Features n Small footprint size (0805) and low profile for space-constrained mobile applications n Ultra-low resistance n Symmetrical design n Surface mount packaging for automated assembly n RoHS compliant* and halogen free** n Agency recognition: This MF-PSML series is currently available, although not recommended for new designs. The enhanced MF-PSML/X Series is recommended for new designs. MF-PSML Series - Low Ohmic PTC Resettable Fuses Electrical Characteristics Model MF-PSML075 MF-PSML110 MF-PSML150 MF-PSML175 MF-PSML200 MF-PSML260 MF-PSML300 MF-PSML350 V max. Volts I max. Amps 6 6 6 6 6 6 6 6 50 50 50 50 50 50 50 50 Ihold Itrip Amperes at 23 C Hold Trip 0.75 1.50 1.10 1.80 1.50 3.00 1.75 3.50 2.00 4.00 2.60 5.00 3.00 6.00 3.50 7.00 Resistance Ohms at 23 C RMin. R1Max. 0.020 0.0175 0.015 0.005 0.005 0.003 0.003 0.003 0.300 0.130 0.065 0.055 0.045 0.035 0.030 0.025 Max. Time To Trip Amperes at 23 C Seconds at 23 C 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 0.3 0.3 0.5 0.6 1.0 4.0 5.0 5.0 Tripped Power Dissipation Watts at 23 C Typ. 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 Environmental Characteristics Operating Temperature.......................................... -40 C to +85 C Storage Condition Before Opening................................................. +40 C max. / 70 % RH max. After Opening.................................................... +40 C max. / 10 % RH max. Floor Condition After Opening............................... Consumption within 4 weeks at floor condition +30 C max. / 60 % RH max. Passive Aging........................................................ +85 C, 1000 hours................................................ 10 % typical resistance change Humidity Aging...................................................... +85 C, 85 % R.H. 100 hours................................ 15 % typical resistance change Thermal Shock...................................................... +85 C to -40 C, 20 times..................................... 30 % typical resistance change Solvent Resistance................................................ MIL-STD-202, Method 215.................................... No change Vibration................................................................ MIL-STD-883C, Method 2007.1,............................ No change Condition A Moisture Sensitivity Level (MSL)........................... See Note ESD Classification - HBM...................................... Class 6 Test Procedures And Requirements Test Test Conditions Accept/Reject Criteria Visual/Mech........................................................... Verify dimensions and materials............................ Per MF physical description Resistance............................................................. In still air @ 23 C.................................................. Rmin R R1max Time to Trip............................................................ At specified current, Vmax, 23 C.......................... T max. time to trip (seconds) Hold Current.......................................................... 30 min. at Ihold...................................................... No trip Trip Cycle Life........................................................ Vmax, Imax, 100 cycles......................................... No arcing or burning Trip Endurance...................................................... Vmax, 48 hours...................................................... No arcing or burning Solderability........................................................... 245 C 5 C, 5 seconds...................................... 95 % min. coverage UL File Number..................................................... E174545 TUV Certificate Number........................................ R 50302873 WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov * RoHS Directive 2015/863, Mar 31, 2015 and Annex. **Bourns considers a product to be "halogen free" if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Applications n USB port protection - USB 2.0, 3.0 & OTG n HDMI 1.4 Source protection n PC motherboards - Plug & Play protection n Mobile phones - Battery & port protection n PDAs / digital cameras n Bluetooth(R) earphone power protection n Game console port protection MF-PSML PTC Resettable MF-NSMFSeries Series- -Low PTCOhmic Resettable Fuses Fuses Product Dimensions Model MF-PSML075 MF-PSML110 MF-PSML150 MF-PSML175 MF-PSML200 MF-PSML260 MF-PSML300 MF-PSML350 DIMENSIONS: A Min. Max. Min. 2.00 (0.079) 2.30 (0.091) 2.00 (0.079) 2.30 (0.091) B Max. D Min. Min. 0.30 (0.012) 0.60 (0.024) 0.20 (0.008) 0.05 (0.002) 0.45 (0.018) 0.45 (0.018) 0.80 (0.031) 0.20 (0.008) 0.05 (0.002) 0.45 (0.018) Max. Min. 1.20 (0.047) 1.50 (0.059) 1.20 (0.047) 1.50 (0.059) C E Max. MM (INCHES) Top ViewTop View Bottom View Bottom View A A C PE PE D Side View Side View B B D E E Recommended Pad Layout Recommended Pad Layout C 1.500.10 1.500.10 (.059.004) (.059.004) Terminal material: Nickel/gold plated. 1.000.05 1.000.05 (.039.002) (.039.002) 1.200.10 1.200.10 (.047.004) (.047.004) Packaging Specifications MF-PSML075~MF-PSML200 = 6000 pcs. per reel MF-PSML260~MF-PSML350 = 4500 pcs. per reel Thermal Derating Table - Ihold (Amps) Model MF-PSML075 MF-PSML110 MF-PSML150 MF-PSML175 MF-PSML200 MF-PSML260 MF-PSML300 MF-PSML350 -40 C 1.24 1.93 2.37 2.57 2.94 3.82 4.41 5.51 -20 C 1.07 1.65 2.07 2.33 2.66 3.46 3.99 4.66 0 C 0.94 1.37 1.80 2.07 2.36 3.07 3.54 4.13 Ambient Operating Temperature 23 C 40 C 50 C 0.75 0.62 0.54 1.10 0.83 0.69 1.50 1.25 1.08 1.75 1.49 1.36 2.00 1.70 1.55 2.60 2.21 2.02 3.00 2.55 2.33 3.50 2.98 2.71 60 C 0.47 0.55 0.93 1.24 1.42 1.85 2.13 2.49 70 C 0.37 0.41 0.74 1.00 1.14 1.48 1.71 2.00 85 C 0.23 0.31 0.50 0.91 1.04 1.35 1.56 1.82 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. MF-PSML Series - Low Ohmic PTC Resettable Fuses 3312 - 2 mm SMD Trimming Potentiometer Solder Reflow Recommendations Notes: tp TP CRITICAL ZONE T L TO TP RAMP-UP TL * All temperatures refer to topside of the package, measured on the package body surface. Temperature tL TS MAX. RAMP-DOWN TS MIN. * MF-PSML models cannot be wave soldered or hand soldered. Please contact Bourns for soldering recommendations. * If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. * Compatible with Pb and Pb-free solder reflow profiles. * Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse(R) Polymer PTC Soldering Recommendation guidelines. ts PREHEAT 25 t 25 C TO PEAK Time Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 C / second max. PREHEAT: Temperature Min. (Tsmin) Temperature Max. (Tsmax) Time (Tsmin to Tsmax) (ts) 150 C 200 C 60~180 seconds TIME MAINTAINED ABOVE: Process Time Materials Temperature Description(TL) Interval Temperature 217 C Time (tL) paste to 60~150 seconds 1. Apply solder * Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature test board (8 10 mil thick) Alloy water soluble or no Peak Temperature (Tp) 260 C clean solder paste Time within 5 C of Actual Peak(see Temperature (t ) 20~40 seconds note 1) p * single sided epoxy glass Ramp-Down Rate 6 C / second max. (G10) (UL approved) Time 25 C to Peak Temperature 8 minutes max. * PC board approx. 4x4x.06 in. 2. Place test units onto board 6 units/board 3. Ramp How up to Order Convection oven 4. Preheat (TS) MF - PSML 075 - 2 5. Time above liquidus (TL) (see note 2) 2.5 C 0.5 /sec. Typical Part Marking 150 C to 190 C 90 30 sec. Represents total content. Layout may vary. 220 C 60-90 sec. Multifuse(R) Product 6. Peak temperature (TP) Designator Series PSML = 0805 Surface Mount Component 7. Ramp down Hold Current, Ihold 075 - 350 (0.75 Amps - 3.50 Amps) Packaging 8. Cleaning water clean profile High pressure deionized Packaged per EIA 481 water 65 PSI max. -2 = Tape and Reel Temperature of Lead/Pad Junction (Derived using 6-zone Convection Oven) MF-PSML SERIES, REV. G, 11/19 PARTIDENTIFICATION: 250 C +0 /-5 MF-PSML075=PD 10-20 sec. within MF-PSML110=PE 5 C of peak MF-PSML150=PG Room temperatureMF-PSML175=PH 3 C 0.5 C/sec. MF-PSML200=PJ (see note 2) MF-PSML260=PN 72 F to 160 F MF-PSML300=PP As required (22 C to 71 C) MF-PSML350=PS PE BIWEEKLYDATECODEWILLAPPEAR ONTHEPACKAGINGLABEL: WEEK1AND2=A WEEK51AND52=Z Inspect solder joint to determine if solder joint is acceptable (i.e. exhibits wetting of joint's surface). Use the following criteria (ref. acceptability of printed board assemblies, IPC-A-610): A) Acceptable (see Figure 1) (1) The solder connection wetting angle (solder to component and solder to PCB termination) does not exceed 90 . (2) Solder balls that do not violate minimum electrical clearances and are attached (soldered) to a metal surface. B) Unacceptable (see Figure 2) (1) Solder connection wetting angle exceeding Asia-Pacific: 90Tel: . +886-2 2562-4117 (2) Incomplete reflow of solder paste. Email: asiacus@bourns.com (3) Dewetting. Europe: Tel: +36 88 885cause 877 and correct prior to If unacceptable, determine next run. Email: eurocus@bourns.com NOTES: The Americas: Tel: +1-951 781-5500 1. Water soluble solder paste only above 100K. Email: americus@bourns.com 2. Refer to ref. temperature profile. Temperature at www.bourns.com lead/pad junction with "K" type thermocouple. 3. Units that are board mounted for environmental testing must see a peak temperature in the reflow zone, as specified. This is to ensure that all test units will see "worst case conditions". 4. Ramp down rate to be measured from 245 C to Specifications are subject to change without notice. 150 C. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. 5. Process Description 8 does not apply to open frame trimmers. MF-PSML Series Tape and Reel Specifications Tape Dimensions W P0 P1 MF-PSML Series per EIA 481 8.0 0.30 (0.315 0.012) 4.0 0.10 (0.157 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 P2 (0.079 0.002) 1.70 0.10 A0 (0.067 0.004) 2.45 0.10 B0 (0.096 0.004) 4.35 B1 max. (0.171) 1.5 + 0.10/-0.0 D0 (0.059 + 0.004/-0) 3.5 0.05 F (0.138 0.002) 1.75 0.10 E1 (0.069 0.004) 6.25 E2 min. (0.246) 0.6 T max. (0.024) 0.1 T1 max. (0.004) K0 (MF-PSML075~MF-PSML200) K0 (MF-PSML260~MF-PSML350) 0.65 0.10 (0.026 0.004) 0.95 0.10 (0.037 0.004) 390 Leader min. (15.35) 160 Trailer min. (6.30) Reel Dimensions 185 A max. (7.28) 50 N min. (1.97) 8.4 + 1.5/-0.0 W1 (0.331 + 0.059/-0.0) 14.4 W2 max. (0.567) T D0 P2 P0 DIMENSIONS: E1 MM (INCHES) W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 A0 P1 W1(MEASURED AT HUB) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Bourns PPTC Resettable Fuses 3312 - (R)2 Multifuse mm SMD(R) Trimming Potentiometer Application Notice * Users are responsible for independent and adequate evaluation of Bourns(R) Multifuse(R) Polymer PTC devices in the user's application, including the PPTC device characteristics stated in the applicable data sheet. * Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated within the user's application during the PTC selection and qualification process. * Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions are expected to be repetitive or prolonged. * In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC device must be protected against mechanical stress, and must be given adequate clearance within the user's application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC devices if the thermal expansion is inhibited. * Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the performance of polymer PTC devices. * Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene, which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect on the device. * Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet and on the Multifuse(R) Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf MFAN 12/18 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns(R) products manufactured by or on behalf of Bourns, Inc. and its affiliates (collectively, "Bourns"). Unless otherwise expressly indicated in writing, Bourns(R) products and data sheets relating thereto are subject to change without notice. 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