RGL34A thru RGL34K
Vishay Semiconductors
for merly General Semiconductor
Document Number 88698 www.vishay.com
08-Feb-02 1
Surface Mount Glass Passivated Junction
Fast Switching Rectifiers Rever se V oltage 50 to 800V
Forward Current 0.5A
®
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Fast switching device: 1st band is Red Symbol RGL34A RGL34B RGL34D RGL34G RGL34J RGL34K Unit
Polar ity color bands (2nd Band) Gray Red Orange Yellow Green Blue
Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 V
Maximum RMS voltage VRMS 35 70 140 280 420 560 V
Maximum DC blocking voltage VDC 50 100 200 400 600 800 V
Max. average forward rectified current at TT = 55°C IF(AV) 0.5 A
Peak forward surge current 8.3ms single half sine-wave IFSM 10 A
superimposed on rated load (JEDEC Method)
Max. full load reverse current, full cycle average TA = 55°C IR(AV) 30 µA
Maximum thermal resistance(1) RθJA 150
(2) RθJT 70 °C/W
Operating junction and storage temperature range
TJ, TSTG
65 to +175 °C
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Symbol RGL34A RGL34B RGL34D RGL34G RGL34J RGL34K Unit
Maximum instantaneous forward voltage at 0.5A VF1.3 V
Maximum DC reverse current TA = 25°C 5.0
at rated DC blocking voltage TA = 125°C IR50 µA
Maximum reverse recovery time at
IF = 0.5A, IR = 1.0A, Irr = 0.25A trr 150 250 ns
Typical junction capacitance at 4.0V, 1MHz CJ4.0 pF
Notes: (1) Thermal resistance from junction to ambient, 0.2 x 0.2” (5.0 x 5.0mm) copper pads to each terminal
(2) Thermal resistance from junction to ter minal, 0.2 x 0.2” (5.0 x 5.0mm) copper pads to each terminal
Patented*
SOLDERABLE ENDS
1st BAND
2nd BAND
0.022 (0.559)
0.016 (0.406)
0.145 (3.683)
0.131(3.327)
D1=
0.066
0.060
(1.676)
(1.524)
D2 = D1
+ 0
- 0.008 (0.20)
1st band denotes type and polarity
2nd band denotes voltage type
D2
DO-213AA Features
Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
For surface mount applications
High temperature metallurgically bonded construction
Cavity-free glass passivated junction
Capable of meeting environmental standards of MIL-S-19500
Fast switching for high efficiency
High temperature soldering guaranteed: 450°C/5 seconds
at terminals. Complete device submersible temperature
of 260°C for 10 seconds in solder bath
Mechanical Data
Case: JEDEC DO-213AA, molded plastic over glass body
Terminals: Plated ter minals, solderable per MIL-STD-750,
Method 2026
Polarity: Two bands indicate cathode end 1st band
denotes device type and 2nd band denotes repetitive
peak reverse voltage rating
Mounting Position: Any Weight: 0.0014 oz., 0.036 g
Packaging codes/options:
33/9K per 13Reel (8mm tape)
48/2.5K per 7Reel (8mm tape)
*Glass-plastic encapsulation is covered by
Patent No. 3,996,602 and brazed-lead assembly to Patent No. 3,930,306
Dimensions in inches
and (millimeters)
RGL34A thru RGL34K
Vishay Semiconductors
for merly General Semiconductor
www.vishay.com Document Number 88698
208-Feb-02
Ratings and
Characteristic Curves(TA= 25°C unless otherwise noted)
0
10
12
2.0
4.0
6.0
8.0
1 10010
Peak Forward Surge Current (A)
Number of Cycles at 60HZ
0
0.3
0.4
0.5
0 25 50 75 100 125 150 175
Average Forward Rectified Current (A)
Terminal Temperature (°C)
0.40.2 0.80.6 1.2 1.41.0 1.6
Fig. 3 – Typical Instantaneous
Forward Characteristics
020 6040 10080
Fig. 4 – Typical Reverse Characteristics
Instantaneous Reverse Current (µA)
Percent of Rated Peak Reverse Voltage (%)
0.2
0.1
Resistive or Inductive Load
0.01
0.1
10
1
Instantaneous Forward Current (A)
TJ = 25°C
Rev erse Voltage (V)
Junction Capacitance (pF)
1 10 100
10
1
0.01
0.1
10
1TJ = 100°C
Fig. 5 – Typical Junction Capacitance
TJ = 25°C
TJ = 25°C
f = 1.0 MHZ
Vsig = 50mVp-p
Fig. 1 – Forward Current
Derating Curve Fig. 2 – Maximum Non-Repetitive Peak
Forward Surge Current
Instantaneous Forward Voltage (V)
TJ = TJ max.
8.3ms Single Half Sine-Wave
(JEDEC Method)
Pulse Width = 300µs
1% Duty Cycle