MC34164, MC33164, NCV33164 Micropower Undervoltage Sensing Circuits The MC34164 series are undervoltage sensing circuits specifically designed for use as reset controllers in portable microprocessor based systems where extended battery life is required. These devices offer the designer an economical solution for low voltage detection with a single external resistor. The MC34164 series features a bandgap reference, a comparator with precise thresholds and built-in hysteresis to prevent erratic reset operation, an open collector reset output capable of sinking in excess of 6.0 mA, and guaranteed operation down to 1.0 V input with extremely low standby current. The MC devices are packaged in 3-pin TO-226AA, 8-pin SO-8 and Micro8 surface mount packages. The NCV device is packaged in SO-8. Applications include direct monitoring of the 3.0 or 5.0 V MPU/logic power supply used in appliance, automotive, consumer, and industrial equipment. * Temperature Compensated Reference * Monitors 3.0 V (MC34164-3) or 5.0 V (MC34164-5) Power Supplies * Precise Comparator Thresholds Guaranteed Over Temperature * Comparator Hysteresis Prevents Erratic Reset * Reset Output Capable of Sinking in Excess of 6.0 mA * Internal Clamp Diode for Discharging Delay Capacitor * Guaranteed Reset Operation With 1.0 V Input * Extremely Low Standby Current: As Low as 9.0 A * Economical TO-226AA, SO-8 and Micro8 Surface Mount Packages Input 2 (2) http://onsemi.com TO-226AA P SUFFIX CASE 29 1 2 3 8 1 8 1 SO-8 D SUFFIX CASE 751 Micro8 DM SUFFIX CASE 846A PIN CONNECTIONS Reset 1 8 N.C. Input 2 7 N.C. N.C. 3 6 N.C. Ground 4 5 N.C. (Top View) Reset ORDERING INFORMATION 1 (1) See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 7 of this data sheet. 1.2 Vref Gnd 3 (4) = Sink Only Positive True Logic Pin numbers adjacent to terminals are for the 3-pin TO-226AA package. Pin numbers in parenthesis are for the 8-lead packages. This device contains 28 active transistors. Figure 1. Representative Block Diagram Semiconductor Components Industries, LLC, 2002 October, 2002 - Rev. 8 1 Publication Order Number: MC34164/D MC34164, MC33164, NCV33164 MAXIMUM RATINGS Symbol Value Unit Power Input Supply Voltage Rating Vin -1.0 to 12 V Reset Output Voltage VO -1.0 to 12 V Reset Output Sink Current ISink Internally Limited mA IF 100 mA PD RJA 700 178 mW C/W PD RJA 700 178 mW C/W PD RJA 520 240 mW C/W Operating Junction Temperature TJ +150 C Operating Ambient Temperature Range MC34164 Series MC33164 Series, NCV33164 TA Storage Temperature Range Tstg Clamp Diode Forward Current, Pin 1 to 2 (Note 1) Power Dissipation and Thermal Characteristics P Suffix, Plastic Package Maximum Power Dissipation @ TA = 25C Thermal Resistance, Junction-to-Air D Suffix, Plastic Package Maximum Power Dissipation @ TA = 25C Thermal Resistance, Junction-to-Air DM Suffix, Plastic Package Maximum Power Dissipation @ TA = 25C Thermal Resistance, Junction-to-Air NOTE: C 0 to +70 - 40 to +125 C - 65 to +150 ESD data available upon request. MC34164-3, MC33164-3 SERIES ELECTRICAL CHARACTERISTICS (For typical values TA = 25C, for min/max values TA is the operating ambient temperature range that applies [Notes 2 & 3], unless otherwise noted.) Characteristic Symbol Min Typ Max Unit VIH VIL VH 2.55 2.55 0.03 2.71 2.65 0.06 2.80 2.80 - - - 0.14 0.1 0.4 0.3 6.0 12 30 - - 0.02 0.02 0.5 1.0 VF 0.6 0.9 1.2 V Operating Input Voltage Range Vin 1.0 to 10 - - V Quiescent Input Current Vin = 3.0 V Vin = 6.0 V Iin - - 9.0 24 15 40 COMPARATOR Threshold Voltage High State Output (Vin Increasing) Low State Output (Vin Decreasing) Hysteresis (ISink = 100 A) V RESET OUTPUT Output Sink Saturation (Vin = 2.4 V, ISink = 1.0 mA) (Vin = 1.0 V, ISink = 0.25 mA) VOL Output Sink Current (Vin, Reset = 2.4 V) ISink V Output Off-State Leakage (Vin, Reset = 3.0 V) (Vin, Reset = 10 V) Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 5.0 mA) mA A IR(leak) TOTAL DEVICE A 1. Maximum package power dissipation limits must be observed. 2. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 3. Tlow = 0C for MC34164 Thigh = +70C for MC34164 = - 40C for MC33164 = +125C for MC33164 http://onsemi.com 2 MC34164, MC33164, NCV33164 MC34164-5, MC33164-5 SERIES, NCV33164-5 ELECTRICAL CHARACTERISTICS (For typical values TA = 25C, for min/max values TA is the operating ambient temperature range that applies [Notes 5 & 6], unless otherwise noted.) Characteristic Symbol Min Typ Max VIH VIL VH 4.15 4.15 0.02 4.33 4.27 0.09 4.45 4.45 - - - 0.14 0.1 0.4 0.3 7.0 20 50 - - 0.02 0.02 0.5 2.0 VF 0.6 0.9 1.2 Operating Input Voltage Range Vin 1.0 to 10 - - Quiescent Input Current Vin = 5.0 V Vin = 10 V Iin Unit COMPARATOR Threshold Voltage High State Output (Vin Increasing) Low State Output (Vin Decreasing) Hysteresis (ISink = 100 A) V RESET OUTPUT Output Sink Saturation (Vin = 4.0 V, ISink = 1.0 mA) (Vin = 1.0 V, ISink = 0.25 mA) VOL Output Sink Current (Vin, Reset = 4.0 V) V ISink mA A IR(leak) Output Off-State Leakage (Vin, Reset = 5.0 V) (Vin, Reset = 10 V) Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 5.0 mA) V TOTAL DEVICE V A - - 12 32 20 50 4. Maximum package power dissipation limits must be observed. 5. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 6. Tlow = 0C for MC34164 Thigh = +70C for MC34164 = - 40C for MC33164, NCV33164 = +125C for MC33164, NCV33164 7. NCV prefix is for automotive and other applications requiring site and change control. 10 RL = 82 k to Vin TA = 25C 8.0 VO , OUTPUT VOLTAGE (V) VO , OUTPUT VOLTAGE (V) 10 6.0 4.0 2.0 0 0 2.0 4.0 6.0 8.0 6.0 4.0 2.0 0 10 RL = 82 k to Vin TA = 25C 8.0 0 2.0 4.0 6.0 8.0 Vin, INPUT VOLTAGE (V) Vin, INPUT VOLTAGE (V) Figure 1. MC3X164-3 Reset Output Voltage versus Input Voltage Figure 2. MC3X164-5 Reset Output Voltage versus Input Voltage http://onsemi.com 3 10 5.0 5.0 4.0 4.0 V O , OUTPUT VOLTAGE (V) V O , OUTPUT VOLTAGE (V) MC34164, MC33164, NCV33164 3.0 2.0 1.0 3.0 2.0 1.0 RL = 82 k to Vin TA = 25C 0 2.62 2.66 2.70 2.74 RL = 82 k to Vin TA = 25C 0 4.22 2.78 4.26 Vin, INPUT VOLTAGE (V) Figure 3. MC3X164-3 Reset Output Voltage versus Input Voltage Upper Threshold High State Output 2.72 V in , THRESHOLD VOLTAGE (V) V in , THRESHOLD VOLTAGE (V) 4.38 4.36 2.68 2.64 Lower Threshold Low State Output 2.60 -50 -25 0 25 50 75 100 Upper Threshold High State Output 4.32 4.28 4.24 Lower Threshold Low State Output 4.20 -50 125 -25 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (C) TA, AMBIENT TEMPERATURE (C) Figure 5. MC3X164-3 Comparator Threshold Voltage versus Temperature Figure 6. MC3X164-5 Comparator Threshold Voltage versus Temperature 50 50 TA = 25C 40 I in, INPUT CURRENT ( A) I in, INPUT CURRENT ( A) 4.34 Figure 4. MC3X164-5 Reset Output Voltage versus Input Voltage 2.76 30 TA = 0C 20 TA = 70C 10 0 4.30 Vin, INPUT VOLTAGE (V) 0 2.0 4.0 6.0 8.0 40 20 TA = 0C TA = 70C 10 0 10 TA = 25C 30 0 2.0 4.0 6.0 8.0 Vin, INPUT VOLTAGE (V) Vin, INPUT VOLTAGE (V) Figure 7. MC3X164-3 Input Current versus Input Voltage Figure 8. MC3X164-5 Input Current versus Input Voltage http://onsemi.com 4 10 MC34164, MC33164, NCV33164 4.0 Vin = 2.4 V 3.0 V OL, OUTPUT SATURATION (V) V OL, OUTPUT SATURATION (V) 4.0 TA = 70C TA = 25C 2.0 TA = 0C 1.0 0 TA = 0C TA = 25C TA = 70C 0 4.0 8.0 12 TA = 70C 3.0 TA = 0C TA = 25C 2.0 TA = 0C 1.0 0 20 16 TA = 25C Vin, Reset = 4 V TA = 70C 0 4.0 8.0 12 16 VSink, SINK CURRENT (mA) ISink, SINK CURRENT (mA) Figure 9. MC3X164-3 Reset Output Saturation versus Sink Current Figure 10. MC3X164-5 Reset Output Saturation versus Sink Current I F , FORWARD CURRENT (mA) 32 Vin = 5.0 V to 4.0 V RL = 43 k TA = 25C Reset Vin = 0 V TA = 25C 24 90% 16 4.0 V 8.0 0 Vin 5.0 V 10 % Vin 43k 5.0V 4.0V Reset Ref 0 0.4 0.8 1.2 1.6 5.0 s/DIV VF , FORWARD VOLTAGE (V) Figure 11. Clamp Diode Forward Current versus Voltage Figure 12. Reset Delay Time (MC3X164-5 Shown) R 2 (2) Power Supply Reset 1 (1) CDLY 1.2 Vref tDLY = RCDLY In 3 (4) Microprocessor Circuit 1- 1 Vth(MPU) Vin A time delayed reset can be accomplished with the addition of CDLY. For systems with extremely fast power supply rise times (<500 ns) it is recommended that the RCDLY time constant be greater than 5.0 s. Vth(MPU) is the microprocessor reset input threshold. Figure 13. Low Voltage Microprocessor Reset http://onsemi.com 5 20 MC34164, MC33164, NCV33164 Test Data RH Iin Power Supply 2 (2) Vin RL 1.2 Vref MC3X164-5 Microprocessor Circuit Reset 1 (1) VH 4.3 RH + 0.06 RL Vth(lower) 10 RH x 10-6 3 (4) where: RH 1.0 k 43 k RL 4.3 k VH (mV) Vth (mV) RH () RL (k) 60 103 123 160 155 199 280 262 306 357 421 530 0 1.0 1.0 1.0 2.2 2.2 2.2 4.7 4.7 4.7 4.7 4.7 0 100 100 100 220 220 220 470 470 470 470 470 43 10 6.8 4.3 10 6.8 4.3 10 8.2 6.8 5.6 4.3 Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been simplified and does not account for the change of input current Iin as Vin crosses the comparator threshold (Figure 8). An increase of the lower threshold Vth(lower) will be observed due to Iin which is typically 10 A at 4.3 V. The equations are accurate to 10% with RH less than 1.0 k and RL between 4.3 k and 43 k. Figure 14. Low Voltage Microprocessor Reset With Additional Hysteresis (MC3X164-5 Shown) 2 (2) 1.0 k 2 (2) Power Supply 1 (1) 1 (1) 1.2 Vref 1.2 Vref Solar Cells 3 (4) 3 (4) Figure 15. Voltage Monitor Figure 16. Solar Powered Battery Charger VCC RL MTP3055EL 270 4.3V 2 (2) 1 (1) Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above circuit. When the input signal is below the 4.3 V threshold of the MC3X164-5, its output grounds the gate of the L2 MOSFET. 1.2 Vref 3 (4) MC3X164-5 Figure 17. MOSFET Low Voltage Gate Drive Protection Using the MC3X164-5 http://onsemi.com 6 MC34164, MC33164, NCV33164 ORDERING INFORMATION Device Package Shipping MC33164D-3 SO-8 98 Units / Rail MC33164D-3R2 SO-8 2500 Units / Tape & Reel MC33164DM-3R2 Micro8 4000 Units / Tape & Reel MC33164P-3 TO-92 2000 Units / Box MC33164P-3RA TO-92 2000 Units / Tape & Reel MC33164P-3RP TO-92 2000 Units / Pack MC33164D-5 SO-8 98 Units / Rail MC33164D-5R2 SO-8 2500 Units / Tape & Reel NCV33164D-5R2* SO-8 2500 Units / Tape & Reel MC33164DM-5R2 Micro8 4000 Units / Tape & Reel MC33164P-5 TO-92 2000 Units / Box MC33164P-5RA TO-92 2000 Units / Tape & Reel MC33164P-5RP TO-92 2000 Units / Pack MC34164D-3 SO-8 98 Units / Rail MC34164D-3R2 SO-8 2500 Units / Tape & Reel MC34164DM-3R2 Micro8 4000 Units / Tape & Reel MC334164P-3 TO-92 2000 Units / Box MC34164P-3RP TO-92 2000 Units / Pack MC34164D-5 SO-8 98 Units / Rail MC34164D-5R2 SO-8 2500 Units / Tape & Reel MC34164DM-5R2 Micro8 4000 Units / Tape & Reel MC334164P-5 TO-92 2000 Units / Box MC34164P-5RA TO-92 2000 Units / Tape & Reel MC34164P-5RP TO-92 2000 Units / Pack *NCV33164: Tlow = -40C, Thigh = +125C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. MARKING DIAGRAMS SO-8 D SUFFIX CASE 751 8 Micro8 MC33164DM CASE 846A 8 3x164 ALYWy Micro8 MC34164DM CASE 846A 8 Mlx0 YWW AWL TO-92 MC3x164P-y CASE 29 TO-92 MC3x164P-yRA MC3x164P-yRP CASE 29 MC3x1 64Py YWW MC3x1 64P-y YWW 123 123 Mly0 YWW AWL 1 1 1 x = Device Number 3 or 5 y = Suffix Number 3 or 5 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week http://onsemi.com 7 MC34164, MC33164, NCV33164 PACKAGE DIMENSIONS TO-226AA P SUFFIX CASE 29-11 ISSUE AL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. B R P L SEATING PLANE K DIM A B C D G H J K L N P R V D X X G J H V C SECTION X-X 1 N INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --0.250 --0.080 0.105 --0.100 0.115 --0.135 --- MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --6.35 --2.04 2.66 --2.54 2.93 --3.43 --- N SO-8 D SUFFIX CASE 751-07 ISSUE AA NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDAARD IS 751-07 -X- A 8 5 0.25 (0.010) S B 1 M Y M 4 K -Y- G C N X 45 SEATING PLANE -Z- 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M S http://onsemi.com 8 J DIM A B C D G H J K M N S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 8 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 8 0.010 0.020 0.228 0.244 MC34164, MC33164, NCV33164 PACKAGE DIMENSIONS Micro8 DM SUFFIX CASE 846A-02 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A-01 OBSOLETE, NEW STANDARD 846A-02. -A- -B- K PIN 1 ID G D 8 PL 0.08 (0.003) -T- M T B S A S SEATING PLANE 0.038 (0.0015) C H L J http://onsemi.com 9 DIM A B C D G H J K L MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 --1.10 0.25 0.40 0.65 BSC 0.05 0.15 0.13 0.23 4.75 5.05 0.40 0.70 INCHES MIN MAX 0.114 0.122 0.114 0.122 --0.043 0.010 0.016 0.026 BSC 0.002 0.006 0.005 0.009 0.187 0.199 0.016 0.028 MC34164, MC33164, NCV33164 Notes http://onsemi.com 10 MC34164, MC33164, NCV33164 Notes http://onsemi.com 11 MC34164, MC33164, NCV33164 Micro8 is a trademark of International Rectifier. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com JAPAN: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800-282-9855 Toll Free USA/Canada http://onsemi.com 12 MC34164/D