ON Semiconductor MDC3205 Advance Information Integrated Relay/Solenoid Driver * Optimized to Switch 3 V to 5 V Relays from a 5 V Rail * Compatible with "TX'' and "TQ'' Series Telecom Relays Rated up to RELAY/SOLENOID DRIVER SILICON MONOLITHIC CIRCUIT BLOCK 625 mW at 3 V to 5 V * Features Low Input Drive Current * Internal Zener Clamp Routes Induced Current to Ground Rather * * * * Than Back to Supply Guaranteed Off State with No Input Connection Supports Large Systems with Minimal Off-State Leakage ESD Resistant in Accordance with the 2000 V Human Body Model Provides a Robust Driver Interface Between Relay Coil and Sensitive Logic Circuits CASE 29-11, STYLE 14 TO-92 Applications include: * * * * * * Telecom Line Cards and Telephony Industrial Controls Security Systems Appliances and White Goods Automated Test Equipment Automotive Controls INTERNAL CIRCUIT DIAGRAM Vout (2) Vin 1.0 k (3) This device is intended to replace an array of three to six discrete components with an integrated part. It can be used to switch other 3 to 5 Vdc Inductive Loads such as solenoids and small DC motors. 6.8 V 33 k GND (1) MAXIMUM RATINGS Rating Power Supply Voltage Recommended Operating Supply Voltage Symbol Value Unit VCC 6.0 Vdc VCC 2.0-5.5 Vdc Input Voltage Vin(fwd) 6.0 Vdc Reverse Input Voltage Vin(rev) -0.5 Vdc Output Sink Current Continuous IO 300 mA Junction Temperature TJ 150 C Operating Ambient Temperature Range TA -40 to +85 C Storage Temperature Range Tstg -65 to +150 C Symbol Max Unit PD 625 mW RJA 200 C/W THERMAL CHARACTERISTICS Characteristic Total Device Dissipation(1) Derate above 25C Thermal Resistance Junction to Ambient 1. FR-5 PCB of 1 x 0.75 x 0.062, TA = 25C This document contains information on a new product. Specifications and information herein are subject to change without notice. Semiconductor Components Industries, LLC, 2001 August, 2001 - Rev. 2 1 Publication Order Number: MDC3205/D MDC3205 ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Symbol Min Typ Max Unit V(BRout) V(-BRout) 6.4 -- 6.8 -0.7 7.2 -- V -- -- -- -- 5.0 30 -- 2.5 -- -- 0.2 0.4 250 -- -- OFF CHARACTERISTICS Output Zener Breakdown Voltage (@ IT = 10 mA Pulse) Output Leakage Current @ 0 Input Voltage (Vout = 5.5 Vdc, Vin = O.C., TA = 25C) (Vout = 5.5 Vdc, Vin = O.C., TA = 85C) A IOO ON CHARACTERISTICS Input Bias Current @ Vin = 4.0 Vdc (IO = 250 mA, Vout = 0.4 Vdc, TA = -40C) (correlated to a measurement @ 25C) Iin mAdc Output Saturation Voltage (IO = 250 mA, Vin = 4.0 Vdc, TA = -40C) (correlated to a measurement @ 25C) Vdc Output Sink Current Continuous (TA = -40C, VCE = 0.4 Vdc, Vin = 4.0 Vdc ) (correlated to a measurement @ 25C) IC(on) mA TYPICAL APPLICATION-DEPENDENT SWITCHING PERFORMANCE SWITCHING CHARACTERISTICS Symbol VCC Min Typ Max Propagation Delay Times: High to Low Propagation Delay; Figures 1, 2 (5.0 V 74HC04) Low to High Propagation Delay; Figures 1, 2 (5.0 V 74HC04) Characteristic tPHL tPLH 5.5 5.5 -- -- 55 430 -- -- High to Low Propagation Delay; Figures 1, 3 (3.0 V 74HC04) Low to High Propagation Delay; Figures 1, 3 (3.0 V 74HC04) tPHL tPLH 5.5 5.5 -- -- 85 315 -- -- High to Low Propagation Delay; Figures 1, 4 (5.0 V 74LS04) Low to High Propagation Delay; Figures 1, 4 (5.0 V 74LS04) tPHL tPLH 5.5 5.5 -- -- 55 2385 -- -- Transition Times: Fall Time; Figures 1, 2 (5.0 V 74HC04) Rise Time; Figures 1, 2 (5.0 V 74HC04) tf tr 5.5 5.5 -- -- 45 160 -- -- Fall Time; Figures 1, 3 (3.0 V 74HC04) Rise Time; Figures 1, 3 (3.0 V 74HC04) tf tr 5.5 5.5 -- -- 70 195 -- -- Fall Time; Figures 1, 4 (5.0 V 74LS04) Rise Time; Figures 1, 4 (5.0 V 74LS04) tf tr 5.5 5.5 -- -- 45 2400 -- -- V/t in 5.5 TBD -- -- ns ns Input Slew Rate(1) 1. Minimum input slew rate must be followed to avoid overdissipating the device. tf Vin Units tr 90% 50% 10% tPLH tPHL GND VZ VCC 90% 50% 10% Vout VCC GND tTHL tTLH Figure 1. Switching Waveforms http://onsemi.com 2 V/ms MDC3205 +4.5 VCC +5.5 Vdc + + AROMAT TX2-L2-3 V Vout (3) Vout (3) MDC3205 74HC04 OR EQUIVALENT Vin (1) 1k MDC3205 6.8 V 1k 6.8 V 33 k Vin (1) 33 k GND (2) 74HC04 OR EQUIVALENT GND (2) Figure 2. A 3.0-V, 200-mW Dual Coil Latching Relay Application with 5.0 V-HCMOS Interface +3.0 VDD +3.75 Vdc +4.5 VCC +5.5 Vdc + + AROMAT TX2-L2-3 V Vout (3) Vout (3) MDC3205 74HC04 OR EQUIVALENT Vin (1) 1k MDC3205 6.8 V 1k 6.8 V 33 k Vin (1) 33 k GND (2) GND (2) Figure 3. A 3.0-V, 200-mW Dual Coil Latching Relay Application with 3.0 V-HCMOS Interface http://onsemi.com 3 74HC04 OR EQUIVALENT MDC3205 +4.5 VCC +5.5 Vdc + + AROMAT TX2-L2-3 V Vout (3) Vout (3) MDC3205 74LS04 BAL99LT 1 1k MDC3205 6.8 V 1k 6.8 V 33 k BAL99LT 1 74LS04 33 k Vin (1) Vin (1) GND (2) GND (2) Figure 4. A 3.0-V, 200-mW Dual Coil Latching Relay Application with TTL Interface +4.5 TO +5.5 Vdc + + AROMAT R1 TX2-5 V R2 - AROMAT TX2-5 V - Max Continuous Current Calculation R1 = R2 = 178 Nominal @ TA = 25C Assuming 10% Make Tolerance, R1 = R2 = (178 ) (0.9) = 160 Min @ TA = 25C Vout (3) TC for Annealed Copper Wire is 0.4%/C 74HC04 OR EQUIVALENT R1 = R2 = (160 ) [1+(0.004) (-40-25)] = 118 Min @ -40C Vin (1) R1 in Parallel with R2 = 59 Min @ -40C Io 5.5 V Max - 0.4 V 86 mA Max 59 Min 86 mA 300 mA Max Io spec. GND (2) Figure 5. Typical 5.0 V, 140 mW Coil Dual Relay Application http://onsemi.com 4 MDC3205 TYPICAL OPERATING WAVEFORMS 4.5 225 3.5 175 IC (mA) V in (VOLTS) (Circuit of Figure 5) 2.5 125 1.5 75 500 M 25 10 30 50 TIME (ms) 70 90 10 9 172 7 132 5 52 1 12 30 50 TIME (ms) 70 90 10 Figure 8. 20 Hz Square Wave Response 600 TJ = 85C 300 TJ = 25C 70 90 TJ = 25C TJ = -40C 175 0.6 1 10 50 125 250 IC = 350 mA 0.4 0.2 100 0 50 TIME (ms) 0.8 400 200 30 1 OUTPUT VOLTAGE (V) hFE 500 90 Figure 9. 20 Hz Square Wave Response TJ = 125C Vo = 1.0 V Vo = 0.25 V 70 92 3 10 50 TIME (ms) Figure 7. 20 Hz Square Wave Response IZ (mA) Vout (VOLTS) Figure 6. 20 Hz Square Wave Input 30 1 10 100 Io, OUTPUT SINK CURRENT (mA) 0 1E-5 100 0 Figure 10. Pulsed Current Gain 1E-4 1E-3 INPUT CURRENT Figure 11. Collector Saturation Region http://onsemi.com 5 1E-2 MDC3205 PACKAGE DIMENSIONS TO-92 (TO-226) CASE 29-11 ISSUE AL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. B R P L SEATING PLANE STYLE 14: PIN 1. EMITTER 2. COLLECTOR 3. BASE K D X X G J H V C SECTION X-X 1 N N http://onsemi.com 6 DIM A B C D G H J K L N P R V INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --0.250 --0.080 0.105 --0.100 0.115 --0.135 --- MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --6.35 --2.04 2.66 --2.54 2.93 --3.43 --- MDC3205 Notes http://onsemi.com 7 MDC3205 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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