ChipSESD
Silicon ESD Protector
Overvoltage Protection Device
DOCUMENT: SCD27763
REV LETTER: B
REV DATE: JULY 26, 2016
PAGE NO.: Page 1 of 5
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
PRODUCT: SESD0201P1BN-0400-090
SESD 0201 P1BN - 0400 -090
Series
EIA Size
Breakdown Voltage
9.0V (min)
Package Type
P - Packaged SMD
Input Capacitance
4.0 pF (typ)
1 - one channel N - No Common pin
B - Bidirectional
Specification Status: Released
PART NUMBERING
MATERIALS INFORMATION
Halogen Free *
* Halogen Free refers to: Br≤900ppm, Cl≤900ppm, Br+Cl≤1500ppm
HF
BENEFITS
Silicon ESD device in an EIA-0201 size rectangular
passive component SMT package
Standard PCB assembly and rework processes
Bi-directional operation allows placement on PCB
without orientation constraint
Appropriate for ESD protection in space-constrained
portable electronics and mobile handsets
Suitable for +5V operating voltage applications
Helps protect electronic circuits against damage
from Electrostatic Discharge (ESD) events
Assist equipment to pass IEC61000-4-2, level 4
testing
RoHS compliant and Halogen Free
FEATURES
Input capacitance – 4pF (typ)
Low leakage current – 1.0µA (max)
Low working reverse voltage – 6.0V (max)
ESD maximum rating per IEC61000-4-2 standard
o ± 10kV contact discharge (1)
o ± 16kV air discharge
Capable of withstanding numerous ESD strikes
Small package size: 0.60mm x 0.30mm (typ)
Low package height: 0.30mm (typ)
APPLICATIONS
Cellular phones and portable electronics
Digital cameras and camcorders
USB 2.0 and computer I/O ports
Keypads, pushbuttons, low voltage DC lines,
speakers, headphones, microphones
Applications requiring high ESD performance
ChipSESD
Silicon ESD Protector
Overvoltage Protection Device
DOCUMENT: SCD27763
REV LETTER: B
REV DATE: JULY 26, 2016
PAGE NO.: Page 2 of 5
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
PRODUCT: SESD0201P1BN-0400-090
Device Characteristics @ T = 25oCMin Typ Max Unit
Input Capacitance @ Vr = 0V, f = 1MHz -- 4.0 5.0 pF
Working Reverse Voltage (peak) - VRWM -- -- 6.0 V
Breakdown Voltage – Vbr @ It = 1mA(2) 9.0 11.0 -- V
Leakage current @ VRWM = 6.0V -- -- 1.0 µA
Clamping Voltage @ Ipp=2A, tp=(8/20µs) -- ±10.0 ±12.0 V
ESD contact discharge per IEC61000-4-2 standard (1) -- -- ±10 kV
ESD air discharge per IEC61000-4-2 standard -- -- ±16 kV
Operating (Tjunction) and Storage Temperature Range ˚C
(1) 10kV @ ± 50 pulses under IEC61000-4-2; 8kV @ 1,000 pulses under IEC61000-4-2
(2) Vbr is measured at test current It
-40 to +125
DEVICE DIMENSIONS
Drawing Not To Scale
Typical A B C D
mm 0.60 ± 0.05 0.30 ± 0.05 0.30 ± 0.05 0.21 ± 0.07
mils* 23.62 ± 2.0 11.81 ± 2.0 11.81 ± 2.0 8.27 ± 2.8
* Round off approximation
RECOMMENDED LANDING PATTERN:
L
Pad Pad
PC Board
W
L S L
Pad Pad
PC Board
W
L S
A
A
B
C
D D
A
A
B
C
D D
ChipSESD
Silicon ESD Protector
Overvoltage Protection Device
DOCUMENT: SCD27763
REV LETTER: B
REV DATE: JULY 26, 2016
PAGE NO.: Page 3 of 5
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
PRODUCT: SESD0201P1BN-0400-090
L S W
mm 0.28 ± 0.01 0.19 ± 0.01 0.30 ± 0.01
mils* 11.0 ± 0.4 7.5 ± 0.4 11.8 ± 0.4
* Round off approximation
Recommended solder thickness: 150 to 200 um
Recommended rework procedure:
o Soldering iron tip temperature should be less than 350oC
o Apply iron tip to solder for less than 5 seconds
o Do not apply solder iron tip to the body of this product directly
PACKAGING
Packaging
Tape & Reel
Standard Box
SESD0201P1BN-0400-090
15,000
75,000
REEL DIMENSIONS
Dimension A B C D E F G
(mm) 178.0 ± 2.0 2.0 ± 0.5 13.0 ± 0.5 21.0 ± 0.8 62.0 ± 1.5 9.0 ± 0.5 13.0 ± 1.0
CARRIER TAPE DIMENSIONS
LabelLabel
ChipSESD
Silicon ESD Protector
Overvoltage Protection Device
DOCUMENT: SCD27763
REV LETTER: B
REV DATE: JULY 26, 2016
PAGE NO.: Page 4 of 5
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
PRODUCT: SESD0201P1BN-0400-090
Dimension A B D E F W
(mm) 0.39 ± 0.03 0.69 ± 0.03 1.55 ± 0.05 1.75 ± 0.05 3.5 ± 0.05 8.0 ± 0.1
Dimension P0P1P2T
(mm) 4.0 ± 0.1 2.0 ± 0.05 2.0 ± 0.05 0.42 ± 0.03
FIGURE 1: TYPICAL IV CURVE
FIGURE 2: ESD CLAMPING VOLTAGE – 8kV Contact
SESD0201
ESD 8kV contact per IEC61000-4-2 Level 4
0
50
100
150
200
250
300
350
020 40 60 80 100
Time (nSec)
Voltage ( V )
SESD0201
Typical IV Chart @ 1mA
-1.00E-03
-8.00E-04
-6.00E-04
-4.00E-04
-2.00E-04
0.00E+00
2.00E-04
4.00E-04
6.00E-04
8.00E-04
1.00E-03
-12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12
Voltage ( V )
Current ( A )
ChipSESD
Silicon ESD Protector
Overvoltage Protection Device
DOCUMENT: SCD27763
REV LETTER: B
REV DATE: JULY 26, 2016
PAGE NO.: Page 5 of 5
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
PRODUCT: SESD0201P1BN-0400-090
FIGURE 3: ESD CLAMPING VOLTAGE – 8x20µs, 2A Surge
Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving,
life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired
operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation.
Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse
shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse
documentation. The sale and use of Littelfuse products is subject to Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse.
SESD0201
Typical Clamping Performace under a 8x20µs, 2A Surge
0
2
4
6
8
10
12
14
0.0E+00 1.0E-04 2.0E-04 3.0E-04 4.0E-04 5.0E-04 6.0E-04 7.0E-04 8.0E-04 9.0E-04 1.0E-03
Time (S)
Voltage (V)