2381 661 97.../PTCTZ..R....TE
Vishay BCcomponents
SMD PTC Thermistors For Overload Protection
www.vishay.com For technical questions, contact: nlr@vishay.com Document Number: 29068
38 Revision: 27-Oct-09
Notes
(1) Customized products are available on request
(2) Coated and/or reinforced types are available on request
FEATURES
•Ideal for pick-and-place circuit assembly
•Low mounting height
•Suitable for reflow soldering
•Small ceramic diameter for faster response
•Low heat transfer to substrate
•Flat terminations for stable positioning and good
solderability
•Compliant to RoHS directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
APPLICATIONS
Over-temperature/over-load protection:
•Telecom
- Central office switching (C.O.)
- Subscriber terminal equipment (T.E.)
- Set top box
- Modems
- Cable TV communications
•General industry and automotive
- Low power supplies overload protection
- Data bus protection
DESCRIPTION
The component consists of a high-performance PTC ceramic
disc mounted in a lead-frame for direct soldering onto a
printed-circuit board (PCB) or substrate.
The ceramic is soldered to the leadframe by a local reflow
process, during which the solder layer is melted to the
metallized ceramic surface using a low residue flux.
MARKING
•All SMD PTCs are marked with the last 3-digits of the type
number (XXX) and a date code (YYWW)
Note
(3) These types pass ITU-K20-21-45 edition 2003 telecommunication protection recommendation
QUICK REFERENCE DATA
DESCRIPTION
VALUE
STANDARD
TYPES (1) (2)
TELECOM
TYPES
(1) (2)
Nominal R25 2 Ω to 500 Ω10 Ωto 70 Ω
Resistance tolerance ± 10 %; ± 15 %; ± 20 %
Maximum overload current
(voltage dependent) 2 A to 10 A
Non-trip current 50 mA to 500 mA
at 25 °C
50 mA to 100 mA
at 70 °C
Maximum voltage 16 VRMS
to 400 VRMS
220 VRMS
to 600 VRMS
Response time at 25 °C
and 20 W overload power < 1 s
Matching - Down to 0.5 Ω
Maximum continuous
power at 25 °C2W
ELECTRICAL DATA AND ORDERING INFORMATION
RESISTANCE MATCHING
Ω
V
MAX.
(V)
Int at Itat MAX.
TRIP-TIME
at 1 A (s)
Imax. at
Vmax. (A)
CATALOG NUMBER
R25
(Ω)
TOL
(%)
25 °C
(mA)
70 °C
(mA)
25 °C
(mA) 12NC SAP CODING
Telecommunication Types
10 20 no 245 165 100 270 3.0 2.0 2381 661 97012 (3) PTCTZ3NR100GTE (3)
10 20 0.5 245 165 100 270 3.0 2.0 2381 661 97016 (3) PTCTZ3MR100GTE (3)
40 25 no 265 80 50 130 0.8 2.0 2381 661 97002 PTCTZ3NR400HTE
25 20 1 265 120 70 220 1.3 2.0 2381 661 97005 (3) PTCTZ3MR250HTE (3)
15 to 20 - no 300 150 100 250 1.5 1.5 2381 661 97004 (3) PTCTZ3NR150KTE (3)
15 to 20 - 0.5 300 150 100 250 1.5 2.0 2381 661 97003 (3) PTCTZ3MR150KTE (3)
20 20 0.5 300 120 70 250 1.4 1.5 2381 661 97018 (3) PTCTZ3MR200KTE (3)
35 + 15/- 20 1 425 110 70 175 1.0 0.7 2381 661 97009 (3) PTCTZ3MR350MTE (3)
50 20 1 425 90 60 150 0.8 0.7 2381 661 97019 PTCTZ3MR500MTE
General Industrial Types
3.3 25 - 24 400 - 650 6.0 8.0 2381 661 97013 (3) PTCTZ3NR339CTE (3)
9.4 25 - 60 150 100 300 1.8 3.0 2381 661 97011 (3) PTCTZ3NR949ETE (3)
2381 661 97.../PTCTZ..R....TE
SMD PTC Thermistors For
Overload Protection Vishay BCcomponents
Document Number: 29068 For technical questions, contact: nlr@vishay.com www.vishay.com
Revision: 27-Oct-09 39
PTC OUTLINES
DIMENSIONS in millimeters
DIMENSIONS OF SOLDER LANDS
in millimeters
SOLDERING CONDITIONS
This SMD thermistor is only suitable for reflow soldering, in accordance with JEDEC J-STD-020D. Soldering processes which
can be used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260 °C during 10 s
should not be exceeded and no liquid flux should be allowed to reach the ceramic body.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
HANDLING PRECAUTIONS
The special leadframe construction and the applied processes do not allow high handling forces on the component.
Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of
perspiration can influence component behaviour at high temperatures.
Handling forces vertically applied to the centre of the component should be limited to 5 N in the non-soldered condition and to
10 N in the soldered. These forces should not be exceeded during the handling, transportation and packaging of the soldered
product.
For those applications where higher handling forces can be present, a reinforced version is available on request.
PTC SMD ceramic size: 6.5 mm
3.6 ± 0.1
10 ± 0.25
8.0
2.8
2
4 ± 0.1
4 ± 0.2
0.2
10°
max.
1
7.6 ± 0.25
3.45
± 0.15
1.2
7.2
0
- 0.2
0.6
+ 0.6
0
3
2
2
3
1
MATERIAL INFORMATION
REF. DESCRIPTION MATERIAL AND REMARKS
1 Ceramic BaTiO3 doped
2 Metallization NiCr Ag layer
(vacuum deposition)
3 Leadframe Ni plated phosphor bronze material
covered by PbSn8 solder layer
11
5
2
0 50 100 150 200 25
0
300
250
200
150
100
50
0
t (s)
215 °C
180 °C
20 to 40 s
internal preheating,
e.g. by infrared,
max. 2 K/s
100 °C
130 °C
external
preheating
forced
cooling
T
(°C)
Typical values (solid line)
Process limits (dotted lines)
Vapour phase soldering
Reflow soldering
0 50 100 150 200 250
300
250
200
150
100
50
0
10 s
260 °C
t (s)
215 °C
180 °C
10 s
40 s
2 K/s
T
(°C) 245 °C
130 °C
Typical values (solid line)
Process limits (dotted lines)
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www.vishay.com Vishay
Revision: 12-Mar-12 1Document Number: 91000
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