMP removes this ripple voltage. gmAMP compares VAMP (2.5V typ.) with the divided voltage of the output voltage, gmAMP controls the EO voltage by this gap. When EO pin voltage rises, ON width of the OUT pin becomes wide. When the EO voltage less than about 0.7V, the IC stops switching. Therefore it can stop switching operation when EO pin connects to the GND. External parts value of EO pin should be set that the ripple voltage of AC frequency does not conduct to EO pin. And, please confirm it by real board. PFC Output VS + 2.50V EO_ VSEO Figure 6. gmAMP block diagram (3-2) VS short protection VS pin has a short protection function. A state of PFC output voltage < VSHORT (0.3V typ.) continues more than TVS_SH (150us typ.), it stops switching. It shows operation in Figure 7. PFC output Vout VS V SHORT T VS_SH OUT Switching stop Figure 7. Operation of VS short protection (3-3) VS low voltage gain increase function When output voltage decreases by output load sudden changes, an output voltage drop period becomes long because a voltage control loop is slow. VS pin voltage becomes lower than VGUP (2.25V typ.) (equivalent to -10% of output voltage), the error amplifier increases a gain. By this operation, ON width of OUT increases and prevents a long-term drop of the output voltage. When VS pin voltage rises from VGUP(2.25V typ.), this operation stops. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 5/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ (3-4) VS overvoltage gain increase function (Dynamic OVP) When output voltage rises by startup or a rapid change of the output load, output voltage rises for a long term because a voltage control loop is slow. VS pin voltage becomes higher than VOVP (2.625V typ.) (equivalent to +5% of output voltage), the error amplifier increases a gain. By this operation, it reduces ON width of OUT and prevents a long-term rise of the output voltage. When VS pin voltage decreases under VOVP(2.625V typ.), this operation stops. (3-5) VS overvoltage protection function (Static OVP) VS pin rises across VOVP, static OVP acts, and VS pin voltage rises from VOVP1(2.7V typ.), it stops switching immediately. VS pin voltage under than VOVP2(2.6V typ.), it starts switching. It shows operation in Figure 8. PFC Output VOVP1 VOVP2 VS Switching stop OUT Figure 8. VS overvoltage protection operation (4) CS overcurrent detection In operation, turn OFF of PFC is usually decided in EO pin voltage. However, when CS pin rises than overcurrent detection voltage (the CS pin threshold voltage) VCS(0.65V typ.), overcurrent protection works. For this protection, OUT pin turn off pulse by pulse. The overcurrent protection limits ON width. The PFC voltage is decrease when this OCP works. Please decide RCS value of PFC so that this protection does not work in rated load with the minimum input voltage at the time of the application design. OUT Control Logic CS Over Current Protection 0.65V CCS RCS Figure 9. CS overcurrent detection www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 6/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ (5) ZCD pin zero current detection The zero current detection circuit is a function to detect a zero cross of the inductor current (IL) (cf. Figure 10). In addition, it recommends that it adds CR filter for switching noise reduction. It inserts R1 for limit the current between auxiliary winding and ZCD pin to use ZCD pin in rating. In addition, Vds of Q1 performs free resonance when inductor current disappears. It can suppress a switching loss and the surge of Q1 by coordinating R1,C1 so that Q1 is turned on in the valley of the resonance wave pattern. D1 C0 OUT Q1 R1 RCS C1 ZCD 0.67/1.8V Control Logic OUT FMAX Figure 10. ZCD circuit Vds Time Figure 11. Drain wave patterns (6) RT pin This pin sets a slope wave pattern formed in the IC inside by external resistance. It shows RT resistor value and relations of the maximum frequency in Figure 12. The maximum ON width on the application is calculated in the following formula. It shows relations of RT resistor value and maximum ON width in Figure 13. TON _ MAX [ s] VAC: Input voltage, L: Inductance, 2 L PO 2 VACMin Po: Max output power, :Efficiency Necessary TON_MAX on application can be check as upper formula. Please set ON width in RT pin more than TONMAX. In addition, the high-speed frequency in the light load is limited in RT pin. The external resistance range of the RT pin is 51k 390k. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 7/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ VCC=15V Figure 12. VCC=15V Relations of RT resistor value and the Max frequency (reference value) Figure 13. Relations of RT resistor value and the Max ON width (reference value) *The graph mentioned above is reference value. After the confirmation of the actual board, please set the fixed number. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 8/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ Operation mode of the protective circuit It shows the operation mode of each protection function in Table 2. Table 2. Operation mode of each protective circuit Protection mode Parameter Contents VCCUVLO Detection method Detect operation Cancellation method Cancellation operation VCC pin low voltage protection VCC<9.0V(typ.) VCC drop OUT stop EO discharge VCC>13.0V(typ.) VCC rise Startup operation VS short protection VS pin short protection VS<0.30V(typ.) VS drop OUT stop VS>0.30V(typ.) VS rise Normal operation VS gain increase VS pin low voltage gain increase VS<2.25V(typ.) VS drop GM amplifier GAIN increase VS>2.25V(typ.) VS rise Normal operation VS Dynamic OVP VS pin overvoltage protection 1 VS>2.625V(typ.) VS rise GM amplifier GAIN increase VS<2.625V(typ.) VS drop Normal operation VS Static OVP VS pin overvoltage protection 2 VS>2.700V(typ.) VS rise OUT stop VS<2.600V(typ.) VS drop Normal operation www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 9/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ Absolute Maximum Ratings (Ta = 25C) Parameter Symbol Rating Unit Condition Max Voltage 1 Vmax1 -0.3 to +28.0 V VCC Max Voltage 2 Vmax2 -0.3 to +15.0 V OUT Max Voltage 3 Vmax3 -0.3 to +6.5 V CS, RT, VS, EO Max Current 1 Izcd1 -10.0 to +10.0 mA ZCD OUT pin output peak current 1 OUT pin output peak current 2 Operation Temperature Range Storage Temperature Range IOUT1 IOUT2 Topr Tstr -0.5 +1.0 -40 to +105 -55 to +150 A A o C o C Source current Sink current Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Thermal Resistance(Note 1) Parameter Thermal Resistance (Typ) Symbol Unit 1s(Note 3) 2s2p(Note 4) JA 149.3 76.9 C/W JT 18 11 C/W SOP-J8 Junction to Ambient Junction to Top Characterization Parameter (Note 2) (Note 1)Based on JESD51-2A(Still-Air) (Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3)Using a PCB board based on JESD51-3. (Note 4)Using a PCB board based on JESD51-7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70m Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70m 74.2mm x 74.2mm 35m 74.2mm x 74.2mm 70m Recommended Operating ConditionsTa=25C Parameter Symbol Supply Voltage VCC Rating 10.026.0 Unit V Condition VCC voltage Recommended range of the external componentTa=25C Parameter VCC pin connection capacity RT pin connection resistance Symbol CVCC RRT www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Range More than 10.0 51 to 390 10/22 Unit uF k TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ Electrical Characteristics (Unless otherwise specified VCC=15V Ta=25C) Parameter Symbol Min Specifications Typ Max Unit Condition [ Circuit Current Circuit Current(ON)1 ION1 - 310 600 uA EO=0.0V, RT=220k Circuit Current (ON)2 ION2 - 380 700 uA EO=3.0V, RT=220k (Switching operation) Start Up Current ION3 - 65 130 uA VCC=12V VUVLO1 VUVLO2 VUVLO3 12.0 8.0 - 13.0 9.0 4.0 14.0 10.0 - V V V VCC rise VCC drop VUVLO3 = VUVLO1 -VUVLO2 IVS - 0.5 - uA VAMP 2.465 2.500 2.535 V VAMP_line -20 -1 - mV TVS 50 75 100 uA/V IEO_source IEO_sink 30 30 50 50 70 70 uA uA VCC10V to 26V EO=2.5V VGUP <VSVOVP VS=1.0V VS=3.5V EO_OFF_TH REO 0.57 2.3 0.67 4.3 0.77 6.3 V k VCC=12V, TMAXDUTY FMAXDUTY VRT 23.4 160 0.90 26.0 220 1.15 28.6 280 1.40 us kHz V Vzcd1 Vzcd2 1.65 0.55 1.80 0.67 1.95 0.79 V V Tzcd1 100 200 - ns Tzcd2 Vih Vil 6.1 -0.3 260 6.7 -0.1 520 7.3 - ns V V Isink=3mA Isource=-3mA TRS 15.0 30.0 45.0 us ZCD=0V VS=EO=2.5V VSHORT 0.200 0.300 0.400 V TVS_SH 50 150 300 us 1.025x VAMP 1.065x VAMP 1.020x VAMP 0.030x VAMP 0.840x VAMP 1.050x VAMP 1.080x VAMP 1.040x VAMP 0.040x VAMP 0.900x VAMP 1.075x VAMP 1.095x VAMP 1.060x VAMP 0.050x VAMP 0.960x VAMP Vcs Hmin Tdelay 0.63 - 0.65 400 150 0.67 700 300 V ns ns VPOUTH VPOUTL RPDOUT 10.8 75 12.0 100 13.2 1.00 125 V V k [ VCC pin protection VCC UVLO Voltage1 VCC UVLO Voltage2 VCC UVLO Hysteresis [ Gm Amplifier Block ] VS pin Pull Up Current Gm Amplifier Reference Voltage 1 Gm Amplifier Line Regulation Gm Amplifier Trans Conductance Gm Amplifier Source Current Gm Amplifier Sink Current [ EO Block ] OFF Threshold Voltage EO Discharge Resistance [ OSC Block ] MAX ON Width MAX Frequency RT Output Voltage [ ZCD Block ] ZCD Threshold Voltage 1 ZCD Threshold Voltage 2 Minimum Detection Pulse Width ZCD Output Delay Input Clamp Voltage (High) Input Clamp Voltage ( Low) [ Restart Block ] Restart Time [ VS Protection Block ] VS Short Protection Detection Voltage VS Shortstop Protection Detection Time VS Overvoltage Gain Increase Voltage VS Overvoltage Protection Detection Voltage 1 VS Overvoltage Protection Detection Voltage 2 VS Overvoltage Protection Detection Voltage Hys VS Low Voltage Gain Increase Voltage [ CS Block ] CS Threshold Voltage Minimum Pulse Output Delay [ OUT Block ] OUT H Voltage OUT L Voltage OUT Pull-down Resistance www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 VOVP VOVP1 VOVP2 VHYS VGUP 11/22 EO=3V RT=220k EO=4V RT=220k EO=0.7V ZCD rise ZCD drop V V VS rise V VS drop V V CS> Vcs IO=-20mA IO=+20mA TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ Typical Performance Curves (Reference data) Figure 14. VCC UVLO voltage1 (VCCUVLO1) vs Ambient temperature (Ta) Figure 15. Gm amplifier reference voltage1 (VAMP) vs Ambient temperature (Ta) Figure 16. Gm amplifier reference voltage1 (VAMP) vs VCC www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 12/22 Figure 17. CS threshold voltage (Vcs) vs Ambient temperature (Ta) TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ Figure 18. OUT pin H voltage (VOUTH) vs VCC Figure 19. EO pin off threshold (EO_OFF_TH) vs Ambient temperature (Ta) Figure 20. Gm amplifier trans conductance (TVS) vs Ambient temperature (Ta) www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 13/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ I/O Equivalence Circuits VS 1 EO 2 RT 3 Internal Reg CS 4 Internal Reg Internal Reg ZCD 5 GND 6 OUT 7 VCC 8 Figure 21. I/O Equivalence Circuits Application Example F1 C1 N TH1 L1 L D1 VOUT + T1 C3 250uH C2 D5 C4 DVCC RVCC 220 DOUT ROUT RSTR1 15 M1 220k ROUTE RSTR2 100 C5 RVSH1 RZCDH 1uF 100k 220k 1.5M RGS1 RVSH2 10k 82k DSTR CEO2 REO CEO1 0.47uF RRT 150k ROCP1 0.18 U1 68k 1uF RCSF CO 220uF VCC VS DZ1 OUT EO BD7690FJ RT GND CS ZCD CVCC2 50uF 1k CVS 1000pF RZCDL 20k RVSL 10k CCSF 100pF CZCD N/A GND GND Figure 22. Application Example 1Output voltage setting The output voltage is decided in resistor value of RVSH and RVSL. RVSH 1582k Vo _ PFC 1 VAMP 1 2.5V 398V RVSL 10k www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 14/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ 2Decision of minimum frequency fsw The switching frequency of PFC fsw _ PFC Vin 2 Vo _ PFC 2 Vin 2 Po _ PFC L Vo _ PFC The frequency is minimized in the minimum input voltage. Slow frequency is effective about loss and noise. However, inductance is large value at low frequency. In addition, it enters the audible band when frequency lowers to 20kHz or less, and sound banging occurs. It designs the minimum frequency as 50kHz this time. 3Calculation of the inductance L _ PFC Vin 2 Vo _ PFC 2 Vin 2 Po _ PFC fsw Vo _ PFC ExVin=AC90V, Vo_PFC=400V, Po_PFC=200W, _PFC=0.9, fsw=50kHz L 248.5uH 250uH 4Calculation of the inductor current Ipk 2 Vin 2 2 Po _ PFC ton 6.98 A L _ PFC Vin 5Calculation of the ON width TON _ MAX [ s] 2 L PO _ PFC V ACMin _ PFC 2 ON width is short at the high AC voltage. Therefore, the ON width is decided with the minimum AC voltage. It recommends RT setting such as the maximum ON width is just covered at the minimum AC voltage. ON width is small when the high AC voltage. And the EO voltage range is small. EO voltage band width is the large then the ON width setting by the RT resistance is short. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 15/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ Attention in the board design About parts placement Please locate the parts in the Fig.23 inside dot line near the IC. In addition, please do parts placement to avoid the interference with switching lines and high current lines such as inductor, DRAIN. F1 TH1 L1 L D1 VOUT + T1 C3 C1 250uH C2 D5 C4 N DVCC RVCC 220 DOUT ROUT RSTR1 15 M1 220k ROUTE RSTR2 100 C5 RVSH1 RZCDH 1uF 100k 220k 1.5M RGS1 RVSH2 10k 82k DSTR CEO2 REO U1 68k 1uF 0.47uF DZ1 OUT EO RRT BD7690FJ 150k ROCP1 CO 220uF VCC VS CEO1 RCSF RT GND CS ZCD CVCC2 50uF 1k 0.18 CVS 1000pF RVSL RZCDL CCSF 10k 20k 100pF CZCD N/A GND GND Figure 23. Parts placement About GND wiring guidance The red line of Fig.24 becomes the GND lines which large current flows. Each line independence wires it, and please wire it briefly and thickly. A blue line is ICGND. Please make a common use ICGND and GND of IC outskirts parts. F1 C1 N TH1 L1 L D1 VOUT + T1 C3 250uH C2 D5 C4 DVCC RVCC 220 DOUT ROUT RSTR1 15 M1 220k ROUTE RSTR2 100 C5 RVSH1 RZCDH 1uF 100k 220k 1.5M RGS1 RVSH2 10k 82k DSTR CEO2 REO CEO1 0.47uF RRT 150k ROCP1 0.18 U1 68k 1uF RCSF CO 220uF VCC VS DZ1 OUT EO BD7690FJ RT GND CS ZCD CVCC2 50uF 1k CVS 1000pF RZCDL 20k RVSL 10k CCSF 100pF CZCD N/A GND GND Figure 24. GND line layout www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 16/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ About large current line Large circuit current flows through the part of the red line of Fig.25. Please wire it briefly and thickly. Please do not place IC and high impedance line near red line. Because red line is very noisy. F1 C1 N TH1 L1 L D1 VOUT + T1 C3 250uH C2 D5 C4 DVCC RVCC 220 DOUT ROUT RSTR1 15 M1 220k ROUTE RSTR2 100 C5 RVSH1 RZCDH 1uF 100k 220k 1.5M RGS1 RVSH2 10k 82k DSTR CEO2 REO CEO1 0.47uF RRT 150k ROCP1 0.18 U1 68k 1uF RCSF CO 220uF VCC VS DZ1 OUT EO BD7690FJ RT GND CS ZCD CVCC2 50uF 1k CVS 1000pF RZCDL 20k RVSL 10k CCSF 100pF CZCD N/A GND GND Figure 25. High current line layout www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 17/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 18/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B GND Parasitic Elements GND GND N Region close-by GND Figure xx. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 17. Disturbance light In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 19/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ Ordering Information B D 7 6 9 Part Number 0 F J - Package FJ:SOP-J8 E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagrams SOP-J8(TOP VIEW) Part Number Marking D 7 6 9 0 LOT Number 1PIN MARK Part Number Marking D7690 www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Package SOP-J8 Orderable Part Number BD7690FJ-E2 20/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 SOP-J8 21/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 BD7690FJ Revision History Date Revision 23. Jan. 2017 27. Mar. 2017 001 002 Changes Release p.11 Add electrical characteristics www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 22/22 TSZ02201-0F2F0A200280-1-2 27. Mar. 2017 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bd7690fj - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bd7690fj SOP-J8 2500 2500 Taping inquiry Yes