PL IA NT Features *R oH S CO M Applications Lead free device (RoHS compliant*) Protects up to 4 I/O ports Bidirectional configuration ESD protection Low capacitance 6 pF Ethernet -- 10/100/1000 Base T Personal digital assistant Handheld electronics Cellular phones Video cards CDNBS08-SLVU2.8-8 -- Low Capacitance TVS Array General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. 8 7 6 5 1 2 3 4 Bourns offers Transient Voltage Suppressor Array combination diodes for surge and ESD protection applications in an 8 Lead Narrow Body SOIC package size format. Bourns Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. The Bourns(R) device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 61000-4-5 (Surge) requirements. Electrical Characteristics (@ TA = 25 C Unless Otherwise Noted) Parameter Symbol Min. Nom. Max. Unit Peak Pulse Current (tp = 8/20 s) I PP 30 A Peak Pulse Power (tp = 8/20 s)1 PPP 600 W Working Voltage VWM 2.8 V Breakdown Voltage @ 1 mA VBR Leakage Current @ VWM ID Capacitance @ 0 V, 1 MHz C Snapback Voltage @ 50 mA 3.0 V 1.0 6 A pF 2.8 V 8 15 kV kV ESD Protection per IEC 61000-4-2 Contact Discharge Air Discharge ESD ESD EFT Protection per IEC61000-4-4 @ 5/50 nS EFT 60 A VC 8.5 V @ IP = 24 A2 VC 15 V @ IPP = 30 A2 VC 17 V Surge Protection per IEC 61000-4-5 Clamping Voltage @ 8/20 S @ IP = 5 A 2 Note: 1. See Peak Pulse Power vs. Pulse Time. 2. Each differential line pair. Thermal Characteristics (@ TA = 25 C Unless Otherwise Noted) Parameter Operating Temperature Storage Temperature Symbol Min. Nom. Max. Unit TJ -55 +25 +125 C TSTG -55 +25 +150 C *RoHS Directive 2002/95/EC Jan 27, 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CDNBS08-SLVU2.8-8 -- Low Capacitance TVS Array Mechanical Characteristics This is a molded JEDEC Narrow Body SO-8 package with lead free 100 % Sn plating on the lead frame. It weighs approximately 15 mg and has a flammability rating of UL 94V-0. Product Dimensions Recommended Footprint A A B G B I C D H D C E DIMENSIONS = MILLIMETERS (INCHES) E Dimensions F Dimensions A 4.80 - 5.00 (0.189 - 0.196) A 1.143 - 1.397 (0.045 - 0.055) B 0.635 - 0.889 (0.025 - 0.035) 6.223 Min. (0.245) C B 3.80 - 4.00 (0.150 - 0.157) D 3.937 - 4.191 (0.155 - 0.165) C 5.80 - 6.20 (0.229 - 0.244) E 1.016 - 1.27 (0.040 - 0.050) D 0.36 - 0.46 (0.014 - 0.018) E 1.35 - 1.75 (0.054 - 0.068) F 0.10 - 0.25 (0.004 - 0.008) G 0.25 - 0.50 (0.010 - 0.019) H 0.40 - 1.250 (0.016 - 0.049) I 0.18 - 0.25 (0.007 - 0.009) How To Order CD NBS08 - SLVU 2.8 - 8 Common Code CD = Chip Diode Package NBS08 = Narrow Body SOIC8 Package Model SLVU = Low Capacitance TVS Array Working Peak Reverse Voltage 2.8 = 2.8 VRWM (Volts) Number of Diodes Typical Part Marking CDNBS08-SLVU2.8-8 .......................................................... SL8 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CDNBS08-SLVU2.8-8 -- Low Capacitance TVS Array Block Diagram Device Pinout 8 7 1 6 2 Bidirectional Differential Mode Line Pair 1 Line Pair 1 Line Pair 2 Line Pair 2 Line Pair 4 Line Pair 4 Line Pair 3 Line Pair 3 5 3 Bidirectional Common Mode Line 1 GND GND Line 4 Line 3 GND GND Line 2 Pin 1 2 3 4 5 6 7 8 4 Performance Graphs Peak Pulse Power vs Pulse Time Pulse Wave Form 120 IPP - Peak Pulse Current (% of IPP) PPP - Peak Pulse Current (W) 10,000 600 W, 8/20 s Waveform 1,000 100 1 10 100 1,000 10,000 et 60 40 td = t|IPP/2 20 Power Derating Curve 100 Peak Pulse Power 8/20 s 80 60 40 20 Average Power 0 25 50 75 0 5 10 15 t - Time (s) td - Pulse Duration (s) % of Rated Power 80 0 10 0.01 0 Test Waveform Parameters tt = 8 s td = 20 s tt 100 100 125 TL - Lead Temperature (C) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 150 20 25 30 CDNBS08-SLVU2.8-8 -- Low Capacitance TVS Array Packaging Specifications The product will be dispensed in Tape and Reel format (see diagram below). P 0 P 1 d T E Index Hole 120 F D2 W B D1 D P Trailer A C Device Leader ....... ....... ....... ....... ....... ....... ....... ....... End W1 Start DIMENSIONS: 10 pitches (min.) 10 pitches (min.) Direction of Feed Item Symbol Carrier Width A Carrier Length B Carrier Depth C Sprocket Hole d Reel Outside Diameter D Reel Inner Diameter D1 Feed Hole Diameter D2 Sprocket Hole Position E Punch Hole Position F Punch Hole Pitch P Sprocket Hole Pitch P0 Embossment Center P1 Overall Tape Thickness T Tape Width W Reel Width W1 Quantity per Reel - NSOIC 8L 6.7 0.10 (0.264 0.004) 5.5 0.10 0.217 0.004 2.10 0.10 0.083 0.004 1.55 0.05 (0.061 0.002) 330 (12.992) 80.0 (3.1500) MIN. 13.0 0.20 (0.512 0.008) 1.75 0.10 (0.069 0.004) 3.50 0.05 (0.138 0.002) 8.00 0.10 (0.315 0.004) 4.00 0.10 (0.157 0.004) 2.00 0.05 (0.079 0.002) 0.20 0.10 (0.008 0.004) 12.00 0.20 (0.472 0.008) 18.4 (0.724) MAX. 2500 REV. 10/11 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MM (INCHES) Devices are packed in accordance with EIA standard RS-481-A. Asia-Pacific: Tel: +886-2 2562-4117 * Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 * Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 * Fax: +1-951 781-5700 www.bourns.com