2381 661 97.../PTCTZ..R....TE Vishay BCcomponents SMD PTC Thermistors For Overload Protection FEATURES * * * * * * Ideal for pick-and-place circuit assembly Low mounting height Suitable for reflow soldering Small ceramic diameter for faster response Low heat transfer to substrate Flat terminations for stable positioning and good solderability * Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC APPLICATIONS QUICK REFERENCE DATA VALUE DESCRIPTION Nominal R25 STANDARD TYPES (1) (2) TELECOM TYPES (1) (2) 2 to 500 10 to 70 Resistance tolerance 10 %; 15 %; 20 % Maximum overload current (voltage dependent) 2 A to 10 A 50 mA to 500 mA 50 mA to 100 mA at 25 C at 70 C Non-trip current 16 VRMS to 400 VRMS Maximum voltage Response time at 25 C and 20 W overload power 220 VRMS to 600 VRMS <1s Matching Down to 0.5 - Maximum continuous power at 25 C 2W Over-temperature/over-load protection: * Telecom - Central office switching (C.O.) - Subscriber terminal equipment (T.E.) - Set top box - Modems - Cable TV communications * General industry and automotive - Low power supplies overload protection - Data bus protection DESCRIPTION The component consists of a high-performance PTC ceramic disc mounted in a lead-frame for direct soldering onto a printed-circuit board (PCB) or substrate. The ceramic is soldered to the leadframe by a local reflow process, during which the solder layer is melted to the metallized ceramic surface using a low residue flux. MARKING Notes (1) Customized products are available on request (2) Coated and/or reinforced types are available on request * All SMD PTCs are marked with the last 3-digits of the type number (XXX) and a date code (YYWW) ELECTRICAL DATA AND ORDERING INFORMATION RESISTANCE R25 () TOL (%) MATCHING V MAX. (V) Int at It at 25 C 70 C 25 C (mA) (mA) (mA) CATALOG NUMBER MAX. TRIP-TIME at 1 A (s) Imax. at Vmax. (A) 12NC SAP CODING 3.0 2.0 2381 661 97012 (3) PTCTZ3NR100GTE (3) 2.0 97016 (3) PTCTZ3MR100GTE (3) Telecommunication Types 10 20 10 no 245 245 165 165 100 100 270 20 0.5 270 3.0 2381 661 40 25 no 265 80 50 130 0.8 2.0 2381 661 97002 PTCTZ3NR400HTE 25 20 1 265 120 70 220 1.3 2.0 2381 661 97005 (3) PTCTZ3MR250HTE (3) 15 to 20 - no 300 150 100 250 1.5 1.5 2381 661 97004 (3) PTCTZ3NR150KTE (3) 15 to 20 - 0.5 300 150 100 250 1.5 2.0 2381 661 97003 (3) PTCTZ3MR150KTE (3) 20 20 0.5 300 120 70 250 1.4 1.5 2381 661 97018 (3) PTCTZ3MR200KTE (3) 35 + 15/- 20 1 425 110 70 175 1.0 0.7 2381 661 97009 (3) PTCTZ3MR350MTE (3) 50 20 1 425 90 60 150 0.8 0.7 2381 661 97019 PTCTZ3MR500MTE - 24 400 - 650 6.0 8.0 2381 661 97013 (3) PTCTZ3NR339CTE (3) 97011 (3) PTCTZ3NR949ETE (3) General Industrial Types 3.3 25 9.4 25 60 150 100 300 1.8 3.0 2381 661 Note (3) These types pass ITU-K20-21-45 edition 2003 telecommunication protection recommendation www.vishay.com 38 For technical questions, contact: nlr@vishay.com Document Number: 29068 Revision: 27-Oct-09 2381 661 97.../PTCTZ..R....TE SMD PTC Thermistors For Overload Protection PTC OUTLINES Vishay BCcomponents DIMENSIONS OF SOLDER LANDS in millimeters PTC SMD ceramic size: 6.5 mm 0 7.2 - 0.2 2 8.0 2 3.45 0.15 5 0.2 1 1.2 3.6 0.1 10 max. + 0.6 0 0.6 7.6 0.25 10 0.25 11 4 0.2 2.8 4 0.1 DIMENSIONS in millimeters 2 MATERIAL INFORMATION 3 REF. DESCRIPTION MATERIAL AND REMARKS 1 Ceramic BaTiO3 doped 2 Metallization NiCr Ag layer (vacuum deposition) 3 Leadframe Ni plated phosphor bronze material covered by PbSn8 solder layer 1 2 3 SOLDERING CONDITIONS This SMD thermistor is only suitable for reflow soldering, in accordance with JEDEC J-STD-020D. Soldering processes which can be used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260 C during 10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body. Typical examples of a soldering processes that will provide reliable joints without damage, are shown below. Reflow soldering T (C) Vapour phase soldering 10 s 300 260 C 250 245 C 215 C 200 180 C 150 130 C T (C) 10 s 40 s 200 180 C 150 130 C 100 C 100 2 K/s 50 50 external preheating 50 0 0 20 to 40 s 250 215 C 100 0 300 100 Typical values (solid line) Process limits (dotted lines) 150 200 t (s) 250 0 forced cooling internal preheating, e.g. by infrared, max. 2 K/s 50 100 Typical values (solid line) Process limits (dotted lines) 150 200 t (s) 250 HANDLING PRECAUTIONS The special leadframe construction and the applied processes do not allow high handling forces on the component. Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of perspiration can influence component behaviour at high temperatures. Handling forces vertically applied to the centre of the component should be limited to 5 N in the non-soldered condition and to 10 N in the soldered. These forces should not be exceeded during the handling, transportation and packaging of the soldered product. For those applications where higher handling forces can be present, a reinforced version is available on request. Document Number: 29068 Revision: 27-Oct-09 For technical questions, contact: nlr@vishay.com www.vishay.com 39 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Material Category Policy Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Revision: 12-Mar-12 1 Document Number: 91000