HFBR-0500ETZ Series Versatile Link The Versatile Fiber Optic Connection Data Sheet Description Features The Versatile Link series is a complete family of fiber optic link components for applications requiring a low cost solution. The HFBR-0500ETZ series includes transmitters, receivers, connectors and cable specified for easy design. This series of components is ideal for solving problems with voltage isolation/insulation, EMI/RFI immunity or data security. The optical link design is simplified by the logic compatible receivers and complete specifi-cations for each component. The key optical and electrical parameters of links configured with the HFBR-0500ETZ family are fully guaranteed from -40 to 85 C. A wide variety of package configurations and connectors provide the designer with numerous mechanical solutions to meet application requirements. The transmitter and receiver components have been designed for use in high volume/low cost assembly processes such as auto insertion and wave soldering. Transmitters incorporate a 660 nm LED. Receivers include a monolithic dc coupled, digital IC receiver with open collector Schottky output transistor. An internal pullup resistor is avail able for use in the HFBR-25X1ETZ and HFBR-25X2ETZ receivers. A shield has been integrated into the receiver IC to provide additional, localized noise immunity. Internal optics have been optimized for use with 1 mm diameter plastic optical fiber. Versatile Link specifications incorporate all connector interface losses. Therefore, optical calculations for common link applications are simplified. Extended temperature range -40 to +85 C RoHS-compliant Low cost fiber optic components Enhanced digital links: dc-5 MBd Link distance up to 43m at 1MBd and 20m at 5MBd Low current link: 6 mA peak supply current Horizontal and vertical mounting Interlocking feature High noise immunity Easy connectoring: simplex, duplex, and latching connectors Flame retardant Transmitters incorporate a 660 nm red LED for easy visibility Compatible with standard TTL circuitry Applications Industrial Drives/Frequency Inverters Renewable Energies (Wind Turbines, Solar PV farms) Power electronics Reduction of lightning/voltage transient susceptibility Motor controller triggering Data communications and local area networks Electromagnetic Compatibility (EMC) for regulated systems: FCC, VDE, CSA, etc. Tempest-secure data processing equipment Isolation in test and measurement instruments Error free signalling for industrial and manufacturing equipment Automotive communications and control networks Noise immune communication in audio and video equipment HFBR-0500ETZ Series Part Number Guide HFBR-X5XXETZ 1 = Transmitter 2 = Receiver ET = extended temperature range Z = RoHS compliant 5 = 600 nm Transmitter and Receiver Products 1 = 5 MBd High Performance Link 2 = 1 MBd High Performance Link 6 = 155 MBd Receiver 7 = 155 MBd Transmitter 2 = Horizontal Package 3 = Vertical Package 4 = 30 Tilted Package Available option - Horizontal Package HFBR-x521ETZ HFBR-x522ETZ Available option - Vertical Package HFBR-x531ETZ HFBR-x532ETZ Available option - 30 Tilted Package HFBR-x541ETZ HFBR-x542ETZ Link Selection Guide (Links specified from -40 to 85 C, for plastic optical fiber unless specified.) Signal Rate Distance (m) 25 C Distance (m) Transmitter Receiver 1 MBd 67 43 HFBR-15x2ETZ HFBR-25x2ETZ 5 Mbd 38 20 HFBR-15x1ETZ HFBR-25x1ETZ 2 Application Literature Handling Application Note 1035 (Versatile Link) Versatile Link components are auto-insertable. When wave soldering is performed with Versatile Link components, the optical port plug should be left in to prevent contamination of the port. Do not use reflow solder processes (i.e., infrared reflow or vapor-phase reflow). Nonhalogenated water soluble fluxes (i.e., 0% chloride), not rosin based fluxes, are recommended for use with Versatile Link components. Package and Handling Information The compact Versatile Link package is made of a flame retardant VALOX(R) UL 94 V-0 material (UL file # E121562) and uses the same pad layout as a standard, eight pin dual-in-line package. Vertical and horizontal mountable parts are available. These low profile Versatile Link packages are stackable and are enclosed to provide a dust resistant seal. Snap action simplex, simplex latching, duplex, and duplex latching connectors are offered with simplex or duplex cables. Package Orientation Performance and pinouts for the vertical and horizontal packages are identical. To provide additional attachment support for the vertical Versatile Link housing, the designer has the option of using a selftapping screw through a printed circuit board into a mounting hole at the bottom of the package. For most applications this is not necessary. Package Housing Color Versatile Link components and simplex connectors are color coded to eliminate confusion when making connections. Receivers are blue and transmitters are gray. VALOX is a registered trademark of the General Electric Corporation. 3 Versatile Link components are moisture sensitive devices and are shipped in a moisture sealed bag. If the components are exposed to air for an extended period of time, they may require a baking step before the soldering process. Refer to the special labeling on the shipping tube for details. Recommended Chemicals for Cleaning/Degreasing Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane, heptane. Other: soap solution, naphtha. Do not use partially halogenated hydrocarbons such as 1,1.1 trichloroethane, ketones such as MEK, acetone, chloroform, ethyl acetate, methylene dichloride, phenol, methylene chloride, or N-methylpyrolldone. Also, Avago does not recommend the use of cleaners that use halogenated hydrocarbons because of their potential environmental harm. Mechanical Dimensions Vertical Modules 2 [0.08] Horizontal Modules 3.6 [0.14] 5.1 [0.20] 10.2 [0.40] 6.5 [0.26] 10.2 [0.40] 1 [0.04] 18.8 [0.74] 18.1 [0.71] 5.1 [0.20] 6.5 [0.26] 7.6 [0.30] 4.2 [0.17] 18.9 [0.75] 1.3 [0.05] 0.5 [0.02] 0.6 [0.02] 2.54 [0.100] NOTES: 1) Dimensions: mm [in] 2.8 [0.11] MIN .6 0 3] 0.0 [ 1.7 [0.07] 3.3 [0.13] MAX 7.7 [0.30] 3.6[0.14]MIN. 3.8[0.15]MAX. 0.6 [0.03] 7.6 [0.30] 2 [0.08] 1.3 [0.05] 0.5 [0.02] 7.62 [0.300] 2.54 [0.100] 3.8 [0.15] 1.7 [0.07] 2.8 [0.11] NOTES: 1) Dimensions: mm [in] 2) 2) Optional mounting hole for #2 self-tapping-screw (metric equivalent M2.2 x 0.45) 3.8 [0.15] 2 [0.08] 30 Tilted Modules 6.5 [0.26] 10.2 [0.40] A 30 0.4 [0.02] 2.54 [0.100] 0.5 [0.02] 1.3 [0.05] 4.6 [0.18] 4.6 [0.18] 0.6 [0.03] 6.6 [0.26] 15.2 [0.60] .7 18 4] 7 [0. A 0.7 [0.03] 1.1 [0.05] 8.7 [0.34] 10.1 [0.40] 7.62 [0.300] 2.2 [0.09] NOTES: 1) Dimensions: mm [in] 19.3 [0.76] 4 0.6 3] 0 0. [ Versatile Link Printed Board Layout Dimensions Horizontal Module Vertical Module 7.62 [0.300] 7.62 [0.300] 2.54 [0.100] 2.54 [0.100] 1 ] 4 0.0 [ 2 [ 1 7.7 [0.30] 3 4] 2.25 [0.09] clearance hole for optional vertical mount self-tapping-screw #2 3.8 [0.15] 8 5 1 0.0 4 3 2 1 7.62 [0.300] 4 PCB EDGE 5 1.9 MIN. [0.07] PCB EDGE 3.8 [0.15] NOTES: 8 1.7 [0.07] MIN. 1) Dimensions: mm [in] Footprint - TOP VIEW 7.62 [0.300] 2.54 [0.100] 1 [0 .04] 3 2 1 8.7 [0.34] 4 5 8 PCB EDGE 2.2 MIN. [0.09] NOTES: 1) Dimensions: mm [in] Footprint - TOP VIEW 5 1) Dimensions: mm [in] Footprint - TOP VIEW 30 Tilted Modules NOTES: Interlocked (Stacked) Assemblies (refer to Figure 1) Horizontal packages may be stacked by placing units with pins facing upward. Initially engage the interlocking mechanism by sliding the L bracket body from above into the L slot body of the lower package. Use a straight edge, such as a ruler, to bring all stacked units into uniform alignment. This technique prevents potential harm that could occur to fingers and hands of assemblers from the package pins. Stacked horizontal packages can be disengaged if necessary. Repeated stacking and unstacking causes no damage to individual units. Stacking Horizontal Modules Stacking Vertical Modules Stacking 30 Tilted Modules Figure 1. Interlocked (stacked) horizontal, vertical or 30 tilted packages 6 To stack vertical packages, hold one unit in each hand, with the pins facing away and the optical ports on the bottom. Slide the L bracket unit into the L slot unit. The straight edge used for horizontal package alignment is not needed. 5 MBd Link (HFBR-15X1ETZ/25X1ETZ) System Performance -40 to 85 C, unless otherwise specified. Parameter High Performance 5 MBd Symbol Data Rate Link Distance Typ. dc Max. 5 Units MBd m Conditions Ref. BER 10-9, PRBS:27-1 d 17 33 m IFdc = 60 mA, 25 C d 20 m IFdc = 60 mA (Standard Cable) Link Distance Min. IFdc = 60 mA Notes 3, 4 Notes 3, 4 m IFdc = 60 mA, 25 C Propagation tPLH 90 140 ns RL = 560 , CL = 30 pF Fig. 3, 6 Delay tPHL 50 140 ns fiber length = 0.5 m Notes 1, 2, 4 (Improved Cable) 38 -21.6 PR -9.5 dBm Pulse Width Distortion tPLH-tPHL tD 40 ns PR = -15 dBm Fig. 3, 5 RL = 560 , CL = 30 pF Note 4 Notes: 1. The propagation delay for one metre of cable is typically 5 ns. 2. Typical propagation delay is measured at PR = -15 dBm. 3. Estimated typical link life expectancy at 40 C exceeds 10 years at 60 mA. 4. Optical link performance is guaranteed only with transmitter HFBR-15x1ETZ and receiver HFBR-25x1ETZ. Figure 2. Typical 5 MBd interface circuit Figure 3. 5 MBd propagation delay test circuit 7 Figure 4. Propagation delay test waveforms 100 60 50 40 30 20 X5X1ETZ -40 C X5X1ETZ 25 C X5X1ETZ 85 C 10 0 -27 -24 -21 -18 -15 -12 PR - INPUT OPTICAL POWER - dBm Figure 5. Typical link pulse width distortion vs. optical power 8 tP - PROPAGATION DELAY - ns tD - PULSE WIDTH DISTORTION - ns 70 -9 -6 80 60 40 20 0 -27 tPLH X5X1ETZ tPHL X5X1ETZ -24 -21 -18 -15 -12 PR - INPUT OPTICAL POWER - dBm Figure 6. Typical link propagation delay vs. optical power -9 -6 HFBR-15X1ETZ Transmitter Pin # Function 1 1 Anode 2 2 Cathode Ground GROUND 3 3 4 4 Ground GROUND 5 Ground 8 Ground 8 GROUND ANODE CATHODE 5 GROUND Note: Pins 5 and 8 are for mounting and retaining purposes only. Do not electrically connect these pins. Absolute Maximum Ratings Parameter Symbol Min. Max. Units TS -40 +85 C TA -40 +85 C 260 C Storage Temperature Operating Temperature Lead Soldering Cycle Temp. Time Forward Input Current Reverse Input Voltage 10 sec IFPK 1000 mA IFdc 80 VBR 5 Reference Note 1, 4 Note 2, 3 V Notes: 1. 2. 3. 4. 1.6 mm below seating plane. Recommended operating range between 10 and 750 mA. 1 s pulse, 20 s period. Moisture sensitivity level is MSL-3 All HFBR-15XXETZ LED transmitters are classified as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed draft scheduled to go into effect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. Contact your local Avago sales representative for more information. 9 Transmitter Electrical/Optical Characteristics -40 to 85 C unless otherwise specified. Parameter Symbol Transmitter Output Optical Power Output Optical Power PT Min. Typ.[5] Max. Units Conditions -16.8 -7.1 dBm IFdc = 60 mA -14.3 -8.0 dBm IFdc = 60 mA, 25 C PT /T -0.85 %/C PK 660 nm Ref. Notes 1, 2 Temperature Coefficient Peak Emission Wavelength 1.43 1.67 2.05 V IFdc = 60 mA Forward Voltage VF Forward Voltage VF /T -1.37 mV/C D 1 mm 11.0 V Fig. 7 Temperature Coefficient Effective Diameter Reverse Input Breakdown VBR 5.0 IFdc = 10 A, TA = 25 C Voltage Diode Capacitance CO 86 pF VF = 0, f = MHz Rise Time tr 20 ns Fall Time tf 20 ns 10% to 90%, IF = 60 mA Note 3 Notes: 1. Optical power measured at the end of 0.5 m of 1 mm diameter POF (NA = 0.5) with a large area detector. 2. Optical power, P (dBm) = 10 Log [P(W)/1000 W]. 3. Rise and fall times are measured with a voltage pulse driving the transmitter driver IC (75451). A wide bandwidth optical to electrical waveform analyzer, terminated to a 50 input of a wide bandwidth oscilloscope, is used for this response time measurement. 5 PT - NORMALIZED OUTPUT POWER - dB 1.8 VF - VORWARD VOLTAGE - V 1.75 1.7 1.65 1.6 1.55 1.5 -40 C 25 C 85 C 1.45 1.4 1 10 IFdc - TRANSMITTER DRIVE CURRENT (mA) Figure 7. Typical forward voltage vs. drive current 10 100 0 -5 -10 -40 C 25 C 85 C -15 -20 1 10 IFdc - TRANSMITTER DRIVE CURRENT (mA) Figure 8. Normalized typical output power vs. drive current 100 HFBR-25X1ETZ Receiver DO NOT CONNECT 1 VO 4 2 Ground 3 VCC 3 VCC GROUND 4 RL VO 5 Ground 8 Ground 2 1 DO NOT CONNECT Function RL 5 1000 Pin # 8 Note: Pins 5 and 8 are for mounting and retaining purposes only. Do not electrically connect these pins. Absolute Maximum Ratings Parameter Storage Temperature Operating Temperature Lead Soldering Cycle Symbol Min. Max. Units TS -40 +85 C TA -40 +85 C 260 C 10 sec 7 V Temp. Time Supply Voltage VCC -0.5 Output Collector Current IOAV 25 mA Output Collector Power Dissipation POD 40 mW Output Voltage VO -0.5 18 V Pull-up Voltage VP -5 VCC V Fan Out (TTL) N Reference Note 1, 3 Note 2 5 Notes: 1. 1.6 mm below seating plane. 2. It is essential that a bypass capacitor 0.1 F be connected from pin 2 to pin 3 of the receiver. Total lead length between both ends of the capacitor and the pins should not exceed 20 mm. 3. Moisture sensitivity level is MSL-3 Receiver Electrical/Optical Characteristics -40 to 85 C, 4.75 V VCC 5.25 V, unless otherwise specified. Parameter Input Optical Power Level for Logic "0" Symbol Min. Max. Units Conditions Ref. PR(L) -21.6 -9.5 dBm Notes 1, 2, 4, 5 -21.6 -8.7 VOL = 0.5 V IOL = 8 mA VOL = 0.5 V IOL = 8 mA, 25 C VOL = 5.25 V IOH 250 A VO = 18 V, PR = 0 IOL = 8 mA, PR = PR(L)MIN VCC = 5.25 V, PR = 0 VCC = 5.25 V PR = -12.5 dBm Input Optical Power Level for Logic "1" High Level Output Current Low Level Output Voltage PR(H) IOH VOL High Level Supply Current Low Level Supply Current Effective Diameter Internal Pull-up Resistor Typ. -43 dBm 5 0.4 250 0.5 A V ICCH 3.5 6.3 mA ICCL 6.2 10 mA 1 1000 1700 mm D RL 680 Notes 1, 5 Notes 3, 5 Notes 3, 5 Notes 3, 5 Notes 3, 5 Notes: 1. 2. 3. 4. Optical flux, P (dBm) = 10 Log [P (W)/1000 W]. Optical power measured at the end of 1 mm diameter POF (NA = 0.5) with a large area detector. RL is open. Pulsed LED operation at IF > 80 mA will cause increased link tPLH propagation delay time. This extended tPLH time contributes to increased pulse width distortion of the receiver output signal. 5. Guaranteed only if optical input signal to the receiver is generated by HFBR-15x1ETZ, with ideal alignment to photo diode using 1mm POF (NA=0.5). 11 1 MBd Link (High Performance HFBR-15X2ETZ/25X2ETZ) System Performance Under recommended operating conditions, unless otherwise specified. Parameter High Performance 1 MBd Symbol Data Rate Link Distance Typ. dc Max. 1 Units Conditions MBd BER 10-9, PRBS:27-1 m IFdc = 60 mA d 37 58 m IFdc = 60 mA, 25 C d 43 m IFdc = 60 mA (Standard Cable) Link Distance Min. m IFdc = 60 mA, 25 C Propagation tPLH 100 250 ns RL = 560 , CL = 30 pF Delay tPHL 80 140 ns (Improved Cable) 67 I = 0.5 metre Ref. Notes 1, 3, 4, 5 Notes 1, 3, 4, 5 Fig. 10, 12 Notes 2, 4, 5 PR = -24 dBm Pulse Width tD Distortion tPLH-tPHL 20 ns PR = -24 dBm Fig. 10, 11 RL = 560 , CL = 30 pF Notes 4, 5 Notes: 1. For IFPK > 80 mA, the duty factor must be such as to keep IFdc 80 mA. In addition, for IFPK > 80 mA, the following rules for pulse width apply: IFPK 160 mA: Pulse width 1 ms IFPK > 160 mA: Pulse width 1 S, period 20 S. 2. The propagation delay for one meter of cable is typically 5 ns. 3. Estimated typical link life expectancy at 40 C exceeds 10 years at 60 mA. 4. Pulsed LED operation at IFPK > 80 mA will cause increased link tPLH propagation delay time. This extended tPLH time contributes to increased pulse width distortion of the receiver output signal. 5. Optical link performance is guaranteed only with transmitter HFBR-15x2ETZ and receiver HFBR-25x2ETZ. Figure 9. Required 1 MBd interface circuit The HFBR-25X2ETZ receiver cannot be overdriven when using the required interface circuit shown in Figure 9 12 Figure 10. 1 MBd propagation delay test circuit 120 80 70 60 50 40 30 X5X2ETZ -40 C X5X2ETZ 25 C X5X2ETZ 85 C 20 10 0 -27 -24 -21 -18 -15 -12 PR - INPUT OPTICAL POWER - dBm Figure 11. Typical link pulse width distortion vs. optical power Figure 13. Propagation delay test waveforms 13 tP - PROPAGATION DELAY - ns tD - PULSE WIDTH DISTORTION - ns 90 -9 -6 100 80 60 40 tPLH X5X2ETZ tPHL X5X2ETZ 20 0 -27 -24 -21 -18 -15 -12 PR - INPUT OPTICAL POWER - dBm Figure 12. Typical link propagation delay vs. optical power -9 -6 HFBR-15X2ETZ Transmitters CATHODE Function 1 Anode 1 2 Cathode 2 3 Ground 4 Ground 5 Ground 8 Ground 8 GROUND ANODE Pin # GROUND 3 GROUND 4 Note: Pins 5 and 8 are for mounting and retaining purposes only. Do not electrically connect these pins. 5 GROUND Absolute Maximum Ratings Parameter Symbol Min. Max. Units Storage Temperature TS -40 +85 C Operating Temperature TA -40 +85 C Lead Soldering Cycle Temp. 260 C Time 10 sec IFPK 1000 mA IFdc 80 VBR 5 Forward Input Current Reverse Input Voltage Reference Note 1, 4 Note 2, 3 V Notes: 1. 2. 3. 4. 1.6 mm below seating plane. Recommended operating range between 10 and 750 mA. 1 s pulse, 20 s period. Moisture sensitivity level is MSL-3 All HFBR15XXETZ LED transmitters are classified as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed draft scheduled to go into effect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. Contact your Avago sales representative for more information. Transmitter Electrical/Optical Characteristics -40 to 85 C unless otherwise specified. For forward voltage and output power vs. drive current graphs. Parameter Transmitter Output Optical Power Output Optical Power Temperature Coefficient Peak Emission Wavelength Forward Voltage Forward Voltage Temperature Coefficient Effective Diameter Reverse Input Breakdown Voltage Diode Capacitance Rise Time Fall Time Symbol Min. PT -13.9 -11.2 PT /T PK VF VF /T DT VBR CO tr tf Typ. Max. Units Conditions Ref. -4.0 -5.1 dBm IFdc = 60 mA IFdc = 60 mA, 25 C Note 1 -0.85 1.43 5.0 660 1.67 -1.37 %/ C 2.05 nm V mV/ C 1 11.0 mm V 86 20 20 pF ns ns IFdc = 60 mA Fig. 09 IFdc = 10 A, TA = 25 C VF = 0, f = 1 MHz 10% to 90%, IF = 60 mA Note 2 Note: 1. Optical power measured at the end of 0.5 m of 1 mm diameter POF (NA = 0.5) with a large area detector. 2. Rise and fall times are measured with a voltage pulse driving the transmitter driver IC (75451). A wide bandwidth optical to electrical waveform analyzer, terminated to a 50 input of a wide bandwidth oscilloscope, is used for this response time measurement. 14 HFBR-25X2ETZ Receivers DO NOT CONNECT 1000 Function 1 VO 4 2 Ground 3 VCC 3 VCC GROUND 4 RL VO 5 Ground 8 Ground 2 1 DO NOT CONNECT Pin # RL 5 8 Note: Pins 5 and 8 are for mounting and retaining purposes only. Do not electrically connect these pins. Absolute Maximum Ratings Parameter Storage Temperature Operating Temperature Lead Soldering Cycle Symbol Min. Max. Units TS TA -40 -40 +85 +85 260 10 7 25 40 18 VCC 5 C C C sec V mA mW V V Temp. Time Supply Voltage Output Collector Current Output Collector Power Dissipation Output Voltage Pull-up Voltage Fan Out (TTL) VCC IOAV POD VO VP N -0.5 -0.5 -5 Reference Note 1, 3 Note 2 Notes: 1. 1.6 mm below seating plane. 2. It is essential that a bypass capacitor 0.1 F be connected from pin 2 to pin 3 of the receiver. Total lead length between both ends of the capacitor and the pins should not exceed 20 mm. 3. Moisture sensitivity level is MSL-3 Receiver Electrical/Optical Characteristics -40 to 85 C, 4.75 V VCC 5.25 V unless otherwise specified. Parameter Receiver Optical Input Power Level Logic 0 Optical Input Power Level Logic 1 High Level Output Current Low Level Output Voltage Symbol Min. PR(L) -24 Typ. PR(H) Max. Units -9.5 dBm -43 dBm IOH VOL 5 0.4 250 0.5 A V High Level Supply Current ICCH 3.5 6.3 mA Low Level Supply Current ICCL 6.2 10 mA 1 1000 1700 mm Effective Diameter Internal Pull-up Resistor D RL 680 Conditions VOL 0.5 V IOL = 8 mA VOH = 5.25 V IOH = 250 A VO = 18 V, PR = 0 IOL = 8 mA PR = PR(L)MIN VCC = 5.25 V, PR = 0 VCC = 5.25 V, PR = -12.5 dBm Ref. Notes 1, 2, 3, 6 Notes 4, 6 Notes 5, 6 Notes 5, 6 Notes 5, 6 Notes 5, 6 Notes: 1. Optical power measured at the end of 1 mm diameter POF (NA = 0.5) with a large area detector. 2. Pulsed LED operation at IF > 80 mA will cause increased link tPLH propagation delay time. This extended tPLH time contributes to increased pulse width distortion of the receiver output signal. 3. The LED drive circuit of Figure 11 is required for 1 MBd operation of the HFBR-25X2ETZ. 4. Optical flux, P (dBm) = 10 Log [P(W)/1000 W]. 5. RL is open. 6. Guaranteed only if optical input signal to the receiver is generated by HFBR-15x2ETZ, with ideal alignment to photodiode using 1 mm POF (NA=0.5). 15 For product information and a complete list of distributors, please go to our web site: www.broadcom.com. Broadcom, the pulse logo, Connecting everything, Avago Technologies, and the A logo are the trademarks of Broadcom in the United States, certain other countries and/or the EU. Copyright (c) 2005-2016 Broadcom. All Rights Reserved. The term "Broadcom" refers to Broadcom Limited and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. AV02-3283EN - July 25, 2016