CDNBS08-SLVU2.8-8 — Low Capacitance TVS Array
Features
Lead free device (RoHS compliant*)
Protects up to 4 I/O ports
Bidirectional configuration
ESD protection
Low capacitance 6 pF
Applications
Ethernet — 10/100/1000 Base T
Personal digital assistant
Handheld electronics
Cellular phones
Video cards
General Information
Electrical Characteristics (@ TA= 25 °C Unless Otherwise Noted)
Thermal Characteristics (@ TA= 25 °C Unless Otherwise Noted)
The markets of portable communications, computing and video equipment are
challenging the semiconductor industry to develop increasingly smaller electronic
components.
Bourns offers Transient Voltage Suppressor Array combination diodes for surge and
ESD protection applications in an 8 Lead Narrow Body SOIC package size format.
Bourns Chip Diodes conform to JEDEC standards, are easy to handle on standard
pick and place equipment and their flat configuration minimizes roll away.
The Bourns® device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC
61000-4-5 (Surge) requirements.
Parameter Symbol Min. Nom. Max. Unit
Operating Temperature TJ-55 +25 +125 °C
Storage Temperature TSTG -55 +25 +150 °C
Note:
1. See Peak Pulse Power vs. Pulse Time.
2. Each differential line pair.
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Parameter Symbol Min. Nom. Max. Unit
Peak Pulse Current (tp= 8/20 µs) IPP 30 A
Peak Pulse Power (tp= 8/20 µs)1PPP 600 W
Working Voltage VWM 2.8 V
Breakdown Voltage @ 1 mA VBR 3.0 V
Leakage Current @ VWM ID1.0 µA
Capacitance @ 0 V, 1 MHz C 6 pF
Snapback Voltage @ 50 mA 2.8 V
ESD Protection per IEC 61000-4-2
Contact Discharge
Air Discharge
ESD
ESD
±8
±15
kV
kV
EFT Protection per IEC61000-4-4
@ 5/50 nS EFT 60 A
Surge Protection per
IEC 61000-4-5
Clamping Voltage
@ 8/20 µS
@ IP= 5 A2VC8.5 V
@ IP= 24 A2VC15 V
@ IPP = 30 A2VC17 V