8-Bit, 60MHz Sampling
ANALOG-T O-DIGITAL CONVERTER
FEATURES
HIGH SNR: 49.5dB
INTERNAL/ EXTERNAL REFERENCE
OPTION
SINGLE-ENDED OR
DIFFERENTIAL ANALOG INPUT
PROGRAMMABLE INPUT RANGE:
1Vp-p/2Vp-p
LOW POWER: 170mW
LOW DNL: 0.2LSB
SINGLE +5V SUPPLY OPERATION
SSOP-20 PACKAGE
APPLICATIONS
MEDICAL IMAGING
VIDEO DIGITIZING
COMMUNICATIONS
DISK-DRIVE CONTROL
DESCRIPTION
The ADS830 is a pipeline, CMOS Analog-to-Digital (A/D)
converter that operates from a single +5V power supply.
This converter provides excellent performance with a single-
ended input and can be operated with a differential input
for added spurious performance. This high performance
converter includes an 8-bit quantizer, high bandwidth
track/hold, and a high accuracy internal reference. It also
allows for the user to disable the internal reference and
utilize external references. This external reference option
provides excellent gain and offset matching when used in
multi-channel applications or in applications where DC full
scale range adjustment is required.
The ADS830 employs digital error correction techniques to
provide excellent differential linearity for demanding im-
aging applications. Its low distortion and high SNR give
the extra margin needed for medical imaging, communica-
tions, video, and test instrumentation.
The ADS830 is specified at a maximum sampling fre-
quency of 60MHz and a single-ended input range of 1.5V
to 3.5V. The ADS830 is available in a SSOP-20 package
and is pin-for-pin compatible with the 8-bit, 80MHz ADS831.
TM
¤
ADS830
8-Bit
Pipelined
A/D Core
Internal
Reference
Optional External
Reference
Timing
Circuitry
Error
Correction
Logic
3-State
Outputs
T/H
CLK VDRV
ADS830
+VS
Int/Ext
D0
D7
INVIN
IN
(Opt)
ADS830
SBAS086A APRIL 2001
www.ti.com
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2001, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ADS830
2SBAS086A
PACKAGE SPECIFIED
DRAWING TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE NUMBER RANGE MARKING NUMBER(1) MEDIA
ADS830E SSOP-20 (QSOP) 349 40°C to +85°C ADS830E ADS830E Rails
" " " " " ADS830E/1K Tape and Reel
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces
of ADS830E/1K will get a single 1000-piece Tape and Reel.
PACKAGE/ORDERING INFORMATION
+VS....................................................................................................... +6V
Analog Input............................................................. 0.3V to (+VS + 0.3V)
Logic Input ............................................................... 0.3V to (+VS + 0.3V)
Case Temperature ......................................................................... +100°C
Junction Temperature .................................................................... +150°C
Storage Temperature..................................................................... +150°C
ABSOLUTE MAXIMUM RATINGS ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instruments
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PRODUCT DEMO BOARD
ADS830 DEM-ADS830E
DEMO BOARD ORDERING INFORMATION
ELECTRICAL CHARACTERISTICS
At TA = full specified temperature range, single-ended input range = 1.5V to 3.5V, sampling rate = 60MHz, and external reference, unless otherwise noted.
ADS830E
PARAMETER CONDITIONS MIN TYP MAX UNITS
RESOLUTION 8 Guaranteed Bits
SPECIFIED TEMPERATURE RANGE Ambient Air 40 to +85 °C
ANALOG INPUT
Standard Single-Ended Input Range 2Vp-p 1.5 3.5 V
Optional Single-Ended Input Range 1Vp-p 2 3 V
Common-Mode Voltage 2.5 V
Optional Differential Input Range 2Vp-p 2 3 V
Analog Input Bias Current 1µA
Input Impedance 1.25 || 5 M || pF
Track-Mode Input Bandwidth 3dBFS 300 MHz
CONVERSION CHARACTERISTICS
Sample Rate 10k 60M Samples/s
Data Latency 4 Clk Cyc
DYNAMIC CHARACTERISTICS
Differential Linearity Error (Largest Code Error)
f = 1MHz ±0.1 ±1.0 LSB
f = 10MHz ±0.2 LSB
No Missing Codes Guaranteed
Integral Nonlinearity Error, f = 1MHz ±0.3 ±1.5 LSBs
Spurious Free Dynamic Range(1)
f = 1MHz (1dB input) 67 dBFS(2)
f = 10MHz (1dB input) 54 65 dBFS
Two-Tone Intermodulation Distortion(3)
f = 9.5MHz and 9.9MHz (7dB each tone) 60 dBc
Signal-to-Noise Ratio (SNR) Referred to Full Scale
f = 1MHz 49.5 dB
f = 10MHz 47 49.5 dB
Signal-to-(Noise + Distortion) (SINAD) Referred to Full Scale
f = 1MHz 48 dB
f = 10MHz 45 48 dB
Effective Number of Bits(4), f = 1MHz 7.7 Bits
Differential Gain Error NTSC, PAL 0.2 %
Differential Phase Error NTSC, PAL 0.2 degrees
Output Noise Input Tied to Common-Mode 0.2 LSBs rms
Aperture Delay Time 3ns
Aperture Jitter 1.2 ps rms
Overvoltage Recovery Time 2ns
Full-Scale Step Acquisition Time 2.5 ns
ADS830 3
SBAS086A
ELECTRICAL CHARACTERISTICS (Cont.)
At TA = full specified temperature range, single-ended input range = 1.5V to 3.5V, sampling rate = 60MHz, and external reference, unless otherwise noted.
ADS830E
PARAMETER CONDITIONS MIN TYP MAX UNITS
CMOS/TTL Compatible
Rising Edge of Convert Clock
CMOS/TTL Compatible
Straight Offset Binary
DIGITAL INPUTS
Logic Family
Convert Command Start Conversion
High Level Input Current(5) (VIN = 5V) 100 µA
Low Level Input Current (VIN = 0V) 10 µA
High Level Input Voltage +2.4 V
Low Level Input Voltage +1.0 V
Input Capacitance 5pF
DIGITAL OUTPUTS
Logic Family
Logic Coding
Low Output Voltage (IOL = 50µA) VDRV = 5V +0.1 V
Low Output Voltage, (IOL = 1.6mA) +0.2 V
High Output Voltage, (IOH = 50µA) +4.9 V
High Output Voltage, (IOH = 0.5mA) +4.8 V
Low Output Voltage, (IOL = 50µA) VDRV = 3V +0.1 V
High Output Voltage, (IOH = 50µA) +2.8 V
Output Capacitance 5pF
ACCURACY
(External Reference, 2Vp-p, Unless Otherwise Noted)
fS = 2.5MHz
Zero Error (Referred to FS) at 25°C2.5 ±0.25 +2.5 %FS
Zero Error Drift (Referred to FS) ±53 ppm/°C
Gain Error(6) at 25°C2.5 ±0.3 +2.5 %FS
Gain Error Drift(6) ±75 ppm/°C
Power Supply Rejection of Gain VS = ±5% 58 dB
Internal REFT Tolerance Deviation from Ideal 3.0V ±10 ±100 mV
Internal REFB Tolerance Deviation from Ideal 2.0V ±10 ±100 mV
External REFT Voltage Range REFB + 0.8 3.0 VS 1.25 V
External REFB Voltage Range 1.25 2.0 REFT 0.8 V
Reference Input Resistance REFT to REFB 800 k
POWER SUPPLY REQUIREMENTS
Supply Voltage: +VSOperating +4.75 +5.0 +5.25 V
Supply Current: +ISOperating 37 45 mA
Power Dissipation: VDRV = 5V External Reference 185 225 mW
VDRV = 3V External Reference 170 mW
VDRV = 5V Internal Reference 215 mW
VDRV = 3V Internal Reference 200 mW
Thermal Resistance,
θ
JA
SSOP-20 115 °C/W
NOTES: (1) Spurious Free Dynamic Range refers to the magnitude of the largest harmonic. (2) dBFS means dB relative to Full Scale. (3) Two-tone
intermodulation distortion is referred to the largest fundamental tone. This number will be 6dB higher if it is referred to the magnitude of the two-tone fundamental
envelope. (4) Effective number of bits (ENOB) is defined by (SINAD 1.76)/6.02. (5) A 50k pull-down resistor is inserted internally. (6) Excludes internal
reference.
ADS830
4SBAS086A
TIMING DIAGRAM
SYMBOL DESCRIPTION MIN TYP MAX UNITS
tCONV Convert Clock Period 16.6 100µsns
tLClock Pulse Low 7.3 8.3 ns
tHClock Pulse High 7.3 8.3 ns
tDAperture Delay 3 ns
t1Data Hold Time, CL = 0pF 3.9 ns
t2New Data Delay Time, CL = 15pF max 5.9 12 ns
4 Clock Cycles
Data Invalid
t
D
t
L
t
H
t
CONV
N4N3N2N1 N N+1 N+2 N+3
Data Out
Clock
Analog In N
t
2
N+1 N+2 N+3 N+4 N+5 N+6 N+7
t
1
PIN CONFIGURATION
Top View SSOP PIN DESIGNATOR DESCRIPTION
1 GND Ground
2 Bit 1 Data Bit 1 (D7) (MSB)
3 Bit 2 Data Bit 2 (D6)
4 Bit 3 Data Bit 3 (D5)
5 Bit 4 Data Bit 4 (D4)
6 Bit 5 Data Bit 5 (D3)
7 Bit 6 Data Bit 6 (D2)
8 Bit 7 Data Bit 7 (D1)
9 Bit 8 Data Bit 8 (D0) (LSB)
10 CLK Convert Clock
11 RSEL Input Range Select: HI = 2V; LO = 1V
12 INT/EXT Reference Select: HI = External; LO = Internal
13 REFB Bottom Reference
14 REFT Top Reference
15 CM Common-Mode Voltage Output
16 IN Complementary Input
17 IN Analog Input
18 GND Ground
19 +VS +5V Supply
20 VDRV Output Logic Drive Supply Voltage
PIN DESCRIPTIONS
GND
Bit 1 (MSB)
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Bit 8 (LSB)
CLK
VDRV
+V
S
GND
IN
IN
CM
REFT
REFB
INT/EXT
RSEL
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
ADS830
ADS830 5
SBAS086A
SPECTRAL PERFORMANCE
(Single-Ended, 1Vp-p)
Frequency (MHz)
7.50 15 22.5 30
Magnitude (dB)
0
10
20
30
40
50
60
70
80
90
f
IN
= 10MHz
SNR = 49dBFS
SFDR = 65dBFS
SPECTRAL PERFORMANCE
Frequency (MHz)
Magnitude (dB)
0 7.5 15 22.5 30
0
10
20
30
40
50
60
70
80
90
f
IN
= 20MHz
SNR = 49dBFS
SFDR = 63dBFS
SPECTRAL PERFORMANCE
Frequency (MHz)
0 7.5 15 22.5 30
Magnitude (dB)
0
10
20
30
40
50
60
70
80
90
fIN = 10MHz
SNR = 49dBFS
SFDR = 65dBFS
SPECTRAL PERFORMANCE
Frequency (MHz)
0 7.5 15 22.5 30
Magnitude (dB)
0
10
20
30
40
50
60
70
80
90
f
IN
= 1MHz
SNR = 49dBFS
SFDR = 67dBFS
TWO-TONE INTERMODULATION DISTORTION
Fre
q
uenc
y
(
MHz
)
0 7.5 15 22.5 30
Magnitude (dB)
0
10
20
30
40
50
60
70
80
90
f
1
= 9.5MHz at 7dBFS
f
2
= 9.9MHz at 7dBFS
IMD(3) = 60dBc
TYPICAL CHARACTERISTICS
At TA = full specified temperature range, single-ended input range = 1.5V to 3.5V, sampling rate = 60MHz, and external reference, unless otherwise noted.
DIFFERENTIAL LINEARITY ERROR
Output Code
DLE (LSB)
0.2
0.1
0
0.1
0.2 0 64 128 192 256
fIN = 10MHz
ADS830
6SBAS086A
TYPICAL CHARACTERISTICS (Cont.)
At TA = full specified temperature range, single-ended input range = 1.5V to 3.5V, sampling rate = 60MHz, and external reference, unless otherwise noted.
Output Code
DLE (LSB)
0.2
0.1
0
0.1
0.2 0 64 128 192 256
f
IN
= 20MHz
DIFFERENTIAL LINEARITY ERROR
INTEGRAL LINEARITY ERROR
Output Code
ILE (LSB)
1.0
0.5
0
0.5
1.0 0 64 128 192 256
f
IN
= 1MHz
DYNAMIC PERFORMANCE vs INPUT FREQUENCY
Frequency (MHz)
SFDR, SNR (dBFS)
70
60
50
40 0.1 1 10 100
SFDR
SNR
POWER DISSIPATION vs TEMPERATURE
Temperature
(
°C
)
220
210
200
190
180
170
16050 25 0 25 50 10075
Power Dissipation (mW)
External Reference
VDRV = +5V
Internal Reference
800k
600k
400k
200k
0
OUTPUT NOISE HISTOGRAM (DC Input)
Counts
N2N1N N+1N+2
Output Code
ADS830 7
SBAS086A
APPLICATION INFORMATION
THEORY OF OPERATION
The ADS830 is a high-speed CMOS A/D converter which
employs a pipelined converter architecture consisting of 6
internal stages. Each stage feeds its data into the digital error
correction logic ensuring excellent differential linearity and
no missing codes at the 8-bit level. The output data becomes
valid on the rising clock edge (see Timing Diagram). The
pipeline architecture results in a data latency of 4 clock
cycles.
The analog input of the ADS830 is a differential track and
hold, see Figure 1. The differential topology along with
tightly matched capacitors produce a high level of ac perfor-
mance while sampling at very high rates.
The ADS830 allows its analog inputs to be driven either
single-ended or differentially. The typical configuration for
the ADS830 is for the single-ended mode in which the input
track and hold performs a single-ended to differential con-
version of the analog input signal.
Both inputs (IN, IN) require external biasing using a com-
mon-mode voltage that is typically at the mid-supply level
(+VS/2).
The following application discussion focuses on the single-
ended configuration. Typically, its implementation is easier
to achieve and the rated specifications for the ADS830 are
characterized using the single-ended mode of operation.
DRIVING THE ANALOG INPUT
The ADS830 achieves excellent ac performance either in the
single-ended or differential mode of operation. The selection
for the optimum interface configuration will depend on the
individual application requirements and system structure.
For example, communications applications often process a
band of frequencies that does not include DC, whereas in
imaging applications, the previously restored DC level must
be maintained correctly up to the A/D converter. Features on
the ADS830 like the input range select (RSEL pin) or the
option for an external reference provide the needed flexibil-
ity to accommodate a wide range of applications. In any
case, the ADS830 should be configured such that the appli-
cation objectives are met while observing the headroom
requirements of the driving amplifier in order to yield the
best overall performance.
INPUT CONFIGURATIONS
AC-Coupled, Single-Supply Interface
Figure 2 shows the typical circuit for an ac-coupled analog
input configuration of the ADS830 where all components
are powered from a single +5V supply.
With the RSEL pin connected HIGH, the full-scale input
range is set to 2Vp-p. In this configuration, the top and
bottom references (REFT, REFB) provide an output voltage
of +3.0V and +2.0V, respectively. Two resistors ( 2 x 1k)
are used to create a common-mode voltage (VCM) of ap-
proximately +2.5V to bias the inputs of the driving ampli-
fier. Using the OPA681 on a single +5V supply, its ideal
common-mode point is at +2.5V. This coincides with the
recommended common-mode input level for the ADS830
thus, obviating the need for a coupling capacitor between the
amplifier and the converter. Even though the OPA681 has an
ac gain of +2, the dc gain is only +1 due to the blocking
capacitor at resistor RG.
The addition of a small series resistor (RS) between the
output of the op amp and the input of the ADS830 will be
beneficial in almost all interface configurations. This will
de-couple the op amp’s output from the capacitive load and
avoid gain peaking, which can result in increased noise. For
best spurious and distortion performance, the resistor value
should be kept below 75. The series resistor in combina-
tion with the 47pF capacitor establishes a passive low-pass
filter, limiting the bandwidth for the wideband noise thus
help improving the SNR performance.
AC-Coupled, Dual Supply Interface
The circuit provided in Figure 3 shows typical connections
for the analog input in case the selected amplifier operates
on dual supplies. This might be necessary to take full
advantage of very low distortion operational amplifiers,
such as the OPA642. The advantage is that the driving
amplifier can be operated with a ground referenced bipolar
signal swing. This will keep the distortion performance at its
lowest since the signal range stays within the linear region
of the op amp and sufficient headroom to the supply rails can
be maintained. By capacitively coupling the single-ended
signal to the input of the ADS830, its common-mode re-
quirements can easily be satisfied with two resistors con-
nected between the top and bottom reference.
φ1
φ1φ2φ1
φ1φ1
φ1
φ1
φ2
φ1φ2φ1
φ2
IN
IN
OUT
OUT
Op Amp
Bias V
CM
Op Amp
Bias V
CM
C
H
C
I
C
I
C
H
Input Clock (50%)
Internal Non-overlapping Clock
FIGURE 1. Simplified Circuit of Input Track and Hold with
Timing Diagram.
ADS830
8SBAS086A
OPA642
VIN
RF
402
1k
RG
402
ADS830
RS
24.9
1k
47pF
0.1µF
0.1µFIN
IN
CM
REFB
+2.0V INT/EXT GND
REFT
+3.0V RSEL +VS
+5V
+5V
5V
ately biased using the +2.5V common-mode voltage avail-
able at the CM pin. One-half of the amplifier (OPA2681)
buffers the REFB pin and drives the voltage divider R1, R2.
Because of the op amp’s noise gain of +2V/V, assuming
RF = RIN , the common-mode voltage (VCM) has to be re-
scaled to +1.25V, resulting in the correct DC level of +2.5V
for the signal input (IN). Any DC voltage differences be-
tween the IN and IN inputs of the ADS830 effectively
produce an offset, which can be corrected for by adjusting
the resistor values of the divider, R1 and R2. The selection
criteria for a suitable op amp should include the supply
voltage, input bias current, output voltage swing, distortion
and noise specification. Note that in this example the overall
signal phase is inverted. To re-establish the original signal
polarity, it is always possible to interchange the IN and IN
connections.
FIGURE 3. AC-Coupling the Dual Supply Amplifier OPA642 to the ADS830 for a 2Vp-p Full Scale Input Range.
For applications requiring the driving amplifier to provide a
signal amplification, with a gain 5, consider using decom-
pensated voltage feedback op amps, such as the OPA643, or
current feedback op amps OPA681 and OPA658.
DC-Coupled with Level Shift
Several applications may require that the bandwidth of the
signal path includes DC, in which case the signal has to be
DC-coupled to the A/D converter. In order to accomplish
this, the interface circuit has to provide a DC level shift to
the analog input signal. The circuit shown in Figure 4
employs a dual op amp, A1, to drive the input of the
ADS830 and level shift the signal to be compatible with
the selected input range. With the RSEL pin tied to the
supply and the INT/EXT pin to ground, the ADS830 is
configured for a 2Vp-p input range and uses the internal
references. The complementary input (IN) may be appropri-
+V
IN
0V
V
IN
OPA681
V
IN
R
F
402
1k
R
G
402
ADS830
R
S
39
47pF
0.1µF
IN
IN
CM
INT/EXT GND
REFT
+3.0V
1k
V
CM
= +2.5V
DC
REFB
+2.0V
0.1µF
0.1µF
RSEL +V
S
+5V
+5V
FIGURE 2. AC-Coupled Input Configuration for a 2Vp-p Full-Scale Range and a Common-Mode Voltage, VCM, at +2.5V
Derived from the Internal Top (REFT) and Bottom Reference (REFB). The OPA680 can be used in place of the
OPA681 if a voltage feedback amplifier is preferred.
ADS830 9
SBAS086A
FIGURE 5. Transformer Coupled Input. FIGURE 6. Equivalent Reference Circuit with Recommended
Reference Bypassing.
V
IN
IN
IN CM
22
22
47pF
R
T
47pF
+10µF 0.1µF
INT/EXTRSEL
+5V
ADS830
1:n
0.1µF
R
G
ADS830
REFT CM REFB
Bypass Capacitors: 0.1µF || 2.2µF each
Bandgap Reference and Logic
VREF
400400
+1+1
+VS
50k50k
INT/EXTRSEL
SINGLE-ENDED-TO-DIFFERENTIAL CONFIGURATION
(Transformer Coupled)
If the application requires a signal conversion from a single-
ended source to feed the ADS830 differentially, a RF trans-
former might be a good solution. The selected transformer
must have a center tap in order to apply the common-mode
DC voltage necessary to bias the converter inputs.
AC grounding the center tap will generate the differential
signal swing across the secondary winding. Consider a step-
up transformer to take advantage of a signal amplification
without the introduction of another noise source. Further-
more, the reduced signal swing from the source may lead to
an improved distortion performance.
The differential input configuration may provide a notice-
able advantage of achieving good SFDR performance over
a wide range of input frequencies. In this mode both inputs
of the ADS830 see closely matched impedances, and the
differential signal swing is reduced to half of the swing
required for single-ended drive. Figure 5 shows the sche-
matic for the suggested transformer coupled interface cir-
cuit. The component values of the R-C lowpass may be
optimized depending on the desired roll-off frequency. The
resistor across the secondary side (RT) should be calculated
using the equation RT = n2 x RG to match the source
impedance (RG) for good power transfer and VSWR.
REFERENCE OPERATION
Figure 6 depicts the simplified model of the internal refer-
ence circuit. The internal blocks are the bandgap voltage
reference, the drivers for the top and bottom reference, and
2Vp-p
NOTE: RF = RIN, G = 1
VIN
R2
301
R1
499
ADS830
RS
39
47pF
0.1µF
IN
IN
CM (+2.5V)
INT/EXT
RF
499
RIN
499
VCM = +1.25V
REFB
(+2.0V) REFT
(+3.0V)
1/2
OPA2681
1/2
OPA2681
RF
1k
500.1µF
0.1µF
RSEL +VS
+5V
+5V
FIGURE 4. DC-Coupled Interface Circuit with Dual Current-Feedback Amplifier OPA2681. The OPA2680 can be used in place
of the OPA2681 if a voltage feedback amplifier is preferred.
ADS830
10 SBAS086A
REFT
+3.0V
ADS830
CMV
+2.5V
REFB
+2.0V
R
1
1kR
2
1k
0.1µF0.1µF2.2µF +2.2µF
+
the resistive reference ladder. The bandgap reference circuit
includes logic functions that allow to set the analog input
swing of the ADS830 to either a 1Vp-p or 2Vp-p full-scale
range simply by tying the RSEL pin to a LOW or HIGH
potential, respectively. While operating the ADS830 in the
external reference mode, the buffer amplifiers for REFT and
REFB are disconnected from the reference ladder.
As shown, the ADS830 has internal 50k pull-up resistors
at the Range Select pin (RSEL) and Reference Select pin
(INT/EXT). Leaving those pins open configures the ADS830
for a 2Vp-p input range and external reference operation.
Setting the ADS830 up for internal reference mode requires
to bring the INT/EXT pin LOW.
The reference buffers can be utilized to supply up to 1mA
(sink and source) to external circuitry. To ensure proper
operation with any reference configurations, it is necessary
to provide solid bypassing at the reference pins in order to
keep the clock feedthrough to a minimum (Figure 6). All
bypassing capacitors should be located as close to their
respective pins as possible.
FIGURE 8. Configuration Example for External Reference Operation.
The common-mode voltage available at the CM pin may be
used as a bias voltage to provide the appropriate offset for
the driving circuitry. However, care must be taken not to
appreciably load this node, which is not buffered and has a
high impedance. An alternative way of generating a com-
mon-mode voltage is given in Figure 7. Here, two external
precision resistors (1% tolerance or better) are located
between the top and bottom reference pins. The common-
mode voltage, CMV, will appear at the midpoint.
EXTERNAL REFERENCE OPERATION
For even more design flexibility, the internal reference can
be disabled and an external reference voltage be used. The
utilization of an external reference may be considered for
applications requiring higher accuracy, improved tempera-
ture performance, or a wide adjustment range of the
converter’s full-scale range. Especially in multichannel
applications, the use of a common external reference has the
benefit of obtaining better matching of the full-scale range
between converters.
The external references can vary as long as the value of the
external top reference REFTEXT stays within the range of
(VS – 1.25V) and (REFB + 0.8V), and the external bottom
reference REFBEXT stays within 1.25V and (REFT – 0.8V),
see Figure 8.
The full-scale input signal range (FSR) of the ADS830 is
determined by the voltage difference across the reference
pins REFT and REFB (FSR = REFT – REFB), while the
common-mode voltage is defined by CMV = (REFT +
REFB)/2. In order to maintain good ac performance, it is
recommended that the typical common-mode voltage be
kept at +2.5V while setting the external reference voltages.
It is possible, however, to deviate from this common-mode
level without significantly impacting the performance. In
particular, DC-coupled applications may benefit from a
ADS830
IN
IN
INT/EXT
REFT GND REFB
External Top Reference
REFT = REFB +0.8V to +3.75V
+VS
BA
RSEL GND
+5V
External Bottom Reference
REFB = REFT 0.8V to +1.25V
VIN
A - Short for 1Vp-p Input Range
B - Short for 2Vp-p Input Range (Default)
CMV
FIGURE 7. Alternative Circuit to Generate Common-Mode
Voltage.
ADS830 11
SBAS086A
lower CMV as it increases the signal headroom of the
driving amplifier. The internal reference ladder has a nomi-
nal impedance of 800. Depending on the selected refer-
ence voltages, the required drive current will vary accord-
ingly and the external reference circuitry should be designed
to supply the maximum required current.
DIGITAL INPUTS AND OUTPUTS
Clock Input Requirements
Clock jitter is critical to the SNR performance of high speed,
high resolution Analog to Digital Converters. It leads to
aperture jitter (tA) which adds noise to the signal being
converted. The ADS830 samples the input signal on the
rising edge of the CLK input. Therefore, this edge should
have the lowest possible jitter. The jitter noise contribution
to total SNR is given by the following equation. If this value
is near your system requirements, input clock jitter must be
reduced.
Where: ƒIN is Input Signal Frequency
tA is rms Clock Jitter
Particularly in udersampling applications, special consider-
ation should be given to clock jitter. The clock input should
be treated as an analog input in order to achieve the highest
level of performance. Any overshoot or undershoot of the
clock signal may cause degradation of the performance.
When digitizing at high sampling rates, the clock should
have a 50% duty cycle (tH = tL), along with fast rise and fall
times of 2ns or less.
Digital Outputs
The output data format of the ADS830 is in positive Straight
Offset Binary code, see Table I. This format can easily
converted into the Two’s Binary Complement code by
inverting the MSB.
Digital Output Driver (VDRV)
The ADS830 features a dedicated supply pin for the output
logic drivers, VDRV, which is not internally connected to
the other supply pins. Setting the voltage at VDRV to +5V
or +3V, the ADS830 produces corresponding logic levels
and can directly interface to the selected logic family. The
output stages are designed to supply sufficient current to
drive a variety of logic families. However, it is recom-
mended to use the ADS830 with +3V logic supply. This will
lower the power dissipation in the output stages due to the
lower output swing and reduce current glitches on the supply
line which may affect the ac performance of the converter.
In some applications, it might be advantageous to decouple
the VDRV pin with additional capacitors or a pi-filter.
GROUNDING AND DECOUPLING
Proper grounding and bypassing, short lead length, and the
use of ground planes are particularly important for high
frequency designs. Multilayer PC boards are recommended
for best performance since they offer distinct advantages
like minimizing ground impedance, separation of signal
layers by ground layers, etc. The ADS830 should be treated
as an analog component. Whenever possible, the supply pins
should be powered by the analog supply. This will ensure
the most consistent results, since digital supply lines often
carry high levels of noise which otherwise would be coupled
into the converter and degrade the achievable performance.
All ground connections on the ADS830 are internally joined
together, obviating the design of split ground planes. The
ground pins (1, 18) should directly connect to an analog
ground plane which covers the PC board area around the
converter. While designing the layout, it is important to keep
the analog signal traces separated from any digital lines to
prevent noise coupling onto the analog signal path. Because
of its high sampling rate, the ADS830 generates high fre-
quency current transients and noise (clock feedthrough) that
are fed back into the supply and reference lines. This
requires that all supply and reference pins are sufficiently
bypassed. Figure 9 shows the recommended decoupling
scheme for the ADS830. In most cases 0.1µF ceramic chip
capacitors at each pin are adequate to keep the impedance
low over a wide frequency range. Their effectiveness largely
depends on the proximity to the individual supply pin.
Therefore, they should be located as close to the supply pins
as possible. In addition, a larger bipolar capacitor (1µF to
22µF) should be placed on the PC board in proximity of the
converter circuit.
It is recommended to keep the capacitive loading on the data
lines as low as possible ( 15pF). Higher capacitive loading
will cause larger dynamic currents as the digital outputs are
changing. Those high current surges can feed back to the
analog portion of the ADS830 and affect the performance. If
necessary, external buffers or latches close to the converter’s
output pins may be used to minimize the capacitive loading.
They also provide the added benefit of isolating the ADS830
from any digital noise activities on the bus coupling back
high frequency noise. FIGURE 9. Recommended Bypassing for the Supply Pins.
1
GND
ADS830
+
0.1µF
+VS
19 18
GND
10µF
+5V
VDRV
20
0.1µF
+3/+5V
Jitter SNR trms signal to rms noise
IN A
=ƒ
20 1
2
log π
+FS (IN = +3.5V) 1111 1111
+1/2 FS 1100 0000
+1LSB 1000 0001
Bipolar Zero (IN = 2.5V) 1000 0000
1LSB 0111 1111
1/2 FS 0100 0000
FS (IN = +1.5V) 0000 0000
SINGLE-ENDED INPUT (2Vp-p) STRAIGHT OFFSET BINARY
(IN = CMV) (SOB)
TABLE I. Coding Table for the ADS830.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
ADS830E ACTIVE SSOP DBQ 20 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ADS830E/2K5 ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ADS830E/2K5G4 ACTIVE SSOP DBQ 20 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ADS830EG4 ACTIVE SSOP DBQ 20 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
ADS830E/2K5 SSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
ADS830E/2K5 SSOP DBQ 20 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2
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