CDNBS08-SLVU2.8-8 — Low Capacitance TVS Array
Features
Lead free device (RoHS compliant*)
Protects up to 4 I/O ports
Bidirectional configuration
ESD protection
Low capacitance 6 pF
Applications
Ethernet — 10/100/1000 Base T
Personal digital assistant
Handheld electronics
Cellular phones
Video cards
General Information
Electrical Characteristics (@ TA= 25 °C Unless Otherwise Noted)
Thermal Characteristics (@ TA= 25 °C Unless Otherwise Noted)
The markets of portable communications, computing and video equipment are
challenging the semiconductor industry to develop increasingly smaller electronic
components.
Bourns offers Transient Voltage Suppressor Array combination diodes for surge and
ESD protection applications in an 8 Lead Narrow Body SOIC package size format.
Bourns Chip Diodes conform to JEDEC standards, are easy to handle on standard
pick and place equipment and their flat configuration minimizes roll away.
The Bourns® device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC
61000-4-5 (Surge) requirements.
Parameter Symbol Min. Nom. Max. Unit
Operating Temperature TJ-55 +25 +125 °C
Storage Temperature TSTG -55 +25 +150 °C
Note:
1. See Peak Pulse Power vs. Pulse Time.
2. Each differential line pair.
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*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
*RoHS COMPLIANT
Parameter Symbol Min. Nom. Max. Unit
Peak Pulse Current (tp= 8/20 µs) IPP 30 A
Peak Pulse Power (tp= 8/20 µs)1PPP 600 W
Working Voltage VWM 2.8 V
Breakdown Voltage @ 1 mA VBR 3.0 V
Leakage Current @ VWM ID1.0 µA
Capacitance @ 0 V, 1 MHz C 6 pF
Snapback Voltage @ 50 mA 2.8 V
ESD Protection per IEC 61000-4-2
Contact Discharge
Air Discharge
ESD
ESD
±8
±15
kV
kV
EFT Protection per IEC61000-4-4
@ 5/50 nS EFT 60 A
Surge Protection per
IEC 61000-4-5
Clamping Voltage
@ 8/20 µS
@ IP= 5 A2VC8.5 V
@ IP= 24 A2VC15 V
@ IPP = 30 A2VC17 V
CDNBS08-SLVU2.8-8 — Low Capacitance TVS Array
Mechanical Characteristics
A
B
E
F
C
G
I
H
D
MILLIMETERS
(INCHES)
DIMENSIONS =
AB
C
D
E
Dimensions
A1.143 - 1.397
(0.045 - 0.055)
B0.635 - 0.889
(0.025 - 0.035)
C6.223
(0.245) Min.
D3.937 - 4.191
(0.155 - 0.165)
E1.016 - 1.27
(0.040 - 0.050)
This is a molded JEDEC Narrow Body SO-8 package with lead free 100 % Sn plating on the lead frame. It weighs approximately 15 mg and
has a flammability rating of UL 94V-0.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Recommended Footprint
How To Order
CD NBS08 - SLVU 2.8 - 8
Common Code
CD = Chip Diode
Package
NBS08 = Narrow Body SOIC8 Package
Model
SLVU = Low Capacitance TVS Array
Working Peak Reverse Voltage
2.8 = 2.8 VRWM (Volts)
Number of Diodes
Product Dimensions
CDNBS08-SLVU2.8-8 .......................................................... SL8
Typical Part Marking
Dimensions
A4.80 - 5.00
(0.189 - 0.196)
B3.80 - 4.00
(0.150 - 0.157)
C5.80 - 6.20
(0.229 - 0.244)
D0.36 - 0.46
(0.014 - 0.018)
E1.35 - 1.75
(0.054 - 0.068)
F0.10 - 0.25
(0.004 - 0.008)
G0.25 - 0.50
(0.010 - 0.019)
H0.40 - 1.250
(0.016 - 0.049)
I0.18 - 0.25
(0.007 - 0.009)
CDNBS08-SLVU2.8-8 — Low Capacitance TVS Array
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Block Diagram
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Device Pinout
Bidirectional
Bidirectional Differential
Pin Common Mode Mode
1Line 1 Line Pair 1
2GND Line Pair 1
3GND Line Pair 2
4Line 4 Line Pair 2
5Line 3 Line Pair 4
6GND Line Pair 4
7GND Line Pair 3
8Line 2 Line Pair 3
Performance Graphs
Peak Pulse Power vs Pulse Time
10,000
1,000
100
10
10.01 10 100 10,0001,000
PPP – Peak Pulse Current (W)
td – Pulse Duration (µs)
600 W, 8/20 µs Waveform
Pulse Wave Form
20
40
60
80
100
120
0
03025201510
5
IPP – Peak Pulse Current (% of IPP)
t – Time (µs)
Test Waveform Parameters
tt = 8 µs
td = 20 µs
tt
et
td = t|IPP/2
Power Derating Curve
0
20
40
60
80
100
0 25 50 75 100 125 150
% of Rated Power
TL – Lead Temperature (°C)
Average Power
Peak Pulse Power
8/20 µs
CDNBS08-SLVU2.8-8 — Low Capacitance TVS Array
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
REV. 10/11
Packaging Specifications
The product will be dispensed in Tape and Reel format (see diagram below).
Item Symbol NSOIC 8L
Carrier Width A 6.7 ± 0.10
(0.264 ± 0.004)
Carrier Length B 5.5 ± 0.10
0.217 ± 0.004
Carrier Depth C 2.10 ± 0.10
0.083 ± 0.004
Sprocket Hole d 1.55 ± 0.05
(0.061 ± 0.002)
Reel Outside Diameter D 330
(12.992)
Reel Inner Diameter D180.0
(3.1500) MIN.
Feed Hole Diameter D213.0 ± 0.20
(0.512 ± 0.008)
Sprocket Hole Position E 1.75 ± 0.10
(0.069 ± 0.004)
Punch Hole Position F 3.50 ± 0.05
(0.138 ± 0.002)
Punch Hole Pitch P 8.00 ± 0.10
(0.315 ± 0.004)
Sprocket Hole Pitch P04.00 ± 0.10
(0.157 ± 0.004)
Embossment Center P12.00 ± 0.05
(0.079 ± 0.002)
Overall Tape Thickness T 0.20 ± 0.10
(0.008 ± 0.004)
Tape Width W 12.00 ± 0.20
(0.472 ± 0.008)
Reel Width W118.4
(0.724) MAX.
Quantity per Reel - 2500
.......
.......
....... ..............
....... ..............
P A
F
ET
120 °
D2
DD
1
W1
C
Index Hole
P
0
P
1
W
B
10 pitches (min.)
Direction of Feed
10 pitches (min.)
End
Trailer Device Leader
Start
d
DIMENSIONS: MM
(INCHES)
Devices are packed in accordance with EIA standard
RS-481-A.
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com