1
SJN CONNECTOR
2.0mm pitch/Board-in Crimp style connectors
1
BJST
23456789
U-U
4.9
2.8
1.7min
3.5min
5.45
±0.03
φ
0.9
±0.05
2.0
Side entry type board-in connector, with a
mounting height of only 2.8mm and a
thickness of 4.9mm.
• Housing lances
• Easy mounting onto printed circuit boards
Specifications –––––––––––––––––––
• Current rating: 3A AC, DC (AWG #22)
• Voltage rating: 250V AC, DC
• Temperature range: -25˚C to +85˚C
(including temperature rise in applying
electrical current)
• Insulation resistance: 1,000M Ωmin.
• Withstanding voltage: 800V AC/minute
• Applicable wire: AWG #28 to #22
• Applicable PC board thickness: 1.2 to 1.6mm
*Compliant with RoHS.
*Refer to "General Instruction and Notice when using
Terminals and Connectors" at the end of this catalog.
* Contact JST for details.
Standards ––––––––––––––––––––––
0Recognized E60389
Note: 1. Tolerances are non-cumulative:
±
0.05mm for all centers.
2. Hole dimensions differ according to the kind of PC board and piercing method. The dimensions above should serve as a guideline. Contact JST for details.
PC board layout (viewed from soldering side) and Assembly layout
222
SJN CONNECTOR
Material and Finish
Model No. Applicable wire Q
’
ty /
reelmm2AWG #
Insulation O.D.(mm)
15,000
18,000
Brass, tin-plated (reflow treatment)
SJN-001PT-0.9
SJN-002PT-0.9
0.20〜0.33
0.08〜0.22
24〜22
28〜24
1.1〜1.4
0.9〜1.4
0.2 4.0
0.6
0.80.9
（5.4）
0.95
SJN-002PT-0.9 MKS-L
−
MK/SJN-002-09
−
APLMKSJN002-09
−
SJN-001PT-0.9
AP-K2N
MKS-L
−
MK/SJN-001-09
−
APLMKSJN001-09
−
JST
2.0 2.8
4.9
B
A
12789
Material
PA 66, UL94V-0, natural (white)
Circuits Model No. Dimensions (mm) Q’ty /
bag
AB
2
3
4
6
7
8
9
10
02P-SJN
03P-SJN
04P-SJN
06P-SJN
07P-SJN
08P-SJN
09P-SJN
10P-SJN
2.0
4.0
6.0
10.0
12.0
14.0
16.0
18.0
4.4
6.4
8.4
12.4
14.4
16.4
18.4
20.4
2,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
RoHS compliance
Note: Contact JST if you require shielded wires, thin wires or other special
wires.
RoHS compliance
Contact
Crimping
machine
Crimpapplicator Dies
Crimpapplicatorwithdies
Applicator
Contact
Housing
