HD74LS47 BCD-to-Seven-Segment Decoder / Driver (with 15 V Outputs) REJ03D0410-0300 Rev.3.00 Jul.22.2005 HD74LS47 features active-low outputs designed for driving incandescent indicators directly. This device has full ripple-blanking input / output controls and a lamp test. Display patterns for BCD input counts above 9 are unique symbols to authenticate input conditions. This circuit incorporates automatic leading and / or trailing-edge zeroblanking control (RBI and RBO). Lamp test (LT) of these types may be performed at any time when the BI / RBO node is at a high level. It contains an overriding blanking input (BI) which can be used to control the lamp intensity of pulsing or to inhibit the outputs. Inputs and outputs are entirely compatible for use with TTL or DTL logic outputs. Features * Ordering Information Part Name Package Type HD74LS47P DILP-16 pin Package Code (Previous Code) PRDP0016AE-B (DP-16FV) Package Abbreviation Taping Abbreviation (Quantity) P -- PRSP0016DH-B FP (FP-16DAV) Note: Please consult the sales office for the above package availability. HD74LS47FPEL EL (2,000 pcs/reel) SOP-16 pin (JEITA) Pin Arrangement B 1 C 2 LT 16 VCC 15 f Inputs BI/RBO B f 3 C g 14 g 4 LT a 13 a BI/RBO b RBI c 12 b D d 11 c A e 10 d 9 e RBI 5 D 6 A 7 GND 8 Inputs (Top view) Rev.3.00, Jul.22.2005, page 1 of 6 Outputs HD74LS47 Function Table Decimal or Function Inputs BI RBO Outputs Note H a ON b ON c ON d ON e ON f ON g OFF H L H H OFF ON ON ON ON OFF OFF ON OFF ON OFF OFF OFF ON H L H L H H ON OFF ON ON ON ON ON OFF OFF OFF OFF ON ON ON H H L H H L H H ON OFF OFF OFF ON ON ON ON OFF ON ON ON ON ON L H H L H L H L H H ON ON ON ON ON ON OFF ON OFF ON OFF ON OFF ON X X H H L L L H H L H H ON OFF ON OFF ON OFF OFF ON OFF ON ON OFF ON ON H H X X H H L H H L H L H H OFF OFF OFF ON ON OFF ON OFF OFF OFF OFF ON ON ON 13 14 H H X X H H H H L H H L H H ON OFF OFF OFF OFF OFF ON ON OFF ON ON ON ON ON 15 BI H X X X H X H X H X H X H L OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF 2 RBI LT H L L X L X L X L X L X L H OFF ON OFF ON OFF ON OFF ON OFF ON OFF ON OFF ON 3 4 0 LT H RBI H D L C L B L A L 1 2 H H X X L L L L L H 3 4 H H X X L L L H 5 6 H H X X L L 7 8 H H X X 9 10 H H 11 12 1 H; high level, L; low level, X, irrelevant Notes: 1. The blanking input (BI) must be open or held at a high logic level when output functions 0 through 15 are desired. The ripple-blanking input (RBI) must be open or high if blanking of a decimal zero is not desired. 2. When a low logic level is applied directly to the blanking input (BI), all segment outputs are off regardless of the level of any other input. 3. When ripple-blanking input (RBI) and inputs A, B, C, and D are a low level with the lamp test input high, all segment outputs go off and the ripple-blanking output (RBO) goes to a low level (response condition). 4. When a blanking input / ripple blanking output (BI / RBO) is open or held high and a low is applied to the lamp-test input, all segment outputs are on. a f g e c d Rev.3.00, Jul.22.2005, page 2 of 6 b 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 HD74LS47 Block Diagram a A b B Inputs C c Outputs D d Blanking Input or Ripple Blanking Output (BI/RBO) e f Lamp Test Input (LT) g Ripple Blanking Input (RBI) Absolute Maximum Ratings Item Supply voltage Input voltage Output current (tw 1ms,duty cycle 10%) Output current (off) Symbol Ratings Unit VCC VIN 7 7 V V IO(peak) 200 mA IO(off) 1 mA Power dissipation Operating temperature PT Tupr 400 -20 to +75 mW C Storage temperature Tstg -65 to +150 C Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Rev.3.00, Jul.22.2005, page 3 of 6 HD74LS47 Recommended Operating Conditions Item Symbol Min Typ Max Unit Supply voltage Output voltage (off) VCC VO(off) 4.75 -- 5.00 -- 5.25 15 V V Input current (on) IO(on) IOH -- -- -- -- 24 -50 mA A IOL Topr -- -20 -- 25 3.2 75 mA C Output current Operating temperature Electrical Characteristics (Ta = -20 to +75 C) Item Input voltage Symbol min. typ.* max. Unit VIH VIL 2.0 -- -- -- -- 0.8 V V VOH 2.4 -- -- V -- -- 0.4 -- -- -- -- 0.5 0.4 -- -- 0.5 BI / RBO Output voltage VOL Output current Input current Condition VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V, IOH = -50 A IOL = 1.6 mA VCC = 4.75 V, V IH = 2 V, VIL = 0.8 V IOL = 3.2 mA V IO(on) = 12 mA VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V IO(on) = 24 mA VCC = 5.25 V, VIH = 2 V, VIL = 0.8 V, VO(off) = 15 V a to g VO(on) a to g IO(off) -- -- 250 A IIH -- -- 20 A -- -- -0.4 mA II -- -- -- -- -1.2 0.1 mA mA VCC = 5.25 V, VI = 7 V -- -2 mA VCC = 5.25 V All input except BI / RBO IIL BI / RBO V Short-circuit BI / RBO output current Supply current** IOS -0.3 ICC -- 7 13 mA Input clamp voltage VIK -- -- -1.5 V VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V VCC = 4.75 V, IIN = -18 mA Notes: * VCC = 5 V, Ta = 25C ** ICC is measured with all outputs open and inputs at 4.5 V. Switching Characteristics (VCC = 5 V, Ta = 25C) Item Turn-on time Turn-off time Symbol ton toff Rev.3.00, Jul.22.2005, page 4 of 6 Input A min. -- typ. -- max. 100 RBI A -- -- -- -- 100 100 RBI -- -- 100 Unit Condition ns CL = 15 pF, RL = 665 ns HD74LS47 Testing Method Test Circuit VCC 4.5V See Function Table a Input P.G. Zout = 50 Note: A B C D RL Output b c d CL e LT RBI BI/RBO f g CL includes probe and jig capacitance. Waveform tTHL tTLH Input 3V 90% 1.3 V 90% 1.3 V 10% 10% 0V ton toff VOH In phase output 1.3 V 1.3 V VOL ton toff VOH 1.3 V Out of phase output 1.3 V VOL Note: Input pulse: tTLH 15 ns, tTHL 6 ns, PRR = 1 MHz, duty cycle 50%. Testing Table Item ton toff RBI D Inputs C B A a b c Outputs d e f g 4.5 V 4.5 V GND GND GND GND GND 4.5 V IN IN OUT -- -- -- -- OUT OUT -- OUT OUT OUT -- -- -- 4.5 V IN GND GND 4.5 V GND 4.5 V GND IN GND OUT OUT OUT OUT -- OUT OUT OUT OUT OUT OUT OUT OUT -- Rev.3.00, Jul.22.2005, page 5 of 6 HD74LS47 Package Dimensions JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g D 9 E 16 1 8 b3 0.89 Z A1 A Reference Symbol L e Nom c e1 D 19.2 E 6.3 JEITA Package Code P-SOP16-5.5x10.06-1.27 RENESAS Code PRSP0016DH-B *1 Previous Code FP-16DAV 7.4 A1 0.51 b p 0.40 b 3 0.48 0.56 1.30 c 0.19 0 e 2.29 0.25 0.31 2.54 2.79 15 1.12 L 2.54 MASS[Typ.] 0.24g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. D F 16 20.32 5.06 Z ( Ni/Pd/Au plating ) Max 7.62 1 A bp e Dimension in Millimeters Min 9 c HE *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) 1 Z *3 bp Nom D 10.06 E 5.50 Max 10.5 A2 8 e Dimension in Millimeters Min x A1 M 0.00 0.10 0.20 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 2.20 A L1 bp b1 c A c A1 y L Detail F 1 0 HE 7.50 1.27 e x 0.12 y 0.15 Z 0.80 0.50 L L Rev.3.00, Jul.22.2005, page 6 of 6 8 1 0.70 1.15 0.90 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. 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