NCP161ASN180T1G - APTINA IMAGING

December, 2020 − Rev. 16

1Publication Order Number:

NCP161/D

LDO Regulator for RF and

Analog Circuits - Ultra-Low

Noise and High PSRR

450 mA

NCP161

The NCP161 is a linear regulator capable of supplying 450 mA

output current. Designed to meet the requirements of RF and analog

circuits, the NCP161 device provides low noise, high PSRR, low

quiescent current, and very good load/line transients. The device is

designed to work with a 1 mF input and a 1 mF output ceramic capacitor.

It is available in two thickness ultra−small 0.35P, 0.65 mm x 0.65 mm

Chip Scale Package (CSP) and XDFN4 0.65P, 1 mm x 1 mm.

Features

•Operating Input Voltage Range: 1.9 V to 5.5 V

•Available in Fixed Voltage Option: 1.8 V to 5.14 V

•±2% Accuracy Over Load/Temperature

•Ultra Low Quiescent Current Typ. 18 mA

•Standby Current: Typ. 0.1 mA

•Very Low Dropout: 150 mV at 450 mA

•Ultra High PSRR: Typ. 98 dB at 20 mA, f = 1 kHz

•Ultra Low Noise: 10 mVRMS

•Stable with a 1 mF Small Case Size Ceramic Capacitors

•Available in −WLCSP4 0.65 mm x 0.65 mm x 0.4 mm

−WLCSP4 0.65 mm x 0.65 mm x 0.33 mm

−XDFN4 1 mm x 1 mm x 0.4 mm

−SOT23−5 2.9 mm x 2.8 mm x 1.2 mm

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Typical Applications

•Battery−powered Equipment

•Wireless LAN Devices

•Smartphones, Tablets

•Cameras, DVRs, STB and Camcorders

GND

OUT

OFF

Figure 1. Typical Application Schematics

VOUT

COUT

1 mF

Ceramic

VIN

NCP161

CIN

1 mF

Ceramic

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See detailed ordering and shipping information on page 16 of

this data sheet.

ORDERING INFORMATION

PIN CONNECTIONS (Top Views)

A1 A2

B1 B2

IN OUT

EN GND

MARKING

DIAGRAMS

X, XX, XXX = Specific Device Code

M = Date Code

XDFN4

CASE 711AJ

WLCSP4

CASE 567JZ A1

1XX M

WLCSP4

CASE 567KA A1

SOT23−5

CASE 527AH

OUT

GND

OUT

GND

EPAD

XXX M

NCP161

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Figure 2. Simplified Schematic Block Diagram

THERMAL

SHUTDOWN

MOSFET

DRIVER WITH

CURRENT LIMIT

INTEGRATED

SOFT−START

BANDGAP

REFERENCE

ENABLE

LOGIC

OUT

GND

* ACTIVE DISCHARGE

Version A only

PIN FUNCTION DESCRIPTION

Pin No.

CSP4

Pin No.

SOT23−5

Pin No.

XDFN4

Name Description

A1 1 4 IN Input voltage supply pin

A2 5 1 OUT Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.

B1 3 3 EN Chip enable: Applying VEN < 0.4 V disables the regulator, Pulling VEN > 1.2 V enables the LDO.

B2 2 2 GND Common ground connection

− − EPAD EPAD Expose pad should be tied to ground plane for better power dissipation

ABSOLUTE MAXIMUM RATINGS

Rating Symbol Value Unit

Input Voltage (Note 1) VIN −0.3 V to 6 V

Output Voltage VOUT −0.3 to VIN + 0.3, max. 6 V

Chip Enable Input VCE −0.3 to 6 V

Output Short Circuit Duration tSC unlimited s

Maximum Junction Temperature TJ150 °C

Storage Temperature TSTG −55 to 150 °C

ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V

ESD Capability, Machine Model (Note 2) ESDMM 200 V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per EIA/JESD22−A114

ESD Machine Model tested per EIA/JESD22−A115

Latchup Current Maximum Rating tested per JEDEC standard: JESD78.

THERMAL CHARACTERISTICS

Rating Symbol Value Unit

Thermal Characteristics, CSP4 (Note 3) Thermal Resistance, Junction−to−Air

RqJA

108

°C/W

Thermal Characteristics, XDFN4 (Note 3) Thermal Resistance, Junction−to−Air 198.1

Thermal Characteristics, SOT23−5 (Note 3) Thermal Resistance, Junction−to−Air 218

3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7

NCP161

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ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA, CIN = COUT = 1 mF, unless otherwise

noted. VEN = 1.2 V. Typical values are at TJ = +25°C (Note 4).

Parameter Test Conditions Symbol Min Typ Max Unit

Operating Input Voltage VIN 1.9 5.5 V

Output Voltage Accuracy VIN = VOUT(NOM) + 1 V

0 mA ≤ IOUT ≤ 450 mA

WLCSP4, XDFN4

VOUT

−2 +2 %

VIN = VOUT(NOM) + 1 V SOT23−5−2 +2

Line Regulation VOUT(NOM) + 1 V ≤ VIN ≤ 5.5 V LineReg 0.02 %/V

Load Regulation IOUT = 1 mA to 450 mA

WLCSP4, XDFN4

WLCSP4, XDFN4 LoadReg

0.001 %/mA

SOT23−50.005 0.008

Dropout Voltage (Note 5) IOUT = 450 mA

WLCSP4, XDFN4

VOUT(NOM) = 1.8 V

VDO

300 450

VOUT(NOM) = 1.85 V 290 393

VOUT(NOM) = 2.5 V 190 315

VOUT(NOM) = 2.8 V 175 290

VOUT(NOM) = 2.85 V 170 290

VOUT(NOM) = 3.0 V 165 275

VOUT(NOM) = 3.3 V 160 260

VOUT(NOM) = 3.5 V 150 255

VOUT(NOM) = 4.5 V 120 210

VOUT(NOM) = 5.0 V 105 190

VOUT(NOM) = 5.14 V 105 185

Dropout Voltage (Note 5) IOUT = 450 mA

SOT23−5

VOUT(NOM) = 1.8 V

VDO

365 480

VOUT(NOM) = 2.8 V 260 345

VOUT(NOM) = 3.0 V 240 330

VOUT(NOM) = 3.3 V 225 305

Output Current Limit VOUT = 90% VOUT(NOM) ICL 450 700 mA

Short Circuit Current VOUT = 0 V ISC 690

Quiescent Current IOUT = 0 mA IQ18 23 mA

Shutdown Current VEN ≤ 0.4 V, VIN = 4.8 V IDIS 0.01 1 mA

EN Pin Threshold Voltage EN Input Voltage “H” VENH 1.2 V

EN Input Voltage “L” VENL 0.4

EN Pull Down Current VEN = 4.8 V IEN 0.2 0.5 mA

Turn−On Time COUT = 1 mF, From assertion of VEN to

VOUT = 95% VOUT(NOM) 120 ms

Power Supply Rejection Ratio IOUT = 20 mA f = 100 Hz

f = 1 kHz

f = 10 kHz

f = 100 kHz

PSRR

Output Voltage Noise f = 10 Hz to 100 kHz IOUT = 1 mA

IOUT = 250 mA VN14

10 mVRMS

Thermal Shutdown Threshold Temperature rising TSDH 160 °C

Temperature falling TSDL 140 °C

Active output discharge resistance VEN < 0.4 V, Version A only RDIS 280 W

Line transient (Note 6) VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) + 1.6 V)

in 30 ms, IOUT = 1 mA TranLINE

−1

VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) + 1 V)

in 30 ms, IOUT = 1 mA +1

Load transient (Note 6) IOUT = 1 mA to 450 mA in 10 msTranLOAD

−40

IOUT = 450 mA to 1mA in 10 ms+40

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TA = 25°C.

Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible.

5. Dropout voltage is characterized when VOUT falls 100 mV below VOUT(NOM).

6. Guaranteed by design.

NCP161

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TYPICAL CHARACTERISTICS

Figure 3. Output Voltage vs. Temperature −

VOUT = 1.8 V − XDFN Package

Figure 4. Output Voltage vs. Temperature −

VOUT = 2.5 V − XDFN Package

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

1201008060200−20−40

1.780

1.785

1.790

1.810

1.800

1.805

1.815

1.820

1201008060400−20−40

2.480

2.485

2.490

2.495

2.500

2.510

2.515

2.520

Figure 5. Output Voltage vs. Temperature −

VOUT = 3.3 V − XDFN Package

Figure 6. Output Voltage vs. Temperature −

VOUT = 3.3 V − CSP Package

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

1201008040200−20−40

3.25

3.26

3.27

3.28

3.29

3.31

3.32

3.33

1201008060400−20−40

3.27

3.28

3.29

3.30

3.31

3.33

3.34

3.35

Figure 7. Output Voltage vs. Temperature −

VOUT = 5.14 V − XDFN Package

Figure 8. Line Regulation vs. Temperature −

VOUT = 1.8 V

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

1201006040200−20−40

5.11

5.12

5.13

5.14

5.15

5.17

5.18

5.19

1201008060200−20−40

0.001

0.003

0.004

0.005

0.007

0.009

0.010

VOUT

, OUTPUT VOLTAGE (V)

VOUT

, OUTPUT VOLTAGE (V)

VOUT

, OUTPUT VOLTAGE (V)

VOUT

, OUTPUT VOLTAGE (V)

VOUT

, OUTPUT VOLTAGE (V)

REGLINE, LINE REGULATION (%/V)

40 140

1.795

IOUT = 10 mA

IOUT = 450 mA

VIN = 2.8 V

VOUT = 1.8 V

CIN = 1 mF

COUT = 1 mF

20 140

2.505

IOUT = 10 mA

IOUT = 450 mA

VIN = 3.5 V

VOUT = 2.5 V

CIN = 1 mF

COUT = 1 mF

IOUT = 10 mA

IOUT = 450 mA

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

3.30

60 140 20 140

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

IOUT = 10 mA and 450 mA

3.32

80 140

IOUT = 10 mA

IOUT = 450 mA

VIN = 5.5 V

VOUT = 5.14 V

CIN = 1 mF

COUT = 1 mF

5.16

40 140

0.002

0.006

0.008

VIN = 2.8 V

VOUT = 1.8 V

CIN = 1 mF

COUT = 1 mF

NCP161

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TYPICAL CHARACTERISTICS

Figure 9. Line Regulation vs. Temperature −

VOUT = 3.3 V

Figure 10. Line Regulation vs. Temperature −

VOUT = 5.14 V

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

1201008060200−20−40

0.001

0.003

0.004

0.006

0.007

0.009

0.010

1201008060200−20−40

0.002

0.004

0.006

0.012

0.014

0.016

0.020

Figure 11. Load Regulation vs. Temperature −

VOUT = 1.8 V (WLCSP4)

Figure 12. Load Regulation vs. Temperature −

VOUT = 3.3 V (WLCSP4)

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

120806040200−20−40

0.0002

0.0006

0.0008

0.0010

0.0014

0.0016

0.0020

1201008060200−20−40

0.0002

0.0006

0.0008

0.0010

0.0014

0.0016

0.0020

Figure 13. Load Regulation vs. Temperature −

VOUT = 5.14 V (WLCSP4)

Figure 14. Load Regulation vs. Temperature

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

1201008040200−20−40

0.0002

0.0006

0.0008

0.0012

0.0014

0.0018

0.0020

12080604020−20−40

REGLINE, LINE REGULATION (%/V)REGLOAD, LOAD REGULATION (%/mA)

REGLOAD, LOAD REGULATION (%/mA)

REGLOAD, LOAD REGULATION (mV)

40 140

0.002

0.005

0.008

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

40 140

0.008

0.010

0.018 VIN = 5.5 V

VOUT = 5.14 V

CIN = 1 mF

COUT = 1 mF

100 140

0.0004

0.0012

0.0018

VIN = 2.8 V, VOUT = 1.8 V

CIN = 1 mF, COUT = 1 mF

IOUT = 1 mA to 450 mA

40 140

0.0004

0.0012

0.0018

VIN = 4.3 V, VOUT = 3.3 V

CIN = 1 mF, COUT = 1 mF

IOUT = 1 mA to 450 mA

60 140

0.0004

0.0010

0.0016

VIN = 5.5 V, COUT = 1 mF

VOUT = 5.14 V, CIN = 1 mF

IOUT = 1 mA to 450 mA

0 100 140

IOUT = 1 mA to 450 mA

CIN = 1 mFSOT23−5 Package

REGLINE, LINE REGULATION (%/V)

XDFN4 Package

WLCSP4 Package

NCP161

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TYPICAL CHARACTERISTICS

Figure 15. Ground Current vs. Load Current −

VOUT = 1.8 V

IOUT

, OUTPUT CURRENT (mA)

450350300250200150500

0.2

0.6

0.8

1.2

1.4

1.8

2.0

IGND, GROUND CURRENT (mA)

0.4

1.0

1.6

100 400 500

VIN = 2.8 V

VOUT = 1.8 V

CIN = 1 mF

COUT = 1 mF

TJ = 125°C

TJ = 25°C

TJ = −40°C

Figure 16. Ground Current vs. Load Current −

VOUT = 3.3 V

Figure 17. Ground Current vs. Load Current −

VOUT = 5.14 V

IOUT

, OUTPUT CURRENT (mA) IOUT

, OUTPUT CURRENT (mA)

450350300250150100500

0.2

0.6

0.8

1.2

1.4

1.8

2.0

450400300250200100500

0.25

0.75

1.00

1.50

1.75

2.25

2.50

Figure 18. Dropout Voltage vs. Load Current −

VOUT = 1.8 V

Figure 19. Dropout Voltage vs. Load Current −

VOUT = 3.3 V

IOUT

, OUTPUT CURRENT (mA) IOUT

, OUTPUT CURRENT (mA)

450400300200150100500

120

160

240

280

360

400

450400300250200100500

100

175

225

IGND, GROUND CURRENT (mA)

VDROP

, DROPOUT VOLTAGE (mV)

VDROP

, DROPOUT VOLTAGE (mV)

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

TJ = 125°C

TJ = 25°C

TJ = −40°C

200 400 500

0.4

1.0

1.6

150 350 500

0.50

1.25

2.00

VIN = 5.5 V

VOUT = 5.14 V

CIN = 1 mF

COUT = 1 mF

TJ = 125°C

TJ = 25°C

TJ = −40°C

VOUT = 1.8 V

CIN = 1 mF

COUT = 1 mF

TJ = 125°C

TJ = 25°C

TJ = −40°C

200

320

250 350 500

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

TJ = 125°C

TJ = 25°C

TJ = −40°C

150 350 500

150

200

125

NCP161

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TYPICAL CHARACTERISTICS

Figure 20. Dropout Voltage vs. Load Current −

VOUT = 5.14 V

Figure 21. Dropout Voltage vs. Temperature−

VOUT = 1.8 V

IOUT

, OUTPUT CURRENT (mA) TJ, JUNCTION TEMPERATURE (°C)

450400300250200100500

105

135

150

1201008060200−20−40

120

160

240

280

360

400

VDROP

, DROPOUT VOLTAGE (mV)

VDROP

, DROPOUT VOLTAGE (mV)

150 350 500

120

VOUT = 5.14 V

CIN = 1 mF

COUT = 1 mF

TJ = 125°C

TJ = 25°C

TJ = −40°C

40 140

200

320

IOUT = 0 mA

IOUT = 450 mA

VOUT = 1.8 V

CIN = 1 mF

COUT = 1 mF

Figure 22. Dropout Voltage vs. Temperature−

VOUT = 3.3 V

Figure 23. Dropout Voltage vs. Temperature−

VOUT = 5.14 V

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

1201008060200−20−40

100

150

175

225

250

1201008060400−20−40

105

135

150

VDROP

, DROPOUT VOLTAGE (mV)

VDROP

, DROPOUT VOLTAGE (mV)

40 140

125

200

IOUT = 0 mA

IOUT = 450 mA

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

20 140

120

IOUT = 0 mA

IOUT = 450 mA

VOUT = 5.14 V

CIN = 1 mF

COUT = 1 mF

Figure 24. Dropout Voltage vs. Temperature

VOUT = 1.8 V

TJ, JUNCTION TEMPERATURE (°C)

1201008060200−20−40

150

200

300

350

450

500

VDROP

, DROPOUT VOLTAGE (mV)

40 140

100

250

400

IOUT = 450 mA

CIN = 1 mF

COUT = 1 mF

SOT23−5 Package

XDFN4 Package

WLCSP4 Package

NCP161

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TYPICAL CHARACTERISTICS

Figure 25. Current Limit vs. Temperature Figure 26. Short Circuit Current vs.

Temperature

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

1201008060400−20−40

650

670

680

690

710

720

740

750

1201008060400−20−40

600

610

630

640

660

670

690

700

Figure 27. Enable Threshold Voltage vs.

Temperature

Figure 28. Enable Current Temperature

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

1201008060200−20−40

0.1

0.3

0.4

0.6

0.7

0.9

1.0

1201008060400−20−40

0.05

0.10

0.20

0.30

0.35

0.40

0.50

ICL, CURRENT LIMIT (mA)

ISC, SHORT CIRCUIT CURRENT (mA)

VEN, ENABLE VOLTAGE THRESHOLD (V)

IEN, ENABLE PIN CURRENT (mA)

20 140

660

700

730

VIN = 4.3 V

VOUT = 90% VOUT(nom)

CIN = 1 mF

COUT = 1 mF

20 140

620

650

680

VIN = 4.3 V

VOUT = 0 V (Short)

CIN = 1 mF

COUT = 1 mF

40 140

0.2

0.5

0.8

OFF −> ON

ON −> OFF

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

20 140

0.15

0.25

0.45

Figure 29. Disable Current vs. Temperature Figure 30. Discharge Resistivity vs.

Temperature

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

1201008060200−20−40

100

1201008060400−20−40

200

220

230

240

260

270

290

300

IDIS, DISABLE CURRENT (nA)

RDIS, DISCHARGE RESISTIVITY

40 140

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

20 140

210

250

280

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

NCP161

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TYPICAL CHARACTERISTICS

Figure 31. Output Voltage Noise Spectral Density − VOUT = 1.8 V

FREQUENCY (kHz)

10001001010.10.01

100

1000

10,000

Figure 32. Output Voltage Noise Spectral Density − VOUT = 3.3 V

FREQUENCY (kHz)

10001001010.10.01

100

1000

10,000

OUTPUT VOLTAGE NOISE (nV/√Hz)

1 mA 14.62 14.10

10 mA 11.12 10.48

250 mA 10.37 9.82

10 Hz − 100 kHz 100 Hz − 100 kHz

RMS Output Noise (mV)

IOUT

1 mA 16.9 15.79

10 mA 12.64 11.13

250 mA 11.96 10.64

10 Hz − 100 kHz 100 Hz − 100 kHz

RMS Output Noise (mV)

IOUT

OUTPUT VOLTAGE NOISE (nV/√Hz)

VIN = 2.8 V

VOUT = 1.8 V

CIN = 1 mF

COUT = 1 mF

IOUT = 1 mA

IOUT = 250 mA

IOUT = 10 mA

VIN = 4.3 V

VOUT = 3.3 V

CIN = 1 mF

COUT = 1 mF

IOUT = 1 mA

IOUT = 450 mA

IOUT = 10 mA

450 mA 10.22 9.62

450 mA 11.50 10.40

IOUT = 450 mA

IOUT = 250 mA

NCP161

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TYPICAL CHARACTERISTICS

Figure 33. Power Supply Rejection Ratio,

VOUT = 1.8 V

Figure 34. Power Supply Rejection Ratio,

VOUT = 3.3 V

FREQUENCY (kHz) FREQUENCY (kHz)

10k1k1001010.10.01

100

120

10k1k1001010.10.01

100

120

Figure 35. Power Supply Rejection Ratio,

VOUT = 5.14 V

Figure 36. Stability vs. ESR

FREQUENCY (kHz) IOUT

, OUTPUT CURRENT (mA)

10k1k1001010.10.01

300250200150100500

0.1

100

Figure 37. Enable Turn−on Response −

COUT = 1 mF, I OUT = 10 mA

Figure 38. Enable Turn−on Response −

COUT = 1 mF, I OUT = 250 mA

100 ms/div 100 ms/div

RR, RIPPLE REJECTION (dB)

ESR (W)

500 mV/div

VIN = 2.5 V

VOUT = 1.8 V

COUT = 1 mF

IOUT = 10 mA

IOUT = 250 mA

IOUT = 20 mA

IOUT = 100 mA

VIN = 3.6 V

VOUT = 3.3 V

COUT = 1 mF

IOUT = 10 mA

IOUT = 250 mA

IOUT = 100 mA

IOUT = 20 mA

VIN = 5.5 V

VOUT = 5.14 V

COUT = 1 mF

IOUT = 20 mA

IOUT = 250 mA

IOUT = 10 mA

IOUT = 100 mA

Unstable Operation

Stable Operation

VIN = 2.8 V, VOUT = 1.8 V

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

VEN

IINPUT

VOUT

1 V/div

500 mV/div1 V/div

200 mA/div

VIN = 2.8 V, VOUT = 1.8 V

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

VEN

IINPUT

VOUT

IOUT = 450 mA IOUT = 450 mA

IOUT = 450 mA

500450400350

NCP161

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TYPICAL CHARACTERISTICS

Figure 39. Line Transient Response −

VOUT = 1.8 V

Figure 40. Line Transient Response −

VOUT = 3.3 V

20 ms/div 20 ms/div

Figure 41. Line Transient Response −

VOUT = 5.14 V

Figure 42. Turn−on/off − Slow Rising VIN

20 ms/div 4 ms/div

Figure 43. Load Transient Response −

1 mA to 450 mA − VOUT = 1.8 V

Figure 44. Load Transient Response −

450 mA to 1 mA − VOUT = 1.8 V

4 ms/div 20 ms/div

500 mV/div

VOUT = 1.8 V, IOUT = 10 mA

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

VIN

3.3 V

VOUT

10 mV/div

2.3 V

500 mV/div10 mV/div

VOUT = 3.3 V, IOUT = 10 mA

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

4.8 V

3.8 V

1 V/div200 mA/div100 mV/div

200 mV/div

VOUT = 5.14 V, IOUT = 10 mA

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

VIN

5.5 V

VOUT

10 mV/div

5.3 V

VOUT = 2.8 V, CIN = 1 mF (MLCC)

IOUT = 10 mA, COUT = 1 mF (MLCC)

VIN

VOUT

200 mA/div100 mV/div

VIN = 2.8 V, VOUT = 1.8 V

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

IOUT

VOUT

tRISE = 1 ms

VIN = 2.8 V, VOUT = 1.8 V

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

IOUT

VOUT

tFALL = 1 ms

VIN

VOUT

NCP161

www.onsemi.com

TYPICAL CHARACTERISTICS

Figure 45. Load Transient Response −

1 mA to 450 mA − VOUT = 3.3 V

Figure 46. Load Transient Response −

450 mA to 1 mA − VOUT = 3.3 V

4 ms/div 20 ms/div

Figure 47. Load Transient Response −

1 mA to 450 mA − VOUT = 5.14 V

Figure 48. Load Transient Response −

450 mA to 1 mA − VOUT = 5.14 V

4 ms/div 20 ms/div

Figure 49. Short Circuit and Thermal

Shutdown

Figure 50. Enable Turn−off

10 ms/div 400 ms/div

200 mA/div100 mV/div

VIN = 4.3 V, VOUT = 3.3 V

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

IOUT

VOUT

tRISE = 1 ms

200 mA/div100 mV/div

VIN = 4.3 V, VOUT = 3.3 V

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

IOUT

VOUT

tFALL = 1 ms

200 mA/div100 mV/div

VIN = 5.5 V, VOUT = 5.14 V

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

IOUT

VOUT

tFALL = 1 ms

200 mA/div100 mV/div

VIN = 5.5 V, VOUT = 5.14 V

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

IOUT

VOUT

tRISE = 1 ms

500 mV/div1 V/div

VIN = 3.8 V

VOUT = 2.8 V

CIN = 1 mF (MLCC)

VEN

VOUT

COUT = 1 mF

COUT = 4.7 mF

500 mA/div1 V/div

IOUT

VOUT

Short Circuit Event

Overheating

Thermal Shutdown

TSD Cycling

VIN = 5.5 V

VOUT = 3.3 V

CIN = 1 mF (MLCC)

COUT = 1 mF (MLCC)

NCP161

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APPLICATIONS INFORMATION

General

The NCP161 is an ultra−low noise 450 mA low dropout

regulator designed to meet the requirements of RF

applications and high performance analog circuits. The

NCP161 device provides very high PSRR and excellent

dynamic response. In connection with low quiescent current

this device is well suitable for battery powered application

such as cell phones, tablets and other. The NCP161 is fully

protected in case of current overload, output short circuit and

overheating.

Input Capacitor Selection (CIN)

Input capacitor connected as close as possible is necessary

for ensure device stability. The X7R or X5R capacitor

should be used for reliable performance over temperature

range. The value of the input capacitor should be 1 mF or

greater to ensure the best dynamic performance. This

capacitor will provide a low impedance path for unwanted

AC signals or noise modulated onto constant input voltage.

There is no requirement for the ESR of the input capacitor

but it is recommended to use ceramic capacitors for their low

ESR and ESL. A good input capacitor will limit the

influence of input trace inductance and source resistance

during sudden load current changes.

Output Decoupling (COUT)

The NCP161 requires an output capacitor connected as

close as possible to the output pin of the regulator. The

recommended capacitor value is 1 mF and X7R or X5R

dielectric due to its low capacitance variations over the

specified temperature range. The NCP161 is designed to

remain stable with minimum effective capacitance of 0.7 mF

to account for changes with temperature, DC bias and

package size. Especially for small package size capacitors

such as 0201 the effective capacitance drops rapidly with the

applied DC bias. Please refer Figure 51.

Figure 51. Capacity vs DC Bias Voltage

There is no requirement for the minimum value of

Equivalent Series Resistance (ESR) for the COUT but the

maximum value of ESR should be less than 2 Ω. Larger

output capacitors and lower ESR could improve the load

transient response or high frequency PSRR. It is not

recommended to use tantalum capacitors on the output due

to their large ESR. The equivalent series resistance of

tantalum capacitors is also strongly dependent on the

temperature, increasing at low temperature.

Enable Operation

The NCP161 uses the EN pin to enable/disable its device

and to deactivate/activate the active discharge function.

If the EN pin voltage is <0.4 V the device is guaranteed to

be disabled. The pass transistor is turned−off so that there is

virtually no current flow between the IN and OUT. The

active discharge transistor is active so that the output voltage

VOUT is pulled to GND through a 280 Ω resistor. In the

disable state the device consumes as low as typ. 10 nA from

the VIN.

If the EN pin voltage >1.2 V the device is guaranteed to

be enabled. The NCP161 regulates the output voltage and

the active discharge transistor is turned−off.

The EN pin has internal pull−down current source with

typ. value of 200 nA which assures that the device is

turned−off when the EN pin is not connected. In the case

where the EN function isn’t required the EN should be tied

directly to IN.

Output Current Limit

Output Current is internally limited within the IC to a

typical 700 mA. The NCP161 will source this amount of

current measured with a voltage drops on the 90% of the

nominal VOUT. If the Output Voltage is directly shorted to

ground (VOUT = 0 V), the short circuit protection will limit

the output current to 690 mA (typ). The current limit and

short circuit protection will work properly over whole

temperature range and also input voltage range. There is no

limitation for the short circuit duration.

Thermal Shutdown

When the die temperature exceeds the Thermal Shutdown

threshold (TSD * 160°C typical), Thermal Shutdown event

is detected and the device is disabled. The IC will remain in

this state until the die temperature decreases below the

Thermal Shutdown Reset threshold (TSDU − 140°C typical).

Once the IC temperature falls below the 140°C the LDO is

enabled again. The thermal shutdown feature provides the

protection from a catastrophic device failure due to

accidental overheating. This protection is not intended to be

used as a substitute for proper heat sinking.

Power Dissipation

As power dissipated in the NCP161 increases, it might

become necessary to provide some thermal relief. The

maximum power dissipation supported by the device is

dependent upon board design and layout. Mounting pad

configuration on the PCB, the board material, and the

NCP161

www.onsemi.com

ambient temperature affect the rate of junction temperature

rise for the part.

The maximum power dissipation the NCP161 can handle

is given by:

PD(MAX) +ƪ125oC*TAƫ

qJA

(eq. 1)

The power dissipated by the NCP161 for given

application conditions can be calculated from the following

equations:

PD[VIN @IGND )IOUTǒVIN *VOUTǓ(eq. 2)

Figure 52. qJA and PD (MAX) vs. Copper Area (CSP4)

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

100

110

120

130

140

150

160

0 100 200 300 400 500 600 700

PCB COPPER AREA (mm2)

qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)

PD(MAX), MAXIMUM POWER DISSIPATION (W)

qJA, 2 oz Cu

qJA, 1 oz Cu

PD(MAX), TA = 25°C, 1 oz Cu

PD(MAX), TA = 25°C, 2 oz Cu

Figure 53. qJA and PD (MAX) vs. Copper Area (XDFN4)

0.3

0.4

0.5

0.6

0.8

0.7

0.9

1.0

150

160

170

180

190

200

210

220

0 100 200 300 400 500 600 700

PCB COPPER AREA (mm2)

qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)

PD(MAX), MAXIMUM POWER DISSIPATION (W)

qJA, 1 oz Cu

qJA, 2 oz Cu

PD(MAX), TA = 25°C, 1 oz Cu

PD(MAX), TA = 25°C, 2 oz Cu

NCP161

www.onsemi.com

Figure 54. qJA and PD (MAX) vs. Copper Area (SOT23−5)

0.1

0.2

0.3

0.5

0.4

0.6

0.7

150

175

200

225

250

275

300

325

0 100 200 300 400 500 600 700

PCB COPPER AREA (mm2)

qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)

PD(MAX), MAXIMUM POWER DISSIPATION (W)

qJA, 2 oz Cu

qJA, 1 oz Cu

PD(MAX), TA = 25°C, 1 oz Cu

PD(MAX), TA = 25°C, 2 oz Cu

Reverse Current

The PMOS pass transistor has an inherent body diode

which will be forward biased in the case that VOUT > VIN.

Due to this fact in cases, where the extended reverse current

condition can be anticipated the device may require

additional external protection.

Power Supply Rejection Ratio

The NCP161 features very high Power Supply Rejection

ratio. If desired the PSRR at higher frequencies in the range

100 kHz – 10 MHz can be tuned by the selection of COUT

capacitor and proper PCB layout.

Turn−On Time

The turn−on time is defined as the time period from EN

assertion to the point in which VOUT will reach 98% of its

nominal value. This time is dependent on various

application conditions such as VOUT(NOM), COUT, TA.

PCB Layout Recommendations

To obtain good transient performance and good regulation

characteristics place CIN and COUT capacitors close to the

device pins and make the PCB traces wide. In order to

minimize the solution size, use 0402 or 0201 capacitors with

appropriate capacity. Larger copper area connected to the

pins will also improve the device thermal resistance. The

actual power dissipation can be calculated from the equation

above (Equation 2). Expose pad can be tied to the GND pin

for improvement power dissipation and lower device

temperature.

NCP161

www.onsemi.com

ORDERING INFORMATION

Device

Nominal

Output

Voltage Description Marking Rotation Package Shipping

NCP161AFCS180T2G 1.8 V

450 mA, Active Discharge

A 180°

WLCSP4

CASE 567KA*

(Pb-Free)

5000 /

Tape &

Reel

NCP161AFCS250T2G 2.5 V D 180°

NCP161AFCS270T2G 2.7 V V 180°

NCP161AFCS280T2G 2.8 V E 180°

NCP161AFCS285T2G 2.85 V F 180°

NCP161AFCS300T2G 3.0 V J 180°

NCP161AFCS320T2G 3.2 V T 180°

NCP161AFCS330T2G 3.3 V K 180°

NCP161AFCS350T2G 3.5 V L 180°

NCP161AFCS450T2G 4.5 V P 180°

NCP161AFCS500T2G 5.0 V R 180°

NCP161AFCS514T2G 5.14 V Q 180°

NCP161BFCS180T2G 1.8 V

450 mA, Non-Active

Discharge

A 270°

WLCSP4

CASE 567KA*

(Pb-Free)

5000 /

Tape &

Reel

NCP161BFCS250T2G 2.5 V D 270°

NCP161BFCS280T2G 2.8 V E 270°

NCP161BFCS285T2G 2.85 V F 270°

NCP161BFCS300T2G 3.0 V J 270°

NCP161BFCS330T2G 3.3 V K 270°

NCP161BFCS350T2G 3.5 V L 270°

NCP161BFCS450T2G 4.5 V P 270°

NCP161BFCS500T2G 5.0 V R 270°

NCP161BFCS514T2G 5.14 V Q 270°

NCP161AFCT180T2G 1.8 V

450 mA, Active Discharge

A 180°

WLCSP4

CASE 567JZ

(Pb-Free)

5000 /

Tape &

Reel

NCP161AFCT185T2G 1.85 V V 180°

NCP161AFCT250T2G 2.5 V D 180°

NCP161AFCT280T2G 2.8 V E 180°

NCP161AFCT285T2G 2.85 V F 180°

NCP161AFCT290T2G 2.9 V T 180°

NCP161AFCT300T2G 3.0 V J 180°

NCP161AFCT310T2G 3.1 V 6 180°

NCP161AFCT330T2G 3.3 V K 180°

NCP161AFCT350T2G 3.5 V L 180°

NCP161AFCT450T2G 4.5 V P 180°

NCP161AFCT500T2G 5.0 V R 180°

NCP161AFCT514T2G 5.14 V Q 180°

NCP161AFCTC280T2G 2.8 V 450 mA, Active Discharge,

Backside Coating

E 180°

NCP161AFCTC350T2G 3.5 V L 180°

NCP161BFCT180T2G 1.8 V

450 mA, Non-Active

Discharge

A 270°

WLCSP4

CASE 567JZ

(Pb-Free)

5000 /

Tape &

Reel

NCP161BFCT185T2G 1.85 V V 270°

NCP161BFCT250T2G 2.5 V D 270°

NCP161BFCT280T2G 2.8 V E 270°

NCP161BFCT285T2G 2.85 V F 270°

NCP161BFCT300T2G 3.0 V J 270°

NCP161BFCT330T2G 3.3 V K 270°

NCP161BFCT350T2G 3.5 V L 270°

NCP161BFCT450T2G 4.5 V P 270°

NCP161BFCT500T2G 5.0 V R 270°

NCP161BFCT514T2G 5.14 V Q 270°

*UBM = 180 mm (±5 mm)

NCP161

www.onsemi.com

ORDERING INFORMATION

Device Nominal Output Voltage Description Marking Package Shipping

NCP161AMX180TBG 1.8 V

450 mA, Active Discharge

XDFN4

(Pb-Free)

3000 /

Tape &

Reel

NCP161AMX185TBG 1.85 V EY

NCP161AMX250TBG 2.5 V DP

NCP161AMX280TBG 2.8 V DQ

NCP161AMX285TBG 2.85 V DR

NCP161AMX300TBG 3.0 V DT

NCP161AMX320TBG 3.2 V DZ

NCP161AMX330TBG 3.3 V DD

NCP161AMX350TBG 3.5 V DU

NCP161AMX450TBG 4.5 V DV

NCP161AMX500TBG 5.0 V DX

NCP161AMX514TBG 5.14 V DE

NCP161BMX180TBG 1.8 V

450 mA, Non-Active Discharge

XDFN4

(Pb-Free)

3000 /

Tape &

Reel

NCP161BMX250TBG 2.5 V EP

NCP161BMX280TBG 2.8 V EQ

NCP161BMX285TBG 2.85 V ER

NCP161BMX300TBG 3.0 V ET

NCP161BMX330TBG 3.3 V ED

NCP161BMX350TBG 3.5 V EU

NCP161BMX450TBG 4.5 V EV

NCP161BMX500TBG 5.0 V EW

NCP161BMX514TBG 5.14 V EE

NCP161ASN180T1G 1.8 V

450 mA, Active Discharge

JAF

SOT23−5L

(Pb-Free)

3000 /

Tape &

Reel

NCP161ASN250T1G 2.5 V JAA

NCP161ASN280T1G 2.8 V JAC

NCP161ASN300T1G 3.0 V JAD

NCP161ASN330T1G 3.3 V JAG

NCP161ASN350T1G 3.5 V JAH

NCP161ASN500T1G 5.0 V JAE

SOT−23, 5 Lead

CASE 527AH−01

ISSUE O

DATE 19 DEC 2008

TOP VIEW

SIDE VIEW END VIEW

E1 E

PIN #1 IDENTIFICATION

L1 L

Notes:

(1) All dimensions in millimeters. Angles in degrees.

(2) Complies with JEDEC standard MO-178.

θ2

θ1

SYMBOL MIN NOM MAX

θ2 5° 15°

0.00

0.90

0.30

0.08

2.90 BSC

1.60 BSC

0.45

1.45

0.15

1.30

0.50

0.22

0.25 REF

1.15

2.80 BSC

L1 0.60 REF

0.30 0.60

0.95 BSC

0.90

10°

θ1 5° 15°10°

θ0° 8°4°

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98AON34320E

DOCUMENT NUMBER:

DESCRIPTION:

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Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

SOT−23, 5 LEAD

WLCSP4, 0.64x0.64

CASE 567JZ

ISSUE A

DATE 03 AUG 2016

SEATING

PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

DIM

MIN NOM

−−−

MILLIMETERS

b0.195 0.210

e0.35 BSC

−−−

PIN A1

REFERENCE

A0.03 BC

0.05 C

4X b

0.05 C

0.04 0.06

SCALE 4:1

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

A2 0.23 REF

PITCH 0.20

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.35

RECOMMENDED

A1 PACKAGE

OUTLINE

PITCH

MAX

0.610 0.640

0.225

0.33

0.08

0.670

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98AON85781F

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

WLCSP4, 0.64X0.64

WLCSP4, 0.64x0.64

CASE 567KA

ISSUE B

DATE 24 MAR 2020

SCALE 4:1

X = Specific Device Code

M = Date Code

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “G”, may

or may not be present. Some products may

not follow the Generic Marking.

GENERIC

MARKING DIAGRAM*

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98AON85783F

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

WLCSP4, 0.64X0.64

XDFN4 1.0x1.0, 0.65P

CASE 711AJ

ISSUE A

DATE 13 NOV 2015

SCALE 4:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.20 mm FROM THE TERMINAL TIPS.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

ÉÉ

BOTTOM VIEW

NOTE 3

2X 0.05 C

PIN ONE

REFERENCE

TOP VIEW

2X 0.05 C

(A3)

0.05 C

CSEATING

PLANE

SIDE VIEW

DIM MIN MAX

MILLIMETERS

A0.33 0.43

A1 0.00 0.05

A3 0.10 REF

b0.15 0.25

D1.00 BSC

D2 0.43 0.53

E1.00 BSC

e0.65 BSC

L0.20 0.30

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MOUNTING FOOTPRINT*

1.20

0.26

0.24 4X

DIMENSIONS: MILLIMETERS

0.39

RECOMMENDED

GENERIC

MARKING DIAGRAM*

XX = Specific Device Code

M = Date Code

*This information is generic. Please refer

to device data sheet for actual part

marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present.

XX M

PACKAGE

OUTLINE

NOTE 4

e/2

45 5

0.05 BC

0.65

PITCH

DETAIL A

b2 0.02 0.12

L2 0.07 0.17

0.52

0.11

L24X

DETAIL A

b24X

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98AON67179E

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

XDFN4, 1.0X1.0, 0.65P

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ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

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Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,

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