1. General description
The SA615 is a high performance monolithic low-power FM IF system incorporating a
mixer/oscillator, two limiting intermediate frequency amplifiers, quadrature detector,
muting, logarithmic Received Signal S trength Indicator (RSSI), and voltage regulator . The
SA615 combines the functions of NXP Semiconductors SA602A and SA604A, but
features a higher mixer input intercept point, higher IF bandwidth (25 MHz) and
temperature compensated RSSI and limiters permitting higher performance application.
The SA615 is available in 20-lead SO (surface-mounted miniature package) and 20-lead
SSOP (shrink small outline package).
The SA605 and SA615 are functionally the same de vice types. The difference between
the two devices lies in the guaranteed specifications. The SA615 has a higher ICC, lower
input third-order intercept point, lower conversion mixer gain, lower limiter gain, lower AM
rejection, lower SINAD, higher THD, and higher RSSI error than the SA615. Both the
SA605 and SA615 devices meet the EIA specifications for AMPS and TACS cellular radio
applications.
2. Features and benefits
Low power consum ption: 5.7 mA typical at 6 V
Mixer input to >500 MHz
Mixer conversion power gain of 13 dB at 45 MHz
Mixer noise figure of 4.6 dB at 45 MHz
XTAL oscillator effective to 150 MHz (L/C oscillator to 1 GHz local oscillator can be
injected)
102 dB of IF amplifier/limiter gain
25 MHz limiter small signal bandwidth
Temperature-compe nsated logarithmic Received Signal Strength Indicator (RSSI) with
a dynamic range in excess of 90 dB
Two audio outputs — muted and unmuted
Low external com p on e nt count; suitable for crystal/ceramic/LC filters
Excellent sensitivity: 0.22 V into 50 matching network for 12 dB SINAD
(Signal-to-Noise-and-Distortion ratio) for 1 kHz tone with RF at 45 MHz and IF at
455 kHz
SA615 meets cellular radio specifications
ESD hardened
SA615
High performance low power mixer FM IF system
Rev. 4 — 14 November 2014 Product data sheet
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 2 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
3. Applications
Cellular radio FM IF
High performance communications receivers
Single conversion VHF/UHF receivers
SCA receivers
RF level meter
Spectrum analyzer
Instrumentation
FSK and ASK data receivers
Log amps
Wideband low current amplification
4. Ordering information
4.1 Ordering options
Table 1. Ordering information
Type number Topside
marking Package
Name Description Version
SA615D/01 SA615D SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
SA615DK/01 SA615DK SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1
Tabl e 2. O rdering options
Type number Orderable
part number Package Packing method Minimum
order
quantity
Temperature
SA615D/01 SA615D/01,112 SO20 Standard marking
* IC’s tube - DSC bulk pack 1520 Tamb =40 C to +85 C
SA615D/01,118 SO20 Reel 13” Q1/T1
*Standard mark SMD 2000 Tamb =40 C to +85 C
SA615DK/01 SA615DK/01,112 SSOP20 Standard marking
* IC’s tube - DSC bulk pack 1350 Tamb =40 C to +85 C
SA615DK/01,118 SSOP20 Reel 13” Q1/T1
*Standard mark SMD 2500 Tamb =40 C to +85 C
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 3 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
5. Block diagram
Fig 1. Block diagram
aaa-012909
mixer
IF amp limiter
OSCILLATOR
RSSI
quad
EB
20 19 18 17 16 15 14 13 12 11
12345678910
RF_IN
RF_BYPASS
OSC_OUT
OSC_IN
MUTE_INPUT
V
CC
RSSI_OUT
MUTED_AUD_OUTP
UNMUTED_AUD_OUTP
QUADRATURE_IN
MIXER_OUT
IF_AMP_DECOUPL
IF_AMP_IN
IF_AMP_DECOUPL
IF_AMP_OUT
GND
LIMITER_IN
LIMITER_DECOUPL
LIMITER_DECOUPL
LIMITER_OUT
mute
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 4 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
6. Pinning information
6.1 Pinning
Fig 2. Pi n configuration for SO20
Fig 3. Pi n configuration for SSOP20
SA615D/01
aaa-013002
1
2
3
4
5
6
7
8
9
10
12
11
14
13
16
15
18
17
20
19
RF_IN
RF_BYPASS
OSC_OUT
OSC_IN
MUTE_INPUT
V
CC
RSSI_OUT
MUTE_AUD_OUTP
UNMUTE_AUD_OUTP
QUADRATURE_IN
MIXER_OUT
IF_AMP_DECOUPL
IF_AMP_IN
IF_AMP_DECOUPL
IF_AMP_OUT
GND
LIMITER_IN
LIMITER_DECOUPL
LIMITER_DECOUPL
LIMITER_OUT
SA615DK/01
RF_IN MIXER_OUT
RF_BYPASS IF_AMP_DECOUPL
OSC_OUT IF_AMP_IN
OSC_IN IF_AMP_DECOUPL
MUTE_INPUT IF_AMP_OUT
VCC GND
RSSI_OUT LIMITER_IN
MUTE_AUD_OUTP LIMITER_DECOUPL
UNMUTE_AUD_OUTP LIMITER_DECOUPL
QUADRATURE_IN LIMITER_OUT
aaa-013003
1
2
3
4
5
6
7
8
9
10
12
11
14
13
16
15
18
17
20
19
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 5 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
6.2 Pin description
Tabl e 3. Pin description
Symbol Pin Description
RF_IN 1 RF input
RF_BYPASS 2 RF bypass pin
OSC_OUT 3 oscillator output
OSC_IN 4 oscillator input
MUTE_INPUT 5 mute input
VCC 6 positive supply voltage
RSSI_OUT 7 RSSI output
MUTED_AUD_OUTP 8 mute audio output
UNMUTED_AUD_OUTP 9 unmute audio output
QUADRATURE_IN 10 quadrature detector input terminal
LIMITER_OUT 11 limiter amplifier output
LIMITER_DECOUPL 12 limiter amplifier decoupling pin
LIMITER_DECOUPL 13 limiter amplifier decoupling pin
LIMITER_IN 14 limiter amplifier input
GND 15 ground; negative supply
IF_AMP_OUT 16 IF amplifier output
IF_AMP_DECOUPL 17 IF amplifier decoupling pin
IF_AMP_IN 18 IF amplifier input
IF_AMP_DECOUPL 19 IF amplifier decoupling pin
MIXER_OUT 20 mixer output
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 6 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
7. Limiting values
8. Thermal characteristics
9. Static characteristics
Table 4. Limiting valu es
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage - 9 V
Tstg storage temperature 65 +150 C
Tamb ambient temperature operating 40 +85 C
Table 5. Therm al char acteristics
Symbol Parameter Conditions Typ Unit
Zth(j-a) transient thermal imped ance
from junction to ambient SA615D/01 (SO20) 90 K/W
SA615DK/01 (SSOP20) 117 K/W
Table 6. Static characteristics
VCC =+6V; T
amb =25
C; unless specified otherwise.
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage 4.5 - 8.0 V
ICC supply current - 5.7 7.4 mA
Vth threshold voltage mute switch-on 1.7 - - V
mute switch-off - - 1.0 V
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 7 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
10. Dynamic characteristics
Table 7. Dynam ic characteristics
Tamb =25
C; VCC = +6 V; unless specified otherwise. RF freq uency = 45 MHz + 14.5 dBV RF input step-up.
IF frequency = 455 kHz; R17 = 5.1 k
; RF level =
45 dBm; FM modulation = 1 kHz with
8 kHz peak deviation.
Audio output with C-message weighted filter and de-emphasis ca pacitor. Test circuit Figure 7. The parameters listed below
are tested using automatic test equipment to assure consistent electrical characteristics. The limits do not represent the
ultimate performance limits of the device. Use of an optimized RF layout improves many of the listed parameters.
Symbol Parameter Conditions Min Typ Max Unit
Mixer/oscillator section (external LO = 300 mV)
fiinput frequency - 500 - MHz
fosc oscillator frequency - 150 - MHz
NF noise figure at 45 MHz - 5.0 - dB
IP3iinput third-order intercept point FL1 = 4 5.0 MHz; FL 2 = 45.06 MHz - 12 - dBm
Gp(conv) conversion power gain matched 14.5 dBV step-up 8.0 13 - dB
50 source - 1.7 - dB
Ri(RF) RF input resistance single-ended input 3.0 4.7 - k
Ci(RF) RF input capacitance - 3.5 4.0 pF
Ro(mix) mixer output resistance MIXER_OUT pin 1.25 1.50 - k
IF section
Gamp(IF) IF amplifier gain 50 source - 39.7 - dB
Glim limiter gain 50 source - 62.5 - dB
Pi(IF) IF input power for 3 dB input limiting sensitivity;
R17=5.1k; test at IF_AMP_IN pin -109 - dBm
AM AM rejection 80 % AM 1 kHz 25 33 43 dB
audio level RMS value; R10 = 100 k;
15 nF de-emphasis 60 150 260 mV
unmuted audio level R11 = 100 k; 150 pF de-emphasis - 530 - mV
SINAD signal-to-noise-and-distortion ratio RF level 118 dB - 12 - dB
THD total ha rmonic distortion 30 42 - dB
S/N signal-to-noise ratio no modulation for noise - 68 - dB
Vo(RSSI) RSSI output voltage IF; R9 = 100 k[1]
IF level = 118 dBm 0 160 800 mV
IF level = 68 dBm 1.7 2.5 3.3 V
IF level = 18 dBm 3.6 4.8 5.8 V
RSSI(range) RSSI range R9 = 100 k; IF_AMP_OUT pin - 80 - dB
RSSI RSSI variation R9 = 100 k; IF_AMP_OUT pin - 2- dB
Zi(IF) IF input impedance 1.40 1.6 - k
Zo(IF) IF output impedance 0.85 1.0 - k
Zi(lim) limiter input impedance 1.40 1.6 - k
Rooutput resistance unmuted audio - 58 - k
muted audio - 58 - k
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 8 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
[1] The generator source impedance is 50 , but the SA615 input impedance at pin 18 (IF_AMP_IN) is 1500 . As a result, IF level refers
to the actual signal that enters the SA615 input (pin 8, MUTED_AUD_OUTP) which is about 21 dB less than the ‘available power’ at the
generator.
RF/IF section (internal LO)
unmuted audio level RMS value; VCC =4.5V;
RF level = 27 dBm -450-mV
Vo(RSSI) RSSI output voltage system; VCC =4.5V;
RF level = 27 dBm -4.3-V
Table 7. Dynam ic characteristics …continued
Tamb =25
C; VCC = +6 V; unless specified otherwise. RF freq uency = 45 MHz + 14.5 dBV RF input step-up.
IF frequency = 455 kHz; R17 = 5.1 k
; RF level =
45 dBm; FM modulation = 1 kHz with
8 kHz peak deviation.
Audio output with C-message weighted filter and de-emphasis ca pacitor. Test circuit Figure 7. The parameters listed below
are tested using automatic test equipment to assure consistent electrical characteristics. The limits do not represent the
ultimate performance limits of the device. Use of an optimized RF layout improves many of the listed parameters.
Symbol Parameter Conditions Min Typ Max Unit
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 9 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
11. Application information
The layout is very critical in the performance of the receiver. We highly recommend our demo
board layout.
All of the inductors, the quad tank, and their shield must be grounded. A 10 F to 15 F or higher
value tantalum cap acitor on the supply line is essential. A low frequency ESR screening test on this
capacitor ensures consistent good sensitivity in production. A 0.1 F bypass capacitor on the
supply pin, and grounded near the 44.545 MHz oscillator improves sensitivity by 2 dB to 3 dB.
(1) R5 can be used to bias the oscillator transistor at a higher current for operation above 45 MHz.
Recommended value is 22 k, but should not be below 10 k.
Fig 4. SA615 45 MHz application circuit
aaa-012965
MUTE
mixer
IF amp
limiter
OSCILLATOR
RSSI
quad
detector
20 19 18 17 16 15 14 13 12 11
12 34 5 6789 10
mute
switch
700 Ω
C23 C21
FL1 FL2
R17
5.1 kΩ
C18 C17
C15
C5
L1
C1
C2
45 MHz
input
C7
L2
X1
C6
C8
R5(1)
VCC
C9
C10 C25
C11 C12 C13
RSSI
OUTPUT
AUDIO
UNMUTED
AUDIO
R9 R10 R11
C14
C26
C3
C24
L3
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 10 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
[1] This value can be reduced when a battery is the power source.
[2] The ceramic filters can be 30 kHz SFG455A3s made by Murata, which have 30 kHz IF bandwidth (they come in blue), or 16 kHz
CFU455Ds, also made by Murata (they come in black). All of our specifications and testing are done with the more wideband filter.
[3] Optional.
Table 8. SA615 application component list
Component Value Description Package Part number
C1 33 pF NPO ceramic C0805K 445-127x-1-ND
C2 220 pF NPO ceramic C0805K 445-7484-6-ND
C3 5 pF to 30 pF NPO ceramic; Murata TZC3P300A 110R00 TRIMCAP 490-1994-2-ND
C5 100 nF 10 % 100 nF 10 % monolithic ceramic C0805K 311-1036-1-ND
C6 5 pF to 30 pF NPO ceramic; Murata TZC3P300A 110R00 TRIMCAP 490-1994-2-ND
C7 1 nF ceramic C0805K 399-3293-1-ND
C8 10 pF NPO ceramic C0805K 490-1994-2-ND
C9 100 nF 10 % monolithic ceramic C0805K 311-1036-1-ND
C10[1] 22 F tantalum C1812 478-3117-1-ND
C11 100 nF 10 % monolithic ceramic C0805K 311-103 6-1-ND
C12 15 nF 10 % ceramic C0805K 399-1161-1-ND
C13 150 pF 2 % N1500 ceramic C0805K 399-112 5-1-ND
C14 100 nF 10 % monolithic ceramic C0805K 311-1036-1-ND
C15 10.0 pF NPO ceramic C0805K 311-1036-1-ND
C17 100 nF 10 % monolithic ceramic C0805K 311-1036-1-ND
C18 100 nF 10 % monolithic ceramic C0805K 311-1036-1-ND
C21 100 nF 10 % monolithic ceramic C0805K 311-1036-1-ND
C23 100 nF 10 % monolithic ceramic C0805K 311-1036-1-ND
C24 5 pF to 30 pF trim NPO ceramic; Murata TZC3P300A 110R00 TRIMCAP 490-1994-2-ND
C25 470 pF monolithic ceramic C0805K
C26 39 pF monolithic ceramic C0805K
CN1 8-pin header MA08-1 399-8083-10ND
CN2 BU-SMA-H J502-ND-142-
0701-881/886 520-142-0701-881
FL1, FL2[2] ceramic filter;
Murata CFUKF455KB4X or equivalent surface mount CFUKF455KB4X-R0
L1 330 nH Coilcraft 1008CS-331 WE-KI_1008_B 1008CS-331
L2 1.2 H fixed inductor Coilcraft 1008CS-122XKLC WE-KI_1008_B 1 008CS-122
L3 220 H fixed in ductor WE-GF_L 1812LS-224XJB
R9 100 k 1 % 1/4 W metal film R0603 311-100KCRCT-ND
R10[3] 100 k 1 % 1/4 W metal film C0805K 311-100KCRCT-ND
R11[3] 100 k 1 % 1/4 W metal film C0805K 311-100KCRCT-ND
R17 5.1 k 5 % 1/4 W carbon composition C0805K 311-5.10KCRDKR-ND
U1 SA605DK TSSOP20 568-2087-5-nd
X1 44.545 MHz resonant 3rd-overtone crystal UM-1 49HC/11453
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 11 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
(1) The C-message filter has a peak gain of 100 dB for accurate measurements. Without the gain, the
measurements may be affected by the noise of the scope and HP339 analyzer.
(2) Set your RF generator at 45.000 MHz, use a 1 kHz modulation frequency and a 6 kHz deviation if
you use 16 kHz filters, or 8 kHz if you use 30 kHz filters.
(3) The smallest RSSI voltage (that is, when no RF input is present and the input is terminated) is a
measure of the quality of the layout and design. If the lowest RSSI voltage is 250 mV or higher, it
means that the receiver is in regenerative mode. In that case, the receiver sensitivity is worse than
expected.
(4) The measured typical sensitivity for 12 dB SINAD should be 0.22 V or 120 dBm at the RF input.
Fig 5. SA615 application circuit test setu p
Audio out:
C message weighted
0 dB reference = recovered audio for 8 kHz peak deviation (dB)
Fig 6. Performance of the SA615 application board at 25 C
SCOPE
SA615 DEMOBOARD
aaa-013153
RF GENERATOR(1)
45 MHz
VCC (+6 V)
DC VOLTMETER
HP339A DISTORTION
ANALYZER(4)
C-MESSAGE(3)
RSSI(2) AUDIO DATA
AUDIO REF = 174 mV (RMS value)
RSSI (V)
THD + NOISE
NOISE
AM (80 % MOD)
aaa-012967
−130
−80
2
3
4
−60
−40
−20
(dB)
NOISE
AM (80 % MOD)
THD + NOISE
RSSI
(V)
−110 −70 −50 −30 −10
RF input level (dBm)
0
−100
20
0
1
5
6
−90 10 20
RF = 45 MHz
IF = 455 kHz
VCC = 6 V
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 12 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
11.1 Circuit description
The SA615 is an IF signal processing system suitable for second IF or single conversion
systems with input frequency as high as 1 GHz. The bandwidth of the IF amplifie r is about
40 MHz, with 39.7 dB of gain from a 50 source. The bandwidth of the limiter is about
28 MHz with about 62.5 dB of gain from a 50 source. However, the gain/bandwidth
distribution is optimized for 455 kHz, 1.5 k source applications. The overall system is
well-suited to battery operation as well as high-performance and high-quality products of
all types.
The input stage is a Gilbert cell mixer with oscillator. Typical mixer characteristics include
a noise figure of 5 dB, conversion gain of 13 dB, and input third-orde r intercept of
10 dBm. The oscillator operates in excess of 1 GHz in L/C tank configurations. Hartley or
Colpitts circuits can be used up to 100 MHz for crystal configurations. Butler oscillators
are recommended for crystal configurations up to 150 MHz.
The output of the mixer is internally loaded with a 1.5 k resistor, permitting direct
connection to a 455 kHz ceramic filter. The input resistance of the limiting IF amplifiers is
also 1.5 k. With most 455 kHz ceramic filters and many crystal filters, no impedance
matching network is necessary. To achieve optimum lineari ty of the log signal strength
indicator, there must be a 12 dBV insertion loss between the first and second IF st ages. If
the IF filter or inter-st age network does not cause 12 dBV insertion loss, a fixed or vari able
resistor can be added between the first IF output (pin 16, IF_AMP_OUT) and the
inter-stage network.
The signal from the second limiting amplifier goes to a Gilbert cell quadrature detector.
One port of the Gilbert cell is internally driven by the IF. The other output of the IF is
AC-coupled to a tuned quadrature network. This signal, which now has a 90 phase
relationship to the internal signal, drives the other port of the multiplier cell.
Overall, the IF section has a gain of 90 dB. For operation at intermediate frequencies
greater than 455 kHz, special care must be given to layout, termination, and inter-stage
loss to avoid instability.
The demodulated output of the quadrature detector is available at two pins, one
continuous and one with a mu te switch . Sign al at te nu at ion with th e mu te act iv at ed is
greater than 60 dB. The mute inp ut is very hi gh-impeda nce and is comp a tible with CMOS
or TTL levels.
A log signal strength complete s the circuitry. The output range is greater than 90 dB and is
temperature compensated. This log signal strength indicator exceeds the criteria for
AMPS or TACS cellular telephone.
Remark: dBV = 20log VO/V
I.
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 13 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
12. Test information
Fig 7. SA615 45 MHz test circuit (relays as shown)
aaa-012966
MUTE
mixer
IF amp
limiter
OSCILLATOR
RSSI
quad
detector
20 19 18 17 16 15 14 13 12 11
1345678910
mute
switch
700 Ω
C23 C21
FL1 FL2
R17
5.1 kΩ
C18 C17
VCC
C9
C10 C11 C12 C13
RSSI
OUTPUT
AUDIO
UNMUTED
AUDIO
R9 R10 R11
IFT1
C14
C26
‘C’ WEIGHTED
AUDIO
MEASUREMENT
CIRCUIT
emitter
base
C15
C16
1.3 kΩ
51.7 Ω
−36 dB,
156 kΩ/50 Ω pad
SW5
SW6
C19
32.8 Ω
71.5 Ω
96.5 Ω
−10.6 dB,
50 Ω/50 Ω pad
SW7
C20
51.5 Ω
−29 dB,
929 Ω/50 Ω pad
SW8
C22
32.6 Ω
96.5 Ω
−10.6 dB,
50 Ω/50 Ω pad
71.5 Ω
C24
3880 Ω
50.5 Ω
−25 dB,
1500 Ω/50 Ω pad
2430 Ω
SW9
2
C7
L2
X1
C6
C8
L1
C1
C2
45 MHz
SW4
R8
39.2 Ω
R7
30.5 Ω
R6
178 Ω
ext.
LOC osc
44.545 MHz
SW3
C5
SW1
R4
C4
51.1 Ω
SW2
C3
R2
R1
R3
mini-circuit
ZSC2-1B
45.06
MHz
C3
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 14 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
[1] This value can be reduced when a battery is the power source.
Table 9. Auto matic test circuit component lis t
Component Description
C1 33 pF NPO ceramic
C2 180 pF NPO ceramic
C3, C6 5 pF to 30 pF variable capacitor; Murata TZC3P300A 110R00
C5, C9, C1 1, C14, C17,
C18, C21, C23 100 nF 10 % monolithic ceramic
C7 1 nF ceramic
C8, C15 10 pF NPO ceramic
C10[1] 6.8 F tantalum (minimum)
C12 15 nF 10 % ceramic
C13 150 pF 2 % N1500 ceramic
C26 390 pF 10 % monolithic ceramic
FL1 ceramic filter Murata SFG455A3 or equivalent
FL2
IFT1 330 H variable shiel ded inductor, Toko 836AN-0129Z
L1 330 nH Coilcraft 1008CS-331
L2 1.2 H Coilcraft 1008CS-122
X1 44.545 MHz 3rd Overtone series resonant crystal in the HC-49U case
R9 100 k1 % 1/4 W metal film
R10, R11 100 k1 % 1/4 W metal film (optional)
R17 5.1 k5 % 1/4 W carbon composition
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 15 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
13. Package outline
Fig 8. Package outline SOT163-1 (SO20)
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SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 16 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
Fig 9. Package outline SOT266-1 (SSOP20)
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SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 17 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
W ave soldering is a joinin g technology in which the joint s are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
•Through-hole components
•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•Board specifications, including the board finish, solder masks and vias
•Package footprints, including solder thieves and orientation
•The moisture sensitivity level of the packages
•Package placement
•Inspection and repair
•Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
•Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
•Solder bath specifications, including temperature and impurities
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 18 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
14.4 Reflow soldering
Key characteristics in reflow soldering are:
•Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to
higher minimum peak temperatures (see Figure 10) than a SnPb process, thus
reducing the process window
•Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
•Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enoug h for the solder to make reliable solder joint s (a solder paste
characteristic). In addition, the peak temperature must be low en ough that the
packages and/or boards are not damaged. Th e peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10 and 11
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 10.
Table 10. SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350
< 2.5 235 220
2.5 220 220
Table 11. Lead-free pr ocess (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 19 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
MSL: Moisture Sensitivity Level
Fig 10. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 20 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
15. Soldering: PCB footprints
Fig 11. PCB footprint for SOT163-1 (SO20); reflow soldering
Fig 12. PCB footprint for SOT163-1 (SO20); wave soldering
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SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 21 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
Fig 13. PCB footprint for SOT266-1 (SSOP20); reflow soldering
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SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 22 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
16. Abbreviations
Table 12. Abbreviations
Acronym Description
AM Amplitude Modulation
AMPS Advanced Mobile Phone System
ASK Amplitude Shift Keying
CMOS Complementary Metal-Oxide Semiconductor
ESD ElectroStatic Discharge
ESR Equivalent Series Resistor
FM Frequency Modulation
FSK Frequency Shift Keying
IF Intermediate Frequency
L/C inductor-capacitor filter
RF Radio Frequency
RSSI Received Signal Strength Indicator
SCA Subsidiary Communications Authori z ation
SINAD Signal-to-Noise-And-Distortion ratio
TACS Total Access Communication System
THD Total Harmonic Distortion
TTL Transistor-Transistor Logic
UHF Ultra High Frequency
VHF Very High Frequency
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 23 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
17. Revision history
Table 13. Revision history
Document ID Release date Data sheet status Change notice Supersedes
SA615 v.4 20141114 Product data sheet - SA615 v.3
Modifications: •Table 8 “SA615 application comp onent list” upda ted
•Figure 4 “SA615 45 MHz application circu it” updated
SA615 v.3 20140512 Product data sheet - SA615 v.2
SA615 v.2 19971107 Product specification 853-1402 18665 NE/SA615 v.1
NE/SA615 v.1 19921103 Product specification 853-1402 08109 -
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 24 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
18. Legal information
18.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat io n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond tho se described in the
Product data sheet.
18.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semicondu ctors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, lif e-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development .
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
SA615 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 14 November 2014 25 of 26
NXP Semiconductors SA615
High performance low power mixer FM IF system
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It i s neither qua lif ied nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in au tomotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a docume nt is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
18.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors SA615
High performance low power mixer FM IF system
© NXP Semiconductors N.V. 2014. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 14 November 2014
Document identifier: SA615
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
20. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Thermal characteristics . . . . . . . . . . . . . . . . . . 6
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
11 Application information. . . . . . . . . . . . . . . . . . . 9
11.1 Circuit description. . . . . . . . . . . . . . . . . . . . . . 12
12 Test information. . . . . . . . . . . . . . . . . . . . . . . . 13
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
14 Soldering of SMD packages . . . . . . . . . . . . . . 17
14.1 Introduction to soldering . . . . . . . . . . . . . . . . . 17
14.2 Wave and reflow soldering . . . . . . . . . . . . . . . 17
14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 17
14.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 18
15 Soldering: PCB footprints. . . . . . . . . . . . . . . . 20
16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 22
17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 23
18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 24
18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24
18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
18.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 24
18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25
19 Contact information. . . . . . . . . . . . . . . . . . . . . 25
20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
