2CGHV96100F2 Rev 3.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
rfsales@cree.com
www.cree.com/rf
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Absolute Maximum Ratings (not simultaneous)
Parameter Symbol Rating Units Conditions
Drain-source Voltage VDSS 120 Volts 25˚C
Gate-source Voltage VGS -10, +2 Volts 25˚C
Power Dissipation PDISS 222.0 Watts Pulsed
Storage Temperature TSTG -65, +150 ˚C
Operating Junction Temperature TJ225 ˚C
Maximum Drain Current1IDMAX 12 Amps
Maximum Forward Gate Current IGMAX 28.8 mA 25˚C
Soldering Temperature2TS245 ˚C
Screw Torque τ40 in-oz
Thermal Resistance, Junction to Case RθJC 0.73 ˚C/W Pulse Width = 100 µs, Duty Cycle = 10%, 85˚C, PDISS = 173 W
Case Operating Temperature3TC-40, +125 ˚C
Note:
1 Current limit for long term reliable operation.
2 Refer to the Application Note on soldering at http://www.cree.com/rf/document-library
3 See also, the Power Dissipation De-rating Curve on Page 9.
Electrical Characteristics (Frequency = 9.6 GHz unless otherwise stated; TC = 25˚C)
Characteristics Symbol Min. Typ. Max. Units Conditions
DC Characteristics1
Gate Threshold Voltage VGS(TH) -3.8 -3.0 -2.3 V VDS = 10 V, ID = 28.8 mA
Gate Quiscent Voltage VGS(Q) – -2.7 – V VDS = 40 V, ID = 1000 mA
Saturated Drain Current2IDS 20.7 28.8 – A VDS = 6.0 V, VGS = 2.0 V
Drain-Source Breakdown Voltage VBD 100 – – V VGS = -8 V, ID = 28.8 mA
RF Characteristics3
Small Signal Gain S21 10.5 12.4 – dB VDD = 40 V, IDQ = 1000 mA, PIN = -20 dBm
Input Return Loss 1 S11 – –5.2 -2.8 dB VDD = 40 V, IDQ = 1000 mA, PIN = -20 dBm, 8.4 - 9.4 GHz
Input Return Loss 2 S11 – – -3.3 dB VDD = 40 V, IDQ = 1000 mA, PIN = -20 dBm, 9.4 - 9.6 GHz
Output Return Loss S22 – –12.3 -6.0 dB VDD = 40 V, IDQ = 1000 mA, PIN = -20 dBm
Power Output3,4 POUT 100 131.0 – W VDD = 40 V, IDQ = 1000 mA, PIN = 41.75 dBm
Power Added Efciency3,4 PAE 30 45 – % VDD = 40 V, IDQ = 1000 mA, PIN = 41.75 dBm
Power Gain3,4 PG– 10.2 – dB VDD = 40 V, IDQ = 1000 mA, PIN = 41.75 dBm
Output Mismatch Stress VSWR – – 5:1 YNo damage at all phase angles, VDD = 40 V, IDQ = 1000 mA,
Notes:
1 Measured on-wafer prior to packaging.
2 Scaled from PCM data.
3 Measured in CGHV96100F2-AMP (838179) under 100 µS pulse width, 10% duty
4 Fixture loss de-embedded using the following offsets: Frequency = 9.6 GHz. Input = 0.5 dB and Output = 0.5 dB.