2SC0535T2Ax-33
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2SC0535T2Ax-33 Preliminary Datasheet
Dual-Channel Cost-Efficient SCALE™-2 IGBT Driver Core for 3300V IGBTs
Abstract
The cost-efficient SCALE™-2 dual-driver core 2SC0535T2Ax-33 combines unrivalled compactness with broad
applicability. The driver is designed for universal applications requiring high reliability. The 2SC0535T2Ax-33
drives all usual high-power IGBT modules up to 3300V. Its embedded paralleling capability allows easy
inverter design covering higher power ratings. Multi-level topologies involving 1700V IGBTs with higher
isolation requirements can also be easily supported by 2SC0535T2Ax-33.
The 2SC0535T2Ax-33 combines a complete two-channel driver core with all components required for driving,
such as an isolated DC/DC converter, short-circuit protection, Advanced Active Clamping as well as supply
voltage monitoring. Each of the two output channels is electrically isolated from the primary side and from the
other secondary channel.
An output current of 35A and 5W drive power is available per channel, making the 2SC0535T2Ax-33 an ideal
driver platform for universal use in medium and high-power applications. The driver provides a gate voltage
swing of 15V/-10V. The turn-on voltage is regulated to maintain a stable 15V regardless of the output power
level.
Its outstanding EMC allows safe and reliable operation even in hard industrial applications.
Product Highlights Applications
Ultra-compact dual-channel driver Traction
Highly integrated SCALE-2 chipset Railroad power supplies
Gate current ±35A, 5W output power per channel Light rail vehicles
15V/-10V gate driving HVDC
Blocking voltages up to 3300V Flexible AC transmission systems (FACTS)
Safe isolation to EN 50178 and EN 50124 Medium-voltage converters
Short delay and low jitter Wind-power converters
Interface for 3.3V...15V logic level Industrial drives
UL compliant Medical applications
2SC0535T2Ax-33
Preliminary Data Sheet
www.IGBT-Driver.com Page 2
Safety Notice!
The data contained in this data sheet is intended exclusively for technically trained staff. Handling all high-
voltage equipment involves risk to life. Strict compliance with the respective safety regulations is mandatory!
Any handling of electronic devices is subject to the general specifications for protecting electrostatic-sensitive
devices according to international standard IEC 60747-1, Chapter IX or European standard EN 100015 (i.e. the
workplace, tools, etc. must comply with these standards). Otherwise, this product may be damaged.
Important Product Documentation
This data sheet contains only product-specific data. For a detailed description, must-read application notes and
important information that apply to this product, please refer to “2SC0535T Description & Application Manual”
on www.igbt-driver.com/go/2SC0535T
Absolute Maximum Ratings
Parameter Remarks Min Max Unit
Supply voltage VDC VDC to GND 0 16 V
Supply voltage VCC VCC to GND 0 16 V
Logic input and output voltages Primary side, to GND -0.5 VCC+0.5 V
SOx current Failure condition, total current 20 mA
Gate peak current Iout Note 1 -35 +35 A
External gate resistance Turn-on and turn-off 0.5 Ω
Average supply current IDC Notes 2, 3 1250 mA
Output power Ambient temperature <70°C (Notes 4, 5) 7.5 W
Ambient temperature <85°C (Note 4) 5 W
Switching frequency F 100 kHz
Test voltage (50Hz/1min.) Primary to secondary (Note 15) 9100 VAC(eff)
Secondary to secondary (Note 15) 6000 VAC(eff)
|dV/dt| Rate of change of input to output voltage (Note 11) 50 kV/μs
Operating voltage Primary/secondary, secondary/secondary 3300 Vpeak
Operating temperature Notes 5, 18 -40 +85 °C
Storage temperature -55 +90 °C
2SC0535T2Ax-33
Preliminary Data Sheet
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Recommended Operating Conditions
Power Supply Remarks Min Typ Max Unit
Supply voltage
VDC VDC to GND, IGBT mode 14.5 15 15.5 V
Supply voltage
VCC VCC to GND 14.5 15 15.5 V
Electrical Characteristics (IGBT mode)
All data refer to +25°C and VCC = VDC
= 15V unless otherwise specified.
Power supply Remarks Min Typ Max Unit
Supply current IDC Without load 70 mA
Supply current ICC F = 0Hz 25 mA
Supply current ICC F = 100kHz 34 mA
Coupling capacitance Cio Primary to output, total 19 pF
Power Supply Monitoring Remarks Min Typ Max Unit
Supply threshold VCC Primary side, clear fault 11.9 12.6 13.3 V
Primary side, set fault (Note 12) 11.3 12.0 12.7 V
Monitoring hysteresis Primary side, set/clear fault 0.35 V
Supply threshold VISOx-VEx Secondary side, clear fault 12.1 12.6 13.1 V
Secondary side, set fault (Note 13) 11.5 12.0 12.5 V
Monitoring hysteresis Secondary side, set/clear fault 0.35 V
Supply threshold VEx-VCOMx Secondary side, clear fault 5 5.15 5.3 V
Secondary side, set fault (Note 13) 4.7 4.85 5 V
Monitoring hysteresis Secondary side, set/clear fault 0.15 V
Logic Inputs and Outputs Remarks Min Typ Max Unit
Input bias current V(INx) > 3V 190 µA
Turn-on threshold V(INx) 2.6 V
Turn-off threshold V(INx) 1.3 V
SOx output voltage Failure condition, I(SOx)<20mA 0.7 V
Short-Circuit Protection Remarks Min Typ Max Unit
Current through pin REFx R(REFx, VEx)<70kΩ 150 µA
Minimum response time Note 9 1.5 µs
Minimum blocking time Note 10 9 µs
2SC0535T2Ax-33
Preliminary Data Sheet
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Timing Characteristics Remarks Min Typ Max Unit
Turn-on delay td(on) Note 6 70 ns
Turn-off delay td(off) Note 6 70 ns
Jitter of turn-on delay Note 17 ±2 ns
Jitter of turn-off delay Note 17 ±2 ns
Output rise time tr(out) Note 7 20 ns
Output fall time tf(out) Note 7 25 ns
Transmission delay of fault state Note 14 400 ns
Electrical Isolation Remarks Min Typ Max Unit
Test voltage (50Hz/1s) Primary to secondary side (Note 15) 9100 9150 9200 Veff
Secondary to secondary side (Note 15) 6000 6050 6100 Veff
Partial discharge extinction volt. Primary to secondary side (Note 16) 4125 Vpeak
Secondary to secondary side (Note 16) 3300 Vpeak
Creepage distance
On the PCB Primary to secondary side 44 mm
(Material group IIIa) Secondary to secondary side 22 mm
On the transformer Primary to secondary side 29 mm
(Material group I) Secondary to secondary side 25 mm
Clearance distance Primary to secondary side 25 mm
Secondary to secondary side 14 mm
Output Remarks Min Typ Max Unit
Blocking capacitance VISOx to VEx (Note 8) 9.4 µF
VEx to COMx (Note 8) 9.4 µF
Output voltage swing
The output voltage swing consists of two distinct segments. First, there is the turn-on voltage VGHx between
pins GHx and VEx. VGHx is regulated and maintained at a constant level for all output power values and
frequencies.
The second segment of the output voltage swing is the turn-off voltage VGLx. VGLx is measured between pins
GLx and VEx. It is a negative voltage. It changes with the output power to accommodate the inevitable
voltage drop across the internal DC/DC converter.
2SC0535T2Ax-33
Preliminary Data Sheet
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Output Voltage Remarks Min Typ Max Unit
Turn-on voltage, VGHx Any load condition 15.0 V
Turn-off voltage, VGLx No load -10.8 V
Turn-off voltage, VGLx 5W output power -9 V
Turn-off voltage, VGLx 7.5W output power -8.5 V
Footnotes to the Key Data
1) The maximum peak gate current refers to the highest current level occurring during the product
lifetime. It is an absolute value and does also apply for short pulses.
2) The average supply input current is limited for thermal reasons. Higher values than specified by the
absolute maximum rating are permissible (e.g. during power supply start up) if the average remains
below the given value, provided the average is taken over a time period which is shorter than the
thermal time constants of the driver in the application.
3) There is no means of actively controlling or limiting the input current in the driver. In the case of
start-up with very high blocking capacitor values, or in case of short circuit at the output, the supply
input current has to be limited externally.
4) The maximum output power must not be exceeded at any time during operation. The absolute
maximum rating must also be observed for time periods shorter than the thermal time constants of
the driver in the application.
5) An extended output power range is specified in the output power section for maximum ambient
temperatures of 70°C. In that case, the absolute maximum rating for the operating temperature
changes to (–40°C - 70°C) and the absolute maximum output power rating changes to 7.5W.
6) The delay time is measured between 50% of the input signal and 10% voltage swing of the
corresponding output. The delay time is independent on the output loading.
7) Output rise and fall times are measured between 10% and 90% of the nominal output swing with an
output load of 4.7Ω and 270nF. The values are given for the driver side of the gate resistors. The time
constant of the output load in conjunction with the present gate resistors leads to an additional delay
at the load side of the gate resistors.
8) External blocking capacitors should be placed between the VISOx and VEx as well as the VEx and
COMx terminals. Refer to “2SC0535T Description & Application Manual” (paragraph “DC/DC output
(VISOx), emitter (VEx) and COMx terminals)” for recommendations. Ceramic capacitors are
recommended.
9) The minimum response time is valid for the circuit given in the description and application manual
with the values of the corresponding tables.
10) The blocking time sets a minimum time span between the end of any secondary-side fault state and
the start of normal operation (remove fault from pin SOx). The value of the blocking time can be
adjusted at pin TB. The specified blocking time is valid if TB is connected to GND.
11) This specification guarantees that the drive information will be transferred reliably even at a high DC-
link voltage and with ultra-fast switching operations.
12) Undervoltage monitoring of the primary-side supply voltage (VCC to GND). If the voltage drops below
this limit, a fault is transmitted to both SOx outputs and the power semiconductors are switched off.
13) Undervoltage monitoring of the secondary-side supply voltage (VISOx to VEx and VEx to COMx which
correspond with the approximate turn-on and turn-off gate-emitter voltages). If the corresponding
voltage drops below this limit, the IGBT is switched off and a fault is transmitted to the corresponding
SOx output.
14) Transmission delay of fault state from the secondary side to the corresponding primary-side status
output.
15) HiPot testing (= dielectric testing) must generally be restricted to suitable components. This gate
driver is suited for HiPot testing. Nevertheless, it is strongly recommended to limit the testing time to
1s slots as stipulated by EN 50178. Excessive HiPot testing at voltages much higher than 2330VAC(eff)
may lead to insulation degradation. No degradation has been observed over 1min. testing at
2SC0535T2Ax-33
Preliminary Data Sheet
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9100VAC(eff). Every production sample shipped to customers has undergone 100% testing at the given
value for 1s.
16) Partial discharge measurement is performed in accordance with IEC 60270 and isolation coordination
specified in EN 50178. The partial discharge extinction voltage between primary and either secondary
side is coordinated for safe isolation to EN 50178.
17) Jitter measurements are performed with input signals INx switching between 0V and 5V referred to
GND, with a corresponding rise time and fall time of 15ns.
18) The minimum operating temperature is limited to -40°C for the first series. This will be extended
to -55°C upon completion of the ongoing qualification program.
Legal Disclaimer
This data sheet specifies devices but cannot promise to deliver any specific characteristics. No warranty or
guarantee is given – either expressly or implicitly – regarding delivery, performance or suitability.
CT-Concept Technologie GmbH reserves the right to make modifications to its technical data and product
specifications at any time without prior notice. The general terms and conditions of delivery of CT-Concept
Technologie GmbH apply.
2SC0535T2Ax-33
Preliminary Data Sheet
www.IGBT-Driver.com Page 7
Ordering Information
The general terms and conditions of delivery of CT-Concept Technologie GmbH apply.
Type Designation Description
2SC0535T2A0-33 Dual-channel 3.3kV SCALE-2 driver core
Product home page: www.IGBT-Driver.com/go/2SC0535T
Refer to www.IGBT-Driver.com/go/nomenclature for information on driver nomenclature
Information about Other Products
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Please click: www.IGBT-Driver.com
Manufacturer
CT-Concept Technologie GmbH
A Power Integrations Company
Johann-Renfer-Strasse 15
2504 Biel-Bienne
Switzerland
Phone +41 - 32 - 344 47 47
Fax +41 - 32 - 344 47 40
E-mail Info@IGBT-Driver.com
Internet www.IGBT-Driver.com
© 2011…2014 CT-Concept Technologie GmbH - Switzerland. All rights reserved.
We reserve the right to make any technical modifications without prior notice. Version 2.0 from 2014-03-31
