Board Level Heat Sinks P/N: 811102B00000 TO-220 PRODUCT SPECIFICATIONS Devices: TO-220 Size: 22.2 x 5.4 x 30.3 mm Material: Aluminum, 1.0 mm Thick Weight: 1.6 grams Type: Stamped PCB Mounting: Solderable Tabs Finish: Black Anodized Package: Bulk Accessories: Hardware & Thermal Interface Material Air Velocity - LFM 400 600 800 1000 20 80 16 60 12 * Hole for Device Attachment * Staggered Fins for Improved Performance * Vertical Mounting via Solderable Tabs * RoHS Compliant 40 8 20 4 0 0 0 1 2 3 Heat Dissipated - Watts * Specialized Tabs, Plating * Specialized Body Configurations * Contact Applications Engineering COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 4 5 Thermal Resistance - oC / Watt (Mounting Surface to Ambient) FEATURES & BENEFITS CUSTOMIZED HEATSINKS 200 100 o C 0 Temp Rise Above Ambient (Mounting Surface) * * * * * * * * *