LINEAR INTEGRATED CIRCUIT CHIPS GENERAL DESCRIPTION Motorola now offers a very broad selection of linear integrated circuit chips. Among the types of circuits which compose the linear family there are: . Operational Amplifiers Voltage Regulators Comparators . Drivers and Receivers . Sense Amplifiers . D/A and A/D Converters As a general rule of thumb, all linear chips from Motorola are 100% unit probed to the D.C. parameters given in Volume 6 of the Semiconductor Data Library. Far specific information on electrical parameters which are probed contact the nearest Motorola Sales Office. mmooOmp STANDARD FEATURES FOR LINEAR INTEGRATED CIRCUIT CHIPS All linear integrated circuit chips... are 100% electrically tested to sufficient param- eter limits (min/max) to permit distinct identi- fication as either premium or industrial versions @ employ phosphorsilicate passivation which pro- tects the entire active surface area including metallization interconnects during shipping and handling : @ are 100% visually inspected to a modified cri- teria per MIL-STD-883, Method 2010, Condi- tion B @ incorporate a minimum of 4000 A gold backing to ensure positive adherence bonding GENERAL PHYSICAL CHARACTERISTICS OF LINEAR CHIPS The following characteristics represent the vast majority of all Motorola linear chips. Since an indi- vidual chip type may vary slightly, contact your local sales office for information regarding physical charac- teristics critical to a specific application. The overall size and final metallization patterns are shown in the following pages; however the geometries shown and MIC numbers listed are current at the date of print- ing. Since we are constantly striving to improve the quality, performance, and yield of our linear devices we cannot be responsible for changes at future dates. Please contact your local Motorola Sales representative for the most current information. A. Chips thickness: 8 + 1 mil B. Passivation: Phosphorsilicate C. Passivation thickness: 5kA + 1k D. Metallization: Aluminum E. Metallization thickness: 12kA + 2kA F. Back metallization: Gold, alloyed G. Bonding pad dimensions: Typical 4.0 mil x 5.0 mil H. Overall chip dimensions: See pages that follow for individual device type. Tolerance of +5 mils should be allowed. HANDLING PRECAUTIONS Although passivation on all chips provides protec- tion in shipping and handling, care should be exercised to prevent damaging the face of the chip. A vacuum pickup is most useful for this purpose; tweezers are not recommended. There are four basic requirements for handling devices in a prudent manner: 1. Store the chips in a covered or sealed container 2. Store devices in an environment of no more than 30% relative humidity 3. Process the chips in a non-inert atmosphere not exceeding 100C, or in an inert atmosphere not exceeding 400C. 4. Processing equipment should conform to the minimum standards that are normally em- ployed by semiconductor manufacturers. Motorolas engineering staff is available for consul- tation in the event of correlation or processing prob- lems encountered in the use of Motorola linear chips. For assistance, please contact your nearest Motorola sales representative. CHIP AND WAFER PACKAGING Chips Motorolas linear integrated circuit chips come Packaged to the customer in the Multi-Pak carrier. Refer to page 1-11, Figure 7. Wafers Motorolas linear integrated circuit wafers come packaged to the customer in the Wafer-Pak plastic bow. The wafer has been probed and rejects are designated by a red color dot on the die surface. Refer to page 1-8, Figure 2. HOW TO ORDER LINEAR CHIPS OR WAFERS FROM MOTOROLA 1. Remove all suffix package designators from the desired device type. (EXAMPLE: MC1741CP1 now becomes MC1741C) 2. Add a C to the prefix designator if individual chips are desired. (EXAMPLE: MC1741C now is McC1741C) Add a W to the prefix designator if a wafer is de- sired. (EXAMPLE: MC1741C now is MCW1741C) 3. When ordering chips, two options are available: a. The ~1 suffix designator will deliver to you 10 chips per Multi-Pak, up to 1000 chips. (EXAMPLE: MCC1741C-1} 5-2 TATA TTT MCC4000 Series (0 to +75C) MCC4300 Series (55 to +125C) The MTTL complex functions are designed for digital applications in the medium to high- speed range. These MTTL. devices provide significant reduction in package count and increased logic per function over devices in the basic MTTL and MDTL families. Type Wafer Chip Mask Size 0 to 75C ~55 to +125C Function Set #| (Mils) MCC4000 MCC4300 Dual 4 Channel Data Selector 18E 58x86 MCCc4002 MCC4302 Dual Data Distributor 59B 60x90 MCC4003 MCC4303 Dual Binary to NBCD Converter O6T 73x75 MCC4004 MCC4304 16 Bit Scratch Pad Memory Cell 1PR 77x82 MCC4005 MCC4305 16 Bit Scratch Pad Memory Cell 1PR 77x82 MCC4006 MCC4306 Binary to one of eight Line Decoder 31C 88x88 MCC4007 MCC4307 Dual Binary to one of four Line Decoder 31C 88x88 MCC4008/74408 | MCC4308 8 Bit Parity Tree 8HT 53x59 MCC4010 MCC4310 Dual 4 Bit Parity Tree 94F 78x79 MCC4012 MCC4312 4 Bit Shift Register 43L 58x74 MCC4015 MCC4315 Quad Type D Flip-Flop 87N 68x74 MCC4016/74416 | MCC4316 Program. Modulo-N Decade Counter 30P 79x89 MCC4017/74417 | MCC4317 Modulo 2, Modulo 5 Program. Counter 30P 79x89 MCC4018/74418 | MCC4318 Program. Modulo-N Hexadecimal Counter 30P 79x89 MCC4019/74419 | MCC4319 Dual Modulo 4 Program. Counter 30P 79x89 Mcc4021 MCC4321 Dual 4 Bit Comparator (O.C.) O4R 63x69 MCC4022 MCC4322 Dual 4 Bit Comparator O4R 63x69 MCC4023 MCC4323 4-Bit Universal Counter 74H 94x95 MCC4024 MCC4324 Dual Voltage Controtled Multivibrator 54H 66x53 MCC4026 MCC4326 Full Adder 33K 58x60 MCC4027 MCC4327 Full Adder 33K 58x60 MCC4028 MCC4328 Adder (Dependent Carry) 33K 58x60 MCC4029 MCC4329 Adder (Dependent Carry) 33K 58x60 MCC4030 MCC4330 Adder (Independent Carry) 33K 58x60 MCC4031 MCC4331 Adder (Independent Carry) 33K 58x60 MCC4032 MCC4332 Carry Decoder 50K 39x43 MCC4035 MCC4335 Quad Latch (0.C.) 1DB 60x61 MCC4037 MCC4337 Quad Latch 1DB 60x61 MCC4042 MCC4342 Quad Predriver 3iE 55x67 MCC4043 MCC4343 Dual Line Selector 32E 61x61 MCC4044 MCC4344 Phase Frequency Detector 46K 62x66 MCC4050/74450 | MCC4350 Counter-Latch Decoder/Driver O9R 92x94 MCC4051 MCC4351 Counter-Latch Decoder/Driver O9R 92x94 MCC4052/74452 | MCC4352 Dual Decade Counter 91R 80x84 MCC4083/74453 | MCC4353 Dual Hexadecima! Counter 91R 80x84 MCC4054/74454 | MCC4354 Dual Decade Up/Down Counter 66wW 102x99 MCC4055/74455 | MCC4355 Dual Binary Up/Down Counter 66wW 102x99 MCC4056/74456 | MCC4356 NBCD Adder 74V 69x90 MCC4058/74458 | MCC4358 Nines Complement/Zero Element 1DK 61x62 MCC4060/74460 | MCC4360 Bus Transfer Switch 38T 64x66 MCC4062 MCC4362 Dual Majority Logic Gate 62T 50x45 MCC4068/74468 | MCC4368 Dual MOS to TTL Level Translator 2AG 50x50 7-95 MTTL COMPLEX FUNCTIONS MCC4000/4300 Series (continued) MCC4017/74417/MCC4317/54417 Modulo 2, Modulo 5 Programmable Counter 79 x 89 (30P) PIN CONNECTIONS oy Gate oUciock + aot2o 1 o 34 Clack 2 9 5 ai}+o o 4 po 1 15 op1 a2-o 14 1 oT D2 03 Oo oY p3 12 3 Bus fo oo PE 1 oder Voc = Pin 16 Gnd= Pin 8 11 12 13 14 MCC4018/74418/MCC4318/54418 Programmable Modulo-N Hexadecimal Counter (30P) PIN CONNECTIONS ee OD , FF We eas (1) 4&4IGat aot_07 (8) ? TNR ima ye arth vate (2) 6 Clock gi} o9 (8) (1) 5 &_1P0 at i SI nee 1 (1) 110-4p_ 2015 (8) Ny es eee oe ee NTS (1) 14 O+4 P2 a3 O1 (8) ee Sti anit, > (1) 20P3 A vi mn nals 16 R/o13 (2) 30--PE Me rll aes (4) 100~-qMR_- Bust 012 Sa (a 0 toa, Clock to OQ3 = 50ns typ Clock to Bus = 35 ns typ 11 12 13 14 Pp = 250 MW typ/pkg Vec = Pin 16 GND = Pin8 7-102