RF01001, Rev. A (1/4/13) ©2013 Microsemi Corporation Page 1 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
Available Surface Mount 1500 Watt
Transient Voltage Suppressor
Screening in
reference to
MIL-PRF-19500
available
DESCRIPTION
The MSMCG(J)5.0A through MXLSMCG(J)170A series of 1500 watt high-reliability Transient
Voltage Suppressors (TVSs) protects a variety of voltage-sensitive compone nts. The SMCG gull-
wing design i n the DO -215AB package allows for visible solder connections. The SMCJ J-bend
design in the DO-214AB package allows for greater PC board m ount i ng density. Selections include
uni d i r ect i o n al and bi di r ec tion al as w el l as R oHS compliant versions. These are available w i t h a
var i e ty of up sc ree ni ng opt ion s f or en h anc ed r el i ab i l i ty. They can protect against the secondary
effects of li ghtnin g per I EC61000-4-5 and against voltage pulses from inductive switching
environments and induced by RF radiation. Since their res ponse tim e i s vir tually instantaneou s,
they can also be used in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4.
DO-215AB
(SMCG) Package
DO-214AB
(SMCJ) Package
NOTE: All SMC series are
equival ent to pri or SMM pa ckage
identifications.
Also avai l able:
Commercial grade
SMCG(J)5.0A –
SMCG(J)170CAe3
Important: For the lates t inform ation, v isit our website http://www.microsemi.com.
FEATURES
• High reliability devices with fabrication and ass embly lot traceability.
• All devi ces are 100% surge tested.
• 3σ lot norm screening performed on standby current (ID).
• Availabl e in both unidirectional and bidi rectional versions.
• Moisture classifi catio n is “Level 1” with no dry pack required per IPC/JEDEC J-STD-020B.
• Enhanced reliability screening opt ions are available in reference to MIL-PRF-19500.
Refer to High Reliability Up-Screened Plastic Products Portfolio for more details on the screening
options.
(See part nomenclature for all available options).
• RoHS compliant versions available.
• Axial-lead equivalent packages for thru-hole mount ing are available as 1.5KE6.8A to 1.5KE200CA
or 1N6267 thru 1N6303A and 1N5908 (contact Mi crosemi for other surface mount options).
APPL ICATIONS / BENEF ITS
• High-reliabil ity devices.
• Selections for 5.0 to 170 volts standoff voltages (VWM).
• Protection from switching transients and induced RF.
• Protecti on from ESD, and EFT per IE C 61000-4-2 and IEC 61000-4-4.
• Secondary lightning protecti on per IEC61000-4-5 with 42 ohms source impedance:
Class 1: MSMC 5.0A to MXLSMC 170A or CA
Class 2: MSMC 5.0A to MXLSMC 150A or CA
Class 3: MSMC 5.0A to MXLSMC 75A or CA
Class 4: MSMC 5.0A to MXLSMC 36A or CA
• Secondary lightning protecti on per IEC61000-4-5 with 12 ohms source impedance:
Class 1: MSMC 5. 0A to MXLSM C 90A or CA
Class 2: MSMC 5.0A to MXLSMC 45A or CA
Class 3: MSMC 5.0A to MXLSMC 24A or CA
Class 4: MSMC 5.0A to MXLSMC 11A or CA
• Secondary lightning protecti on per IEC61000-4-5 with 2 ohms source impedance:
Class 2: MSMC 5.0A to MXLSMC 22A or CA
Class 3: MSMC 5.0A to MXLSMC 10A or CA
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
RF01001, Rev. A (1/4/13) ©2013 Microsemi Corporation Page 2 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
MAX IMUM RATING S
Parameters/Test Condi tions
Symbol
Value
Unit
Junction and Storage Temperature
TJ and TSTG
-65 to +150
ºC
Thermal Resistance Junction-to-Lead
RӨJL
20
ºC/W
Thermal Resistance Junction-to-Ambient (1)
RӨJA
80
ºC/W
Peak Pulse Power Dissipation @ 25 ºC (at 10/1000 µs,
see Figures 1, 2, and 3)
P
PP
1500
W
Impulse Repetition Rate (duty factor)
df
0.01
%
t
clamping
(0 volts to V
(BR)
min.)
Bidirectional
t
clamping
<100
<5
ps
ns
Rated Average Power Dissipation
L
T
= +25 ºC
P
M(AV)
6
1.56(1)
W
Maximum Forward Surge Current (2)
I
FSM
200
A (pk)
Solder Temperature @ 10 s
TSP
260
oC
Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprin t (see last page).
2. Peak impulse of 8.3 ms half-si ne wave at 25 ºC (unidirectional only).
M ECHANICAL and PACKAGING
• CASE: Void-free transfer molded thermosetting epoxy body meeti ng UL94V-0.
• TERMINALS: Tin-lead or RoHS compliant ann ealed matte-tin plating. So lderable to MI L-STD-750, method 2026.
• MARKING: Part number marked on package.
• POLARITY: Cathode indicated by band. No cathode band on bi-directional devices.
• TAPE & REEL option: Standard per EIA-481-2 with 16 mm tape (add “TR” suffix to part number). Consult factory for quantities.
• WEIGHT: Approximately 0.25 grams.
• See Package Dimensions on last page.
PART NOMENCLATURE
MX SM C G 5.0 C A e3
Reliability Level*
M
MA
MX
MXL
*(see
High Reliability
Up-Screened Plastic
Products Portf olio )
Surface M ount
Package
1500 W Power Level
Gull-wing Lead Frame
G = Gull-Wing
J = J-Bend
RoHS Compliance
e3 = RoHS Compl iant
Blank = non-RoHS Compliant
+/- 5% Tolerance Level
Uni/Bidirectional
C = Bi directional
Blank = Unidirectional
Reverse Stand-Off Voltage
(see Electrical Characteristics
table)
RF01001, Rev. A (1/4/13) ©2013 Microsemi Corporation Page 3 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
SYMBOLS & DEFINITI ONS
Symbol
Definition
I(BR)
Breakdown Current: The current used for measuring breakdown voltage V(BR) .
ID
Standby Current: The current at the rated standoff voltage (VWM).
IF
Forward Current: The forward current dc value, no alternating component.
IO Average Rectified Output Current: The output current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave input
and a 180 degree conduction angle.
IPP
Peak Impulse Current: The peak current during the impulse.
PPP
Peak Pulse Power: The peak power dissipation resulting from the peak impulse current IPP.
VC
Cla mping Volta ge: Maximum clamping voltage at specified IPP (Peak Pulse Current) at the specified pulse conditions.
V(BR)
Minimum B reakdown Voltage: The minimum voltage the device will exhibit at a specified current.
VWM
Working Peak Voltage: The maximum peak voltage that c an be applied over the operating temperature range. This is
also referred to as standoff voltage.
ELECTRICAL CHARACTERISTICS @ 25 ºC unl ess otherwis e stat ed
MICROSEMI PART NUMBER REVERSE
STAND-OFF
VOLTAGE
VWM
Volts
BREAKDOWN
VOLTAGE
V(BR) @ I (BR)
Volts
MAXIMUM
CLAMPING
VOLTAGE
@ I PP
Volts
PEAK PULSE
CURRENT
(See Fig. 2)
IPP
Amps
MAXIMUM
STANDBY
CURRENT
@ VWM
ID
µA
Gull-Wing
J-Bend
MIN. MAX.
I
(BR)
mA
MSMCG5.0A
MSMCG6.0A
MSMCJ5.0A
MSMCJ6.0A
5.0
6.0
6.40 – 7.00
6.67 – 7.37
10
10
9.2
10.3
163.0
145.6
1000
1000
MSMCG6.5A
MSMCG7.0A
MSMCJ6.5A
MSMCJ7.0A
6.5
7.0
7.22 – 7.98
7.78 – 8.60
10
10
11.2
12.0
133.9
125.0
500
200
MSMCG7.5A
MSMCG8.0A
MSMCJ7.5A
MSMCJ8.0A
7.5
8.0
8.33 – 9.21
8.89 – 9.83
1
1
12.9
13.6
116.3
110.3
100
50
MSMCG8.5A
MSMCG9.0A
MSMCJ8.5A
MSMCJ9.0A
8.5
9.0
9.44 – 10.4
10.0 – 11.1
1
1
14.4
15.4
104.2
97.4
20
10
MSMCG10A
MSMCG11A
MSMCJ10A
MSMCJ11A
10
11
11.1 – 12.3
12.2 – 13.5
1
1
17.0
18.2
88.2
82.4
5
5
MSMCG12A
MSMCG13A
MSMCJ12A
MSMCJ13A
12
13
13.3 – 14.7
14.4 – 15.9
1
1
19.9
21.5
75.3
69.7
5
1
MSMCG14A
MSMCG15A
MSMCJ14A
MSMCJ15A
14
15
15.6 – 17.2
16.7 – 18.5
1
1
23.2
24.4
64.7
61.5
1
1
MSMCG16A
MSMCG17A
MSMCJ16A
MSMCJ17A
16
17
17.8 – 19.7
18.9 – 20.9
1
1
26.0
27.6
57.7
53.3
1
1
MSMCG18A
MSMCG20A
MSMCJ18A
MSMCJ20A
18
20
20.0 – 22.1
22.2 – 24.5
1
1
29.2
32.4
51.4
46.3
1
1
MSMCG22A
MSMCG24A
MSMCJ22A
MSMCJ24A
22
24
24.4 – 26.9
26.7 – 29.5
1
1
35.5
38.9
42.2
38.6
1
1
MSMCG26A
MSMCG28A
MSMCJ26A
MSMCJ28A
26
28
28.9 – 31.9
31.1 – 34.4
1
1
42.1
45.4
35.6
33.0
1
1
MSMCG30A
MSMCG33A
MSMCJ30A
MSMCJ33A
30
33
33.3 – 36.8
36.7 – 40.6
1
1
48.4
53.3
31.0
28.1
1
1
MSMCG36A
MSMCG40A
MSMCJ36A
MSMCJ40A
36
40
40.0 – 44.2
44.4 – 49.1
1
1
58.1
64.5
25.8
23.2
1
1
MSMCG43A
MSMCG45A
MSMCJ43A
MSMCJ45A
43
45
47.8 – 52.8
50.0 – 55.3
1
1
69.4
72.7
21.6
20.6
1
1
MSMCG48A
MSMCG51A
MSMCJ48A
MSMCJ51A
48
51
53.3 – 58.9
56.7 – 62.7
1
1
77.4
82.4
19.4
18.2
1
1
MSMCG54A
MSMCG58A
MSMCJ54A
MSMCJ58A
54
58
60.0 – 66.3
64.4 – 71.2
1
1
87.1
93.6
17.2
16.0
1
1
MSMCG60A
MSMCG64A
MSMCJ60A
MSMCJ64A
60
64
66.7 – 73.7
71.1 – 78.6
1
1
96.8
103.0
15.5
14.6
1
1
MSMCG70A
MSMCG75A
MSMCJ70A
MSMCJ75A
70
75
77.8 – 86.0
83.3 – 92.1
1
1
113
121
13.3
12.4
1
1
Continued.
RF01001, Rev. A (1/4/13) ©2013 Microsemi Corporation Page 4 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
ELECTRICAL CHARACTERISTICS @ 25 ºC unl ess otherwis e stat ed ( continued)
MICROSEMI PART NUMBER REVERSE
STAND-OFF
VOLTAGE
VWM
Volts
BREAKDOWN
VOLTAGE
V(BR) @ I (BR)
Volts
MAXIMUM
CLAMPING
VOLTAGE
@ I PP
Volts
PEAK PULSE
CURRENT
(See Fig. 2)
IPP
Amps
MAXIMUM
STANDBY
CURRENT
@ VWM
ID
µA
Gull-Wing
J-Bend
MIN. MAX.
I
(BR)
mA
MSMCG78A
MSMCG85A
MSMCJ78A
MSMCJ85A
78
85
86.7 – 95.8
94.4 – 104.0
1
1
126
137
11.4
10.4
1
1
MSMCG90A
MSMCG100A
MSMCJ90A
MSMCJ100A
90
100
100 – 111
111 – 123
1
1
146
162
10.3
9.3
1
1
MSMCG110A
MSMCG120A
MSMCJ110A
MSMCJ120A
110
120
122 – 135
133 – 147
1
1
177
193
8.4
7.8
1
1
MSMCG130A
MSMCG150A
MSMCJ130A
MSMCJ150A
130
150
144 – 159
167 – 185
1
1
209
243
7.2
6.2
1
1
MSMCG160A
MSMCG170A
MSMCJ160A
MSMCJ170A
160
170
178 – 197
189 – 209
1
1
259
275
5.8
5.5
1
1
RF01001, Rev. A (1/4/13) ©2013 Microsemi Corporation Page 5 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
GRAPHS
t – Ti me (ms ec )
tp – Pulse Time – sec
FIGURE 2 – Pulse Waveform
FIGURE 1 – Peak P ulse Power vs. P ulse Time
TL Lead Temperature oC BV – Breakdown Voltage (V)
FIGURE 3 – Deratin g Cu rve FIGURE 4
Typical C apacitanc e vs .
Breakdown Vol tage (unidirectional configuration)
NOTE: Bidirectional capacitance is hal f that shown at zero volts.
1µs 10µsec 100µsec 1ms 10ms
(P
PP
) – Peak Pulse Power - kW
(Waveform – See F igu re 2)
Non-repetitive
Peak Pulse Power (
P
PP) or continuous
Power in Percent of 25
o
C Rating
100
10
1.0
0
I
PP
– Peak Pulse Current - % I
PP
C – Ca pacit a nce (p F)
Test w ave form
parameters
tr =
10
µ
sec.
t p = 1000 µsec.
RF01001, Rev. A (1/4/13) ©2013 Microsemi Corporation Page 6 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
PACKAGE DIM ENSIONS
NOTES: Dimension “E” exceeds the JEDEC outline as shown.
Typical Standoff Height: 0.004” – 0.008” (0.1 mm – 0. 2 mm ).
NOTES: Dimension “E” e xceed s the JE DE C out line in he i ght as sh own.
Typical Standoff Height: 0.004” – 0.008” (0.1 mm – 0. 2 mm ).
Dimensions
Ltr
Inch
Millimeters
Min
Max
Min
Max
A
.115
.121
2.92
3.07
B
.260
.280
6.60
7.11
C
.220
.245
5.59
6.22
E
.077
.110
1.95
2.80
F
.380
.400
9.65
10.16
K
.025
.040
0.635
1.016
Dimensions
Ltr
Inch
Millimeters
Min
Max
Min
Max
A
.115
.121
2.92
3.07
B
.260
.280
6.60
7.11
C
.220
.245
5.59
6.22
D
.305
.320
7.75
8.13
E
.077
.110
1.95
2.80
L
.030
.060
.760
1.52
SMCG (DO-215AB)
SMCJ (DO-214AB)
RF01001, Rev. A (1/4/13) ©2013 Microsemi Corporation Page 7 of 7
MSMCG5.0A – MXLSMCG170CAe3,
MSMCJ5.0 – MXLSMCJ170CAe3
PAD LAYOUT
SMCG (DO-215AB)
Ltr
Inch
Millimeters
A
.510
12.95
B
.110
2.79
C
.150
3.81
SMCJ (DO-214AB)
Ltr
Inch
Millimeters
A
.390
9.90
B
.110
2.79
C
.150
3.81