
Bel Fuse Inc.
206 Van Vorst Street, Jersey City, NJ 07302 • Tel: 201-432-0463 • Fax: 201-432-9542 • E-Mail: belfuse@belfuse.com
Website: www.belfuse.com
Specifications subject to change without notice
Electrical Characteristics (23
0
C)
RoHS6 Compliant
Surface Mount PTC
0ZCC Series
0ZCC1006D may200#A44
Application
All high-density boards
Product Features
1812 Chip Size, Fast Trip Time, Low DCR
Resistance
Operating (Hold Current) Range
500mA ~ 1.1A
Maximum Voltage
6 ~ 16V (per table)
Temperature Range
-40oC to 85oC
Agency Approval
UL Component (E305051)
All dimensions
in mm
Product Dimensions
B
TOP VIEW
D
A
Marking
SIDE VIEW
C
traP
rebmuN
ABCD
niMxaMniMxaMniMxaMniM
0500CCZ073.437.470.314.353.056.03.0
5700CCZ073.437.470.314.353.056.03.0
0110CCZ073.437.470.314.352.055.03.0
Standard Package
2,000 fuses in 7 inches dia. reel, 8mm wide
tape, 4mm pitch, per EIA-481 (equivalent
IEC-286 part 3). P/N code - 2C.
PTC Marking
“bel” or “b”, IH code.
PTC Marking
traP
rebmuN
dloH
tnerruC
pirT
tnerruC pirTotemiTxaM xaM
tnerruC
detaR
egatloV
lacipyT
rewoP
ecnareloTecnatsiseR
R
nim
R
xam
1R
xam
I
H
A, I
T
A, A,tnerruC sdnoceS I
,xam
A V
,xam
V
cd
P
d
W, smhO smhO smhO
A 0500CCZ0 05.0 0.1 8 51.0 04 61 8.0 51.0 75.0 00.1
B 5700CCZ0 57.0 5.1 8 20.0 04 61 8.0 11.0 72.0 54.0
C 0110CCZ0 01.1 2.2 8 03.0 04 6 8.0 40.0 11.0 12.0
IHHold current-maximum current at which the device will not trip in still air at 23°C.
ITTrip current-minimum current at which the device will always trip in still air at 23°C.
Imax Maximum fault current device can withstand without damage at rated voltage (Vmax).
Vmax Maximum voltage device can withstand without damage at its rated current.
PdTypical power dissipated from device when in the tripped state in 23°C still air environment.
Rmin Minimum device resistance at 23°C.
Rmax Maximum device resistance at 23°C.
R1max Maximum device resistance at 23°C, 1 hour after initial device trip.
Termination pad materials
Tin-plated copper
Termination pad characteristics
Pad Layout, Solder Reflow and Rework Recommendations
* Due to “lead free/RoHS6” construction of these PTC
devices, the required Temperature and Dwell Time
in the “Soldering” zone of the reflow profile are
greater than those used for non-RoHS devices.
Solder Reflow
The dimensions in the table below provide the recommended pad layout for
each 0ZCC device
1. Recommended reflow methods; IR , vapor phase oven, hot air oven.
2. The 0ZCC Series is suitable for wave solder application methods.
3. Recommended maximum paste thickness is 0.25mm.
4. Devices are compatible with standard industry cleaning solvents and methods.
Caution
If reflow temperature/dwell times exceed the recommended Profile, the electrical performance of the PTC
may be affected.
Rework
Use standard industry practices.
AlanimoN BlanimoN ClanimoN
mm hcni mm hcni mm hcni
54.3 8531.0 87.1 1070.0 05.3 8731.0
B B
A
C
Temperature (
o
C)
Preheating Soldering Cooling
300
50 - 90 sec 30 - 50 sec120 sec
250
200
150
100
50
0
1812 Chip