PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan, R.O.C. Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 http://www.para.com.tw E-mail: para@para.com.tw DATA SHEET PART NO.: L-C191GCT-U1 REV: A / 0 CUSTOMER'S APPROVAL : _______________ DCC : ____________ DRAWING NO. : DS-74-05-0001 DATE : 2005-07-28 PAGE 1 of 14 PARA-FOR-065 SURFACE MOUNT DEVICE LED Part No. : L-C191GCT-U1 REV:A / 0 PACKAGE OUTLINE DIMENSIONS Notes: 1. All dimensions are in millimeters. 2. Tolerance is 0.1mm (.004") unless otherwise noted. Features Top view, wide view angle, single color Chip LED. Package in 8mm tape on 7" diameter reels. Compatible with automatic Pick & Place equipment. Compatible with Infrared and Wave soldering reflow solder processes. EIA STD package. I.C. compatible. Pb free product. DRAWING NO. : DS-74-05-0001 PARA-FOR-068 DATE : 2005-07-28 PAGE 2 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C191GCT-U1 REV:A / 0 Chip Materials Dice Material : GaP Light Color : Green Lens Color : Water Clear Absolute Maximum Ratings(Ta=25) Symbol Parameter Rating Unit PD Power Dissipation 100 mW IPF Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) 120 mA IF Continuous Forward Current 25 mA - De-rating Linear From 25 0.25 mA/ 5 VR Reverse Voltage Topr Operating Temperature Range -40 ~ +85 V Tstg Storage Temperature Range -40 ~ +85 - Wave Soldering Condition (Two times Max.) 260 (for 5 seconds) - Infrared Soldering Condition (Two times MAX.) 240 (for 10 seconds) Electro-Optical Characteristics(Ta=25) Parameter Luminous Intensity Unit Test Condition 12.5 mcd IF=20mA Symbol Min. Typ. IV 4.0 Max. Viewing Angle 21/2 130 deg Note 2 Peak Emission Wavelength p 568 nm Measurement @Peak Dominant Wavelength d 570 nm IF=20mA Spectral Line Half-Width 30 nm Forward Voltage VF 2.1 Reverse Current IR DRAWING NO. : DS-74-05-0001 PARA-FOR-068 2.6 V IF =20mA 100 A VR = 5V DATE : 2005-07-28 PAGE 3 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C191GCT-U1 REV:A / 0 Notes: 1. Luminous intensity is measured with a light sensor and filter combination that proximities the CIE eye-response curve. 2. 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength d is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Caution in ESD : Static Electricity and surge damages the LED. It is recommended use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. 5. Major standard testing equipment by "Instrument System" Model : CAS140B Compact Array Spectrometer and "KEITHLEY" Source Meter Model : 2400. Typical Electro-Optical Characteristics Curves Fig.1 Relative Intensity vs. Wavelength DRAWING NO. : DS-74-05-0001 PARA-FOR-068 DATE : 2005-07-28 PAGE 4 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C191GCT-U1 REV:A / 0 Typical Electro-Optical Characteristics Curves (25Ambient Temperature Unless Otherwise Noted) 25 Luminous lntensity(mcd) Forward Current(mA) 50 40 30 20 10 0 1.6 15 10 5 0 1.8 2.0 2.2 2.4 Forward Voltage(V) 0 2.6 10 40 30 50 Fig.3 Luminous Intensity vs.Forward Current 1000 Relative luminous intensity(%) 2.5 2 1.5 1 0.5 0 0 10 20 30 40 50 100 10 1 -60 -40 -20 -0 20 40 60 80 100 Ambient Temperature Ta() Forward Current(mA) Fig.4 Relative Luminous Intensity vs.Forward Current Fig.5 Luminous Intensity vs.Ambient Temperature 0 50 Forward Current IF(mA) 20 Forward Current(mA) Fig.2 Forward Current vs.Forward Voltage Relative Luminous lntensity Normalized of 20mA 20 10 20 30 40 30 25 20 40 1.0 0.9 50 0.8 60 70 80 90 10 0.7 0 0 20 40 60 80 100 0.5 0.3 0.1 0.2 0.4 0.6 Ambient Temperature Ta() Fig.6 Forward Current Derating Curve DRAWING NO. : DS-74-05-0001 PARA-FOR-068 Fig.7 Relative Intensity vs.Angle DATE : 2005-07-28 PAGE 5 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C191GCT-U1 REV:A / 0 Label Explanation CUS. PART NO: To be denominated. CUSTOMER: To be denominated. PART NO: Refer to P14 BATCH: ( actual code will be base on page 11 specification). K--- Luminous Intensity Code LOT NO: E L S 4 7 0009 A B C D E F A---E: For series number B---L: Local F: Foreign C---S: SMD D---Year E---Month F---SPEC. QUANTITY: (Below are standard specification, actual packing quantity reference page 7) 3000pcs for 150110155115 series 4000pcs for 191 series 5000pcs for 192 series DRAWING NO. : DS-74-05-0001 PARA-FOR-068 DATE : 2005-07-28 PAGE 6 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C191GCT-U1 REV:A / 0 Reel Dimensions Notes: 1. Taping Quantity : 4000pcs 2. The tolerances unless mentioned is0.1mm, Angle0.5, Unit : mm. DRAWING NO. : DS-74-05-0001 PARA-FOR-068 DATE : 2005-07-28 PAGE 7 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C191GCT-U1 REV:A / 0 Package Dimensions Of Tape And Reel Progressive direction Cathode Polarity Notes:All dimensions are in millimeters. T LIGH PARA T LIGH PARA Moisture Resistant Packaging Label Reel Label Desiccant Aluminum moistue-proof bag 240 145 210 255 Label Box 435 Carton Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm. DRAWING NO. : DS-74-05-0001 PARA-FOR-068 DATE : 2005-07-28 PAGE 8 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C191GCT-U1 REV:A / 0 Cleaning If cleaning is required , use the following solutions for less than 1 minute and less than 40. Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Suggest Soldering Pad Dimensions Direction of PWB camber and go to reflow furnace DRAWING NO. : DS-74-05-0001 PARA-FOR-068 DATE : 2005-07-28 PAGE 9 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C170KGCT-HX Suggest Sn/Pb IR Reflow Soldering Profile Condition: Suggest Pb-Free IR Reflow Soldering Profile Condition: DRAWING NO. : DS-72-05-A / 0X PARA-FOR-068 DATE : 2005-07-28 REV:A / 0 PAGE 10 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C191GCT-U1 REV:A / 0 Bin Code List Luminous Intensity(IV), Unit:mcd@20mA Bin Code Min Max J 4.0 8.0 K 6.30 12.5 L 10.0 20.0 M 16.0 32.0 Including test tolerance CAUTIONS 1.Application Limitation : The LED's described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household application).Consult PARA's sales in advance for information on application in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LED's may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life support system and safety devices). 2.Storage : Before opening the package : The LEDs should be kept at 5C to 30C or less and 85%RH or less. The LEDs should be used within a year. After opening the package : The LEDs should be kept at 5C to 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours(7 days) after opening the package. Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur. 3.Soldering Do not apply any stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering condition. Reflow Soldering : Pre-heat 120~150C, 120sec. MAX., Peak temperature : 240C Max. Soldering time : 10 sec Max. Soldering Iron : (Not recommended) Temperature 300C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60 solder of solder with silver content and don't to touch LED lens when soldering. Wave soldering : Pre-heat 100C Max, Pre-heat time 60 sec. Max, Solder wave 260C Max, Soldering time 5 sec. Max. preformed consecutively cooling process is required between 1st and 2nd soldering processes. DRAWING NO. : DS-74-05-0001 PARA-FOR-068 DATE : 2005-07-28 PAGE 11 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C191GCT-U1 REV:A / 0 4. Lead-Free Soldering For Reflow Soldering : 1Pre-Heat Temp:150-180,120sec.Max. 2Soldering Temp:Temperature Of Soldering Pot Over 230,40sec.Max. 3Peak Temperature:2605sec. 4Reflow Repetition:2 Times Max. 5Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu For Soldering Iron (Not Recommended) : 1Iron Tip Temp:350 Max. 2Soldering Iron:30w Max. 3Soldering Time:3 Sec. Max. One Time. For Dip Soldering : 1Pre-Heat Temp:150 Max. 120 Sec. Max. 2Bath Temp:265 Max. 3Dip Time:5 Sec. Max. 5. Drive Method Circuit model A Circuit model B (A)Recommended circuit. (B)The difference of brightness between LEDs could be found due to the Vf-If characteristics of LED. DRAWING NO. : DS-74-05-0001 PARA-FOR-068 DATE : 2005-07-28 PAGE 12 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C191GCT-U1 REV:A / 0 6.Reliability Test Classification Test Item Test Condition Reference Standard Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS)*@20mA. MIL-STD-750D:1026 (1995) MIL-STD-883D:1005 (1991) JIS C 7021:B-1 (1982) IR-Reflow In-Board, 2 Times Ta= 655,RH= 9095% *Test Time= 1000HRS2HRS MIL-STD-202F:103B(1980) JIS C 7021:B-11(1982) High Temperature Storage Ta= 1055 Test Time= 1000HRS (-24HRS,72HRS) MIL-STD-883D:1008 (1991) JIS C 7021:B-10 (1982) Low Temperature Storage Ta= -555 *Test Time=1000HRS (-24HRS,72H RS) JIS C 7021:B-12 (1982) Temperature Cycling 1055 10mins MIL-STD-202F:107D (1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1010 (1991) JIS C 7021:A-4(1982) Thermal Shock IR-Reflow In-Board, 2 Times 1055 -555 10mins 10mins 100 Cycles MIL-STD-202F:107D(1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1011 (1991) Tsol= 260 5 Dwell Time= 10 1sec MIL-STD-202F:210A(1980) MIL-STD-750D:2031(1995) JIS C 7021:A-1(1982) Tsol= 235 5 Immersion time 20.5 sec Immersion rate 252.5 mm/sec Coverage 95% of the dipped surface MIL-STD-202F:208D(1980) MIL-STD-750D:2026(1995) MIL-STD-883D:2003(1991) IEC 68 Part 2-20 JIS C 7021:A-2(1982) Operation Life High Temperature Endurance Test High Humidity Storage Environmental Test Solder Resistance Solder ability -555 10mins 100 Cycles 7.Others: The appearance and specifications of the product may be modified for improvement without notice. DRAWING NO. : DS-74-05-0001 PARA-FOR-068 DATE : 2005-07-28 PAGE 13 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C191GCT-U1 PART NO. SYSTEM : L-C 1 9 1 X C X X - X X X X REV:A / 0 XXXX : Special specification for customer T : Taping for 7 inch reel TC : Taping for 13 inch reel TH : IV half binning TP : Wavelength binning Lens color C : Water Clear W : White Diffused T : Color Transparent D : Color Diffused G : Gap 570nm Green Y : GaAsp 585 nm Yellow E : GaAsp 620 nm Orange SR : GaAlAs 634 nm Red KG : AlInGap 570nm Super Green KY : AlInGap 590nm Super Yellow KF : AlInGap 605nm Super Amber KR : AlInGap 630 nm Super Red LB : InGaN 470nm Blue LG : InGaN 525nm Green 0 : Single chip 1/2 : Super thin single chip 5/6 : Dual chip F : Three chip(Full color) C : Top View Type S : Side View Type DRAWING NO. : DS-74-05-0001 PARA-FOR-068 150 : 1206 1.1T 170 : 0805 0.8T 191 : 0603 0.6T 192 : 0603 0.4T 110 : 1206 1.0T DATE : 2005-07-28 Type Type Type Type Type PAGE 14 of 14