©2004 Fairchild Semiconductor Corporation Rev. A1, August 2004
Absolute Maximum Ratings *
T
a
=25°C unless otherwise noted
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
NOTES:
1) These ratings are based on a maximum junction temperature of 150 degrees C.
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations
Electrical Characteristics
T
a
=25°C unless otherwise noted
* Pulse Test: Pulse Width 300µs, Duty Cycle 2.0%
Symbol Parameter Value Units
V
CEO
Collector-Emitter Voltage 40 V
V
CBO
Collector-Base Voltage 75 V
V
EBO
Emitter-Base Voltage 6.0 V
I
C
Collector Current 1.0 A
T
STG
Operating and Storage Junction Temperature Range - 55 ~ 150 °C
Symbol Parameter Test Condition Min. Max. Units
Off Characteristics
BV
(BR)CEO
Collector-Emitter Breakdown Voltage * I
C
= 10mA, I
B
= 0 40 V
BV
(BR)CBO
Collector-Base Breakdown Voltage I
C
= 10µA, I
E
= 0 75 V
BV
(BR)EBO
Emitter-Base Breakdown Voltage I
E
= 10µA, I
C
= 0 6.0 V
I
CEX
Collector Cutoff Current V
CE
= 60V, V
EB(off)
= 3.0V 10 nA
I
CBO
Collector Cutoff Current V
CB
= 60V, I
E
= 0
V
CB
= 60V, I
E
= 0, T
a
= 125°C0.01
10 µA
µA
I
EBO
Emitter Cutoff Current V
EB
= 3.0V, I
C
= 0 10 µA
I
BL
Bas e C u to ff C u rr e n t V
CE
= 60V, V
EB(off)
= 3.0V 20 µA
On Characteristics
h
FE
DC Current Gain I
C
= 0.1mA, V
CE
= 10V
I
C
= 1.0mA, V
CE
= 10V
I
C
= 10mA, V
CE
= 10V
I
C
= 10mA, V
CE
= 10V, T
a
= -55°C
I
C
= 150mA, V
CE
= 10V *
I
C
= 150mA, V
CE
= 10V *
I
C
= 500mA, V
CE
= 10V *
35
50
75
35
100
50
40
300
V
CE(sat)
Collector-Emitter Saturation V oltage * I
C
= 150mA, V
CE
= 10V
I
C
= 500mA, V
CE
= 10V 0.3
1.0 V
V
V
BE(sat)
Base-Emitter Saturation Voltage * I
C
= 150mA, V
CE
= 10V
I
C
= 500mA, V
CE
= 10V 0.6 1.2
2.0 V
V
NPN General Purpose Amplifier
This device is for use as a medium power amplifier and switch
requiring collector currents up to 500mA.
Sourced from process 19.
PN2222A MMBT2222A PZT2222A
EBC TO-92 SOT-23 SOT-223
Mark:1P
C
B
EE
BC
C
©2004 Fairchild Semiconductor Corporation Rev. A1, August 2004
Electrical Characteristics
Ta=25°C unless otherwise noted
(Continued)
Thermal Charac t eris ti cs
T
a
=25°C unless otherwise noted
* Device mounted on FR-4 PCB 1.6” × 1.6” × 0.06”.
** Devi ce mounted on FR-4 PCB 36mm × 18mm × 1.5mm; mounting pad for the collector lead min. 6cm
2
.
Spice Model
NPN (Is = 14.34f Xti = 3 Eg = 1.11 Vaf = 74.03 Bf = 255.9 Ne = 1.307 Ise = 14.34 Ikf = .2847 Xtb = 1.5 B r = 6.092 Isc = 0
Ikr = 0 Rc = 1 Cjc = 7.306p Mjc = .3416 Vjc = .75 Fc = .5 Cje = 22.01p Mje = .377 Vje = .75 Tr = 46.91n Tf = 411.1p Itf = .6
Vtf = 1.7 Xtf = 3 Rb = 10)
Symbol Parameter Test Condition Min. Max. Units
Small Signal Characteristics
f
T
Current Gain Bandwidt h Product I
C
= 20mA, V
CE
= 20V, f = 100MHz 300 MHz
C
obo
Output Capacitance V
CB
= 10V, I
E
= 0, f = 1MHz 8.0 pF
C
ibo
Input Capacit ance V
EB
= 0.5V, I
C
= 0, f = 1MHz 25 pF
rb’C
c
Collector Base Time Constant I
C
= 20mA, V
CB
= 20V, f = 31.8MHz 150 pS
NF Noise Figure I
C
= 100µA, V
CE
= 10V,
R
S
= 1.0K, f = 1.0KHz 4.0 dB
Re(h
ie
) Real Part of Common-Emitter
High Frequency Input Impedance I
C
= 20mA, V
CE
= 20V, f = 300MHz 60
Switching Characteristics
t
d
Delay T ime V
CC
= 30V, V
EB(off)
= 0.5V,
I
C
= 150mA, I
B1
= 15mA 10 ns
t
r
Rise Time 25 ns
t
s
S torage T ime V
CC
= 30V, I
C
= 150mA,
I
B1
= I
B2
= 15mA 225 ns
t
f
Fall T ime 60 ns
Symbol Parameter Max. Units
PN2222A *MMBT2222A **PZT2222A
P
D
Total Device Dissipation
Derate above 25°C625
5.0 350
2.8 1,000
8.0 mW
mW/°C
R
θJC
Thermal Resistance, Junction to Case 83.3 °C/W
R
θJA
Thermal Resistance, Junction to Ambient 200 357 125 °C/W
©2004 Fairchild Semiconductor Corporation Rev. A1, August 2004
Typical Characteristics
Figure 1. Typical Pulsed Current Gain
vs Collector Current Figure 2. Collector-Emitter Saturation Voltage
vs Collector Current
Figure 3. Base-Emitter Saturation Voltage
vs Collector Current Figure 4. Base-Emitter On Voltage
vs Collector Current
Figure 5. Collector Cutoff Current
vs Ambient Temperature Figure 6. Emitter Transition and Output Capacitance
vs Reverse Bias Voltage
0.1 0.3 1 3 10 30 100 300
0
100
200
300
400
500
I - COLLECTOR CURRENT ( mA)
h - TY PI CAL PULSED CUR RENT GAIN
C
FE
125 °C
25 °C
- 40 °C
V = 5V
CE
β
β
1 10 100 500
0.1
0.2
0.3
0.4
I - COLLECTOR CURRENT (mA)
V - COLLECTOR-EMITTER VOLTAGE (V)
CESAT
25
C
β
ββ
β= 10
125
- 40
°C
°C
°C
1 10 100 500
0.4
0.6
0.8
1
I - COLLECTOR CURRENT (mA)
V - BASE-EMITTER VOLTAGE (V)
BESAT
C
β
ββ
β= 10
25
125
- 40
°C
°C
°C
IC
β
β
0.1 1 10 25
0.2
0.4
0.6
0.8
1
I - COLLECTOR CURRENT (mA)
V - BASE-EMITTER ON VOL T AGE (V)
BE(ON)
C
V = 5V
CE
25 °C
125 °C
- 40 °C
IC
25 50 75 100 125 150
0.1
1
10
100
500
T - AMBIENT TEMPERATURE ( C)
I - COLLECTOR CURRENT (nA)
A
V
= 40V
CB
CBO
°
β
β
0.1 1 10 100
4
8
12
16
20
RE VER SE BIAS VOLTAG E (V)
CAP ACIT ANCE (pF)
f = 1 M H z
Cob
C
te
©2004 Fairchild Semiconductor Corporation Rev. A1, August 2004
Typical Characteristics
Figure 7. Turn On and Turn Off Times
vs Collector Current Figure 8. Switching Times vs Collector Current
Figure 9. Power Dissipation vs
Ambient Temperature Figure 10. Common Emitter Characteristics
Figure 11. Common Emitter Characteristics Figure 12. Common Emitter Characteristics
10 100 1000
0
80
160
240
320
400
I - COLLEC TO R CURREN T (mA)
TIM E ( nS)
I = I =
ton
t
off
B1
C
B2 Ic
10
V = 25 V
cc
IC
10 100 1000
0
80
160
240
320
400
I - COLLECTOR CURRENT (mA)
TIME (nS)
I = I =
tr
t
s
B1
C
B2 Ic
10
V = 25 V
cc
tf
td
IC
0 25 50 75 100 125 150
0
0.25
0.5
0.75
1
TEMPERATURE ( C)
P - POWER DISSIPATION (W)
D
o
SOT-223
TO-92
SOT-23
0 102030405060
0
2
4
6
8
I - COLLECTOR CURRENT (mA)
CHAR. RELATIVE TO VALUES AT I = 10mA
V = 10 V
CE
C
C
T = 25 C
A
o
h
oe
h
re
h
fe
h
ie
0 20406080100
0
0.4
0.8
1.2
1.6
2
2.4
T - AMBIENT TEMPERAT URE ( C)
CHAR. RELATIVE TO VALUES AT T = 25 C
V = 10 V
CE
A
A
I = 10 mA
C
h
oe
h
re
h
fe
h
ie
o
o
0 5 10 15 20 25 30 35
0.75
0.8
0.85
0.9
0.95
1
1.05
1.1
1.15
1.2
1.25
1.3
V - COLLECTOR VOLTAGE (V)
CHAR. RELATIVE TO VALUES AT V = 10V
CE
CE
T = 25 C
A
o
h
oe
h
re
h
fe
h
ie
I = 10 mA
C
Package Dimensions
TO-92
Dimensions in Millimeters
©2002 Fairchild Semiconductor Corporation Rev. A1, August 2004
©2002 Fairchild Semiconductor Corporation Rev. A1, August 2004
Package Dimensi ons
(Continued)
Dimensions in Millimeters
Rev. A1, August 2004
SOT-23
©2002 Fairchild Semiconductor Corporation Rev. A1, August 2004
Package Dimensi ons
(Continued)
Dimensions in Millimeters
Rev. A1, August 2004
SOT-223
Rev. I11
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when properly used in accordance with instructi ons for use
provided in the labeling, can be reasonably expected to
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device or system, or to affect its safety or effectiveness.
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Definition of Terms
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Advance Information Formative or In
Design This datasheet contains the design specifications for
product development. Specifications may change in
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Preliminary First Production This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notic e in order to improve
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