TMS320F28044 Digital Signal Processor Data Manual PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Literature Number: SPRS357C August 2006 - Revised January 2010 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Contents 1 F28044 Digital Signal Processor ............................................................................................ 9 ...................................................................................................................... 9 1.2 Getting Started ............................................................................................................. 10 Introduction ...................................................................................................................... 11 2.1 Pin Assignments ........................................................................................................... 12 2.2 Signal Descriptions ........................................................................................................ 14 Functional Overview .......................................................................................................... 20 3.1 Memory Map ............................................................................................................... 21 3.2 Brief Descriptions .......................................................................................................... 23 3.2.1 C28x CPU ....................................................................................................... 23 3.2.2 Memory Bus (Harvard Bus Architecture) .................................................................... 23 3.2.3 Peripheral Bus .................................................................................................. 23 3.2.4 Real-Time JTAG and Analysis ................................................................................ 24 3.2.5 Flash ............................................................................................................. 24 3.2.6 M0, M1 SARAMs ............................................................................................... 24 3.2.7 L0, L1 SARAMs ................................................................................................. 24 3.2.8 Boot ROM ....................................................................................................... 25 3.2.9 Security .......................................................................................................... 26 3.2.10 Peripheral Interrupt Expansion (PIE) Block ................................................................. 27 3.2.11 External Interrupts (XINT1, XINT2, XNMI) .................................................................. 27 3.2.12 Oscillator and PLL .............................................................................................. 27 3.2.13 Watchdog ........................................................................................................ 27 3.2.14 Peripheral Clocking ............................................................................................. 27 3.2.15 Low-Power Modes .............................................................................................. 27 3.2.16 Peripheral Frames 0, 1, 2 (PFn) .............................................................................. 28 3.2.17 General-Purpose Input/Output (GPIO) Multiplexer ......................................................... 28 3.2.18 32-Bit CPU-Timers (0, 1, 2) ................................................................................... 28 3.2.19 Control Peripherals ............................................................................................. 28 3.2.20 Serial Port Peripherals ......................................................................................... 29 3.3 Register Map ............................................................................................................... 29 3.4 Device Emulation Registers .............................................................................................. 30 3.5 Interrupts .................................................................................................................... 31 3.5.1 External Interrupts .............................................................................................. 34 3.6 System Control ............................................................................................................ 35 3.6.1 OSC and PLL Block ............................................................................................ 37 3.6.1.1 External Reference Oscillator Clock Option .................................................... 38 3.6.1.2 PLL-Based Clock Module ......................................................................... 38 3.6.1.3 Loss of Input Clock ................................................................................ 39 3.6.2 Watchdog Block ................................................................................................. 40 3.7 Low-Power Modes Block ................................................................................................. 41 Peripherals ....................................................................................................................... 42 4.1 32-Bit CPU-Timers 0/1/2 ................................................................................................. 42 4.2 Enhanced PWM Modules (ePWM1-16) ................................................................................ 44 4.3 Hi-Resolution PWM (HRPWM) .......................................................................................... 49 4.4 Enhanced Analog-to-Digital Converter (ADC) Module ............................................................... 50 1.1 2 3 4 2 Features Contents Copyright (c) 2006-2010, Texas Instruments Incorporated TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 .................................................................. 53 ............................................................. 55 4.6 Serial Peripheral Interface (SPI) Module (SPI-A) ..................................................................... 58 4.7 Inter-Integrated Circuit (I2C) ............................................................................................. 61 4.8 GPIO MUX ................................................................................................................. 63 Device Support ................................................................................................................. 67 5.1 Device and Development Support Tool Nomenclature ............................................................... 67 5.2 Documentation Support ................................................................................................... 69 Electrical Specifications ..................................................................................................... 73 6.1 Absolute Maximum Ratings .............................................................................................. 73 6.2 Recommended Operating Conditions .................................................................................. 74 6.3 Electrical Characteristics ................................................................................................. 74 6.4 Current Consumption ..................................................................................................... 75 6.4.1 Reducing Current Consumption .............................................................................. 76 6.5 Emulator Connection Without Signal Buffering for the DSP ......................................................... 77 6.6 Timing Parameter Symbology ........................................................................................... 78 6.6.1 General Notes on Timing Parameters ....................................................................... 78 6.6.2 Test Load Circuit ................................................................................................ 79 6.6.3 Device Clock Table ............................................................................................. 79 6.7 Clock Requirements and Characteristics ............................................................................... 80 6.8 Power Sequencing ........................................................................................................ 81 6.8.1 Power Management and Supervisory Circuit Solutions ................................................... 81 6.9 General-Purpose Input/Output (GPIO) ................................................................................. 84 6.9.1 GPIO - Output Timing .......................................................................................... 84 6.9.2 GPIO - Input Timing ............................................................................................ 85 6.9.2.1 Sampling Window Width for Input Signals ...................................................... 86 6.9.2.2 Low-Power Mode Wakeup Timing ............................................................... 87 6.10 Enhanced Control Peripherals ........................................................................................... 91 6.10.1 Enhanced Pulse Width Modulator (ePWM) Timing ........................................................ 91 6.10.2 Trip-Zone Input Timing ......................................................................................... 91 6.10.3 External Interrupt Timing ...................................................................................... 92 6.10.4 I2C Electrical Specification and Timing ...................................................................... 93 6.10.5 Serial Peripheral Interface (SPI) Master Mode Timing .................................................... 93 6.10.6 SPI Slave Mode Timing ........................................................................................ 98 6.11 On-Chip Analog-to-Digital Converter .................................................................................. 100 6.11.1 ADC Power-Up Control Bit Timing .......................................................................... 101 6.11.2 Definitions ...................................................................................................... 102 6.11.3 Sequential Sampling Mode (Single-Channel) (SMODE = 0) ............................................ 103 6.11.4 Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1) .......................................... 104 6.12 Detailed Descriptions .................................................................................................... 105 6.13 Flash Timing .............................................................................................................. 106 Revision History .............................................................................................................. 108 Mechanical Data .............................................................................................................. 110 4.4.1 4.5 5 6 7 8 ADC Connections if the ADC Is Not Used Serial Communications Interface (SCI) Module (SCI-A) Copyright (c) 2006-2010, Texas Instruments Incorporated Contents 3 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com List of Figures 2-1 2-2 3-1 3-2 3-3 3-4 3-5 3-6 3-7 3-8 3-9 3-10 4-1 4-2 4-3 4-4 4-5 4-6 4-7 4-8 4-9 4-10 4-11 4-12 5-1 6-1 6-2 6-3 6-4 6-5 6-6 6-7 6-8 6-9 6-10 6-11 6-12 6-13 6-14 6-15 6-16 6-17 6-18 6-19 6-20 6-21 4 .................................................................................................. 100-Ball GGM and ZGM MicroStar BGATM (Bottom View) ................................................................. Functional Block Diagram ....................................................................................................... F28044 Memory Map ............................................................................................................ External and PIE Interrupt Sources ............................................................................................ Multiplexing of Interrupts Using the PIE Block ............................................................................... Clock and Reset Domains ...................................................................................................... OSC and PLL Block Diagram................................................................................................... Using a 3.3-V External Oscillator............................................................................................... Using a 1.8-V External Oscillator............................................................................................... Using the Internal Oscillator .................................................................................................... Watchdog Module ................................................................................................................ CPU-Timers ....................................................................................................................... CPU-Timer Interrupt Signals and Output Signal ............................................................................. Multiple PWM Modules .......................................................................................................... ePWM Sub-Modules Showing Critical Internal Signal Interconnections .................................................. Block Diagram of the ADC Module ............................................................................................ ADC Pin Connections With Internal Reference .............................................................................. ADC Pin Connections With External Reference ............................................................................. Serial Communications Interface (SCI) Module Block Diagram............................................................ SPI Module Block Diagram (Slave Mode) .................................................................................... I2C Peripheral Module Interfaces .............................................................................................. GPIO MUX Block Diagram ...................................................................................................... Qualification Using Sampling Window ......................................................................................... Example of TMS320x280x Device Nomenclature ........................................................................... Emulator Connection Without Signal Buffering for the DSP ................................................................ 3.3-V Test Load Circuit .......................................................................................................... Clock Timing ...................................................................................................................... Power-on Reset .................................................................................................................. Warm Reset ....................................................................................................................... Example of Effect of Writing Into PLLCR Register........................................................................... General-Purpose Output Timing ............................................................................................... Sampling Mode ................................................................................................................... General-Purpose Input Timing.................................................................................................. IDLE Entry and Exit Timing ..................................................................................................... STANDBY Entry and Exit Timing Diagram ................................................................................... HALT Wake-Up Using GPIOn .................................................................................................. PWM Hi-Z Characteristics ....................................................................................................... ADCSOCAO or ADCSOCBO Timing .......................................................................................... External Interrupt Timing ........................................................................................................ SPI Master Mode External Timing (Clock Phase = 0) ....................................................................... SPI Master External Timing (Clock Phase = 1) .............................................................................. SPI Slave Mode External Timing (Clock Phase = 0) ........................................................................ SPI Slave Mode External Timing (Clock Phase = 1) ........................................................................ ADC Power-Up Control Bit Timing ........................................................................................... ADC Analog Input Impedance Model ........................................................................................ 100-Pin PZ LQFP (Top View) List of Figures 13 13 21 21 32 32 35 37 37 37 38 40 42 43 44 49 51 52 53 57 60 62 63 66 68 77 79 81 82 83 84 85 85 86 87 89 90 91 92 92 95 97 99 99 101 102 Copyright (c) 2006-2010, Texas Instruments Incorporated TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 6-22 Sequential Sampling Mode (Single-Channel) Timing ...................................................................... 103 6-23 Simultaneous Sampling Mode Timing Copyright (c) 2006-2010, Texas Instruments Incorporated ....................................................................................... List of Figures 104 5 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com List of Tables 2-1 Hardware Features ............................................................................................................... 11 2-2 Signal Descriptions ............................................................................................................... 14 3-1 Addresses of Flash Sectors ..................................................................................................... 22 3-2 Wait-states ........................................................................................................................ 22 3-3 Boot Mode Selection ............................................................................................................. 25 3-4 Peripheral Frame 0 Registers 3-5 3-6 3-7 3-8 3-9 3-10 3-11 3-12 3-13 3-14 4-1 4-2 4-3 4-4 4-5 4-6 4-7 4-8 4-9 4-10 4-11 5-1 6-1 6-2 6-3 6-4 6-5 6-6 6-7 6-8 6-9 6-10 6-11 6-12 6-13 6-14 6-15 6-16 6-17 6-18 6 .................................................................................................. Peripheral Frame 1 Registers .................................................................................................. Peripheral Frame 2 Registers .................................................................................................. Device Emulation Registers..................................................................................................... PIE Peripheral Interrupts ....................................................................................................... PIE Configuration and Control Registers...................................................................................... External Interrupt Registers ..................................................................................................... PLL, Clocking, Watchdog, and Low-Power Mode Registers .............................................................. PLLCR Register Bit Definitions ................................................................................................. Possible PLL Configuration Modes ............................................................................................ Low-Power Modes ............................................................................................................... CPU-Timers 0, 1, 2 Configuration and Control Registers ................................................................... ePWM1-4 Control and Status Registers ...................................................................................... ePWM5-8 Control and Status Registers ...................................................................................... ePWM9-12 Control and Status Registers .................................................................................... ePWM13-16 Control and Status Registers ................................................................................... ADC Registers ................................................................................................................... SCI-A Registers .................................................................................................................. SPI-A Registers................................................................................................................... I2C-A Registers ................................................................................................................... GPIO Registers .................................................................................................................. F28044 GPIO MUX Table ....................................................................................................... TMS320F28044 Peripheral Selection Guide ................................................................................. TMS320F28044 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT ............................. Typical Current Consumption by Various Peripherals (at 100 MHz) ..................................................... TMS320x280x Clock Table and Nomenclature .............................................................................. Input Clock Frequency ........................................................................................................... XCLKIN Timing Requirements - PLL Enabled ............................................................................... XCLKIN Timing Requirements - PLL Disabled .............................................................................. XCLKOUT Switching Characteristics (PLL Bypassed or Enabled) ....................................................... Power Management and Supervisory Circuit Solutions ..................................................................... Reset (XRS) Timing Requirements ........................................................................................... General-Purpose Output Switching Characteristics ......................................................................... General-Purpose Input Timing Requirements ................................................................................ IDLE Mode Timing Requirements ............................................................................................. IDLE Mode Switching Characteristics ........................................................................................ STANDBY Mode Timing Requirements ...................................................................................... STANDBY Mode Switching Characteristics .................................................................................. HALT Mode Timing Requirements ............................................................................................ HALT Mode Switching Characteristics ........................................................................................ ePWM Timing Requirements .................................................................................................. List of Tables 29 30 30 30 32 33 34 36 38 39 41 43 45 46 47 48 54 56 59 62 64 65 69 75 76 79 80 80 80 80 81 83 84 85 87 87 88 88 89 89 91 Copyright (c) 2006-2010, Texas Instruments Incorporated TMS320F28044 www.ti.com 6-19 6-20 6-21 6-22 6-23 6-24 6-25 6-26 6-27 6-28 6-29 6-30 6-31 6-32 6-33 6-34 6-35 6-36 6-37 6-38 8-1 8-2 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 .............................................................................................. 91 Trip-Zone input Timing Requirements ........................................................................................ 91 High Resolution PWM Characteristics at SYSCLKOUT = (60 - 100 MHz) ............................................... 92 External ADC Start-of-Conversion Switching Characteristics .............................................................. 92 External Interrupt Timing Requirements ...................................................................................... 92 External Interrupt Switching Characteristics ................................................................................. 92 I2C Timing ........................................................................................................................ 93 SPI Master Mode External Timing (Clock Phase = 0) ...................................................................... 94 SPI Master Mode External Timing (Clock Phase = 1) ...................................................................... 96 SPI Slave Mode External Timing (Clock Phase = 0) ....................................................................... 98 SPI Slave Mode External Timing (Clock Phase = 1) ....................................................................... 99 ADC Electrical Characteristics (over recommended operating conditions) ............................................ 100 ADC Power-Up Delays ......................................................................................................... 101 Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK) ....................................... 101 Sequential Sampling Mode Timing ........................................................................................... 103 Simultaneous Sampling Mode Timing ....................................................................................... 104 Flash Endurance for A Temperature Material ............................................................................... 106 Flash Parameters at 100-MHz SYSCLKOUT ............................................................................... 106 Flash/OTP Access Timing .................................................................................................... 106 Minimum Required Flash/OTP Wait-States at Different Frequencies ................................................... 107 F28044 Thermal Model 100-pin GGM Results ............................................................................. 110 F28044 Thermal Model 100-pin PZ Results ................................................................................ 110 ePWM Switching Characteristics Copyright (c) 2006-2010, Texas Instruments Incorporated List of Tables 7 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 8 List of Tables www.ti.com Copyright (c) 2006-2010, Texas Instruments Incorporated TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Digital Signal Processor Check for Samples: TMS320F28044 1 F28044 Digital Signal Processor 1.1 Features 1234 * High-Performance 100-MHz (10-ns Cycle Time) Processor * TMS320C28xTM 32-Bit CPU - Single-cycle 16 x 16 and 32 x 32 Multiply-accumulate (MAC) Operations - Dual 16 x 16 MAC - Fast Interrupt Response - Unified Memory Programming Model * On-Chip Memory - 64K x 16 Flash - 10K x 16 SARAM - 1K x 16 OTP - 4K x 16 Boot ROM - Code Security Module Protects Against Unauthorized Memory Access * Clocking - Dynamic PLL Ratio Changes Supported - On-Chip Oscillator - Clock-Fail-Detect Mode * Interrupts - Support for up to Three External Core Interrupts - Peripheral Interrupt Expansion (PIE) Block That Supports All Peripheral Interrupts * High-speed, 12-Bit ADC - 80 ns (12.5 MSPS) Conversion Rate - 16 Channels - Two Sample-and-Hold - Single/Simultaneous Conversions - Internal or External Reference * High-Resolution PWM - 16 Outputs with 150 ps Resolution - 14.8 Bits at 200-kHz Switching - 13.4 Bits at 500-kHz Switching - 12.4 Bits at 1-MHz Switching * Communications Port Peripherals - Serial Peripheral Interface (SPI) Module - Serial Communications Interface (SCI) - Inter-Integrated Circuit (I2C) Bus * Timers - Three 32-bit CPU Timers - Up to 16 16-bit Timers - Watchdog Timer Module * Up to 35 General-Purpose Input/Output (GPIO) Pins With Input Filtering * On-chip JTAG Emulation With Real-time Debug via Hardware * JTAG Boundary Scan Support * Low-power IDLE, STANDBY, and HALT Modes * Development Tools - F28044 eZdsp Starter Kit - Code Composer StudioTM IDE With Flash Programming Plug-in - C28x-optimized ANSI C/C++ Compiler/Assembler/Linker - DSP/BIOSTM Real-time Operating System - USB-based JTAG Emulators (1) * Available Software - C2000TM Digital Power Supply Software Library - C28xTM IQ Math Library - C28x Header Files With Example Programs for all Peripherals - C28x DSP Library - C28x Digital Motor Control Software Library * Package Options - 100-pin Thin Quad Flatpack (PZ) - 100-pin MicroStar BGATM (GGM, ZGM) - RoHS-compliant, Green Packaging * Temperature Range: A: -40C to 85C (PZ, GGM, ZGM) (1) IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture 1 2 3 4 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TMS320C28x, Code Composer Studio, DSP/BIOS, C2000, C28x, MicroStar BGA, TMS320 are trademarks of Texas Instruments. eZdsp, XDS510USB are trademarks of Spectrum Digital. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2006-2010, Texas Instruments Incorporated TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 1.2 www.ti.com Getting Started This section gives a brief overview of the steps to take when first developing for a C28x device. For more detail on each of these steps, see the following: * Getting Started With TMS320C28x Digital Signal Controllers (literature number SPRAAM0). * C2000 Getting Started Website (http://www.ti.com/c2000getstarted) Step 1. Acquire the appropriate development tools The quickest way to begin working with a C28x device is to acquire an eZdspTM kit for initial development, which, in one package, includes: * On-board JTAG emulation via USB or parallel port * Appropriate emulation driver * Code Composer StudioTM IDE for eZdsp Once you have become familiar with the device and begin developing on your own hardware, purchase Code Composer StudioTM IDE separately for software development and a JTAG emulation tool to get started on your project. Step 2. Download starter software To simplify programming for C28x devices, it is recommended that users download and use the C/C++ Header Files and Example(s) to begin developing software for the C28x devices and their various peripherals. After downloading the appropriate header file package for your device, refer to the following resources for step-by-step instructions on how to run the peripheral examples and use the header file structure for your own software * The Quick Start Readme in the /doc directory to run your first application. * Programming TMS320x28xx and 28xxx Peripherals in C/C++ Application Report (literature number SPRAA85) Step 3. Download flash programming software Many C28x devices include on-chip flash memory and tools that allow you to program the flash with your software IP. * Flash Tools: C28x Flash Tools * TMS320F281xTM Flash Programming Solutions (literature number SPRB169) * Running an Application from Internal Flash Memory on the TMS320F28xxx DSP (literature number SPRA958) Step 4. Move on to more advanced topics For more application software and other advanced topics, visit the TI website at http://www.ti.com or http://www.ti.com/c2000getstarted. 10 F28044 Digital Signal Processor Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 2 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Introduction The TMS320F28044 device, member of the TMS320C28xTM DSP generation, is a highly integrated, high-performance solution for demanding control applications. Throughout this document, TMS320F28044 is abbreviated as F28044. Table 2-1 provides a summary of the device's features. Table 2-1. Hardware Features TYPE (1) F28044 Instruction cycle (at 100 MHz) - 10 ns Single-access RAM (SARAM) (16-bit word) - 10K (L0, L1, M0, M1) 3.3-V on-chip flash (16-bit word) - 64K On-chip ROM (16-bit word) - - Code security for on-chip flash/SARAM/OTP blocks - Yes Boot ROM (4K x 16) - Yes One-time programmable (OTP) ROM (16-bit word) - 1K PWM outputs (one 16-bit timer/module) 0 ePWM1-16 HRPWM channels 0 ePWM1-16 - Yes FEATURE Watchdog timer 12-Bit ADC No. of channels 1 16 MSPS 1 12.5 Conversion time 1 80 ns 32-Bit CPU timers - 3 Serial Peripheral Interface (SPI) 0 SPI-A Serial Communications Interface (SCI) 0 SCI-A Inter-Integrated Circuit (I C) 0 I2C-A Digital I/O pins (shared) - 35 External interrupts - 3 1.8-V Core, 3.3-V I/O - Yes 100-Pin PZ - Yes 100-ball GGM, ZGM - Yes A: -40C to 85C - (PZ, GGM, ZGM) - TMS 2 Supply voltage Packaging Temperature options Product status (2) (1) (2) A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor differences between devices that do not affect the basic functionality of the module. These device-specific differences are listed in the TMS320x28xx, 28xxx DSP Peripheral Reference Guide (literature number SPRU566) and in the peripheral reference guides. See Section 5.1 , Device and Development Support Tool Nomenclature, for descriptions of device stages. Introduction Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 11 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 2.1 www.ti.com Pin Assignments VSS GPIO18/SPICLKA/TZ1 GPIO5/EPWM6A GPIO17/SPISOMIA/TZ6 GPIO4/EPWM5A 54 53 52 51 56 55 GPIO19/SPISTEA/TZ2 GPIO6/EPWM7A/EPWMSYNCI/EPWMSYNCO 57 VDD GPIO7/EPWM8A 58 GPIO8/EPWM9A/ADCSOCAO 60 59 VSS GPIO9/EPWM10A 61 GPIO20 63 62 VDDIO GPIO10/EPWM11A/ADCSOCBO 64 XCLKOUT 66 65 VDD VSS GPIO21 GPIO11/EPWM12A 69 67 GPIO22 71 70 68 TDI GPIO23 72 74 73 TCK TMS 75 The TMS320F28044 100-pin PZ low-profile quad flatpack (LQFP) pin assignments are shown in Figure 2-1. The 100-ball GGM and ZGM ball grid array (BGA) terminal assignments are shown in Figure 2-2. Table 2-2 describes the function(s) of each pin. TDO 76 50 VSS 77 49 VSS XRS 78 48 GPIO3/EPWM4A GPIO27 79 47 GPIO0/EPWM1A EMU0 80 46 VDDIO EMU1 81 45 GPIO2/EPWM3A GPIO16/SPISIMOA/TZ5 VDDIO 82 44 GPIO1/EPWM2A GPIO24 83 43 GPIO34 TRST 84 42 VDD VDD 85 41 VSS X2 86 40 VDD2A18 VSS 87 39 VSS2AGND X1 88 38 ADCRESEXT 17 18 19 20 21 22 23 24 25 ADCINA5 ADCINA4 ADCINA3 ADCINA2 ADCINA1 ADCINA0 ADCLO VSSAIO VDDAIO 16 26 ADCINA7 ADCINB0 100 GPIO32/SDAA/EPWMSYNCI/ADCSOCAO ADCINA6 27 15 99 VDDA2 ADCINB1 GPIO26 14 28 13 98 VSSA2 ADCINB2 TEST2 VSS1AGND 29 12 97 VDD1A18 ADCINB3 TEST1 11 30 10 96 VSS ADCINB4 VDD3VFL VDD 31 9 95 GPIO15/TZ4/EPWM16A ADCINB5 GPIO13/TZ2/EPWM14A 8 32 GPIO14/TZ3/EPWM15A 94 7 ADCINB6 VSS GPIO31/TZ4 33 6 93 5 ADCINB7 VDD GPIO30/TZ3 34 GPIO33/EPWMSYNCO/ADCSOCBO 92 4 ADCREFIN GPIO28/SCIRXDA/TZ5 3 35 VDDIO 91 GPIO29/SCITXDA/TZ6 ADCREFM GPIO25 2 ADCREFP 36 1 37 90 VSS 89 GPIO12/TZ1/EPWM13A VSS XCLKIN Figure 2-1. 100-Pin PZ LQFP (Top View) 12 Introduction Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 K VSSAIO ADCINB0 ADCINB3 ADCINB5 ADCINB7 VSS2AGND GPIO1 GPIO0 VSS GPIO16 J ADCLO VDDAIO ADCINB1 ADCINB4 ADCREFIN VDD2A18 GPIO2 GPIO3 GPIO4 GPIO17 H ADCINA1 ADCINA0 ADCINB2 ADCINB6 ADCREFM VSS VDDIO GPIO18 GPIO5 VSS G ADCINA4 ADCINA3 ADCINA2 ADCINA5 ADCREFP VDD GPIO34 GPIO7 GPIO6 GPIO19 F VSSA2 VDDA2 ADCINA7 ADCINA6 ADCRESEXT GPIO20 VSS GPIO9 GPIO8 VDD E GPIO15 VDD VSS VDD1A18 VSS1AGND X1 GPIO21 XCLKOUT VDDIO GPIO10 D GPIO31 GPIO30 GPIO14 VDD GPIO28 VSS VDD GPIO22 GPIO11 VSS C GPIO33 VDDIO GPIO29 VDD3VFL GPIO25 X2 GPIO24 GPIO27 TDI GPIO23 B VSS GPIO12 TEST2 GPIO13 XCLKIN VDD EMU1 XRS TDO TMS A GPIO32 GPIO26 TEST1 VSS VSS TRST VDDIO EMU0 VSS TCK 1 2 3 4 5 6 7 8 9 10 BOTTOM VIEW Figure 2-2. 100-Ball GGM and ZGM MicroStar BGATM (Bottom View) Introduction Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 13 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 2.2 www.ti.com Signal Descriptions Table 2-2 describes the signals on the F28044 device. All digital inputs are TTL-compatible. All outputs are 3.3 V with CMOS levels. Inputs are not 5-V tolerant. Table 2-2. Signal Descriptions PIN NO. NAME PZ PIN # GGM/ ZGM BALL # DESCRIPTION (1) JTAG TRST 84 A6 JTAG test reset with internal pulldown. TRST, when driven high, gives the scan system control of the operations of the device. If this signal is not connected or driven low, the device operates in its functional mode, and the test reset signals are ignored. NOTE: Do not use pullup resistors on TRST; it has an internal pull-down device. TRST is an active high test pin and must be maintained low at all times during normal device operation. An external pulldown resistor is required on this pin. The value of this resistor should be based on drive strength of the debugger pods applicable to the design. A 2.2-k resistor generally offers adequate protection. Since this is application-specific, it is recommended that each target board be validated for proper operation of the debugger and the application. (I, ) TCK 75 A10 JTAG test clock with internal pullup (I, ) TMS 74 B10 JTAG test-mode select (TMS) with internal pullup. This serial control input is clocked into the TAP controller on the rising edge of TCK. (I, ) TDI 73 C9 JTAG test data input (TDI) with internal pullup. TDI is clocked into the selected register (instruction or data) on a rising edge of TCK. (I, ) TDO 76 B9 JTAG scan out, test data output (TDO). The contents of the selected register (instruction or data) are shifted out of TDO on the falling edge of TCK. (O/Z 8 mA drive) A8 Emulator pin 0. When TRST is driven high, this pin is used as an interrupt to or from the emulator system and is defined as input/output through the JTAG scan. This pin is also used to put the device into boundary-scan mode. With the EMU0 pin at a logic-high state and the EMU1 pin at a logic-low state, a rising edge on the TRST pin would latch the device into boundary-scan mode. (I/O/Z, 8 mA drive ) NOTE: An external pullup resistor is recommended on this pin. The value of this resistor should be based on the drive strength of the debugger pods applicable to the design. A 2.2-k to 4.7-k resistor is generally adequate. Since this is application-specific, it is recommended that each target board be validated for proper operation of the debugger and the application. B7 Emulator pin 1. When TRST is driven high, this pin is used as an interrupt to or from the emulator system and is defined as input/output through the JTAG scan. This pin is also used to put the device into boundary-scan mode. With the EMU0 pin at a logic-high state and the EMU1 pin at a logic-low state, a rising edge on the TRST pin would latch the device into boundary-scan mode. (I/O/Z, 8 mA drive ) NOTE: An external pullup resistor is recommended on this pin. The value of this resistor should be based on the drive strength of the debugger pods applicable to the design. A 2.2-k to 4.7-k resistor is generally adequate. Since this is application-specific, it is recommended that each target board be validated for proper operation of the debugger and the application. EMU0 80 EMU1 81 FLASH VDD3VFL 96 C4 3.3-V Flash Core Power Pin. This pin should be connected to 3.3 V at all times. On the ROM parts (C280x), this pin should be connected to VDDIO. TEST1 97 A3 Test Pin. Reserved for TI. Must be left unconnected. (I/O) TEST2 98 B3 Test Pin. Reserved for TI. Must be left unconnected. (I/O) CLOCK XCLKOUT 66 E8 Output clock derived from SYSCLKOUT. XCLKOUT is either the same frequency, one-half the frequency, or one-fourth the frequency of SYSCLKOUT. This is controlled by the bits 1, 0 (XCLKOUTDIV) in the XCLK register. At reset, XCLKOUT = SYSCLKOUT/4. The XCLKOUT signal can be turned off by setting XCLKOUTDIV to 3. Unlike other GPIO pins, the XCLKOUT pin is not placed in high-impedance state during a reset. (O/Z, 8 mA drive). XCLKIN 90 B5 External Oscillator Input. This pin is to feed a clock from an external 3.3-V oscillator. In this case, the X1 pin must be tied to GND. If a crystal/resonator is used (or if an external 1.8-V oscillator is used to feed clock to X1 pin), this pin must be tied to GND. (I) (1) 14 I = Input, O = Output, Z = High impedance, OD = Open drain, = Pullup, = Pulldown Introduction Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Table 2-2. Signal Descriptions (continued) PIN NO. NAME PZ PIN # GGM/ ZGM BALL # DESCRIPTION (1) X1 88 E6 Internal/External Oscillator Input. To use the internal oscillator, a quartz crystal or a ceramic resonator may be connected across X1 and X2. The X1 pin is referenced to the 1.8-V core digital power supply. A 1.8-V external oscillator may be connected to the X1 pin. In this case, the XCLKIN pin must be connected to ground. If a 3.3-V external oscillator is used with the XCLKIN pin, X1 must be tied to GND. (I) X2 86 C6 Internal Oscillator Output. A quartz crystal or a ceramic resonator may be connected across X1 and X2. If X2 is not used it must be left unconnected. (O) RESET XRS 78 B8 Device Reset (in) and Watchdog Reset (out). Device reset. XRS causes the device to terminate execution. The PC will point to the address contained at the location 0x3FFFC0. When XRS is brought to a high level, execution begins at the location pointed to by the PC. This pin is driven low by the DSP when a watchdog reset occurs. During watchdog reset, the XRS pin is driven low for the watchdog reset duration of 512 OSCCLK cycles. (I/OD, ) The output buffer of this pin is an open-drain with an internal pullup. It is recommended that this pin be driven by an open-drain device. ADCINA7 16 F3 ADC Group A, Channel 7 input (I) ADCINA6 17 F4 ADC Group A, Channel 6 input (I) ADCINA5 18 G4 ADC Group A, Channel 5 input (I) ADCINA4 19 G1 ADC Group A, Channel 4 input (I) ADCINA3 20 G2 ADC Group A, Channel 3 input (I) ADCINA2 21 G3 ADC Group A, Channel 2 input (I) ADCINA1 22 H1 ADC Group A, Channel 1 input (I) ADCINA0 23 H2 ADC Group A, Channel 0 input (I) ADCINB7 34 K5 ADC Group B, Channel 7 input (I) ADCINB6 33 H4 ADC Group B, Channel 6 input (I) ADCINB5 32 K4 ADC Group B, Channel 5 input (I) ADCINB4 31 J4 ADC Group B, Channel 4 input (I) ADCINB3 30 K3 ADC Group B, Channel 3 input (I) ADCINB2 29 H3 ADC Group B, Channel 2 input (I) ADCINB1 28 J3 ADC Group B, Channel 1 input (I) ADCINB0 27 K2 ADC Group B, Channel 0 input (I) ADCLO 24 J1 Low Reference (connect to analog ground) (I) ADCRESEXT 38 F5 ADC External Current Bias Resistor. Connect a 22-k resistor to analog ground. ADCREFIN 35 J5 External reference input (I) ADCREFP 37 G5 Internal Reference Positive Output. Requires a low ESR (50 m - 1.5 ) ceramic bypass capacitor of 2.2 mF to analog ground. (O) ADCREFM 36 H5 Internal Reference Medium Output. Requires a low ESR (50 m - 1.5 ) ceramic bypass capacitor of 2.2 mF to analog ground. (O) VDDA2 15 F2 ADC Analog Power Pin (3.3 V) VSSA2 14 F1 ADC Analog Ground Pin VDDAIO 26 J2 ADC Analog I/O Power Pin (3.3 V) VSSAIO 25 K1 ADC Analog I/O Ground Pin VDD1A18 12 E4 ADC Analog Power Pin (1.8 V) VSS1AGND 13 E5 ADC Analog Ground Pin VDD2A18 40 J6 ADC Analog Power Pin (1.8 V) VSS2AGND 39 K6 ADC Analog Ground Pin ADC SIGNALS CPU AND I/O POWER PINS Introduction Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 15 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Table 2-2. Signal Descriptions (continued) PIN NO. NAME PZ PIN # GGM/ ZGM BALL # VDD 10 E2 VDD 42 G6 VDD 59 F10 VDD 68 D7 VDD 85 B6 VDD 93 D4 VDDIO 3 C2 VDDIO 46 H7 VDDIO 65 E9 VDDIO 82 A7 VSS 2 B1 VSS 11 E3 VSS 41 H6 VSS 49 K9 VSS 55 H10 VSS 62 F7 VSS 69 D10 VSS 77 A9 VSS 87 D6 VSS 89 A5 VSS 94 A4 DESCRIPTION (1) CPU and Logic Digital Power Pins (1.8 V) Digital I/O Power Pin (3.3 V) Digital Ground Pins GPIOA AND PERIPHERAL SIGNALS (2) GPIO0 EPWM1A GPIO1 EPWM2A GPIO2 EPWM3A GPIO3 EPWM4A GPIO4 EPWM5A GPIO5 EPWM6A - (2) (3) 16 47 44 45 48 51 53 K8 General purpose input/output 0 (I/O/Z) (3) Enhanced PWM1 Output and HRPWM channel (O) - K7 General purpose input/output 1 (I/O/Z) (3) Enhanced PWM2 Output A and HRPWM channel (O) - J7 General purpose input/output 2 (I/O/Z) (3) Enhanced PWM3 Output A and HRPWM channel (O) - J8 General purpose input/output 3 (I/O/Z) (3) Enhanced PWM4 Output A and HRPWM channel (O) - J9 General purpose input/output 4 (I/O/Z) (3) Enhanced PWM5 output A and HRPWM channel (O) - H9 General purpose input/output 5 (I/O/Z) (3) Enhanced PWM6 Output A and HRPWM channel (O) - All GPIO pins are I/O/Z, 4-mA drive typical (unless otherwise indicated), and have an internal pullup, which can be selectively enabled/disabled on a per-pin basis. This feature only applies to the GPIO pins. The GPIO function (shown in Italics) is the default at reset. The peripheral signals that are listed under them are alternate functions. The pullups on GPIO0-GPIO15 pins are not enabled at reset. Introduction Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Table 2-2. Signal Descriptions (continued) PIN NO. NAME PZ PIN # GGM/ ZGM BALL # DESCRIPTION GPIO6 EPWM7A EPWMSYNCI EPWMSYNCO 56 G9 General purpose input/output 6 (I/O/Z) (3) Enhanced PWM7 output A and HRPWM channel (O) External ePWM sync pulse input (I) External ePWM sync pulse output (O) GPIO7 EPWM8A - 58 G8 General purpose input/output 7 (I/O/Z) (3) Enhanced PWM8 Output A and HRPWM channel (O) - GPIO8 EPWM9A ADCSOCAO 60 F9 General purpose input/output 8 (I/O/Z) (3) Enhanced PWM9 output A(O) ADC start-of-conversion A (O) GPIO9 EPWM10A - 61 F8 General purpose input/output 9 (I/O/Z) (3) Enhanced PWM10 Output A and HRPWM channel (O) - GPIO10 EPWM11A ADCSOCBO 64 E10 General purpose input/output 10 (I/O/Z) (3) Enhanced PWM11 Output A and HRPWM channel (O) ADC start-of-conversion B (O) GPIO11 EPWM12A - 70 D9 General purpose input/output 11 (I/O/Z) (3) Enhanced PWM12 Output A and HRPWM channel (O) - B2 General purpose input/output 12 (I/O/Z) (4) Trip Zone input 1 (I) Enhanced PWM13 Output A and HRPWM channel (O) - B4 General purpose input/output 13 (I/O/Z) (4) Trip zone input 2 (I) Enhanced PWM14 Output A and HRPWM channel (O) - D3 General purpose input/output 14 (I/O/Z) (4) Trip zone input 3 (I) Enhanced PWM15 Output A and HRPWM channel (O) - E1 General purpose input/output 15 (I/O/Z) (4) Trip zone input 4 (I) Enhanced PWM16 Output A and HRPWM channel (O) - K10 General purpose input/output 16 (I/O/Z) (4) SPI-A slave in, master out (I/O) Trip zone input 5 (I) J10 General purpose input/output 17 (I/O/Z) (4) SPI-A slave out, master in (I/O) Trip zone input 6(I) H8 General purpose input/output 18 (I/O/Z) (4) SPI-A clock input/output (I/O) Trip zone input 1 (I) GPIO12 TZ1 EPWM13A GPIO13 TZ2 EPWM14A GPIO14 TZ3 EPWM15A GPIO15 TZ4 EPWM16A GPIO16 SPISIMOA TZ5 GPIO17 SPISOMIA TZ6 GPIO18 SPICLKA TZ1 GPIO19 SPISTEA TZ2 GPIO20 (4) 1 95 8 9 50 52 54 57 63 G10 F6 (1) General purpose input/output 19 (I/O/Z) (4) SPI-A slave transmit enable input/output (I/O) Trip zone input 2 (I) General purpose input/output 20 (I/O/Z) (4) - The pullups on GPIO16-GPIO34 are enabled upon reset. Introduction Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 17 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Table 2-2. Signal Descriptions (continued) PIN NO. NAME GPIO21 GPIO22 GPIO23 GPIO24 GPIO25 GPIO26 GPIO27 GPIO28 SCIRXDA TZ5 GPIO29 SCITXDA TZ6 GPIO30 TZ3 GPIO31 TZ4 GPIO32 SDAA EPWMSYNCI ADCSOCAO 18 PZ PIN # 67 71 72 83 91 99 79 92 4 6 7 100 GGM/ ZGM BALL # DESCRIPTION (1) E7 General purpose input/output 21 (I/O/Z) (4) - D8 General purpose input/output 22 (I/O/Z) (4) - C10 General purpose input/output 23 (I/O/Z) (4) - C7 General purpose input/output 24 (I/O/Z) (4) - C5 General purpose input/output 25 (I/O/Z) (4) - A2 General purpose input/output 26 (I/O/Z) (4) - C8 General purpose input/output 27 (I/O/Z) (4) - D5 General purpose input/output 28. This pin has an 8-mA (typical) output buffer. (I/O/Z) (4) SCI receive data (I) Trip zone 5 (I) C3 General purpose input/output 29. This pin has an 8-mA (typical) output buffer. (I/O/Z) (4) SCI transmit data (O) Trip zone 6 (I) D2 General purpose input/output 30. This pin has an 8-mA (typical) output buffer. (I/O/Z) (4) Trip zone input 3 (I) D1 General purpose input/output 31. This pin has an 8-mA (typical) output buffer. (I/O/Z) (4) Trip zone input 4 (I) A1 General purpose input/output 32 (I/O/Z) (4) I2C data open-drain bidirectional port (I/OD) Enhanced PWM external sync pulse input (I) ADC start-of-conversion (O) Introduction Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Table 2-2. Signal Descriptions (continued) PIN NO. NAME GPIO33 SCLA EPWMSYNCO ADCSOCBO GPIO34 (1) PZ PIN # 5 43 GGM/ ZGM BALL # DESCRIPTION C1 General-Purpose Input/Output 33 (I/O/Z) (1) I2C clock open-drain bidirectional port (I/OD) Enhanced PWM external synch pulse output (O) ADC start-of-conversion (O) G7 General-Purpose Input/Output 34 (I/O/Z) (1) - (1) The pullups on GPIO16-GPIO34 are enabled upon reset. Introduction Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 19 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 3 www.ti.com Functional Overview Memory Bus TINT0 32-bit CPU TIMER 0 TINT1 32-bit CPU TIMER 1 TINT2 32-bit CPU TIMER 2 7 Real-Time JTAG (TDI, TDO, TRST, TCK, TMS, EMU0, EMU1) INT14 PIE (96 Interrupts) (A) INT[12:1] M0 SARAM 1K x 16 External Interrupt Control 32 4 16 GPIOs (35) GPIO MUX 2 SCI-A FIFO SPI-A FIFO 2 I C-A 16 M1 SARAM 1K x 16 NMI, INT13 L0 SARAM 4K x 16 (0-wait) FIFO L1 SARAM 4K x 16 (0-wait) ePWM1 to ePWM16 (16 PWM Outputs, 6 Trip Zones, 6 Timers, 16-Bit) C28x CPU (100 MHz) FLASH 64K x 16 32 OTP 1K x 16 SYSCLKOUT System Control XCLKOUT XRS XCLKIN X1 X2 RS (Oscillator, PLL, Peripheral Clocking, Low-Power Modes, Watchdog) CLKIN Boot ROM 4K x 16 (1-wait state) ADCSOCA/B SOCA/B 12-Bit ADC 16 Channels Protected by the code-security module. A. Peripheral Bus 43 of the possible 96 interrupts are used on the devices. Figure 3-1. Functional Block Diagram 20 Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 3.1 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Memory Map Block Start Address Prog Space Data Space 0x00 0000 M0 Vector - RAM (32 x 32) (Enabled if VMAP = 0) 0x00 0040 M0 SARAM (1K x 16) 0x00 0400 M1 SARAM (1K x 16) 0x00 0800 Low 64K (0000 - FFFF) (24x/240x-equivalent data space) Peripheral Frame 0 0x00 0D00 PIE Vector - RAM (256 x 16) (Enabled if ENPIE = 1) Reserved 0x00 0E00 Reserved 0x00 6000 0x00 7000 Peripheral Frame 1 (protected) Reserved Peripheral Frame 2 (protected) 0x00 8000 L0 SARAM (0-wait) (4K x 16, Secure Zone, Dual Mapped) 0x00 9000 L1 SARAM (0-wait) (4K x 16, Secure Zone, Dual Mapped) 0x00 A000 Reserved 0x3D 7800 OTP (1K x 16, Secure Zone) 0x3D 7C00 Reserved 0x3E 8000 FLASH (64K x 16, Secure Zone) 0x3F 7FF8 High 64K (3F0000 - 3FFFFF) (24x/240x-equivalent program space) 128-Bit Password 0x3F 8000 L0 SARAM (0-wait) (4K x 16, Secure Zone, Dual Mapped) 0x3F 9000 L1 SARAM (0-wait) (4K x 16, Secure Zone, Dual Mapped) 0x3F A000 Reserved 0x3F F000 Boot ROM (4K x 16) 0x3F FFC0 A. B. C. D. Vectors (32 x 32) (Enabled if VMAP = 1, ENPIE = 0) Memory blocks are not to scale. Peripheral Frame 0, Peripheral Frame 1, and Peripheral Frame 2 memory maps are restricted to data memory only. User program cannot access these memory maps in program space. "Protected" means the order of Write followed by Read operations is preserved rather than the pipeline order. Certain memory ranges are EALLOW protected against spurious writes after configuration. Figure 3-2. F28044 Memory Map Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 21 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Table 3-1. Addresses of Flash Sectors ADDRESS RANGE PROGRAM AND DATA SPACE 0x3E 8000 - 0x3E BFFF Sector D (16K x 16) 0x3E C000 - 0x3E FFFF Sector C (16K x 16) 0x3F 0000 - 0x3F 3FFF Sector B (16K x 16) 0x3F 4000 - 0x3F 7F7F Sector A (16K x 16) 0x3F 7F80 - 0x3F 7FF5 Program to 0x0000 when using the Code Security Module 0x3F 7FF6 - 0x3F 7FF7 Boot-to-Flash Entry Point (program branch instruction here) 0x3F 7FF8 - 0x3F 7FFF Security Password (128-Bit) (Do not program to all zeros) Peripheral Frame 1 and Peripheral Frame 2 are grouped together so as to enable these blocks to be write/read peripheral block protected. The protected mode ensures that all accesses to these blocks happen as written. Because of the C28x pipeline, a write immediately followed by a read, to different memory locations, will appear in reverse order on the memory bus of the CPU. This can cause problems in certain peripheral applications where the user expected the write to occur first (as written). The C28x CPU supports a block protection mode where a region of memory can be protected so as to make sure that operations occur as written (the penalty is extra cycles are added to align the operations). This mode is programmable and by default, it will protect the selected zones. The wait-states for the various spaces in the memory map area are listed in Table 3-2. Table 3-2. Wait-states 22 AREA WAIT-STATES M0 and M1 SARAMs 0-wait COMMENTS Fixed Peripheral Frame 0 0-wait Fixed Peripheral Frame 1 0-wait (writes) 2-wait (reads) Fixed. Consecutive (back-to-back) writes to Peripheral Frame 1 registers will experience a 1-cycle pipeline hit (1-cycle delay). Peripheral Frame 2 0-wait (writes) 2-wait (reads) Fixed L0 and L1 SARAMs 0-wait OTP Programmable, 1-wait minimum Programmed via the Flash registers. 1-wait-state operation is possible at a reduced CPU frequency. See Section 3.2.5 for more information. Flash Programmable, 0-wait minimum Programmed via the Flash registers. 0-wait-state operation is possible at reduced CPU frequency. The CSM password locations are hardwired for 16 wait-states. See Section 3.2.5 for more information. Boot-ROM 1-wait Fixed Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 3.2 3.2.1 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Brief Descriptions C28x CPU The C28xTM DSP generation is the newest member of the TMS320C2000TM DSP platform. The C28x is a very efficient C/C++ engine, hence enabling users to develop not only their system control software in a high-level language, but also enables math algorithms to be developed using C/C++. The C28x is as efficient in DSP math tasks as it is in system control tasks that typically are handled by microcontroller devices. This efficiency removes the need for a second processor in many systems. The 32 x 32-bit MAC capabilities of the C28x and its 64-bit processing capabilities, enable the C28x to efficiently handle higher numerical resolution problems that would otherwise demand a more expensive floating-point processor solution. Add to this the fast interrupt response with automatic context save of critical registers, resulting in a device that is capable of servicing many asynchronous events with minimal latency. The C28x has an 8-level-deep protected pipeline with pipelined memory accesses. This pipelining enables the C28x to execute at high speeds without resorting to expensive high-speed memories. Special branch-look-ahead hardware minimizes the latency for conditional discontinuities. Special store conditional operations further improve performance. 3.2.2 Memory Bus (Harvard Bus Architecture) As with many DSP type devices, multiple busses are used to move data between the memories and peripherals and the CPU. The C28x memory bus architecture contains a program read bus, data read bus and data write bus. The program read bus consists of 22 address lines and 32 data lines. The data read and write busses consist of 32 address lines and 32 data lines each. The 32-bit-wide data busses enable single cycle 32-bit operations. The multiple bus architecture, commonly termed "Harvard Bus", enables the C28x to fetch an instruction, read a data value and write a data value in a single cycle. All peripherals and memories attached to the memory bus will prioritize memory accesses. Generally, the priority of memory bus accesses can be summarized as follows: Highest: Data Writes (Simultaneous data and program writes cannot occur on the memory bus.) Program Writes (Simultaneous data and program writes cannot occur on the memory bus.) Data Reads Lowest: 3.2.3 Program Reads (Simultaneous program reads and fetches cannot occur on the memory bus.) Fetches (Simultaneous program reads and fetches cannot occur on the memory bus.) Peripheral Bus To enable migration of peripherals between various Texas Instruments (TI) DSP family of devices, the F28044 device adopts a peripheral bus standard for peripheral interconnect. The peripheral bus bridge multiplexes the various busses that make up the processor Memory Bus into a single bus consisting of 16 address lines and 16 or 32 data lines and associated control signals. Two versions of the peripheral bus are supported on the F28044. One version only supports 16-bit accesses (called peripheral frame 2). The other version supports both 16-bit and 32-bit accesses (called peripheral frame 1). Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 23 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 3.2.4 www.ti.com Real-Time JTAG and Analysis The F28044 device implements the standard IEEE 1149.1 JTAG interface. Additionally, the device supports real-time mode of operation whereby the contents of memory, peripheral and register locations can be modified while the processor is running and executing code and servicing interrupts. The user can also single step through non-time critical code while enabling time-critical interrupts to be serviced without interference. The F28044 implements the real-time mode in hardware within the CPU. This is a unique feature to the F28044, no software monitor is required. Additionally, special analysis hardware is provided which allows the user to set hardware breakpoint or data/address watch-points and generate various user-selectable break events when a match occurs. 3.2.5 Flash The F28044 contains 64K x 16 of embedded flash memory, segregated into four 16K x 16 sectors. Both devices also contain a single 1K x 16 of OTP memory at address range 0x3D 7800 - 0x3D 7BFF. The user can individually erase, program, and validate a flash sector while leaving other sectors untouched. However, it is not possible to use one sector of the flash or the OTP to execute flash algorithms that erase/program other sectors. Special memory pipelining is provided to enable the flash module to achieve higher performance. The flash/OTP is mapped to both program and data space; therefore, it can be used to execute code or store data information. Note that addresses 0x3F7FF0 - 0x3F7FF5 are reserved for data variables and should not contain program code. NOTE The F28044 Flash and OTP wait-states can be configured by the application. This allows applications running at slower frequencies to configure the flash to use fewer wait-states. Flash effective performance can be improved by enabling the flash pipeline mode in the Flash options register. With this mode enabled, effective performance of linear code execution will be much faster than the raw performance indicated by the wait-state configuration alone. The exact performance gain when using the Flash pipeline mode is application-dependent. For more information on the Flash options, Flash wait-state, and OTP wait-state registers, see the TMS320x280x, 2801x, 2804x DSP System Control and Interrupts Reference Guide (literature number SPRU712). 3.2.6 M0, M1 SARAMs The F28044 device contains these two blocks (M0/M1) of single access memory, each 1K x 16 in size. The stack pointer points to the beginning of block M1 on reset. The M0 and M1 blocks, like all other memory blocks on C28x devices, are mapped to both program and data space. Hence, the user can use M0 and M1 to execute code or for data variables. The partitioning is performed within the linker. The C28x device presents a unified memory map to the programmer. This makes for easier programming in high-level languages. 3.2.7 L0, L1 SARAMs The F28044 device contains an additional 8K x 16 of single-access RAM, divided into 2 blocks (L0-4K, L1-4K). Each block can be independently accessed to minimize CPU pipeline stalls. Each block is mapped to both program and data space. 24 Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 3.2.8 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Boot ROM The Boot ROM is factory-programmed with boot-loading software. Boot-mode signals are provided to tell the bootloader software what boot mode to use on power up. The user can select to boot normally or to download new software from an external connection or to select boot software that is programmed in the internal Flash/ROM. The Boot ROM also contains standard tables, such as SIN/COS waveforms, for use in math related algorithms. Table 3-3. Boot Mode Selection MODE DESCRIPTION GPIO18 SPICLKA GPIO29 SCITXDA GPIO34 Boot to Flash/ROM Jump to Flash/ROM address 0x3F 7FF6 You must have programmed a branch instruction here prior to reset to redirect code execution as desired. 1 1 1 SCI-A Boot Load a data stream from SCI-A 1 1 0 SPI-A Boot Load from an external serial SPI EEPROM on SPI-A 1 0 1 I C Boot Load data from an external EEPROM at address 0x50 on the I2C bus 1 0 0 eCAN-A Boot Reserved. This mode should not be used. 0 1 1 Boot to M0 SARAM Jump to M0 SARAM address 0x00 0000. 0 1 0 Boot to OTP Jump to OTP address 0x3D 7800 0 0 1 Parallel I/O Boot Load data from GPIO0-GPIO15 0 0 0 2 Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 25 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 3.2.9 www.ti.com Security The device supports high levels of security to protect the user firmware from being reverse engineered. The security features a 128-bit password (hardcoded for 16 wait-states), which the user programs into the flash. One code security module (CSM) is used to protect the flash/OTP and the L0/L1 SARAM blocks. The security feature prevents unauthorized users from examining the memory contents via the JTAG port, executing code from external memory or trying to boot-load some undesirable software that would export the secure memory contents. To enable access to the secure blocks, the user must write the correct 128-bit "KEY" value, which matches the value stored in the password locations within the Flash. NOTE For code security operation, all addresses between 0x3F7F80 and 0x3F7FF5 cannot be used as program code or data, but must be programmed to 0x0000 when the Code Security Password is programmed. If security is not a concern, addresses 0x3F7F80 through 0x3F7FEF may be used for code or data. Addresses 0x3F7FF0 - 0x3F7FF5 are reserved for data variables and should not contain program code. The 128-bit password (at 0x3F 7FF8 - 0x3F 7FFF) must not be programmed to zeros. Doing so would permanently lock the device. disclaimer Code Security Module Disclaimer THE CODE SECURITY MODULE ("CSM") INCLUDED ON THIS DEVICE WAS DESIGNED TO PASSWORD PROTECT THE DATA STORED IN THE ASSOCIATED MEMORY (EITHER ROM OR FLASH) AND IS WARRANTED BY TEXAS INSTRUMENTS (TI), IN ACCORDANCE WITH ITS STANDARD TERMS AND CONDITIONS, TO CONFORM TO TI'S PUBLISHED SPECIFICATIONS FOR THE WARRANTY PERIOD APPLICABLE FOR THIS DEVICE. TI DOES NOT, HOWEVER, WARRANT OR REPRESENT THAT THE CSM CANNOT BE COMPROMISED OR BREACHED OR THAT THE DATA STORED IN THE ASSOCIATED MEMORY CANNOT BE ACCESSED THROUGH OTHER MEANS. MOREOVER, EXCEPT AS SET FORTH ABOVE, TI MAKES NO WARRANTIES OR REPRESENTATIONS CONCERNING THE CSM OR OPERATION OF THIS DEVICE, INCLUDING ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL TI BE LIABLE FOR ANY CONSEQUENTIAL, SPECIAL, INDIRECT, INCIDENTAL, OR PUNITIVE DAMAGES, HOWEVER CAUSED, ARISING IN ANY WAY OUT OF YOUR USE OF THE CSM OR THIS DEVICE, WHETHER OR NOT TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO LOSS OF DATA, LOSS OF GOODWILL, LOSS OF USE OR INTERRUPTION OF BUSINESS OR OTHER ECONOMIC LOSS. 26 Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 3.2.10 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Peripheral Interrupt Expansion (PIE) Block The PIE block serves to multiplex numerous interrupt sources into a smaller set of interrupt inputs. The PIE block can support up to 96 peripheral interrupts. On the F28044 device, 43 of the possible 96 interrupts are used by peripherals. The 96 interrupts are grouped into blocks of 8 and each group is fed into 1 of 12 CPU interrupt lines (INT1 to INT12). Each of the 96 interrupts is supported by its own vector stored in a dedicated RAM block that can be overwritten by the user. The vector is automatically fetched by the CPU on servicing the interrupt. It takes 8 CPU clock cycles to fetch the vector and save critical CPU registers. Hence the CPU can quickly respond to interrupt events. Prioritization of interrupts is controlled in hardware and software. Each individual interrupt can be enabled/disabled within the PIE block. 3.2.11 External Interrupts (XINT1, XINT2, XNMI) The F28044 device supports three masked external interrupts (XINT1, XINT2, XNMI). XNMI can be connected to the INT13 or NMI interrupt of the CPU. Each of the interrupts can be selected for negative, positive, or both negative and positive edge triggering and can also be enabled/disabled (including the XNMI). The masked interrupts also contain a 16-bit free running up counter, which is reset to zero when a valid interrupt edge is detected. This counter can be used to accurately time stamp the interrupt. Unlike the 281x devices, there are no dedicated pins for the external interrupts. Rather, any Port A GPIO pin can be configured to trigger any external interrupt. 3.2.12 Oscillator and PLL The F28044 device can be clocked by an external oscillator or by a crystal attached to the on-chip oscillator circuit. A PLL is provided supporting up to 10 input-clock-scaling ratios. The PLL ratios can be changed on-the-fly in software, enabling the user to scale back on operating frequency if lower power operation is desired. Refer to the Electrical Specification section for timing details. The PLL block can be set in bypass mode. 3.2.13 Watchdog The F28044 device contains a watchdog timer. The user software must regularly reset the watchdog counter within a certain time frame; otherwise, the watchdog will generate a reset to the processor. The watchdog can be disabled if necessary. 3.2.14 Peripheral Clocking The clocks to each individual peripheral can be enabled/disabled so as to reduce power consumption when a peripheral is not in use. Additionally, the system clock to the serial ports (except I2C) and the ADC blocks can be scaled relative to the CPU clock. This enables the timing of peripherals to be decoupled from increasing CPU clock speeds. 3.2.15 Low-Power Modes The F28044 device is full static CMOS devices. Three low-power modes are provided: IDLE: Place CPU into low-power mode. Peripheral clocks may be turned off selectively and only those peripherals that need to function during IDLE are left operating. An enabled interrupt from an active peripheral or the watchdog timer will wake the processor from IDLE mode. STANDBY: Turns off clock to CPU and peripherals. This mode leaves the oscillator and PLL functional. An external interrupt event will wake the processor and the peripherals. Execution begins on the next valid cycle after detection of the interrupt event HALT: Turns off the internal oscillator. This mode basically shuts down the device and places it in the lowest possible power consumption mode. A reset or external signal can wake the device from this mode. Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 27 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 3.2.16 www.ti.com Peripheral Frames 0, 1, 2 (PFn) The F28044 device segregates peripherals into three sections. The mapping of peripherals is as follows: PF0: PF1: PF2: PIE: PIE Interrupt Enable and Control Registers Plus PIE Vector Table Flash: Flash Control, Programming, Erase, Verify Registers Timers: CPU-Timers 0, 1, 2 Registers CSM: Code Security Module KEY Registers ADC: ADC Result Registers (dual-mapped) GPIO: GPIO MUX Configuration and Control Registers ePWM: Enhanced Pulse Width Modulator Module and Registers SYS: System Control Registers SCI: Serial Communications Interface (SCI) Control and RX/TX Registers SPI: Serial Port Interface (SPI) Control and RX/TX Registers ADC: ADC Status, Control, and Result Register 2 I C: 3.2.17 Inter-Integrated Circuit Module and Registers General-Purpose Input/Output (GPIO) Multiplexer Most of the peripheral signals are multiplexed with general-purpose input/output (GPIO) signals. This enables the user to use a pin as GPIO if the peripheral signal or function is not used. On reset, GPIO pins are configured as inputs. The user can individually program each pin for GPIO mode or peripheral signal mode. For specific inputs, the user can also select the number of input qualification cycles. This is to filter unwanted noise glitches. The GPIO signals can also be used to bring the device out of specific low-power modes. 3.2.18 32-Bit CPU-Timers (0, 1, 2) CPU-Timers 0, 1, and 2 are identical 32-bit timers with presettable periods and with 16-bit clock prescaling. The timers have a 32-bit count down register, which generates an interrupt when the counter reaches zero. The counter is decremented at the CPU clock speed divided by the prescale value setting. When the counter reaches zero, it is automatically reloaded with a 32-bit period value. CPU-Timer 2 is reserved for the DSP/BIOS Real-Time OS, and is connected to INT14 of the CPU. If DSP/BIOS is not being used, CPU-Timer 2 is available for general use. CPU-Timer 1 is for general use and can be connected to INT13 of the CPU. CPU-Timer 0 is also for general use and is connected to the PIE block. 3.2.19 Control Peripherals The F28044 device supports the following peripherals which are used for embedded control and communication: 28 ePWM: The enhanced PWM peripheral supports independent/complementary PWM generation, adjustable dead-band generation for leading/trailing edges, latched/cycle-by-cycle trip mechanism. Some of the PWM pins support HRPWM features. ADC: The ADC block is a 12-bit converter, single ended, 16-channels. It contains two sample-and-hold units for simultaneous sampling. Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 3.2.20 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Serial Port Peripherals The F28044 device supports the following serial communication peripherals: 3.3 SPI: The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream of programmed length (one to sixteen bits) to be shifted into and out of the device at a programmable bit-transfer rate. Normally, the SPI is used for communications between the DSP controller and external peripherals or another processor. Typical applications include external I/O or peripheral expansion through devices such as shift registers, display drivers, and ADCs. Multi-device communications are supported by the master/slave operation of the SPI. On the F28044 device, the SPI contains a 16-level receive and transmit FIFO for reducing interrupt servicing overhead. SCI: The serial communications interface is a two-wire asynchronous serial port, commonly known as UART. On the F28044 device, the SCI contains a 16-level receive and transmit FIFO for reducing interrupt servicing overhead. I2C: The inter-integrated circuit (I2C) module provides an interface between a DSP and other devices compliant with Philips Semiconductors Inter-IC bus (I2C-bus) specification version 2.1 and connected by way of an I2C-bus. External components attached to this 2-wire serial bus can transmit/receive up to 8-bit data to/from the DSP through the I2C module. On the F28044 device, the I2C contains a 16-level receive and transmit FIFO for reducing interrupt servicing overhead. Register Map The F28044 device contains three peripheral register spaces. The spaces are categorized as follows: Peripheral Frame 0: These are peripherals that are mapped directly to the CPU memory bus. See Table 3-4. Peripheral Frame 1 These are peripherals that are mapped to the 32-bit peripheral bus. See Table 3-5. Peripheral Frame 2: These are peripherals that are mapped to the 16-bit peripheral bus. See Table 3-6. Table 3-4. Peripheral Frame 0 Registers (1) NAME (2) ACCESS TYPE (3) ADDRESS RANGE SIZE (x16) 0x0880 - 0x09FF 384 EALLOW protected 0x0A80 - 0x0ADF 96 EALLOW protected CSM Protected 0x0AE0 - 0x0AEF 16 EALLOW protected 0x0B00 - 0xB0F 16 CPU-TIMER0/1/2 Registers 0x0C00 - 0x0C3F 64 PIE Registers 0x0CE0 - 0x0CFF 32 PIE Vector Table 0x0D00 - 0x0DFF 256 Device Emulation Registers FLASH Registers (4) Code Security Module Registers ADC Result Registers (dual-mapped) (1) (2) (3) (4) Not EALLOW protected EALLOW protected Registers in Frame 0 support 16-bit and 32-bit accesses. Missing segments of memory space are reserved and should not be used in applications. If registers are EALLOW protected, then writes cannot be performed until the EALLOW instruction is executed. The EDIS instruction disables writes to prevent stray code or pointers from corrupting register contents. The Flash Registers are also protected by the Code Security Module (CSM). Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 29 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Table 3-5. Peripheral Frame 1 Registers (1) NAME (2) ADDRESS RANGE SIZE (x16) 0x6800 - 0x683F 64 ePWM2 + HRPWM Registers 0x6840 - 0x687F 64 ePWM3 + HRPWM Registers 0x6880 - 0x68BF 64 ePWM4 + HRPWM Registers 0x68C0 - 0x68FF 64 ePWM5 + HRPWM Registers 0x6900 - 0x693F 64 ePWM6 + HRPWM Registers 0x6940 - 0x697F 64 ePWM7 + HRPWM Registers 0x6980 - 0x69BF 64 ePWM8 + HRPWM Registers 0x69C0 - 0x69FF 64 ePWM9 + HRPWM Registers 0x6600 - 0x663F 64 ePWM10 + HRPWM Registers 0x6640 - 0x667F 64 ePWM11 + HRPWM Registers 0x6680 - 0x66BF 64 ePWM12 + HRPWM Registers 0x66C0 - 0x66FF 64 ePWM13 + HRPWM Registers 0x6700 - 0x673F 64 ePWM14 + HRPWM Registers 0x6740 - 0x677F 64 ePWM15 + HRPWM Registers 0x6780 - 0x67BF 64 ePWM16 + HRPWM Registers 0x67C0 - 0x67FF 64 GPIO Control Registers 0x6F80 - 0x6FBF 128 EALLOW protected GPIO Data Registers 0x6FC0 - 0x6FDF 32 Not EALLOW protected GPIO Interrupt and LPM Select Registers 0x6FE0 - 0x6FFF 32 EALLOW protected ePWM1 + HRPWM Registers (1) (2) Some ePWM registers are EALLOW protected. See Table 4-2 through Table 4-5. All 32-bit accesses are aligned to even address boundaries. Missing segments of memory space are reserved and should not be used in applications. Table 3-6. Peripheral Frame 2 Registers (1) ADDRESS RANGE SIZE (x16) System Control Registers NAME 0x7010 - 0x702F 32 SPI-A Registers 0x7040 - 0x704F 16 SCI-A Registers 0x7050 - 0x705F 16 External Interrupt Registers 0x7070 - 0x707F 16 ADC Registers 0x7100 - 0x711F 32 I2C Registers 0x7900 - 0x792F 48 (1) (2) ACCESS TYPE (2) ACCESS TYPE EALLOW Protected Not EALLOW Protected Peripheral Frame 2 only allows 16-bit accesses. All 32-bit accesses are ignored (invalid data may be returned or written). Missing segments of memory space are reserved and should not be used in applications. 3.4 Device Emulation Registers These registers are used to control the protection mode of the C28x CPU and to monitor some critical device signals. The registers are defined in Table 3-7. Table 3-7. Device Emulation Registers NAME ADDRESS RANGE SIZE (x16) 0x0880 - 0x0881 2 Device Configuration Register PARTID 0x0882 1 Part ID Register 0x00FC - F28044 REVID 0x0883 1 Revision ID Register 0x0000 - Silicon Rev. 0 - TMX or TMS PROTSTART 0x0884 1 Block Protection Start Address Register PROTRANGE 0x0885 1 Block Protection Range Address Register DEVICECNF 30 DESCRIPTION Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 3.5 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Interrupts Figure 3-3 shows how the various interrupt sources are multiplexed within the F28044 device. Peripherals 2 (SPI, SCI, I C, ePWM, ADC) WDINT WAKEINT Watchdog LPMINT XINT1 XINT1 Interrupt Control MUX Low-Power Modes 96 Interrupts INT1 to INT12 PIE XINT1CR(15:0) XINT1CTR(15:0) GPIOXINT1SEL(4:0) XINT2SOC XINT2 XINT2 Interrupt Control MUX ADC XINT2CR(15:0) C28x CPU XINT2CTR(15:0) GPIOXINT2SEL(4:0) TINT0 CPU TIMER 0 TINT2 CPU TIMER 2 (Reserved for DSP/BIOS) INT14 TINT1 INT13 MUX CPU TIMER 1 int13_select GPIO0.int nmi_select MUX NMI MUX XNMI_XINT13 Interrupt Control XNMICR(15:0) GPIO MUX GPIO31.int 1 XNMICTR(15:0) GPIOXNMISEL(4:0) Figure 3-3. External and PIE Interrupt Sources Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 31 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Eight PIE block interrupts are grouped into one CPU interrupt. In total, 12 CPU interrupt groups, with 8 interrupts per group equals 96 possible interrupts. On the F28044 device, 43 of these are used by peripherals as shown in Table 3-8. The TRAP #VectorNumber instruction transfers program control to the interrupt service routine corresponding to the vector specified. TRAP #0 attempts to transfer program control to the address pointed to by the reset vector. The PIE vector table does not, however, include a reset vector. Therefore, TRAP #0 should not be used when the PIE is enabled. Doing so will result in undefined behavior. When the PIE is enabled, TRAP #1 through TRAP #12 will transfer program control to the interrupt service routine corresponding to the first vector within the PIE group. For example: TRAP #1 fetches the vector from INT1.1, TRAP #2 fetches the vector from INT2.1 and so forth. IFR(12:1) INTM IER(12:1) INT1 INT2 1 CPU MUX 0 INT11 INT12 (Flag) Global Enable (Enable) INTx.1 INTx.2 INTx.3 INTx.4 INTx MUX INTx.5 INTx.6 From Peripherals or External Interrupts INTx.7 PIEACKx INTx.8 (Enable) (Flag) PIEIERx(8:1) PIEIFRx(8:1) (Enable/Flag) Figure 3-4. Multiplexing of Interrupts Using the PIE Block Table 3-8. PIE Peripheral Interrupts (1) CPU INTERRUPTS INTx.7 INTx.6 INTx.5 INTx.4 INTx.3 INTx.2 INTx.1 INT1 WAKEINT (LPM/WD) TINT0 (TIMER 0) ADCINT (ADC) XINT2 XINT1 Reserved SEQ2INT (ADC) SEQ1INT (ADC) INT2 EPWM8_TZINT (ePWM8) EPWM7_TZINT (ePWM7) EPWM6_TZINT (ePWM6) EPWM5_TZINT (ePWM5) EPWM4_TZINT (ePWM4) EPWM3_TZINT (ePWM3) EPWM2_TZINT (ePWM2) EPWM1_TZINT (ePWM1) INT3 EPWM8_INT (ePWM8) EPWM7_INT (ePWM7) EPWM6T_INTn (ePWM6) EPWM5_INT (ePWM5) EPWM4_INT (ePWM4) EPWM3_INT (ePWM3) EPWM2_INT (ePWM2) EPWM1_INT (ePWM1) INT4 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved INT5 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved SPITXINTA (SPI-A) SPIRXINTA (SPI-A) INT6 Reserved Reserved Reserved Reserved Reserved Reserved INT7 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved I2CINT2A (I2C-A) I2CINT1A (I2C-A) INT8 (1) 32 PIE INTERRUPTS INTx.8 Reserved Reserved Reserved Reserved Reserved Out of the 96 possible interrupts, 43 interrupts are currently used. The remaining interrupts are reserved for future devices. These interrupts can be used as software interrupts if they are enabled at the PIEIFRx level, provided none of the interrupts within the group is being used by a peripheral. Otherwise, interrupts coming in from peripherals may be lost by accidentally clearing their flag while modifying the PIEIFR. To summarize, there are two safe cases when the reserved interrupts could be used as software interrupts: * No peripheral within the group is asserting interrupts. * No peripheral interrupts are assigned to the group (example PIE group 12). Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Table 3-8. PIE Peripheral Interrupts (1) (continued) PIE INTERRUPTS CPU INTERRUPTS INTx.8 INTx.7 INTx.6 INTx.5 INTx.4 INTx.3 INTx.2 INTx.1 INT9 Reserved Reserved Reserved Reserved Reserved Reserved SCITXINTA (SCI-A) SCIRXINTA (SCI-A) INT10 EPWM16_TZINT (ePWM16) EPWM15_TZINT (ePWM15) EPWM14_TZINT (ePWM14) EPWM13_TZINT (ePWM13) EPWM12_TZINT (ePWM12) EPWM11_TZINT (ePWM11) EPWM10_TZINT (ePWM10) EPWM9_TZINT (ePWM9) INT11 EPWM16_INT (ePWM16) EPWM15_INT (ePWM15) EPWM14_INT (ePWM14) EPWM13_INT (ePWM13) EPWM12_INT (ePWM12) EPWM11_INT (ePWM11) EPWM10_INT (ePWM10) EPWM9_INT (ePWM9) INT12 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Table 3-9. PIE Configuration and Control Registers NAME DESCRIPTION (1) ADDRESS SIZE (x16) PIECTRL 0x0CE0 1 PIE, Control Register PIEACK 0x0CE1 1 PIE, Acknowledge Register PIEIER1 0x0CE2 1 PIE, INT1 Group Enable Register PIEIFR1 0x0CE3 1 PIE, INT1 Group Flag Register PIEIER2 0x0CE4 1 PIE, INT2 Group Enable Register PIEIFR2 0x0CE5 1 PIE, INT2 Group Flag Register PIEIER3 0x0CE6 1 PIE, INT3 Group Enable Register PIEIFR3 0x0CE7 1 PIE, INT3 Group Flag Register PIEIER4 0x0CE8 1 PIE, INT4 Group Enable Register PIEIFR4 0x0CE9 1 PIE, INT4 Group Flag Register PIEIER5 0x0CEA 1 PIE, INT5 Group Enable Register PIEIFR5 0x0CEB 1 PIE, INT5 Group Flag Register PIEIER6 0x0CEC 1 PIE, INT6 Group Enable Register PIEIFR6 0x0CED 1 PIE, INT6 Group Flag Register PIEIER7 0x0CEE 1 PIE, INT7 Group Enable Register PIEIFR7 0x0CEF 1 PIE, INT7 Group Flag Register PIEIER8 0x0CF0 1 PIE, INT8 Group Enable Register PIEIFR8 0x0CF1 1 PIE, INT8 Group Flag Register PIEIER9 0x0CF2 1 PIE, INT9 Group Enable Register PIEIFR9 0x0CF3 1 PIE, INT9 Group Flag Register PIEIER10 0x0CF4 1 PIE, INT10 Group Enable Register PIEIFR10 0x0CF5 1 PIE, INT10 Group Flag Register PIEIER11 0x0CF6 1 PIE, INT11 Group Enable Register PIEIFR11 0x0CF7 1 PIE, INT11 Group Flag Register PIEIER12 0x0CF8 1 PIE, INT12 Group Enable Register PIEIFR12 0x0CF9 1 PIE, INT12 Group Flag Register Reserved 0x0CFA - 0x0CFF 6 Reserved (1) The PIE configuration and control registers are not protected by EALLOW mode. The PIE vector table is protected. Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 33 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 3.5.1 www.ti.com External Interrupts Table 3-10. External Interrupt Registers NAME ADDRESS SIZE (x16) DESCRIPTION XINT1CR 0x7070 1 XINT1 control register XINT2CR 0x7071 1 XINT2 control register Reserved 0x7072 - 0x7076 5 Reserved XNMICR 0x7077 1 XNMI control register XINT1CTR 0x7078 1 XINT1 counter register XINT2CTR 0x7079 1 XINT2 counter register Reserved 0x707A - 0x707E 5 Reserved XNMICTR 0x707F 1 XNMI counter register Each external interrupt can be enabled/disabled or qualified using positive, negative, or both positive and negative edge. For more information, see the TMS320x280x, 2801x, 2804x DSP System Control and Interrupts Reference Guide (literature number SPRU712). 34 Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 3.6 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 System Control This section describes the F28044 device oscillator, PLL and clocking mechanisms, the watchdog function and the low-power modes. Figure 3-5 shows the various clock and reset domains in the F28044 device that will be discussed. Reset XRS Watchdog Block (A) SYSCLKOUT Peripheral Reset CLKIN X1 (A) PLL 28x CPU Peripheral Registers Peripheral Bus System Control Registers OSC X2 Power Modes Control CPU Timers XCLKIN Clock Enables Peripheral Registers ePWM 1-16 Peripheral Registers I C-A 2 I/O I/O GPIO MUX GPIOs Low-Speed Prescaler LSPCLK Peripheral Registers Low-Speed Peripherals SCI-A, SPI-A I/O High-Speed Prescaler HSPCLK ADC Registers A. 12-Bit ADC 16 ADC inputs CLKIN is the clock into the CPU. It is passed out of the CPU as SYSCLKOUT (that is, CLKIN is the same frequency as SYSCLKOUT). Figure 3-5. Clock and Reset Domains Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 35 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com The PLL, clocking, watchdog and low-power modes, are controlled by the registers listed in Table 3-11. Table 3-11. PLL, Clocking, Watchdog, and Low-Power Mode Registers (1) NAME ADDRESS SIZE (x16) 0x7010 1 XCLKOUT Pin Control, X1 and XCLKIN Status Register PLLSTS 0x7011 1 PLL Status Register Reserved 0x7012 - 0x7018 7 Reserved PCLKCR2 0x7019 1 Peripheral Clock Control Register 2 HISPCP 0x701A 1 High-Speed Peripheral Clock Prescaler Register (for HSPCLK) LOSPCP 0x701B 1 Low-Speed Peripheral Clock Prescaler Register (for LSPCLK) PCLKCR0 0x701C 1 Peripheral Clock Control Register 0 PCLKCR1 0x701D 1 Peripheral Clock Control Register 1 LPMCR0 0x701E 1 Low Power Mode Control Register 0 Reserved 0x701F - 0x7020 1 Reserved PLLCR 0x7021 1 PLL Control Register SCSR 0x7022 1 System Control and Status Register WDCNTR 0x7023 1 Watchdog Counter Register Reserved 0x7024 1 Reserved XCLK WDKEY Reserved WDCR Reserved (1) 36 DESCRIPTION 0x7025 1 Watchdog Reset Key Register 0x7026 - 0x7028 3 Reserved 0x7029 1 Watchdog Control Register 0x702A - 0x702F 6 Reserved All of the registers in this table are EALLOW protected. Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 3.6.1 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 OSC and PLL Block Figure 3-6 shows the OSC and PLL block on the F28044. XCLKIN (3.3-V Clock Input) OSCCLK OSCCLK 0 XOR PLLSTS[OSCOFF] PLL VCOCLK n OSCCLK or VCOCLK n CLKIN 0 /2 PLLSTS[PLLOFF] X1 PLLSTS[CLKINDIV] On-Chip Oscillator 4-bit PLL Select (PLLCR) X2 Figure 3-6. OSC and PLL Block Diagram The on-chip oscillator circuit enables a crystal/resonator to be attached to the F28044 device using the X1 and X2 pins. If the on-chip oscillator is not used, an external oscillator can be used in either one of the following configurations: 1. A 3.3-V external oscillator can be directly connected to the XCLKIN pin. The X2 pin should be left unconnected and the X1 pin tied low. The logic-high level in this case should not exceed VDDIO. 2. A 1.8-V external oscillator can be directly connected to the X1 pin. The X2 pin should be left unconnected and the XCLKIN pin tied low. The logic-high level in this case should not exceed VDD. The three possible input-clock configurations are shown in Figure 3-7 through Figure 3-9 XCLKIN X1 X2 NC External Clock Signal (Toggling 0-VDDIO) Figure 3-7. Using a 3.3-V External Oscillator XCLKIN X1 X2 External Clock Signal (Toggling 0-VDD) NC Figure 3-8. Using a 1.8-V External Oscillator XCLKIN X1 X2 CL1 CL2 Crystal Figure 3-9. Using the Internal Oscillator Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 37 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 3.6.1.1 www.ti.com External Reference Oscillator Clock Option The typical specifications for the external quartz crystal for a frequency of 20 MHz are listed below: * Fundamental mode, parallel resonant * CL (load capacitance) = 12 pF * CL1 = CL2 = 24 pF * Cshunt = 6 pF * ESR range = 30 to 60 TI recommends that customers have the resonator/crystal vendor characterize the operation of their device with the DSP chip. The resonator/crystal vendor has the equipment and expertise to tune the tank circuit. The vendor can also advise the customer regarding the proper tank component values that will produce proper start up and stability over the entire operating range. 3.6.1.2 PLL-Based Clock Module The F28044 device has an on-chip, PLL-based clock module. This module provides all the necessary clocking signals for the device, as well as control for low-power mode entry. The PLL has a 4-bit ratio control PLLCR[DIV] to select different CPU clock rates. The watchdog module should be disabled before writing to the PLLCR register. It can be re-enabled (if need be) after the PLL module has stabilized, which takes 131072 OSCCLK cycles. Table 3-12. PLLCR Register Bit Definitions (1) (2) SYSCLKOUT (CLKIN) (2) PLLCR[DIV] (1) PLLSTS[CLKINDIV] 0000 (PLL bypass) 0 OSCCLK/2 0000 (PLL bypass) 1 OSCCLK 0001 0 (OSCCLK*1)/2 0010 0 (OSCCLK*2)/2 0011 0 (OSCCLK*3)/2 0100 0 (OSCCLK*4)/2 0101 0 (OSCCLK*5)/2 0110 0 (OSCCLK*6)/2 0111 0 (OSCCLK*7)/2 1000 0 (OSCCLK*8)/2 1001 0 (OSCCLK*9)/2 1010 0 (OSCCLK*10)/2 1011-1111 0 Reserved This register is EALLOW protected. CLKIN is the input clock to the CPU. SYSCLKOUT is the output clock from the CPU. The frequency of SYSCLKOUT is the same as CLKIN. NOTE PLLSTS[CLKINDIV] can be set to 1 only if PLLCR is 0x0000. PLLCR should not be changed once PLLSTS[CLKINDIV] is set. The PLL-based clock module provides two modes of operation: * Crystal-operation - This mode allows the use of an external crystal/resonator to provide the time base to the device. * External clock source operation - This mode allows the internal oscillator to be bypassed. The device clocks are generated from an external clock source input on the X1 or the XCLKIN pin. 38 Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Table 3-13. Possible PLL Configuration Modes REMARKS PLLSTS[CLKINDIV] SYSCLKOUT (CLKIN) Invoked by the user setting the PLLOFF bit in the PLLSTS register. The PLL block is disabled in this mode. This can be useful to reduce system noise and for low power operation. The PLLCR register must first be set to 0x0000 (PLL Bypass) before entering this mode. The CPU clock (CLKIN) is derived directly from the input clock on either X1/X2, X1 or XCLKIN. 0 OSCCLK/2 1 OSCCLK 0 OSCCLK/2 1 OSCCLK 0 OSCCLK*n/2 PLL MODE PLL Off PLL Bypass is the default PLL configuration upon power-up or after an external reset (XRS). This mode is selected when the PLLCR register is set to 0x0000 or PLL Bypass while the PLL locks to a new frequency after the PLLCR register has been modified. In this mode, the PLL itself is bypassed but the PLL is not turned off. PLL Enable 3.6.1.3 Achieved by writing a non-zero value n into the PLLCR register. Upon writing to the PLLCR the device will switch to PLL Bypass mode until the PLL locks. Loss of Input Clock In PLL-enabled and PLL-bypass mode, if the input clock OSCCLK is removed or absent, the PLL will still issue a "limp-mode" clock. The limp-mode clock continues to clock the CPU and peripherals at a typical frequency of 1-5 MHz. Limp mode is not specified to work from power-up, only after input clocks have been present initially. In PLL bypass mode, the limp mode clock from the PLL is automatically routed to the CPU if the input clock is removed or absent. Normally, when the input clocks are present, the watchdog counter decrements to initiate a watchdog reset or WDINT interrupt. However, when the external input clock fails, the watchdog counter stops decrementing (i.e., the watchdog counter does not change with the limp-mode clock). In addition to this, the device will be reset and the "Missing Clock Status" (MCLKSTS) bit will be set. These conditions could be used by the application firmware to detect the input clock failure and initiate necessary shut-down procedure for the system. NOTE Applications in which the correct CPU operating frequency is absolutely critical should implement a mechanism by which the DSP will be held in reset, should the input clocks ever fail. For example, an R-C circuit may be used to trigger the XRS pin of the DSP, should the capacitor ever get fully charged. An I/O pin may be used to discharge the capacitor on a periodic basis to prevent it from getting fully charged. Such a circuit would also help in detecting failure of the flash memory and the VDD3VFL rail. Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 39 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 3.6.2 www.ti.com Watchdog Block The watchdog block on the F28044 is similar to the one used on the 240x and 281x devices. The watchdog module generates an output pulse, 512 oscillator clocks wide (OSCCLK), whenever the 8-bit watchdog up counter has reached its maximum value. To prevent this, the user disables the counter or the software must periodically write a 0x55 + 0xAA sequence into the watchdog key register which will reset the watchdog counter. Figure 3-10 shows the various functional blocks within the watchdog module. WDCR (WDPS(2:0)) WDCR (WDDIS) WDCNTR(7:0) OSCCLK Watchdog Prescaler /512 WDCLK 8-Bit Watchdog Counter CLR Clear Counter Internal Pullup WDKEY(7:0) Watchdog 55 + AA Key Detector Generate Output Pulse (512 OSCCLKs) Good Key WDRST WDINT XRS Core-reset Bad WDCHK Key SCSR (WDENINT) WDCR (WDCHK(2:0)) (A) 1 0 1 WDRST A. The WDRST signal is driven low for 512 OSCCLK cycles. Figure 3-10. Watchdog Module The WDINT signal enables the watchdog to be used as a wakeup from IDLE/STANDBY mode. In STANDBY mode, all peripherals are turned off on the device. The only peripheral that remains functional is the watchdog. The WATCHDOG module will run off OSCCLK. The WDINT signal is fed to the LPM block so that it can wake the device from STANDBY (if enabled). See Section 3.7, Low-Power Modes Block, for details. In IDLE mode, the WDINT signal can generate an interrupt to the CPU, via the PIE, to take the CPU out of IDLE mode. In HALT mode, this feature cannot be used because the oscillator (and PLL) are turned off and hence so is the WATCHDOG. 40 Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 3.7 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Low-Power Modes Block The low-power modes on the F28044 device are similar to the 240x devices. Table 3-14 summarizes the various modes. Table 3-14. Low-Power Modes EXIT (1) MODE LPMCR0(1:0) OSCCLK CLKIN SYSCLKOUT IDLE 00 On On On (2) XRS, Watchdog interrupt, any enabled interrupt, XNMI STANDBY 01 On (watchdog still running) Off Off XRS, Watchdog interrupt, GPIO Port A signal, debugger (3), XNMI HALT 1X Off (oscillator and PLL turned off, watchdog not functional) Off Off XRS, GPIO Port A signal, XNMI, debugger (3) (1) (2) (3) The Exit column lists which signals or under what conditions the low power mode will be exited. A low signal, on any of the signals, will exit the low power condition. This signal must be kept low long enough for an interrupt to be recognized by the device. Otherwise the IDLE mode will not be exited and the device will go back into the indicated low power mode. The IDLE mode on the C28x behaves differently than on the 24x/240x. On the C28x, the clock output from the CPU (SYSCLKOUT) is still functional while on the 24x/240x the clock is turned off. On the C28x, the JTAG port can still function even if the CPU clock (CLKIN) is turned off. The various low-power modes operate as follows: IDLE Mode: This mode is exited by any enabled interrupt or an XNMI that is recognized by the processor. The LPM block performs no tasks during this mode as long as the LPMCR0(LPM) bits are set to 0,0. STANDBY Mode: Any GPIO port A signal (GPIO[31:0]) can wake the device from STANDBY mode. The user must select which signal(s) will wake the device in the GPIOLPMSEL register. The selected signal(s) are also qualified by the OSCCLK before waking the device. The number of OSCCLKs is specified in the LPMCR0 register. HALT Mode: Only the XRS and any GPIO port A signal (GPIO[31:0]) can wake the device from HALT mode. The user selects the signal in the GPIOLPMSEL register. NOTE The low-power modes do not affect the state of the output pins (PWM pins included). They will be in whatever state the code left them in when the IDLE instruction was executed. See the TMS320x280x, 2801x, 2804x DSP System Control and Interrupts Reference Guide (literature number SPRU712) for details. Functional Overview Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 41 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 4 www.ti.com Peripherals The integrated peripherals of the F28044 device are described in the following subsections: * Three 32-bit CPU-Timers * Up to 16 enhanced PWM modules (ePWM1-16) * Enhanced analog-to-digital converter (ADC) module * Serial communications interface module (SCI-A) * Serial peripheral interface (SPI) module (SPI-A) * Inter-integrated circuit module (I2C) * Digital I/O and shared pin functions 4.1 32-Bit CPU-Timers 0/1/2 There are three 32-bit CPU-timers on the F28044 device (CPU-TIMER0/1/2). CPU-Timer 0 and CPU-Timer 1 can be used in user applications. Timer 2 is reserved for DSP/BIOSTM. These timers are different from the timers that are present in the ePWM modules. NOTE If the application is not using DSP/BIOS, then CPU-Timer 2 can be used in the application. Reset Timer Reload 16-Bit Timer Divide-Down TDDRH:TDDR SYSCLKOUT TCR.4 (Timer Start Status) 32-Bit Timer Period PRDH:PRD 16-Bit Prescale Counter PSCH:PSC Borrow 32-Bit Counter TIMH:TIM Borrow TINT Figure 4-1. CPU-Timers 42 Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 In the F28044 device, the timer interrupt signals (TINT0, TINT1, TINT2) are connected as shown in Figure 4-2. INT1 to INT12 TINT0 PIE CPU-TIMER 0 C28x TINT1 INT13 CPU-TIMER 1 XINT13 CPU-TIMER 2 (Reserved for DSP/BIOS) TINT2 INT14 A. B. The timer registers are connected to the memory bus of the C28x processor. The timing of the timers is synchronized to SYSCLKOUT of the processor clock. Figure 4-2. CPU-Timer Interrupt Signals and Output Signal The general operation of the timer is as follows: The 32-bit counter register "TIMH:TIM" is loaded with the value in the period register "PRDH:PRD". The counter register decrements at the SYSCLKOUT rate of the C28x. When the counter reaches 0, a timer interrupt output signal generates an interrupt pulse. The registers listed in Table 4-1 are used to configure the timers. For more information, see the TMS320x280x, 2801x, 2804x DSP System Control and Interrupts Reference Guide (literature number SPRU712). Table 4-1. CPU-Timers 0, 1, 2 Configuration and Control Registers ADDRESS SIZE (x16) TIMER0TIM NAME 0x0C00 1 CPU-Timer 0, Counter Register DESCRIPTION TIMER0TIMH 0x0C01 1 CPU-Timer 0, Counter Register High TIMER0PRD 0x0C02 1 CPU-Timer 0, Period Register TIMER0PRDH 0x0C03 1 CPU-Timer 0, Period Register High TIMER0TCR 0x0C04 1 CPU-Timer 0, Control Register Reserved 0x0C05 1 Reserved TIMER0TPR 0x0C06 1 CPU-Timer 0, Prescale Register TIMER0TPRH 0x0C07 1 CPU-Timer 0, Prescale Register High TIMER1TIM 0x0C08 1 CPU-Timer 1, Counter Register TIMER1TIMH 0x0C09 1 CPU-Timer 1, Counter Register High TIMER1PRD 0x0C0A 1 CPU-Timer 1, Period Register TIMER1PRDH 0x0C0B 1 CPU-Timer 1, Period Register High TIMER1TCR 0x0C0C 1 CPU-Timer 1, Control Register Reserved 0x0C0D 1 Reserved TIMER1TPR 0x0C0E 1 CPU-Timer 1, Prescale Register TIMER1TPRH 0x0C0F 1 CPU-Timer 1, Prescale Register High TIMER2TIM 0x0C10 1 CPU-Timer 2, Counter Register TIMER2TIMH 0x0C11 1 CPU-Timer 2, Counter Register High TIMER2PRD 0x0C12 1 CPU-Timer 2, Period Register TIMER2PRDH 0x0C13 1 CPU-Timer 2, Period Register High TIMER2TCR 0x0C14 1 CPU-Timer 2, Control Register Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 43 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Table 4-1. CPU-Timers 0, 1, 2 Configuration and Control Registers (continued) NAME ADDRESS SIZE (x16) Reserved 0x0C15 1 Reserved TIMER2TPR 0x0C16 1 CPU-Timer 2, Prescale Register TIMER2TPRH 0x0C17 1 CPU-Timer 2, Prescale Register High 0x0C18 - 0x0C3F 40 Reserved Reserved 4.2 DESCRIPTION Enhanced PWM Modules (ePWM1-16) The F28044 device contains up to 16 enhanced PWM modules (ePWM). Figure 4-3 shows a block diagram of multiple ePWM modules. Figure 4-4 shows the signal interconnections with the ePWM. See the TMS320x280x, 2801x, 2804x Enhanced Pulse Width Modulator (ePWM) Module Reference Guide (literature number SPRU791) for details. EPWM1SYNCI EPWM1SYNCI EPWM1INT EPWM1SOC EPWM1A ePWM1 Module EPWM1B TZ1 to TZ6 To eCAP1 Module (Sync In) EPWM1SYNCO EPWM1SYNCO EPWM2SYNCI EPWM2INT EPWM2SOC PIE EPWM2A ePWM2 Module EPWM2B TZ1 to TZ6 GPIO MUX EPWM2SYNCO EPWMxSYNCI EPWMxINT EPWMxSOC EPWMxA ePWMx Module EPWMxB TZ1 to TZ6 EPWMxSYNCO ADCSOCx0 Peripheral Bus ADC Figure 4-3. Multiple PWM Modules 44 Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 The F28044 device contains 16 enhanced PWM modules (ePWM) and 16 high resolution PWM modules (HRPWM). The ePWM modules synchronize input/output and the ADC start of conversion (SOCA/B) signals are regrouped in the F28044. At reset, EPWMMODE bits in the GPAMCFG register configure the sync signals to be compatible to the TMS320F2808 device. In F28044 mode, the ePWMMODE bits are set to 11 to select the EPWMA signals on all 16 GPIOs (GPIO0-GPIO15). This mode selection also reconfigures the EPWM1 SYNCOUT to be connected to four groups of ePWM modules and as EPWMSYNCO signals on the pin: * Group 1: ePWM2, ePWM3, ePWM4 * Group 2: ePWM5, ePWM6, ePWM7, ePWM8 * Group 3: ePWM9, ePWM10, ePWM11, ePWM12 * Group 4: ePWM13, ePWM14, ePWM15, ePWM16 See the TMS320x280x, 2801x, 2804x Enhanced Pulse Width Modulator (ePWM) Module Reference Guide (literature number SPRU791) for additional details. Table 4-2 through Table 4-5 show the complete ePWM register set per module. Table 4-2. ePWM1-4 Control and Status Registers ePWM1 ePWM2 ePWM3 ePWM4 SIZE (x16) / #SHADOW TBCTL 0x6800 0x6840 0x6880 0x68C0 1/0 Time Base Control Register TBSTS 0x6801 0x6841 0x6881 0x68C1 1/0 Time Base Status Register TBPHSHR 0x6802 0x6842 0x6882 0x68C2 1/0 Time Base Phase HRPWM Register TBPHS 0x6803 0x6843 0x6883 0x68C3 1/0 Time Base Phase Register TBCTR 0x6804 0x6844 0x6884 0x68C4 1/0 Time Base Counter Register TBPRD 0x6805 0x6845 0x6885 0x68C5 1/1 Time Base Period Register Set CMPCTL 0x6807 0x6847 0x6887 0x68C7 1/0 Counter Compare Control Register CMPAHR 0x6808 0x6848 0x6888 0x68C8 1/1 Time Base Compare A HRPWM Register CMPA 0x6809 0x6849 0x6889 0x68C9 1/1 Counter Compare A Register Set CMPB 0x680A 0x684A 0x688A 0x68CA 1/1 Counter Compare B Register Set AQCTLA 0x680B 0x684B 0x688B 0x68CB 1/0 Action Qualifier Control Register For Output A AQCTLB 0x680C 0x684C 0x688C 0x68CC 1/0 Action Qualifier Control Register For Output B AQSFRC 0x680D 0x684D 0x688D 0x68CD 1/0 Action Qualifier Software Force Register AQCSFRC 0x680E 0x684E 0x688E 0x68CE 1/1 Action Qualifier Continuous S/W Force Register Set DBCTL 0x680F 0x684F 0x688F 0x68CF 1/1 Dead-Band Generator Control Register DBRED 0x6810 0x6850 0x6890 0x68D0 1/0 Dead-Band Generator Rising Edge Delay Count Register DBFED 0x6811 0x6851 0x6891 0x68D1 1/0 Dead-Band Generator Falling Edge Delay Count Register TZSEL 0x6812 0x6852 0x6892 0x68D2 1/0 Trip Zone Select Register (1) TZCTL 0x6814 0x6854 0x6894 0x68D4 1/0 Trip Zone Control Register (1) TZEINT 0x6815 0x6855 0x6895 0x68D5 1/0 Trip Zone Enable Interrupt Register (1) TZFLG 0x6816 0x6856 0x6896 0x68D6 1/0 Trip Zone Flag Register TZCLR 0x6817 0x6857 0x6897 0x68D7 1/0 Trip Zone Clear Register (1) TZFRC 0x6818 0x6858 0x6898 0x68D8 1/0 Trip Zone Force Register (1) ETSEL 0x6819 0x6859 0x6899 0x68D9 1/0 Event Trigger Selection Register ETPS 0x681A 0x685A 0x689A 0x68DA 1/0 Event Trigger Prescale Register ETFLG 0x681B 0x685B 0x689B 0x68DB 1/0 Event Trigger Flag Register ETCLR 0x681C 0x685C 0x689C 0x68DC 1/0 Event Trigger Clear Register ETFRC 0x681D 0x685D 0x689D 0x68DD 1/0 Event Trigger Force Register PCCTL 0x681E 0x685E 0x689E 0x68DE 1/0 PWM Chopper Control Register HRCNFG 0x6820 0x6860 0x68A0 0x68E0 1/0 HRPWM Configuration Register (1) NAME (1) DESCRIPTION Registers that are EALLOW protected. Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 45 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Table 4-3. ePWM5-8 Control and Status Registers ePWM5 ePWM6 ePWM7 ePWM8 SIZE (x16) / #SHADOW TBCTL 0x6900 0x6940 0x6980 0x69C0 1/0 Time Base Control Register TBSTS 0x6901 0x6941 0x6981 0x69C1 1/0 Time Base Status Register TBPHSHR 0x6902 0x6942 0x6982 0x69C2 1/0 Time Base Phase HRPWM Register TBPHS 0x6903 0x6943 0x6983 0x69C3 1/0 Time Base Phase Register TBCTR 0x6904 0x6944 0x6984 0x69C4 1/0 Time Base Counter Register TBPRD 0x6905 0x6945 0x6985 0x69C5 1/1 Time Base Period Register Set CMPCTL 0x6907 0x6947 0x6987 0x69C7 1/0 Counter Compare Control Register CMPAHR 0x6908 0x6948 0x6988 0x69C8 1/1 Time Base Compare A HRPWM Register CMPA 0x6909 0x6949 0x6989 0x69C9 1/1 Counter Compare A Register Set CMPB 0x690A 0x694A 0x698A 0x69CA 1/1 Counter Compare B Register Set AQCTLA 0x690B 0x694B 0x698B 0x69CB 1/0 Action Qualifier Control Register For Output A AQCTLB 0x690C 0x694C 0x698C 0x69CC 1/0 Action Qualifier Control Register For Output B AQSFRC 0x690D 0x694D 0x698D 0x69CD 1/0 Action Qualifier Software Force Register AQCSFRC 0x690E 0x694E 0x698E 0x69CE 1/1 Action Qualifier Continuous S/W Force Register Set DBCTL 0x690F 0x694F 0x698F 0x69CF 1/1 Dead-Band Generator Control Register DBRED 0x6910 0x6950 0x6990 0x69D0 1/0 Dead-Band Generator Rising Edge Delay Count Register DBFED 0x6911 0x6951 0x6991 0x69D1 1/0 Dead-Band Generator Falling Edge Delay Count Register TZSEL 0x6912 0x6952 0x6992 0x69D2 1/0 Trip Zone Select Register (1) TZCTL 0x6914 0x6954 0x6994 0x69D4 1/0 Trip Zone Control Register (1) TZEINT 0x6915 0x6955 0x6995 0x69D5 1/0 Trip Zone Enable Interrupt Register (1) TZFLG 0x6916 0x6956 0x6996 0x69D6 1/0 Trip Zone Flag Register TZCLR 0x6917 0x6957 0x6997 0x69D7 1/0 Trip Zone Clear Register (1) TZFRC 0x6918 0x6958 0x6998 0x69D8 1/0 Trip Zone Force Register (1) ETSEL 0x6919 0x6959 0x6999 0x69D9 1/0 Event Trigger Selection Register ETPS 0x691A 0x695A 0x699A 0x69DA 1/0 Event Trigger Prescale Register ETFLG 0x691B 0x695B 0x699B 0x69DB 1/0 Event Trigger Flag Register ETCLR 0x691C 0x695C 0x699C 0x69DC 1/0 Event Trigger Clear Register ETFRC 0x691D 0x695D 0x699D 0x69DD 1/0 Event Trigger Force Register PCCTL 0x691E 0x695E 0x699E 0x69DE 1/0 PWM Chopper Control Register HRCNFG 0x6920 0x6960 0x69A0 0x69E0 1/0 HRPWM Configuration Register (1) NAME (1) 46 DESCRIPTION Registers that are EALLOW protected. Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Table 4-4. ePWM9-12 Control and Status Registers ePWM9 ePWM10 ePWM11 ePWM12 SIZE (x16) / #SHADOW TBCTL 0x6600 0x6640 0x6680 0x66C0 1/0 Time Base Control Register TBSTS 0x6601 0x6641 0x6681 0x66C1 1/0 Time Base Status Register TBPHSHR 0x6602 0x6642 0x6682 0x66C2 1/0 Time Base Phase HRPWM Register TBPHS 0x6603 0x6643 0x6683 0x66C3 1/0 Time Base Phase Register TBCTR 0x6604 0x6644 0x6684 0x66C4 1/0 Time Base Counter Register TBPRD 0x6605 0x6645 0x6685 0x66C5 1/1 Time Base Period Register Set CMPCTL 0x6607 0x6647 0x6687 0x66C7 1/0 Counter Compare Control Register CMPAHR 0x6608 0x6648 0x6688 0x66C8 1/1 Time Base Compare A HRPWM Register CMPA 0x6609 0x6649 0x6689 0x66C9 1/1 Counter Compare A Register Set CMPB 0x660A 0x664A 0x668A 0x66CA 1/1 Counter Compare B Register Set AQCTLA 0x660B 0x664B 0x668B 0x66CB 1/0 Action Qualifier Control Register For Output A AQCTLB 0x660C 0x664C 0x668C 0x66CC 1/0 Action Qualifier Control Register For Output B AQSFRC 0x660D 0x664D 0x668D 0x66CD 1/0 Action Qualifier Software Force Register AQCSFRC 0x660E 0x664E 0x668E 0x66CE 1/1 Action Qualifier Continuous S/W Force Register Set DBCTL 0x660F 0x664F 0x668F 0x66CF 1/1 Dead-Band Generator Control Register DBRED 0x6610 0x6650 0x6690 0x66D0 1/0 Dead-Band Generator Rising Edge Delay Count Register DBFED 0x6611 0x6651 0x6691 0x66D1 1/0 Dead-Band Generator Falling Edge Delay Count Register TZSEL 0x6612 0x6652 0x6692 0x66D2 1/0 Trip Zone Select Register (1) TZCTL 0x6614 0x6654 0x6694 0x66D4 1/0 Trip Zone Control Register (1) TZEINT 0x6615 0x6655 0x6695 0x66D5 1/0 Trip Zone Enable Interrupt Register (1) TZFLG 0x6616 0x6656 0x6696 0x66D6 1/0 Trip Zone Flag Register TZCLR 0x6617 0x6657 0x6697 0x66D7 1/0 Trip Zone Clear Register (1) TZFRC 0x6618 0x6658 0x6698 0x66D8 1/0 Trip Zone Force Register (1) ETSEL 0x6619 0x6659 0x6699 0x66D9 1/0 Event Trigger Selection Register ETPS 0x661A 0x665A 0x669A 0x66DA 1/0 Event Trigger Prescale Register ETFLG 0x661B 0x665B 0x669B 0x66DB 1/0 Event Trigger Flag Register ETCLR 0x661C 0x665C 0x669C 0x66DC 1/0 Event Trigger Clear Register ETFRC 0x661D 0x665D 0x669D 0x66DD 1/0 Event Trigger Force Register PCCTL 0x661E 0x665E 0x669E 0x66DE 1/0 PWM Chopper Control Register HRCNFG 0x6620 0x6660 0x66A0 0x66E0 1/0 HRPWM Configuration Register (1) NAME (1) DESCRIPTION Registers that are EALLOW protected. Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 47 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Table 4-5. ePWM13-16 Control and Status Registers ePWM13 ePWM14 ePWM15 ePWM16 SIZE (x16) / #SHADOW TBCTL 0x6700 0x6740 0x6780 0x67C0 1/0 Time Base Control Register TBSTS 0x6701 0x6741 0x6781 0x67C1 1/0 Time Base Status Register TBPHSHR 0x6702 0x6742 0x6782 0x67C2 1/0 Time Base Phase HRPWM Register TBPHS 0x6703 0x6743 0x6783 0x67C3 1/0 Time Base Phase Register TBCTR 0x6704 0x6744 0x6784 0x67C4 1/0 Time Base Counter Register TBPRD 0x6705 0x6745 0x6785 0x67C5 1/1 Time Base Period Register Set CMPCTL 0x6707 0x6747 0x6787 0x67C7 1/0 Counter Compare Control Register CMPAHR 0x6708 0x6748 0x6788 0x67C8 1/1 Time Base Compare A HRPWM Register CMPA 0x6709 0x6749 0x6789 0x67C9 1/1 Counter Compare A Register Set CMPB 0x670A 0x674A 0x678A 0x67CA 1/1 Counter Compare B Register Set AQCTLA 0x670B 0x674B 0x678B 0x67CB 1/0 Action Qualifier Control Register For Output A AQCTLB 0x670C 0x674C 0x678C 0x67CC 1/0 Action Qualifier Control Register For Output B AQSFRC 0x670D 0x674D 0x678D 0x67CD 1/0 Action Qualifier Software Force Register AQCSFRC 0x670E 0x674E 0x678E 0x67CE 1/1 Action Qualifier Continuous S/W Force Register Set DBCTL 0x670F 0x674F 0x678F 0x67CF 1/1 Dead-Band Generator Control Register DBRED 0x6710 0x6750 0x6790 0x67D0 1/0 Dead-Band Generator Rising Edge Delay Count Register DBFED 0x6711 0x6751 0x6791 0x67D1 1/0 Dead-Band Generator Falling Edge Delay Count Register TZSEL 0x6712 0x6752 0x6792 0x67D2 1/0 Trip Zone Select Register (1) TZCTL 0x6714 0x6754 0x6794 0x67D4 1/0 Trip Zone Control Register (1) TZEINT 0x6715 0x6755 0x6795 0x67D5 1/0 Trip Zone Enable Interrupt Register (1) TZFLG 0x6716 0x6756 0x6796 0x67D6 1/0 Trip Zone Flag Register TZCLR 0x6717 0x6757 0x6797 0x67D7 1/0 Trip Zone Clear Register (1) TZFRC 0x6718 0x6758 0x6798 0x67D8 1/0 Trip Zone Force Register (1) ETSEL 0x6719 0x6759 0x6799 0x67D9 1/0 Event Trigger Selection Register ETPS 0x671A 0x675A 0x679A 0x67DA 1/0 Event Trigger Prescale Register ETFLG 0x671B 0x675B 0x679B 0x67DB 1/0 Event Trigger Flag Register ETCLR 0x671C 0x675C 0x679C 0x67DC 1/0 Event Trigger Clear Register ETFRC 0x671D 0x675D 0x679D 0x67DD 1/0 Event Trigger Force Register PCCTL 0x671E 0x675E 0x679E 0x67DE 1/0 PWM Chopper Control Register HRCNFG 0x6720 0x6760 0x67A0 0x67E0 1/0 HRPWM Configuration Register (1) NAME (1) 48 DESCRIPTION Registers that are EALLOW protected. Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Time-Base (TB) CTR = ZERO TBPRD Shadow (16) CTR = CMPB TBPRD Active (16) Disabled Sync In/Out Select Mux EPWMxSYNCO CTR = PRD TBCTL[SYNCOSEL] TBCTL[PHSEN] EPWMxSYNCI Counter Up/Down (16-Bit) TBCTL[SWFSYNC] (Software-Forced Sync) CTR = ZERO TBCNT Active (16) CTR_Dir TBPHSHR (8) 16 8 TBPHS Active (24) CTR = PRD Phase Control CTR = ZERO CTR = CMPA Counter Compare (CC) CTR = CMPA CTR = CMPB CTR_Dir Event Trigger and Interrupt (ET) EPWMxINT EPWMxSOCA EPWMxSOCB Action Qualifier (AQ) CMPAHR (8) 16 8 HiRes PWM (HRPWM) CMPA Active (24) EPWMxAO EPWMA CMPA Shadow (24) Dead Band (DB) CTR = CMPB PWM Chopper (PC) 16 Trip Zone (TZ) EPWMxBO EPWMB CMPB Active (16) EPWMxTZINT CMPB Shadow (16) CTR = ZERO TZ1 to TZ6 Figure 4-4. ePWM Sub-Modules Showing Critical Internal Signal Interconnections 4.3 Hi-Resolution PWM (HRPWM) The HRPWM module offers PWM resolution (time granularity) which is significantly better than what can be achieved using conventionally derived digital PWM methods. The key points for the HRPWM module are: * Significantly extends the time resolution capabilities of conventionally derived digital PWM * Typically used when effective PWM resolution falls below ~ 9-10 bits. This occurs at PWM frequencies greater than ~200 kHz when using a CPU/System clock of 100 MHz. * This capability can be utilized in both duty cycle and phase-shift control methods. * Finer time granularity control or edge positioning is controlled via extensions to the Compare A and Phase registers of the ePWM module. * HRPWM capabilities are offered only on the A signal path of an ePWM module (i.e., on the EPWMxA output). EPWMxB output has conventional PWM capabilities. Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 49 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 4.4 www.ti.com Enhanced Analog-to-Digital Converter (ADC) Module A simplified functional block diagram of the ADC module is shown in Figure 4-5. The ADC module consists of a 12-bit ADC with a built-in sample-and-hold (S/H) circuit. Functions of the ADC module include: * 12-bit ADC core with built-in S/H * Analog input: 0.0 V to 3.0 V (Voltages above 3.0 V produce full-scale conversion results.) * Fast conversion rate: 80 ns at 25-MHz ADC clock, 12.5 MSPS * 16-channel, MUXed inputs * Autosequencing capability provides up to 16 "autoconversions" in a single session. Each conversion can be programmed to select any 1 of 16 input channels * Sequencer can be operated as two independent 8-state sequencers or as one large 16-state sequencer (i.e., two cascaded 8-state sequencers) * Sixteen result registers (individually addressable) to store conversion values - The digital value of the input analog voltage is derived by: when input 0 V Digital Value + 0, Digital Value + 4096 Input Analog Voltage * ADCLO 3 when input 3 V Digital Value + 4095, A. * * * * * when 0 V < input < 3 V All fractional values are truncated. Multiple triggers as sources for the start-of-conversion (SOC) sequence - S/W - software immediate start - ePWM start of conversion - XINT2 ADC start of conversion Flexible interrupt control allows interrupt request on every end-of-sequence (EOS) or every other EOS. Sequencer can operate in "start/stop" mode, allowing multiple "time-sequenced triggers" to synchronize conversions. SOCA and SOCB triggers can operate independently in dual-sequencer mode. Sample-and-hold (S/H) acquisition time window has separate prescale control. The ADC module in the F28044 device has been enhanced to provide flexible interface to ePWM peripherals. The ADC interface is built around a fast, 12-bit ADC module with a fast conversion rate of 80 ns at 25-MHz ADC clock. The ADC module has 16 channels, configurable as two independent 8-channel modules. The two independent 8-channel modules can be cascaded to form a 16-channel module. Although there are multiple input channels and two sequencers, there is only one converter in the ADC module. Figure 4-5 shows the block diagram of the ADC module. The two 8-channel modules have the capability to autosequence a series of conversions, each module has the choice of selecting any one of the respective eight channels available through an analog MUX. In the cascaded mode, the autosequencer functions as a single 16-channel sequencer. On each sequencer, once the conversion is complete, the selected channel value is stored in its respective RESULT register. Autosequencing allows the system to convert the same channel multiple times, allowing the user to perform oversampling algorithms. This gives increased resolution over traditional single-sampled conversion results. 50 Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 System Control Block ADCENCLK SYSCLKOUT High-Speed Prescaler DSP HSPCLK HALT Analog MUX Result Registers Result Reg 0 ADCINA0 70A8h Result Reg 1 S/H ADCINA7 12-Bit ADC Module Result Reg 7 70AFh Result Reg 8 70B0h Result Reg 15 70B7h ADCINB0 S/H ADCINB7 ADC Control Registers S/W S/W EPWMSOCA SOC Sequencer 1 Sequencer 2 SOC EPWMSOCB GPIO/XINT2_ ADCSOC Figure 4-5. Block Diagram of the ADC Module To obtain the specified accuracy of the ADC, proper board layout is very critical. To the best extent possible, traces leading to the ADCIN pins should not run in close proximity to the digital signal paths. This is to minimize switching noise on the digital lines from getting coupled to the ADC inputs. Furthermore, proper isolation techniques must be used to isolate the ADC module power pins (VDD1A18, VDD2A18 , VDDA2, VDDAIO) from the digital supply. Figure 4-6 shows the ADC pin connections for the F28044 device. Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 51 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com NOTE 1. The ADC registers are accessed at the SYSCLKOUT rate. The internal timing of the ADC module is controlled by the high-speed peripheral clock (HSPCLK). 2. The behavior of the ADC module based on the state of the ADCENCLK and HALT signals is as follows: - - ADCENCLK: On reset, this signal will be low. While reset is active-low (XRS) the clock to the register will still function. This is necessary to make sure all registers and modes go into their default reset state. The analog module, however, will be in a low-power inactive state. As soon as reset goes high, then the clock to the registers will be disabled. When the user sets the ADCENCLK signal high, then the clocks to the registers will be enabled and the analog module will be enabled. There will be a certain time delay (ms range) before the ADC is stable and can be used. HALT: This mode only affects the analog module. It does not affect the registers. In this mode, the ADC module goes into low-power mode. This mode also will stop the clock to the CPU, which will stop the HSPCLK; therefore, the ADC register logic will be turned off indirectly. Figure 4-6 shows the ADC pin-biasing for internal reference and Figure 4-7 shows the ADC pin-biasing for external reference. ADC 16-Channel Analog Inputs ADCINA[7:0] ADCINB[7:0] ADCLO ADCREFIN Analog input 0-3 V with respect to ADCLO Connect to analog ground Float or connect to analog ground if internal reference is used 22 k ADC External Current Bias Resistor ADCRESEXT ADC Reference Positive Output ADCREFP ADC Reference Medium Output ADCREFM ADC Power VDD1A18 VDD2A18 VSS1AGND VSS2AGND (A) 2.2 F ADCREFP and ADCREFM should not be loaded by external circuitry (A) 2.2 F ADC Analog Power Pin (1.8 V) ADC Analog Power Pin (1.8 V) ADC Analog Ground Pin ADC Analog Ground Pin VDDA2 ADC Analog Power Pin (3.3 V) VSSA2 ADC Analog Ground Pin ADC Analog and Reference I/O Power VDDAIO VSSAIO A. B. C. ADC Analog Power Pin (3.3 V) ADC Analog I/O Ground Pin TAIYO YUDEN LMK212BJ225MG-T or equivalent External decoupling capacitors are recommended on all power pins. Analog inputs must be driven from an operational amplifier that does not degrade the ADC performance. Figure 4-6. ADC Pin Connections With Internal Reference 52 Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 ADC 16-Channel Analog Inputs ADCINA[7:0] ADCINB[7:0] ADCLO ADCREFIN Analog input 0-3 V with respect to ADCLO Connect to Analog Ground Connect to 1.500, 1.024, or 2.048-V precision source (D) 22 k ADC External Current Bias Resistor ADCRESEXT (A) 2.2 F ADC Reference Positive Output ADCREFP ADC Reference Medium Output ADCREFM ADC Analog Power VDD1A18 VDD2A18 VSS1AGND VSS2AGND ADC Analog Power Pin (1.8 V) ADC Analog Power Pin (1.8 V) ADC Analog Ground Pin ADC Analog Ground Pin VDDA2 VSSA2 ADC Analog Power Pin (3.3 V) ADC Analog Ground Pin VDDAIO VSSAIO ADC Analog Power Pin (3.3 V) ADC Analog I/O Ground Pin (A) ADC Analog and Reference I/O Power A. B. C. D. 2.2 F ADCREFP and ADCREFM should not be loaded by external circuitry TAIYO YUDEN LMK212BJ225MG-T or equivalent External decoupling capacitors are recommended on all power pins. Analog inputs must be driven from an operational amplifier that does not degrade the ADC performance. External voltage on ADCREFIN is enabled by changing bits 15:14 in the ADC Reference Select register depending on the voltage used on this pin. TI recommends TI part REF3020 or equivalent for 2.048-V generation. Overall gain accuracy will be determined by accuracy of this voltage source. Figure 4-7. ADC Pin Connections With External Reference NOTE The temperature rating of any recommended component must match the rating of the end product. 4.4.1 ADC Connections if the ADC Is Not Used It is recommended that the connections for the analog power pins be kept even if the ADC is not used. Following is a summary of how the ADC pins should be connected, if the ADC is not used in an application: * VDD1A18/VDD2A18 - Connect to VDD * VDDA2, VDDAIO - Connect to VDDIO * VSS1AGND/VSS2AGND, VSSA2, VSSAIO - Connect to VSS * ADCLO - Connect to VSS * ADCREFIN - Connect to VSS * ADCREFP/ADCREFM - Connect a 100 nF cap to VSS * ADCRESEXT - Connect a 20-k resistor (very loose tolerance) to VSS. * ADCINAn, ADCINBn - Connect to VSS When the ADC is not used, be sure that the clock to the ADC module is not turned on to realize power savings. When the ADC module is used in an application, unused ADC input pins should be connected to analog ground (VSS1AGND/VSS2AGND) Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 53 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com The ADC operation is configured, controlled, and monitored by the registers listed in Table 4-6. Table 4-6. ADC Registers (1) NAME ADDRESS (1) ADDRESS (2) ADCTRL1 0x7100 1 ADC Control Register 1 SIZE (x16) DESCRIPTION ADCTRL2 0x7101 1 ADC Control Register 2 ADCMAXCONV 0x7102 1 ADC Maximum Conversion Channels Register ADCCHSELSEQ1 0x7103 1 ADC Channel Select Sequencing Control Register 1 ADCCHSELSEQ2 0x7104 1 ADC Channel Select Sequencing Control Register 2 ADCCHSELSEQ3 0x7105 1 ADC Channel Select Sequencing Control Register 3 ADCCHSELSEQ4 0x7106 1 ADC Channel Select Sequencing Control Register 4 ADCASEQSR 0x7107 1 ADC Auto-Sequence Status Register ADCRESULT0 0x7108 0x0B00 1 ADC Conversion Result Buffer Register 0 ADCRESULT1 0x7109 0x0B01 1 ADC Conversion Result Buffer Register 1 ADCRESULT2 0x710A 0x0B02 1 ADC Conversion Result Buffer Register 2 ADCRESULT3 0x710B 0x0B03 1 ADC Conversion Result Buffer Register 3 ADCRESULT4 0x710C 0x0B04 1 ADC Conversion Result Buffer Register 4 ADCRESULT5 0x710D 0x0B05 1 ADC Conversion Result Buffer Register 5 ADCRESULT6 0x710E 0x0B06 1 ADC Conversion Result Buffer Register 6 ADCRESULT7 0x710F 0x0B07 1 ADC Conversion Result Buffer Register 7 ADCRESULT8 0x7110 0x0B08 1 ADC Conversion Result Buffer Register 8 ADCRESULT9 0x7111 0x0B09 1 ADC Conversion Result Buffer Register 9 ADCRESULT10 0x7112 0x0B0A 1 ADC Conversion Result Buffer Register 10 ADCRESULT11 0x7113 0x0B0B 1 ADC Conversion Result Buffer Register 11 ADCRESULT12 0x7114 0x0B0C 1 ADC Conversion Result Buffer Register 12 ADCRESULT13 0x7115 0x0B0D 1 ADC Conversion Result Buffer Register 13 ADCRESULT14 0x7116 0x0B0E 1 ADC Conversion Result Buffer Register 14 ADCRESULT15 0x7117 0x0B0F 1 ADC Conversion Result Buffer Register 15 ADCTRL3 0x7118 1 ADC Control Register 3 ADCST 0x7119 1 ADC Status Register Reserved 0x711A - 0x711B 2 Reserved ADCREFSEL 0x711C 1 ADC Reference Select Register ADCOFFTRIM 0x711D 1 ADC Offset Trim Register Reserved 0x711E - 0x711F 2 Reserved (1) (2) 54 The registers in this column are Peripheral Frame 2 Registers. The ADC result registers are dual mapped in the F28044 DSP. Locations in Peripheral Frame 2 (0x7108-0x7117) are 2 wait-states and left justified. Locations in Peripheral frame 0 space (0x0B00-0x0B0F) are 0 wait sates and right justified. During high speed/continuous conversion use of the ADC, use the 0 wait-state locations for fast transfer of ADC results to user memory. Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 4.5 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Serial Communications Interface (SCI) Module (SCI-A) The F28044 device includes a serial communications interface (SCI) module. The SCI module supports digital communications between the CPU and other asynchronous peripherals that use the standard non-return-to-zero (NRZ) format. The SCI receiver and transmitter are double-buffered, and each has its own separate enable and interrupt bits. Both can be operated independently or simultaneously in the full-duplex mode. To ensure data integrity, the SCI checks received data for break detection, parity, overrun, and framing errors. The bit rate is programmable to over 65000 different speeds through a 16-bit baud-select register. Features of each SCI module include: * Two external pins: - SCITXD: SCI transmit-output pin - SCIRXD: SCI receive-input pin NOTE: Both pins can be used as GPIO if not used for SCI. - Baud rate programmable to 64K different rates: * * * * * * * * * * Baud rate = LSPCLK (BRR ) 1) * 8 when BRR 0 Baud rate = LSPCLK 16 when BRR = 0 Data-word format - One start bit - Data-word length programmable from one to eight bits - Optional even/odd/no parity bit - One or two stop bits Four error-detection flags: parity, overrun, framing, and break detection Two wake-up multiprocessor modes: idle-line and address bit Half- or full-duplex operation Double-buffered receive and transmit functions Transmitter and receiver operations can be accomplished through interrupt-driven or polled algorithms with status flags. - Transmitter: TXRDY flag (transmitter-buffer register is ready to receive another character) and TX EMPTY flag (transmitter-shift register is empty) - Receiver: RXRDY flag (receiver-buffer register is ready to receive another character), BRKDT flag (break condition occurred), and RX ERROR flag (monitoring four interrupt conditions) Separate enable bits for transmitter and receiver interrupts (except BRKDT) Max bit rate + 100 MHz + 6.25 106 bs 16 NRZ (non-return-to-zero) format Ten SCI module control registers located in the control register frame beginning at address 7050h NOTE All registers in this module are 8-bit registers that are connected to Peripheral Frame 2. When a register is accessed, the register data is in the lower byte (7-0), and the upper byte (15-8) is read as zeros. Writing to the upper byte has no effect. Enhanced features: * Auto baud-detect hardware logic * 16-level transmit/receive FIFO Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 55 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com The SCI port operation is configured and controlled by the registers listed in Table 4-7. Table 4-7. SCI-A Registers (1) NAME ADDRESS SIZE (x16) SCICCRA 0x7050 1 SCI-A Communications Control Register SCICTL1A 0x7051 1 SCI-A Control Register 1 SCIHBAUDA 0x7052 1 SCI-A Baud Register, High Bits SCILBAUDA 0x7053 1 SCI-A Baud Register, Low Bits SCICTL2A 0x7054 1 SCI-A Control Register 2 SCIRXSTA 0x7055 1 SCI-A Receive Status Register SCIRXEMUA 0x7056 1 SCI-A Receive Emulation Data Buffer Register SCIRXBUFA 0x7057 1 SCI-A Receive Data Buffer Register SCITXBUFA 0x7059 1 SCI-A Transmit Data Buffer Register (2) 0x705A 1 SCI-A FIFO Transmit Register SCIFFRXA (2) 0x705B 1 SCI-A FIFO Receive Register SCIFFCTA (2) 0x705C 1 SCI-A FIFO Control Register SCIPRIA 0x705F 1 SCI-A Priority Control Register SCIFFTXA (1) (2) 56 DESCRIPTION Registers in this table are mapped to Peripheral Frame 2 space. This space only allows 16-bit accesses. 32-bit accesses produce undefined results. These registers are new registers for the FIFO mode. Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Figure 4-8 shows the SCI module block diagram. SCICTL1.1 SCITXD Frame Format and Mode TXSHF Register Parity Even/Odd Enable TX EMPTY SCICTL2.6 8 SCICCR.6 SCICCR.5 TXRDY SCICTL2.7 Transmitter-Data Buffer Register TXWAKE SCICTL1.3 SCICTL2.0 TXINT TX FIFO _0 1 TX Interrupt Logic ----- TX FIFO _15 TX FIFO Interrupts SCITXBUF.7-0 TX FIFO Registers SCIFFENA SCIHBAUD. 15 - 8 Baud Rate MSbyte Register LSPCLK TX INT ENA 8 TX FIFO _1 WUT SCITXD TXENA To CPU SCI TX Interrupt Select Logic AutoBaud Detect Logic SCIFFTX.14 SCIRXD SCIRXD RXSHF Register RXWAKE SCIRXST.1 SCILBAUD. 7 - 0 Baud Rate LSbyte Register RXENA 8 SCICTL1.0 SCICTL2.1 RXRDY Receive-Data Buffer Register SCIRXBUF.7-0 RX/BK INT ENA SCIRXST.6 BRKDT 8 SCIRXST.5 RX FIFO _15 ----- RX FIFO _1 RX FIFO _0 RX FIFO Interrupts RXINT RX Interrupt Logic To CPU SCIRXBUF.7-0 RX FIFO Registers RXFFOVF SCIRXST.7 SCIRXST.4 - 2 RX Error FE OE PE SCIFFRX.15 RX Error RX ERR INT ENA SCI RX Interrupt Select Logic SCICTL1.6 Figure 4-8. Serial Communications Interface (SCI) Module Block Diagram Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 57 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 4.6 www.ti.com Serial Peripheral Interface (SPI) Module (SPI-A) The F28044 device includes the four-pin serial peripheral interface (SPI) module. The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream of programmed length (one to sixteen bits) to be shifted into and out of the device at a programmable bit-transfer rate. Normally, the SPI is used for communications between the DSP controller and external peripherals or another processor. Typical applications include external I/O or peripheral expansion through devices such as shift registers, display drivers, and ADCs. Multidevice communications are supported by the master/slave operation of the SPI. The SPI module features include: * Four external pins: - SPISOMI: SPI slave-output/master-input pin - SPISIMO: SPI slave-input/master-output pin - SPISTE: SPI slave transmit-enable pin - SPICLK: SPI serial-clock pin NOTE: All four pins can be used as GPIO, if the SPI module is not used. * Two operational modes: master and slave Baud rate: 125 different programmable rates. * * * * * Baud rate = LSPCLK (SPIBRR ) 1) Baud rate = LSPCLK 4 when SPIBRR = 3 to 127 when SPIBRR = 0,1, 2 Data word length: one to sixteen data bits Four clocking schemes (controlled by clock polarity and clock phase bits) include: - Falling edge without phase delay: SPICLK active-high. SPI transmits data on the falling edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal. - Falling edge with phase delay: SPICLK active-high. SPI transmits data one half-cycle ahead of the falling edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal. - Rising edge without phase delay: SPICLK inactive-low. SPI transmits data on the rising edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal. - Rising edge with phase delay: SPICLK inactive-low. SPI transmits data one half-cycle ahead of the falling edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal. Simultaneous receive and transmit operation (transmit function can be disabled in software) Transmitter and receiver operations are accomplished through either interrupt-driven or polled algorithms. Nine SPI module control registers: Located in control register frame beginning at address 7040h. NOTE All registers in this module are 16-bit registers that are connected to Peripheral Frame 2. When a register is accessed, the register data is in the lower byte (7-0), and the upper byte (15-8) is read as zeros. Writing to the upper byte has no effect. Enhanced feature: * 16-level transmit/receive FIFO * Delayed transmit control 58 Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 The SPI port operation is configured and controlled by the registers listed in Table 4-8. Table 4-8. SPI-A Registers (1) DESCRIPTION (1) NAME ADDRESS SIZE (x16) SPICCR 0x7040 1 SPI-A Configuration Control Register SPICTL 0x7041 1 SPI-A Operation Control Register SPISTS 0x7042 1 SPI-A Status Register SPIBRR 0x7044 1 SPI-A Baud Rate Register SPIRXEMU 0x7046 1 SPI-A Receive Emulation Buffer Register SPIRXBUF 0x7047 1 SPI-A Serial Input Buffer Register SPITXBUF 0x7048 1 SPI-A Serial Output Buffer Register SPIDAT 0x7049 1 SPI-A Serial Data Register SPIFFTX 0x704A 1 SPI-A FIFO Transmit Register SPIFFRX 0x704B 1 SPI-A FIFO Receive Register SPIFFCT 0x704C 1 SPI-A FIFO Control Register SPIPRI 0x704F 1 SPI-A Priority Control Register Registers in this table are mapped to Peripheral Frame 2. This space only allows 16-bit accesses. 32-bit accesses produce undefined results. Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 59 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Figure 4-9 is a block diagram of the SPI in slave mode. SPIFFENA SPIFFTX.14 Overrun INT ENA Receiver Overrun Flag RX FIFO Registers SPIRXBUF RX FIFO _0 RX FIFO _1 ----RX FIFO _15 SPISTS.7 SPICTL.4 RX FIFO Interrupt RX Interrupt Logic 16 SPIINT/SPIRXINT SPIFFOVF FLAG SPIRXBUF Buffer Register To CPU SPIFFRX.15 TX FIFO Registers SPITXBUF TX FIFO Interrupt TX Interrupt Logic TX FIFO _15 ----TX FIFO _1 TX FIFO _0 16 SPI INT FLAG SPITXINT SPI INT ENA SPISTS.6 SPICTL.0 16 SPITXBUF Buffer Register 16 M M S S SPIDAT Data Register SW1 SPISIMO M M SPIDAT.15 - 0 S S SW2 SPISOMI Talk SPICTL.1 (A) SPISTE State Control Master/Slave SPI Char SPICCR.3 - 0 3 2 1 SW3 M SPI Bit Rate LSPCLK SPIBRR.6 - 0 6 A. 5 4 3 SPICTL.2 S 0 2 S Clock Polarity SPICCR.6 Clock Phase SPICTL.3 SPICLK M 1 0 SPISTE is driven low by the master for a slave device. Figure 4-9. SPI Module Block Diagram (Slave Mode) 60 Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 4.7 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Inter-Integrated Circuit (I2C) The F28044 device contains one I2C Serial Port. Figure 4-10 shows how the I2C peripheral module interfaces within the F28044 device. The I2C module has the following features: * Compliance with the Philips Semiconductors I2C-bus specification (version 2.1): - Support for 1-bit to 8-bit format transfers - 7-bit and 10-bit addressing modes - General call - START byte mode - Support for multiple master-transmitters and slave-receivers - Support for multiple slave-transmitters and master-receivers - Combined master transmit/receive and receive/transmit mode - Data transfer rate from 10 kbps up to 400 kbps (I2C Fast-mode rate) * One 16-word receive FIFO and one 16-word transmit FIFO * One interrupt that can be used by the CPU. This interrupt can be generated as a result of one of the following conditions: - Transmit-data ready - Receive-data ready - Register-access ready - No-acknowledgment received - Arbitration lost - Stop condition detected - Addressed as slave * An additional interrupt that can be used by the CPU when in FIFO mode * Module enable/disable capability * Free data format mode Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 61 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com System Control Block C28x CPU I2CAENCLK SYSRS Control Data[16] SDAA Peripheral Bus SYSCLKOUT Data[16] 2 GPIO MUX I C-A Addr[16] SCLA I2CINT1A PIE Block I2CINT2A A. B. The I2C registers are accessed at the SYSCLKOUT rate. The internal timing and signal waveforms of the I2C port are also at the SYSCLKOUT rate. The clock enable bit (I2CAENCLK) in the PCLKCRO register turns off the clock to the I2C port for low power operation. Upon reset, I2CAENCLK is clear, which indicates the peripheral internal clocks are off. Figure 4-10. I2C Peripheral Module Interfaces The registers in Table 4-9 configure and control the I2C port operation. Table 4-9. I2C-A Registers 62 NAME ADDRESS DESCRIPTION I2COAR 0x7900 I2C own address register I2CIER 0x7901 I2C interrupt enable register I2CSTR 0x7902 I2C status register I2CCLKL 0x7903 IC clock low-time divider register I2CCLKH 0x7904 I2C clock high-time divider register I2CCNT 0x7905 I2C data count register I2CDRR 0x7906 I2C data receive register I2CSAR 0x7907 I2C slave address register I2CDXR 0x7908 I2C data transmit register I2CMDR 0x7909 I2C mode register I2CISRC 0x790A I2C interrupt source register I2CPSC 0x790C I2C prescaler register I2CFFTX 0x7920 I2C FIFO transmit register I2CFFRX 0x7921 I2C FIFO receive register I2CRSR - I2C receive shift register (not accessible to the CPU) I2CXSR - I2C transmit shift register (not accessible to the CPU) Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 4.8 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 GPIO MUX On the 280x, the GPIO MUX can multiplex up to three independent peripheral signals on a single GPIO pin in addition to providing individual pin bit-banging IO capability. The GPIO MUX block diagram per pin is shown in Figure 4-11. Because of the open drain capabilities of the I2C pins, the GPIO MUX block diagram for these pins differ. See the TMS320x280x, 2801x, 2804x DSP System Control and Interrupts Reference Guide (literature number SPRU712) for details. GPIOXINT1SEL GPIOLMPSEL GPIOXINT2SEL LPMCR0 GPIOXNMISEL Low-Power Modes Block External Interrupt MUX PIE GPxDAT (read) Asynchronous path GPxQSEL1/2 GPxCTRL GPxPUD Input Qualification Internal Pullup 00 N/C 01 Peripheral 1 Input 10 Peripheral 2 Input 11 Peripheral 3 Input Asynchronous path GPxTOGGLE GPxCLEAR GPxSET GPIOx pin 00 GPxDAT (latch) 01 Peripheral 1 Output 10 Peripheral 2 Output 11 Peripheral 3 Output High-Impedance Output Control 00 0 = Input, 1 = Output XRS = Default at Reset A. B. GPxDIR (latch) 01 Peripheral 1 Output Enable 10 Peripheral 2 Output Enable 11 Peripheral 3 Output Enable GPxMUX1/2 x stands for the port, either A or B. For example, GPxDIR refers to either the GPADIR and GPBDIR register depending on the particular GPIO pin selected. GPxDAT latch/read are accessed at the same memory location. Figure 4-11. GPIO MUX Block Diagram Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 63 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com The F28044 supports 34 GPIO pins. The GPIO control and data registers are mapped to Peripheral Frame 1 to enable 32-bit operations on the registers (along with 16-bit operations). Table 4-10 shows the GPIO register mapping. Table 4-10. GPIO Registers NAME ADDRESS SIZE (x16) DESCRIPTION GPIO CONTROL REGISTERS (EALLOW PROTECTED) GPACTRL 0x6F80 2 GPIO A Control Register (GPIO0 to 31) GPAQSEL1 0x6F82 2 GPIO A Qualifier Select 1 Register (GPIO0 to 15) GPAQSEL2 0x6F84 2 GPIO A Qualifier Select 2 Register (GPIO16 to 31) GPAMUX1 0x6F86 2 GPIO A MUX 1 Register (GPIO0 to 15) GPAMUX2 0x6F88 2 GPIO A MUX 2 Register (GPIO16 to 31) GPADIR 0x6F8A 2 GPIO A Direction Register (GPIO0 to 31) GPAPUD 0x6F8C 2 GPIO A Pull Up Disable Register (GPIO0 to 31) GPAMCFG 0x6F8E 2 GPIO A Miscellaneous Configuration Register (GPIO0 to 31) GPBCTRL 0x6F90 2 GPIO B Control Register (GPIO32 to 35) GPBQSEL1 0x6F92 2 GPIO B Qualifier Select 1 Register (GPIO32 to 35) GPBQSEL2 0x6F94 2 Reserved GPBMUX1 0x6F96 2 GPIO B MUX 1 Register (GPIO32 to 35) GPBMUX2 0x6F98 2 Reserved GPBDIR 0x6F9A 2 GPIO B Direction Register (GPIO32 to 35) GPBPUD 0x6F9C 2 GPIO B Pull Up Disable Register (GPIO32 to 35) Reserved 0x6F9E - 0x6F9F 2 Reserved Reserved 0x6FA0 - 0x6FBF 32 Reserved GPADAT 0x6FC0 2 GPIO Data Register (GPIO0 to 31) GPASET 0x6FC2 2 GPIO Data Set Register (GPIO0 to 31) GPIO DATA REGISTERS (NOT EALLOW PROTECTED) GPACLEAR 0x6FC4 2 GPIO Data Clear Register (GPIO0 to 31) GPATOGGLE 0x6FC6 2 GPIO Data Toggle Register (GPIO0 to 31) GPBDAT 0x6FC8 2 GPIO Data Register (GPIO32 to 35) GPBSET 0x6FCA 2 GPIO Data Set Register (GPIO32 to 35) GPBCLEAR 0x6FCC 2 GPIO Data Clear Register (GPIO32 to 35) GPBTOGGLE 0x6FCE 2 GPIO Data Toggle Register (GPIO32 to 35) Reserved 0x6FD0 - 0x6FDF 16 Reserved GPIO INTERRUPT AND LOW POWER MODES SELECT REGISTERS (EALLOW PROTECTED) 64 GPIOXINT1SEL 0x6FE0 1 XINT1 GPIO Input Select Register (GPIO0 to 31) GPIOXINT2SEL 0x6FE1 1 XINT2 GPIO Input Select Register (GPIO0 to 31) GPIOXNMISEL 0x6FE2 1 XNMI GPIO Input Select Register (GPIO0 to 31) Reserved 0x6FE3 - 0x6FE7 5 Reserved GPIOLPMSEL 0x6FE8 2 LPM GPIO Select Register (GPIO0 to 31) Reserved 0x6FEA - 0x6FFF 22 Reserved Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Table 4-11. F28044 GPIO MUX Table GPxMUX1/2 (1) REGISTER BITS DEFAULT AT RESET PRIMARY I/O FUNCTION (GPxMUX1/2 BITS = 0,0) PERIPHERAL SELECTION 1 (2) (GPxMUX1 BITS = 0,1) GPAMCFG(EPWMMODE) (3) 0,0 (4) PERIPHERAL SELECTION 2 (2) (GPxMUX1/2 BITS = 1,0) PERIPHERAL SELECTION 3 (2) (GPxMUX1/2 BITS = 1,1) 1,1 GPAMUX1 1-0 GPIO0 EPWM1A (O) EPWM1A (O) Reserved Reserved 3-2 GPIO1 EPWM1B (O) EPWM2A (O) Reserved Reserved 5-4 GPIO2 EPWM2A (O) EPWM3A (O) Reserved Reserved 7-6 GPIO3 EPWM2B (O) EPWM4A (O) Reserved Reserved 9-8 GPIO4 EPWM3A (O) EPWM5A (O) Reserved Reserved 11-10 GPIO5 EPWM3B (O) EPWM6A (O) Reserved Reserved 13-12 GPIO6 EPWM4A (O) EPWM7A (O) EPWMSYNCI (I) EPWMSYNCO (O) 15-14 GPIO7 EPWM4B (O) EPWM8A (O) Reserved Reserved 17-16 GPIO8 EPWM5A (O) EPWM9A (O) Reserved ADCSOCAO (O) 19-18 GPIO9 EPWM5B (O) EPWM10A (O) Reserved Reserved 21-20 GPIO10 EPWM6A (O) EPWM11A (O) Reserved ADCSOCBO (O) 23-22 GPIO11 EPWM6B (O) EPWM12A (O) Reserved Reserved 25-24 GPIO12 TZ1 (I) EPWM13A (O) Reserved Reserved 27-26 GPIO13 TZ2 (I) EPWM14A (O) Reserved Reserved 29-28 GPIO14 TZ3 (I) EPWM15A (O) Reserved Reserved 31-30 GPIO15 TZ4 (I) EPWM16A (O) Reserved Reserved GPAMUX2 1-0 GPIO16 SPISIMOA (I/O) Reserved TZ5 (I) 3-2 GPIO17 SPISOMIA (I/O) Reserved TZ6 (I) 5-4 GPIO18 SPICLKA (I/O) Reserved TZ1 (I) 7-6 GPIO19 SPISTEA (I/O) Reserved TZ2 (I) 9-8 GPIO20 Reserved Reserved Reserved 11-10 GPIO21 Reserved Reserved Reserved 13-12 GPIO22 Reserved Reserved Reserved 15-14 GPIO23 Reserved Reserved Reserved 17-16 GPIO24 Reserved Reserved Reserved 19-18 GPIO25 Reserved Reserved Reserved 21-20 GPIO26 Reserved Reserved Reserved 23-22 GPIO27 Reserved Reserved Reserved 25-24 GPIO28 SCIRXDA (I) Reserved TZ5 (I) 27-26 GPIO29 SCITXDA (O) Reserved TZ6 (I) 29-28 GPIO30 Reserved Reserved TZ3 (I) 31-30 GPIO31 Reserved Reserved TZ4 (I) GPBMUX1 (1) (2) (3) (4) 1-0 GPIO32 SDAA (I/OC) EPWMSYNCI (I) ADCSOCAO (O) 3-2 GPIO33 SCLA (I/OC) EPWMSYNCO (O) ADCSOCBO (O) 5-4 GPIO34 Reserved Reserved Reserved GPxMUX1/2 refers to the appropriate MUX register for the pin; GPAMUX1, GPAMUX2 or GPBMUX1. The word "Reserved" means that there is no peripheral assigned to this GPxMUX1/2 register setting. Should it be selected, the state of the pin will be undefined and the pin may be driven. This selection is a reserved configuration for future expansion. The options GPAMCFG(EPWMMODE) = 0, 1 and 1, 0 are reserved. This is the default configuration upon reset. Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 65 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com The user can select the type of input qualification for each GPIO pin via the GPxQSEL1/2 registers from four choices: * Synchronization To SYSCLKOUT Only (GPxQSEL1/2 = 0,0): This is the default mode of all GPIO pins at reset and it simply synchronizes the input signal to the system clock (SYSCLKOUT). * Qualification Using Sampling Window (GPxQSEL1/2 = 0,1 and 1,0): In this mode the input signal, after synchronization to the system clock (SYSCLKOUT), is qualified by a specified number of cycles before the input is allowed to change. Time Between Samples GPyCTRL Reg GPIOx SYNC Qualification Input Signal Qualified by 3 or 6 Samples GPxQSEL SYSCLKOUT Number of Samples Figure 4-12. Qualification Using Sampling Window * * The sampling period is specified by the QUALPRD bits in the GPxCTRL register and is configurable in groups of 8 signals. It specifies a multiple of SYSCLKOUT cycles for sampling the input signal. The sampling window is either 3-samples or 6-samples wide and the output is only changed when ALL samples are the same (all 0s or all 1s) as shown in Figure 6-8 (for 6 sample mode). No Synchronization (GPxQSEL1/2 = 1,1): This mode is used for peripherals where synchronization is not required (synchronization is performed within the peripheral). Due to the multi-level multiplexing that is required on the F28044 device, there may be cases where a peripheral input signal can be mapped to more then one GPIO pin. Also, when an input signal is not selected, the input signal will default to either a 0 or 1 state, depending on the peripheral. 66 Peripherals Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 5 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Device Support Texas Instruments (TI) offers an extensive line of development tools for the C28xTM generation of DSPs, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The following products support development of 280x-based applications: Software Development Tools * Code Composer StudioTM Integrated Development Environment (IDE) - C/C++ Compiler - Code generation tools - Assembler/Linker - Cycle Accurate Simulator * Application algorithms * Sample applications code Hardware Development Tools * 2808 eZdspTM * JTAG-based emulators - SPI515, XDS510PP, XDS510PP Plus, XDS510USBTM * Universal 5-V dc power supply * Documentation and cables 5.1 Device and Development Support Tool Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all TMS320TM DSP devices and support tools. Each TMS320TM DSP commercial family member has one of three prefixes: TMX, TMP, or TMS (e.g., TMS320F28044). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS). Device development evolutionary flow: TMX Experimental device that is not necessarily representative of the final device's electrical specifications TMP Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification TMS Fully qualified production device Support tool development evolutionary flow: TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing TMDS Fully qualified development-support product TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer: "Developmental product is intended for internal evaluation purposes." TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Device Support Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 67 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, GGM) and temperature range (for example, A). Figure 5-1 provides a legend for reading the complete device name for any family member. TMS 320 F 28044 PZ A PREFIX TEMPERTURE RANGE TMX = Experimental Device TMP = Prototype Device TMS = Qualified Device A = -40C to 85C S = -40C to 125C Q = -40C to 125C (Q100 fault grading) PACKAGE TYPE DEVICE FAMILY TM 320 = TMS320 PZ = 100-Pin Low-Profile Quad Flatpack (LQFP) GGM = 100-Ball Ball Grid Array (BGA) ZGM = 100-Ball Lead-Free BGA DSP Family TECHNOLOGY F = Flash EEPROM (1.8-V Core/3.3-V I/O) DEVICE 28044 Figure 5-1. Example of TMS320x280x Device Nomenclature 68 Device Support Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 5.2 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Documentation Support Extensive documentation supports all of the TMS320TM DSP family generations of devices from product announcement through applications development. The types of documentation available include: data sheets and data manuals, with design specifications; and hardware and software applications. Table 5-1 shows the peripheral reference guides appropriate for use with the device(s) in this data manual. (TMS320F28044 device reference guides are applicable to the UCD9501 device as well.) See the TMS320x28xx, 28xxx DSP Peripheral Reference Guide (literature number SPRU566) for more information on types of peripherals. Table 5-1. TMS320F28044 Peripheral Selection Guide LITERATURE NUMBER TYPE (1) 28044 TMS320x280x, 2801x, 2804x DSP System Control and Interrupts SPRU712 - X TMS320x280x, 2801x, 2804x DSP Analog-to-Digital Converter (ADC) SPRU716 1 X TMS320x280x, 2801x, 2804x Serial Communications Interface (SCI) SPRUFK7 0 X TMS320x280x, 2801x, 2804x Serial Peripheral Interface SPRUG72 0 X TMS320x280x, 2801x, 2804x Boot ROM SPRU722 - X TMS320x280x, 2801x, 2804x Enhanced Pulse Width Modulator (ePWM) Module SPRU791 0 X TMS320x280x, 2801x, 2804x Inter-Integrated Circuit (I2C) SPRU721 0 X TMS320x280x, 2801x, 2804x High Resolution Pulse Width Modulator SPRU924 0 X PERIPHERAL GUIDE (1) A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor differences between devices that do not affect the basic functionality of the module. These device-specific differences are listed in the TMS320x28xx, 28xxx DSP Peripheral Reference Guide (literature number SPRU566) and in the peripheral reference guides. The following documents are available on the TI website (www.ti.com): Errata SPRZ255 TMS320F28044 DSP Silicon Errata describes known advisories on silicon and provides workarounds. CPU User's Guides SPRU430 TMS320C28x CPU and Instruction Set Reference Guide describes the central processing unit (CPU) and the assembly language instructions of the TMS320C28x fixed-point digital signal processors (DSPs). It also describes emulation features available on these DSPs. SPRU712 TMS320x280x, 2801x, 2804x DSP System Control and Interrupts Reference Guide describes the various interrupts and system control features of the 280x digital signal processors (DSPs). Peripheral Guides SPRU566 TMS320x28xx, 28xxx DSP Peripheral Reference Guide describes the peripheral reference guides of the 28x digital signal processors (DSPs). SPRU716 TMS320x280x, 2801x, 2804x DSP Analog-to-Digital Converter (ADC) Reference Guide describes how to configure and use the on-chip ADC module, which is a 12-bit pipelined ADC. SPRU791 TMS320x280x, 2801x, 2804x Enhanced Pulse Width Modulator (ePWM) Module Reference Guide describes the main areas of the enhanced pulse width modulator that include digital motor control, switch mode power supply control, UPS (uninterruptible power supplies), and other forms of power conversion SPRU790 TMS320x280x, 2801x, 2804x Enhanced Quadrature Encoder Pulse (eQEP) Module Reference Guide describes the eQEP module, which is used for interfacing with a linear or rotary incremental encoder to get position, direction, and speed information from a rotating Device Support Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 69 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com machine in high performance motion and position control systems. It includes the module description and registers SPRU807 TMS320x280x, 2801x, 2804x Enhanced Capture (eCAP) Module Reference Guide describes the enhanced capture module. It includes the module description and registers. SPRU924 TMS320x280x, 2801x, 2804x High-Resolution Pulse Width Modulator Reference Guide describes the operation of the high-resolution extension to the pulse width modulator (HRPWM) SPRU074 TMS320x281x Enhanced Controller Area Network (eCAN) Reference Guide describes the eCAN that uses established protocol to communicate serially with other controllers in electrically noisy environments. SPRU051 TMS320x281x Serial Communications Interface (SCI) Reference Guide describes the SCI, which is a two-wire asynchronous serial port, commonly known as a UART. The SCI modules support digital communications between the CPU and other asynchronous peripherals that use the standard non-return-to-zero (NRZ) format. SPRU059 TMS320x281x Serial Peripheral Interface Reference Guide describes the SPI - a high-speed synchronous serial input/output (I/O) port - that allows a serial bit stream of programmed length (one to sixteen bits) to be shifted into and out of the device at a programmed bit-transfer rate. SPRU721 TMS320x280x, 2801x, 2804x Inter-Integrated Circuit (I2C) Reference Guide describes the features and operation of the inter-integrated circuit (I2C) module. SPRU722 TMS320x280x, 2801x, 2804x Boot ROM Reference Guide describes the purpose and features of the bootloader (factory-programmed boot-loading software). It also describes other contents of the device on-chip boot ROM and identifies where all of the information is located within that memory. SPRUFK7 TMS320x280x, 2801x, 2804x Serial Communications Interface (SCI) Reference Guide describes the features and operation of the serial communication interface (SCI) module that is available on the TMS320x280x, 2801x, 2804x devices. SPRUG72 TMS320x280x, 2801x, 2804x Serial Peripheral Interface Reference Guide describes how the serial peripheral interface works. Tools Guides SPRU513 TMS320C28x Assembly Language Tools v5.0 User's Guide describes the assembly language tools (assembler and other tools used to develop assembly language code), assembler directives, macros, common object file format, and symbolic debugging directives for the TMS320C28x device. 70 SPRU514 TMS320C28x Optimizing C/C++ Compiler v5.0 User's Guide describes the TMS320C28xTM C/C++ compiler. This compiler accepts ANSI standard C/C++ source code and produces TMS320 DSP assembly language source code for the TMS320C28x device. SPRU608 TMS320C28x Instruction Set Simulator Technical Overview describes the simulator, available within the Code Composer Studio for TMS320C2000 IDE, that simulates the instruction set of the C28xTM core. SPRU625 TMS320C28x DSP/BIOS 5.x Application Programming Interface (API) Reference Guide describes development using DSP/BIOS. Device Support Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Application Reports and Software Key Links Include: 1. C2000 Get Started - www.ti.com/c2000getstarted 2. C2000 Digital Motor Control Software Library - www.ti.com/c2000appsw 3. C2000 Digital Power Supply Software Library - www.ti.com/dpslib 4. DSP Power Management Reference Designs - www.ti.com/dsppower SPRAAQ7 TMS320x281x to TMS320x2833x or 2823x Migration Overview describes how to migrate from the 281x device design to 2833x or 2823x designs. SPRAAQ8 TMS320x280x to TMS320x2833x or 2823x Migration Overview describes how to migrate from a 280x device design to 2833x or 2823x designs. SPRAAN9 TMS320C28x FPU Primer provides an overview of the floating-point unit (FPU) in the TMS320F28335, TMS320F28334, and TMS320F28332 Digital Signal Controller (DSC) devices. SPRAAM0 Getting Started With TMS320C28x Digital Signal Controllers is organized by development flow and functional areas to make your design effort as seamless as possible. Tips on getting started with C28xTM DSP software and hardware development are provided to aid in your initial design and debug efforts. Each section includes pointers to valuable information including technical documentation, software, and tools for use in each phase of design. SPRA958 Running an Application from Internal Flash Memory on the TMS320F28xxx DSP covers the requirements needed to properly configure application software for execution from on-chip flash memory. Requirements for both DSP/BIOSTM and non-DSP/BIOS projects are presented. Example code projects are included. SPRAA85 Programming TMS320x28xx and 28xxx Peripherals in C/C++ explores a hardware abstraction layer implementation to make C/C++ coding easier on 28x DSPs. This method is compared to traditional #define macros and topics of code efficiency and special case registers are also addressed. SPRAA88 Using PWM Output as a Digital-to-Analog Converter on a TMS320F280x Digital Signal Controller presents a method for utilizing the on-chip pulse width modulated (PWM) signal generators on the TMS320F280x family of digital signal controllers as a digital-to-analog converter (DAC). SPRAA91 TMS320F280x Digital Signal Controller USB Connectivity Using the TUSB3410 USB-to-UART Bridge Chip presents hardware connections as well as software preparation and operation of the development system using a simple communication echo program. SPRAAH1 Using the Enhanced Quadrature Encoder Pulse (eQEP) Module in TMS320x280x, 28xxx as a Dedicated Capture provides a guide for the use of the eQEP module as a dedicated capture unit and is applicable to the TMS320x280x, 28xxx family of processors. SPRAAI1 Using the ePWM Module for 0% - 100% Duty Cycle Control provides a guide for the use of the ePWM module to provide 0% to 100% duty cycle control and is applicable to the TMS320x280x family of processors. SPRAAD5 Power Line Communication for Lighting Applications Using Binary Phase Shift Keying (BPSK) with a Single DSP Controller presents a complete implementation of a power line modem following CEA-709 protocol using a single DSP. SPRAAD8 TMS320x280x and TMS320F2801x ADC Calibration describes a method for improving the absolute accuracy of the 12-bit ADC found on the TMS320x280x and TMS320F2801x devices. Inherent gain and offset errors affect the absolute accuracy of the ADC. The methods described in this report can improve the absolute accuracy of the ADC to levels Device Support Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 71 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com better than 0.5%. This application report has an option to download an example program that executes from RAM on the F2808 EzDSP. SPRA820 Online Stack Overflow Detection on the TMS320C28x DSP presents the methodology for online stack overflow detection on the TMS320C28xTM DSP. C-source code is provided that contains functions for implementing the overflow detection on both DSP/BIOSTM and non-DSP/BIOS applications. SPRA806 An Easy Way of Creating a C-callable Assembly Function for the TMS320C28x DSP provides instructions and suggestions to configure the C compiler to assist with understanding of parameter-passing conventions and environments expected by the C compiler. Software SPRC191 Download: C280x, C2801x C/C++ Header Files and Peripheral Examples BSDL Models SPRM246 F28044 GGM/ZGM BSDL Model SPRM247 F28044 PZ BSDL Model IBIS Models SPRM447 F28044 GGM IBIS Model SPRM301 F28044 PZ IBIS Model SPRM446 F28044 ZGM IBIS Model A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support digital signal processing research and education. The TMS320 DSP newsletter, Details on Signal Processing, is published quarterly and distributed to update TMS320 DSP customers on product information. Updated information on the TMS320 DSP controllers can be found on the worldwide web at: http://www.ti.com. To send comments regarding this data manual (literature number SPRS357), use the comments@books.sc.ti.com email address, which is a repository for feedback. For questions and support, contact the Product Information Center listed at the http://www.ti.com/sc/docs/pic/home.htm site. 72 Device Support Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 6 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Electrical Specifications This section provides the absolute maximum ratings and the recommended operating conditions for the TMS320F28044 DSP. 6.1 Absolute Maximum Ratings (1) (2) Unless otherwise noted, the list of absolute maximum ratings are specified over operating temperature ranges. Supply voltage range, VDDIO, VDD3VFL with respect to VSS -0.3 V to 4.6 V Supply voltage range, VDDA2, VDDAIO with respect to VSSA -0.3 V to 4.6 V Supply voltage range, VDD with respect to VSS -0.3 V to 2.5 V Supply voltage range, VDD1A18, VDD2A18 with respect to VSSA -0.3 V to 2.5 V Supply voltage range, VSSA2, VSSAIO, VSS1AGND, VSS2AGND with respect to VSS -0.3 V to 0.3 V Input voltage range, VIN -0.3 V to 4.6 V Output voltage range, VO -0.3 V to 4.6 V Input clamp current, IIK (VIN < 0 or VIN > VDDIO) (3) 20 mA Output clamp current, IOK (VO < 0 or VO > VDDIO) Operating ambient temperature range, Junction temperature range, TJ (2) (3) (4) (4) (4) Storage temperature range, Tstg (1) 20 mA TA: A version (GGM, PZ) -40C to 85C -40C to 150C (4) -65C to 150C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Section 6.2 is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to VSS, unless otherwise noted. Continuous clamp current per pin is 2 mA. This includes the analog inputs which have an internal clamping circuit that clamps the voltage to a diode drop above VDDA2 or below VSSA2. Long-term high-temperature storage and/or extended use at maximum temperature conditions may result in a reduction of overall device life. For additional information, see IC Package Thermal Metrics Application Report (literature number SPRA953) and Reliability Data for TMS320LF24xx and TMS320F28xx Devices Application Report (literature number SPRA963) Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 73 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 6.2 www.ti.com Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Device supply voltage, I/O, VDDIO 3.14 3.3 3.47 V Device supply voltage CPU, VDD 1.71 1.8 1.89 V Supply ground, VSS, VSSIO 0 V ADC supply voltage (3.3 V), VDDA2, VDDAIO 3.14 3.3 3.47 V ADC supply voltage (1.8 V), VDD1A18, VDD2A18 1.71 1.8 1.89 V Flash supply voltage, VDD3VFL 3.14 3.3 Device clock frequency (system clock), fSYSCLKOUT High-level input voltage, VIH All inputs except X1 X1 Low-level input voltage, VIL 3.47 V 2 100 MHz 2 VDDIO + 0.3 0.7 * VDD - 0.05 VDD VSS - 0.3 0.8 All inputs except X1 X1 All I/Os except Group 2 -4 Group 2 (1) -8 Low-level output sink current, VOL = VOL MAX, IOL All I/Os except Group 2 Ambient temperature, TA A version 6.3 V 0.3 * VDD + 0.05 High-level output source current, VOH = 2.4 V, IOH (1) V Group 2 mA 4 (1) mA 8 -40 85 C MAX UNIT Group 2 pins are as follows: GPIO28, GPIO29, GPIO30, GPIO31, TDO, XCLKOUT, EMU0, and EMU1 Electrical Characteristics over recommended operating conditions (unless otherwise noted) PARAMETER VOH High-level output voltage VOL Low-level output voltage IIL IIH Input current (low level) Input current (high level) MIN TYP 2.4 IOH = 50 mA V VDDIO - 0.2 IOL = IOL MAX 0.4 Pin with pullup enabled VDDIO = 3.3 V, VIN = 0 V Pin with pulldown enabled VDDIO = 3.3 V, VIN = 0 V 2 Pin with pullup enabled VDDIO = 3.3 V, VIN = VDDIO 2 Pin with pulldown enabled VDDIO = 3.3 V, VIN = VDDIO (F280x) 28 50 80 Pin with pulldown enabled VDDIO = 3.3 V, VIN = VDDIO (C280x) 80 140 190 IOZ Output current, pullup or pulldown disabled CI Input capacitance 74 TEST CONDITIONS IOH = IOH MAX All I/Os (including XRS) -80 -140 V -190 mA VO = VDDIO or 0 V 2 2 Electrical Specifications mA mA pF Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 6.4 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Current Consumption Table 6-1. TMS320F28044 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT MODE TEST CONDITIONS IDD TYP IDDIO (5) MAX (6) TYP (5) (1) MAX IDD3VFL (2) (6) TYP MAX IDDA18 (6) TYP (5) (3) MAX IDDA33 (6) TYP (5) (4) MAX (6) The following peripheral clocks are enabled: * ePWM1-16 * SCI-A * SPI-A * ADC Operational (Flash) IDLE * I2C All PWM pins are toggled at 100 kHz. All I/O pins are left unconnected. Data is continuously transmitted out of the SCI-A port. The hardware multiplier is exercised. Code is running out of flash with 3 wait-states. XCLKOUT is turned off. Flash is powered down. XCLKOUT is turned off. The following peripheral clocks are enabled: * SCI-A * SPI-A * 205 mA 230 mA 10 mA 15 mA 35 mA 40 mA 30 mA 38 mA 1.5 mA 2 mA 75 mA 90 mA 500 mA 2 mA 2 mA 10 mA 5 mA 50 mA 15 mA 30 mA 12 mA 100 mA 500 mA 2 mA 10 mA 5 mA 50 mA 15 mA 30 mA 60 mA 120 mA 2 mA 10 mA 5 mA 50 mA 15 mA 30 mA I2C STANDBY Flash is powered down. Peripheral clocks are off. 6 mA HALT Flash is powered down. Peripheral clocks are off. Input clock is disabled. 70 mA (1) (2) (3) (4) (5) (6) IDDIO current is dependent on the electrical loading on the I/O pins. The IDD3VFL current indicated in this table is the flash read-current and does not include additional current for erase/write operations. During flash programming, extra current is drawn from the VDD and VDD3VFL rails, as indicated in Table 6-36 . If the user application involves on-board flash programming, this extra current must be taken into account while architecting the power-supply stage. IDDA18 includes current into VDD1A18 and VDD2A18 pins. In order to realize the IDDA18 currents shown for IDLE, STANDBY, and HALT, clock to the ADC module must be turned off explicitly by writing to the PCLKCR0 register. IDDA33 includes current into VDDA2 and VDDAIO pins. The TYP numbers are applicable over room temperature and nominal voltage. MAX numbers are at 85C and MAX voltage. NOTE The peripheral - I/O multiplexing implemented in the F28044 device prevents all available peripherals from being used at the same time. This is because more than one peripheral function may share an I/O pin. It is, however, possible to turn on the clocks to all the peripherals at the same time, although such a configuration is not useful. If this is done, the current drawn by the device will be more than the numbers specified in the current consumption tables. Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 75 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 6.4.1 www.ti.com Reducing Current Consumption Since each peripheral unit has an individual clock-enable bit, significant reduction in current consumption can be achieved by turning off the clock to any peripheral module that is not used in a given application. Furthermore, any one of the three low-power modes could be taken advantage of to reduce the current consumption even further. Table 6-2 indicates the typical reduction in current consumption achieved by turning off the clocks. Table 6-2. Typical Current Consumption by Various Peripherals (at 100 MHz) (1) (1) (2) (3) PERIPHERAL MODULE IDD CURRENT REDUCTION (mA) (2) ADC 8 (3) 2 I C 5 ePWM 5 SCI 4 SPI 5 All peripheral clocks are disabled upon reset. Writing to/reading from peripheral registers is possible only after the peripheral clocks are turned on. For peripherals with multiple instances, the current quoted is per module. For example, the 5 mA number quoted for ePWM is for one ePWM module. This number represents the current drawn by the digital portion of the ADC module. Turning off the clock to the ADC module results in the elimination of the current drawn by the analog portion of the ADC (IDDA18) as well. NOTE IDDIO current consumption is reduced by 15 mA (typical) when XCLKOUT is turned off. NOTE The baseline IDD current (current when the core is executing a dummy loop with no peripherals enabled) is 110 mA, typical. To arrive at the IDD current for a given application, the current-drawn by the peripherals (enabled by that application) must be added to the baseline IDD current. 76 Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 6.5 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Emulator Connection Without Signal Buffering for the DSP Figure 6-1 shows the connection between the DSP and JTAG header for a single-processor configuration. If the distance between the JTAG header and the DSP is greater than 6 inches, the emulation signals must be buffered. If the distance is less than 6 inches, buffering is typically not needed. Figure 6-1 shows the simpler, no-buffering situation. For the pullup/pulldown resistor values, see the pin description section. 6 inches or less VDDIO EMU0 EMU1 TRST TMS TDI TDO TCK VDDIO 13 14 2 1 3 7 11 9 PD EMU0 5 EMU1 TRST GND TMS GND TDI GND TDO GND TCK GND 4 6 8 10 12 TCK_RET DSP JTAG Header Figure 6-1. Emulator Connection Without Signal Buffering for the DSP Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 77 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 6.6 www.ti.com Timing Parameter Symbology Timing parameter symbols used are created in accordance with JEDEC Standard 100. To shorten the symbols, some of the pin names and other related terminology have been abbreviated as follows: 6.6.1 Lowercase subscripts and their meanings: Letters and symbols and their meanings: a access time H High c cycle time (period) L Low d delay time V Valid f fall time X Unknown, changing, or don't care level h hold time Z High impedance r rise time su setup time t transition time v valid time w pulse duration (width) General Notes on Timing Parameters All output signals from the 28x devices (including XCLKOUT) are derived from an internal clock such that all output transitions for a given half-cycle occur with a minimum of skewing relative to each other. The signal combinations shown in the following timing diagrams may not necessarily represent actual cycles. For actual cycle examples, see the appropriate cycle description section of this document. 78 Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 6.6.2 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Test Load Circuit This test load circuit is used to measure all switching characteristics provided in this document. Tester Pin Electronics 42 W 3.5 nH Transmission Line Data Sheet Timing Reference Point Output Under Test (A) Z0 = 50 W Device Pin 4.0 pF A. (B) 1.85 pF Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin. The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must be taken into account. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line effect. The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns or longer) from the data sheet timing. B. Figure 6-2. 3.3-V Test Load Circuit 6.6.3 Device Clock Table This section provides the timing requirements and switching characteristics for the various clock options available on the F28044 DSP. Table 6-3 lists the cycle times of various clocks. Table 6-3. TMS320x280x Clock Table and Nomenclature MIN On-chip oscillator clock XCLKIN (1) SYSCLKOUT XCLKOUT HSPCLK (2) LSPCLK (2) ADC clock (1) (2) (3) tc(OSC), Cycle time NOM MAX UNIT 28.6 50 ns Frequency 20 35 MHz tc(CI), Cycle time 10 250 ns MHz Frequency 4 100 10 500 ns 2 100 MHz tc(XCO), Cycle time 10 2000 ns Frequency 0.5 100 MHz tc(HCO), Cycle time 10 100 MHz 100 MHz tc(SCO), Cycle time Frequency 20 (3) 50 (3) Frequency tc(LCO), Cycle time 10 40 (3) 25 (3) Frequency tc(ADCCLK), Cycle time ns ns 80 Frequency ns 12.5 MHz This also applies to the X1 pin if a 1.8-V oscillator is used. Lower LSPCLK and HSPCLK will reduce device power consumption. This is the default reset value if SYSCLKOUT = 100 MHz. Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 79 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 6.7 www.ti.com Clock Requirements and Characteristics Table 6-4. Input Clock Frequency PARAMETER fx Input clock frequency MIN MAX Resonator (X1/X2) 20 Crystal (X1/X2) 20 35 4 100 External oscillator/clock source (XCLKIN or X1 pin) fl TYP Limp mode SYSCLKOUT frequency range (with /2 enabled) UNIT 35 1-5 MHz MHz Table 6-5. XCLKIN (1) Timing Requirements - PLL Enabled NO. MIN MAX UNIT 33.3 C8 tc(CI) Cycle time, XCLKIN 200 ns C9 tf(CI) Fall time, XCLKIN 6 ns C10 tr(CI) Rise time, XCLKIN 6 ns C11 tw(CIL) Pulse duration, XCLKIN low as a percentage of tc(OSCCLK) 45 55 % C12 tw(CIH) Pulse duration, XCLKIN high as a percentage of tc(OSCCLK) 45 55 % MIN MAX UNIT 10 250 ns Up to 20 MHz 6 ns 20 MHz to 100 MHz 2 ns Up to 20 MHz 6 ns 20 MHz to 100 MHz 2 ns (1) This applies to the X1 pin also. Table 6-6. XCLKIN (1) Timing Requirements - PLL Disabled NO. C8 tc(CI) Cycle time, XCLKIN C9 tf(CI) Fall time, XCLKIN C10 tr(CI) Rise time, XCLKIN C11 tw(CIL) Pulse duration, XCLKIN low as a percentage of tc(OSCCLK) 45 55 % C12 tw(CIH) Pulse duration, XCLKIN high as a percentage of tc(OSCCLK) 45 55 % (1) This applies to the X1 pin also. The possible configuration modes are shown in Table 3-13. Table 6-7. XCLKOUT Switching Characteristics (PLL Bypassed or Enabled) (1) NO. PARAMETER 80 TYP MAX 10 UNIT C1 tc(XCO) Cycle time, XCLKOUT C3 tf(XCO) Fall time, XCLKOUT C4 tr(XCO) Rise time, XCLKOUT C5 tw(XCOL) Pulse duration, XCLKOUT low H-2 H+2 ns C6 tw(XCOH) Pulse duration, XCLKOUT high H-2 H+2 ns tp (1) (2) (3) MIN (2) ns 2 ns 2 PLL lock time ns 131072tc(OSCCLK) (3) cycles A load of 40 pF is assumed for these parameters. H = 0.5tc(XCO) OSCCLK is either the output of the on-chip oscillator or the output from an external oscillator. Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 C10 C9 C8 XCLKIN(A) C6 C3 C1 C4 C5 XCLKOUT(B) A. B. The relationship of XCLKIN to XCLKOUT depends on the divide factor chosen. The waveform relationship shown is intended to illustrate the timing parameters only and may differ based on actual configuration. XCLKOUT configured to reflect SYSCLKOUT. Figure 6-3. Clock Timing 6.8 Power Sequencing No requirements are placed on the power up/down sequence of the various power pins to ensure the correct reset state for all the modules. However, if the 3.3-V transistors in the level shifting output buffers of the I/O pins are powered prior to the 1.8-V transistors, it is possible for the output buffers to turn on, causing a glitch to occur on the pin during power up. To avoid this behavior, power the VDD pins prior to or simultaneously with the VDDIO pins, ensuring that the VDD pins have reached 0.7 V before the VDDIO pins reach 0.7 V. There are some requirements on the XRS pin: 1. During power up, the XRS pin must be held low for tw(RSL1) after the input clock is stable (see Table 6-9). This is to enable the entire device to start from a known condition. 2. During power down, the XRS pin must be pulled low at least 8 ms prior to VDD reaching 1.5 V. This is to enhance flash reliability. Additionally it is recommended that no voltage larger than a diode drop (0.7 V) should be applied to any pin prior to powering up the device. Voltages applied to pins on an unpowered device can bias internal p-n junctions in unintended ways and produce unpredictable results. 6.8.1 Power Management and Supervisory Circuit Solutions Table 6-8 lists the power management and supervisory circuit solutions for F28044 DSP. LDO selection depends on the total power consumed in the end application. Go to www.power.ti.com for a complete list of TI power ICs or select the Reference Designs link for specific power reference designs. Table 6-8. Power Management and Supervisory Circuit Solutions TYPE PART Texas Instruments SUPPLIER LDO TPS767D301 DESCRIPTION Texas Instruments LDO TPS70202 Dual 500/250-mA LDO with SVS Texas Instruments LDO TPS766xx 250-mA LDO with PG Texas Instruments SVS TPS3808 Open Drain SVS with programmable delay Texas Instruments SVS TPS3803 Low-cost Open-drain SVS with 5-mS delay Texas Instruments LDO TPS799xx 200-mA LDO in WCSP package Texas Instruments LDO TPS736xx 400-mA LDO with 40 mV of VDO Texas Instruments DC/DC TPS62110 High Vin 1.2-A dc/dc converter in 4 x 4 QFN package Texas Instruments DC/DC TPS6230x 500-mA converter in WCSP package Dual 1-A low-dropout regulator (LDO) with supply voltage supervisor (SVS) Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 81 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com VDDIO, VDD3VFL VDDA2, VDDAIO (3.3 V) VDD, VDD1A18, VDD2A18 (1.8 V) XCLKIN X1/X2 OSCCLK/8(A) XCLKOUT tOSCST User-Code Dependent tw(RSL1) XRS Address/Data Valid. Internal Boot-ROM Code Execution Phase Address/Data/ Control (Internal) td(EX) th(boot-mode)(B) Boot-Mode Pins User-Code Execution Phase User-Code Dependent GPIO Pins as Input Peripheral/GPIO Function Based on Boot Code Boot-ROM Execution Starts I/O Pins(C) GPIO Pins as Input (State Depends on Internal PU/PD) User-Code Dependent A. B. C. Upon power up, SYSCLKOUT is OSCCLK/2. Since the XCLKOUTDIV bits in the XCLK register come up with a reset state of 0, SYSCLKOUT is further divided by 4 before it appears at XCLKOUT. This explains why XCLKOUT = OSCCLK/8 during this phase. After reset, the boot ROM code samples Boot Mode pins. Based on the status of the Boot Mode pin, the boot code branches to destination memory or boot code function. If boot ROM code executes after power-on conditions (in debugger environment), the boot code execution time is based on the current SYSCLKOUT speed. The SYSCLKOUT will be based on user environment and could be with or without PLL enabled. See Section 6.8 for requirements to ensure a high-impedance state for GPIO pins during power-up. Figure 6-4. Power-on Reset 82 Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Table 6-9. Reset (XRS) Timing Requirements MIN (1) tw(RSL1) Pulse duration, stable XCLKIN to XRS high tw(RSL2) Pulse duration, XRS low tw(WDRS) Pulse duration, reset pulse generated by watchdog td(EX) Delay time, address/data valid after XRS high tOSCST (2) UNIT 8tc(OSCCLK) cycles 512tc(OSCCLK) cycles 32tc(OSCCLK) cycles 1 Hold time for boot-mode pins MAX cycles Oscillator start-up time th(boot-mode) (1) (2) Warm reset NOM 8tc(OSCCLK) 10 200tc(OSCCLK) ms cycles In addition to the tw(RSL1) requirement, XRS has to be low at least for 1 ms after VDD reaches 1.5 V. Dependent on crystal/resonator and board design. XCLKIN X1/X2 OSCCLK/8 XCLKOUT User-Code Dependent OSCCLK * 5 tw(RSL2) XRS Address/Data/ Control (Internal) td(EX) User-Code Execution (Don't Care) Boot-ROM Execution Starts Boot-Mode Pins Peripheral/GPIO Function User-Code Execution Phase GPIO Pins as Input th(boot-mode)(A) Peripheral/GPIO Function User-Code Execution Starts I/O Pins User-Code Dependent GPIO Pins as Input (State Depends on Internal PU/PD) User-Code Dependent A. After reset, the Boot ROM code samples BOOT Mode pins. Based on the status of the Boot Mode pin, the boot code branches to destination memory or boot code function. If Boot ROM code executes after power-on conditions (in debugger environment), the Boot code execution time is based on the current SYSCLKOUT speed. The SYSCLKOUT will be based on user environment and could be with or without PLL enabled. Figure 6-5. Warm Reset Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 83 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Figure 6-6 shows an example for the effect of writing into PLLCR register. In the first phase, PLLCR = 0x0004 and SYSCLKOUT = OSCCLK x 2. The PLLCR is then written with 0x0008. Right after the PLLCR register is written, the PLL lock-up phase begins. During this phase, SYSCLKOUT = OSCCLK/2. After the PLL lock-up is complete (which takes 131072 OSCCLK cycles), SYSCLKOUT reflects the new operating frequency, OSCCLK x 4. OSCCLK Write to PLLCR SYSCLKOUT OSCCLK * 2 OSCCLK/2 OSCCLK * 4 (Current CPU Frequency) (CPU Frequency While PLL is Stabilizing With the Desired Frequency. This Period (PLL Lock-up Time, tp) is 131072 OSCCLK Cycles Long.) (Changed CPU Frequency) Figure 6-6. Example of Effect of Writing Into PLLCR Register 6.9 6.9.1 General-Purpose Input/Output (GPIO) GPIO - Output Timing Table 6-10. General-Purpose Output Switching Characteristics PARAMETER MIN MAX UNIT tr(GPO) Rise time, GPIO switching low to high All GPIOs 8 tf(GPO) Fall time, GPIO switching high to low All GPIOs 8 ns ns tfGPO Toggling frequency, GPO pins 25 MHz GPIO tr(GPO) tf(GPO) Figure 6-7. General-Purpose Output Timing 84 Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 6.9.2 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 GPIO - Input Timing (A) GPIO Signal GPxQSELn = 1,0 (6 samples) 1 1 0 0 0 0 0 0 0 1 0 tw(SP) 0 0 1 1 1 1 1 1 1 1 1 Sampling Period determined by GPxCTRL[QUALPRD](B) tw(IQSW) (SYSCLKOUT cycle * 2 * QUALPRD) * 5(C)) Sampling Window SYSCLKOUT QUALPRD = 1 (SYSCLKOUT/2) (D) Output From Qualifier A. B. C. D. This glitch will be ignored by the input qualifier. The QUALPRD bit field specifies the qualification sampling period. It can vary from 00 to 0xFF. If QUALPRD = 00, then the sampling period is 1 SYSCLKOUT cycle. For any other value "n", the qualification sampling period in 2n SYSCLKOUT cycles (i.e., at every 2n SYSCLKOUT cycles, the GPIO pin will be sampled). The qualification period selected via the GPxCTRL register applies to groups of 8 GPIO pins. The qualification block can take either three or six samples. The GPxQSELn Register selects which sample mode is used. In the example shown, for the qualifier to detect the change, the input should be stable for 10 SYSCLKOUT cycles or greater. In other words, the inputs should be stable for (5 x QUALPRD x 2) SYSCLKOUT cycles. This would ensure 5 sampling periods for detection to occur. Since external signals are driven asynchronously, an 13-SYSCLKOUT-wide pulse ensures reliable recognition. Figure 6-8. Sampling Mode Table 6-11. General-Purpose Input Timing Requirements MIN tw(SP) Sampling period tw(IQSW) Input qualifier sampling window tw(GPI) (1) (2) (2) Pulse duration, GPIO low/high MAX UNIT QUALPRD = 0 1tc(SCO) cycles QUALPRD 0 2tc(SCO) * QUALPRD cycles tw(SP) * [n (1) - 1] cycles 2tc(SCO) cycles tw(IQSW) + tw(SP) + 1tc(SCO) cycles Synchronous mode With input qualifier "n" represents the number of qualification samples as defined by GPxQSELn register. For tw(GPI), pulse width is measured from VIL to VIL for an active low signal and VIH to VIH for an active high signal. Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 85 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 6.9.2.1 www.ti.com Sampling Window Width for Input Signals The following section summarizes the sampling window width for input signals for various input qualifier configurations. Sampling frequency denotes how often a signal is sampled with respect to SYSCLKOUT. Sampling frequency = SYSCLKOUT/(2 * QUALPRD), if QUALPRD 0 Sampling frequency = SYSCLKOUT, if QUALPRD = 0 Sampling period = SYSCLKOUT cycle x 2 x QUALPRD, if QUALPRD 0 In the above equations, SYSCLKOUT cycle indicates the time period of SYSCLKOUT. Sampling period = SYSCLKOUT cycle, if QUALPRD = 0 In a given sampling window, either 3 or 6 samples of the input signal are taken to determine the validity of the signal. This is determined by the value written to GPxQSELn register. Case 1: Qualification using 3 samples Sampling window width = (SYSCLKOUT cycle x 2 x QUALPRD) x 2, if QUALPRD 0 Sampling window width = (SYSCLKOUT cycle) x 2, if QUALPRD = 0 Case 2: Qualification using 6 samples Sampling window width = (SYSCLKOUT cycle x 2 x QUALPRD) x 5, if QUALPRD 0 Sampling window width = (SYSCLKOUT cycle) x 5, if QUALPRD = 0 XCLKOUT GPIOxn tw(GPI) Figure 6-9. General-Purpose Input Timing The pulse-width requirement XINT2_ADCSOC signal as well. 86 for NOTE general-purpose input Electrical Specifications is applicable for the Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com 6.9.2.2 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Low-Power Mode Wakeup Timing Table 6-12 shows the timing requirements, Table 6-13 shows the switching characteristics, and Figure 6-10 shows the timing diagram for IDLE mode. Table 6-12. IDLE Mode Timing Requirements (1) MIN tw(WAKE-INT) (1) Pulse duration, external wake-up signal Without input qualifier NOM MAX 2tc(SCO) With input qualifier UNIT cycles 5tc(SCO) + tw(IQSW) For an explanation of the input qualifier parameters, see Table 6-11 . Table 6-13. IDLE Mode Switching Characteristics (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Delay time, external wake signal to program execution resume (2) * td(WAKE-IDLE) * * Wake-up from Flash - Flash module in active state Without input qualifier Wake-up from Flash - Flash module in sleep state Without input qualifier Wake-up from SARAM Without input qualifier With input qualifier With input qualifier With input qualifier (1) (2) 20tc(SCO) 20tc(SCO) + tw(IQSW) 1050tc(SCO) 1050tc(SCO) + tw(IQSW) 20tc(SCO) 20tc(SCO) + tw(IQSW) cycles cycles cycles For an explanation of the input qualifier parameters, see Table 6-11 . This is the time taken to begin execution of the instruction that immediately follows the IDLE instruction. execution of an ISR (triggered by the wake up) signal involves additional latency. td(WAKE-IDLE) Address/Data (internal) XCLKOUT tw(WAKE-INT) WAKE INT(A)(B) A. B. WAKE INT can be any enabled interrupt, WDINT, XNMI, or XRS. From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be initiated until at least 4 OSCCLK cycles have elapsed. Figure 6-10. IDLE Entry and Exit Timing Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 87 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Table 6-14. STANDBY Mode Timing Requirements tw(WAKE-INT) (1) Pulse duration, external wake-up signal TEST CONDITIONS MIN Without input qualification 3tc(OSCCLK) With input qualification (1) NOM MAX UNIT cycles (2 + QUALSTDBY) * tc(OSCCLK) QUALSTDBY is a 6-bit field in the LPMCR0 register. Table 6-15. STANDBY Mode Switching Characteristics PARAMETER td(IDLE-XCOL) TEST CONDITIONS Delay time, IDLE instruction executed to XCLKOUT low MIN 32tc(SCO) TYP MAX UNIT 45tc(SCO) cycles Delay time, external wake signal to program execution resume (1) * td(WAKE-STBY) * cycles Wake up from flash - Flash module in active state Without input qualifier Wake up from flash - Flash module in sleep state Without input qualifier With input qualifier With input qualifier Without input qualifier * (1) 88 Wake up from SARAM With input qualifier 100tc(SCO) 100tc(SCO) + tw(WAKE-INT) cycles 1125tc(SCO) 1125tc(SCO) + tw(WAKE-INT) 100tc(SCO) 100tc(SCO) + tw(WAKE-INT) cycles cycles This is the time taken to begin execution of the instruction that immediately follows the IDLE instruction. execution of an ISR (triggered by the wake up signal) involves additional latency. Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 (A) (C) (B) Device Status STANDBY (E) (D) (F) STANDBY Normal Execution Flushing Pipeline Wake-up Signal(G)(H) tw(WAKE-INT) td(WAKE-STBY) X1/X2 or X1 or XCLKIN XCLKOUT td(IDLE-XCOL) A. B. C. D. E. F. G. H. IDLE instruction is executed to put the device into STANDBY mode. The PLL block responds to the STANDBY signal. SYSCLKOUT is held for approximately 32 cycles (if CLKINDIV = 0) or 64 cycles (if CLKINDIV = 1) before being turned off. This delay enables the CPU pipe and any other pending operations to flush properly. Clock to the peripherals are turned off. However, the PLL and watchdog are not shut down. The device is now in STANDBY mode. The external wake-up signal is driven active. After a latency period, the STANDBY mode is exited. Normal execution resumes. The device will respond to the interrupt (if enabled). The wake-up signal fed to a GPIO pin to wake up the device must meet the minimum pulse width requirement. Furthermore, this signal must be free of glitches. If a noisy signal is fed to a GPIO pin, the wake-up behavior of the device will not be deterministic. From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be initiated until at least 4 OSCCLK cycles have elapsed. Figure 6-11. STANDBY Entry and Exit Timing Diagram Table 6-16. HALT Mode Timing Requirements MIN tw(WAKE-GPIO) Pulse duration, GPIO wake-up signal tw(WAKE-XRS) Pulse duration, XRS wakeup signal (1) NOM MAX UNIT (1) cycles toscst + 8tc(OSCCLK) cycles toscst + 2tc(OSCCLK) See Table 6-9 for an explanation of toscst. Table 6-17. HALT Mode Switching Characteristics PARAMETER MIN td(IDLE-XCOL) Delay time, IDLE instruction executed to XCLKOUT low tp PLL lock-up time td(WAKE-HALT) Delay time, PLL lock to program execution resume * Wake up from flash - Flash module in sleep state * 32tc(SCO) Wake up from SARAM TYP MAX UNIT 45tc(SCO) cycles 131072tc(OSCCLK) cycles 1125tc(SCO) cycles 35tc(SCO) cycles Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 89 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 (A) www.ti.com (C) Device Status (D) HALT Flushing Pipeline (G) (E) (B) (F) HALT PLL Lock-up Time Wake-up Latency Normal Execution GPIOn(H)(I) td(WAKE-HALT) tw(WAKE-GPIO) tp X1/X2 or XCLKIN Oscillator Start-up Time XCLKOUT td(IDLE-XCOL) A. B. C. D. E. F. G. H. I. IDLE instruction is executed to put the device into HALT mode. The PLL block responds to the HALT signal. SYSCLKOUT is held for approximately 32 cycles (if CLKINDIV = 0) or 64 cycles (if CLKINDIV = 1) before the oscillator is turned off and the CLKIN to the core is stopped. This delay enables the CPU pipe and any other pending operations to flush properly. Clocks to the peripherals are turned off and the PLL is shut down. If a quartz crystal or ceramic resonator is used as the clock source, the internal oscillator is shut down as well. The device is now in HALT mode and consumes absolute minimum power. When the GPIOn pin (used to bring the device out of HALT) is driven low, the oscillator is turned on and the oscillator wake-up sequence is initiated. The GPIO pin should be driven high only after the oscillator has stabilized. This enables the provision of a clean clock signal during the PLL lock sequence. Since the falling edge of the GPIO pin asynchronously begins the wakeup process, care should be taken to maintain a low noise environment prior to entering and during HALT mode. Once the oscillator has stabilized, the PLL lock sequence is initiated, which takes 131,072 OSCCLK (X1/X2 or X1 or XCLKIN) cycles. Note that these 131,072 clock cycles are applicable even when the PLL is disabled (i.e., code execution will be delayed by this duration even when the PLL is disabled). Clocks to the core and peripherals are enabled. The HALT mode is now exited. The device will respond to the interrupt (if enabled), after a latency. Normal operation resumes. The wake-up signal fed to a GPIO pin to wake up the device must meet the minimum pulse width requirement. Furthermore, this signal must be free of glitches. If a noisy signal is fed to a GPIO pin, the wake-up behavior of the device will not be deterministic. From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be initiated until at least 4 OSCCLK cycles have elapsed. Figure 6-12. HALT Wake-Up Using GPIOn 90 Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 6.10 Enhanced Control Peripherals 6.10.1 Enhanced Pulse Width Modulator (ePWM) Timing Table 6-18 shows the PWM output timing requirements and Table 6-19, switching characteristics. Table 6-18. ePWM Timing Requirements (1) TEST CONDITIONS tw(SYCIN) Sync input pulse width MIN UNIT 2tc(SCO) cycles Synchronous 2tc(SCO) cycles 1tc(SCO) + tw(IQSW) cycles With input qualifier (1) MAX Asynchronous For an explanation of the input qualifier parameters, see Table 6-11 . Table 6-19. ePWM Switching Characteristics PARAMETER TEST CONDITIONS tw(PWM) Pulse duration, PWMx output high/low tw(SYNCOUT) Sync output pulse width td(PWM)tza Delay time, trip input active to PWM forced high Delay time, trip input active to PWM forced low td(TZ-PWM)HZ Delay time, trip input active to PWM Hi-Z MIN MAX UNIT 20 ns 8tc(SCO) no pin load cycles 25 ns 20 ns 6.10.2 Trip-Zone Input Timing XCLKOUT(A) tw(TZ) TZ td(TZ-PWM)HZ PWM(B) A. B. TZ - TZ1, TZ2, TZ3, TZ4, TZ5, TZ6 PWM refers to all the PWM pins in the device. The state of the PWM pins after TZ is taken high depends on the PWM recovery software. Figure 6-13. PWM Hi-Z Characteristics Table 6-20. Trip-Zone input Timing Requirements (1) MIN tw(TZ) Pulse duration, TZx input low Asynchronous Synchronous With input qualifier (1) MAX UNIT 1tc(SCO) cycles 2tc(SCO) cycles 1tc(SCO) + tw(IQSW) cycles For an explanation of the input qualifier parameters, see Table 6-11 . Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 91 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Table 6-21 shows the high-resolution PWM switching characteristics. Table 6-21. High Resolution PWM Characteristics at SYSCLKOUT = (60 - 100 MHz) MIN TYP MAX UNIT 150 310 ps Micro Edge Positioning (MEP) step size (1) (1) Maximum MEP step size is based on worst-case process, maximum temperature and maximum voltage. MEP step size will increase with low voltage and high temperature and decrease with voltage and cold temperature. Applications that use the HRPWM feature should use MEP Scale Factor Optimizer (SFO) estimation software functions. See the TI software libraries for details of using SFO function in end applications. SFO functions help to estimate the number of MEP steps per SYSCLKOUT period dynamically while the HRPWM is in operation. Table 6-22. External ADC Start-of-Conversion Switching Characteristics PARAMETER tw(ADCSOCAL) MIN Pulse duration, ADCSOCAO low MAX 32tc(HCO ) UNIT cycles tw(ADCSOCAL) ADCSOCAO or ADCSOCBO Figure 6-14. ADCSOCAO or ADCSOCBO Timing 6.10.3 External Interrupt Timing tw(INT) XNMI, XINT1, XINT2 td(INT) Address bus (internal) Interrupt Vector Figure 6-15. External Interrupt Timing Table 6-23. External Interrupt Timing Requirements (1) TEST CONDITIONS tw(INT) (1) (2) (2) Pulse duration, INT input low/high MIN MAX UNIT Synchronous 1tc(SCO) cycles With qualifier 1tc(SCO) + tw(IQSW) cycles For an explanation of the input qualifier parameters, see Table 6-11 . This timing is applicable to any GPIO pin configured for ADCSOC functionality. Table 6-24. External Interrupt Switching Characteristics (1) PARAMETER td(INT) (1) 92 MIN Delay time, INT low/high to interrupt-vector fetch MAX UNIT tw(IQSW) + 12tc(SCO) cycles For an explanation of the input qualifier parameters, see Table 6-11 . Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 6.10.4 I2C Electrical Specification and Timing Table 6-25. I2C Timing TEST CONDITIONS MIN 2 I C clock module frequency is between 7 MHz and 12 MHz and I2C prescaler and clock divider registers are configured appropriately MAX UNIT 400 kHz fSCL SCL clock frequency vil Low level input voltage Vih High level input voltage Vhys Input hysteresis Vol Low level output voltage 3 mA sink current tLOW Low period of SCL clock I2C clock module frequency is between 7 MHz and 12 MHz and I2C prescaler and clock divider registers are configured appropriately 1.3 ms tHIGH High period of SCL clock I2C clock module frequency is between 7 MHz and 12 MHz and I2C prescaler and clock divider registers are configured appropriately 0.6 ms lI Input current with an input voltage between 0.1 VDDIO and 0.9 VDDIO MAX 0.3 VDDIO V 0.7 VDDIO V 0.05 VDDIO V 0 -10 0.4 10 V mA 6.10.5 Serial Peripheral Interface (SPI) Master Mode Timing Table 6-26 lists the master mode timing (clock phase = 0) and Table 6-27 lists the timing (clock phase = 1). Figure 6-16 and Figure 6-17 show the timing waveforms. Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 93 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Table 6-26. SPI Master Mode External Timing (Clock Phase = 0) (1) SPI WHEN (SPIBRR + 1) IS EVEN OR SPIBRR = 0 OR 2 NO. MAX MIN MAX 4tc(LCO) 128tc(LCO) 5tc(LCO) 127tc(LCO) ns ns Cycle time, SPICLK 2 tw(SPCH)M Pulse duration, SPICLK high (clock polarity = 0) 0.5tc(SPC)M - 10 0.5tc(SPC)M 0.5tc(SPC)M - 0.5tc(LCO) - 10 0.5tc(SPC)M - 0.5tc(LCO) tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 1) 0.5tc(SPC)M - 10 0.5tc(SPC)M 0.5tc(SPC)M - 0.5tc(LCO) - 10 0.5tc(SPC)M - 0.5tc(LCO) tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 0) 0.5tc(SPC)M - 10 0.5tc(SPC)M 0.5tc(SPC)M + 0.5tc(LCO) - 10 0.5tc(SPC)M + 0.5tc(LCO) tw(SPCH)M Pulse duration, SPICLK high (clock polarity = 1) 0.5tc(SPC)M - 10 0.5tc(SPC)M 0.5tc(SPC)M + 0.5tc(LCO) - 10 0.5tc(SPC)M + 0.5tc(LCO) td(SPCH-SIMO)M Delay time, SPICLK high to SPISIMO valid (clock polarity = 0) 10 10 td(SPCL-SIMO)M Delay time, SPICLK low to SPISIMO valid (clock polarity = 1) 10 10 tv(SPCL-SIMO)M Valid time, SPISIMO data valid after SPICLK low (clock polarity = 0) 0.5tc(SPC)M - 10 0.5tc(SPC)M + 0.5tc(LCO) - 10 tv(SPCH-SIMO)M Valid time, SPISIMO data valid after SPICLK high (clock polarity = 1) 0.5tc(SPC)M - 10 0.5tc(SPC)M + 0.5tc(LCO) - 10 tsu(SOMI-SPCL)M Setup time, SPISOMI before SPICLK low (clock polarity = 0) 35 35 tsu(SOMI-SPCH)M Setup time, SPISOMI before SPICLK high (clock polarity = 1) 35 35 tv(SPCL-SOMI)M Valid time, SPISOMI data valid after SPICLK low (clock polarity = 0) 0.25tc(SPC)M - 10 0.5tc(SPC)M - 0.5tc(LCO) - 10 tv(SPCH-SOMI)M Valid time, SPISOMI data valid after SPICLK high (clock polarity = 1) 0.25tc(SPC)M - 10 0.5tc(SPC)M - 0.5tc(LCO) - 10 5 8 9 94 UNIT MIN tc(SPC)M 4 (5) SPI WHEN (SPIBRR + 1) IS ODD AND SPIBRR > 3 1 3 (1) (2) (3) (4) (2) (3) (4) (5) ns ns ns ns ns The MASTER / SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is cleared. tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR +1) tc(LCO) = LSPCLK cycle time Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate: Master mode transmit 25-MHz MAX, master mode receive 12.5-MHz MAX Slave mode transmit 12.5-MAX, slave mode receive 12.5-MHz MAX. The active edge of the SPICLK signal referenced is controlled by the clock polarity bit (SPICCR.6). Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 1 SPICLK (clock polarity = 0) 2 3 SPICLK (clock polarity = 1) 4 5 SPISIMO Master Out Data Is Valid 8 9 SPISOMI Master In Data Must Be Valid SPISTE(A) A. In the master mode, SPISTE goes active 0.5tc(SPC) (minimum) before valid SPI clock edge. On the trailing end of the word, the SPISTE will go inactive 0.5tc(SPC) after the receiving edge (SPICLK) of the last data bit, except that SPISTE stays active between back-to-back transmit words in both FIFO and non-FIFO modes. Figure 6-16. SPI Master Mode External Timing (Clock Phase = 0) Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 95 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com Table 6-27. SPI Master Mode External Timing (Clock Phase = 1) (1) SPI WHEN (SPIBRR + 1) IS EVEN OR SPIBRR = 0 OR 2 NO. MAX MIN MAX 4tc(LCO) 128tc(LCO) 5tc(LCO) 127tc(LCO) ns ns Cycle time, SPICLK 2 tw(SPCH)M Pulse duration, SPICLK high (clock polarity = 0) 0.5tc(SPC)M - 10 0.5tc(SPC)M 0.5tc(SPC)M - 0.5tc (LCO) - 10 0.5tc(SPC)M - 0.5tc(LCO) tw(SPCL))M Pulse duration, SPICLK low (clock polarity = 1) 0.5tc(SPC)M - 10 0.5tc(SPC)M 0.5tc(SPC)M - 0.5tc (LCO) - 10 0.5tc(SPC)M - 0.5tc(LCO) tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 0) 0.5tc(SPC)M - 10 0.5tc(SPC)M 0.5tc(SPC)M + 0.5tc(LCO) - 10 0.5tc(SPC)M + 0.5tc(LCO) tw(SPCH)M Pulse duration, SPICLK high (clock polarity = 1) 0.5tc(SPC)M - 10 0.5tc(SPC)M 0.5tc(SPC)M + 0.5tc(LCO) - 10 0.5tc(SPC)M + 0.5tc(LCO) tsu(SIMO-SPCH)M Setup time, SPISIMO data valid before SPICLK high (clock polarity = 0) 0.5tc(SPC)M - 10 0.5tc(SPC)M - 10 tsu(SIMO-SPCL)M Setup time, SPISIMO data valid before SPICLK low (clock polarity = 1) 0.5tc(SPC)M - 10 0.5tc(SPC)M - 10 tv(SPCH-SIMO)M Valid time, SPISIMO data valid after SPICLK high (clock polarity = 0) 0.5tc(SPC)M - 10 0.5tc(SPC)M - 10 tv(SPCL-SIMO)M Valid time, SPISIMO data valid after SPICLK low (clock polarity = 1) 0.5tc(SPC)M - 10 0.5tc(SPC)M - 10 tsu(SOMI-SPCH)M Setup time, SPISOMI before SPICLK high (clock polarity = 0) 35 35 tsu(SOMI-SPCL)M Setup time, SPISOMI before SPICLK low (clock polarity = 1) 35 35 tv(SPCH-SOMI)M Valid time, SPISOMI data valid after SPICLK high (clock polarity = 0) 0.25tc(SPC)M - 10 0.5tc(SPC)M - 10 tv(SPCL-SOMI)M Valid time, SPISOMI data valid after SPICLK low (clock polarity = 1) 0.25tc(SPC)M - 10 0.5tc(SPC)M - 10 7 10 11 96 UNIT MIN tc(SPC)M 6 (4) (5) SPI WHEN (SPIBRR + 1) IS ODD AND SPIBRR > 3 1 3 (1) (2) (3) (2) (3) (4) (5) ns ns ns ns ns The MASTER/SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is set. tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1) Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate: Master mode transmit 25 MHz MAX, master mode receive 12.5 MHz MAX Slave mode transmit 12.5 MHz MAX, slave mode receive 12.5 MHz MAX. tc(LCO) = LSPCLK cycle time The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6). Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 1 SPICLK (clock polarity = 0) 2 3 SPICLK (clock polarity = 1) 6 7 SPISIMO Master Out Data Is Valid Data Valid 10 11 SPISOMI Master In Data Must Be Valid SPISTE(A) A. In the master mode, SPISTE goes active 0.5tc(SPC) (minimum) before valid SPI clock edge. On the trailing end of the word, the SPISTE will go inactive 0.5tc(SPC) after the receiving edge (SPICLK) of the last data bit, except that SPISTE stays active between back-to-back transmit words in both FIFO and non-FIFO modes. Figure 6-17. SPI Master External Timing (Clock Phase = 1) Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 97 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com 6.10.6 SPI Slave Mode Timing Table 6-28 lists the slave mode external timing (clock phase = 0) and Table 6-29 (clock phase = 1). Figure 6-18 and Figure 6-19 show the timing waveforms. Table 6-28. SPI Slave Mode External Timing (Clock Phase = 0) (1) (2) (3) (4) (5) NO. MIN MAX 12 tc(SPC)S Cycle time, SPICLK Cycle time, SPICLK 13 tw(SPCH)S Pulse duration, SPICLK high (clock polarity = 0) 0.5tc(SPC)S - 10 0.5tc(SPC)S tw(SPCL)S Pulse duration, SPICLK low (clock polarity = 1) 0.5tc(SPC)S - 10 0.5tc(SPC)S tw(SPCL)S Pulse duration, SPICLK low (clock polarity = 0) 0.5tc(SPC)S - 10 0.5tc(SPC)S tw(SPCH)S Pulse duration, SPICLK high (clock polarity = 1) 0.5tc(SPC)S - 10 0.5tc(SPC)S td(SPCH-SOMI)S Delay time, SPICLK high to SPISOMI valid (clock polarity = 0) 35 td(SPCL-SOMI)S Delay time, SPICLK low to SPISOMI valid (clock polarity = 1) 35 tv(SPCL-SOMI)S Valid time, SPISOMI data valid after SPICLK low (clock polarity = 0) 0.75tc(SPC)S tv(SPCH-SOMI)S Valid time, SPISOMI data valid after SPICLK high (clock polarity = 1) 0.75tc(SPC)S tsu(SIMO-SPCL)S Setup time, SPISIMO before SPICLK low (clock polarity = 0) 35 tsu(SIMO-SPCH)S Setup time, SPISIMO before SPICLK high (clock polarity = 1) 35 tv(SPCL-SIMO)S Valid time, SPISIMO data valid after SPICLK low (clock polarity = 0) 0.5tc(SPC)S - 10 tv(SPCH-SIMO)S Valid time, SPISIMO data valid after SPICLK high (clock polarity = 1) 0.5tc(SPC)S - 10 14 15 16 19 20 (1) (2) (3) (4) (5) 4tc(LCO) UNIT ns ns ns ns ns ns ns The MASTER / SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is cleared. tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1) Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate: Master mode transmit 25-MHz MAX, master mode receive 12.5-MHz MAX Slave mode transmit 12.5-MHz MAX, slave mode receive 12.5-MHz MAX. tc(LCO) = LSPCLK cycle time The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6). 12 SPICLK (clock polarity = 0) 13 14 SPICLK (clock polarity = 1) 15 16 SPISOMI SPISOMI Data Is Valid 19 20 SPISIMO SPISIMO Data Must Be Valid SPISTE(A) A. In the slave mode, the SPISTE signal should be asserted low at least 0.5tc(SPC) (minimum) before the valid SPI clock edge and remain low for at least 0.5tc(SPC) after the receiving edge (SPICLK) of the last data bit. Figure 6-18. SPI Slave Mode External Timing (Clock Phase = 0) 98 Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Table 6-29. SPI Slave Mode External Timing (Clock Phase = 1) (1) NO. MIN tc(SPC)S Cycle time, SPICLK 13 tw(SPCH)S Pulse duration, SPICLK high (clock polarity = 0) 0.5tc(SPC)S - 10 0.5tc(SPC)S tw(SPCL)S Pulse duration, SPICLK low (clock polarity = 1) 0.5tc(SPC)S - 10 0.5tc(SPC)S tw(SPCL)S Pulse duration, SPICLK low (clock polarity = 0) 0.5tc(SPC)S - 10 0.5tc(SPC)S tw(SPCH)S Pulse duration, SPICLK high (clock polarity = 1) 0.5tc(SPC)S - 10 0.5tc(SPC)S tsu(SOMI-SPCH)S Setup time, SPISOMI before SPICLK high (clock polarity = 0) 0.125tc(SPC)S tsu(SOMI-SPCL)S Setup time, SPISOMI before SPICLK low (clock polarity = 1) 0.125tc(SPC)S tv(SPCL-SOMI)S Valid time, SPISOMI data valid after SPICLK low (clock polarity = 1) 0.75tc(SPC)S tv(SPCH-SOMI)S Valid time, SPISOMI data valid after SPICLK high (clock polarity = 0) 0.75tc(SPC)S tsu(SIMO-SPCH)S Setup time, SPISIMO before SPICLK high (clock polarity = 0) 35 tsu(SIMO-SPCL)S Setup time, SPISIMO before SPICLK low (clock polarity = 1) 35 tv(SPCH-SIMO)S Valid time, SPISIMO data valid after SPICLK high (clock polarity = 0) 0.5tc(SPC)S - 10 tv(SPCL-SIMO)S Valid time, SPISIMO data valid after SPICLK low (clock polarity = 1) 0.5tc(SPC)S - 10 17 18 21 22 (4) MAX 12 14 (1) (2) (3) (2) (3) (4) 8tc(LCO) UNIT ns ns ns ns ns ns ns The MASTER / SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is cleared. tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1) Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate: Master mode transmit 25-MHz MAX, master mode receive 12.5-MHz MAX Slave mode transmit 12.5-MHz MAX, slave mode receive 12.5-MHz MAX. The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6). 12 SPICLK (clock polarity = 0) 13 14 SPICLK (clock polarity = 1) 17 18 SPISOMI Data Valid SPISOMI Data Is Valid 21 22 SPISIMO SPISIMO Data Must Be Valid SPISTE(A) A. In the slave mode, the SPISTE signal should be asserted low at least 0.5tc(SPC) before the valid SPI clock edge and remain low for at least 0.5tc(SPC) after the receiving edge (SPICLK) of the last data bit. Figure 6-19. SPI Slave Mode External Timing (Clock Phase = 1) Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 99 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com 6.11 On-Chip Analog-to-Digital Converter Table 6-30. ADC Electrical Characteristics (over recommended operating conditions) (1) PARAMETER MIN TYP MAX (2) UNIT DC SPECIFICATIONS Resolution 12 Bits ADC clock 1 kHz 25 MHz ACCURACY INL (Integral nonlinearity) 1-25 MHz ADC clock (12.5 MSPS) 2.0 LSB DNL (Differential nonlinearity) (3) 1-25 MHz ADC clock (12.5 MSPS) 1 LSB 60 LSB Offset error (4) -60 Offset error with hardware trimming Overall gain error with internal reference 4 (5) -60 Overall gain error with external reference -60 LSB 60 LSB 60 LSB Channel-to-channel offset variation 4 LSB Channel-to-channel gain variation 4 LSB ANALOG INPUT Analog input voltage (ADCINx to ADCLO) (6) 0 ADCLO -5 Input capacitance 0 3 V 5 mV 10 Input leakage current pF 5 INTERNAL VOltAGE REFERENCE mA (5) VADCREFP - ADCREFP output voltage at the pin based on internal reference 1.275 V VADCREFM - ADCREFM output voltage at the pin based on internal reference 0.525 V 0.75 V Voltage difference, ADCREFP - ADCREFM Temperature coefficient 50 EXTERNAL VOltAGE REFERENCE (5) VADCREFIN - External reference voltage input on ADCREFIN pin 0.2% or better accurate reference recommended PPM/C (7) ADCREFSEL[15:14] = 11b 1.024 V ADCREFSEL[15:14] = 10b 1.500 V ADCREFSEL[15:14] = 01b 2.048 V 67.5 dB 68 dB AC SPECIFICATIONS SINAD (100 kHz) Signal-to-noise ratio + distortion SNR (100 kHz) Signal-to-noise ratio THD (100 kHz) Total harmonic distortion -79 dB ENOB (100 kHz) Effective number of bits 10.9 Bits 83 dB SFDR (100 kHz) Spurious free dynamic range (1) (2) (3) (4) (5) (6) (7) 100 Tested at 25-MHz ADCCLK. All voltages listed in this table are with respect to VSSA2. TI specifies that the ADC will have no missing codes. 1 LSB has the weighted value of 3.0/4096 = 0.732 mV. A single internal/external band gap reference sources both ADCREFP and ADCREFM signals, and hence, these voltages track together. The ADC converter uses the difference between these two as its reference. The total gain error listed for the internal reference is inclusive of the movement of the internal bandgap over temperature. Gain error over temperature for the external reference option will depend on the temperature profile of the source used. Voltages above VDDA + 0.3 V or below VSS - 0.3 V applied to an analog input pin may temporarily affect the conversion of another pin. To avoid this, the analog inputs should be kept within these limits. TI recommends using high precision external reference TI part REF3020/3120 or equivalent for 2.048-V reference. Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 6.11.1 ADC Power-Up Control Bit Timing ADC Power Up Delay ADC Ready for Conversions PWDNBG PWDNREF td(BGR) PWDNADC td(PWD) Request for ADC Conversion Figure 6-20. ADC Power-Up Control Bit Timing Table 6-31. ADC Power-Up Delays PARAMETER (1) td(BGR) Delay time for band gap reference to be stable. Bits 7 and 6 of the ADCTRL3 register (ADCBGRFDN1/0) must be set to 1 before the PWDNADC bit is enabled. td(PWD) Delay time for power-down control to be stable. Bit delay time for band-gap reference to be stable. Bits 7 and 6 of the ADCTRL3 register (ADCBGRFDN1/0) must be set to 1 before the PWDNADC bit is enabled. Bit 5 of the ADCTRL3 register (PWDNADC)must be set to 1 before any ADC conversions are initiated. (1) MIN 20 TYP MAX UNIT 5 ms 1 ms 50 ms Timings maintain compatibility to the 281x ADC module. The F28044 ADC also supports driving all 3 bits at the same time and waiting td(BGR) ms before first conversion. Table 6-32. Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK) (1) ADC OPERATING MODE CONDITIONS (2) VDDA18 VDDA3.3 UNIT Mode A (Operational Mode): * * BG and REF enabled PWD disabled 30 2 mA Mode B: * * * ADC clock enabled BG and REF enabled PWD enabled 9 0.5 mA Mode C: * * * ADC clock enabled BG and REF disabled PWD enabled 5 20 mA Mode D: * * * ADC clock disabled BG and REF disabled PWD enabled 5 15 mA (1) (2) Test Conditions: SYSCLKOUT = 100 MHz ADC module clock = 25 MHz ADC performing a continuous conversion of all 16 channels in Mode A VDDA18 includes current into VDD1A18 and VDD2A18. VDDA3.3 includes current into VDDA2 and VDDAIO. Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 101 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Rs Source Signal www.ti.com ADCIN0 Ron 1 k Switch Cp 10 pF ac Ch 1.64 pF 28x DSP Typical Values of the Input Circuit Components: Switch Resistance (Ron): Sampling Capacitor (Ch): Parasitic Capacitance (Cp): Source Resistance (Rs): 1 k 1.64 pF 10 pF 50 Figure 6-21. ADC Analog Input Impedance Model 6.11.2 Definitions Reference Voltage The on-chip ADC has a built-in reference, which provides the reference voltages for the ADC. Analog Inputs The on-chip ADC consists of 16 analog inputs, which are sampled either one at a time or two channels at a time. These inputs are software-selectable. Converter The on-chip ADC uses a 12-bit four-stage pipeline architecture, which achieves a high sample rate with low power consumption. Conversion Modes The conversion can be performed in two different conversion modes: * Sequential sampling mode (SMODE = 0) * Simultaneous sampling mode (SMODE = 1) 102 Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 6.11.3 Sequential Sampling Mode (Single-Channel) (SMODE = 0) In sequential sampling mode, the ADC can continuously convert input signals on any of the channels (Ax to Bx). The ADC can start conversions on event triggers from the ePWM, software trigger, or from an external ADCSOC signal. If the SMODE bit is 0, the ADC will do conversions on the selected channel on every Sample/Hold pulse. The conversion time and latency of the Result register update are explained below. The ADC interrupt flags are set a few SYSCLKOUT cycles after the Result register update. The selected channels will be sampled at every falling edge of the Sample/Hold pulse. The Sample/Hold pulse width can be programmed to be 1 ADC clock wide (minimum) or 16 ADC clocks wide (maximum). Sample n+2 Sample n+1 Analog Input on Channel Ax or Bx Sample n ADC Clock Sample and Hold SH Pulse SMODE Bit td(SH) tdschx_n+1 tdschx_n ADC Event Trigger from ePWM or Other Sources tSH Figure 6-22. Sequential Sampling Mode (Single-Channel) Timing Table 6-33. Sequential Sampling Mode Timing SAMPLE n SAMPLE n + 1 AT 25-MHz ADC CLOCK, tc(ADCCLK) = 40 ns td(SH) Delay time from event trigger to sampling 2.5tc(ADCCLK) tSH Sample/Hold width/Acquisition Width (1 + Acqps) * tc(ADCCLK) 40 ns with Acqps = 0 td(schx_n) Delay time for first result to appear in Result register 4tc(ADCCLK) 160 ns td(schx_n+1) Delay time for successive results to appear in Result register (2 + Acqps) * tc(ADCCLK) REMARKS Acqps value = 0-15 ADCTRL1[8:11] 80 ns Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 103 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com 6.11.4 Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1) In simultaneous mode, the ADC can continuously convert input signals on any one pair of channels (A0/B0 to A7/B7). The ADC can start conversions on event triggers from the ePWM, software trigger, or from an external ADCSOC signal. If the SMODE bit is 1, the ADC will do conversions on two selected channels on every Sample/Hold pulse. The conversion time and latency of the result register update are explained below. The ADC interrupt flags are set a few SYSCLKOUT cycles after the Result register update. The selected channels will be sampled simultaneously at the falling edge of the Sample/Hold pulse. The Sample/Hold pulse width can be programmed to be 1 ADC clock wide (minimum) or 16 ADC clocks wide (maximum). NOTE In simultaneous mode, the ADCIN channel pair select has to be A0/B0, A1/B1, ..., A7/B7, and not in other combinations (such as A1/B3, etc.). Sample n Sample n+2 Sample n+1 Analog Input on Channel Ax Analog Input on Channel Bx ADC Clock Sample and Hold SH Pulse SMODE Bit td(SH) tdschA0_n+1 tSH ADC Event Trigger from ePWM or Other Sources tdschA0_n tdschB0_n+1 tdschB0_n Figure 6-23. Simultaneous Sampling Mode Timing Table 6-34. Simultaneous Sampling Mode Timing SAMPLE n SAMPLE n + 1 AT 25-MHz ADC CLOCK, tc(ADCCLK) = 40 ns td(SH) Delay time from event trigger to sampling 2.5tc(ADCCLK) tSH Sample/Hold width/Acquisition Width (1 + Acqps) * tc(ADCCLK) 40 ns with Acqps = 0 td(schA0_n) Delay time for first result to appear in Result register 4tc(ADCCLK) 160 ns td(schB0_n) Delay time for first result to appear in Result register 5tc(ADCCLK) 200 ns td(schA0_n+1) Delay time for successive results to appear in Result register (3 + Acqps) * tc(ADCCLK) 120 ns td(schB0_n+1) Delay time for successive results to appear in Result register (3 + Acqps) * tc(ADCCLK) 120 ns 104 Electrical Specifications REMARKS Acqps value = 0-15 ADCTRL1[8:11] Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 6.12 Detailed Descriptions Integral Nonlinearity Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero through full scale. The point used as zero occurs one-half LSB before the first code transition. The full-scale point is defined as level one-half LSB beyond the last code transition. The deviation is measured from the center of each particular code to the true straight line between these two points. Differential Nonlinearity An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. A differential nonlinearity error of less than 1 LSB ensures no missing codes. Zero Offset The major carry transition should occur when the analog input is at zero volts. Zero error is defined as the deviation of the actual transition from that point. Gain Error The first code transition should occur at an analog value one-half LSB above negative full scale. The last transition should occur at an analog value one and one-half LSB below the nominal full scale. Gain error is the deviation of the actual difference between first and last code transitions and the ideal difference between first and last code transitions. Signal-to-Noise Ratio + Distortion (SINAD) SINAD is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is expressed in decibels. Effective Number of Bits (ENOB) For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following formula, (SINAD * 1.76) N+ 6.02 it is possible to get a measure of performance expressed as N, the effective number of bits. Thus, effective number of bits for a device for sine wave inputs at a given input frequency can be calculated directly from its measured SINAD. Total Harmonic Distortion (THD) THD is the ratio of the rms sum of the first nine harmonic components to the rms value of the measured input signal and is expressed as a percentage or in decibels. Spurious Free Dynamic Range (SFDR) SFDR is the difference in dB between the rms amplitude of the input signal and the peak spurious signal. Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 105 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 www.ti.com 6.13 Flash Timing Table 6-35. Flash Endurance for A Temperature Material ERASE/PROGRAM TEMPERATURE Nf Flash endurance for the array (write/erase cycles) 0C to 85C (ambient) NOTP OTP endurance for the array (write cycles) 0C to 85C (ambient) MIN TYP 20000 50000 MAX UNIT cycles 1 write Table 6-36. Flash Parameters at 100-MHz SYSCLKOUT PARAMETER (1) TEST CONDITIONS MIN TYP MAX UNIT Program Time 16-Bit Word 50 ms 16K Sector 500 ms Erase Time 16K Sector IDD3VFLP VDD3VFL current consumption during the Erase/Program cycle IDDP VDD current consumption during Erase/Program cycle IDDIOP VDDIO current consumption during Erase/Program cycle (1) 10 S Erase 75 mA Program 35 mA 140 mA 20 mA Typical parameters as seen at room temperature including function call overhead, with all peripherals off. Table 6-37. Flash/OTP Access Timing PARAMETER MIN TYP MAX UNIT ta(fp) Paged flash access time 36 ns ta(fr) Random flash access time 36 ns ta(OTP) OTP access time 60 ns Equations to compute the Flash page wait-state and random wait-state in Table 6-38 are as follows: Flash Page Wait-State + Flash Random Wait-State + ta(fp) t c(SCO) * 1 (round up to the next highest integer) or 0, whichever is larger ta(fr) t c(SCO) *1 (round up to the next highest integer) or 1, whichever is larger Equation to compute the OTP wait-state in Table 6-38 is as follows: OTP Wait-State + 106 ta(OTP) t c(SCO) * 1 (round up to the next highest integer) or 1, whichever is larger Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 Table 6-38. Minimum Required Flash/OTP Wait-States at Different Frequencies SYSCLKOUT (MHz) (1) SYSCLKOUT (ns) FLASH PAGE WAIT-STATE FLASH RANDOM WAIT-STATE (1) OTP WAIT-STATE 100 10 3 3 5 75 13.33 2 2 4 50 20 1 1 2 30 33.33 1 1 1 25 40 0 1 1 15 66.67 0 1 1 4 250 0 1 1 Random wait-state must be greater than or equal to 1. Electrical Specifications Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 107 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 7 www.ti.com Revision History This data sheet revision history highlights the technical changes made to the SPRS357B device-specific data sheet to make it an SPRS357C revision. Scope: Changed MIN Nf value [Flash endurance for the array (write/erase cycles)] from 100 cycles to 20000 cycles. See Table 6-35. Changed TYP Nf value [Flash endurance for the array (write/erase cycles)] from 1000 cycles to 50000 cycles. See Table 6-35. See table below. LOCATION 108 ADDITIONS, DELETIONS, AND MODIFICATIONS Table 2-1 Hardware Features: * Added TYPE column Table 2-2 Signal Descriptions: * TRST: Changed "In a low-noise environment, TRST may be left floating. In other instances, an external pulldown resistor is highly recommended" to "An external pulldown resistor is required on this pin" * XRS: Removed "(100 A, typical)" from "The output buffer of this pin is an open-drain with an internal pullup (100 A, typical)" Figure 3-1 Functional Block Diagram: * Removed footnote about OTP Figure 3-2 F28044 Memory Map: * Updated region from 0x00 0000 to 0x00 0400 Table 3-2 Wait-states: * Peripheral Frame 1: Updated COMMENTS Section 3.2.18 Updated "32-Bit CPU-Timers (0, 1, 2)" section Figure 3-3 External and PIE Interrupt Sources: * Updated "CPU TIMER 2" block and "CPU TIMER 1" block Section 3.5 Interrupts: * Added "The TRAP #VectorNumber instruction transfers program control ..." paragraph * Added "When the PIE is enabled ..." paragraph Section 4.1 32-Bit CPU-Timers 0/1/2: * Updated paragraph about the function of each CPU-Timer Figure 4-2 CPU-Timer Interrupt Signals and Output Signal: * Updated CPU-TIMER 1 block * Removed footnote about TIMER1 and INT13 Figure 4-4 ePWM Sub-Modules Showing Critical Internal Signal Interconnections: * Changed TBCTL[CNTLDE] to TBCTL[PHSEN] * Resized "HiRes PWM (HRPWM)" dashed box Figure 4-6 ADC Pin Connections With Internal Reference: * ADCREFIN: Changed "Float or ground if internal reference is used" to "Float or connect to analog ground if internal reference is used" Table 4-6 ADC Registers: * 0x711E-0x711F: Changed DESCRIPTION from "ADC Status Register" to "Reserved" Section 4.7 Inter-Integrated Circuit (I2C): * Changed "Data transfer rate from 10 kbps up to 400 kbps (Philips Fast-mode rate)" feature to "Data transfer rate from 10 kbps up to 400 kbps (I2C Fast-mode rate)" * Changed 16-bit to 16-word on the FIFO information Section 5.2 Updated "Documentation Support" section Revision History Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 TMS320F28044 www.ti.com SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 LOCATION Section 6.2 ADDITIONS, DELETIONS, AND MODIFICATIONS Recommended Operating Conditions: * High-level input voltage, VIH: - Updated MAX value for "All inputs except X1" - Added MIN and MAX values for X1 * Low-level input voltage, VIL: - Added MIN value for "All inputs except X1" - Added MAX value for X1 Table 6-1 TMS320F28044 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT: * Added footnote about IDD3VFL * Added footnote about MAX numbers Table 6-2 Typical Current Consumption by Various Peripherals (at 100 MHz): * Added footnote about peripherals with multiple instances Section 6.5 Section 6.8.1 Updated "Emulator Connection Without Signal Buffering for the DSP" section Power Management and Supervisory Circuit Solutions: * Updated "Table 6-8 lists the power management and supervisory circuit solutions for F28044 DSP ..." paragraph Figure 6-10 IDLE Entry and Exit Timing: * Added footnote about IDLE instruction and OSCCLK cycles Figure 6-11 STANDBY Entry and Exit Timing Diagram: * Updated "The PLL block responds to the STANDBY signal ..." footnote * Added footnote about wake-up signal fed to a GPIO pin * Added footnote about IDLE instruction and OSCCLK cycles Figure 6-12 HALT Wake-Up Using GPIOn: * Updated footnotes * Added footnote about wake-up signal fed to a GPIO pin * Added footnote about IDLE instruction and OSCCLK cycles Table 6-29 SPI Slave Mode External Timing (Clock Phase = 1): * Parameter 18 (Valid time, SPISOMI data valid after SPICLK low): Changed "(clock polarity = 0)" to "(clock polarity = 1)" * Parameter 18 (Valid time, SPISOMI data valid after SPICLK high): Changed "(clock polarity = 1)" to "(clock polarity = 0)" Table 6-35 Changed title from "Flash Endurance" to "Flash Endurance for A Temperature Material" Table 6-35 Flash Endurance for A Temperature Material: * Added "ERASE/PROGRAM TEMPERATURE" column heading * Nf [Flash endurance for the array (write/erase cycles)]: - Changed MIN value from 100 cycles to 20000 cycles - Changed TYP value from 1000 cycles to 50000 cycles Table 6-36 Flash Parameters at 100-MHz SYSCLKOUT: * Updated footnote Revision History Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 109 TMS320F28044 SPRS357C - AUGUST 2006 - REVISED JANUARY 2010 8 www.ti.com Mechanical Data Table 8-1 and Table 8-2 show the thermal data. Table 8-1. F28044 Thermal Model 100-pin GGM Results AIR FLOW PARAMETER 0 lfm 150 lfm 250 lfm 500 lfm qJA[C/W] High k PCB 28.15 26.89 25.68 24.22 JT[C/W] 0.38 0.35 0.33 0.44 qJC 10.36 qJB 13.3 Table 8-2. F28044 Thermal Model 100-pin PZ Results AIR FLOW PARAMETER 0 lfm 150 lfm 250 lfm 500 lfm qJA[C/W] High k PCB 44.02 28.34 36.28 33.68 JT[C/W] 0.2 0.56 0.7 0.95 qJC 7.06 qJB 28.76 The following packaging information reflects the most current released data available for the designated device(s). This data is subject to change without notice and without revision of this document. 110 Mechanical Data Copyright (c) 2006-2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320F28044 PACKAGE OPTION ADDENDUM www.ti.com 15-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TMS320F28044PZA ACTIVE LQFP PZ 100 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TMS320F28044PZS ACTIVE LQFP PZ 100 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPBG028B FEBRUARY 1997 - REVISED MAY 2002 GGM (S-PBGA-N100) PLASTIC BALL GRID ARRAY 10,10 SQ 9,90 7,20 TYP 0,80 0,40 K 0,80 J H G F E 0,40 D C B A A1 Corner 1 2 3 4 5 6 7 8 9 10 Bottom View 0,95 0,85 1,40 MAX Seating Plane 0,55 0,45 0,08 0,45 0,35 0,10 4145257-3/C 12/01 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice C. MicroStar BGA configuration. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 MECHANICAL DATA MTQF013A - OCTOBER 1994 - REVISED DECEMBER 1996 PZ (S-PQFP-G100) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 75 0,08 M 51 76 50 100 26 1 0,13 NOM 25 12,00 TYP Gage Plane 14,20 SQ 13,80 16,20 SQ 15,80 0,05 MIN 1,45 1,35 0,25 0- 7 0,75 0,45 Seating Plane 0,08 1,60 MAX 4040149 /B 11/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MS-026 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP(R) Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee(R) Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2010, Texas Instruments Incorporated