Semiconductor Components Industries, LLC, 2002
October, 2002 – Rev. 8 1Publication Order Number:
MC34164/D
MC34164, MC33164,
NCV33164
Micropower Undervoltage
Sensing Circuits
The MC34164 series are undervoltage sensing circuits specifically
designed for use as reset controllers in portable microprocessor based
systems where extended battery life is required. These devices offer
the designer an economical solution for low voltage detection with a
single external resistor. The MC34164 series features a bandgap
reference, a comparator with precise thresholds and built–in hysteresis
to prevent erratic reset operation, an open collector reset output
capable of sinking in excess of 6.0 mA, and guaranteed operation
down to 1.0 V input with extremely low standby current. The MC
devices are packaged in 3–pin TO–226AA, 8–pin SO–8 and Micro8
surface mount packages. The NCV device is packaged in SO–8.
Applications include direct monitoring of the 3.0 or 5.0 V
MPU/logic power supply used in appliance, automotive, consumer,
and industrial equipment.
•Temperature Compensated Reference
•Monitors 3.0 V (MC34164–3) or 5.0 V (MC34164–5) Power Supplies
•Precise Comparator Thresholds Guaranteed Over Temperature
•Comparator Hysteresis Prevents Erratic Reset
•Reset Output Capable of Sinking in Excess of 6.0 mA
•Internal Clamp Diode for Discharging Delay Capacitor
•Guaranteed Reset Operation With 1.0 V Input
•Extremely Low Standby Current: As Low as 9.0A
•Economical TO–226AA, SO–8 and Micro8 Surface Mount Packages
This device contains 28 active transistors.
Figure 1. Representative Block Diagram
1.2 Vref
2 (2)
1 (1)
3 (4)
Reset
Gnd
Input
=Sink Only
Positive True Logic
Pin numbers adjacent to terminals are for the 3–pin TO–226AA package.
Pin numbers in parenthesis are for the 8–lead packages.
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
ORDERING INFORMATION
SO–8
D SUFFIX
CASE 751
81
Micro8
DM SUFFIX
CASE 846A
81
See general marking information in the device marking
section on page 7 of this data sheet.
DEVICE MARKING INFORMATION
(Top View)
3
1N.C.
Ground
N.C.
N.C.
2
4
8
7
6
5N.C.
N.C.
Input
Reset
PIN CONNECTIONS
123
TO–226AA
P SUFFIX
CASE 29
http://onsemi.com
MC34164, MC33164, NCV33164
http://onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Input Supply Voltage Vin –1.0 to 12 V
Reset Output Voltage VO–1.0 to 12 V
Reset Output Sink Current ISink Internally
Limited mA
Clamp Diode Forward Current, Pin 1 to 2 (Note 1) IF100 mA
Power Dissipation and Thermal Characteristics
P Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction–to–Air
D Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction–to–Air
DM Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction–to–Air
PD
RJA
PD
RJA
PD
RJA
700
178
700
178
520
240
mW
°C/W
mW
°C/W
mW
°C/W
Operating Junction Temperature TJ+150 °C
Operating Ambient Temperature Range
MC34164 Series
MC33164 Series, NCV33164
TA0 to +70
– 40 to +125
°C
Storage Temperature Range Tstg – 65 to +150 °C
NOTE: ESD data available upon request.
MC34164–3, MC33164–3 SERIES
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature
range that applies [Notes 2 & 3], unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
COMPARATOR
Threshold Voltage
High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis (ISink = 100 A)
VIH
VIL
VH
2.55
2.55
0.03
2.71
2.65
0.06
2.80
2.80
–
V
RESET OUTPUT
Output Sink Saturation
(Vin = 2.4 V, ISink = 1.0 mA)
(Vin = 1.0 V, ISink = 0.25 mA)
VOL –
–0.14
0.1 0.4
0.3
V
Output Sink Current (Vin, Reset = 2.4 V) ISink 6.0 12 30 mA
Output Off–State Leakage
(Vin, Reset = 3.0 V)
(Vin, Reset = 10 V)
IR(leak) –
–0.02
0.02 0.5
1.0
A
Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 5.0 mA) VF0.6 0.9 1.2 V
TOTAL DEVICE
Operating Input Voltage Range Vin 1.0 to 10 – – V
Quiescent Input Current
Vin = 3.0 V
Vin = 6.0 V
Iin –
–9.0
24 15
40
A
1. Maximum package power dissipation limits must be observed.
2. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
3. Tlow = 0°C for MC34164 Thigh = +70°C for MC34164
=–40°C for MC33164 = +125°C for MC33164
MC34164, MC33164, NCV33164
http://onsemi.com
3
MC34164–5, MC33164–5 SERIES, NCV33164–5
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature
range that applies [Notes 5 & 6], unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
COMPARATOR
Threshold Voltage
High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis (ISink = 100 A)
VIH
VIL
VH
4.15
4.15
0.02
4.33
4.27
0.09
4.45
4.45
–
V
RESET OUTPUT
Output Sink Saturation
(Vin = 4.0 V, ISink = 1.0 mA)
(Vin = 1.0 V, ISink = 0.25 mA)
VOL –
–0.14
0.1 0.4
0.3
V
Output Sink Current (Vin, Reset = 4.0 V) ISink 7.0 20 50 mA
Output Off–State Leakage
(Vin, Reset = 5.0 V)
(Vin, Reset = 10 V)
IR(leak) –
–0.02
0.02 0.5
2.0
A
Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 5.0 mA) VF0.6 0.9 1.2 V
TOTAL DEVICE
Operating Input Voltage Range Vin 1.0 to 10 – – V
Quiescent Input Current
Vin = 5.0 V
Vin = 10 V
Iin –
–12
32 20
50
A
4. Maximum package power dissipation limits must be observed.
5. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
6. Tlow = 0°C for MC34164 Thigh = +70°C for MC34164
=–40°C for MC33164, NCV33164 = +125°C for MC33164, NCV33164
7. NCV prefix is for automotive and other applications requiring site and change control.
0
Vin, INPUT VOLTAGE (V)
RL = 82 k to Vin
TA = 25°C
2.0 4.0 6.0 8.0 10
VO, OUTPUT VOLTAGE (V)
Figure 1. MC3X164–3 Reset Output
Voltage versus Input Voltage
0
Vin, INPUT VOLTAGE (V)
Figure 2. MC3X164–5 Reset Output
Voltage versus Input Voltage
RL = 82 k to Vin
TA = 25°C
2.0 4.0 6.0 8.0 10
VO, OUTPUT VOLTAGE (V)
10
8.0
6.0
4.0
2.0
0
10
8.0
6.0
4.0
2.0
0
MC34164, MC33164, NCV33164
http://onsemi.com
4
Iin, INPUT CURRENT ( A)
µ
Vin, THRESHOLD VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
Figure 3. MC3X164–3 Reset Output
Voltage versus Input Voltage
-50
TA, AMBIENT TEMPERATURE (°C)
-25 0 25 50 75 100 125
Vin, THRESHOLD VOLTAGE (V)
Upper Threshold
High State Output
Lower Threshold
Low State Output
Figure 4. MC3X164–5 Reset Output
Voltage versus Input Voltage
4.22
Vin, INPUT VOLTAGE (V)
4.26 4.30 4.34 4.38
Figure 5. MC3X164–3 Comparator Threshold
Voltage versus Temperature Figure 6. MC3X164–5 Comparator Threshold
Voltage versus Temperature
Figure 7. MC3X164–3 Input Current
versus Input Voltage
VO,
O
UTPUT V
O
LTA
G
E
(
V
)
Figure 8. MC3X164–5 Input Current
versus Input Voltage
2.62
Vin, INPUT VOLTAGE (V)
RL = 82 k to Vin
TA = 25°C
2.66 2.70 2.74 2.78
-50
TA, AMBIENT TEMPERATURE (°C)
-25 0 25 50 75 100 125
Upper Threshold
High State Output
Lower Threshold
Low State Output
Vin, INPUT VOLTAGE (V)
2.0 4.0 6.0 8.0 10
TA = 0°C
TA = 70°C
Iin, INPUT CURRENT ( A)
µ
0
Vin, INPUT VOLTAGE (V)
2.0 4.0 6.0 8.0 10
RL = 82 k to Vin
TA = 25°C
4.36
4.32
4.28
4.24
4.20
5.0
4.0
3.0
2.0
1.0
0
5.0
4.0
3.0
2.0
1.0
0
2.76
2.72
2.68
2.64
2.60
50
40
30
20
10
00
50
40
30
20
10
0
TA = 25°C
TA = 0°C
TA = 70°C
TA = 25°C
MC34164, MC33164, NCV33164
http://onsemi.com
5
TA = 0°C
VOL, OUTPUT SATURATION (V)
0
ISink, SINK CURRENT (mA)
4.0 8.0 12 16 20
TA = 70°C
TA = 0°C
Vin, Reset = 4 V
Figure 9. MC3X164–3 Reset Output
Saturation versus Sink Current Figure 10. MC3X164–5 Reset Output
Saturation versus Sink Current
Figure 11. Clamp Diode Forward Current
versus Voltage
VOL, OUTPUT SATURATION (V)
Figure 12. Reset Delay Time
(MC3X164–5 Shown)
0
VSink, SINK CURRENT (mA)
4.0 8.0 12 16
, FORWARD VOLTAGE (V)
0.4 0.8 1.2 1.6
IF, FORWARD CURRENT (mA)
20
TA = 25°C
Figure 13. Low Voltage Microprocessor Reset
Power
Supply
1.2 Vref
Microprocessor
Circuit
2 (2) R
1 (1)
3 (4)
Reset
CDLY
A time delayed reset can be accomplished with the addition of CDLY
. For systems with extremely fast power
supply rise times (<500 ns) it is recommended that the RCDLY time constant be greater than 5.0 s. Vth(MPU) is
the microprocessor reset input threshold.
tDLY = RCDLY In 1 –Vth(MPU)
1
Vin

TA = 25°C
TA = 0°C
TA = 70°C
TA = 25°C
Vin = 0 V
TA = 25°C
VF
Vin = 2.4 V
TA = 70°C
TA = 0°C
TA = 25°C
Reset
Vin
Vin = 5.0 V to 4.0 V
RL = 43 k
TA = 25°C
Reset
Vin
5.0V
4.0V
Ref
43k
90%
5.0 V
4.0 V
5.0 s/DIV
10
%
4.0
3.0
2.0
1.0
0
4.0
3.0
2.0
1.0
0
32
24
16
8.0
00
TA = 70°C
MC34164, MC33164, NCV33164
http://onsemi.com
6
Figure 14. Low Voltage Microprocessor Reset With Additional Hysteresis
(MC3X164–5 Shown)
Power
Supply
1.2 Vref
Microprocessor
Circuit
2 (2) RL
1 (1)
3 (4)
Reset
Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been simplified and does not account for the change of input current
Iin as Vin crosses the comparator threshold (Figure 8). An increase of the lower threshold Vth(lower) will be observed due to Iin which is typically 10 A at 4.3 V. The
equations are accurate to ±10% with RH less than 1.0 k and RL between 4.3 k and 43 k.
VH ≈4.3 RH
RH
MC3X164-5
Iin Vin
Test Data
VH
(mV) Vth
(mV) RH
()RL
(k)
60
103
123
160
155
199
280
262
306
357
421
530
0
1.0
1.0
1.0
2.2
2.2
2.2
4.7
4.7
4.7
4.7
4.7
0
100
100
100
220
220
220
470
470
470
470
470
43
10
6.8
4.3
10
6.8
4.3
10
8.2
6.8
5.6
4.3
RL + 0.06
Vth(lower) ≈10 RH x 10-6
where: RH ≤ 1.0 k
43 k ≥ RL ≥ 4.3 k
Figure 15. Voltage Monitor Figure 16. Solar Powered Battery Charger
Figure 17. MOSFET Low Voltage Gate Drive Protection Using the MC3X164–5
1.2 Vref
2 (2)
270
1 (1)
3 (4)
Power
Supply
1.2 Vref
2 (2)
1.0 k
1 (1)
3 (4)
1.2 Vref
2 (2)
1 (1)
3 (4)
Solar
Cells
RL
MTP3055EL
MC3X164-5
VCC
4.3V
Overheating of the logic level power MOSFET due to insufficient
gate voltage can be prevented with the above circuit. When the
input signal is below the 4.3 V threshold of the MC3X164-5, its
output grounds the gate of the L2 MOSFET.
MC34164, MC33164, NCV33164
http://onsemi.com
7
ORDERING INFORMATION
Device Package Shipping
MC33164D–3 SO–8 98 Units / Rail
MC33164D–3R2 SO–8 2500 Units / Tape & Reel
MC33164DM–3R2 Micro8 4000 Units / Tape & Reel
MC33164P–3 TO–92 2000 Units / Box
MC33164P–3RA TO–92 2000 Units / Tape & Reel
MC33164P–3RP TO–92 2000 Units / Pack
MC33164D–5 SO–8 98 Units / Rail
MC33164D–5R2 SO–8 2500 Units / Tape & Reel
NCV33164D–5R2* SO–8 2500 Units / Tape & Reel
MC33164DM–5R2 Micro8 4000 Units / Tape & Reel
MC33164P–5 TO–92 2000 Units / Box
MC33164P–5RA TO–92 2000 Units / Tape & Reel
MC33164P–5RP TO–92 2000 Units / Pack
MC34164D–3 SO–8 98 Units / Rail
MC34164D–3R2 SO–8 2500 Units / Tape & Reel
MC34164DM–3R2 Micro8 4000 Units / Tape & Reel
MC334164P–3 TO–92 2000 Units / Box
MC34164P–3RP TO–92 2000 Units / Pack
MC34164D–5 SO–8 98 Units / Rail
MC34164D–5R2 SO–8 2500 Units / Tape & Reel
MC34164DM–5R2 Micro8 4000 Units / Tape & Reel
MC334164P–5 TO–92 2000 Units / Box
MC34164P–5RA TO–92 2000 Units / Tape & Reel
MC34164P–5RP TO–92 2000 Units / Pack
*NCV33164: Tlow = –40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring
site and change control.
ALYWy
3x164
1
8
SO–8
D SUFFIX
CASE 751
x = Device Number 3 or 5
y = Suffix Number 3 or 5
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W= Work Week
MARKING DIAGRAMS
Micro8
MC33164DM
CASE 846A
Mlx0
YWW
AWL
1
8
TO–92
MC3x164P–y
CASE 29
MC3x1
64Py
YWW
Micro8
MC34164DM
CASE 846A
Mly0
YWW
AWL
1
8
TO–92
MC3x164P–yRA
MC3x164P–yRP
CASE 29
MC3x1
64P–y
YWW
123 123
MC34164, MC33164, NCV33164
http://onsemi.com
8
PACKAGE DIMENSIONS
TO–226AA
P SUFFIX
CASE 29–11
ISSUE AL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
R
A
P
J
L
B
K
G
H
SECTION X–X
C
V
D
N
N
XX
SEATING
PLANE
1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.175 0.205 4.45 5.20
B0.170 0.210 4.32 5.33
C0.125 0.165 3.18 4.19
D0.016 0.021 0.407 0.533
G0.045 0.055 1.15 1.39
H0.095 0.105 2.42 2.66
J0.015 0.020 0.39 0.50
K0.500 --- 12.70 ---
L0.250 --- 6.35 ---
N0.080 0.105 2.04 2.66
P--- 0.100 --- 2.54
R0.115 --- 2.93 ---
V0.135 --- 3.43 ---
SO–8
D SUFFIX
CASE 751–07
ISSUE AA
SEATING
PLANE
1
4
58
N
J
X 45
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. 751-01 THRU 751-06 ARE OBSOLETE. NEW
STANDAARD IS 751-07
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
–X–
–Y–
G
M
Y
M
0.25 (0.010)
–Z–
Y
M
0.25 (0.010) Z SXS
M

MC34164, MC33164, NCV33164
http://onsemi.com
9
PACKAGE DIMENSIONS
Micro8
DM SUFFIX
CASE 846A–02
ISSUE F
S
B
M
0.08 (0.003) A S
TDIM MIN MAX MIN MAX
INCHESMILLIMETERS
A2.90 3.10 0.114 0.122
B2.90 3.10 0.114 0.122
C--- 1.10 --- 0.043
D0.25 0.40 0.010 0.016
G0.65 BSC 0.026 BSC
H0.05 0.15 0.002 0.006
J0.13 0.23 0.005 0.009
K4.75 5.05 0.187 0.199
L0.40 0.70 0.016 0.028
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
–B–
–A–
D
K
G
PIN 1 ID
8 PL
0.038 (0.0015)
–T– SEATING
PLANE
C
HJL
MC34164, MC33164, NCV33164
http://onsemi.com
10
Notes
MC34164, MC33164, NCV33164
http://onsemi.com
11
Notes
MC34164, MC33164, NCV33164
http://onsemi.com
12
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make
changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC
and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
JAPAN: ON Semiconductor, Japan Customer Focus Center
2–9–1 Kamimeguro, Meguro–ku, Tokyo, Japan 153–0051
Phone: 81–3–5773–3850
Email: r14525@onsemi.com
ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local
Sales Representative.
MC34164/D
Micro8 is a trademark of International Rectifier.
Literature Fulfillment:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada
Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada
Email: ONlit@hibbertco.com
N. American Technical Support: 800–282–9855 Toll Free USA/Canada